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LP3871
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LP387x 0.8-A Fast Ultra-Low-Dropout Linear Regulators
1 Features 3 Description
The LP3871 and LP3874 series of fast ultra-low-
1• Input Voltage: 2.5 V to 7 V dropout linear regulators operate from a 2.5-V to 7-V
• Ultra-Low-Dropout Voltage input supply. Wide range of preset output voltage
• Low Ground Pin Current options are available. These ultra-low-dropout linear
regulators respond very quickly to step changes in
• Load Regulation of 0.04% load, which makes them suitable for low voltage
• 10-nA Quiescent Current in Shutdown Mode microprocessor applications. The devices are
• Specified Output Current of 0.8-A DC developed on a CMOS process which allows low
quiescent current operation independent of output
• Output Voltage Accuracy ±1.5% load current. This CMOS process also allows the
• ERROR Flag Indicates Output Status LP3871 and LP3874 to operate under extremely low
• SENSE Option Improves Load Regulation dropout conditions.
• Minimum Output Capacitor Requirements Dropout Voltage: Ultra-low-dropout voltage; typically
• Overtemperature/Overcurrent Protection 24 mV at 80-mA load current and 240 mV at 0.8-A
•−40°C to +125°C Junction Temperature Range load current.
Ground Pin Current: Typically 6 mA at 0.8-A load
2 Applications current.
• Microprocessor Power Supplies Shutdown Mode: Typically 10-nA quiescent current
• GTL, GTL+, BTL, and SSTL Bus Terminators when the SD pin is pulled low.
• Power Supplies for DSPs ERROR Flag: ERROR flag goes low when the output
• SCSI Terminator voltage drops 10% below nominal value.
• Post Regulators SENSE: SENSE pin improves regulation at remote
• High-Efficiency Linear Regulators loads.
• Battery Chargers Precision Output Voltage: Multiple output voltage
• Other Battery-Powered Applications options are available ranging from 1.8 V to 5 V with a
ensured accuracy of ±1.5% at room temperature, and
±3% over all conditions (varying line, load, and
temperature).
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SOT-223 (5) 6.50 mm x 3.56 mm
LP3871
LP3874 DDPAK/ TO-263 (5) 10.16 mm x 8.42 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Applications
*SD must be pulled high through a 10-kΩ
pullup resistor. See Application and
*SD and ERROR pins must be pulled high Implementation for more information.
through a 10-kΩpullup resistor. Connect
the ERROR pin to ground if this function is
not used. See Application and
Implementation for more information.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
7.4 Device Functional Modes.......................................... 9
1 Features.................................................................. 18 Application and Implementation ........................ 11
2 Applications ........................................................... 18.1 Application Information............................................ 11
3 Description............................................................. 18.2 Typical Applications ............................................... 11
4 Revision History..................................................... 29 Power Supply Recommendations...................... 16
5 Pin Configuration and Functions......................... 39.1 Power Dissipation .................................................. 16
6 Specifications......................................................... 410 Layout................................................................... 16
6.1 Absolute Maximum Ratings ...................................... 410.1 Layout Guidelines ................................................. 16
6.2 ESD Ratings.............................................................. 410.2 Layout Examples................................................... 16
6.3 Recommended Operating Conditions....................... 411 Device and Documentation Support................. 17
6.4 Thermal Information.................................................. 411.1 Related Links ........................................................ 17
6.5 Electrical Characteristics........................................... 511.2 Community Resources.......................................... 17
6.6 Typical Characteristics.............................................. 711.3 Trademarks........................................................... 17
7 Detailed Description.............................................. 811.4 Electrostatic Discharge Caution............................ 17
7.1 Overview................................................................... 811.5 Glossary................................................................ 17
7.2 Functional Block Diagrams ....................................... 812 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................... 8Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (April 2013) to Revision H Page
• Added Pin Configuration and Functions section, ESD Rating table, Feature Description ,Device Functional Modes,
Application and Implementation,Power Supply Recommendations,Layout,Device and Documentation Support ,
and Mechanical, Packaging, and Orderable Information sections; conform pin names in graphics to TI nomenclature....... 1
• Deleted Lead temperature row - information in POA ............................................................................................................ 4
• Deleted Heatsinking subsections regarding specific packages as specs have been updated (see Thermal
Information). ......................................................................................................................................................................... 16
• Changed layout examples to eliminate obsolete thermal-value references ........................................................................ 16
Changes from Revision F (April 2013) to Revision G Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 16
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1 2 34
5
IN OUT
GND
ERROR
/SENSE
SD
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5 Pin Configuration and Functions
KTT Package
5-Pin DDPAK/TO-263
Top View
NC Package
5-Pin SOT-223
Top View
Pin Functions
PIN
LP3871 LP3874 TYPE DESCRIPTION
NAME SOT-223 DDPAK/TO-263 SOT-223 DDPAK/TO-263
ERROR 4 5 — — O ERROR Flag
GND 5 3 5 3 GND Ground
IN 2 2 2 2 I Input voltage
OUT 3 4 3 4 O Output voltage
SD 1 1 1 1 I Shutdown
SENSE — — 4 5 I Remote voltage sense
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input supply voltage (survival) −0.3 7.5 V
Shutdown input voltage (survival) −0.3 7.5 V
Output voltage (survival)(3)(4) −0.3 6 V
IOUT (survival) Short-circuit protected
Maximum voltage for ERROR Pin VIN V
Maximum voltage for SENSE Pin VOUT V
Power dissipation(5) Internally Limited
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) If used in a dual-supply system where the regulator load is returned to a negative supply, the output must be diode-clamped to ground.
