FUTURE BUS CONNECTOR SPECIFICATIONS 1F Series Pow er Header Solder Type 1 Row Mechanical Contact Retention Force: 1.0Kg min. Electrical Voltage Rating: 750V Current Rating: 30A Contact Resistance: 1m max. Dielectrical Withstanding Voltage: 1000V Insulation Resistance: 1000M min. Physical Housing: LCP, UL 94-0 rated, Ivory White Contact: Phosphor Bronze Plating: See "ORDERING INFORMATION" DRAWING ORDERING I NF OR MATI O N PRODUCT NO.: 1 F 6 3 0 0 1 * - S 7 6 H 0 * - * * POS. NO.: 001=001 pos. Mating Area Plating: 1=GOLD FLASH 3=0.76um(30u")MIN. GOLD PLATING 5=1.27um(50u")MIN. GOLD PLATING 6=0.25um(10u")MIN. GOLD PLATING A=0.76um(30u")MIN. FPT PLATING, 0.25um(10u")MIN. GOLD INCLUDED Tail Style: S=Solder Type Lead Free Code: N=None F=Lead Free Package Type: A=Tube Extension Code: N=Normal Plating BODY STYLE H0=Standard Part Mating Length 6=8.10 mm Tail Length 7=3.50mm All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.