Product family data sheet
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo,
XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
WWW.CREE.COM/XLAMP
CLD-DS16 REV 11N
Cree® XLamp® MC-E LED
MC-E White MC-E Color
PRODUCT DESCRIPTION
The XLamp® MC-E LED is a family of
lighting-class, multi-chip LEDs that
provides high lumen output in a small
package. Compared to discrete LEDs,
XLamp MC-E LEDs reduce the distance
between LED die, creating a small optical
source for excellent optical control and
efcient color mixing. XLamp MC-E LEDs
can reduce LED system complexity by
reducing the number of components
required.
Cree XLamp LEDs bring high
performance and quality of light to a wide
range of lighting applications, including
color-changing lighting, portable and
personal lighting, outdoor lighting, indoor
directional lighting, and entertainment
lighting.
FEATURES
• Available in white (2600K–10,000K
CCT), EasyWhite®, or color (RGBW)
• ANSI-compatible neutral & warm
white chromaticity bins
• Individually addressable LEDs
• MC-E EasyWhite LEDs available in
2- and 4-step bins, up to 85 CRI
• Maximum drive current: 700mA per
LED die
• Reow solderable – JEDEC
J-STD-020
• Electrically neutral thermal path
• RoHS and REACh compliant
• UL® recognized component
(E349212)
TABLE OF CONTENTS
Characteristics
Complete Package ........................... 2
Per LED Die (White) .......................... 2
Per LED Die (Color) ...........................2
Flux Characteristics
White, Color.......................................3
EasyWhite® .......................................4
Relative Spectral Power Distribution
White .................................................5
Color ..................................................5
Relative Flux Output vs Junction
Temperature ...........................................6
Electrical Characteristics .......................7
Relative Intensity vs. Current .................7
Typical Spatial Radiation Pattern .......... 8
Reow Soldering Characteristics ..........9
Notes ....................................................10
Mechanical Dimensions ......................12
Tape and Reel .......................................13
Packaging ............................................. 14
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
2
XLamp® mC-E LED
CHARACTERISTICS - COMPLETE PACKAGE
The following table lists the product characteristics for the XLamp MC-E LED package.
Characteristics Unit Minimum Typical Maximum
Thermal Resistance, junction to solder point - white °C/W 3
Thermal Resistance, junction to solder point - color °C/W 4
Viewing Angle (FWHM) - white degrees 110
Viewing Angle (FWHM) - color degrees 115
ESD Withstand Voltage (HBM per Mil-Std-883D) V 8000
LED Junction Temperature °C 150
CHARACTERISTICS - PER LED DIE (WHITE, EASYWHITE®)
The following table lists the product characteristics of each individual LED die within the XLamp MC-E White LED package.
Characteristics Unit Minimum Typical Maximum
Temperature Coefcient of Voltage mV/°C -4
DC Forward Current mA 700
Reverse Voltage V 5
Forward Voltage (@ 350mA) V 3.1 3.9
Forward Voltage (@ 700mA) V 3.4
CHARACTERISTICS - PER LED DIE (COLOR)
The following table lists the product characteristics for each LED die within the XLamp MC-E Color LED package.
Characteristics Unit Red Green Blue White
Temperature Coefcient of Voltage mV/°C Typical -2 -4 -4 -4
DC Forward Current mA Maximum 700 700 700 700
Reverse Voltage V Maximum 5 5 5 5
Forward Voltage (@ 350mA) VTypical 2.1 3.4 3.2 3.1
Maximum 2.5 3.9 3.9 3.9
Forward Voltage (@ 700mA) V Typical 2.3 3.7 3.5 3.5
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
3
XLamp® mC-E LED
FLUX CHARACTERISTICS - WHITE, COLOR (TJ = 25°C)
The following table provides several base order codes for XLamp MC-E LEDs. It is important to note that the base order codes listed here
are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-
code nomenclature, please consult the XLamp MC-E LED Binning and Labeling document.