(4) The output PMOS structure contains a diode between the IN and OUT pins. This diode is normally reverse biased. This diode will get
forward biased if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can typically
withstand 200 mA of DC current and 1 A of peak current.
(5) Internal thermal shutdown circuitry protects the device from permanent damage.
6.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Input supply voltage(1) 2.5 7 V
Shutdown input voltage −0.3 7 V
Maximum operating current (DC) 0.8 A
Junction temperature −40 125 °C
(1) The minimum operating value for VIN is equal to either [VOUT(NOM) + VDROPOUT] or 2.5 V, whichever is greater.
6.4 Thermal Information LP3871, LP3874
THERMAL METRIC(1) NC (SOT-223) KTT (DDPAK/TO-263) UNIT
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 65.2 40.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.2 43.4 °C/W
RθJB Junction-to-board thermal resistance 9.9 23.1 °C/W
ψJT Junction-to-top characterization parameter 3.4 11.5 °C/W
ψJB Junction-to-board characterization parameter 9.7 22 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
Unless otherwise specified: TJ= 25°C, VIN = VO(NOM) + 1 V, IL= 10 mA, COUT = 10 µF, VSD = 2 V.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
Output voltage tolerance(3) VOUT + 1 V ≤VIN ≤7 V, 10 mA ≤IL≤0.8 A –1.5% 0% 1.5%
VOUT VOUT + 1 V ≤VIN ≤7 V, 10 mA ≤IL≤0.8 A, –3% 3%
–40°C ≤TJ≤125°C
Output voltage line regulation(3) VOUT + 1 V ≤VIN ≤7 V 0.02%
ΔVOL VOUT + 1 V ≤VIN ≤7 V, –40°C ≤TJ≤125°C 0.06%
Output voltage load regulation(3) 10 mA ≤IL≤0.8 A 0.04%
ΔVO/
ΔIOUT 10 mA ≤IL≤0.8 A, –40°C ≤TJ≤125°C 0.1%
IL= 80 mA 24 35
IL= 80 mA, –40°C ≤TJ≤125°C 40
VIN –Dropout voltage(4) mV
VOUT IL= 0.8 A 240 300
IL= 0.8 A, –40°C ≤TJ≤125°C 350
IL= 150 mA 5 9
IL= 150 mA, –40°C ≤TJ≤125°C 10
Ground pin current in normal
IGND mA
operation mode IL= 0.8 A 6 14
IL= 0.8 A, –40°C ≤TJ≤125°C 15
Ground pin current in shutdown VSD ≤0.3 V 0.01 10 µA
IGND mode –40°C ≤TJ≤85°C 50
IO(PK) Peak output current VOUT ≥VO(NOM) – 4% 1 A
SHORT CIRCUIT PROTECTION
ISC Short-circuit current 2.3 A
SHUTDOWN INPUT
Output = High VIN
Output = High, –40°C ≤TJ≤125°C 2
VSDT Shutdown threshold V
Output = Low 0
Output = Low, –40°C ≤TJ≤125°C 0.3
TdOFF Turnoff delay IL= 0.8 A 20 µs
TdON Turnon delay IL= 0.8 A 25 µs
ISD SD input current VSD = VIN 1 nA
ERROR FLAG
Threshold See(5) 10%
VTSee(5), –40°C ≤TJ≤125°C 5% 16%
Threshold hysteresis See(5) 5%
VTH See(5), –40°C ≤TJ≤125°C 2% 8%
Isink = 100 µA 0.02
VEF(Sat) ERROR flag saturation V
Isink = 100 µA, –40°C ≤TJ≤125°C 0.1
Td Flag reset delay 1 µs
Ilk ERROR flag pin leakage current 1 nA
Imax ERROR flag pin sink current VError = 0.5 V 1 mA
(1) Limits are specified by testing, design, or statistical correlation.
