TC1413EUA713 - Microchip Technology

 2003 Microchip Technology Inc. DS21392C-page 1

MTC1413/TC1413N

Features

• Latch-Up Protected: Will Withstand 500 mA

Reverse Current

• Input Will Withstand Negative Inputs Up to 5V

• ESD Protected: 4 kV

• High Peak Output Current: 3A

• Wide Input Supply Voltage Operating Range:

- 4.5V to 16V

• High Capacitive Load Drive Capability:

- 1800 pF in 20 nsec

• Short Delay Time: 35 nsec Typ

• Matched Delay Times

• Low Supply Current

- With Logic ‘1’ Input: 500 µA

- With Logic ‘0’ Input: 100 µA

• Low Output Impedance: 2.7Ω

• Available in Space-Saving 8-pin MSOP Package

• Pinout Same as TC1410/TC1411/TC1412

Applications

• Switch Mode Power Supplies

• Line Drivers

• Pulse Transformer Drive

• Relay Driver

Package Type

General Description

The TC1413/TC1413N are 3A CMOS buffers/drivers.

They will not latch-up under any conditions within their

power and voltage ratings. They are not subject to

damage when up to 5V of noise spiking of either

polarity occurs on the ground pin. They can accept,

without damage or logic upset, up to 500 mA of current

of either polarity being forced back into their output. All

terminals are fully protected against up to 4 kV of

electrostatic discharge.

As MOSFET drivers, the TC1413/TC1413N can easily

charge an 1800 pF gate capacitance in 20 nsec with

matched rise and fall times, and provide low enough

impedance in both the ON and the OFF states to

ensure the MOSFET’s intended state will not be

affected, even by large transients. The leading and

trailing edge propagation delay times are also matched

to allow driving short-duration inputs with greater

accuracy.

26,7

Inverting

8-Pin MSOP/PDIP/SOIC

VDD

OUT

GND

VDD

GND

OUT

TC1413

NC = No Internal Connection

26,7

Non-Inverting

TC1413N

VDD

GND

VDD

OUT

GND

OUT

NOTE: Duplicate pins must be connected together

for proper operation.

3A High-Speed MOSFET Drivers

TC1413/TC1413N

DS21392C-page 2  2003 Microchip Technology Inc.

Functional Block Diagram

Effective

Input C = 10 pF

TC1413N

Output

Input

GND

VDD

300 mV

4.7V

Inverting

Non-Inverting

Outputs

TC1413

 2003 Microchip Technology Inc. DS21392C-page 3

TC1413/TC1413N

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings†

Supply Voltage .....................................................+20V

Input Voltage ...................... VDD + 0.3V to GND – 5.0V

Power Dissipation (TA ≤ 70°C)

MSOP .......................................................... 340 mW

PDIP ............................................................ 730 mW

SOIC............................................................ 470 mW

Storage Temperature Range.............. -65°C to +150°C

Maximum Junction Temperature...................... +150ºC

† Stresses above those listed under "Absolute Maximum

Ratings" may cause permanent damage to the device. These

are stress ratings only and functional operation of the device

at these or any other conditions above those indicated in the

operation sections of the specifications is not implied.

Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability.

PIN FUNCTION TABLE

Symbol Description

VDD Supply input, 4.5V to 16V

INPUT Control input

NC No connection

GND Ground

OUTPUT CMOS push-pull output,

common to pin 7

OUTPUT CMOS push-pull output,

common to pin 6

VDD Supply input, 4.5V to 16V

DC ELECTRICAL CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

Typical values are measured at TA = +25°C, VDD = 16V.

