MIC23350 Evaluation Board User's Guide 2018 Microchip Technology Inc. DS50002833A Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. QUALITYMANAGEMENTSYSTEM CERTIFIEDBYDNV The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-4008-6 == ISO/TS16949== DS50002833A-page 2 2018 Microchip Technology Inc. MIC23350 EVALUATION BOARD USER'S GUIDE Table of Contents Preface ........................................................................................................................... 4 Introduction............................................................................................................ 4 Document Layout .................................................................................................. 4 Conventions Used in this Guide ............................................................................ 5 Recommended Reading........................................................................................ 6 The Microchip Website.......................................................................................... 6 Customer Support ................................................................................................. 6 Document Revision History ................................................................................... 6 Chapter 1. Product Overview 1.1 Introduction ..................................................................................................... 7 1.2 MIC23350 Device Short Overview ................................................................. 7 1.3 What is the MIC23350 Evaluation Board? ..................................................... 8 1.4 Contents of the MIC23350 Evaluation Board Kit ............................................ 8 Chapter 2. Installation and Operation 2.1 Introduction ..................................................................................................... 9 2.2 Features ......................................................................................................... 9 2.3 Getting Started ............................................................................................. 10 2.3.1 Power Input and Output Connection ......................................................... 10 Appendix A. Schematic and Layouts A.1 Introduction .................................................................................................. 13 A.2 Board - Schematic ....................................................................................... 14 A.3 Board - Top Silk .......................................................................................... 15 A.4 Board - Top Copper and Silk ....................................................................... 15 A.5 Board - Top Copper .................................................................................... 16 A.6 Board - Mid Layer 1 ..................................................................................... 16 A.7 Board - Mid Layer 2 ..................................................................................... 17 A.8 Board - Bottom Copper ............................................................................... 17 A.9 Board - Bottom Copper and Silk ................................................................. 18 A.10 Board - Bottom Silk ................................................................................... 18 Appendix B. Bill of Materials (BOM) Worldwide Sales and Service .................................................................................... 21 2018 Microchip Technology Inc. DS50002833A-page 3 MIC23350 EVALUATION BOARD USER'S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available. Documents are identified with a "DS" number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is "DSXXXXXXXXA", where "XXXXXXXX" is the document number and "A" is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB(R) IDE online help. Select the Help menu, and then Topics to open a list of available online help files. INTRODUCTION This chapter contains general information that will be useful to know before using the MIC23350 Evaluation Board. Items discussed in this chapter include: * * * * * * Document Layout Conventions Used in this Guide Recommended Reading The Microchip Website Customer Support Document Revision History DOCUMENT LAYOUT This document describes how to use the MIC23350 Evaluation Board as a development tool. The manual layout is as follows: * Chapter 1. "Product Overview" - Important information about the MIC23350 Evaluation Board. * Chapter 2. "Installation and Operation" - Includes instructions on installing and starting the MIC23350 Evaluation Board. * Appendix A. "Schematic and Layouts" - Shows the schematic and layout diagrams for the MIC23350 Evaluation Board. * Appendix B. "Bill of Materials (BOM)" - Lists the parts used to build the MIC23350 Evaluation Board. 