Part Color
CCT / Dominant Wavelength Range Minimum Luminous Flux
@ 350mA* Order Code
Minimum Maximum Group Flux (lm)
White
Cool White 5000 K 10,000 K
K370 MCE4WT-A2-0000-000K01
M 430 MCE4WT-A2-0000-000M01
Neutral White 3700 K 5000 K
J320 MCE4WT-A2-0000-000JE4
K370 MCE4WT-A2-0000-000KE4
Warm White 2600 K 3700 K
G 240 MCE4WT-A2-0000-000GE7
H 280 MCE4WT-A2-0000-000HE7
J320 MCE4WT-A2-0000-000JE7
Color
Red 620 nm 630 nm
A5
30.6
MCE4CT-A2-0000-00A5AAAA1
Green 520 nm 535 nm 67.2
Blue 450 nm 465 nm 8.2
Cool White 5700 K 7000 K 100
Red 620 nm 630 nm
A4
30.6
MCE4CT-A2-0000-00A4AAAB1
Green 520 nm 535 nm 67.2
Blue 450 nm 465 nm 8.2
Neutral White 3700 K 4300 K 80
Notes:
• Cree maintains a tolerance of ±7% on ux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements, ±2 on CRI
measurements and ±1nm on dominant wavelength measurements. See the Measurements section (page 10).
• Typical CRI for cool white and neutral white (3700 K - 10,000 K CCT) is 75.
• Typical CRI for warm white (2600 K - 3700 K CCT) is 80.
* Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350mA. The ux and chromaticity
of XLamp MC-E White LED are measured with all LEDs lit simultaneously. The ux and color of each LED in XLamp and MC-E Color
LEDs are measured individually.
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
4
XLamp® mC-E LED
FLUX CHARACTERISTICS - EASYWHITE® MC-E LEDS (TJ = 25°C)
The following table provides order codes for XLamp MC-E EasyWhite LEDs. For a complete description of the order-code nomenclature,
please consult the XLamp MC-E LED Binning and Labeling document.
Color CCT
Range
Minimum Luminous Flux
@ 350mA, 25° C* 2-Step 4-Step
Group Flux (lm) Chromaticity
Region Order Code Chromaticity
Region Order Code
Standard CRI
EasyWhite
4000 K
K370
40H
MCEEZW-A1-0000-0000K040H
40F
MCEEZW-A1-0000-0000K040F
J320 MCEEZW-A1-0000-0000J040H MCEEZW-A1-0000-0000J040F
3500 K
J320
35H
MCEEZW-A1-0000-0000J035H
35F
MCEEZW-A1-0000-0000J035F
H 280 MCEEZW-A1-0000-0000H035H MCEEZW-A1-0000-0000H035F
3000 K
J320
30H
MCEEZW-A1-0000-0000J030H
30F
MCEEZW-A1-0000-0000J030F
H 280 MCEEZW-A1-0000-0000H030H MCEEZW-A1-0000-0000H030F
2700 K
J320
27H
MCEEZW-A1-0000-0000J027H
27F
MCEEZW-A1-0000-0000J027F
H 280 MCEEZW-A1-0000-0000H027H MCEEZW-A1-0000-0000H027F
80-CRI
Minimum
EasyWhite
4000 K
K370
40H
MCEEZW-H1-0000-0000K040H
40F
MCEEZW-H1-0000-0000K040F
J320 MCEEZW-H1-0000-0000J040H MCEEZW-H1-0000-0000J040F
3500 K
J320
35H
MCEEZW-H1-0000-0000J035H
35F
MCEEZW-H1-0000-0000J035F
H 280 MCEEZW-H1-0000-0000H035H MCEEZW-H1-0000-0000H035F
3000 K
J320
30H
MCEEZW-H1-0000-0000J030H
30F
MCEEZW-H1-0000-0000J030F
H 280 MCEEZW-H1-0000-0000H030H MCEEZW-H1-0000-0000H030F
2700 K
J320
27H
MCEEZW-H1-0000-0000J027H
27F
MCEEZW-H1-0000-0000J027F
H 280 MCEEZW-H1-0000-0000H027H MCEEZW-H1-0000-0000H027F
85-CRI
Minimum
EasyWhite
3000 K
H 280
30H
MCEEZW-P1-0000-0000H030H
30F
MCEEZW-P1-0000-0000H030F
G 240 MCEEZW-P1-0000-0000G030H MCEEZW-P1-0000-0000G030F
2700 K
H 280
27H
MCEEZW-P1-0000-0000H027H
27F
MCEEZW-P1-0000-0000H027F
G 240 MCEEZW-P1-0000-0000G027H MCEEZW-P1-0000-0000G027F
Notes:
• Cree maintains a tolerance of ±7% on ux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on
CRI measurements. See the Measurements section (page 10).