Parameters Sym Min Typ Max Units Conditions

Input

Logic ‘1’, High Input Voltage VIH 2.0 — — V

Logic ‘0’, Low Input Voltage VIL ——0.8V

Input Current IIN -1.0 — 1.0 µA 0V ≤ VIN ≤ VDD, TA = +25°C

-10 — 10 -40°C ≤ TA ≤ +85°C

Output

High Output Voltage VOH VDD – 0.025 — — V DC Test

Low Output Voltage VOL — — 0.025 V DC Test

Output Resistance RO—2.74.0ΩVDD = 16V, IO = 10 mA, TA = +25°C

—3.35.0 0°C ≤ TA ≤ +70°C

— 3.3 5.0 -40°C ≤ TA ≤ +85°C

Peak Output Current IPK —3.0—AV

DD = 16V

Latch-Up Protection

Withstand Reverse Current

IREV — 0.5 — A Duty cycle ≤ 2%, t ≤ 300 µsec,

VDD = 16V

Switching Time (Note 1)

Rise Time tR—2028nsecT

A = +25°C

—2233 0°C ≤ TA ≤ +70°C

— 24 33 -40°C ≤ TA ≤ +85°C, Figure 4-1

Fall Time tF—2028nsecT

A = +25°C

—2233 0°C ≤ TA ≤ +70°C

— 24 33 -40°C ≤ TA ≤ +85°C, Figure 4-1

Note 1: Switching times ensured by design.

TC1413/TC1413N

DS21392C-page 4  2003 Microchip Technology Inc.

TEMPERATURE CHARACTERISTICS

Delay Time tD1 —3545nsecT

A = +25°C,

—4050 0°C ≤ TA ≤ +70°C

— 40 50 -40°C ≤ TA ≤ +85°C, Figure 4-1

Delay Time tD2 —3545nsecT

A = +25°C

—4050 0°C ≤ TA ≤ +70°C

— 40 50 -40°C ≤ TA ≤ +85°C, Figure 4-1

Power Supply

Power Supply Current IS—0.51.0mAV

IN = 3V, VDD = 16V

— 0.1 0.15 VIN = 0V

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range (C) TA0—+70ºC

Specified Temperature Range (E) TA-40 — +85 ºC

Maximum Junction Temperature TJ——+150ºC

Storage Temperature Range TA-65 — +150 ºC

Package Thermal Resistances

Thermal Resistance, 8L-MSOP θJA — 206 — ºC/W

Thermal Resistance, 8L-PDIP θJA — 125 — ºC/W

Thermal Resistance, 8L-SOIC θJA — 155 — ºC/W

DC ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

Typical values are measured at TA = +25°C, VDD = 16V.

Parameters Sym Min Typ Max Units Conditions

Note 1: Switching times ensured by design.

 2003 Microchip Technology Inc. DS21392C-page 5

TC1413/TC1413N

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

FIGURE 2-1: Quiescent Supply Current

vs. Supply Voltage.

FIGURE 2-2: Input Threshold vs. Supply

Voltage.

FIGURE 2-3: High-State Output

Resistance vs. Supply Voltage

FIGURE 2-4: Quiescent Supply Current

vs. Temperature.

FIGURE 2-5: Input Threshold vs.

Temperature.

FIGURE 2-6: Low-State Output

Resistance vs. Supply Voltage.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

100

200

300

400

500

16141210864

VIN = 3V

VIN = 0V

TA = +25°C

ISUPPLY (µA)

VDD (V)

VTHRESHOLD (V)

1.1

1.2

1.3

1.4

1.5

1.6

16141210864

VIH

VIL

TA = +25°C

RDS-ON (Ohms)

VDD (V)

16141210864

TA = -40°C

TA = +25°C

TA = +85°C

ISUPPLY (µA)

TEMPERATURE (°C)

-40 -200 20406080

100

200

300

400

500

VIN = 3V

VIN = 0V

VSUPPLY = 16V

-40 -20 0 20 40 60 80

1.1

1.2

1.3

1.4

1.5

1.6

VSUPPLY = 16V

TEMPERATURE (°C)

VTHRESHOLD (V)

VIH

VIL

RDS-ON (Ohms)

VDD (V)

16141210864

TA = -40°C

TA = +25°C

TA = +85°C

TC1413/TC1413N

DS21392C-page 6  2003 Microchip Technology Inc.

