No. of Contacts
03 to 40
BD080
Ordering Grid
XX L
Insulator Material
L = LCP
X 0230
Tail Length (1/100mm)
0230 = 2.30mm
1.27
Ø0.65 (Typ.)
1.27 (Typ.)
PIN 0.42X0.15 (Typ.)
MIN. INSERTION
DEPTH = 1.70mm
MAX. INSERTION
DEPTH = 3.70mm
Packing Options
D = Tube (Sta n dard)
E = Tube with Cap
F = Tube with Film
G = Plastic Box
For 3 contacts option G only.
B±0.38
A±0.25 (Typ. Non-Accum)
4.30
1.80
X
1.27
Contact Plating
A = Gold Flash All Over(Standard)
B = Selective Gold Flash Contact Area/
Tin On Tail
C = Tin All Over
G = 10µ" Gold Contact Area/Tin On Tail
I = 30µ" Gold Contact Area/Tin On Tail
A
1
B
C
D
23
E
F
G
H
678
C
45
GC
3rd Angle Projection
Units:
Metric (mm)
Tolerances (Except as Noted)
X. ± 0.30
X.X ± 0.20
X.XX ± 0.15
X.XXX ± 0.10
Length Angle
Product Description
This drawing is confidential and
copyright of Global Connector
Technology, Ltd (GCT).
This drawing must not be copied
or disclosed without written
consent. E & OE
Not to
Scale
Drawn By
LYH
Sheet No.
1/1
BD080 1.27mm Pitch Socket, Single Row,
Through Hole, Vertical
CC
H1
By
Detail
Revision
GlobalConnectorTechnology
www.gct.co
Part Number
Drawing Date
28th December 2007
25/10/16Date
X.° ± 5°
X.X° ± 2°
X.XX° ± 1°
X.XXX° ± 0.5°
BD080
H PCN
Number of
Contacts
Dimensions
AB
32.54
4.16
43.81
5.43
5 5.08 6.70
6 6.35 7.97
7 7.62 9.24
8 8.89 10.51
9 10.16 11.78
10 11.43 13.05
11 12.70 14.32
12 13.97 15.59
13 15.24 16.86
14 16.51 18.13
15 17.78 19.40
16 19.05 20.67
17 20.32 21.94
18 21.59 23.21
19 22.86 24.48
20 24.13 25.75
21 25.40 27.02
22 26.67 28.29
23 27.94 29.56
24 29.21 30.83
25 30.48 32.10
26 31.75 33.37
27 33.02 34.64
28 34.29 35.91
29 35.56 37.18
30 36.83 38.45
31 38.10 39.72
32 39.37 40.99
33 40.64 42.26
34 41.91 43.53
35 43.18 44.80
36 44.45 46.07
37 45.72 47.34
38 46.99 48.61
39 48.26 49.88
40 49.53 51.15
Request Samples
and Quotation
Specifications 规格
Material 物料
Insulator Material 绝缘体物料:
Polymer 聚合物,LCP, UL 94V-0
Contact Terminal 接触端子: Copper Alloy
Plating 电镀
See Ordering Grid
Electrical 电气
Current Rating电流额定值: 1A per pin
Contact Resistance接触电阻值: 20 mΩ max.
Insulating Resistance绝缘电阻值: 1000 MΩ min.
Dielectric Withstand Voltage耐电压: 300V AC
Soldering Process 可焊性:
IR Reflow 回流焊: 260°C for 10 sec.
Wave 波峰焊: 250°C for 5-10 sec
Manual Solder 人工焊接: 350°C for 3-5 sec
Mechanical & Environmental 机械 & 环境
Operating Temperature 工作温度: -40°C to +105°C
Mates with 配套之公头
(Subject to pin length 在端子长度适合的条件下)
BD021 BD045 BD100 BD110
Recommended PCB Layout
2.30±0.20