• For Standard CRI parts, the typical CRI is 80 for 4000 and 3500 K CCT parts and typical CRI is 82 for 3000 and 2700K CCT.
* Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350mA and with all LEDs lit
simultaneously.
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
5
XLamp® mC-E LED
RELATIVE SPECTRAL POWER DISTRIBUTION (IF = 350mA PER LED) - WHITE
The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on simultaneously.
RELATIVE SPECTRAL POWER DISTRIBUTION (IF = 350mA PER LED) - COLOR
The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously.
Relative Spectral Power Distribution (If = 350 mA per LED) - White
The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on simultaneously.
0
20
40
60
80
100
380 430 480 530 580 630 680 730 780
Relative Radiant Power (%)
Wavelength (nm)
5000 K - 10,000 K
CCT
3700 K - 5000 K
CCT
2600 K - 3700 K
CCT
Relative Spectral Power Distribution (If = 350 mA per LED) - Color
The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously.
0
20
40
60
80
100
380 430 480 530 580 630 680 730 780
Relative Radiant Power (%)
Wavelength (nm)
RGBW (6000 K)
RGBW (4000 K)
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
6
XLamp® mC-E LED
RELATIVE SPECTRAL POWER DISTRIBUTION (IF = 350mA PER LED) - COLOR (CONTINUED)
The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently.
RELATIVE FLUX OUTPUT VS JUNCTION TEMPERATURE (IF = 350mA)
The following graph represents typical performance of each LED die in the XLamp MC-E LED.
The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently.
0
20
40
60
80
100
380 430 480 530 580 630 680 730 780
Relative Radiant Power (%)
Wavelength (nm)
Red
Green
Blue
White (6000 K)
White (4000 K)
Relative Flux Output vs. Junction Temperature (If = 350 mA)
The following graph represents typical performance of each LED die in the XLamp MC-E LED
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
25 50 75 100 125 150
Relative Luminous Flux
Junction Temperature (ºC)
White
Red
Green
Blue
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
7
XLamp® mC-E LED
ELECTRICAL CHARACTERISTICS (TJ = 25˚C)
The following graph represents typical performance of each LED die in the XLamp MC-E LED.
RELATIVE INTENSITY VS. CURRENT (TJ = 25˚C)
The following graph represents typical performance of each LED die in the XLamp MC-E LED.
Electrical Characteristics (Tj = 25ºC)
The following graph represents typical performance of each LED die in the XLamp MC-E LED
0
100
200
300
400
500
600
700
1.5 2.0 2.5 3.0 3.5 4.0
Forward Current (mA)
Forward Voltage (V)
White, Blue
Red
Green
Relative Intensity vs. Current (Tj = 25ºC)
0
20
40
60
80
100
120
140
160
180
200
0100 200 300 400 500 600 700
Relative Luminous Flux (%)
Forward Current (mA)
White, Blue
Red
Green
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
8
XLamp® mC-E LED
TYPICAL SPATIAL RADIATION PATTERN
The following graph represents typical output of the XLamp MC-E LED with all four LEDs on simultaneously.
Typical Spatial Radiation Pattern
The following graph represents typical spectral output of the XLamp MC-E LED with all four LEDs on simultaneously.
0
20
40
60
80
100
-90 -60 -30 030 60 90
Relative Luminous Intensity (%)
Angle (º)
White
Color
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
9
XLamp® mC-E LED
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp MC-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering prole provided by the manufacturer of the solder paste used,
and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.
Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.