(2) Typical numbers are at 25°C and represent the most likely parametric norm.
(3) Output voltage line regulation is defined as the change in output voltage from the nominal value due to change in the input line voltage.
Output voltage load regulation is defined as the change in output voltage from the nominal value due to change in load current. The line
and load regulation specification contains only the typical number. However, the limits for line and load regulation are included in the
output voltage tolerance specification.
(4) Dropout voltage is defined as the minimum input to output differential voltage at which the output drops 2% below the nominal value.
Dropout voltage specification applies only to output voltages of 2.5 V and above. For output voltages below 2.5 V, the dropout voltage is
nothing but the input to output differential, because the minimum input voltage is 2.5 V.
(5) ERROR Flag threshold and hysteresis are specified as percentage of regulated output voltage. See ERROR Flag Operation.
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Electrical Characteristics (continued)
Unless otherwise specified: TJ= 25°C, VIN = VO(NOM) + 1 V, IL= 10 mA, COUT = 10 µF, VSD = 2 V.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
AC PARAMETERS
VIN = VOUT + 1 V, COUT = 10 µF 73
VOUT = 3.3 V, ƒ = 120 Hz
PSRR Ripple rejection dB
VIN = VOUT + 0.5 V, COUT = 10 µF 57
VOUT = 3.3 V, ƒ = 120 Hz
ρn(l/f) Output noise density ƒ = 120 Hz 0.8 µV
BW = 10 Hz – 100 kHz, VOUT = 2.5 V 150
enOutput noise voltage µVRMS
BW = 300 Hz – 300 kH, VOUT = 2.5 V 100
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-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (oC)
0
0.5
1
1.5
2
2.5
3
DC LOAD REGULATION (mV/A)
-40 -20 0 20 40 60 80 100 125
JUNCTION TEMPERATURE (oC)
0
0.5
1
1.5
2
2.5
3
' VOUT/VOLT CHANGE in VIN (mV)
SHUTDOWN IQ (PA)
TEMPERATURE (oC)
-40 -20 0 20 40 60 80 100 125
0.001
0.01
0.1
1
10
ERROR THRESHOLD (% of VOUT)
JUNCTION TEMPERATURE (oC)
-40 -20 0 20 40 60 80 100 125
0
2
4
6
8
10
12
14
00.5 1.0
LOAD CURRENT (A)
DROPOUT VOLTAGE (mV)
0
200
400
500
100
300
25oC
-40oC
125oC
1.8 2.3 2.8 3.3 3.8 4.3 5.0
OUTPUT VOLTAGE (V)
0
1
2
3
4
5
6
GROUND PIN CURRENT (mA)_
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6.6 Typical Characteristics
Unless otherwise specified: TJ= 25°C, COUT = 10 µF, CIN = 10 µF, SD pin is tied to VIN, VOUT = 2.5 V, VIN = VO(NOM) + 1 V,
IL= 10 mA.
IL= 800 mA
Figure 2. Ground Current vs Output Voltage
Figure 1. Dropout Voltage vs Output Load Current
Figure 4. ERROR Flag Threshold vs Junction Temperature
Figure 3. Shutdown IQvs Junction Temperature
Figure 5. DC Load Regulation vs Junction Temperature Figure 6. DC Line Regulation vs Temperature
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7 Detailed Description
7.1 Overview
The LP3871 and LP3874 linear regulators are designed to provide an ultra-low-dropout voltage with excellent
transient response and load/line regulation. For battery-powered always-on type applications, the very low
quiescent current of LP3871 and LP3874 in shutdown mode helps reduce battery drain. For applications where
load is not placed close to the regulator, LP3874 incorporates a voltage sense circuit to improve voltage
regulation at the point of load. The ERROR output pin of LP3871 can be used in the system to flag a low-voltage
condition.