2018 Microchip Technology Inc. DS50002833A-page 4 Preface CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Represents Examples Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB(R) IDE User's Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer "Save project before build" A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4`b0010, 2`hF1 Italic Courier New Sample source code Filenames File paths Keywords Command-line options Bit values Constants A variable argument Square brackets [ ] Optional arguments Curly brackets and pipe character: { | } Ellipses... Choice of mutually exclusive arguments; an OR selection Replaces repeated text #define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, 1 0xFF, `A' file.o, where file can be any valid filename mcc18 [options] file [options] errorlevel {0|1} Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N`Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents code supplied by user 2018 Microchip Technology Inc. File>Save Press <Enter>, <F1> var_name [, var_name...] void main (void) { ... } DS50002833A-page 5 Preface RECOMMENDED READING This user's guide describes how to use the MIC23350 Evaluation Board. Another useful document is listed below. The following Microchip document is available and recommended as a supplemental reference resource. * MIC23350 Data Sheet - "Step-Down Converter with Hyperlight LoadTM and Voltage Select" (DS20006126) This data sheet provides detailed information regarding the MIC23350 device. THE MICROCHIP WEBSITE Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at: http://support.microchip.com. DOCUMENT REVISION HISTORY Revision A (December 2018) * Initial release of this document. 2018 Microchip Technology Inc. DS50002833A-page 6 MIC23350 EVALUATION BOARD USER'S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the MIC23350 Evaluation Board and covers the following topics: * MIC23350 Device Short Overview * What is the MIC23350 Evaluation Board? * Contents of the MIC23350 Evaluation Board Kit 1.2 MIC23350 DEVICE SHORT OVERVIEW The MIC23350 device is a compact, high-efficiency, low-voltage, 3A continuous current, synchronous step-down regulator. The HyperLight LoadTM provides very high efficiency at light loads, while still having an ultra-fast transient response. The MIC23350 device's output voltage is set by two VSEL (Voltage Selection) three-state pins, which allow for nine possible combinations. Table 2-1 details the possible combinations and the resulting output voltage. The 2.4V to 5.5V input voltage range, low shutdown and quiescent currents make the MIC23350 device ideal for single-cell Li-Ion battery-powered applications. The 100% duty cycle capability provides low-dropout operation, extending the operating range in portable systems. An open-drain Power Good (PG) output is provided to indicate when the output voltage is within 9% of regulation and facilitates output voltage monitoring and supply sequencing. When set in shutdown (EN = GND), the MIC23350 device draws a typical current of 1.5 A. MIC23350 is available in a thermally efficient, 16-lead 2.5 mm x 2.5 mm x 0.55 mm thin FTQFN package, with an operating junction temperature range from -40C to +125C. More detailed information regarding the capabilities of the MIC23350 device is available in the "MIC23350 Data Sheet". C1 1 F VIN FIGURE 1-1: SW VOUT PVIN EN PGND VSEL1 VSEL1 AGND VSEL2 VSEL2 PG EN Program VOUT C2 22 F SVIN L1 0.35 H VOUT C3 47 F PGOOD Typical MIC23350 Step-Down Application. 2018 Microchip Technology Inc. DS50002833A-page 7 Product Overview 1.3 WHAT IS THE MIC23350 EVALUATION BOARD? The MIC23350 Evaluation Board is used to evaluate and demonstrate the MIC23350 device. This board demonstrates the MIC23350 device in a buck converter application, supplied from an external voltage source (from 2.4V to 5.5V), to a pin-programmed regulated output. Two jumpers are provided on the board to select the desired output voltage, chosen from nine preset values (as shown in Table 2-1). 