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notice_e-01
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called “TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’ s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to “Foreign Exchange and For-
eign Trade Control Law” of Japan, “U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
22
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mlcc05_e-01
■ FEATURES
■ PART NUMBER
■ STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY
■ AVAILABLE CAPACITANCE RANGE
■ APPLICATIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Newly developed dielectric material and the use of nickel for internal
electrodes provide superior temperature characteristics with high ca-
pacitance, small case size and low cost.
◦Low distortion and low shock noise make these capacitors appropri-
ate for use in analog or digital mobile devices.
◦Superior heat-resistance, high breakdown voltage, and mechanical
strength make these capacitors
appropriate
for replacing film capacitors.
◦Signal line for AV products
◦Analog signal coupling applications
◦PLL circuit of mobile phones
◦Good temperature characteristics for time constant circuits, oscilla-
tion circuits and filters
SUPER LOW DISTORTION MULTILAYER
CERAMIC CAPACITORS
（
CFCAP
TM
）
REFLOW
Cap
[pF]
Type 105 107 212 316
SD SD SD SD
VDC 50V 25V 16V 10V 6.3V 50V 25V 16V 10V 50V 35V 16V 10V 35V 25V
[3-digit]
390 391 V
470 471 V
560 561 V
680 681 V
820 821 V
1000 102 V A
1200 122 V A
1500 152 V P A
1800 182 V A
2200 222 V A
2700 272 V P A
3300 332 V A
3900 392 V A D
4700 472 V A D
5600 562 A D
6800 682 A D
8200 822 A D
10000 103 A D
12000 123 A D
15000 153 A D
18000 183 A G
22000 223 A G
27000 273 G
33000 333 D F
39000 393 F
47000 473 D F
56000 563 F
68000 683 G F
82000 823 G L
100000 104 G L
※Letters in the table indicate thickness.
T M K 3 1 6 △S D 1 0 4 K L －T△
❶ ❷ ❸ ❹ ❺ ❻ ❼ ❽ ❾ ❿ ⓫ ⓬
❶Rated
voltage 〔VDC〕
U 50
G 35
T 25
E 16
L 10
J 6.3
❾Thickness
〔mm〕
P 0.3
V 0.5
A 0.8
D 0.85
F 1.15
G 1.25
L 1.6
⓬Internal code
△Standard
△＝Blank space
⓫Packaging
T
φ178mm Taping
（4mm pitch）
107, 212, 316 Type
F
φ178mm Taping
（2mm pitch）
105 Type
❹Dimension
Type （inch）L×W 〔mm〕
105 （0402）1.0×0.5
107 （0603）1.6×0.8
212 （0805）2.0×1.25
316 （1206）3.2×1.6
❼Nominal
capacitance〔μF〕
example
223 0.022
104 0.1
❻Series symbol
SD Standard
❽Capacitance
tolerance
K±10%
❷Series name
MMultilayer ceramic
capacitor
❸End termination
K Plated
❺Dimension tolerance
△Standard
△＝Blank space
❿Special code
－Standard
Type Dimension [mm] Standard quantity [pcs]
L W T e Paper tape Embossed tape
□MK105
（0402 inch）1.0±0.05 0.5±0.05 0.3±0.03 P 0.25±0.10 10000 －
0.5±0.05 V
□MK107
（0603 inch）1.6±0.10 0.8±0.10 0.8±0.10 A 0.35±0.25 4000 －
□MK212
（0805 inch）2.0±0.10 1.25±0.10 0.85±0.10 D 0.5±0.25 4000 －
1.25±0.10 G －3000
□MK316
（1206 inch）3.2±0.15 1.6±0.15 1.15±0.10 F 0.5
＋0.35/ー0.25 －3000
1.6±0.20 L 2000
23
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CAPACITORS
mlcc05_e-01