7.2 Functional Block Diagrams
Figure 7. LP3871 Block Diagram
Figure 8. LP3874 Block Diagram
7.3 Feature Description
7.3.1 Shutdown (SD)
The LM3871 and LP3874 devices have a shutdown feature that turns the device off and reduces the quiescent
current to 10 nA, typical.
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Feature Description (continued)
7.3.2 Short-Circuit Protection
The LP3871and LP3874 devices are short-circuit protected and, in the event of a peak overcurrent condition, the
short-circuit control loop will rapidly drive the output PMOS pass element off. Once the power pass element shuts
down, the control loop will rapidly cycle the output on and off until the average power dissipation causes the
thermal shutdown circuit to respond to servo the on/off cycling to a lower frequency.
7.3.3 Low Dropout Voltage
The LP3871 and LP3874 devices feature an ultra-low-dropout voltage, typically 24 mV at 80-mA load current and
240 mV at 0.8-A load current.
The dropout voltage of a regulator is defined as the minimum input-to-output differential required to stay within
2% of the nominal output voltage. For CMOS LDOs, the dropout voltage is the product of the load current and
the Rds(on) of the internal MOSFET.
7.3.4 SENSE Pin
In applications where the regulator output is not very close to the load, LP3874 can provide better remote load
regulation using the SENSE pin. Figure 9 depicts the advantage of the SENSE option. LP3871 regulates the
voltage at the OUT pin. Hence, the voltage at the remote load will be the regulator output voltage minus the drop
across the trace resistance. For example, in the case of a 3.3-V output, if the trace resistance is 100 mΩ, the
voltage at the remote load will be 3.22 V with 0.8 A of load current, ILOAD. The LP3874 regulates the voltage at
the SENSE pin. Connecting the SENSE pin to the remote load will provide regulation at the remote load, as
shown in Figure 9. If the SENSE option pin is not required, the SENSE pin must be connected to the OUT pin.
Figure 9. Improving Remote Load Regulation using LP3874
7.4 Device Functional Modes
7.4.1 Shutdown Mode
A CMOS logic low level signal at the shutdown (SD) pin will turn off the regulator. The SD pin must be actively
terminated through a 10-kΩpullup resistor for a proper operation. If this pin is driven from a source that actively
pulls high and low (such as a CMOS rail-to-rail comparator), the pullup resistor is not required. This pin must be
tied to VIN if not used.
7.4.2 Active Mode
When voltage at SD pin of the LP3871 and LP3874 devices is at logic high level, the device is in normal mode of
operation.
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Device Functional Modes (continued)
7.4.3 ERROR Flag Operation
The LP3871 produces logic low signals at the ERROR Flag pin when the output drops out of regulation due to
low input voltage, current limiting, or thermal limiting. This flag has a built-in hysteresis. The timing diagram in
Figure 10 shows the relationship between the ERROR flag and the output voltage. In this example, the input
voltage is changed to demonstrate the functionality of the ERROR Flag.
The internal ERROR flag comparator has an open drain output stage. Hence, the ERROR pin must be pulled
high through a pullup resistor. Although the ERROR flag pin can sink current of 1mA, this current is energy drain
from the input supply. Hence, the value of the pullup resistor must be in the range of 10 kΩto 1 MΩ.The
ERROR pin must be connected to ground if this function is not used. It must also be noted that when the
shutdown pin is pulled low, the ERROR pin is forced to be invalid for reasons of saving power in shutdown
mode.
Figure 10. ERROR Flag Operation
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers must
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LP3871 and LP3874 devices are linear regulators designed to provide high load current of up to 0.8 A, low
dropout voltage, and low quiescent current in shutdown mode.
8.1.1 Reverse Current Path
The internal MOSFET in LP3871 and LP3874 has an inherent parasitic diode. During normal operation, the input
voltage is higher than the output voltage and the parasitic diode is reverse biased. However, if the output is
pulled above the input in an application, then current flows from the output to the input as the parasitic diode gets
forward biased. The output can be pulled above the input as long as the current in the parasitic diode is limited to
200-mA continuous and 1-A peak.
8.1.2 Turnon Characteristics for Output Voltages Programmed To 2 V or Below
As VIN increases during start-up, the regulator output will track the input until VIN reaches the minimum operating
voltage (typically about 2.5 V). For output voltages programmed to 2 V or below, the regulator output may
momentarily exceed its programmed output voltage during start-up. Outputs programmed to voltages above 2 V
are not affected by this behavior.