Profile Feature Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp) 1.2°C/second
Preheat: Temperature Min (Tsmin) 120 °C
Preheat: Temperature Max (Tsmax) 170 °C
Preheat: Time (tsmin to tsmax) 65-150 seconds
Time Maintained Above: Temperature (TL) 217 °C
Time Maintained Above: Time (tL) 45-90 seconds
Peak/Classication Temperature (Tp) 235 - 245 °C
Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 1 - 6 °C/second
Time 25°C to Peak Temperature 4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
TP
TL
Temperature
Time
t 25˚C to Peak
Preheat
ts
tS
tP
25
Ramp-down
Ramp-up
Critical Zone
TL to TP
Tsmax
Tsmin
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
10
XLamp® mC-E LED
NOTES
Measurements
The luminous ux, radiant power, chromaticity, forward voltage and CRI measurements in this document are binning specications only
and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number
of factors that are not within Cree’s control and are not intended or provided as operational specications for the products. Calculated
values are provided for informational purposes only and are not intended or provided as specications.
Pre‑Release Qualication Testing
Please read the LED Reliability Overview for details of the qualication process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualication testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specic LM-80 data sets available for this LED, refer to the public LM-80 results document.
Moisture Sensitivity
Cree recommends keeping XLamp MC-E LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp MC-E LEDs should be handled and stored as MSL 4 per JEDEC J-STD-033, meaning they have limited
exposure time before damage to the LED may occur during the
soldering operation. The table on the right species the maximum
exposure time in days depending on temperature and humidity
conditions. LEDs with exposure time longer than the specied
maximums must be baked according to the baking conditions
listed below.
Baking Conditions
It is not necessary to bake all XLamp MC-E LEDs. Only the LEDs that meet all of the following criteria must be baked:
• LEDs that have been removed from the original MBP.
• LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
• LEDs that have not been soldered.
LEDs should be baked at 70ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do
not bake parts at temperatures higher than 70ºC. This baking operation resets the exposure time as dened in the Moisture Sensitivity
section above.
Temperature Maximum Percent Relative Humidity
30% 40% 50% 60% 70% 80% 90%
30ºC 9543111
25ºC 12754211
20ºC 17976221
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
11
XLamp® mC-E LED
Storage Conditions
XLamp MC-E LEDs that have been removed from the original MBP but not soldered yet should be stored in a room or cabinet that will
maintain an atmosphere of 25 ± 5ºC and no greater than 10% RH. For LEDs stored in these conditions, storage time does not add to
exposure time as dened in the above Moisture Sensitivity section.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Ecology section of the Cree website.
REACh Compliance
REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has
published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to
insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available
upon request.
UL® Recognized Component
This product meets the requirements to be considered a UL Recognized Component with Level 1 enclosure consideration. The LED
package or a portion thereof has not been investigated as a re enclosure or a re and electrical enclosure per ANSI/UL 8750.
Vision Advisory
WARNING. Do not look at ab exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please
refer to the LED Eye Safety application note.
NOTES - CONTINUED
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
12
XLamp® mC-E LED
MECHANICAL DIMENSIONS
All measurements are ±.1mm unless otherwise indicated.
Bottom View
Side View
9.0 .0
+
.2
.80
TYP.
7.50
7.00
.75
.10
1.50
BSC
PITCH
1 2 3 4
5678
.05
±.05
.25
1.45
R
3.18
4.48
±.20
A
5.40
2.60
2.84 7.70 10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
1.30
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5 4
POSITIVE (+) 4
NEGATIVE (-) 3
6 3
POSITIVE (+) 3
NEGATIVE (-) 2
7 2
POSITIVE (+) 2
8 1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.101.
Solder mask windows must be .05 mm bigger
2.
than PCB Solder Pad.
+.13
-.03
D1
D2 D3
D4
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
23456
65432
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
9.0 .0
+
.2
.80
TYP.
7.50
7.00
.75
.10
1.50
BSC
PITCH
1 2 3 4
5678
.05
±.05
.25
1.45
R
3.18
4.48
±.20
A
5.40
2.60
2.84 7.70 10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
1.30
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5 4
POSITIVE (+) 4
NEGATIVE (-) 3
6 3
POSITIVE (+) 3
NEGATIVE (-) 2
7 2
POSITIVE (+) 2
8 1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.101.
Solder mask windows must be .05 mm bigger
2.
than PCB Solder Pad.
