PSD813F2A-70MIT - STMicroelectronics, Inc.

May 2009 Doc ID 7833 Rev 7 1/128

PSD8XXFX

Flash in-system programmable (ISP)

peripherals for 8-bit MCUs, 5 V

Features

■Flash in-system programmable (ISP)

peripheral for 8-bit MCUs

■Dual bank Flash memories

– Up to 2 Mbit of primary Flash memory (8

uniform sectors, 32K x8)

– Up to 256 Kbit secondary Flash memory (4

uniform sectors)

– Concurrent operation: read from one

memory while erasing and writing the other

■Up to 256 Kbit SRAM

■27 reconfigurable I/Oports

■Enhanced JTAG serial port

■PLD with macrocells

– Over 3000 gates of PLD: CPLD and DPLD

– CPLD with 16 output macrocells (OMCs)

and 24 input macrocells (IMCs)

– DPLD - user defined internal chip select

decoding

■27 individually configurable I/O port pins

They can be used for the following functions:

– MCU I/Os

– PLD I/Os

– Latched MCU address output

– Special function I/Os.

– 16 of the I/O ports may be configured as

open-drain outputs.

■In-system programming (ISP) with JTAG

– Built-in JTAG compliant serial port allows

full-chip in-system programmability

– Efficient manufacturing allow easy product

testing and programming

– Use low cost FlashLINK cable with PC

■Page register

– Internal page register that can be used to

expand the microcontroller address space

by a factor of 256

■Programmable power management

■Packages are ECOPACK®

Table 1. Device summary

Reference Part number

PSD8XXFX

PSD813F2

PSD813F4

PSD813F5

PSD833F2

PSD834F2

PSD853F2

PSD854F2

PQFP52 (M)

PLCC52 (J)

TQFP64 (U)

www.st.com

         
Contents PSD8XXFX
2/128  Doc ID 7833 Rev 7
Contents
Summary description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Pin description   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PSD architectural overview   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1 Memory   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  20
2 Page register   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  20
3 PLDs   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  20
4 I/O ports  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  21
5 MCU bus interface  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  21
6 JTAG port  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  21
7 In-system programming (ISP)   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  21
8 Power management unit (PMU)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  21
Development system   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
PSD register description and address offset  . . . . . . . . . . . . . . . . . . . . 24
Detailed operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1 Memory blocks  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  26
2 Description of primary Flash memory and secondary Flash memory  . . .  27
3 Memory block select signals   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  27
3.1 Ready/Busy (PC3)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.2 Memory operation  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Instructions  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
1 Power-up mode   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  30
2 READ  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  30
3 Read memory contents   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  31
4 Read Primary Flash Identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  31
5 Read Memory Sector Protection status  . . . . . . . . . . . . . . . . . . . . . . . . . .  31
6 Reading the Erase/Program Status bits  . . . . . . . . . . . . . . . . . . . . . . . . . .  31
7 Data Polling flag (DQ7)   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  32

PSD8XXFX Contents
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8 Toggle flag (DQ6)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  32
9 Error flag (DQ5)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  33
10 Erase timeout flag (DQ3)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  33
Programming Flash memory  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
1 Data Polling   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  34
2 Data Toggle   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  35
3 Unlock Bypass (PSD833F2x, PSD834F2x, PSD853F2x, PSD854F2x) . .  36
Erasing Flash memory  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
1 Flash Bulk Erase   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  38
2 Flash Sector Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  38
3 Suspend Sector Erase  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  38
4 Resume Sector Erase   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  39
Specific features  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
1 Flash Memory Sector Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  40
2 Reset Flash   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  40
3 Reset (RESET) signal (on the PSD83xF2 and PSD85xF2) . . . . . . . . . . .  41
SRAM  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Sector Select and SRAM Select  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
1 Example  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  43
2 Memory select configuration for MCUs with separate program and data 
spaces 43
3 Configuration modes for MCUs with separate program and data spaces    44
3.1 Separate Space modes  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
3.2 Combined Space modes  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Page register  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
PLDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
1 The Turbo Bit in PSD  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  47
2 Decode PLD (DPLD)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  50
3 Complex PLD (CPLD)   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  51

         
Contents PSD8XXFX
4/128  Doc ID 7833 Rev 7
4 Output macrocell (OMC)   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  53
5 Product Term Allocator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  54
6 Loading and reading the Output macrocells (OMC) . . . . . . . . . . . . . . . . .  54
7 The OMC Mask register  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  54
8 The Output Enable of the OMC  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  54
9 Input macrocells (IMC)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  56
MCU bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
1 PSD interface to a multiplexed 8-bit bus . . . . . . . . . . . . . . . . . . . . . . . . . .  60
2 PSD interface to a non-multiplexed 8-bit bus  . . . . . . . . . . . . . . . . . . . . . .  60
3 Data Byte Enable reference  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  60
4 MCU bus interface examples  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  61
5 80C31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  62
6 80C251 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  63
7 80C51XA  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  65
8 68HC11   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  66
I/O ports  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
1 General port architecture  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  67
2 Port operating modes  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  68
3 MCU I/O mode  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  69
4 PLD I/O mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  69
5 Address Out mode  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  69
6 Address In mode   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  71
7 Data port mode   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  71
8 Peripheral I/O mode  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  71
9 JTAG in-system programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  71
10 Port configuration registers (PCR)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  72
11 Control register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  72
12 Direction register   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  72
13 Drive Select register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  72
14 Port Data registers  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  74
15 Data In  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  74
16 Data Out register  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  74

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17 OMC Mask register   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  74
18 Input macro (IMC)   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  74
19 Enable Out  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  75
20 Ports A and B – functionality and structure   . . . . . . . . . . . . . . . . . . . . . . .  75
21 Port C – functionality and structure   . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  76
22 Port D – functionality and structure   . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  76
23 External Chip Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  77
Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
1 Automatic Power-down (APD) Unit and Power-down mode . . . . . . . . . . .  80
2 For users of the HC11 (or compatible)  . . . . . . . . . . . . . . . . . . . . . . . . . . .  81
3 Other power saving options  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  81
4 PLD power management  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  82
5 PSD Chip Select input (CSI, PD2)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  84
6 Input clock   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  84
7 Input control signals  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  84
Reset timing and device status at reset  . . . . . . . . . . . . . . . . . . . . . . . . 85
1 Power-up reset  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  85
2 Warm reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  85
3 I/O pin, register and PLD status at Reset . . . . . . . . . . . . . . . . . . . . . . . . .  85
4 Reset of Flash memory erase and program cycles (on the PSD834Fx)  .  85
Programming in-circuit using the JTAG serial interface  . . . . . . . . . . . 87
1 Standard JTAG signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  87
2 JTAG extensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  88
3 Security and Flash memory protection . . . . . . . . . . . . . . . . . . . . . . . . . . .  88
Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
AC/DC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Package mechanical  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Contents PSD8XXFX

6/128 Doc ID 7833 Rev 7

24 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Appendix A PQFP52 pin assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Appendix B PLCC52 pin assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

Appendix C TQFP64 pin assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

PSD8XXFX List of tables
Doc ID 7833 Rev 7 7/128
         
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Product range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3. PLCC52 pin description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 4. PLD I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 5. JTAG SIgnals on port C  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 6. Methods for programming different functional blocks of the PSD. . . . . . . . . . . . . . . . . . . . 22
Table 7. I/O port latched address output assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 8. Register address offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 9. Memory block size and organization  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 10. Instructions  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 11. Status bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 12. Sector Protection/Security Bit definition – Flash Protection register. . . . . . . . . . . . . . . . . . 41
Table 13. Sector Protection/Security Bit definition – PSD/EE Protection register  . . . . . . . . . . . . . . . 41
Table 14. VM register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 15. DPLD and CPLD inputs  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 16. Output macrocell port and data bit assignments  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 17. MCUs and their control signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Table 18. 8-bit data bus  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 19. 80C251 configurations  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 20. Port operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 21. Port operating mode settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 22. I/O port Latched address output assignments  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 23. Port configuration registers (PCR)t . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 24. Port Pin Direction Control, Output Enable P.T. not defined . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 25. Port Pin Direction Control, Output Enable P.T. defined  . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 26. Port Direction assignment example  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 27. Drive register pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 28. Port Data registers  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Table 29. Power-down mode’s effect on ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 30. PSD timing and standby current during Power-down mode . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 31. Power Management mode registers PMMR0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 32. Power Management mode registers PMMR2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 33. APD counter operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Table 34. Status during Power-on reset, Warm reset and Power-down mode. . . . . . . . . . . . . . . . . . 86
Table 35. JTAG port signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 36. JTAG Enable register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table 37. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 38. Example of PSD typical power calculation at VCC=5.0 V (Turbo mode on) . . . . . . . . . . . . 93
Table 39. Example of PSD typical power calculation at VCC = 5.0 V (Turbo mode off) . . . . . . . . . . . 94
Table 40. Operating conditions (5 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table 41. Operating conditions (3 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table 42. AC signal letters for PLD timing  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Table 43. AC signal behavior symbols for PLD timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Table 44. AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Table 45. Capacitance  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Table 46. DC characteristics (5 V devices). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Table 47. DC Characteristics (3 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Table 48. CPLD combinatorial timing (5 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

         
List of tables PSD8XXFX
8/128  Doc ID 7833 Rev 7
Table 49. CPLD combinatorial timing (3 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Table 50. CPLD macrocell Synchronous clock mode timing (5 V devices)  . . . . . . . . . . . . . . . . . . . 101
Table 51. CPLD macrocell synchronous clock mode timing (3 V devices). . . . . . . . . . . . . . . . . . . . 102
Table 52. CPLD macrocell asynchronous clock mode timing (5 V devices). . . . . . . . . . . . . . . . . . . 103
Table 53. CPLD macrocell Asynchronous clock mode timing (3 V devices)  . . . . . . . . . . . . . . . . . . 104
Table 54. Input macrocell timing (5 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Table 55. input macrocell timing (3 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Table 56. READ timing (5 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Table 57. READ timing (3 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Table 58. WRITE timing (5 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Table 59. WRITE timing (3 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Table 60. Program, WRITE and Erase times (5 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Table 61. Program, WRITE and Erase times (3 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Table 62. Port A Peripheral Data mode READ timing (5 V devices)  . . . . . . . . . . . . . . . . . . . . . . . . 111
Table 63. Port A Peripheral Data mode READ timing (3V devices) . . . . . . . . . . . . . . . . . . . . . . . . . 112
Table 64. Port A Peripheral Data mode WRITE timing (5 V devices). . . . . . . . . . . . . . . . . . . . . . . . 112
Table 65. Port A Peripheral Data mode WRITE timing (3 V devices). . . . . . . . . . . . . . . . . . . . . . . . 113
Table 66. Reset (RESET) timing (5 V devices)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Table 67. Reset (RESET) timing (3 V devices)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Table 68. ISC timing (5 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Table 69. ISC timing (3 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Table 70. Power-down timing (5 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Table 71. Power-down timing (3 V devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Table 72. PQFP52 - 52-pin plastic quad flat package mechanical dimensions  . . . . . . . . . . . . . . . . 117
Table 73. PLCC52-52-lead plastic lead chip carrier mechanical dimensions . . . . . . . . . . . . . . . . . . 118
Table 74. TQFP64 - 64-lead thin quad flatpack, package mechanical data . . . . . . . . . . . . . . . . . . . 119
Table 75. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Table 76. PQFP52 connections (see Features) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Table 77. PLCC52 connections (see Features) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Table 78. TQFP64 connections (see Features) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Table 79. Document revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

PSD8XXFX List of figures
Doc ID 7833 Rev 7 9/128
         
List of figures
Figure 1. PQFP52 connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 2. PLCC52 connections  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 3. TQFP64 connections  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 4. PSD block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 5. PSDsoft Express development tool  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 6. Data Polling flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 7. Data Toggle flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 8. Priority level of memory and I/O components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 9. 8031 memory modules – separate space. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 10. 8031 memory modules – combined space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 11. Page register  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 12. PLD diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 13. DPLD logic array. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 14. Macrocell and I/O port  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 15. CPLD Output macrocell  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Figure 16. Input macrocell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 17. Handshaking communication using input macrocells . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 18. An example of a typical 8-bit multiplexed bus interface  . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Figure 19. An example of a typical 8-bit non-multiplexed bus interface. . . . . . . . . . . . . . . . . . . . . . . . 61
Figure 20. Interfacing the PSD with an 80C31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Figure 21. Interfacing the PSD with the 80C251, with One READ input . . . . . . . . . . . . . . . . . . . . . . . 63
Figure 22. Interfacing the PSD with the 80C251, with RD and PSEN inputs. . . . . . . . . . . . . . . . . . . . 64
Figure 23. Interfacing the PSD with the 80C51X, 8-bit data bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Figure 24. Interfacing the PSD with a 68HC11  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Figure 25. General I/O port architecture  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Figure 26. Peripheral I/O mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Figure 27. Port A and port B structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Figure 28. Port C structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Figure 29. Port D structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Figure 30. Port D external Chip Select signals  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Figure 31. APD unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Figure 32. Enable Power-down flowchart  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Figure 33. Reset (RESET) timing  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Figure 34. PLD ICC /frequency consumption (5 V range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Figure 35. PLD ICC /frequency consumption (3 V range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Figure 36. AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Figure 37. AC measurement load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Figure 38. Switching waveforms – key  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Figure 39. Input to output disable / enable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Figure 40. Synchronous clock mode timing – PLD  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Figure 41. Asynchronous Reset / Preset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Figure 42. Asynchronous Clock mode Timing (product term clock). . . . . . . . . . . . . . . . . . . . . . . . . . 103
Figure 43. Input macrocell timing (product term clock)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Figure 44. READ timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Figure 45. WRITE timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Figure 46. Peripheral I/O READ timing  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Figure 47. Peripheral I/O WRITE timing  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Figure 48. Reset (RESET) timing  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

List of figures PSD8XXFX

10/128 Doc ID 7833 Rev 7

Figure 49. ISC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

Figure 50. PQFP52 - 52-pin plastic quad flat package mechanical drawing . . . . . . . . . . . . . . . . . . . 117

Figure 51. PLCC52 - 52-lead plastic lead chip carrier package mechanical drawing . . . . . . . . . . . . 118

Figure 52. TQFP64 - 64-lead thin quad flatpack, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . 119

PSD8XXFX Summary description

Doc ID 7833 Rev 7 11/128

1 Summary description

The PSD8XXFX family of memory systems for microcontrollers (MCUs) brings in-system-

programmability (ISP) to Flash memory and programmable logic. The result is a simple and

flexible solution for embedded designs. PSD devices combine many of the peripheral

functions found in MCU based applications.

Ta bl e 2 summarizes all the devices.

The CPLD in the PSD devices features an optimized macrocell logic architecture. The PSD

macrocell was created to address the unique requirements of embedded system designs. It

allows direct connection between the system address/data bus, and the internal PSD

registers, to simplify communication between the MCU and other supporting devices.

The PSD device includes a JTAG serial programming interface, to allow in-system

programming (ISP) of the entire device. This feature reduces development time, simplifies

the manufacturing flow, and dramatically lowers the cost of field upgrades. Using ST’s

special Fast-JTAG programming, a design can be rapidly programmed into the PSD in as

little as seven seconds.

The innovative PSD8XXFX family solves key problems faced by designers when managing

discrete Flash memory devices, such as:

●First-time in-system programming (ISP)

●Complex address decoding

●Simultaneous read and write to the device.

The JTAG Serial Interface block allows in-system programming (ISP), and eliminates the

need for an external Boot EPROM, or an external programmer. To simplify Flash memory

updates, program execution is performed from a secondary Flash memory while the primary

Flash memory is being updated. This solution avoids the complicated hardware and

software overhead necessary to implement IAP.

ST makes available a software development tool, PSDsoft™ Express, that generates ANSI-

C compliant code for use with your target MCU. This code allows you to manipulate the non-

volatile memory (NVM) within the PSD. Code examples are also provided for:

●Flash memory IAP via the UART of the host MCU

●Memory paging to execute code across several PSD memory pages

●Loading, reading, and manipulation of PSD macrocells by the MCU.