1.4 CONTENTS OF THE MIC23350 EVALUATION BOARD KIT This MIC23350 Evaluation Board kit includes: * One MIC23350 Evaluation Board unit (ADM00880) * Important Information Sheet 2018 Microchip Technology Inc. DS50002833A-page 8 MIC23350 EVALUATION BOARD USER'S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION MIC23350 has been developed for applications suited for 2.4V to 5.5V input voltage range, low shutdown and quiescent currents, 3A continuous output current. This makes the MIC23350 device ideal for single cell Li-Ion battery-powered applications. The 100% duty cycle capability provides low-dropout operation, extending the operating range in portable systems. SW (test point) C1 1 F 2.4V to 5.5V VIN C8 470 F C3 0.1 F C9 22 F SVIN VOUT PVIN VIN FIGURE 2-1: 2.2 VSEL1 VSEL2 VIN VIN VOUT R12 10R C7 0.1 F Loop Gain Test Pins MIC23350 EN R3 1M SW R1 49.9R L1 0.35 H C5 47 F PGND AGND PG VIN R7 100K PG (test point) MIC23350 Step-Down Evaluation Board with Pin-Selectable Output Voltage. FEATURES The MIC23350 Evaluation Board has the following features: * 2.4V to 5.5V Input Voltage Range * 3A Continuous Output Current * Programmable Voltage Output through VSEL Pins: - 0.6V, 0.8V, 0.9V, 1.0V, 1.2V, 1.5V, 1.8V, 2.5V or 3.3V Output Voltage * High Efficiency (up to 95%) * 1.5% Output Voltage Accuracy Over Line/Load/Temperature Range * Supports Safe Start-up with Pre-Biased Output * Output Discharge when Disabled (typically 10) * Typical 1.5 A Shutdown Supply Current * Low-Dropout Operation (100% duty cycle) * Ultra-Fast Transient Response * Latch-Off Thermal Shutdown Protection * Hiccup Current Limit Protection * Power Good Open-Drain Output 2018 Microchip Technology Inc. DS50002833A-page 9 Installation and Operation 2.3 GETTING STARTED The MIC23350 Evaluation Board is fully assembled and tested to evaluate and demonstrate the MIC23350 product. This board requires the use of external lab supplies. 2.3.1 Power Input and Output Connection 2.3.1.1 POWERING THE MIC23350 EVALUATION BOARD When the MIC23350 Evaluation Board is ready for evaluation, apply positive input voltage to the VIN terminal and the corresponding return to the GND_IN terminal. The maximum input voltage should not exceed 5.5V. An electronic load or a resistive load can be used for evaluation. Some electronic loads can sink the programmed current, starting from very low output voltage levels during start-up. For a more realistic start-up behavior evaluation, a resistive load or a constant resistance electronic load is recommended. Connect the positive voltage terminal of the load to the VOUT terminal on the MIC23350 Evaluation Board and connect the negative or the return side of the load to the GND_OUT terminal. 2.3.1.2 BOARD POWER-UP PROCEDURE 1. Connect the input supply, voltmeter, amperemeter and load as shown in Figure 2-2. 2. Place VSEL1 and VSEL2 jumpers to obtain the desired output voltage, according to Table 2-1. 3. Fit the enable jumper on the J6 header according to the silkscreen indication (see Figure 2-2). 4. Once the input is greater than 2.35V, the MIC23350 device begins to operate normally. 5. The voltmeter is now indicating an output voltage according to the VSEL1/VSEL2 jumpers' combination. Adjusting the input voltage and load should not cause the output to vary more than a few mV over the operating range of the converter. Note that because of the relatively high internal resistance of some amperemeters, only a very limited amount of load should be applied, as long as the amperemeter is connected in series with the input power supply. 6. Optionally, for more advanced readings, place the oscilloscope probe CH1 in the SW test point in order to measure the switching waveforms. Place the probe CH2 on the output header (close to the output capacitors) to measure the AC ripple of the output voltage. 7. Remove the EN jumper and check the amperemeter indication. The measured shutdown current should be approximately 1.5 A (typical). 2018 Microchip Technology Inc. DS50002833A-page 10 Installation and Operation Power - Supply + V-meter Load A-meter CH1 CH2 Oscilloscope FIGURE 2-2: MIC23350 Evaluation Board Setup. 