8.2 Typical Applications
*SD and ERROR pins must be pulled high through a 10-kΩpullup resistor. Connect the ERROR pin to ground if this
function is not used.
Figure 11. LP3871 Typical Application
*SD must be pulled high through a 10-kΩpullup resistor.
Figure 12. LP3874 Typical Application
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0 0.2 0.4 0.6 0.8
LOAD CURRENT (A)
1
STABLE REGION
COUT > 10PF
COUT ESR (:)
.001
.01
0.1
1.0
10
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Typical Applications (continued)
8.2.1 Design Requirements
For LP3871 and LP3874 typical applications, use the parameters listed in Table 1.
Table 1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Input voltage 2.5 V to 7 V
Output voltage 2.5 V
Output current 0.8 A
Output capacitor 10 µF
Input capacitor 10 µF
Output capacitor ESR range 100 mΩto 4 Ω
8.2.2 Detailed Design Procedure
8.2.2.1 External Capacitors
Like any low-dropout regulator, external capacitors are required to assure stability. These capacitors must be
correctly selected for proper performance.
• Input Capacitor: An input capacitor of at least 10 μF is required. Ceramic, tantalum, or Electrolytic capacitors
may be used, and capacitance may be increased without limit.
• Output Capacitor: An output capacitor is required for loop stability. It must be located less than 1 cm from the
device and connected directly to the output and ground pins using traces which have no other currents
flowing through them (see Layout Guidelines).
The minimum value of output capacitance that can be used for stable full-load operation is 10 µF, but it may be
increased without limit. The output capacitor must have an equivalent series resistance (ESR) value as shown in
the stable region of the curve (Figure 13). Tantalum capacitors are recommended for the output capacitor.
Figure 13. ESR Curve
8.2.2.2 Selecting a Capacitor
It is important to note that capacitance tolerance and variation with temperature must be taken into consideration
when selecting a capacitor so that the minimum required amount of capacitance is provided over the full
operating temperature range. In general, a good Tantalum capacitor will show very little capacitance variation
with temperature, but a ceramic may not be as good (depending on dielectric type). Aluminum electrolytics also
typically have large temperature variation of capacitance value.
Equally important to consider is a capacitor's ESR change with temperature: this is not an issue with ceramics,
as their ESR is extremely low. However, it is very important in Tantalum and aluminum electrolytic capacitors.
Both show increasing ESR at colder temperatures, but the increase in aluminum electrolytic capacitors is so
severe they may not be feasible for some applications (see Capacitor Characteristics).
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8.2.2.3 Capacitor Characteristics
8.2.2.3.1 Ceramic
For values of capacitance in the 10-µF to 100-µF range, ceramics are usually larger and more costly than
tantalum capacitors but give superior AC performance for bypassing high frequency noise because of very low
ESR (typically less than 10 mΩ). However, some dielectric types do not have good capacitance characteristics
as a function of voltage and temperature.
Z5U and Y5V dielectric ceramics have capacitance that drops severely with applied voltage. A typical Z5U or
Y5V capacitor can lose 60% of its rated capacitance with half of the rated voltage applied to it. The Z5U and Y5V
also exhibit a severe temperature effect, losing more than 50% of nominal capacitance at high and low limits of
the temperature range.
X7R and X5R dielectric ceramic capacitors are strongly recommended if ceramics are used, as they typically
maintain a capacitance range within ±20% of nominal over full operating ratings of temperature and voltage. Of
course, they are typically larger and more costly than Z5U/Y5U types for a given voltage and capacitance.
8.2.2.3.2 Tantalum
Solid tantalum capacitors are recommended for use on the output because their typical ESR is very close to the
ideal value required for loop compensation. They also work well as input capacitors if selected to meet the ESR
requirements previously listed.
Tantalums also have good temperature stability: a good quality tantalum will typically show a capacitance value
that varies less than 10-15% across the full temperature range of 125°C to −40°C. ESR will vary only about 2X
going from the high to low temperature limits.
The increasing ESR at lower temperatures can cause oscillations when marginal quality capacitors are used (if
the ESR of the capacitor is near the upper limit of the stability range at room temperature).
8.2.2.3.3 Aluminum
This capacitor type offers the most capacitance for the money. The disadvantages are that they are larger in
physical size, not widely available in surface mount, and have poor AC performance (especially at higher
frequencies) due to higher ESR and ESL.
Compared by size, the ESR of an aluminum electrolytic is higher than either tantalum or ceramic, and it also
varies greatly with temperature. A typical aluminum electrolytic can exhibit an ESR increase of as much as 50×
when going from 25°C down to −40°C.