Table 2. Product range

Part number(1)

Primary Flash

memory

(8 sectors)

Secondary

Flash memory

(4 sectors)

SRAM I/O

ports

Number of

macrocells Serial ISP

JTAG/ISC

port

Turbo

mode

Input Output

PSD813F2 1 Mbit 256 Kbit 16 Kbit 27 24 16 yes yes

PSD813F4 1 Mbit 256 Kbit none 27 24 16 yes yes

PSD813F5 1 Mbit none none 27 24 16 yes yes

PSD833F2 1 Mbit 256 Kbit 64 Kbit 27 24 16 yes yes

PSD834F2 2 Mbit 256 Kbit 64 Kbit 27 24 16 yes yes

Summary description PSD8XXFX

12/128 Doc ID 7833 Rev 7

Figure 1. PQFP52 connections

PSD853F2 1 Mbit 256 Kbit 256 Kbit 27 24 16 yes yes

PSD854F2 2 Mbit 256 Kbit 256 Kbit 27 24 16 yes yes

1. All products support: JTAG serial ISP, MCU parallel ISP, ISP Flash memory, ISP CPLD, Security features, Power

Management Unit (PMU), Automatic Power-down (APD)

Table 2. Product range (continued)

Part number(1)

Primary Flash

memory

(8 sectors)

Secondary

Flash memory

(4 sectors)

SRAM I/O

ports

Number of

macrocells Serial ISP

JTAG/ISC

port

Turbo

mode

Input Output

39 AD15

38 AD14

37 AD13

36 AD12

35 AD11

34 AD10

33 AD9

32 AD8

31 VCC

30 AD7

29 AD6

28 AD5

27 AD4

PD2

PD1

PD0

PC7

PC6

PC5

PC4

VCC

GND

PC3

PC2

PC1

PC0

PB0

PB1

PB2

PB3

PB4

PB5

GND

PB6

PB7

CNTL1

CNTL2

RESET

CNTLO

PA7

PA6

PA5

PA4

PA3

GND

PA2

PA1

PA0

AD0

AD1

AD2

AD3

AI02858

PSD8XXFX Summary description

Doc ID 7833 Rev 7 13/128

Figure 2. PLCC52 connections

PB0

PB1

PB2

PB3

PB4

PB5

GND

PB6

PB7

CNTL1

CNTL2

RESET

CNTL0

PA7

PA6

PA5

PA4

PA3

GND

PA2

PA1

PA0

AD0

AD1

AD2

AD3

AD15

AD14

AD13

AD12

AD11

AD10

AD9

AD8

VCC

AD7

AD6

AD5

AD4

PD2

PD1

PD0

PC7

PC6

PC5

PC4

VCC

GND

PC3

PC2

PC1

PC0

AI02857

Summary description PSD8XXFX

14/128 Doc ID 7833 Rev 7

Figure 3. TQFP64 connections

48 CNTL0

47 AD15

46 AD14

45 AD13

44 AD12

43 AD11

42 AD10

41 AD9

40 AD8

39 VCC

38 VCC

37 AD7

36 AD6

35 AD5

34 AD4

33 AD3

PD2

PD1

PD0

PC7

PC6

PC5

PC4

VCC

GND

PC3

PC2

PC1

PC0

PB0

PB1

PB2

PB3

PB4

PB5

GND

PB6

PB7

CNTL1

CNTL2

RESET

PA7

PA6

PA5

PA4

PA3

GND

PA2

PA1

PA0

AD0

AD1

AD2

AI09645b

PSD8XXFX Pin description

Doc ID 7833 Rev 7 15/128

2 Pin description

Table 3. PLCC52 pin description (1)

Pin name Pin Type Description

ADIO0-7 30-37 I/O

This is the lower Address/Data port. Connect your MCU address or address/data bus

according to the following rules:

If your MCU has a multiplexed address/data bus where the data is multiplexed with the

lower address bits, connect AD0-AD7 to this port.

If your MCU does not have a multiplexed address/data bus, or you are using an 80C251

in page mode, connect A0-A7 to this port.

If you are using an 80C51XA in burst mode, connect A4/D0 through A11/D7 to this port.

ALE or AS latches the address. The PSD drives data out only if the READ signal is

active and one of the PSD functional blocks was selected. The addresses on this port

are passed to the PLDs.

ADIO8-15 39-46 I/O

This is the upper Address/Data port. Connect your MCU address or address/data bus

according to the following rules:

If your MCU has a multiplexed address/data bus where the data is multiplexed with the

lower address bits, connect A8-A15 to this port.

If your MCU does not have a multiplexed address/data bus, connect A8-A15 to this port.

If you are using an 80C251 in page mode, connect AD8-AD15 to this port.

If you are using an 80C51XA in burst mode, connect A12/D8 through A19/D15 to this

port.

ALE or AS latches the address. The PSD drives data out only if the READ signal is

active and one of the PSD functional blocks was selected. The addresses on this port

are passed to the PLDs.

CNTL0 47 I

The following control signals can be connected to this port, based on your MCU:

WR – active low Write Strobe input.

R_W – active high READ/active low write input.

This port is connected to the PLDs. Therefore, these signals can be used in decode

and other logic equations.

CNTL1 50 I

The following control signals can be connected to this port, based on your MCU:

RD – active low Read Strobe input.

E – E clock input.

DS – active low Data Strobe input.

PSEN – connect PSEN to this port when it is being used as an active low READ signal.

For example, when the 80C251 outputs more than 16 address bits, PSEN is actually

the READ signal.

This port is connected to the PLDs. Therefore, these signals can be used in decode

and other logic equations.

CNTL2 49 I

This port can be used to input the PSEN (Program Select Enable) signal from any MCU

that uses this signal for code exclusively. If your MCU does not output a Program Select

Enable signal, this port can be used as a generic input. This port is connected to the

PLDs.

Reset 48 I Resets I/O ports, PLD macrocells and some of the Configuration registers. Must be low

at Power-up.

Pin description PSD8XXFX

16/128 Doc ID 7833 Rev 7

PA 0

PA 1

PA 2

PA 3

PA 4

PA 5

PA 6

PA 7

I/O

These pins make up port A. These port pins are configurable and can have the

following functions:

MCU I/O – write to or read from a standard output or input port.

CPLD macrocell (McellAB0-7) outputs.

Inputs to the PLDs.

Latched address outputs (see Ta b l e 7 ).

Address inputs. For example, PA0-3 could be used for A0-A3 when using an 80C51XA

in burst mode.

As the data bus inputs D0-D7 for non-multiplexed address/data bus MCUs.

D0/A16-D3/A19 in M37702M2 mode.

Peripheral I/O mode.

Note: PA0-PA3 can only output CMOS signals with an option for high slew rate.

However, PA4-PA7 can be configured as CMOS or Open Drain outputs.

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

I/O

These pins make up port B. These port pins are configurable and can have the

following functions:

MCU I/O – write to or read from a standard output or input port.

CPLD macrocell (McellAB0-7 or McellBC0-7) outputs.

Inputs to the PLDs.

Latched address outputs (see Ta b l e 7 ).

Note: PB0-PB3 can only output CMOS signals with an option for high slew rate.

However, PB4-PB7 can be configured as CMOS or Open Drain outputs.

PC0 20 I/O

PC0 pin of port C. This port pin can be configured to have the following functions:

MCU I/O – write to or read from a standard output or input port.

CPLD macrocell (McellBC0) output.

Input to the PLDs.

TMS input(2) for the JTAG Serial Interface.

This pin can be configured as a CMOS or Open Drain output.

PC1 19 I/O

PC1 pin of port C. This port pin can be configured to have the following functions:

MCU I/O – write to or read from a standard output or input port.

CPLD macrocell (McellBC1) output.

Input to the PLDs.

TCK input(2) for the JTAG Serial Interface.

This pin can be configured as a CMOS or Open Drain output.

PC2 18 I/O

PC2 pin of port C. This port pin can be configured to have the following functions:

MCU I/O – write to or read from a standard output or input port.

CPLD macrocell (McellBC2) output.

Input to the PLDs.

This pin can be configured as a CMOS or Open Drain output.

Table 3. PLCC52 pin description (1) (continued)

Pin name Pin Type Description

PSD8XXFX Pin description

Doc ID 7833 Rev 7 17/128

PC3 17 I/O

PC3 pin of port C. This port pin can be configured to have the following functions:

MCU I/O – write to or read from a standard output or input port.

CPLD macrocell (McellBC3) output.

Input to the PLDs.

TSTAT output(2) for the JTAG Serial Interface.

Ready/Busy output for parallel in-system programming (ISP).

This pin can be configured as a CMOS or Open Drain output.

PC4 14 I/O

PC4 pin of port C. This port pin can be configured to have the following functions:

MCU I/O – write to or read from a standard output or input port.

CPLD macrocell (McellBC4) output.

Input to the PLDs.

TERR output(2) for the JTAG Serial Interface.

This pin can be configured as a CMOS or Open Drain output.

PC5 13 I/O

PC5 pin of port C. This port pin can be configured to have the following functions:

MCU I/O – write to or read from a standard output or input port.

CPLD macrocell (McellBC5) output.

Input to the PLDs.

TDI input(2) for the JTAG Serial Interface.

This pin can be configured as a CMOS or Open Drain output.

PC6 12 I/O

PC6 pin of port C. This port pin can be configured to have the following functions:

MCU I/O – write to or read from a standard output or input port.

CPLD macrocell (McellBC6) output.

Input to the PLDs.

TDO output(2) for the JTAG Serial Interface.

This pin can be configured as a CMOS or Open Drain output.

PC7 11 I/O

PC7 pin of port C. This port pin can be configured to have the following functions:

MCU I/O – write to or read from a standard output or input port.

CPLD macrocell (McellBC7) output.

Input to the PLDs.

DBE – active low Data Byte Enable input from 68HC912 type MCUs.

This pin can be configured as a CMOS or Open Drain output.

PD0 10 I/O

PD0 pin of port D. This port pin can be configured to have the following functions:

ALE/AS input latches address output from the MCU.

MCU I/O – write or read from a standard output or input port.

Input to the PLDs.

CPLD output (External Chip Select).

PD1 9 I/O

PD1 pin of port D. This port pin can be configured to have the following functions:

MCU I/O – write to or read from a standard output or input port.

Input to the PLDs.

CPLD output (External Chip Select).

CLKIN – clock input to the CPLD macrocells, the APD Unit’s Power-down counter, and

the CPLD AND Array.

Table 3. PLCC52 pin description (1) (continued)

Pin name Pin Type Description

Pin description PSD8XXFX

18/128 Doc ID 7833 Rev 7

PD2 8 I/O

PD2 pin of port D. This port pin can be configured to have the following functions:

MCU I/O - write to or read from a standard output or input port.

Input to the PLDs.

CPLD output (External Chip Select).

PSD Chip Select input (CSI). When low, the MCU can access the PSD memory and

I/O. When high, the PSD memory blocks are disabled to conserve power.

VCC 15, 38 Supply voltage

GND 1, 16,

26 Ground pins

1. The pin numbers in this table are for the PLCC package only. See the package information from Table 73 onwards, for pin

numbers on other package types.

2. These functions can be multiplexed with other functions.

Table 3. PLCC52 pin description (1) (continued)

Pin name Pin Type Description

PSD8XXFX Pin description

Doc ID 7833 Rev 7 19/128

Figure 4. PSD block diagram

PROG.

MCU BUS

INTRF.

ADIO

PORT

CNTL0,

CNTL1,

CNTL2

AD0 – AD15

CLKIN

(PD1)

CLKIN

PLD

INPUT

BUS

PROG.

PORT

PROG.

PORT

1 OR 2 MBIT PRIMARY

FLASH MEMORY

8 SECTORS

PA0 – PA7

PB0 – PB7

PROG.

PORT

PROG.

PORT

PC0 – PC7

PD0 – PD2

ADDRESS/DATA/CONTROL BUS

PORT A ,B & C

3 EXT CS TO PORT D

24 INPUT MACROCELLS

PORT A ,B & C

256 KBIT SECONDARY

NON-VOLATILE MEMORY

(BOOT OR DATA)

4 SECTORS

256 KBIT SRAM

RUNTIME CONTROL

AND I/O REGISTERS

SRAM SELECT

PERIP I/O MODE SELECTS

MACROCELL FEEDBACK OR PORT INPUT

CSIOP

FLASH ISP CPLD

(CPLD) 16 OUTPUT MACROCELLS

FLASH DECODE

PLD (DPLD)

PLD, CONFIGURATION

& FLASH MEMORY

LOADER

JTAG

SERIAL

CHANNEL

PAGE

ALGORITHM

SECTOR

SELECTS

SECTOR

SELECTS

GLOBAL

CONFIG. &

SECURITY

AI02861f

PSD architectural overview PSD8XXFX

20/128 Doc ID 7833 Rev 7

3 PSD architectural overview

PSD devices contain several major functional blocks. Figure 4 shows the architecture of the

PSD device family. The functions of each block are described briefly in the following

sections. Many of the blocks perform multiple functions and are user configurable.

3.1 Memory

Each of the memory blocks is briefly discussed in the following paragraphs. A more detailed

discussion can be found in Section 6.1: Memory blocks.

The 1 Mbit or 2 Mbit (128K x 8, or 256K x 8) Flash memory is the primary memory of the

PSD. It is divided into 8 equally-sized sectors that are individually selectable.

The optional 256 Kbit (32K x 8) secondary Flash memory is divided into 4 equally-sized

sectors. Each sector is individually selectable.

The optional SRAM is intended for use as a scratch-pad memory or as an extension to the

MCU SRAM.

Each sector of memory can be located in a different address space as defined by the user.

The access times for all memory types includes the address latching and DPLD decoding

time.

3.2 Page register

The 8-bit Page register expands the address range of the MCU by up to 256 times. The

paged address can be used as part of the address space to access external memory and

peripherals, or internal memory and I/O. The Page register can also be used to change the

address mapping of sectors of the Flash memories into different memory spaces for IAP.

3.3 PLDs

The device contains two PLDs, the Decode PLD (DPLD) and the Complex PLD (CPLD), as

shown in Tab l e 4 , each optimized for a different function. The functional partitioning of the

PLDs reduces power consumption, optimizes cost/performance, and eases design entry.

The DPLD is used to decode addresses and to generate Sector Select signals for the PSD

internal memory and registers. The DPLD has combinatorial outputs. The CPLD has 16

Output macrocells (OMC) and 3 combinatorial outputs. The PSD also has 24 input

macrocells (IMC) that can be configured as inputs to the PLDs. The PLDs receive their

inputs from the PLD input bus and are differentiated by their output destinations, number of

product terms, and macrocells.

The PLDs consume minimal power. The speed and power consumption of the PLD is

controlled by the Turbo Bit in PMMR0 and other bits in the PMMR2. These registers are set

by the MCU at run-time. There is a slight penalty to PLD propagation time when invoking the

power management features.

PSD8XXFX PSD architectural overview

Doc ID 7833 Rev 7 21/128

3.4 I/O ports

The PSD has 27 individually configurable I/O pins distributed over the four ports (Port A, B,

C, and D). Each I/O pin can be individually configured for different functions. ports can be

configured as standard MCU I/O ports, PLD I/O, or latched address outputs for MCUs using

multiplexed address/data buses.

The JTAG pins can be enabled on port C for in-system programming (ISP).

Ports A and B can also be configured as a data port for a non-multiplexed bus.

3.5 MCU bus interface

PSD interfaces easily with most 8-bit MCUs that have either multiplexed or non-multiplexed

address/data buses. The device is configured to respond to the MCU control signals, which

are also used as inputs to the PLDs. For examples, please see Section 15.4: MCU bus

interface examples.

3.6 JTAG port

In-system programming (ISP) can be performed through the JTAG signals on port C. This

serial interface allows complete programming of the entire PSD device. A blank device can

be completely programmed. The JTAG signals (TMS, TCK, TSTAT, TERR, TDI, TDO) can

be multiplexed with other functions on port C. Ta bl e 5 indicates the JTAG pin assignments.

3.7 In-system programming (ISP)

Using the JTAG signals on port C, the entire PSD device can be programmed or erased

without the use of the MCU. The primary Flash memory can also be programmed in-system

by the MCU executing the programming algorithms out of the secondary memory, or SRAM.

The secondary memory can be programmed the same way by executing out of the primary

Flash memory. The PLD or other PSD configuration blocks can be programmed through the

JTAG port or a device programmer. Ta bl e 6 indicates which programming methods can

program different functional blocks of the PSD.

3.8 Power management unit (PMU)

The power management unit (PMU) gives the user control of the power consumption on

selected functional blocks based on system requirements. The PMU includes an Automatic

Power-down (APD) Unit that turns off device functions during MCU inactivity. The APD unit

has a Power-down mode that helps reduce power consumption.

Table 4. PLD I/O

Name Inputs Outputs Product terms

Decode PLD (DPLD) 73 17 42

Complex PLD (CPLD) 73 19 140

PSD architectural overview PSD8XXFX

22/128 Doc ID 7833 Rev 7

The PSD also has some bits that are configured at run-time by the MCU to reduce power

consumption of the CPLD. The Turbo Bit in PMMR0 can be reset to '0' and the CPLD latches

its outputs and goes to sleep until the next transition on its inputs.

Additionally, bits in PMMR2 can be set by the MCU to block signals from entering the CPLD

to reduce power consumption. Please see Section 17: Power management for more details.

Table 5. JTAG SIgnals on port C

Port C pins JTAG signal

PC0 TMS

PC1 TCK

PC3 TSTAT

PC4 TERR

PC5 TDI

PC6 TDO

Table 6. Methods for programming different functional blocks of the PSD

Functional block JTAG

programming

Device

programmer IAP

Primary Flash memory Yes Yes Yes

Secondary Flash memory Yes Yes Yes

PLD array (DPLD and CPLD) Yes Yes No

PSD configuration Yes Yes No

PSD8XXFX Development system

Doc ID 7833 Rev 7 23/128

4 Development system

The PSD8XXFX family is supported by PSDsoft Express, a Windows-based software

development tool. A PSD design is quickly and easily produced in a point and click

environment. The designer does not need to enter Hardware Description Language (HDL)

equations, unless desired, to define PSD pin functions and memory map information. The

general design flow is shown in Figure 5. PSDsoft Express is available from our web site

(the address is given on the back page of this data sheet) or other distribution channels.

PSDsoft Express directly supports two low cost device programmers form ST: PSDpro and

FlashLINK (JTAG). Both of these programmers may be purchased through your local

distributor/representative, or directly from our web site using a credit card. The PSD is also

supported by third party device programmers. See our web site for the current list.