+.13
-.03
D1
D2 D3
D4
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
23456
65432
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
9.0 .0
+
.2
.80
TYP.
7.50
7.00
.75
.10
1.50
BSC
PITCH
1 2 3 4
5678
.05
±.05
.25
1.45
R
3.18
4.48
±.20
A
5.40
2.60
2.84 7.70 10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
1.30
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5 4
POSITIVE (+) 4
NEGATIVE (-) 3
6 3
POSITIVE (+) 3
NEGATIVE (-) 2
7 2
POSITIVE (+) 2
8 1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.101.
Solder mask windows must be .05 mm bigger
2.
than PCB Solder Pad.
+.13
-.03
D1
D2 D3
D4
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
23456
65432
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
Top View
9.0 .0
+
.2
.80
TYP.
7.50
7.00
.75
.10
1.50
BSC
PITCH
1 2 3 4
5678
.05
±.05
.25
1.45
R
3.18
4.48
±.20
A
5.40
2.60
2.84 7.70 10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
1.30
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5 4
POSITIVE (+) 4
NEGATIVE (-) 3
6 3
POSITIVE (+) 3
NEGATIVE (-) 2
7 2
POSITIVE (+) 2
8 1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.101.
Solder mask windows must be .05 mm bigger
2.
than PCB Solder Pad.
+.13
-.03
D1
D2 D3
D4
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
23456
65432
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
Color
D1: Red
D2: Green
D3: Blue
D4: White
Recommended PCB Solder Pad
9.0 .0
+
.2
.80
TYP.
7.50
7.00
.75
.10
1.50
BSC
PITCH
1 2 3 4
5678
.05
±.05
.25
1.45
R
3.18
4.48
±.20
A
5.40
2.60
2.84 7.70 10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
1.30
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5 4
POSITIVE (+) 4
NEGATIVE (-) 3
6 3
POSITIVE (+) 3
NEGATIVE (-) 2
7 2
POSITIVE (+) 2
8 1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.101.
Solder mask windows must be .05 mm bigger
2.
than PCB Solder Pad.
+.13
-.03
D1
D2 D3
D4
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
23456
65432
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
Recommended Stencil Pattern
(Shaded Area is Open)
1.24 7.7 10.02
1
1.5
2.75
1.16
3.85
4
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
13
XLamp® mC-E LED
(200 Lamps)
Loaded Pockets
(13 pockets min.)
Trailer
160mm (min) of
empty pockets
sealed with tape
(34 empty pockets min.)
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
START
END
Cathode Side
Anode Side
(denoted by chamfer)
200.0
A
A
B
5.5
±.1
SECTION A-A
SCALE 2 : 1
16.0 .0
+
.3
12.0
±.1
1.75
±.10
4.0
±.1
1.5
±.1
DETAIL B
SCALE 2 : 1
13
mm
7"
Cover Tape
Pocket Tape
User Feed Direction
User Feed Direction
TAPE AND REEL
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all measurements in mm.
Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,
Inc. UL® and the UR logo are registered trademarks of UL LLC.