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

FIGURE 2-7: Rise Time vs. Supply

Voltage.

FIGURE 2-8: Propagation Delay vs.

Supply Voltage.

FIGURE 2-9: Rise and Fall Times vs.

Capacitive Load.

FIGURE 2-10: Fall Time vs. Supply

Voltage.

FIGURE 2-11: Propagation Delay vs.

Supply Voltage.

FIGURE 2-12: Propagation Delays vs.

Capacitive Load.

VDD (V)

tRISE (nsec)

16141210864

TA = +25°C

TA = +85°C

CLOAD = 1800 pF

TA = -40°C

VDD (V)

tD1 (nsec)

100

110

16141210864

TA = -40°C

TA = +25°C

TA = +85°C

CLOAD = 1800 pF

tRISE, tFALL (nsec)

CLOAD (pF)

0 1000 2000 3000 4000 5000

tFALL

tRISE

TA = +25°C

VDD = 16V

tFALL (nsec)

16141210864

VDD (V)

TA = +25°C

TA = +85°C

CLOAD = 1800 pF

TA = -40°C

VDD (V)

tD2 (nsec)

100

16141210864

CLOAD = 1800 pF

TA = -40°C

TA = +25°C

TA = +85°C

CLOAD (pF)

Propagation Delays (nsec)

0 1000 2000 3000 4000 5000

tD2

tD1

TA = +25°C

VDD = 16V

 2003 Microchip Technology Inc. DS21392C-page 7

TC1413/TC1413N

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

3.1 Supply Input (VDD)

The VDD input is the bias supply for the MOSFET driver

and is rated for 4.5V to 16V with respect to the ground

pin. The VDD input should be bypassed to ground with

a local ceramic capacitor. The value of the capacitor

should be chosen based on the capacitive load that is

being driven. A value of 1.0 µF is suggested.

3.2 Control Input (INPUT)

The MOSFET driver input is a high-impedance,

TTL/CMOS-compatible input. The input has 300 mV of

hysteresis between the high and low thresholds which

prevents output glitching even when the rise and fall

time of the input signal is very slow.

3.3 CMOS Push-Pull Output

(OUTPUT)

The MOSFET driver output is a low-impedance, CMOS

push-pull style output, capable of driving a capacitive

load with 3A peak currents.

3.4 Ground (GND)

The ground pins are the return path for the bias current

and for the high peak currents that discharge the load

capacitor. The ground pins should be tied into a ground

plane or have very short traces to the bias supply

source return.

3.5 No Connect (NC)

No internal connection.

No. Symbol Description

DD Supply input, 4.5V to 16V

2INPUT Control input

3 NC No connection

4 GND Ground

5 GND Ground

6 OUTPUT CMOS push-pull output,

common to pin 7

7 OUTPUT CMOS push-pull output,

common to pin 6

DD Supply input, 4.5V to 16V

TC1413/TC1413N

DS21392C-page 8  2003 Microchip Technology Inc.

4.0 APPLICATION INFORMATION

FIGURE 4-1: Switching Time Test Circuit.

CL = 1800 pF

0.1 µF

1.0 µF

Inverting Driver

Non-Inverting Driver

Input

VDD = 16V

Input

Output

tD1

tD2

Input: 100 kHz,

square wave,

tRISE = tFALL ≤ 10 nsec

Output

Input

Output

tD1

tD2

+5V

10%

90%

10%

90%

10%

90%

VDD

90%

10%

10% 10%

90%

+5V

VDD

90%

4, 5

26, 7

1, 8

TC1413

TC1413N

TC1413

 2003 Microchip Technology Inc. DS21392C-page 9

TC1413/TC1413N

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

XXXXXXXX

XXXXXNNN

YYWW

8-Lead PDIP (300 mil) Example:

Legend: XX...X Customer specific information*

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

*Standard marking consists of Microchip part number, year code, week code, traceability code (facility

code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please

check with your Microchip Sales Office.