Figure 5. PSDsoft Express development tool

PSD Configuration

PSD Fitter

PSD Simulator PSD Programmer

*.OBJ FILE

PLD DESCRIPTION

CONFIGURE MCU BUS

INTERFACE AND OTHER

PSD ATTRIBUTES

LOGIC SYNTHESIS

AND FITTING

PSDsilos III

DEVICE SIMULATION

(OPTIONAL)

PSDPro, or

FlashLINK (JTAG)

ADDRESS TRANSLATION

AND MEMORY MAPPING

PSDabel

MODIFY ABEL TEMPLATE FILE

OR GENERATE NEW FILE

PSD TOOLS

GENERATE C CODE

SPECIFIC TO PSD

FUNCTIONS

USER'S CHOICE OF

MICROCONTROLLER

COMPILER/LINKER

*.OBJ AND *.SVF

FILES AVAILABLE

FOR 3rd PARTY

PROGRAMMERS

(CONVENTIONAL or

JTAG-ISC)

FIRMWARE

HEX OR S-RECORD

FORMAT

AI04918

PSD register description and address offset PSD8XXFX

24/128 Doc ID 7833 Rev 7

5 PSD register description and address offset

Ta bl e 7 shows the offset addresses to the PSD registers relative to the CSIOP base

address. The CSIOP space is the 256 bytes of address that is allocated by the user to the

internal PSD registers. Ta b le 8 provides brief descriptions of the registers in CSIOP space.

The following section gives a more detailed description.

Table 7. I/O port latched address output assignments(1)(2)

1. See Section 16: I/O ports, on how to enable the Latched Address Output function.

2. N/A = Not Applicable

MCU

Port A Port B

Port A (3:0) Port A (7:4) Port B (3:0) Port B (7:4)

8051XA (8-bit) N/A Address a7-a4 Address a11-a8 N/A

80C251 (page mode) N/A N/A Address a11-a8 Address a15-

a12

All other 8-bit multiplexed Address a3-a0 Address a7-a4 Address a3-a0 Address a7-a4

8-bit non-multiplexed bus N/A N/A Address a3-a0 Address a7-a4

Table 8. Register address offset

name Port A Port B Port C Port D Other

(1) Description

Data In 00 01 10 11 Reads port pin as input, MCU I/O input

mode

Control 02 03 Selects mode between MCU I/O or

Address Out

Data Out 04 05 12 13 Stores data for output to port pins, MCU

I/O output mode

Direction 06 07 14 15 Configures port pin as input or output

Drive Select 08 09 16 17

Configures port pins as either CMOS or

Open Drain on some pins, while selecting

high slew rate on other pins.

Input

macrocell 0A 0B 18 Reads input macrocells

Enable Out 0C 0D 1A 1B Reads the status of the output enable to

the I/O port driver

Output

macrocells

20 20 READ – reads output of macrocells AB

WRITE – loads macrocell flip-flops

Output

macrocells

21 21 READ – reads output of macrocells BC

WRITE – loads macrocell flip-flops

PSD8XXFX PSD register description and address offset

Doc ID 7833 Rev 7 25/128

Mask

macrocells

22 22 Blocks writing to the Output macrocells

Mask

macrocells

23 23 Blocks writing to the Output macrocells

Primary Flash

Protection C0 Read only – Primary Flash Sector

Protection

Secondary

Flash memory

Protection

C2 Read only – PSD Security and Secondary

Flash memory Sector Protection

JTAG Enable C7 Enables JTAG port

PMMR0 B0 Power Management register 0

PMMR2 B4 Power Management register 2

Page E0 Page register

VM E2

Places PSD memory areas in program

and/or data space on an individual basis.

1. Other registers that are not part of the I/O ports.

Table 8. Register address offset (continued)

name Port A Port B Port C Port D Other

(1) Description

Detailed operation PSD8XXFX

26/128 Doc ID 7833 Rev 7

6 Detailed operation

As shown in Figure 4, the PSD consists of six major types of functional blocks:

●Memory blocks

●PLD blocks

●MCU bus interface

●I/O ports

●Power management unit (PMU)

●JTAG interface

The functions of each block are described in the following sections. Many of the blocks

perform multiple functions, and are user configurable.

6.1 Memory blocks

The PSD has the following memory blocks:

●Primary Flash memory

●Optional Secondary Flash memory

●Optional SRAM

The Memory Select signals for these blocks originate from the Decode PLD (DPLD) and are

user-defined in PSDsoft Express.

Table 9. Memory block size and organization

Sector

number

Primary Flash memory Secondary Flash

memory SRAM

Sector size

(Kbytes)

Sector

select

signal

Sector size

(Kbytes)

Sector

select

signal

SRAM size

(Kbytes)

SRAM

select

signal

0 32 FS0 16 CSBOOT0 256 RS0

1 32 FS1 16 CSBOOT1

2 32 FS2 16 CSBOOT2

3 32 FS3 16 CSBOOT3

432FS4

532FS5

632FS6

732FS7

Total 512 8 sectors 64 4 sectors 256

PSD8XXFX Detailed operation

Doc ID 7833 Rev 7 27/128

6.2 Description of primary Flash memory and secondary Flash

memory

The primary Flash memory is divided evenly into eight equal sectors. The secondary Flash

memory is divided into four equal sectors. Each sector of either memory block can be

separately protected from Program and Erase cycles.

Flash memory may be erased on a sector-by-sector basis. Flash sector erasure may be

suspended while data is read from other sectors of the block and then resumed after

reading.

During a program or erase cycle in Flash memory, the status can be output on Ready/Busy

(PC3). This pin is set up using PSDsoft Express Configuration.

6.3 Memory block select signals

The DPLD generates the Select signals for all the internal memory blocks (see Section 14:

PLDS). Each of the eight sectors of the primary Flash memory has a Select signal (FS0-

FS7) which can contain up to three product terms. Each of the four sectors of the secondary

Flash memory has a Select signal (CSBOOT0-CSBOOT3) which can contain up to three

product terms. Having three product terms for each Select signal allows a given sector to be

mapped in different areas of system memory. When using a MCU with separate program

and data space, these flexible Select signals allow dynamic re-mapping of sectors from one

memory space to the other.

6.3.1 Ready/Busy (PC3)

This signal can be used to output the Ready/Busy status of the PSD. The output on

Ready/Busy (PC3) is a 0 (Busy) when Flash memory is being written to, or when Flash

memory is being erased. The output is a 1 (Ready) when no WRITE or Erase cycle is in

progress.

6.3.2 Memory operation

The primary Flash memory and secondary Flash memory are addressed through the MCU

bus interface. The MCU can access these memories in one of two ways:

●The MCU can execute a typical bus WRITE or READ operation just as it would if

accessing a RAM or ROM device using standard bus cycles.

●The MCU can execute a specific instruction that consists of several WRITE and READ

operations. This involves writing specific data patterns to special addresses within the

Flash memory to invoke an embedded algorithm. These instructions are summarized in

Ta b le 1 0 .

Typically, the MCU can read Flash memory using READ operations, just as it would read a

ROM device. However, Flash memory can only be altered using specific Erase and Program

instructions. For example, the MCU cannot write a single byte directly to Flash memory as it

would write a byte to RAM. To program a byte into Flash memory, the MCU must execute a

Program instruction, then test the status of the Program cycle. This status test is achieved

by a READ operation or polling Ready/Busy (PC3).

Flash memory can also be read by using special instructions to retrieve particular Flash

device information (sector protect status and ID).

Detailed operation PSD8XXFX

28/128 Doc ID 7833 Rev 7

Table 10. Instructions (1)(2)(3)

Instruction

FS0-FS7 or

CSBOOT0-

CSBOOT3

(4)

Cycle 1 Cycle 2 Cycle 3 Cycle 4 Cycle 5 Cycle 6 Cycle 7

READ(5) 1“READ”

RD @ RA

Read Main

Flash ID(6) 1AAh@

X555h

55h@

XAAAh

90h@

X555h

Read identifier

(A6,A1,A0 = 0,0,1)

Read Sector

Protection(6)(7)

(8)

1AAh@

X555h

55h@

XAAAh

90h@

X555h

Read identifier

(A6,A1,A0 = 0,1,0)

Program a

Flash Byte(8) 1AAh@

X555h

55h@

XAAAh

A0h@

X555h PD@ PA

Flash Sector

Erase(9)(8) 1AAh@

X555h

55h@

XAAAh

80h@

X555h AAh@ X555h 55h@

XAAAh

30h@

30h7@

next SA

Flash Bulk

Erase(8) 1AAh@

X555h

55h@

XAAAh

80h@

X555h AAh@ X555h 55h@

XAAAh

10h@

X555h

Suspend

Sector

Erase(10)

1B0h@

XXXXh

Resume

Sector

Erase(11)

130h@

XXXXh

Reset(6) 1F0h@

XXXXh

Unlock Bypass 1 AAh@

X555h

55h@

XAAAh

20h@

X555h

Unlock Bypass

Program(12) 1A0h@

XXXXh PD@ PA

Unlock Bypass

Reset(13) 190h@

XXXXh

00h@

XXXXh

1. All bus cycles are WRITE bus cycles, except the ones with the “READ” label

2. All values are in hexadecimal:

X = Don’t Care. Addresses of the form XXXXh, in this table, must be even addresses

RA = Address of the memory location to be read

RD = Data read from location RA during the READ cycle

PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of Write Strobe (WR,

CNTL0). PA is an even address for PSD in word programming mode.

PD = Data word to be programmed at location PA. Data is latched on the rising edge of Write Strobe (WR, CNTL0)

SA = Address of the sector to be erased or verified. The Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) of the sector to

be erased, or verified, must be Active (high).

3. Only address bits A11-A0 are used in instruction decoding.

4. Sector Select (FS0 to FS7 or CSBOOT0 to CSBOOT3) signals are active high, and are defined in PSDsoft Express.

5. No Unlock or instruction cycles are required when the device is in the READ mode

6. The Reset instruction is required to return to the READ mode after reading the Flash ID, or after reading the Sector

Protection Status, or if the Error flag bit (DQ5/DQ13) goes high.

7. The data is 00h for an unprotected sector, and 01h for a protected sector. In the fourth cycle, the Sector Select is active,

and (A1,A0)=(1,0)

PSD8XXFX Detailed operation

Doc ID 7833 Rev 7 29/128

8. The MCU cannot invoke these instructions while executing code from the same Flash memory as that for which the

instruction is intended. The MCU must fetch, for example, the code from the secondary Flash memory when reading the

Sector Protection Status of the primary Flash memory.

9. Additional sectors to be erased must be written at the end of the Sector Erase instruction within 80 µs.

10. The system may perform READ and Program cycles in non-erasing sectors, read the Flash ID or read the Sector Protection

Status when in the Suspend Sector Erase mode. The Suspend Sector Erase instruction is valid only during a Sector Erase

cycle.

11. The Resume Sector Erase instruction is valid only during the Suspend Sector Erase mode.

12. The Unlock Bypass instruction is required prior to the Unlock Bypass Program instruction.

13. The Unlock Bypass Reset Flash instruction is required to return to reading memory data when the device is in the Unlock

Bypass mode.

Instructions PSD8XXFX

30/128 Doc ID 7833 Rev 7

7 Instructions

An instruction consists of a sequence of specific operations. Each received byte is

sequentially decoded by the PSD and not executed as a standard WRITE operation. The

instruction is executed when the correct number of bytes are properly received and the time

between two consecutive bytes is shorter than the timeout period. Some instructions are

structured to include READ operations after the initial WRITE operations.

The instruction must be followed exactly. Any invalid combination of instruction bytes or

timeout between two consecutive bytes while addressing Flash memory resets the device

logic into READ mode (Flash memory is read like a ROM device).

The PSD supports the instructions summarized in Tab l e 10 :

Flash memory:

●Erase memory by chip or sector

●Suspend or resume sector erase

●Program a Byte

●Reset to READ mode

●Read primary Flash Identifier value

●Read Sector Protection Status

●Bypass (on the PSD833F2, PSD834F2, PSD853F2 and PSD854F2)

These instructions are detailed in Ta bl e 1 0 . For efficient decoding of the instructions, the first

two bytes of an instruction are the coded cycles and are followed by an instruction byte or

confirmation byte. The coded cycles consist of writing the data AAh to address X555h

during the first cycle and data 55h to address XAAAh during the second cycle. Address

signals A15-A12 are Don’t Care during the instruction WRITE cycles. However, the

appropriate Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) must be selected.

The primary and secondary Flash memories have the same instruction set (except for Read

Primary Flash Identifier). The Sector Select signals determine which Flash memory is to

receive and execute the instruction. The primary Flash memory is selected if any one of

Sector Select (FS0-FS7) is high, and the secondary Flash memory is selected if any one of

Sector Select (CSBOOT0-CSBOOT3) is high.

7.1 Power-up mode

The PSD internal logic is reset upon Power-up to the READ mode. Sector Select (FS0-FS7

and CSBOOT0-CSBOOT3) must be held low, and Write Strobe (WR, CNTL0) high, during

Power-up for maximum security of the data contents and to remove the possibility of a byte

being written on the first edge of Write Strobe (WR, CNTL0). Any WRITE cycle initiation is

locked when VCC is below VLKO.

7.2 READ

Under typical conditions, the MCU may read the primary Flash memory or the secondary

Flash memory using READ operations just as it would a ROM or RAM device. Alternately,

the MCU may use READ operations to obtain status information about a program or erase

PSD8XXFX Instructions

Doc ID 7833 Rev 7 31/128

cycle that is currently in progress. Lastly, the MCU may use instructions to read special data

from these memory blocks. The following sections describe these READ functions.

7.3 Read memory contents

Primary Flash memory and secondary Flash memory are placed in the READ mode after

Power-up, chip reset, or a Reset Flash instruction (see Ta bl e 1 0 ). The MCU can read the

memory contents of the primary Flash memory or the secondary Flash memory by using

READ operations any time the READ operation is not part of an instruction.

7.4 Read Primary Flash Identifier

The primary Flash memory identifier is read with an instruction composed of 4 operations: 3

specific WRITE operations and a READ operation (see Ta bl e 1 0 ). During the READ

operation, address bits A6, A1, and A0 must be '0,0,1,' respectively, and the appropriate

Sector Select (FS0-FS7) must be high. The identifier for the PSD813F2/3/4/5 is E4h, and for

the PSD83xF2 or PSD85xF2 it is E7h.

7.5 Read Memory Sector Protection status

The primary Flash memory Sector Protection Status is read with an instruction composed of

4 operations: 3 specific WRITE operations and a READ operation (see Ta bl e 1 0 ). During the

READ operation, address Bits A6, A1, and A0 must be '0,1,0,' respectively, while Sector

Select (FS0-FS7 or CSBOOT0-CSBOOT3) designates the Flash memory sector whose

protection has to be verified. The READ operation produces 01h if the Flash memory sector

is protected, or 00h if the sector is not protected.

The sector protection status for all NVM blocks (primary Flash memory or secondary Flash

memory) can also be read by the MCU accessing the Flash Protection registers in PSD I/O

space. See Section 10.1: Flash Memory Sector Protect for register definitions.

7.6 Reading the Erase/Program Status bits

The PSD provides several status bits to be used by the MCU to confirm the completion of an

Erase or Program cycle of Flash memory. These status bits minimize the time that the MCU

spends performing these tasks and are defined in Ta b l e 1 1 . The status bits can be read as

many times as needed.

For Flash memory, the MCU can perform a READ operation to obtain these status bits while

an Erase or Program instruction is being executed by the embedded algorithm. See

Section 8: Programming Flash memory for details.

Instructions PSD8XXFX

32/128 Doc ID 7833 Rev 7

7.7 Data Polling flag (DQ7)

When erasing or programming in Flash memory, the Data Polling flag bit (DQ7) outputs the

complement of the bit being entered for programming/writing on the DQ7 Bit. Once the

Program instruction or the WRITE operation is completed, the true logic value is read on the

Data Polling flag bit (DQ7, in a READ operation).

●Data Polling is effective after the fourth WRITE pulse (for a Program instruction) or after

the sixth WRITE pulse (for an Erase instruction). It must be performed at the address

being programmed or at an address within the Flash memory sector being erased.

●During an Erase cycle, the Data Polling flag bit (DQ7) outputs a ’0.’ After completion of

the cycle, the Data Polling flag bit (DQ7) outputs the last bit programmed (it is a '1' after

erasing).

●If the byte to be programmed is in a protected Flash memory sector, the instruction is

ignored.

●If all the Flash memory sectors to be erased are protected, the Data Polling flag bit

(DQ7) is reset to '0' for about 100µs, and then returns to the previous addressed byte.

No erasure is performed.

7.8 Toggle flag (DQ6)

The PSD offers another way for determining when the Flash memory Program cycle is

completed. During the internal WRITE operation and when either the FS0-FS7 or

CSBOOT0-CSBOOT3 is true, the Toggle flag bit (DQ6) toggles from '0' to '1' and '1' to '0' on

subsequent attempts to read any byte of the memory.

When the internal cycle is complete, the toggling stops and the data read on the data bus

D0-D7 is the addressed memory byte. The device is now accessible for a new READ or

WRITE operation. The cycle is finished when two successive READs yield the same output

data.

●The Toggle flag bit (DQ6) is effective after the fourth WRITE pulse (for a Program

instruction) or after the sixth WRITE pulse (for an Erase instruction).

●If the byte to be programmed belongs to a protected Flash memory sector, the

instruction is ignored.

●If all the Flash memory sectors selected for erasure are protected, the Toggle flag bit

(DQ6) toggles to '0' for about 100µs and then returns to the previous addressed byte.

