HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Prelimi nary Data
Issued Date : 2001.07.01
Revised Date : 2001. 07.26
Page No. : 1/3
H1N5820, H1N5821, H1N5822 HSMC Product Specifi cation
H1N5820 thru H1N5822
3.0 AMPS. S CHOTTKY BARRIER RECTIFIERS
Features
• Low Forward Voltage Drop
• High Current Capability
• High Reliab ility
• High Surge Current Capability
Mechanical Data
• Cases: DO-201AD molded plastic.
• Epoxy: UL 94V-0 rate flame retardant.
• Lead: Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.
• Polarity: Color band denotes cathode end.
• Hig h temperat ure solder ing guarant eed: 250°C/1 0 seconds/.3 75”(9.5m m) lead le ngths at 5 lbs.,
(2.3Kg) tension.
• Weight: 1.10 grams.
Maximum Ratings
Ratings at 25°C ambien t tempera ture unless ot herwis e specified. Sing le phase, hal f wave, 60 Hz ,
resistive or inductive load. For capacitive load, derate current by 20%.
Type Number H1N5820 H1N5821 H1N5822 Units
Maximum Recurrent Peak Reverse Voltage 20 30 40 V
Maximum RMS Voltage 14 21 28 V
Maximum DC B locking Voltage 20 30 40 V
Maximum Average Forward Rectified Current
0.375"(9 .5mm) Lead Length @ TL=9 0°C3A
Peak Forward Surge Current, 8.3ms Single Half
Sine-wave Superimposed on Rated Load (JEDEC
method) 80 A
Maximum Instantaneous Forward Voltage @ 3A 0.475 0.5 0.525 V
Maximum Instantaneous Forward Voltage @ 9A 0.85 0.9 0.95 V
Maximum DC Reverse Current At Rated DC
Blocking Voltage 2 (@ Ta=25°C)
20 (@ Ta=100°C) mA
mA
Typical Ther mal Resi stance (Note 1) RθJA 40 °C /W
Typical Junction Capacitance (Note 2) 250 pF
Operating Temperature Range Tj -65 to +125 °C
Storage Temperature Range TSTG -65 to +125 °C
Note 1: Thermal resistance from junction to ambient vertical P.C. Board Mounting, 0.375”(9.5mm) lead length.
Note 2: Measured at 1Mhz and applied reverse voltage of 4V D.C.
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Prelimi nary Data
Issued Date : 2001.07.01
Revised Date : 2001. 07.26
Page No. : 2/3
H1N5820, H1N5821, H1N5822 HSMC Product Specifi cation
Characteristics Curve
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Prelimi nary Data
Issued Date : 2001.07.01
Revised Date : 2001. 07.26
Page No. : 3/3
H1N5820, H1N5821, H1N5822 HSMC Product Specifi cation
DO-201 Dimension
*:Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.0472 0.0512 1.20 1.30 D 1.0000 - 25.40 -
B 1.0000 - 25.40 - E 0.1890 0.2087 4.80 5.30
C 0.2835 0.3740 7.20 9.50
Notes : 1.Dimension and tolerance based on our Spec. dated May 28,1998.
2.Controll i ng dimensi on : mill imeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing m ethod, please contact your l ocal HSMC s ales office.
Material :
• Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.
• Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its produc ts without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any cons equence of customer product design, infringement of patents, or applic at ion assistance.
Head Office And Factory :
• Head Office (Hi-Sincerit y Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-S han N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
E
BC
A
D
DO-201 Molded Pl as tic Package
HSMC Package Code: L