2.3.1.3 ADJUSTING THE OUTPUT VOLTAGE There is no need for a resistor divided network on the MIC23350 device. The output voltage is simply selected before the power-up, through the VSEL1 and VSEL2 pins. Table 2-1 displays the possible combinations. TABLE 2-1: OUTPUT VOLTAGE SETTINGS VSEL2 VSEL1 VOUT GND GND 0.6V GND OPEN 0.8V GND VIN 0.9V OPEN GND 1.0V OPEN OPEN 1.2V OPEN VIN 1.5V VIN GND 1.8V VIN OPEN 2.5V VIN VIN 3.3V The oscilloscope screen capture in Figure 2-3 displays the MIC23350 device's switching waveforms during normal operation, when supplied from a 5V input, at full load (3A). 2018 Microchip Technology Inc. DS50002833A-page 11 Installation and Operation EN 5V/div VOUT 50 mV/div AC coupled SW 5V/div PG 5V/div FIGURE 2-3: Normal Operation at 0.6V Output, 3A Load. 100 Efficiency (%) 90 80 70 60 VIN = 5.0V 50 VIN = 3.3V 40 VIN = 2.5V 30 20 VOUT = 1V 10 0 0.001 FIGURE 2-4: 0.01 0.1 IOUT (A) 1 10 Efficiency vs IOUT at 1V. 2018 Microchip Technology Inc. DS50002833A-page 12 Installation and Operation 100 Efficiency (%) 90 80 70 60 50 40 30 VIN = 5.0V VOUT = 3.3V 20 10 0 0.001 FIGURE 2-5: 0.01 0.1 IOUT (A) 1 10 Efficiency vs. IOUT at 3.3V 2.3.1.4 LOOP GAIN MEASUREMENT The MIC23350 Evaluation Board provides injection points and a termination resistor (R12) for AC loop gain measurements. If needed, the value of R12 can be changed to optimize the injection signal level. Inject the oscillator at J9 through the insulation transformer (for instance, across resistor R12), and connect the A (CH1) and B (CH2) channels at TP1 and TP2, respectively, or as indicated by the operating instructions of the particular loop gain analyzer in use. 2.3.1.5 BENCH TESTING AT HIGH CURRENT When testing the MIC23350 device at high load currents, or when checking the overcurrent protection behavior, it may be necessary to remove the series A-meter, shown in Figure 2-2, or to replace it with a very low-value shunt resistor. This is because the internal resistance of many Digital Multimeters (DMMs) used for current measurements is generally too high. The MIC23350 Evaluation Board also comes populated with a 470 F electrolytic bulk capacitor, especially recommended when long wires are used in combination with high currents or load transitions. This capacitor prevents the input voltage from exceeding the device rating due to voltage spikes and allows for a more stable, controlled input voltage. NOTICE In order to obtain the best performance with the minimum occupied board space, proper layout techniques must be followed. First, the input and output capacitors should be placed as close to the MIC23350 device as possible, and on the same layer as the IC. This ensures low ripple and improved performance. Secondly, vias must be used under the MIC23350 device, from its exposed pad to the GND plane, in order to allow for best heat dissipation. Lastly, the switching node (from the SW pin of the MIC23350 device to the inductor) should be as small as possible to decrease EMI emission. 2018 Microchip Technology Inc. DS50002833A-page 13 MIC23350 EVALUATION BOARD USER'S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the MIC23350 Evaluation Board: * * * * * * * * * Board - Schematic Board - Top Silk Board - Top Copper and Silk Board - Top Copper Board - Mid Layer 1 Board - Mid Layer 2 Board - Bottom Copper Board - Bottom Copper and Silk Board - Bottom Silk 2018 Microchip Technology Inc. DS50002833A-page 13 BOARD - SCHEMATIC SW J3 J1 R1 C1 J5 9,1 C3 22uF 10V 0805 470uF 16V U1 1uF 16V 0603 C9 C8 0.1uF 16V 0402 JP1 J6 9,1 JP1 should be mounted on 1-2 pins J6 J14 SVIN 16 1 PVIN PVIN 12 EN EN R3 1M 0603 VSEL1 VSEL2 J4 L1 350nH 15 14 13 3 2 TP LOOP Red Shunt 2.54mm 1x2 Handle HDR-2.54 Male 1x3 49.9R 0603 9,1 10 VSEL2 C7 47uF 10V 1210 0.1uF 16V 0603 R12 11 VSEL1 C5 MIC23350 10R 0603 1% DNP R7 9,1 9,1 JP2 J2 PG J15 J7 J17 VSEL1 VSEL2 J21 TP LOOP Red J19 J18 JP2 should be mounted on 1-2 pins J2 100k 0603 J9 J20 J13 J12 Shunt 2.54mm 1x2 Handle TP LOOP Black HDR-2.54 Male 1x3 HDR-2.54 Male 1x3 JP3 Shunt 2.54mm 1x2 Handle 2018 Microchip Technology Inc. JP3 should be not mounted, only on the package NT1 Net Tie 0.5mm MIC23350 Evaluation Board User's Guide DS50002833A-page 14 A.2 Schematic and Layouts A.3 BOARD - TOP SILK A.4 BOARD - TOP COPPER AND SILK 2018 Microchip Technology Inc. DS50002833A-page 15 Schematic and Layouts A.5 