Table 11. Status bits(1)(2)(3)

Functional

block

FS0-

FS7/CSBOOT0-

CSBOOT3

DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0

Flash memory VIH

Data

Polling

Toggle

flag

Error

flag XErase

timeout XXX

1. X = Not guaranteed value, can be read either '1' or ’0.’

2. DQ7-DQ0 represent the data bus bits, D7-D0.

3. FS0-FS7 and CSBOOT0-CSBOOT3 are active high.

PSD8XXFX Instructions

Doc ID 7833 Rev 7 33/128

7.9 Error flag (DQ5)

During a normal program or erase cycle, the Error flag bit (DQ5) is to ’0.’ This bit is set to '1'

when there is a failure during Flash memory Byte Program, Sector Erase, or Bulk Erase

cycle.

In the case of Flash memory programming, the Error flag bit (DQ5) indicates the attempt to

program a Flash memory bit from the programmed state, ’0,’ to the erased state, '1,' which is

not valid. The Error flag bit (DQ5) may also indicate a timeout condition while attempting to

program a byte.

In case of an error in a Flash memory Sector Erase or Byte Program cycle, the Flash

memory sector in which the error occurred or to which the programmed byte belongs must

no longer be used. Other Flash memory sectors may still be used. The Error flag bit (DQ5)

is reset after a Reset Flash instruction.

7.10 Erase timeout flag (DQ3)

The Erase timeout flag bit (DQ3) reflects the timeout period allowed between two

consecutive Sector Erase instructions. The Erase timeout flag bit (DQ3) is reset to '0' after a

Sector Erase cycle for a time period of 100µs + 20% unless an additional Sector Erase

instruction is decoded. After this time period, or when the additional Sector Erase instruction

is decoded, the Erase timeout flag bit (DQ3) is set to '1.'

Programming Flash memory PSD8XXFX

34/128 Doc ID 7833 Rev 7

8 Programming Flash memory

Flash memory must be erased prior to being programmed. A byte of Flash memory is

erased to all 1s (FFh), and is programmed by setting selected bits to ’0.’ The MCU may

erase Flash memory all at once or by-sector, but not byte-by-byte. However, the MCU may

program Flash memory byte-by-byte.

The primary and secondary Flash memories require the MCU to send an instruction to

program a byte or to erase sectors (see Ta b l e 10 ).

Once the MCU issues a Flash memory Program or Erase instruction, it must check for the

status bits for completion. The embedded algorithms that are invoked inside the PSD

support several means to provide status to the MCU. Status may be checked using any of

three methods: Data Polling, Data Toggle, or Ready/Busy (PC3).

8.1 Data Polling

Polling on the Data Polling flag bit (DQ7) is a method of checking whether a program or

erase cycle is in progress or has completed. Figure 6 shows the Data Polling algorithm.

When the MCU issues a Program instruction, the embedded algorithm within the PSD

begins. The MCU then reads the location of the byte to be programmed in Flash memory to

check status. The Data Polling flag bit (DQ7) of this location becomes the complement of b7

of the original data byte to be programmed. The MCU continues to poll this location,

comparing the Data Polling flag bit (DQ7) and monitoring the Error flag bit (DQ5). When the

Data Polling flag bit (DQ7) matches b7 of the original data, and the Error flag bit (DQ5)

remains ’0,’ the embedded algorithm is complete. If the Error flag bit (DQ5) is '1,' the MCU

should test the Data Polling flag bit (DQ7) again since the Data Polling flag bit (DQ7) may

have changed simultaneously with the Error flag bit (DQ5, see Figure 6).

The Error flag bit (DQ5) is set if either an internal timeout occurred while the embedded

algorithm attempted to program the byte or if the MCU attempted to program a '1' to a bit

that was not erased (not erased is logic '0').

It is suggested (as with all Flash memories) to read the location again after the embedded

programming algorithm has completed, to compare the byte that was written to the Flash

memory with the byte that was intended to be written.

When using the Data Polling method during an Erase cycle, Figure 6 still applies. However,

the Data Polling flag bit (DQ7) is '0' until the Erase cycle is complete. A 1 on the Error flag bit

(DQ5) indicates a timeout condition on the Erase cycle; a 0 indicates no error. The MCU can

read any location within the sector being erased to get the Data Polling flag bit (DQ7) and

the Error flag bit (DQ5).

PSDsoft Express generates ANSI C code functions which implement these Data Polling

algorithms.

PSD8XXFX Programming Flash memory

Doc ID 7833 Rev 7 35/128

Figure 6. Data Polling flowchart

8.2 Data Toggle

Checking the Toggle flag bit (DQ6) is a method of determining whether a program or erase

cycle is in progress or has completed. Figure 7 shows the Data Toggle algorithm.

When the MCU issues a Program instruction, the embedded algorithm within the PSD

begins. The MCU then reads the location of the byte to be programmed in Flash memory to

check status. The Toggle flag bit (DQ6) of this location toggles each time the MCU reads

this location until the embedded algorithm is complete. The MCU continues to read this

location, checking the Toggle flag bit (DQ6) and monitoring the Error flag bit (DQ5). When

the Toggle flag bit (DQ6) stops toggling (two consecutive reads yield the same value), and

the Error flag bit (DQ5) remains ’0,’ the embedded algorithm is complete. If the Error flag bit

(DQ5) is '1,' the MCU should test the Toggle flag bit (DQ6) again, since the Toggle flag bit

(DQ6) may have changed simultaneously with the Error flag bit (DQ5, see Figure 7).

The Error flag bit (DQ5) is set if either an internal timeout occurred while the embedded

algorithm attempted to program the byte, or if the MCU attempted to program a '1' to a bit

that was not erased (not erased is logic '0').

It is suggested (as with all Flash memories) to read the location again after the embedded

programming algorithm has completed, to compare the byte that was written to Flash

memory with the byte that was intended to be written.

When using the Data Toggle method after an Erase cycle, Figure 7 still applies. the Toggle

flag bit (DQ6) toggles until the Erase cycle is complete. A '1' on the Error flag bit (DQ5)

indicates a timeout condition on the Erase cycle; a '0' indicates no error. The MCU can read

READ DQ5 & DQ7

at VALID ADDRESS

START

READ DQ7

FAIL PASS

AI01369B

DQ7

DATA

YES

DQ5

= 1

DQ7

DATA

YES

Programming Flash memory PSD8XXFX

36/128 Doc ID 7833 Rev 7

any location within the sector being erased to get the Toggle flag bit (DQ6) and the Error flag

bit (DQ5).

PSDsoft Express generates ANSI C code functions which implement these Data Toggling

algorithms.

8.3 Unlock Bypass (PSD833F2x, PSD834F2x, PSD853F2x,

PSD854F2x)

The Unlock Bypass instructions allow the system to program bytes to the Flash memories

faster than using the standard Program instruction. The Unlock Bypass mode is entered by

first initiating two Unlock cycles. This is followed by a third WRITE cycle containing the

Unlock Bypass code, 20h (as shown in Ta b l e 1 0 ).

The Flash memory then enters the Unlock Bypass mode. A two-cycle Unlock Bypass

Program instruction is all that is required to program in this mode. The first cycle in this

instruction contains the Unlock Bypass Program code, A0h. The second cycle contains the

program address and data. Additional data is programmed in the same manner. These

instructions dispense with the initial two Unlock cycles required in the standard Program

instruction, resulting in faster total Flash memory programming.

During the Unlock Bypass mode, only the Unlock Bypass Program and Unlock Bypass

Reset Flash instructions are valid.

To exit the Unlock Bypass mode, the system must issue the two-cycle Unlock Bypass Reset

Flash instruction. The first cycle must contain the data 90h; the second cycle the data 00h.

Addresses are Don’t Care for both cycles. The Flash memory then returns to READ mode.

PSD8XXFX Programming Flash memory

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Figure 7. Data Toggle flowchart

READ

DQ5 & DQ6

START

READ DQ6

FAIL PASS

AI01370B

DQ6

TOGGLE

YES

DQ5

= 1

YES

DQ6

TOGGLE

Erasing Flash memory PSD8XXFX

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9 Erasing Flash memory

9.1 Flash Bulk Erase

The Flash Bulk Erase instruction uses six WRITE operations followed by a READ operation

of the status register, as described in Ta bl e 1 0 . If any byte of the Bulk Erase instruction is

wrong, the Bulk Erase instruction aborts and the device is reset to the Read Flash memory

status.

During a Bulk Erase, the memory status may be checked by reading the Error flag bit (DQ5),

the Toggle flag bit (DQ6), and the Data Polling flag bit (DQ7), as detailed in Section 8:

Programming Flash memory. The Error flag bit (DQ5) returns a '1' if there has been an

Erase Failure (maximum number of Erase cycles have been executed).

It is not necessary to program the memory with 00h because the PSD automatically does

this before erasing to 0FFh.

During execution of the Bulk Erase instruction, the Flash memory does not accept any

instructions.

9.2 Flash Sector Erase

The Sector Erase instruction uses six WRITE operations, as described in Ta b l e 1 0 .

Additional Flash Sector Erase codes and Flash memory sector addresses can be written

subsequently to erase other Flash memory sectors in parallel, without further coded cycles,

if the additional bytes are transmitted in a shorter time than the timeout period of about

100µs. The input of a new Sector Erase code restarts the timeout period.

The status of the internal timer can be monitored through the level of the Erase timeout flag

bit (DQ3). If the Erase timeout flag bit (DQ3) is ’0,’ the Sector Erase instruction has been

received and the timeout period is counting. If the Erase timeout flag bit (DQ3) is '1,' the

timeout period has expired and the PSD is busy erasing the Flash memory sector(s). Before

and during Erase timeout, any instruction other than Suspend Sector Erase and Resume

Sector Erase instructions abort the cycle that is currently in progress, and reset the device

to READ mode. It is not necessary to program the Flash memory sector with 00h as the

PSD does this automatically before erasing (byte = FFh).

During a Sector Erase, the memory status may be checked by reading the Error flag bit

(DQ5), the Toggle flag bit (DQ6), and the Data Polling flag bit (DQ7), as detailed in

Section 8: Programming Flash memory.

During execution of the Erase cycle, the Flash memory accepts only Reset and Suspend

Sector Erase instructions. Erasure of one Flash memory sector may be suspended, in order

to read data from another Flash memory sector, and then resumed.

9.3 Suspend Sector Erase

When a Sector Erase cycle is in progress, the Suspend Sector Erase instruction can be

used to suspend the cycle by writing 0B0h to any address when an appropriate Sector

Select (FS0-FS7 or CSBOOT0-CSBOOT3) is high. (See Ta bl e 1 0 ). This allows reading of

data from another Flash memory sector after the Erase cycle has been suspended.

Suspend Sector Erase is accepted only during an Erase cycle and defaults to READ mode.

PSD8XXFX Erasing Flash memory

Doc ID 7833 Rev 7 39/128

A Suspend Sector Erase instruction executed during an Erase timeout period, in addition to

suspending the Erase cycle, terminates the time out period.

The Toggle flag bit (DQ6) stops toggling when the PSD internal logic is suspended. The

status of this bit must be monitored at an address within the Flash memory sector being

erased. The Toggle flag bit (DQ6) stops toggling between 0.1µs and 15µs after the Suspend

Sector Erase instruction has been executed. The PSD is then automatically set to READ

mode.

If an Suspend Sector Erase instruction was executed, the following rules apply:

●Attempting to read from a Flash memory sector that was being erased outputs invalid

data.

●Reading from a Flash sector that was not being erased is valid.

●The Flash memory cannot be programmed, and only responds to Resume Sector

Erase and Reset Flash instructions (READ is an operation and is allowed).

●If a Reset Flash instruction is received, data in the Flash memory sector that was being

erased is invalid.

9.4 Resume Sector Erase

If a Suspend Sector Erase instruction was previously executed, the erase cycle may be

resumed with this instruction. The Resume Sector Erase instruction consists of writing 030h

to any address while an appropriate Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) is

high. (See Ta b le 1 0 .)

Specific features PSD8XXFX

40/128 Doc ID 7833 Rev 7

10 Specific features

10.1 Flash Memory Sector Protect

Each primary and secondary Flash memory sector can be separately protected against

Program and Erase cycles. Sector Protection provides additional data security because it

disables all program or erase cycles. This mode can be activated through the JTAG port or a

device programmer.

Sector protection can be selected for each sector using the PSDsoft Express Configuration

program. This automatically protects selected sectors when the device is programmed

through the JTAG port or a device programmer. Flash memory sectors can be unprotected

to allow updating of their contents using the JTAG port or a device programmer. The MCU

can read (but cannot change) the sector protection bits.

Any attempt to program or erase a protected Flash memory sector is ignored by the device.

The Verify operation results in a READ of the protected data. This allows a guarantee of the

retention of the Protection status.

The sector protection status can be read by the MCU through the Flash memory protection

and PSD/EE protection registers (in the CSIOP block). See Ta b l e 1 2 and Ta b le 1 3 .

10.2 Reset Flash

The Reset Flash instruction consists of one WRITE cycle (see Ta bl e 1 0 ). It can also be

optionally preceded by the standard two WRITE decoding cycles (writing AAh to 555h and

55h to AAAh). It must be executed after:

●Reading the Flash Protection Status or Flash ID

●An Error condition has occurred (and the device has set the Error flag bit (DQ5) to '1')

during a Flash memory program or erase cycle.

On the PSD813F2/3/4/5, the Reset Flash instruction puts the Flash memory back into

normal READ mode. It may take the Flash memory up to a few milliseconds to complete the

Reset cycle. The Reset Flash instruction is ignored when it is issued during a Program or

Bulk Erase cycle of the Flash memory. The Reset Flash instruction aborts any on-going

Sector Erase cycle, and returns the Flash memory to the normal READ mode within a few

milliseconds.

On the PSD83xF2 or PSD85xF2, the Reset Flash instruction puts the Flash memory back

into normal READ mode. If an Error condition has occurred (and the device has set the

Error flag bit (DQ5) to '1') the Flash memory is put back into normal READ mode within 25μs

of the Reset Flash instruction having been issued. The Reset Flash instruction is ignored

when it is issued during a Program or Bulk Erase cycle of the Flash memory. The Reset

Flash instruction aborts any on-going Sector Erase cycle, and returns the Flash memory to

the normal READ mode within 25μs.

PSD8XXFX Specific features

Doc ID 7833 Rev 7 41/128

10.3 Reset (RESET) signal (on the PSD83xF2 and PSD85xF2)

A pulse on Reset (RESET) aborts any cycle that is in progress, and resets the Flash

memory to the READ mode. When the reset occurs during a program or erase cycle, the

Flash memory takes up to 25μs to return to the READ mode. It is recommended that the

Reset (RESET) pulse (except for Power On Reset, as described in Section 18: Reset timing

and device status at reset) be at least 25 µs so that the Flash memory is always ready for

the MCU to fetch the bootstrap instructions after the Reset cycle is complete.

Table 12. Sector Protection/Security Bit definition – Flash Protection register(1)

1. Bit Definitions:

Sec_Prot 1 = Primary Flash memory or secondary Flash memory Sector is write protected.

Sec_Prot 0 = Primary Flash memory or secondary Flash memory Sector is not write protected.

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Sec7_Prot Sec6_Prot Sec5_Prot Sec4_Prot Sec3_Prot Sec2_Prot Sec1_Prot Sec0_Prot

Table 13. Sector Protection/Security Bit definition – PSD/EE Protection register(1)

1. Bit Definitions:

Sec_Prot 1 = Secondary Flash memory Sector is write protected.

Sec_Prot 0 = Secondary Flash memory Sector is not write protected.

Security_Bit 0 = Security Bit in device has not been set.

1 = Security Bit in device has been set.

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Security_B

it not used not used not used Sec3_Prot Sec2_Prot Sec1_Prot Sec0_Prot

SRAM PSD8XXFX

42/128 Doc ID 7833 Rev 7

11 SRAM

The SRAM is enabled when SRAM Select (RS0) from the DPLD is high. SRAM Select

(RS0) can contain up to two product terms, allowing flexible memory mapping.

SRAM Select (RS0) is configured using PSDsoft Express Configuration.

PSD8XXFX Sector Select and SRAM Select

Doc ID 7833 Rev 7 43/128

12 Sector Select and SRAM Select

Sector Select (FS0-FS7, CSBOOT0-CSBOOT3) and SRAM Select (RS0) are all outputs of

the DPLD. They are setup by writing equations for them in PSDabel. The following rules

apply to the equations for these signals:

1. Primary Flash memory and secondary Flash memory Sector Select signals must not

be larger than the physical sector size.

2. Any primary Flash memory sector must not be mapped in the same memory space as

another Flash memory sector.

3. A secondary Flash memory sector must not be mapped in the same memory space as

another secondary Flash memory sector.

4. SRAM, I/O, and Peripheral I/O spaces must not overlap.

5. A secondary Flash memory sector may overlap a primary Flash memory sector. In

case of overlap, priority is given to the secondary Flash memory sector.

6. SRAM, I/O, and Peripheral I/O spaces may overlap any other memory sector. Priority is

given to the SRAM, I/O, or Peripheral I/O.