TC1413

CPA057

0347

8-Lead SOIC (150 mil) Example:

XXXXXXXX

XXXXYYWW

NNN

TC1413

COA0347

057

8-Lead MSOP Example:

XXXXXXX

YWWNNN

1413NE

347057

TC1413/TC1413N

DS21392C-page 10  2003 Microchip Technology Inc.

8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)

Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX

Number of Pins n88

Pitch p.100 2.54

Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32

Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68

Base to Seating Plane A1 .015 0.38

Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26

Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60

Overall Length D .360 .373 .385 9.14 9.46 9.78

Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43

Lead Thickness c.008 .012 .015 0.20 0.29 0.38

Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78

Lower Lead Width B .014 .018 .022 0.36 0.46 0.56

Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92

Mold Draft Angle Top α51015 51015

Mold Draft Angle Bottom β51015 51015

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

JEDEC Equivalent: MS-001

Drawing No. C04-018

.010” (0.254mm) per side.

§ Significant Characteristic

 2003 Microchip Technology Inc. DS21392C-page 11

TC1413/TC1413N

8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)

Foot Angle φ048048

1512015120

Mold Draft Angle Bottom

1512015120

Mold Draft Angle Top

0.510.420.33.020.017.013BLead Width

0.250.230.20.010.009.008

Lead Thickness

0.760.620.48.030.025.019LFoot Length

0.510.380.25.020.015.010hChamfer Distance

5.004.904.80.197.193.189DOverall Length

3.993.913.71.157.154.146E1Molded Package Width

6.206.025.79.244.237.228EOverall Width

0.250.180.10.010.007.004A1Standoff §

1.551.421.32.061.056.052A2Molded Package Thickness

1.751.551.35.069.061.053AOverall Height

1.27.050

Pitch

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERSINCHES*Units

45°

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

§ Significant Characteristic

TC1413/TC1413N

DS21392C-page 12  2003 Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (UA) (MSOP)

(F)

n 1

Dimensions D and E 1 do not include mold flash or protrusions. Mold flas h or protrusions s hall not

.037 REFFFootprint (R eference)

exceed .010" (0.254mm) per side.

Notes:

Drawin

No. C04-111

*C ontrolling P ara meter

Mold Draft Angle Top

Mold D ra ft Angle B ottom

F oot Angle

Lead Width

Lead Thickness

.003

.009

.006

.012

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

F oot Length

Standoff

Overall Width

Number of Pins

Pitch

.016 .024

.118 BS C

.000

.030

.193 BSC

.033

MIN

Units

.026 BSC

NOM

INC HE S

0.95 R E F

.009

.016

0.08

0.22

0˚

0.23

0.40

8˚

MILLIMETERS*

0.65 BS C

0.85

3.00 BS C

0.60

4.90 BS C

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX NOM

1.10

0.80

0.15

0.95

MAX

15˚5˚ -

JEDEC Equivalent: MO-187

0˚ - 8˚

5˚

5˚ -

15˚

 2003 Microchip Technology Inc. DS21392C-page 13

TC1413/TC1413N

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Sales and Support

Device: TC1413: 3 A Single MOSFET Driver, Inverting

TC1413N: 3 A Single MOSFET Driver, Non-Inverting

Temperature Range: C = 0°C to +70°C

E = -40°C to +85°C

Package: OA = Plastic SOIC, (150 mil Body), 8-lead

OA713 = Plastic SOIC, (150 mil Body), 8-lead

(Tape and Reel)

UA = Plastic Micro Small Outline (MSOP), 8-lead *

UA713 = Plastic Micro Small Outline (MSOP), 8-lead *

(Tape and Reel)

PA = Plastic DIP (300 mil Body), 8-lead

* MSOP package is only available in E-Temp.