■ REPRESENTATIVE PART NUMBERS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
●105TYPE
・0.5mm thickness（V）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
50V UMK105 SD391KV
Standard
type
390 ±10 0.1 0.5±0.05 R 200%
UMK105 SD471KV 470±10 0.1 0.5±0.05 R 200%
UMK105 SD561KV 560±10 0.1 0.5±0.05 R 200%
25V TMK105 SD681KV 680±10 0.1 0.5±0.05 R 200%
TMK105 SD821KV 820±10 0.1 0.5±0.05 R 200%
TMK105 SD102KV 1000 ±10 0.1 0.5±0.05 R 200%
TMK105 SD122KV 1200 ±10 0.1 0.5±0.05 R 200%
16V EMK105 SD152KV 1500 ±10 0.1 0.5±0.05 R 200%
EMK105 SD182KV 1800 ±10 0.1 0.5±0.05 R 200%
EMK105 SD222KV 2200 ±10 0.1 0.5±0.05 R 200%
EMK105 SD272KV 2700 ±10 0.1 0.5±0.05 R 200%
10V LMK105 SD332KV 3300 ±10 0.1 0.5±0.05 R 200%
LMK105 SD392KV 3900 ±10 0.1 0.5±0.05 R 200%
LMK105 SD472KV 4700 ±10 0.1 0.5±0.05 R 200%
●212TYPE
・1.25mm thickness（G）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
35V GMK212 SD183KG
Standard
type
18000 ±10 0.1 1.25±0.1 R 200%
GMK212 SD223KG 22000 ±10 0.1 1.25±0.1 R 200%
GMK212 SD273KG 27000 ±10 0.1 1.25±0.1 R 200%
10V LMK212 SD683KG 68000 ±10 0.1 1.25±0.1 R 200%
LMK212 SD823KG 82000 ±10 0.1 1.25±0.1 R 200%
LMK212 SD104KG 100000 ±10 0.1 1.25±0.1 R 200%
●107TYPE
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
50V UMK107 SD102KA
Standard
type
1000 ±10 0.1 0.8±0.1 R 200%
UMK107 SD122KA 1200 ±10 0.1 0.8±0.1 R 200%
UMK107 SD152KA 1500 ±10 0.1 0.8±0.1 R 200%
UMK107 SD182KA 1800 ±10 0.1 0.8±0.1 R 200%
UMK107 SD222KA 2200 ±10 0.1 0.8±0.1 R 200%
UMK107 SD272KA 2700 ±10 0.1 0.8±0.1 R 200%
UMK107 SD332KA 3300 ±10 0.1 0.8±0.1 R 200%
25V TMK107 SD392KA 3900 ±10 0.1 0.8±0.1 R 200%
TMK107 SD472KA 4700 ±10 0.1 0.8±0.1 R 200%
16V EMK107 SD562KA 5600 ±10 0.1 0.8±0.1 R 200%
EMK107 SD682KA 6800 ±10 0.1 0.8±0.1 R 200%
EMK107 SD822KA 8200 ±10 0.1 0.8±0.1 R 200%
EMK107 SD103KA 10000 ±10 0.1 0.8±0.1 R 200%
10V LMK107 SD123KA 12000 ±10 0.1 0.8±0.1 R 200%
LMK107 SD153KA 15000 ±10 0.1 0.8±0.1 R 200%
LMK107 SD183KA 18000 ±10 0.1 0.8±0.1 R 200%
LMK107 SD223KA 22000 ±10 0.1 0.8±0.1 R 200%
Note：Capacitance tolerance J (±5%) is also available. Please contact Taiyo Yuden sales channels.
・0.85mm thickness（D）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
50V UMK212 SD392KD
Standard
type
3900 ±10 0.1 0.85±0.1 R 200%
UMK212 SD472KD 4700 ±10 0.1 0.85±0.1 R 200%
UMK212 SD562KD 5600 ±10 0.1 0.85±0.1 R 200%
UMK212 SD682KD 6800 ±10 0.1 0.85±0.1 R 200%
UMK212 SD822KD 8200 ±10 0.1 0.85±0.1 R 200%
UMK212 SD103KD 10000 ±10 0.1 0.85±0.1 R 200%
35V GMK212 SD123KD 12000 ±10 0.1 0.85±0.1 R 200%
GMK212 SD153KD 15000 ±10 0.1 0.85±0.1 R 200%
16V EMK212 SD333KD 33000 ±10 0.1 0.85±0.1 R 200%
10V LMK212 SD473KD 47000 ±10 0.1 0.85±0.1 R 200%
Note：Capacitance tolerance J (±5%) is also available. Please contact Taiyo Yuden sales channels.
・0.3mm thickness（P）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
10V LMK105 SD152KP
Standard
type
1500 ±10 0.1 0.3±0.03 R 200%
6.3V JMK105 SD272KP 2700 ±10 0.1 0.3±0.03 R 200%
Note：Capacitance tolerance J (±5%) is also available. Please contact Taiyo Yuden sales channels.