12.1 Example

FS0 is valid when the address is in the range of 8000h to BFFFh, CSBOOT0 is valid from

8000h to 9FFFh, and RS0 is valid from 8000h to 87FFh. Any address in the range of RS0

always accesses the SRAM. Any address in the range of CSBOOT0 greater than 87FFh

(and less than 9FFFh) automatically addresses secondary Flash memory segment 0. Any

address greater than 9FFFh accesses the primary Flash memory segment 0. You can see

that half of the primary Flash memory segment 0 and one-fourth of secondary Flash

memory segment 0 cannot be accessed in this example. Also note that an equation that

defined FS1 to anywhere in the range of 8000h to BFFFh would not be valid.

Figure 8 shows the priority levels for all memory components. Any component on a higher

level can overlap and has priority over any component on a lower level. Components on the

same level must not overlap. Level one has the highest priority and level 3 has the lowest.

12.2 Memory select configuration for MCUs with separate

program and data spaces

The 8031 and compatible family of MCUs, which includes the 80C51, 80C151, 80C251, and

80C51XA, have separate address spaces for program memory (selected using Program

Select Enable (PSEN, CNTL2)) and data memory (selected using Read Strobe (RD,

CNTL1)). Any of the memories within the PSD can reside in either space or both spaces.

This is controlled through manipulation of the VM register that resides in the CSIOP space.

The VM register is set using PSDsoft Express to have an initial value. It can subsequently

be changed by the MCU so that memory mapping can be changed on-the-fly.

For example, you may wish to have SRAM and primary Flash memory in the data space at

Boot-up, and secondary Flash memory in the program space at Boot-up, and later swap the

primary and secondary Flash memories. This is easily done with the VM register by using

Sector Select and SRAM Select PSD8XXFX

44/128 Doc ID 7833 Rev 7

PSDsoft Express Configuration to configure it for Boot-up and having the MCU change it

when desired. Ta bl e 1 4 describes the VM register.

Figure 8. Priority level of memory and I/O components

12.3 Configuration modes for MCUs with separate program and

data spaces

12.3.1 Separate Space modes

Program space is separated from data space. For example, Program Select Enable (PSEN,

CNTL2) is used to access the program code from the primary Flash memory, while Read

Strobe (RD, CNTL1) is used to access data from the secondary Flash memory, SRAM and

I/O port blocks. This configuration requires the VM register to be set to 0Ch (see Figure 9).

12.3.2 Combined Space modes

The program and data spaces are combined into one memory space that allows the primary

Flash memory, secondary Flash memory, and SRAM to be accessed by either Program

Select Enable (PSEN, CNTL2) or Read Strobe (RD, CNTL1). For example, to configure the

primary Flash memory in Combined space, Bits b2 and b4 of the VM register are set to '1'

(see Figure 10).

Figure 9. 8031 memory modules – separate space

Level 1

SRAM, I/O, or

Peripheral I/O

Level 2

Secondary

Non-Volatile Memory

Highest Priority

Lowest Priority

Level 3

Primary Flash Memory

AI02867D

Primary

Flash

Memory

DPLD Secondary

Flash

Memory

SRAM

RS0

CSBOOT0-3

FS0-FS7 CS CSCS

OE OE

PSEN

AI02869C

PSD8XXFX Sector Select and SRAM Select

Doc ID 7833 Rev 7 45/128

Figure 10. 8031 memory modules – combined space

Primary

Flash

Memory

DPLD Secondary

Flash

Memory

SRAM

RS0

CSBOOT0-3

FS0-FS7

CS CSCS

OE OE

VM REG BIT 2

PSEN

VM REG BIT 0

VM REG BIT 1

VM REG BIT 3

VM REG BIT 4

AI02870C

Table 14. VM register

Bit 7

PIO_EN Bit 6 Bit 5

Bit 4

Primary

FL_Data

Bit 3

econdary

EE_Data

Bit 2

Primary

FL_Code

Bit 1

Secondary

EE_Code

Bit 0

SRAM_Code

0 = disable

PIO mode

not

used

not

used

0 = RD

cannot access

Flash memory

0 = RD can’t

access

secondary Flash

memory

0 = PSEN

cannot

access

Flash

memory

0 = PSEN can’t

access

secondary Flash

memory

0 = PSEN

cannot

access

SRAM

1= enable

PIO mode

not

used

not

used

1 = RD

access Flash

memory

1 = RD access

secondary Flash

memory

1 = PSEN

access

Flash

memory

1 = PSEN access

secondary Flash

memory

1 = PSEN

access

SRAM

Page register PSD8XXFX

46/128 Doc ID 7833 Rev 7

13 Page register

The 8-bit Page register increases the addressing capability of the MCU by a factor of up to

256. The contents of the register can also be read by the MCU. The outputs of the Page

Select (FS0-FS7, CSBOOT0-CSBOOT3), and SRAM Select (RS0) equations.

If memory paging is not needed, or if not all 8 page register bits are needed for memory

paging, then these bits may be used in the CPLD for general logic. See Application Note

AN1154.

Figure 11 shows the Page register. The eight flip-flops in the register are connected to the

internal data bus D0-D7. The MCU can write to or read from the Page register. The Page

Figure 11. Page register

RESET

D0-D7

R/W

D0 Q0

PAGE

PGR0

PGR1

PGR2

PGR3 DPLD

AND

CPLD

INTERNAL

SELECTS

AND LOGIC

PLD

PGR4

PGR5

PGR6

PGR7

AI02871B

PSD8XXFX PLDS

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14 PLDS

The PLDs bring programmable logic functionality to the PSD. After specifying the logic for

the PLDs using the PSDabel tool in PSDsoft Express, the logic is programmed into the

device and available upon Power-up.

The PSD contains two PLDs: the Decode PLD (DPLD), and the Complex PLD (CPLD). The

PLDs are briefly discussed in the next few paragraphs, and in more detail in Section 14.2:

Decode PLD (DPLD), and Section 14.3: Complex PLD (CPLD). Figure 12 shows the

configuration of the PLDs.

The DPLD performs address decoding for Select signals for internal components, such as

memory, registers, and I/O ports.

The CPLD can be used for logic functions, such as loadable counters and shift registers,

state machines, and encoding and decoding logic. These logic functions can be constructed

using the 16 Output macrocells (OMC), 24 input macrocells (IMC), and the AND Array. The

CPLD can also be used to generate External Chip Select (ECS0-ECS2) signals.

The AND Array is used to form product terms. These product terms are specified using

PSDabel. An input bus consisting of 73 signals is connected to the PLDs. The signals are

shown in Tab l e 1 5 .

14.1 The Turbo Bit in PSD

The PLDs in the PSD can minimize power consumption by switching off when inputs remain

unchanged for an extended time of about 70ns. Resetting the Turbo Bit to '0' (Bit 3 of

PMMR0) automatically places the PLDs into standby if no inputs are changing. Turning the

Turbo mode off increases propagation delays while reducing power consumption. See

Section 17: Power management on how to set the Turbo Bit.

Additionally, five bits are available in PMMR2 to block MCU control signals from entering the

PLDs. This reduces power consumption and can be used only when these MCU control

signals are not used in PLD logic equations.

Each of the two PLDs has unique characteristics suited for its applications. They are

described in the following sections.

Table 15. DPLD and CPLD inputs

Input source Input name Number of

signals

MCU address bus(1) A15-A0 16

MCU control signals CNTL2-CNTL0 3

Reset RST 1

Power-down PDN 1

Port A input macrocells PA7-PA0 8

Port B input macrocells PB7-PB0 8

Port C input macrocells PC7-PC0 8

Port D inputs PD2-PD0 3

PLDS PSD8XXFX

48/128 Doc ID 7833 Rev 7

Page register PGR7-PGR0 8

Macrocell AB feedback MCELLAB.FB7-FB0 8

Macrocell BC feedback MCELLBC.FB7-FB0 8

Secondary Flash memory Program Status

Bit Ready/Busy 1

1. The address inputs are A19-A4 in 80C51XA mode.

Table 15. DPLD and CPLD inputs (continued)

Input source Input name Number of

signals

PSD8XXFX PLDS

Doc ID 7833 Rev 7 49/128

Figure 12. PLD diagram

PLD INPUT BUS

INPUT MACROCELL & INPUT PORTS

DIRECT MACROCELL INPUT TO MCU DATA BUS

CSIOP SELECT

SRAM SELECT

SECONDARY NON-VOLATILE MEMORY SELECTS

DECODE PLD

PAGE

PERIPHERAL SELECTS

JTAG SELECT

CPLD

ALLOC.

MACROCELL

ALLOC.

MCELLAB

MCELLBC

DIRECT MACROCELL ACCESS FROM MCU DATA BUS

24 INPUT MACROCELL

(PORT A,B,C)

16 OUTPUT

MACROCELL

I/O PORTS

PRIMARY FLASH MEMORY SELECTS

3PORT D INPUTS

TO PORT A OR B

TO PORT B OR C

DATA

BUS

EXTERNAL CHIP SELECTS

TO PORT D

OUTPUT MACROCELL FEEDBACK

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14.2 Decode PLD (DPLD)

The DPLD, shown in Figure 13, is used for decoding the address for internal and external

components. The DPLD can be used to generate the following decode signals:

●8 Sector Select (FS0-FS7) signals for the primary Flash memory (three product terms

each)

●4 Sector Select (CSBOOT0-CSBOOT3) signals for the secondary Flash memory (three

product terms each)

●1 internal SRAM Select (RS0) signal (two product terms)

●1 internal CSIOP Select (PSD Configuration register) signal

●1 JTAG Select signal (enables JTAG on port C)

●2 internal Peripheral Select signals

(Peripheral I/O mode).

Figure 13. DPLD logic array

(INPUTS)

(24)

(8)

(16)

(1)

PDN (APD OUTPUT)

I /O PORTS (PORT A,B,C)

(8)

PGR0 -PGR7

(8)

MCELLAB.FB [7:0] (FEEDBACKS)

MCELLBC.FB [7:0] (FEEDBACKS)

A[15:0]*

(3)

PD[2:0] (ALE,CLKIN,CSI)

CNTRL[2:0] (READ/WRITE CONTROL SIGNALS)

(1)

RESET

RD_BSY

RS0

CSIOP

PSEL0

PSEL1

8 PRIMARY FLASH

MEMORY SECTOR SELECTS

SRAM SELECT

I/O DECODER

SELECT

PERIPHERAL I/O MODE

SELECT

CSBOOT 0

CSBOOT 1

CSBOOT 2

CSBOOT 3

FS0

FS7

JTAGSEL

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FS1

FS2

FS3

FS6

FS5

FS4

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14.3 Complex PLD (CPLD)

The CPLD can be used to implement system logic functions, such as loadable counters and

shift registers, system mailboxes, handshaking protocols, state machines, and random logic.

The CPLD can also be used to generate three External Chip Select (ECS0-ECS2), routed to

port D.

Although External Chip Select (ECS0-ECS2) can be produced by any Output macrocell

(OMC), these three External Chip Select (ECS0-ECS2) on port D do not consume any

Output macrocells (OMC).

As shown in Figure 12, the CPLD has the following blocks:

●24 input macrocells (IMC)

●16 Output macrocells (OMC)

●Macrocell Allocator

●Product Term Allocator

●AND Array capable of generating up to 137 product terms

●Four I/O ports.

Each of the blocks are described in the sections that follow.

The input macrocells (IMC) and Output macrocells (OMC) are connected to the PSD

internal data bus and can be directly accessed by the MCU. This enables the MCU software

to load data into the Output macrocells (OMC) or read data from both the input and Output

macrocells (IMC and OMC).

This feature allows efficient implementation of system logic and eliminates the need to

connect the data bus to the AND Array as required in most standard PLD macrocell

architectures.

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Figure 14. Macrocell and I/O port

I/O PORTS

CPLD MACROCELLS

INPUT MACROCELLS

LATCHED

ADDRESS OUT

MUX

MUX MUX

PDR

DATA

PRODUCT TERM

ALLOCATOR

DIR

REG.

SELECT

INPUT

PRODUCT TERMS

FROM OTHER

MACROCELLS

POLARITY

SELECT

UP TO 10

PRODUCT TERMS

CLOCK

SELECT

PR DI LD

D/T

D/T/JK FF

SELECT

PT CLEAR

CLOCK

GLOBAL

CLOCK

PT OUTPUT ENABLE (OE)

MACROCELL FEEDBACK

I/O PORT INPUT

ALE/AS

PT INPUT LATCH GATE/CLOCK

MCU LOAD

PT PRESET

MCU DATA IN

COMB.

/REG

SELECT MACROCELL

I/O PORT

ALLOC.

CPLD

OUTPUT

TO OTHER I/O PORTS

PLD INPUT BUSPLD INPUT BUS

MCU ADDRESS / DATA BUS

MACROCELL

OUT TO

MCU

DATA

LOAD

CONTROL

AND ARRAY

CPLD OUTPUT

I/O PIN

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14.4 Output macrocell (OMC)

Eight of the Output macrocells (OMC) are connected to ports A and B pins and are named

as McellAB0-McellAB7. The other eight macrocells are connected to ports B and C pins and

are named as McellBC0-McellBC7. If an McellAB output is not assigned to a specific pin in

PSDabel, the macrocell Allocator block assigns it to either port A or B. The same is true for

a McellBC output on port B or C. Ta b l e 1 6 shows the macrocells and port assignment.

The Output macrocell (OMC) architecture is shown in Figure 15. As shown in the figure,

there are native product terms available from the AND Array, and borrowed product terms

available (if unused) from other Output macrocells (OMC). The polarity of the product term

is controlled by the XOR gate. The Output macrocell (OMC) can implement either sequential

logic, using the flip-flop element, or combinatorial logic. The multiplexer selects between the

sequential or combinatorial logic outputs. The multiplexer output can drive a port pin and

has a feedback path to the AND Array inputs.

The flip-flop in the Output macrocell (OMC) block can be configured as a D, T, JK, or SR

type in the PSDabel program. The flip-flop’s clock, preset, and clear inputs may be driven

from a product term of the AND Array. Alternatively, CLKIN (PD1) can be used for the clock

input to the flip-flop. The flip-flop is clocked on the rising edge of CLKIN (PD1). The preset

and clear are active high inputs. Each clear input can use up to two product terms.

Table 16. Output macrocell port and data bit assignments

Output

macrocell

Port

assignment

Native product

terms

Maximum

borrowed product

terms

Data bit for loading

or reading

McellAB0 Port A0, B0 3 6 D0

McellAB1 Port A1, B1 3 6 D1

McellAB2 Port A2, B2 3 6 D2

McellAB3 Port A3, B3 3 6 D3

McellAB4 Port A4, B4 3 6 D4

McellAB5 Port A5, B5 3 6 D5

McellAB6 Port A6, B6 3 6 D6

McellAB7 Port A7, B7 3 6 D7

McellBC0 Port B0, C0 4 5 D0

McellBC1 Port B1, C1 4 5 D1

McellBC2 Port B2, C2 4 5 D2

McellBC3 Port B3, C3 4 5 D3

McellBC4 Port B4, C4 4 6 D4

McellBC5 Port B5, C5 4 6 D5

McellBC6 Port B6, C6 4 6 D6

McellBC7 Port B7, C7 4 6 D7

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14.5 Product Term Allocator

The CPLD has a Product Term Allocator. The PSDabel compiler uses the Product Term

Allocator to borrow and place product terms from one macrocell to another. The following list

summarizes how product terms are allocated:

●McellAB0-McellAB7 all have three native product terms and may borrow up to six more

●McellBC0-McellBC3 all have four native product terms and may borrow up to five more

●McellBC4-McellBC7 all have four native product terms and may borrow up to six more.

Each macrocell may only borrow product terms from certain other macrocells. Product

terms already in use by one macrocell are not available for another macrocell.

If an equation requires more product terms than are available to it, then “external” product

terms are required, which consume other Output macrocells (OMC). If external product

terms are used, extra delay is added for the equation that required the extra product terms.

This is called product term expansion. PSDsoft Express performs this expansion as needed.

14.6 Loading and reading the Output macrocells (OMC)

The Output macrocells (OMC) block occupies a memory location in the MCU address

space, as defined by the CSIOP block (see Section 16: I/O ports). The flip-flops in each of

the 16 Output macrocells (OMC) can be loaded from the data bus by a MCU. Loading the

Output macrocells (OMC) with data from the MCU takes priority over internal functions. As

such, the preset, clear, and clock inputs to the flip-flop can be overridden by the MCU. The

ability to load the flip-flops and read them back is useful in such applications as loadable

counters and shift registers, mailboxes, and handshaking protocols.

Data can be loaded to the Output macrocells (OMC) on the trailing edge of Write Strobe

(WR, CNTL0) (edge loading) or during the time that Write Strobe (WR, CNTL0) is active

(level loading). The method of loading is specified in PSDsoft Express Configuration.

14.7 The OMC Mask register

There is one Mask register for each of the two groups of eight Output macrocells (OMC).

The Mask registers can be used to block the loading of data to individual Output macrocells

(OMC). The default value for the Mask registers is 00h, which allows loading of the Output

macrocells (OMC). When a given bit in a Mask register is set to a 1, the MCU is blocked

from writing to the associated Output macrocells (OMC). For example, suppose McellAB0-

McellAB3 are being used for a state machine. You would not want a MCU write to McellAB

to overwrite the state machine registers. Therefore, you would want to load the Mask

14.8 The Output Enable of the OMC

The Output macrocells (OMC) block can be connected to an I/O port pin as a PLD output.

The output enable of each port pin driver is controlled by a single product term from the

AND Array, ORed with the Direction register output. The pin is enabled upon Power-up if no

output enable equation is defined and if the pin is declared as a PLD output in PSDsoft

Express.