It must also be noted that many aluminum electrolytics only specify impedance at a frequency of 120 Hz, which
indicates they have poor high frequency performance. Only aluminum electrolytics that have an impedance
specified at a higher frequency (between 20 kHz and 100 kHz) must be used for the LP387X. Derating must be
applied to the manufacturer's ESR specification, since it is typically only valid at room temperature.
Any applications using aluminum electrolytics must be thoroughly tested at the lowest ambient operating
temperature where ESR is maximum.
8.2.2.4 RFI/EMI Susceptibility
Radio frequency interference (RFI) and electromagnetic interference (EMI) can degrade the performance of any
integrated circuit because of the small dimensions of the geometries inside the device. In applications where
circuit sources are present which generate signals with significant high frequency energy content (> 1 MHz), care
must be taken to ensure that this does not affect the device regulator.
If RFI/EMI noise is present on the input side of the regulator (such as applications where the input source comes
from the output of a switching regulator), good ceramic bypass capacitors must be used at the input pin of the
device.
If a load is connected to the device output which switches at high speed (such as a clock), the high-frequency
current pulses required by the load must be supplied by the capacitors on the device output. Since the bandwidth
of the regulator loop is less than 100 kHz, the control circuitry cannot respond to load changes above that
frequency. This means the effective output impedance of the device at frequencies above 100 kHz is determined
only by the output capacitor(s).
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In applications where the load is switching at high speed, the output of the device may need RF isolation from
the load. It is recommended that some inductance be placed between the output capacitor and the load, and
good RF bypass capacitors be placed directly across the load.
PCB layout is also critical in high noise environments, since RFI/EMI is easily radiated directly into PC traces.
Noisy circuitry must be isolated from "clean" circuits where possible, and grounded through a separate path. At
MHz frequencies, ground planes begin to look inductive and RFI/EMI can cause ground bounce across the
ground plane.
In multi-layer PCB applications, care must be taken in layout so that noisy power and ground planes do not
radiate directly into adjacent layers which carry analog power and ground.
8.2.2.5 Output Noise
Noise is specified in two ways:
• Spot Noise (or Output Noise Density): the RMS sum of all noise sources, measured at the regulator output, at
a specific frequency (measured with a 1-Hz bandwidth). This type of noise is usually plotted on a curve as a
function of frequency.
• Total Output Noise (or Broad-Band Noise): the RMS sum of spot noise over a specified bandwidth, usually
several decades of frequencies.
Attention must be paid to the units of measurement. Spot noise is measured in units µV/√Hz or nV/√Hz and total
output noise is measured in µVRMS.
The primary source of noise in low-dropout regulators is the internal reference. In CMOS regulators, noise has a
low frequency component and a high frequency component, which depend strongly on the silicon area and
quiescent current. Noise can be reduced in two ways: by increasing the transistor area or by increasing the
current drawn by the internal reference. Increasing the area will decrease the chance of fitting the die into a
smaller package. Increasing the current drawn by the internal reference increases the total supply current
(ground pin current). Using an optimized trade-off of ground pin current and die size, the LP3871 and LP3874
achieve low noise performance and low quiescent-current operation.
The total output noise specification for LP3871 and LP3874 devices is presented in Electrical Characteristics.
The output noise density at different frequencies is represented by a curve under Typical Characteristics.
14 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated
Product Folder Links: LP3871 LP3874
VOUT
100mV/DIV
ILOAD
1A/DIV
TIME (50Ps/DIV)
MAGNITUDE
VOUT
100mV/DIV
ILOAD
1A/DIV
TIME (50Ps/DIV)
MAGNITUDE
VOUT
100mV/DIV
ILOAD
1A/DIV
TIME (50Ps/DIV)
MAGNITUDE
VOUT
100mV/DIV
ILOAD
1A/DIV
TIME (50Ps/DIV)
MAGNITUDE
VOUT
100mV/DIV
ILOAD
1A/DIV
TIME (50Ps/DIV)
MAGNITUDE
LP3871
,
LP3874
www.ti.com
SNVS225H –FEBRUARY 2003–REVISED JUNE 2015
8.2.3 Application Curves
Unless otherwise specified: TJ= 25°C, COUT = 10 µF, CIN = 10 µF, SD pin is tied to VIN, VOUT = 2.5 V, VIN = VO(NOM) + 1 V,
IL= 10 mA.