BOARD - TOP COPPER A.6 BOARD - MID LAYER 1 2018 Microchip Technology Inc. DS50002833A-page 16 Schematic and Layouts A.7 BOARD - MID LAYER 2 A.8 BOARD - BOTTOM COPPER 2018 Microchip Technology Inc. DS50002833A-page 17 Schematic and Layouts A.9 BOARD - BOTTOM COPPER AND SILK A.10 BOARD - BOTTOM SILK 2018 Microchip Technology Inc. DS50002833A-page 18 MIC23350 EVALUATION BOARD USER'S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: Qty. MIC23350 EVALUATION BOARD - BILL OF MATERIALS (BOM) Reference Description Manufacturer Part Number 1 C1 Ceramic capacitor, 1 F, 16V, 10%, X7R, SMD, 0603 Wurth Elektronik 885012206052 1 C3 Ceramic capacitor, 0.1 F, 16V, 10%, X7R, SMD, 0402 Murata Electronics North America, Inc. GRM155R71C104KA88D 1 C5 Ceramic capacitor, 47 F, 10V, 20%, X7R, SMD, 1210 Taiyo Yuden Co., Ltd. LMK325B7476MM-TR 1 C7 Ceramic capacitor, 0.1 F, 16V, 10%, X7R, SMD, 0603 Wurth Elektronik 885012206046 1 C8 Aluminum capacitor, 470 F, 16V, 20%, RAD, P3.5D8H11.5 Nichicon Corporation UVZ1C471MPD 1 C9 Ceramic capacitor, 22 F, 10V, 20%, X7S, SMD, 0805 TDK Corporation C2012X7S1A226M125A C 4 J1, J3, J12, J13 Connector, HDR-2.54, Male, 1x2, Gold, 5.84MH, TH, Vertical FCI 77311-118-02LF 2 J14, J21 Misc, Test Point, Multipurpose, Mini, Red Keystone Electronics Corp. 5000 3 J17, J18, J20 Misc, Test Point, Multipurpose, Mini, Black Keystone Electronics Corp. 5001 3 J2, J6, J7 Connector, HDR-2.54, Male, 1x3, Tin, 5.84MH, TH, Vertical Samtec, Inc. TSW-103-07-T-S 4 J4, J5, J15, J19 Connector, TP, PIN, Tin, TH Harwin H2121-01 0 J9 NOT POPULATED FCI 77311-118-02LF 1 L1 Inductor, 350 nH, 3.3A, 20%, SMD, L3.2W3.5H1.5 Coilcraft XEL3515-351 1 PCB1 MIC23350 Evaluation Board - Printed Microchip Circuit Board Technology Inc. 1 R1 Resistor, TKF, 49.9R, 1%, 1/10W, SMD, 0603 1 R12 Resistor, TKF, 10R, 1%, 1/10W, SMD, Panasonic - ECG 0603 ERJ-3EKF10R0V 1 R3 Resistor, TKF, 1M, 1%, 1/10W, SMD, 0603 Panasonic - ECG ERJ-3EKF1004V 1 R7 Resistor, TKF, 100 k 1%, 1/10W, SMD, 0603 TE Connectivity 1622827-1 1 U1 Microchip Analog Switcher Buck 2.4V to 5.5V MIC23350YFT FTQFN-16 Microchip Technology Inc. MIC23350YFT Note 1: Panasonic(R) - ECG 04-10739-R1 ERJ-3EKF49R9V The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. 2018 Microchip Technology Inc. DS50002833A-page 19 Bill of Materials (BOM) TABLE B-2: Qty. BILL OF MATERIALS - MECHANICAL PARTS Reference Description Manufacturer Part Number 3 JP1, JP2, JP3 Mechanical HW Jumper, 2.54 mm, 1x2, Phosphor Bronze, w/ Handle Jameco Valuepro 2012JH-R 1 LABEL1 Label, Assembly w/Rev Level (Small Modules) Per MTS-0002 -- -- 4 PAD1, PAD2, PAD3, PAD4 Mechanical HW Rubber Pad, Cylindrical, 3M D7.9 H5.3, Black Note 1: SJ61A11 The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. 2018 Microchip Technology Inc. DS50002833A-page 20 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 India - Bangalore Tel: 91-80-3090-4444 China - Beijing Tel: 86-10-8569-7000 India - New Delhi Tel: 91-11-4160-8631 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Chengdu Tel: 86-28-8665-5511 India - Pune Tel: 91-20-4121-0141 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 China - Chongqing Tel: 86-23-8980-9588 Japan - Osaka Tel: 81-6-6152-7160 Finland - Espoo Tel: 358-9-4520-820 China - Dongguan Tel: 86-769-8702-9880 Japan - Tokyo Tel: 81-3-6880- 3770 China - Guangzhou Tel: 86-20-8755-8029 Korea - Daegu Tel: 82-53-744-4301 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Hangzhou Tel: 86-571-8792-8115 Korea - Seoul Tel: 82-2-554-7200 China - Hong Kong SAR Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 China - Nanjing Tel: 86-25-8473-2460 Malaysia - Penang Tel: 60-4-227-8870 China - Qingdao Tel: 86-532-8502-7355 Philippines - Manila Tel: 63-2-634-9065 China - Shanghai Tel: 86-21-3326-8000 Singapore Tel: 65-6334-8870 China - Shenyang Tel: 86-24-2334-2829 Taiwan - Hsin Chu Tel: 886-3-577-8366 China - Shenzhen Tel: 86-755-8864-2200 Taiwan - Kaohsiung Tel: 886-7-213-7830 Israel - Ra'anana Tel: 972-9-744-7705 China - Suzhou Tel: 86-186-6233-1526 Taiwan - Taipei Tel: 886-2-2508-8600 China - Wuhan Tel: 86-27-5980-5300 Thailand - Bangkok Tel: 66-2-694-1351 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 China - Xian Tel: 86-29-8833-7252 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 2018 Microchip Technology Inc. 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