24
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mlcc05_e-01
■ ELECTRICAL CHARACTERISTICS
■ REPRESENTATIVE PART NUMBERS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
20
10
15
0
5
-
5
-
10
-
15
-
20
-
60
-
40
-
20 020406080 100 120
SD : Standard Type
■
Capacitance-temperature characteristics
●316TYPE
・1.6mm thickness（L）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
25V TMK316 SD823KL
Standard
type
82000 ±10 0.1 1.6±0.2 R 200%
TMK316 SD104KL 100000 ±10 0.1 1.6±0.2 R 200%
・1.15mm thickness（F）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
35V GMK316 SD333KF
Standard
type
33000 ±10 0.1 1.15±0.1 R 200%
GMK316 SD393KF 39000 ±10 0.1 1.15±0.1 R 200%
25V
TMK316 SD473KF 47000 ±10 0.1 1.15±0.1 R 200%
TMK316 SD563KF 56000 ±10 0.1 1.15±0.1 R 200%
TMK316 SD683KF 68000 ±10 0.1 1.15±0.1 R 200%
Note：Capacitance tolerance J (±5%) is also available. Please contact Taiyo Yuden sales channels.
25
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CAPACITORS
mlcc05_e-01
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1
2
mlcc_pack-P1 mlcc_pack_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Taped package
①Minimum Quantity
②Taping material
※No bottom tape for pressed carrier tape
③Representative taping dimensions
◦Paper Tape（8mm wide）
◦Pressed carrier tape （2mm pitch）
T1
㧗0.1/−0
◦Paper tape
◦Embossed tape Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
□MK107
□WK107 1.0 1.8
4.0±0.1
1.1max.
□2K110 1.15 1.55 1.0max.
□MK212
□WK212 1.65 2.4 1.1max.□4K212
□2K212
□MK316 2.0 3.6
Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
□2K096 0.72 1.02
52.0±0.05
0.6max.
□MK105
□VK105 0.65 1.15 0.8max.
㧗0.1/−0
㧗0.1/−0
◦Punched carrier tape （4mm pitch）
Note：Taping size might be different depending on the size of the product.
◦Punched carrier tape （2mm pitch）
◦Chip filled
Type
Thickness Standard quantity [pcs]
mm code Paper tape Embossed
tape
□
MK042
0.2 C,D —40000
□MK063 0.3 P,T 15000
—
□2K096 0.3 P
100000.45 K
□WK105 0.3 P
□MK105
0.2 C 20000
0.3 P 15000
0.5 V, W 10000
□VK105 0.5 W
□MK107
□WK107
0.45 K 4000
0.5 V —4000
0.8 A
4000 —
□2K110
0.5 V
0.6 B
0.8 A
□MK212
□WK212
0.45 K
0.85 D
1.25 G —3000
□4K212 0.85 D
4000 —□2K212 0.85 D
□MK316
0.85 D
1.15 F
—3000
1.25 G
1.6 L
2000
□MK325
0.85 D
—
1.15 F
1.9 N
2.0max Y
2.5 M
500（T）, 1000（P）
□MK432 2.5 M —500
Unit：mm
Unit：mm
Unit：mm
Type Chip Cavity
Insertion Pitch
Tape Thickness
Ａ Ｂ Ｆ Ｔ T1
□MK063 0.37 0.67
2.0±0.05
0.45max. 0.42max.□2K096 0.65 1.02
□WK105
0.65 1.15MK105（*1C）0.4max. 0.3max.
MK105（*1P）0.45max. 0.42max.
*1 Thickness, C：0.2mm、P：0.3mm
1
2
mlcc_pack-P2
mlcc_pack_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Embossed tape（8mm wide）
◦Embossed tape（12mm wide）
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
□WK107 1.0 1.8
4.0±0.1
1.3max 0.25±0.1
□MK212 1.65 2.4
3.4max. 0.6max.□MK316 2.0 3.6
□MK325 2.8 3.6
④Trailer and Leader
Trailer 160mm min.
Leader 400mm min.
100mm or more
⑤Reel size
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow
as illustrated below.
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
㧗0.1/−0
㧗0.1/−0
2.0±0.1
F
36＋0/−0.2
110±0.7
12±0.1
＋0.2/−0
＋0/−0.2
12.0±0.1
8.8±0.1
6.8±0.1
1.0＋0/−0.1 2.0＋0/−0.1 1.5＋0.1/−0
Unit：mm
⑦Bulk Cassette
1.0±0.02
0.8±0.04 0.9±0.05
1.8±0.02
4.0±0.05
Ｆ2.0±0.04
◦Embossed tape（4mm wide）
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
□MK042 0.23 0.43 1.0±0.02 0.5max. 0.25max.