CIN = COUT = 10 µF, Oscon CIN = COUT = 100 µF, Oscon
Figure 14. Load Transient Response Figure 15. Load Transient Response
CIN = COUT = 10 µF, Poscap CIN = COUT = 10 µF, Tantalum
Figure 16. Load Transient Response Figure 17. Load Transient Response
CIN = COUT = 100 µF, Tantalum
Figure 18. Load Transient Response
Copyright © 2003–2015, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LP3871 LP3874
IN
GND
OUT
VIN
VOUT
COUT
CIN
SD
ERROR/SENSE
CIN
VOUT
VIN IN
OUT
ERROR/SENSE
GND
COUT
SD
4à,# =6
4I=T F6
#I=T /2
&
6
4I=T =6
,I=T F6
#I=T
2
&=:8
+0 F8
176 ;+176 +:8
+0 ;+)0&
LP3871
,
LP3874
SNVS225H –FEBRUARY 2003–REVISED JUNE 2015
www.ti.com
9 Power Supply Recommendations
9.1 Power Dissipation
LP3871 and LP3874 can deliver a continuous current of 0.8 A over the full operating temperature range. A
heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. Under all possible conditions, the junction temperature must be within the range specified under
operating conditions. The total power dissipation of the device is given by:
where
• IGND is the operating ground current of the device (specified under Electrical Characteristics). (1)
The maximum allowable temperature rise (TRmax) depends on the maximum ambient temperature (TAmax) of the
application, and the maximum allowable junction temperature (TJmax): (2)
The maximum allowable value for junction to ambient thermal resistance, RθJA, can be calculated using the
formula: (3)
10 Layout
10.1 Layout Guidelines
Good PC layout practices must be used or instability can be induced because of ground loops and voltage drops.
The input and output capacitors must be directly connected to the input, output, and ground pins of the regulator
using traces which do not have other currents flowing in them (Kelvin connect).
The best way to do this is to lay out CIN and COUT near the device with short traces to the IN, OUT, and ground
pins. The regulator ground pin must be connected to the external circuit ground so that the regulator and its
capacitors have a "single point ground".
It must be noted that stability problems have been seen in applications where "vias" to an internal ground plane
were used at the ground points of the device and the input and output capacitors. This was caused by varying
ground potentials at these nodes resulting from current flowing through the ground plane. Using a single point
ground technique for the regulator and its capacitors fixed the problem.
Since high current flows through the traces going into IN and coming from OUT, Kelvin connect the capacitor
leads to these pins so there is no voltage drop in series with the input and output capacitors.
10.2 Layout Examples
Figure 19. Layout Example for SOT-223 Package Figure 20. Layout Example for TO-263 Package
16 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated
Product Folder Links: LP3871 LP3874
LP3871
,
LP3874
www.ti.com
SNVS225H –FEBRUARY 2003–REVISED JUNE 2015
11 Device and Documentation Support
11.1 Related Links
Table 2 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to sample or buy.
Table 2. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
LP3871 Click here Click here Click here Click here Click here
LP3874 Click here Click here Click here Click here Click here
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2003–2015, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LP3871 LP3874
PACKAGE OPTION ADDENDUM
www.ti.com 8-Oct-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP3871EMP-1.8/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LH6B
LP3871EMP-2.5/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LH7B
LP3871EMP-3.3/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LH8B
LP3871EMP-5.0/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LH9B
LP3871EMPX-3.3/NOPB ACTIVE SOT-223 NDC 5 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LH8B
LP3871ES-1.8/NOPB ACTIVE DDPAK/
TO-263 KTT 5 45 Pb-Free (RoHS
Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP3871ES
-1.8
LP3871ES-2.5/NOPB ACTIVE DDPAK/
TO-263 KTT 5 45 Pb-Free (RoHS
Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP3871ES
-2.5
LP3871ES-3.3/NOPB ACTIVE DDPAK/
TO-263 KTT 5 45 Pb-Free (RoHS
Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP3871ES
-3.3
LP3871ESX-1.8/NOPB ACTIVE DDPAK/
TO-263 KTT 5 500 Pb-Free (RoHS
Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP3871ES
-1.8
LP3871ESX-2.5/NOPB ACTIVE DDPAK/
TO-263 KTT 5 500 Pb-Free (RoHS
Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP3871ES
-2.5
LP3871ESX-3.3/NOPB ACTIVE DDPAK/