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If the Output macrocell (OMC) output is declared as an internal node and not as a port pin

output in the PSDabel file, the port pin can be used for other I/O functions. The internal node

feedback can be routed as an input to the AND Array.

Figure 15. CPLD Output macrocell

ALLOCATOR

MASK

REG.

PT CLK

CLKIN

FEEDBACK (.FB)

PORT INPUT

AND ARRAY

PLD INPUT BUS

MUX

POLARITY

SELECT

CLR

PRDIN

COMB/REG

SELECT

PORT

DRIVER

INPUT

MACROCELL

I/O PIN

MACROCELL

ALLOCATOR

INTERNAL DATA BUS D[7:0]

DIRECTION

CLEAR (.RE)

PROGRAMMABLE

FF (D/ T/JK /SR)

ENABLE (.OE)

PRESET(.PR)

MACROCELL CS

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14.9 Input macrocells (IMC)

The CPLD has 24 input macrocells (IMC), one for each pin on ports A, B, and C. The

architecture of the input macrocells (IMC) is shown in Figure 16. The input macrocells (IMC)

are individually configurable, and can be used as a latch, register, or to pass incoming port

signals prior to driving them onto the PLD input bus. The outputs of the input macrocells

(IMC) can be read by the MCU through the internal data bus.

The enable for the latch and clock for the register are driven by a multiplexer whose inputs

are a product term from the CPLD AND Array or the MCU Address Strobe (ALE/AS). Each

product term output is used to latch or clock four input macrocells (IMC). port inputs 3-0 can

be controlled by one product term and 7-4 by another.

Configurations for the input macrocells (IMC) are specified by equations written in PSDabel

(see Application Note AN1171). outputs of the input macrocells (IMC) can be read by the

MCU via the IMC buffer (see Section 16: I/O ports).

Input macrocells (IMC) can use Address Strobe (ALE/AS, PD0) to latch address bits higher

than A15. Any latched addresses are routed to the PLDs as inputs.

Input macrocells (IMC) are particularly useful with handshaking communication applications

where two processors pass data back and forth through a common mailbox. Figure 17

shows a typical configuration where the Master MCU writes to the port A Data Out register.

This, in turn, can be read by the Slave MCU via the activation of the “Slave-Read” output

enable product term.

The Slave can also write to the port A input macrocells (IMC) and the Master can then read

the input macrocells (IMC) directly.

Note that the “Slave-Read” and “Slave-Wr” signals are product terms that are derived from

the Slave MCU inputs Read Strobe (RD, CNTL1), Write Strobe (WR, CNTL0), and

Slave_CS.

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Figure 16. Input macrocell

OUTPUT

MACROCELLS BC

AND

MACROCELL AB

FEEDBACK

AND ARRAY

PLD INPUT BUS

PORT

DRIVER

I/O PIN

INTERNAL DATA BUS D[7:0]

DIRECTION

MUX

ALE/AS

LATCH INPUT MACROCELL

ENABLE (.OE)

D FF

INPUT MACROCELL _ RD

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Figure 17. Handshaking communication using input macrocells

MASTER

MCU

MCU-RD

MCU-WR

SLAVE–WR

SLAVE – CS

MCU-WR

D[7:0]

CPLD DQ

PORT A

DATA OUT

PORT A

INPUT

MACROCELL

PORT A

SLAVE–READ

SLAVE

MCU

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15 MCU bus interface

The “no-glue logic” MCU bus interface block can be directly connected to most popular

MCUs and their control signals. Key 8-bit MCUs, with their bus types and control signals, are

shown in Tab l e 1 7 . The interface type is specified using the PSDsoft Express Configuration.

Table 17. MCUs and their control signals

MCU Data bus

width CNTL0 CNTL1 CNTL2 PC7 PD0(1) ADIO0 PA3-PA0 PA7-PA3

8031 8 WR RD PSEN (2) ALE A0 (2) (2)

80C51XA 8 WR RD PSEN (2) ALE A4 A3-A0 (2)

80C251 8 WR PSEN (2) (2) ALE A0 (2) (2)

80C251 8 WR RD PSEN (2) ALE A0 (2) (2)

80198 8 WR RD (2) (2) ALE A0 (2) (2)

68HC11 8 R/W E(2) (2) AS A0 (2) (2)

68HC912 8 R/W E(2) DBE AS A0 (2) (2)

Z80 8 WR RD (2) (2) (2) A0 D3-D0 D7-D4

Z8 8 R/W DS (2) (2) AS A0 (2) (2)

68330 8 R/W DS (2) (2) AS A0 (2) (2)

M37702M2 8 R/W E(2) (2) ALE A0 D3-D0 D7-D4

1. ALE/AS input is optional for MCUs with a non-multiplexed bus

2. Unused CNTL2 pin can be configured as CPLD input. Other unused pins (PC7, PD0, PA3-0) can be configured for other

I/O functions.

MCU bus interface PSD8XXFX

60/128 Doc ID 7833 Rev 7

15.1 PSD interface to a multiplexed 8-bit bus

Figure 18 shows an example of a system using a MCU with an 8-bit multiplexed bus and a

PSD. The ADIO port on the PSD is connected directly to the MCU address/data bus.

Address Strobe (ALE/AS, PD0) latches the address signals internally. Latched addresses

can be brought out to port A or B. The PSD drives the ADIO data bus only when one of its

internal resources is accessed and Read Strobe (RD, CNTL1) is active. Should the system

address bus exceed sixteen bits, ports A, B, C, or D may be used as additional address

inputs.

Figure 18. An example of a typical 8-bit multiplexed bus interface

15.2 PSD interface to a non-multiplexed 8-bit bus

Figure 19 shows an example of a system using a MCU with an 8-bit non-multiplexed bus

and a PSD. The address bus is connected to the ADIO port, and the data bus is connected

to port A. port A is in tri-state mode when the PSD is not accessed by the MCU. Should the

system address bus exceed sixteen bits, ports B, C, or D may be used for additional address

inputs.

15.3 Data Byte Enable reference

MCUs have different data byte orientations. Ta bl e 1 8 shows how the PSD interprets

byte/word operations in different bus WRITE configurations. Even-byte refers to locations

with address A0 equal to '0' and odd byte as locations with A0 equal to ’1.’

MCU

BHE

ALE

RESET

AD[7:0]

A[15:8]

A[7: 0]

ADIO

PORT

WR (CNTRL0)

RD (CNTRL1)

BHE (CNTRL2)

RST

ALE (PD0)

PORT D

(OPTIONAL)

PSD

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15.4 MCU bus interface examples

Figure 20, Figure 21, Figure 22, Figure 23, and Figure 24 show examples of the basic

connections between the PSD and some popular MCUs. The PSD Control input pins are

labeled as to the MCU function for which they are configured. The MCU bus interface is

specified using the PSDsoft Express Configuration.

Figure 19. An example of a typical 8-bit non-multiplexed bus interface

Table 18. 8-bit data bus

BHE A0 D7-D0

X 0 Even byte

X 1 Odd byte

MCU

BHE

ALE

RESET

D[7:0]

A[15:0]

A[23:16]

D[7:0]

ADIO

PORT

WR (CNTRL0)

RD (CNTRL1)

BHE (CNTRL2)

RST

ALE (PD0)

PORT D

(OPTIONAL)

PSD

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15.5 80C31

Figure 20 shows the bus interface for the 80C31, which has an 8-bit multiplexed

address/data bus. The lower address byte is multiplexed with the data bus. The MCU control

signals Program Select Enable (PSEN, CNTL2), Read Strobe (RD, CNTL1), and Write

Strobe (WR, CNTL0) may be used for accessing the internal memory and I/O ports blocks.

Address Strobe (ALE/AS, PD0) latches the address.

Figure 20. Interfacing the PSD with an 80C31

EA/VP

RESET

INT0

INT1

P1.0

P1.1

P1.2

P1.3

P1.4

P1.5

P1.6

P1.7

P0.0

P0.1

P0.2

P0.3

P0.4

P0.5

P0.6

P0.7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PC0

PC2

PC1

PC3

PC4

PC5

PC6

PC7

P2.0

P2.1

P2.2

P2.3

P2.4

P2.5

P2.6

P2.7

ADIO0

ADIO1

ADIO2

ADIO3

ADIO4

ADIO5

ADIO6

ADIO7

ADIO8

ADIO9

ADIO10

ADIO11

ADIO12

ADIO13

ADIO14

ADIO15

CNTL0 (WR)

CNTL1(RD)

CNTL2(PSEN)

PD0-ALE

PD1

PD2

RESET

PSEN

ALE/P

TXD

RXD

RESET

AD0

AD1

AD2

AD3

AD4

AD5

AD6

AD7

AD0

AD1

AD2

AD3

AD4

AD5

AD6

AD7

PSD

80C31

AD7-AD0

AD[7:0]

A10

A11

A12

A13

A14

A15

PSEN

ALE

RESET

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15.6 80C251

The Intel 80C251 MCU features a user-configurable bus interface with four possible bus

configurations, as shown in Ta b le 1 9 .

The first configuration is 80C31-compatible, and the bus interface to the PSD is identical to

that shown in Figure 20. The second and third configurations have the same bus connection

as shown in Figure 21. There is only one Read Strobe (PSEN) connected to CNTL1 on the

PSD. The A16 connection to PA0 allows for a larger address input to the PSD. The fourth

configuration is shown in Figure 22. Read Strobe (RD) is connected to CNTL1 and Program

Select Enable (PSEN) is connected to CNTL2.

The 80C251 has two major operating modes: Page mode and Non-page mode. In Non-

page mode, the data is multiplexed with the lower address byte, and Address Strobe

(ALE/AS, PD0) is active in every bus cycle. In Page mode, data (D7-D0) is multiplexed with

address (A15-A8). In a bus cycle where there is a Page hit, Address Strobe (ALE/AS, PD0)

is not active and only addresses (A7-A0) are changing. The PSD supports both modes. In

Page mode, the PSD bus timing is identical to Non-Page mode except the address hold time

and setup time with respect to Address Strobe (ALE/AS, PD0) is not required. The PSD

access time is measured from address (A7-A0) valid to data in valid.

Figure 21. Interfacing the PSD with the 80C251, with One READ input

1. The A16 and A17 connections are optional.

2. In non-Page-mode, AD7-AD0 connects to ADIO7-ADIO0.

ADIO0

ADIO1

ADIO2

ADIO3

ADIO4

ADIO5

ADIO6

ADIO7

ADIO8

ADIO9

ADIO10

ADIO11

ADIO12

ADIO13

ADIO14

ADIO15

CNTL0 (WR)

CNTL1(RD)

CNTL 2(PSEN)

PD0-ALE

PD1

PD2

RESET

AD8

AD9

AD10

AD14

AD15

AD13

AD11

AD12

AD8

AD9

AD10

AD11

AD15

ALE

A16

AD14

AD12

AD13

P1.0

P1.1

P1.2

P1.3

P1.4

P1.5

P1.6

P1.7

P3.0/RXD

P3.1/TXD

P3.2/INT0

P3.3/INT1

RST

A161

P0.1

P0.0

P0.2

P0.3

P0.4

P0.5

P0.6

P0.7

P2.0

P2.1

P2.2

P2.3

P2.4

P2.5

P2.6

P2.7

ALE

PSEN

RD/A16

PC0

PC1

PC3

PC4

PC5

PC6

PC7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

80C251SB PSD

RESET

P3.4/T0

P3.5/T1

RESET

PC2

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Figure 22. Interfacing the PSD with the 80C251, with RD and PSEN inputs

ADIO0

ADIO1

ADIO2

ADIO3

ADIO4

ADIO5

ADIO6

ADIO7

ADIO8

ADIO9

ADIO10

ADIO11

ADIO12

ADIO13

ADIO14

ADIO15

CNTL0 (WR)

CNTL1(RD)

CNTL 2(PSEN)

PD0-ALE

PD1

PD2

RESET

AD8

AD9

AD10

AD14

AD15

AD13

AD11

AD12

AD8

AD9

AD10

AD11

AD15

ALE

PSEN

AD14

AD12

AD13

P1.0

P1.1

P1.2

P1.3

P1.4

P1.5

P1.6

P1.7

P3.0/RXD

P3.1/TXD

P3.2/INT0

P3.3/INT1

RST

P0.1

P0.0

P0.2

P0.3

P0.4

P0.5

P0.6

P0.7

P2.0

P2.1

P2.2

P2.3

P2.4

P2.5

P2.6

P2.7

ALE

PSEN

RD/A16

PC0

PC1

PC3

PC4

PC5

PC6

PC7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

80C251SB PSD

RESET

P3.4/T0

P3.5/T1

RESET

PC2

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Table 19. 80C251 configurations

Configuration 80C251 READ/WRITE

pins Connecting to PSD pins Page mode

PSEN

CNTL0

CNTL1

CNTL2

Non-Page mode, 80C31 compatible

A7-A0 multiplex with D7-D0

2 WR

PSEN only

CNTL0

CNTL1

Non-Page mode

A7-A0 multiplex with D7-D0

3 WR

PSEN only

CNTL0

CNTL1

Page mode

A15-A8 multiplex with D7-D0

PSEN

CNTL0

CNTL1

CNTL2

Page mode

A15-A8 multiplex with D7-D0

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15.7 80C51XA

The Philips 80C51XA MCU family supports an 8- or 16-bit multiplexed bus that can have

burst cycles. Address bits (A3-A0) are not multiplexed, while (A19-A4) are multiplexed with

data bits (D15-D0) in 16-bit mode. In 8-bit mode, (A11-A4) are multiplexed with data bits

(D7-D0).

The 80C51XA can be configured to operate in eight-bit data mode (as shown in Figure 23).

The 80C51XA improves bus throughput and performance by executing burst cycles for code

fetches. In Burst mode, address A19-A4 are latched internally by the PSD, while the

80C51XA changes the A3-A0 signals to fetch up to 16 bytes of code. The PSD access time

is then measured from address A3-A0 valid to data in valid. The PSD bus timing

requirement in Burst mode is identical to the normal bus cycle, except the address setup

and hold time with respect to Address Strobe (ALE/AS, PD0) does not apply.

Figure 23. Interfacing the PSD with the 80C51X, 8-bit data bus

ADIO0

ADIO1

ADIO2

ADIO3

AD104

AD105

ADIO6

ADIO7

ADIO8

ADIO9

ADIO10

ADIO11

AD1012

AD1013

ADIO14

ADIO15

CNTL0 (WR)

CNTL1(RD)

CNTL 2(PSEN)

PD0-ALE

PD1

PD2

RESET

A4D0

A5D1

A6D2

A7D3

A8D4

A9D5

A10D6

A11D7

A12

A13

A14

A18

A19

A17

A15

A16

A4D0

A5D1

A6D2

A7D3

A8D4

A9D5

A10D6

A11D7

A12

A16

A17

A18

A19

A15

A13

A14

TXD1

T2EX

RST

EA/WAIT

BUSW

A0/WRH

A4D0

A5D1

A6D2

A7D3

A8D4

A9D5

A10D6

A11D7

A12D8

A13D9

A14D10

A15D11

A16D12

A17D13

A18D14

A19D15

PSEN

WRL

PC0

PC1

PC3

PC4

PC5

PC6

PC7

ALE

PSEN

ALE

XTAL1

XTAL2

RXD0

TXD0

RXD1

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

80C51XA PSD

RESET

INT0

INT1

PC2

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15.8 68HC11

Figure 24 shows a bus interface to a 68HC11 where the PSD is configured in 8-bit

multiplexed mode with E and R/W settings. The DPLD can be used to generate the READ

and WR signals for external devices.

Figure 24. Interfacing the PSD with a 68HC11

ADIO0

ADIO1

ADIO2

ADIO3

AD104

AD105

ADIO6

ADIO7

ADIO8

ADIO9

ADIO10

ADIO11

AD1012

AD1013

ADIO14

ADIO15

CNTL0 (R_W)

CNTL1(E)

CNTL 2

PD0–AS

PD1

PD2

RESET

AD0

AD1

AD2

AD3

AD4

AD5

AD6

AD7

A10

A14

A15

A13

A11

A12

AD1

AD2

AD3

AD4

AD5

AD6

AD7

R/W

RESET

IRQ

XIRQ

PA0

PA1

PA2

PE0

PE1

PE2

PE3

PE4

PE5

PE6

PE7

VRH

VRL

PA3

PA4

PA5

PA6

PA7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PC0

PC1

PC3

PC4

PC5

PC6

PC7

PD0

PD1

PD2

PD3

PD4

PD5

MODA

R/W

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

MODB

68HC11

PSD

RESET

AD7-AD0

PC2

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16 I/O ports

There are four programmable I/O ports: ports A, B, C, and D. Each of the ports is eight bits

except port D, which is 3 bits. Each port pin is individually user configurable, thus allowing

multiple functions per port. The ports are configured using PSDsoft Express Configuration

or by the MCU writing to on-chip registers in the CSIOP space.

The topics discussed in this section are:

●General port architecture

●Port operating modes

●Port configuration registers (PCR)

●Port Data registers

●Individual port functionality.

16.1 General port architecture

The general architecture of the I/O port block is shown in Figure 25. Individual port

architectures are shown in Figure 27, Figure 28, Figure 29, and Figure 30. In general, once

the purpose for a port pin has been defined, that pin is no longer available for other

purposes. Exceptions are noted.