A B C
φ178±2.0 φ50min.
φ13.0±0.2
D E R
φ21.0±0.8 2.0±0.5
1.0
t W
4mm wide tape 1.5max.
5±1.0
8mm wide tape 2.5max.
10±1.5
12mm wide tape 2.5max.
14±1.5
Unit：mm
Unit：mm
Unit：mm
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
□MK432 3.7 4.9 8.0±0.1 4.0max. 0.6max.
Unit：mm
E
W
C
RDB
t
A
E
W
C
RDB
t
A
1
2
mlcc05_reli-R1 mlcc05_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Super Low Distortion Multilayer Ceramic Capacitors （CFCAP）
1. Operating Temperature Range
Specified Value －55 to ＋125℃
2. Storage Temperature Range
Specified Value －55 to ＋125℃
3. Rated Voltage
Specified Value 6.3VDC, 10VDC, 16VDC, 25VDC, 35VDC, 50VDC
4. Dielectric Withstanding Voltage（Between terminals）
Specified Value No breakdown or damage
【Test Methods and Remarks】
Applied voltage: Rated voltage×3
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max.
５．Insulation Resistance
Specified Value 10000 MΩ or 500MΩμF, whichever is smaller
【Test Methods and Remarks】
Applied voltage: Rated voltage
Duration: 60±5 sec.
Charge/discharge current: 50mA max.
6．Capacitance （Tolerance）
Specified Value ±10％
【Test Methods and Remarks】
Measuring frequency：1ｋHz±10%
Measuring voltage：1±0.2Vrms
Bias application: None
７
．Dissipation Factor
Specified Value 0.1%max
【Test Methods and Remarks】
Measuring frequency：1ｋHz±10%
Measuring voltage：1±0.2Vrms
Bias application: None
8．Bending Strength
Specified Value Appearance: No abnormality
Capacitance change: ±5%
【Test Methods and Remarks】
Warp: 1mm
Speed: 0.5mm/second
Duration:10 seconds
Test board: glass epoxy resin substrate
Thickness: 1.6mm
Capacitance measurement shall be conducted with the board bent.
R-230
9．Adhesive Force of Terminal Electrodes
Specified Value Terminal electrodes shall be no exfoliation or a sign of exfoliation.
【Test Methods and Remarks】
Applied force: 5N
Duration: 30 ±5 seconds
10．Solderability
Specified Value At least 95% of terminal electrode is covered by new solder.
【Test Methods and Remarks】
Solder type Solder temperature Duration
Eutectic solder H60A or H63A 230±5℃4±1 sec.
Lead-free solder Snー3.0Agー0.5Cu 245±3℃
11．Resistance to Soldering Heat
Specified Value
Appearance: No abnormality
Capacitance change: ±2.5% max.
Dissipation factor : Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
【Test Methods and Remarks】
Solder temp.: 270 ±5℃
Duration: 3 ±0.5 sec.
Preheating conditions： 80 to 100℃, 2 to 5 min. or 5 to 10 min.
150 to 200℃, 2 to 5 min. or 5 to 10 min.
Measurement shall be conducted : 24±2hrs under the standard condition Note1
Multilayer Ceramic Capacitors and Medium-High Voltage Multilayer Ceramic
Capacitors are noted separately.
1
2
mlcc05_reli-R2
mlcc05_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
12．Temperature Cycle（Thermal Shock）
Specified Value
Appearance: No abnormality
Capacitance change: ±2.5% max
Dissipation factor : Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
【Test Methods and Remarks】
Conditions for 1 cycle／ Step 1: Minimum operating temperature ＋0
－3℃ 30±3 min.
Step 2: Normal temperature 2 to 3 min.
Step 3: Maximum operating temperature ＋0
－3℃ 30±3 min.
Step 4: Normal temperature 2 to 3 min.
Number of cycles: 5 times
Measurement shall be conducted : 24±2hrs under the standard condition Note1
13．Humidity （Steady state）
Specified Value
Appearance: No abnormality
Capacitance change: ±5% max
Dissipation factor : 0.5% max
Insulation resistance 50MΩμF or 1000MΩ, whichever is smaller
【Test Methods and Remarks】
Temperature:40±2℃
Humidity:90 to 95% RH
Duration:500 ＋24
－0 hrs
Measurement shall be conducted : 24 ±2hrs under the standard condition Note1
14．Humidity Loading
Specified Value
Appearance: No abnormality
Capacitance change: ±7.5% max
Dissipation factor : 0.5% max
Insulation resistance: 25MΩμF or 500MΩ, whichever is smaller
【Test Methods and Remarks】
According to JIS C 5102 clause 9.9.