TO-263 KTT 5 500 Pb-Free (RoHS
Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP3871ES
-3.3
LP3874EMP-1.8/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LHEB
LP3874EMP-2.5/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LHFB
LP3874EMP-3.3 NRND SOT-223 NDC 5 1000 TBD Call TI Call TI -40 to 125 LHHB
LP3874EMP-3.3/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LHHB
LP3874EMP-5.0/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LHJB
LP3874EMPX-1.8/NOPB ACTIVE SOT-223 NDC 5 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LHEB
PACKAGE OPTION ADDENDUM
www.ti.com 8-Oct-2015
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP3874EMPX-2.5/NOPB ACTIVE SOT-223 NDC 5 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LHFB
LP3874EMPX-3.3/NOPB ACTIVE SOT-223 NDC 5 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LHHB
LP3874EMPX-5.0/NOPB ACTIVE SOT-223 NDC 5 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LHJB
LP3874ES-2.5 NRND DDPAK/
TO-263 KTT 5 45 TBD Call TI Call TI -40 to 125 LP3874ES
-2.5
LP3874ES-2.5/NOPB ACTIVE DDPAK/
TO-263 KTT 5 45 Pb-Free (RoHS
Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP3874ES
-2.5
LP3874ES-3.3 NRND DDPAK/
TO-263 KTT 5 45 TBD Call TI Call TI -40 to 125 LP3874ES
-3.3
LP3874ES-3.3/NOPB ACTIVE DDPAK/
TO-263 KTT 5 45 Pb-Free (RoHS
Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP3874ES
-3.3
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 8-Oct-2015
Addendum-Page 3
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP3871EMP-1.8/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3871EMP-2.5/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3871EMP-3.3/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3871EMP-5.0/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3871EMPX-3.3/NOPB SOT-223 NDC 5 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3871ESX-1.8/NOPB DDPAK/
TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
LP3871ESX-2.5/NOPB DDPAK/
TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
LP3871ESX-3.3/NOPB DDPAK/
TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
LP3874EMP-1.8/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3874EMP-2.5/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3874EMP-3.3 SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3874EMP-3.3/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3874EMP-5.0/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3874EMPX-1.8/NOPB SOT-223 NDC 5 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3874EMPX-2.5/NOPB SOT-223 NDC 5 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP3874EMPX-3.3/NOPB SOT-223 NDC 5 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP3874EMPX-5.0/NOPB SOT-223 NDC 5 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP3871EMP-1.8/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP3871EMP-2.5/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP3871EMP-3.3/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP3871EMP-5.0/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP3871EMPX-3.3/NOPB SOT-223 NDC 5 2000 367.0 367.0 35.0
LP3871ESX-1.8/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0
LP3871ESX-2.5/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0
LP3871ESX-3.3/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0
LP3874EMP-1.8/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP3874EMP-2.5/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP3874EMP-3.3 SOT-223 NDC 5 1000 367.0 367.0 35.0
LP3874EMP-3.3/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP3874EMP-5.0/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP3874EMPX-1.8/NOPB SOT-223 NDC 5 2000 367.0 367.0 35.0
LP3874EMPX-2.5/NOPB SOT-223 NDC 5 2000 367.0 367.0 35.0
LP3874EMPX-3.3/NOPB SOT-223 NDC 5 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP3874EMPX-5.0/NOPB SOT-223 NDC 5 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 3
MECHANICAL DATA
NDC0005A
www.ti.com
MECHANICAL DATA
KTT0005B
www.ti.com
BOTTOM SIDE OF PACKAGE
TS5B (Rev D)
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Click to View Pricing, Inventory, Delivery & Lifecycle Information:
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LP3871EMP-1.8 LP3871EMP-1.8/NOPB LP3871EMP-2.5 LP3871EMP-2.5/NOPB LP3871EMP-3.3 LP3871EMP-
3.3/NOPB LP3871EMP-5.0/NOPB LP3871EMPX-2.5 LP3871EMPX-2.5/NOPB LP3871EMPX-3.3 LP3871EMPX-
3.3/NOPB LP3871ES-1.8 LP3871ES-1.8/NOPB LP3871ES-2.5 LP3871ES-2.5/NOPB LP3871ES-3.3 LP3871ES-
3.3/NOPB LP3871ESX-1.8 LP3871ESX-1.8/NOPB LP3871ESX-2.5 LP3871ESX-2.5/NOPB LP3871ESX-3.3
LP3871ESX-3.3/NOPB
