BFP193 Low Noise Silicon Bipolar RF Transistor * For low noise, high-gain amplifiers up to 2 GHz 3 * For linear broadband amplifiers 2 4 * fT = 8 GHz, NFmin = 1 dB at 900 MHz 1 * Pb-free (RoHS compliant) package * Qualification report according to AEC-Q101 available ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type BFP193 Marking Pin Configuration RCs 1=C 2=E 3=B 4=E - Package - SOT143 Maximum Ratings at TA = 25 C, unless otherwise specified Parameter Symbol Value Unit Collector-emitter voltage VCEO 12 Collector-emitter voltage VCES 20 Collector-base voltage VCBO 20 Emitter-base voltage VEBO 2 Collector current IC 80 Base current IB 10 Total power dissipation1) Ptot 580 mW Junction temperature TJ 150 C Storage temperature TStg V mA TS 72C -55 ... 150 Thermal Resistance Parameter Symbol Junction - soldering point2) RthJS 1T Value Unit 135 K/W S is measured on the collector lead at the soldering point to the pcb the definition of RthJS please refer to Application Note AN077 (Thermal Resistance Calculation) 2For 1 2014-04-07 BFP193 Electrical Characteristics at T A = 25 C, unless otherwise specified Symbol Values Parameter Unit min. typ. max. 12 - - V ICES - - 100 A ICBO - - 100 nA IEBO - - 1 A hFE 70 100 140 DC Characteristics Collector-emitter breakdown voltage V(BR)CEO IC = 1 mA, I B = 0 Collector-emitter cutoff current VCE = 20 V, VBE = 0 Collector-base cutoff current VCB = 10 V, IE = 0 Emitter-base cutoff current VEB = 1 V, IC = 0 DC current gain - IC = 30 mA, VCE = 8 V, pulse measured 2 2014-04-07 BFP193 Electrical Characteristics at TA = 25 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. fT 6 8 - Ccb - 0.59 0.9 Cce - 0.28 - Ceb - 2.25 - AC Characteristics (verified by random sampling) Transition frequency GHz IC = 50 mA, VCE = 8 V, f = 500 MHz Collector-base capacitance pF VCB = 10 V, f = 1 MHz, VBE = 0 , emitter grounded Collector emitter capacitance VCE = 10 V, f = 1 MHz, VBE = 0 , base grounded Emitter-base capacitance VEB = 0.5 V, f = 1 MHz, VCB = 0 , collector grounded Minimum noise figure dB NFmin IC = 10 mA, VCE = 8 V, ZS = ZSopt, f = 900 MHz - 1 - f = 1.8 GHz - 1.6 - IC = 30 mA, VCE = 8 V, ZS = ZSopt, ZL = ZLopt, f = 900 MHz - 18 - f = 1.8 GHz - 12 - Power gain, maximum available1) Gma |S21e|2 Transducer gain dB IC = 30 mA, VCE = 8 V, ZS = ZL = 50, f = 900 MHz - 14.5 - f = 1.8 GHz - 8.5 - IP3 - 29.5 - P-1dB - 13 - Third order intercept point at output2) dBm IC = 30 mA, VCE = 8 V, ZS = ZL = 50 , f = 900 MHz 1dB Compression point IC = 30 mA, VCE = 8 V, ZS = ZL = 50 , f = 900 MHz 1/2 ma = |S21 / S12| (k-(k-1) ) 1G 2IP3 value depends on termination of all intermodulation frequency components. Termination used for this measurement is 50 from 0.2 MHz to 12 GHz 3 2014-04-07 BFP193 Total power dissipation P tot = (TS) 600 mW 500 Ptot 450 400 350 300 250 200 150 100 50 0 0 20 40 60 80 100 120 C 150 TS 4 2014-04-07 Package SOT143 5 BFP193 2014-04-07 BFP193 Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2014-04-07