Temperature:40±2℃ Humidity:90 to 95% RH
Duration:500 ＋24
－0 hrs
Applied voltage: Rated voltage
Charge/discharge current:50mA max
Measurement shall be conducted : 24 ±2hrs under the standard condition Note1
15．High Temperature Loading
Specified Value
Appearance: No abnormality
Capacitance change: ±3% max
Dissipation factor : 0.35% max
Insulation resistance: 50MΩμF or 1000MΩ, whichever is smaller
【Test Methods and Remarks】
According to JIS C 5102 clause 9.10.
Temperature:125±3℃
Duration:1000 ＋48
－0 hrs
Applied voltage: Rated voltage x 2
Charge/discharge current:50mA max
Measurement shall be conducted : 24 ±2hrs under the standard condition Note1
Note1 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
1
2
mlcc_prec-P1 mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
Precautions
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
amount of solder.
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
◆Pattern configurations（Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors
shall be carefully considered to minimize stresses.
Technical
consider-
ations
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions （unit: mm）
Wave-soldering Land patterns for PCBs
Type 107 212 316 325
Size L 1.6 2.0 3.2 3.2
W 0.8 51.25 1.6 2.5
A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
Solder-resist
Chip capacitor
L
L
W
B
C
B
A
W
LWDC
Land
Chip capacitor
Reflow-soldering
Type 042 063 105 107 212 316 325 432
Size L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
W 0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55
0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
B
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50
0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
C
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55
0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
Note：Recommended land size might be different according to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering（unit: mm）
Type 105 107 212
Size L 0.52 50.8 1.25
W 1.0 1.6 2.0
A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7
B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5
C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1
●Array type: Recommended land dimensions for reflow-soldering （unit: mm）
2 circuits 4 circuits
Type 096（2 circuits）110（2 circuits）212（2 circuits）212（4 circuits）
Size L 0.9 1.37 2.0 2.0
W 0.6 1.0 1.25 1.25
a 0.25 to 0.35 0.35 to 0.45 0.5 to 0.6 0.5 to 0.6
b 0.15 to 0.25 0.55 to 0.65 0.5 to 0.6 0.5 to 0.6
c 0.15 to 0.25 0.3 to 0.4 0.5 to 0.6 0.2 to 0.3
d 0.45 0.64 1.0 0.5
Chip capacitor
a
a
b
d
c
Land
c
d
a
a
b
（2）Examples of good and bad solder application
Items Not recommended Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Precautions on the use of Multilayer Ceramic Capacitors
To next page
1
2
mlcc_prec-P2
mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
2. PCB Design
Technical
consider-
ations
◆Pattern configurations（Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
flection.
Items Not recommended Recommended
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
Technical
consider-
ations
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
shall be considerable.
（1） The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2） The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Items Not recommended Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f . The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 to 120 μm
c Adhesives shall not contact land
1
2
mlcc_prec-P3 mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
Precautions
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt% （in CI equivalent） of halogenated content. Flux having a strong acidity content shall not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
consider-
ations
◆Selection of Flux
1-1. When too much halogenated substance （Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-（Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec- content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble flux is used.
◆Soldering
• Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
• Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
• Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃.
• Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】
Temperature（℃）
0
100
200
300
230℃
Within 10 sec.
60sec.
Min.
60sec.
Min.
Slow cooling
Preheating
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Caution
①The ideal condition is to have solder mass （fillet） controlled to 1/2 to 1/3 of the thickness of a capacitor.
Capacitor
PC board
T
Solder
②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
⊿T
316type or less
⊿T≦150℃
⊿T
325type or more
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
1
2
mlcc_prec-P4
mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning.（e.g. to
remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics.
Technical
consider-
ations
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in
a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions （insufficient or excessive cleaning） may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered
portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked;
Ultrasonic output : 20 W/ℓ or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor-
age conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or
destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
◆Storage
1.
To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity : Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci-
tors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2.
The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, ｓo care shall be taken to design circuits . Even if
capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour.
Technical
consider-
ations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/
packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be-
fore using the capacitors.
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