As shown in Figure 25, the ports contain an output multiplexer whose select signals are

driven by the configuration bits in the Control registers (Ports A and B only) and PSDsoft

Express Configuration.Inputs to the multiplexer include the following:

●Output data from the Data Out register

●Latched address outputs

●CPLD macrocell output

●External Chip Select (ECS0-ECS2) from the CPLD.

The port Data Buffer (PDB) is a tri-state buffer that allows only one source at a time to be

read. The port Data Buffer (PDB) is connected to the Internal data bus for feedback and can

be read by the MCU. The Data Out and macrocell outputs, Direction and Control registers,

and port pin input are all connected to the port data buffer (PDB).

The port pin’s tri-state output driver enable is controlled by a two input OR gate whose

inputs come from the CPLD AND Array enable product term and the Direction register. If the

enable product term of any of the Array outputs are not defined and that port pin is not

defined as a CPLD output in the PSDabel file, then the Direction register has sole control of

the buffer that drives the port pin.

The contents of these registers can be altered by the MCU. The port Data Buffer (PDB)

feedback path allows the MCU to check the contents of the registers.

Ports A, B, and C have embedded input macrocells (IMC). The input macrocells (IMC) can

be configured as latches, registers, or direct inputs to the PLDs. The latches and registers

are clocked by Address Strobe (ALE/AS, PD0) or a product term from the PLD AND Array.

The outputs from the input macrocells (IMC) drive the PLD input bus and can be read by the

MCU (see Figure 16: Input macrocell).

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68/128 Doc ID 7833 Rev 7

16.2 Port operating modes

The I/O ports have several modes of operation. Some modes can be defined using

PSDabel, some by the MCU writing to the Control registers in CSIOP space, and some by

both. The modes that can only be defined using PSDsoft Express must be programmed into

the device and cannot be changed unless the device is reprogrammed. The modes that can

be changed by the MCU can be done so dynamically at run-time. The PLD I/O, Data port,

Address input, and Peripheral I/O modes are the only modes that must be defined before

programming the device. All other modes can be changed by the MCU at run-time. See

Application Note AN1171 for more detail.

Ta bl e 2 0 summarizes which modes are available on each port. Ta bl e 2 3 shows how and

where the different modes are configured. Each of the port operating modes are described

in the following sections.

Figure 25. General I/O port architecture

INTERNAL DATA BUS

DATA OUT

REG.

ADDRESS

MACROCELL OUTPUTS

ENABLE PRODUCT TERM (.OE)

EXT CS

ALE

READ MUX

CPLD-INPUT

CONTROL REG.

DIR REG.

INPUT

MACROCELL

ENABLE OUT

DATA IN

OUTPUT

SELECT

OUTPUT

MUX

PORT PIN

DATA OUT

ADDRESS

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16.3 MCU I/O mode

In the MCU I/O mode, the MCU uses the I/O ports block to expand its own I/O ports. By

setting up the CSIOP space, the ports on the PSD are mapped into the MCU address

space. The addresses of the ports are listed in Ta bl e 8 .

A port pin can be put into MCU I/O mode by writing a 0 to the corresponding bit in the

Control register. The MCU I/O direction may be changed by writing to the corresponding bit

in the Direction register, or by the output enable product term (see Section 16.8: Peripheral

I/O mode). When the pin is configured as an output, the content of the Data Out register

drives the pin. When configured as an input, the MCU can read the port input through the

Data In buffer (see Figure 25).

Ports C and D do not have Control registers, and are in MCU I/O mode by default. They can

be used for PLD I/O if equations are written for them in PSDabel.

16.4 PLD I/O mode

The PLD I/O mode uses a port as an input to the CPLD’s input macrocells (IMC), and/or as

an output from the CPLD’s Output macrocells (OMC). The output can be tri-stated with a

control signal. This output enable control signal can be defined by a product term from the

PLD, or by resetting the corresponding bit in the Direction register to ’0.’ The corresponding

bit in the Direction register must not be set to '1' if the pin is defined for a PLD input signal in

PSDabel. The PLD I/O mode is specified in PSDabel by declaring the port pins, and then

writing an equation assigning the PLD I/O to a port.

16.5 Address Out mode

For MCUs with a multiplexed address/data bus, Address Out mode can be used to drive

latched addresses on to the port pins. These port pins can, in turn, drive external devices.

Either the output enable or the corresponding bits of both the Direction register and Control

MCU at run-time. See Ta b l e 22 for the address output pin assignments on ports A and B for

various MCUs.

For non-multiplexed 8-bit bus mode, address signals (A7-A0) are available to port B in

Address Out mode.

Note: Do not drive address signals with Address Out mode to an external memory device if it is

intended for the MCU to Boot from the external device. The MCU must first Boot from PSD

memory so the Direction and Control register bits can be set.

Table 20. Port operating modes

Port mode Port A Port B Port C Port D

M C U I / O Ye s Ye s Ye s Ye s

PLD I/O

McellAB outputs

McellBC outputs

Additional Ext. CS outputs

PLD inputs

Ye s

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Address Out Yes (A7 – 0) Yes (A7 – 0)

or (A15 – 8) No No

Address In Yes Yes Yes Yes

Data port Yes (D7 – 0) No No No

Peripheral I/O Yes No No No

JTAG ISP No No Yes(1) No

1. Can be multiplexed with other I/O functions.

Table 20. Port operating modes (continued)

Port mode Port A Port B Port C Port D

Table 21. Port operating mode settings

Mode Defined in

PSDabel

Defined in PSD

configuration

Control

setting

Direction

setting

JTAG Enable

MCU I/O Declare pins only N/A(1) 01 = output,

0 = input(2) N/A N/A

PLD I/O Logic equations N/A N/A (2) N/A N/A

Data port (Port A) N/A Specify bus type N/A N/A N/A N/A

Address Out

(Port A,B) Declare pins only N/A 1 1(2) N/A N/A

Address In

(Port A,B,C,D)

Logic for equation

input macrocells N/A N/A N/A N/A N/A

Peripheral I/O

(Port A)

Logic equations

(PSEL0 & 1) N/A N/A N/A PIO bit = 1 N/A

JTAG ISP(3) JTAGSEL JTAG

Configuration N/A N/A N/A JTAG_Enable

1. N/A = Not Applicable

2. The direction of the port A,B,C, and D pins are controlled by the Direction register ORed with the individual output enable

product term (.oe) from the CPLD AND Array.

3. Any of these three methods enables the JTAG pins on port C.

Table 22. I/O port Latched address output assignments

MCU Port A (PA3-PA0) Port A (PA7-PA4) Port B (PB3-PB0) Port B (PB7-PB4)

8051XA (8-Bit) N/A(1) Address a7-a4 Address a11-a8 N/A

80C251

(Page mode) N/A N/A Address a11-a8 Address a15-a12

All Other

8-Bit Multiplexed Address a3-a0 Address a7-a4 Address a3-a0 Address a7-a4

8-Bit

Non-Multiplexed bus N/A N/A Address a3-a0 Address a7-a4

1. N/A = Not Applicable

PSD8XXFX I/O ports

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16.6 Address In mode

For MCUs that have more than 16 address signals, the higher addresses can be connected

to port A, B, C, and D. The address input can be latched in the input macrocell (IMC) by

Address Strobe (ALE/AS, PD0). Any input that is included in the DPLD equations for the

SRAM, or primary or secondary Flash memory is considered to be an address input.

16.7 Data port mode

Port A can be used as a data bus port for a MCU with a non-multiplexed address/data bus.

The Data port is connected to the data bus of the MCU. The general I/O functions are

disabled in port A if the port is configured as a Data port.

16.8 Peripheral I/O mode

Peripheral I/O mode can be used to interface with external peripherals. In this mode, all of

port A serves as a tri-state, bi-directional data buffer for the MCU. Peripheral I/O mode is

enabled by setting Bit 7 of the VM register to a ’1.’ Figure 26 shows how port A acts as a bi-

directional buffer for the MCU data bus if Peripheral I/O mode is enabled. An equation for

PSEL0 and/or PSEL1 must be written in PSDabel. The buffer is tri-stated when PSEL0 or

PSEL1 is not active.

Figure 26. Peripheral I/O mode

16.9 JTAG in-system programming (ISP)

Port C is JTAG compliant, and can be used for in-system programming (ISP). You can

multiplex JTAG operations with other functions on port C because in-system programming

(ISP) is not performed in normal operating mode. For more information on the JTAG port,

see Section 19: Programming in-circuit using the JTAG serial interface.

PSEL0

PSEL1

PSEL

VM REGISTER BIT 7

PA0 - PA7

D0-D7

DATA BUS

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16.10 Port configuration registers (PCR)

Each port has a set of port configuration registers (PCR) used for configuration. The

contents of the registers can be accessed by the MCU through normal READ/WRITE bus

cycles at the addresses given in Ta bl e 8 . The addresses in Ta bl e 8 are the offsets in

hexadecimal from the base of the CSIOP register.

The pins of a port are individually configurable and each bit in the register controls its

respective pin. For example, Bit 0 in a register refers to Bit 0 of its port. The three port

configuration registers (PCR), shown in Ta b le 2 3 , are used for setting the port

configurations. The default Power-up state for each register in Ta b l e 2 3 is 00h.

16.11 Control register

Any bit reset to '0' in the Control register sets the corresponding port pin to MCU I/O mode,

and a '1' sets it to Address Out mode. The default mode is MCU I/O. Only ports A and B

have an associated Control register.

16.12 Direction register

The Direction register, in conjunction with the output enable (except for port D), controls the

direction of data flow in the I/O ports. Any bit set to '1' in the Direction register causes the

corresponding pin to be an output, and any bit set to '0' causes it to be an input. The default

mode for all port pins is input.

Figure 27 and Figure 28 show the port architecture diagrams for ports A/B and C,

respectively. The direction of data flow for ports A, B, and C are controlled not only by the

direction register, but also by the output enable product term from the PLD AND Array. If the

output enable product term is not active, the Direction register has sole control of a given

pin’s direction.

An example of a configuration for a port with the three least significant bits set to output and

the remainder set to input is shown in Ta b l e 2 6 . Since port D only contains three pins

(shown in Figure 30), the Direction register for port D has only the three least significant bits

active.

16.13 Drive Select register

The Drive Select register configures the pin driver as Open Drain or CMOS for some port

pins, and controls the slew rate for the other port pins. An external pull-up resistor should be

used for pins configured as Open Drain.

A pin can be configured as Open Drain if its corresponding bit in the Drive Select register is

set to a ’1.’ The default pin drive is CMOS.

Note that the slew rate is a measurement of the rise and fall times of an output. A higher

slew rate means a faster output response and may create more electrical noise. A pin

operates in a high slew rate when the corresponding bit in the Drive register is set to ’1.’ The

default rate is slow slew.

Ta bl e 2 7 shows the Drive register for ports A, B, C, and D. It summarizes which pins can be

configured as Open Drain outputs and which pins the slew rate can be set for.

PSD8XXFX I/O ports

Doc ID 7833 Rev 7 73/128

Table 23. Port configuration registers (PCR)t

Control A,B WRITE/READ

Direction A,B,C,D WRITE/READ

Drive Select(1)

1. See Table 27 for Drive register bit definition.

A,B,C,D WRITE/READ

Table 24. Port Pin Direction Control, Output Enable P.T. not defined

Direction register bit Port Pin mode

0 Input

1 Output

Table 25. Port Pin Direction Control, Output Enable P.T. defined

Direction register Bit Output Enable P.T. Port Pin mode

0 0 Input

0 1 Output

1 0 Output

1 1 Output

Table 26. Port Direction assignment example

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0 0 0 0 0 1 1 1

Table 27. Drive register pin assignment

Drive

Port A Open

Drain

Open

Drain

Open

Drain

Open

Drain

Slew

Rate

Slew

Rate

Slew

Rate

Slew

Rate

Port B Open

Drain

Open

Drain

Open

Drain

Open

Drain

Slew

Rate

Slew

Rate

Slew

Rate

Slew

Rate

Port C Open

Drain

Open

Drain

Open

Drain

Open

Drain

Open

Drain

Open

Drain

Open

Drain

Open

Drain

Port D NA(1)

1. NA = Not Applicable.

NA(1) NA(1) NA(1) NA(1) Slew

Rate

Slew

Rate

Slew

Rate

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74/128 Doc ID 7833 Rev 7

16.14 Port Data registers

The port Data registers, shown in Ta bl e 2 8 , are used by the MCU to write data to or read

data from the ports. Ta b l e 2 8 shows the register name, the ports having each register type,

and MCU access for each register type. The registers are described below.

16.15 Data In

Port pins are connected directly to the Data In buffer. In MCU I/O input mode, the pin input is

read through the Data In buffer.

16.16 Data Out register

Stores output data written by the MCU in the MCU I/O output mode. The contents of the

is set to ’1.’ The contents of the register can also be read back by the MCU.

Output macrocells (OMC)

The CPLD Output macrocells (OMC) occupy a location in the MCU’s address space. The

MCU can read the output of the Output macrocells (OMC). If the OMC Mask register bits are

not set, writing to the macrocell loads data to the macrocell flip-flops (see Section 14:

PLDS).

16.17 OMC Mask register

Each OMC Mask register bit corresponds to an Output macrocell (OMC) flip-flop. When the

OMC Mask register bit is set to a 1, loading data into the Output macrocell (OMC) flip-flop is

blocked. The default value is 0 or unblocked.

16.18 Input macro (IMC)

The input macrocells (IMC) can be used to latch or store external inputs. The outputs of the

input macrocells (IMC) are routed to the PLD input bus, and can be read by the MCU (see

Section 14: PLDS).

Table 28. Port Data registers

Data In A,B,C,D READ – input on pin

Data Out A,B,C,D WRITE/READ

Output macrocell A,B,C READ – outputs of macrocells

WRITE – loading macrocells flip-flop

Mask macrocell A,B,C WRITE/READ – prevents loading into a given

macrocell

Input macrocell A,B,C READ – outputs of the input macrocells

Enable Out A,B,C READ – the output enable control of the port driver

PSD8XXFX I/O ports

Doc ID 7833 Rev 7 75/128

16.19 Enable Out

The Enable Out register can be read by the MCU. It contains the output enable values for a

given port. A 1 indicates the driver is in output mode. A 0 indicates the driver is in tri-state

and the pin is in input mode.

16.20 Ports A and B – functionality and structure

Ports A and B have similar functionality and structure, as shown in Figure 27. The two ports

can be configured to perform one or more of the following functions:

●MCU I/O mode

●CPLD Output – macrocells McellAB7-McellAB0 can be connected to port A or port B.

McellBC7-McellBC0 can be connected to port B or port C.

●CPLD input – Via the input macrocells (IMC).

●Latched Address output – Provide latched address output as per Ta bl e 2 2 .

●Address In – Additional high address inputs using the input macrocells (IMC).

●Open Drain/Slew Rate – pins PA3-PA0 and PB3-PB0 can be configured to fast slew

rate, pins PA7-PA4 and PB7-PB4 can be configured to Open Drain mode.

●Data port – port A to D7-D0 for 8 bit non-multiplexed bus

●Multiplexed Address/Data port for certain types of MCU bus interfaces.

●Peripheral mode – port A only

Figure 27. Port A and port B structure

INTERNAL DATA BUS

DATA OUT

REG.

ADDRESS

MACROCELL OUTPUTS

ENABLE PRODUCT TERM (.OE)

ALE

READ MUX

CPLD- INPUT

CONTROL REG.

DIR REG.

INPUT

MACROCELL

ENABLE OUT

DATA IN

OUTPUT

SELECT

OUTPUT

MUX

PORT

A OR B PIN

DATA OUT

ADDRESS

A[7:0] OR A[15:8]

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16.21 Port C – functionality and structure

Port C can be configured to perform one or more of the following functions (see Figure 28):

●MCU I/O mode

●CPLD Output – McellBC7-McellBC0 outputs can be connected to port B or port C.

●CPLD input – via the input macrocells (IMC)

●Address In – Additional high address inputs using the input macrocells (IMC).

●In-system programming (ISP) – JTAG port can be enabled for programming/erase of

the PSD device (see Section 19: Programming in-circuit using the JTAG serial interface

for more information on JTAG programming).

●Open Drain – port C pins can be configured in Open Drain mode

Port C does not support Address Out mode, and therefore no Control register is required.

Pin PC7 may be configured as the DBE input in certain MCU bus interfaces.

Figure 28. Port C structure

16.22 Port D – functionality and structure

Port D has three I/O pins. See Figure 29 and Figure 30. This port does not support Address

Out mode, and therefore no Control register is required. port D can be configured to perform

one or more of the following functions:

●MCU I/O mode

●CPLD Output – External Chip Select (ECS0-ECS2)

●CPLD input – direct input to the CPLD, no input macrocells (IMC)

●Slew rate – pins can be set up for fast slew rate

INTERNAL DATA BUS

DATA OUT

REG.

MCELLBC[7:0]

ENABLE PRODUCT TERM (.OE)

READ MUX

CPLD- INPUT

DIR REG.

INPUT

MACROCELL

ENABLE OUT

SPECIAL FUNCTION

SPECIAL FUNCTION1

CONFIGURATION

BIT

DATA IN

OUTPUT

SELECT

OUTPUT

MUX

PORT C PIN

DATA OUT

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Port D pins can be configured in PSDsoft Express as input pins for other dedicated

functions:

●Address Strobe (ALE/AS, PD0)

●CLKIN (PD1) as input to the macrocells flip-flops and APD counter

●PSD Chip Select input (CSI, PD2). Driving this signal high disables the Flash memory,

SRAM and CSIOP.