14
XLamp® mC-E LED
PACKAGING
Patent Label
(on bottom of box)
Label with Cree Bin Code,
Quantity, Reel ID
Label with Cree Bin
Code, Quantity, Reel ID
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Unpackaged Reel
Packaged Reel
Boxed Reel
CREE Bin Code
& Barcode Label
Vacuum-Sealed
Moisture Barrier Bag
Label with Customer
P/N, Qty, Lot #, PO #
Label with Cree Bin
Code, Qty, Lot #
Label with Cree Bin
Code, Qty, Lot #
Vacuum-Sealed
Moisture Barrier Bag
Patent Label
Label with Customer Order
Code, Qty, Reel ID, PO #
Humidity Indicator Card
(inside bag)
Dessicant
(inside bag)
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Cree, Inc.:
MCE4WT-A2-0000-000GA9 MCE4WT-A2-0000-000GAA MCE4WT-A2-0000-000GE8 MCE4WT-A2-0000-000GF8
MCE4WT-A2-0000-000HA5 MCE4WT-A2-0000-000HA6 MCE4WT-A2-0000-000HA7 MCE4WT-A2-0000-000HA8
MCE4WT-A2-0000-000HA9 MCE4WT-A2-0000-000HAA MCE4WT-A2-0000-000HE6 MCE4WT-A2-0000-000HE8
MCE4WT-A2-0000-000HF6 MCE4WT-A2-0000-000HF7 MCE4WT-A2-0000-000HF8 MCE4WT-A2-0000-000JA1
MCE4WT-A2-0000-000JA2 MCE4WT-A2-0000-000JA3 MCE4WT-A2-0000-000JA4 MCE4WT-A2-0000-000JA5
MCE4WT-A2-0000-000JA6 MCE4WT-A2-0000-000JA7 MCE4WT-A2-0000-000JA8 MCE4WT-A2-0000-000JA9
MCE4WT-A2-0000-000JAA MCE4WT-A2-0000-000JE3 MCE4WT-A2-0000-000JE6 MCE4WT-A2-0000-000JE7
MCE4WT-A2-0000-000JE8 MCE4WT-A2-0000-000JF4 MCE4WT-A2-0000-000JF5 MCE4WT-A2-0000-000JF6
MCE4WT-A2-0000-000JF7 MCE4WT-A2-0000-000JF8 MCE4WT-A2-0000-000K01 MCE4WT-A2-0000-000K02
MCE4WT-A2-0000-000K03 MCE4WT-A2-0000-000K07 MCE4WT-A2-0000-000K08 MCE4WT-A2-0000-000K09
MCE4WT-A2-0000-000KA1 MCE4WT-A2-0000-000KA2 MCE4WT-A2-0000-000KA3 MCE4WT-A2-0000-000KA4
MCE4WT-A2-0000-000KA5 MCE4WT-A2-0000-000KA6 MCE4WT-A2-0000-000KE3 MCE4WT-A2-0000-000KE4
MCE4WT-A2-0000-000KE5 MCE4WT-A2-0000-000KE6 MCE4WT-A2-0000-000KF4 MCE4WT-A2-0000-000KF5
MCE4WT-A2-0000-000KF6 MCE4WT-A2-0000-000M02 MCE4WT-A2-0000-000M03 MCE4WT-A2-0000-000M07
MCE4WT-A2-0000-000M08 MCE4WT-A2-0000-000M09 MCEEZW-A1-0000-0000G027F MCEEZW-A1-0000-
0000G027H MCEEZW-A1-0000-0000H027F MCEEZW-A1-0000-0000H027H MCEEZW-A1-0000-0000H030F
MCEEZW-A1-0000-0000H030H MCEEZW-A1-0000-0000J027F MCEEZW-A1-0000-0000J027H MCEEZW-A1-0000-
0000J030F MCEEZW-A1-0000-0000J030H MCEEZW-A1-0000-0000J035F MCEEZW-A1-0000-0000J035H
MCEEZW-A1-0000-0000K035F MCEEZW-A1-0000-0000K035H MCE4WT-A2-0000-000JE4 MCE4CT-A2-0000-
00A4AAAB1 MCE4CT-A2-0000-00A5AAAA1 MCE4WT-A2-0000-000HE7 MCE4WT-A2-0000-000JE5 MCE4WT-A2-
0000-000M01 MCEEZW-A1-0000-0000H035F MCEEZW-A1-0000-0000H035H MCEEZW-A1-0000-0000J040F
MCEEZW-A1-0000-0000J040H MCEEZW-A1-0000-0000K040F MCEEZW-A1-0000-0000K040H MCEDWT-A1-0000-
0000A1001 MCEDWT-A1-0000-0000A1002 MCEEZW-H1-0000-0000H035F MCEEZW-H1-0000-0000H035H
MCEEZW-H1-0000-0000H040H MCEEZW-H1-0000-0000J027F MCEEZW-H1-0000-0000J030F MCEEZW-P1-0000-
0000G030F MCEEZW-P1-0000-0000G030H MCEEZW-P1-0000-0000H030F MCEEZW-H1-0000-0000H027F
MCEEZW-P1-0000-0000H030H MCEEZW-P1-0000-0000G027H MCEEZW-H1-0000-0000J040F MCEEZW-H1-0000-
0000H040F MCEEZW-P1-0000-0000H027H