PART NO. X/XX

PackageTemperature

Range

Device

Examples:

a) TC1413COA: 3A Single MOSFET driver,

SOIC package, 0°C to +70°C.

b) TC1413CPA: 3A Single MOSFET driver,

PDIP package, 0°C to +70°C.

c) TC1413EUA713: Tape and Reel, 3A

Single MOSFET driver, MSOP package,

-40°C to +85°C.

a) TC1413NCPA: 3A Single MOSFET driver,

PDIP package, 0°C to +70°C.

b) TC1413NEPA: 3A Single MOSFET driver,

PDIP package, -40°C to +85°C.

c) TC1413NEUA: 3A Single MOSFET driver,

MSOP package, -40°C to +85°C.

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification System

TC1413/TC1413N

DS21392C-page 14  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. DS21392C-page 15

Information contained in this publication regarding device

applications and the like is intended through suggestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect

to the accuracy or use of such information, or infringement of

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FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL

and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Accuron, Application Maestro, dsPIC, dsPICDEM,

dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,

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microPort, Migratable Memory, MPASM, MPLIB, MPLINK,

MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal,

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Serialized Quick Turn Programming (SQTP) is a service mark

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All other trademarks mentioned herein are property of their

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Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999

and Mountain View, California in March 2002.

The Company’s quality system processes and

procedures are QS-9000 compliant for its

PICmicro® 8-bit MCUs, KEELOQ® code hopping

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systems is ISO 9001 certified.

DS21392C-page 16  2003 Microchip Technology Inc.

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Microchip Technology Consulting (Shanghai)

Co., Ltd., Shenzhen Liaison Office

Rm. 1812, 18/F, Building A, United Plaza

No. 5022 Binhe Road, Futian District

Shenzhen 518033, China

Tel: 86-755-82901380 Fax: 86-755-82966626

China - Qingdao

Rm. B505A, Fullhope Plaza,

No. 12 Hong Kong Central Rd.

Qingdao 266071, China

Tel: 86-532-5027355 Fax: 86-532-5027205

India

Microchip Technology Inc.

India Liaison Office

Marketing Support Division

Divyasree Chambers

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road

Bangalore, 560 025, India

Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

Microchip Technology Japan K.K.

Benex S-1 6F

3-18-20, Shinyokohama

Kohoku-Ku, Yokohama-shi

Kanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Korea

Microchip Technology Korea

168-1, Youngbo Bldg. 3 Floor

Samsung-Dong, Kangnam-Ku

Seoul, Korea 135-882

Tel: 82-2-554-7200 Fax: 82-2-558-5934

Singapore

Microchip Technology Singapore Pte Ltd.

200 Middle Road

#07-02 Prime Centre

Singapore, 188980

Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan

Microchip Technology (Barbados) Inc.,

Taiwan Branch

11F-3, No. 207

Tung Hua North Road

Taipei, 105, Taiwan

Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

EUROPE

Austria

Microchip Technology Austria GmbH

Durisolstrasse 2

A-4600 Wels

Austria

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

Denmark

Microchip Technology Nordic ApS

Regus Business Centre

Lautrup hoj 1-3

Ballerup DK-2750 Denmark

Tel: 45-4420-9895 Fax: 45-4420-9910

France

Microchip Technology SARL

Parc d’Activite du Moulin de Massy

43 Rue du Saule Trapu

Batiment A - ler Etage

91300 Massy, France

Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany

Microchip Technology GmbH

Steinheilstrasse 10

D-85737 Ismaning, Germany

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Italy

Microchip Technology SRL

Via Quasimodo, 12

20025 Legnano (MI)

Milan, Italy

Tel: 39-0331-742611 Fax: 39-0331-466781

United Kingdom

Microchip Ltd.

505 Eskdale Road

Winnersh Triangle

Wokingham

Berkshire, England RG41 5TU

Tel: 44-118-921-5869 Fax: 44-118-921-5820

03/25/03

WORLDWIDE SALES AND SERVICE