Figure 29. Port D structure

16.23 External Chip Select

The CPLD also provides three External Chip Select (ECS0-ECS2) outputs on port D pins

that can be used to select external devices. Each External Chip Select (ECS0-ECS2)

consists of one product term that can be configured active high or low. The output enable of

the pin is controlled by either the output enable product term or the Direction register (see

Figure 30).

INTERNAL DATA BUS

DATA OUT

REG.

ECS[2:0]

READ MUX

CPLD- INPUT

DIR REG.

DATA IN

ENABLE PRODUCT

TERM (.OE)

OUTPUT

SELECT

OUTPUT

MUX

PORT D PIN

DATA OUT

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Figure 30. Port D external Chip Select signals

PLD INPUT BUS

POLARITY

BIT

PD2 PIN

PT2 ECS2

DIRECTION

POLARITY

BIT

PD1 PIN

PT1 ECS1

ENABLE (.OE)

ENABLE (.OE) DIRECTION

POLARITY

BIT

PD0 PIN

PT0 ECS0

ENABLE (.OE) DIRECTION

CPLD AND ARRAY

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PSD8XXFX Power management

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17 Power management

All PSD devices offer configurable power saving options. These options may be used

individually or in combinations, as follows:

●All memory blocks in a PSD (primary and secondary Flash memory, and SRAM) are

built with power management technology. In addition to using special silicon design

methodology, power management technology puts the memories into standby mode

when address/data inputs are not changing (zero DC current). As soon as a transition

occurs on an input, the affected memory “wakes up”, changes and latches its outputs,

then goes back to Standby. The designer does not have to do anything special to

achieve memory Standby mode when no inputs are changing—it happens

automatically.

The PLD sections can also achieve Standby mode when its inputs are not changing, as

described in the sections on the Power Management mode registers (PMMR).

●As with the Power Management mode, the Automatic Power Down (APD) block allows

the PSD to reduce to standby current automatically. The APD Unit can also block MCU

address/data signals from reaching the memories and PLDs. This feature is available

on all the devices of the PSD family. The APD Unit is described in more detail in

Section 17.1: Automatic Power-down (APD) Unit and Power-down mode.

Built in logic monitors the Address Strobe of the MCU for activity. If there is no activity

for a certain time period (MCU is asleep), the APD Unit initiates Power-down mode (if

enabled). Once in Power-down mode, all address/data signals are blocked from

reaching PSD memory and PLDs, and the memories are deselected internally. This

allows the memory and PLDs to remain in Standby mode even if the address/data

signals are changing state externally (noise, other devices on the MCU bus, etc.). Keep

in mind that any unblocked PLD input signals that are changing states keeps the PLD

out of Standby mode, but not the memories.

●PSD Chip Select input (CSI, PD2) can be used to disable the internal memories,

placing them in Standby mode even if inputs are changing. This feature does not block

any internal signals or disable the PLDs. This is a good alternative to using the APD

Unit. There is a slight penalty in memory access time when PSD Chip Select input

(CSI, PD2) makes its initial transition from deselected to selected.

●The PMMRs can be written by the MCU at run-time to manage power. All PSD

supports “blocking bits” in these registers that are set to block designated signals from

reaching both PLDs. Current consumption of the PLDs is directly related to the

composite frequency of the changes on their inputs (see Figure 34 and Figure 35).

Significant power savings can be achieved by blocking signals that are not used in

DPLD or CPLD logic equations.

PSD devices have a Turbo Bit in PMMR0. This bit can be set to turn the Turbo mode off

(the default is with Turbo mode turned on). While Turbo mode is off, the PLDs can

achieve standby current when no PLD inputs are changing (zero DC current). Even

when inputs do change, significant power can be saved at lower frequencies (AC

current), compared to when Turbo mode is on. When the Turbo mode is on, there is a

significant DC current component and the AC component is higher.

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17.1 Automatic Power-down (APD) Unit and Power-down mode

The APD Unit, shown in Figure 31, puts the PSD into Power-down mode by monitoring the

activity of Address Strobe (ALE/AS, PD0). If the APD Unit is enabled, as soon as activity on

Address Strobe (ALE/AS, PD0) stops, a four bit counter starts counting. If Address Strobe

(ALE/AS, PD0) remains inactive for fifteen clock periods of CLKIN (PD1), Power-down

(PDN) goes high, and the PSD enters Power-down mode, as discussed next.

Power-down mode

By default, if you enable the APD Unit, Power-down mode is automatically enabled. The

device enters Power-down mode if Address Strobe (ALE/AS, PD0) remains inactive for

fifteen periods of CLKIN (PD1).

The following should be kept in mind when the PSD is in Power-down mode:

●If Address Strobe (ALE/AS, PD0) starts pulsing again, the PSD returns to normal

operating mode. The PSD also returns to normal operating mode if either PSD Chip

Select input (CSI, PD2) is low or the Reset (RESET) input is high.

●The MCU address/data bus is blocked from all memory and PLDs.

●Various signals can be blocked (prior to Power-down mode) from entering the PLDs by

setting the appropriate bits in the PMMR registers. The blocked signals include MCU

control signals and the common CLKIN (PD1). Note that blocking CLKIN (PD1) from

the PLDs does not block CLKIN (PD1) from the APD Unit.

●All PSD memories enter Standby mode and are drawing standby current. However, the

PLD and I/O ports blocks do not go into Standby mode because you don’t want to have

to wait for the logic and I/O to “wake up” before their outputs can change. See Ta bl e 2 9

for Power-down mode effects on PSD ports.

●Typical standby current is of the order of microamperes. These standby current values

assume that there are no transitions on any PLD input.

Table 29. Power-down mode’s effect on ports

Port function Pin level

MCU I/O No change

PLD Out No change

Address Out Undefined

Data port Tri-state

Peripheral I/O Tri-state

PSD8XXFX Power management

Doc ID 7833 Rev 7 81/128

Figure 31. APD unit

17.2 For users of the HC11 (or compatible)

The HC11 turns off its E clock when it sleeps. Therefore, if you are using an HC11 (or

compatible) in your design, and you wish to use the Power-down mode, you must not

connect the E clock to CLKIN (PD1). You should instead connect a crystal oscillator to

CLKIN (PD1). The crystal oscillator frequency must be less than 15 times the frequency of

AS. The reason for this is that if the frequency is greater than 15 times the frequency of AS,

the PSD keeps going into Power-down mode.

17.3 Other power saving options

The PSD offers other reduced power saving options that are independent of the Power-

down mode. Except for PSD Chip Select input (CSI, PD2) features, they are enabled by

setting bits in PMMR0 and PMMR2.

APD EN

PMMR0 BIT 1=1

ALE

RESET

CSI

CLKIN

TRANSITION

DETECTION

EDGE

DETECT

APD

COUNTER

POWER DOWN

(PDN)

DISABLE BUS

INTERFACE

EEPROM SELECT

FLASH SELECT

SRAM SELECT

CLR

DISABLE

FLASH/EEPROM/SRAM

PLD

SELECT

AI02891

Table 30. PSD timing and standby current during Power-down mode

Mode PLD propagation delay Memory

access time

Access recovery time

to normal access

Typical standby current

5V V

CC 3V V

Power-down Normal tPD(1) No access tLVDV 75 µA(2) 25 µA(2)

1. Power-down does not affect the operation of the PLD. The PLD operation in this mode is based only on the Turbo Bit.

2. Typical current consumption assuming no PLD inputs are changing state and the PLD Turbo Bit is ’0.’

Power management PSD8XXFX

82/128 Doc ID 7833 Rev 7

Figure 32. Enable Power-down flowchart

17.4 PLD power management

The power and speed of the PLDs are controlled by the Turbo Bit (Bit 3) in PMMR0. By

setting the bit to '1,' the Turbo mode is off and the PLDs consume the specified standby

current when the inputs are not switching for an extended time of 70ns. The propagation

delay time is increased by 10ns after the Turbo Bit is set to '1' (turned off) when the inputs

change at a composite frequency of less than 15 MHz. When the Turbo Bit is reset to '0'

(turned on), the PLDs run at full power and speed. The Turbo Bit affects the PLD’s DC

power, AC power, and propagation delay.

Blocking MCU control signals with the bits of PMMR2 can further reduce PLD AC power

consumption.

Enable APD

Set PMMR0 Bit 1 = 1

PSD in Power

Down Mode

ALE/AS idle

for 15 CLKIN

clocks?

RESET

Yes

OPTIONAL

Disable desired inputs to PLD

by setting PMMR0 bits 4 and 5

and PMMR2 bits 2 through 6.

AI02892

Table 31. Power Management mode registers PMMR0(1)

Bit Name Description

Bit 0 X 0 Not used, and should be set to zero.

Bit 1 APD Enable

0 =

off Automatic Power-down (APD) is disabled.

1 =

on Automatic Power-down (APD) is enabled.

Bit 2 X 0 Not used, and should be set to zero.

Bit 3 PLD Turbo

0 =

on PLD Turbo mode is on

1 =

off PLD Turbo mode is off, saving power.

PSD8XXFX Power management

Doc ID 7833 Rev 7 83/128

Bit 4 PLD Array clk

0 =

CLKIN (PD1) input to the PLD AND Array is connected. Every change of CLKIN

(PD1) Powers-up the PLD when Turbo Bit is ’0.’

1 =

off CLKIN (PD1) input to PLD AND Array is disconnected, saving power.

Bit 5 PLD MCell clk

0 =

on CLKIN (PD1) input to the PLD macrocells is connected.

1 =

off CLKIN (PD1) input to PLD macrocells is disconnected, saving power.

Bit 6 X 0 Not used, and should be set to zero.

Bit 7 X 0 Not used, and should be set to zero.

1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (RESET) pulses do not clear the

registers.

Table 32. Power Management mode registers PMMR2(1)

Bit Name Description

Bit 0 X 0 Not used, and should be set to zero.

Bit 1 X 0 Not used, and should be set to zero.

Bit 2 PLD Array

CNTL0

0 = on Cntl0 input to the PLD AND Array is connected.

1 = off Cntl0 input to PLD AND Array is disconnected, saving power.

Bit 3 PLD Array

CNTL1

0 = on Cntl1 input to the PLD AND Array is connected.

1 = off Cntl1 input to PLD AND Array is disconnected, saving power.

Bit 4 PLD Array

CNTL2

0 = on Cntl2 input to the PLD AND Array is connected.

1 = off Cntl2 input to PLD AND Array is disconnected, saving power.

Bit 5 PLD Array

ALE

0 = on ALE input to the PLD AND Array is connected.

1 = off ALE input to PLD AND Array is disconnected, saving power.

Bit 6 PLD Array

DBE

0 = on DBE input to the PLD AND Array is connected.

1 = off DBE input to PLD AND Array is disconnected, saving power.

Bit 7 X 0 Not used, and should be set to zero.

1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (RESET) pulses do not clear the

registers.

Table 31. Power Management mode registers PMMR0(1) (continued)

Bit Name Description

Power management PSD8XXFX

84/128 Doc ID 7833 Rev 7

17.5 PSD Chip Select input (CSI, PD2)

PD2 of port D can be configured in PSDsoft Express as PSD Chip Select input (CSI). When

low, the signal selects and enables the internal Flash memory, EEPROM, SRAM, and I/O

blocks for READ or WRITE operations involving the PSD. A high on PSD Chip Select input

(CSI, PD2) disables the Flash memory, EEPROM, and SRAM, and reduces the PSD power

consumption. However, the PLD and I/O signals remain operational when PSD Chip Select

input (CSI, PD2) is high.

There may be a timing penalty when using PSD Chip Select input (CSI, PD2) depending on

the speed grade of the PSD that you are using. See the timing parameter tSLQV in Ta b l e 6 2

or Ta b l e 6 3 .

17.6 Input clock

The PSD provides the option to turn off CLKIN (PD1) to the PLD to save AC power

consumption. CLKIN (PD1) is an input to the PLD AND Array and the Output macrocells

(OMC).

During Power-down mode, or, if CLKIN (PD1) is not being used as part of the PLD logic

equation, the clock should be disabled to save AC power. CLKIN (PD1) is disconnected from

the PLD AND Array or the macrocells block by setting Bits 4 or 5 to a 1 in PMMR0.

17.7 Input control signals

The PSD provides the option to turn off the input control signals (CNTL0, CNTL1, CNTL2,

Address Strobe (ALE/AS, PD0) and DBE) to the PLD to save AC power consumption. These

control signals are inputs to the PLD AND Array. During Power-down mode, or, if any of

them are not being used as part of the PLD logic equation, these control signals should be

disabled to save AC power. They are disconnected from the PLD AND Array by setting Bits

2, 3, 4, 5, and 6 to a 1 in PMMR2.

Table 33. APD counter operation

APD Enable

bit

ALE PD

polarity ALE level APD counter

0 X X Not counting

1 X Pulsing Not counting

1 1 1 Counting (generates PDN after 15 clocks)

1 0 0 Counting (generates PDN after 15 clocks)

PSD8XXFX Reset timing and device status at reset

Doc ID 7833 Rev 7 85/128

18 Reset timing and device status at reset

18.1 Power-up reset

Upon Power-up, the PSD requires a Reset (RESET) pulse of duration tNLNH-PO after VCC is

steady. During this period, the device loads internal configurations, clears some of the

registers and sets the Flash memory into operating mode. After the rising edge of Reset

(RESET), the PSD remains in the Reset mode for an additional period, tOPR, before the first

memory access is allowed.

The Flash memory is reset to the READ mode upon Power-up. Sector Select (FS0-FS7 and

CSBOOT0-CSBOOT3) must all be low, Write Strobe (WR, CNTL0) high, during Power On

Reset for maximum security of the data contents and to remove the possibility of a byte

being written on the first edge of Write Strobe (WR, CNTL0). Any Flash memory WRITE

cycle initiation is prevented automatically when VCC is below VLKO.

18.2 Warm reset

Once the device is up and running, the device can be reset with a pulse of a much shorter

duration, tNLNH.

The same tOPR period is needed before the device is operational after warm reset.

Figure 33 shows the timing of the Power-up and warm reset.

18.3 I/O pin, register and PLD status at Reset

Ta bl e 3 4 shows the I/O pin, register and PLD status during Power On Reset, warm reset and

Power-down mode. PLD outputs are always valid during warm reset, and they are valid in

Power On Reset once the internal PSD Configuration bits are loaded. This loading of PSD is

completed typically long before the VCC ramps up to operating level. Once the PLD is active,

the state of the outputs are determined by the PSDabel equations.

18.4 Reset of Flash memory erase and program cycles (on the

PSD834Fx)

A Reset (RESET) also resets the internal Flash memory state machine. During a Flash

memory program or erase cycle, Reset (RESET) terminates the cycle and returns the Flash

memory to the Read mode within a period of tNLNH-A.

Reset timing and device status at reset PSD8XXFX

86/128 Doc ID 7833 Rev 7

Figure 33. Reset (RESET) timing

tNLNH-PO tOPR

AI02866b

RESET

tNLNH

tNLNH-A tOPR

VCC(min)

Power-On Reset Warm Reset

Table 34. Status during Power-on reset, Warm reset and Power-down mode

Port configuration Power-on reset Warm reset Power-down mode

MCU I/O Input mode Input mode Unchanged

PLD Output

Valid after internal PSD

configuration bits are

loaded

Valid

Depends on inputs to PLD

(addresses are blocked in

PD mode)

Address Out Tri-stated Tri-stated Not defined

Data port Tri-stated Tri-stated Tri-stated

Peripheral I/O Tri-stated Tri-stated Tri-stated

PMMR0 and PMMR2 Cleared to '0' Unchanged Unchanged

Macrocells flip-flop status Cleared to '0' by internal

Power-On Reset

Depends on .re and .pr

equations

Depends on .re and .pr

equations

VM register(1)

Initialized, based on the

selection in PSDsoft

Configuration menu

Initialized, based on the

selection in PSDsoft

Configuration menu

Unchanged

All other registers Cleared to '0' Cleared to '0' Unchanged

1. The SR_cod and Periphmode bits in the VM register are always cleared to '0' on Power-on reset or Warm reset.

PSD8XXFX Programming in-circuit using the JTAG serial interface

Doc ID 7833 Rev 7 87/128

19 Programming in-circuit using the JTAG serial

interface

The JTAG Serial Interface block can be enabled on port C (see Ta bl e 3 5 ). All memory blocks

(primary and secondary Flash memory), PLD logic, and PSD Configuration register bits may

be programmed through the JTAG Serial Interface block. A blank device can be mounted on

a printed circuit board and programmed using JTAG.

The standard JTAG signals (IEEE 1149.1) are TMS, TCK, TDI, and TDO. Two additional

signals, TSTAT and TERR, are optional JTAG extensions used to speed up Program and

Erase cycles.

Note: By default, on a blank PSD (as shipped from the factory or after erasure), four pins on port C

are enabled for the basic JTAG signals TMS, TCK, TDI, and TDO.

See Application Note AN1153 for more details on JTAG in-system programming (ISP).

19.1 Standard JTAG signals

The standard JTAG signals (TMS, TCK, TDI, and TDO) can be enabled by any of three

different conditions that are logically ORed. When enabled, TDI, TDO, TCK, and TMS are

inputs, waiting for a JTAG serial command from an external JTAG controller device (such as

FlashLINK or Automated Test Equipment). When the enabling command is received, TDO

becomes an output and the JTAG channel is fully functional inside the PSD. The same

command that enables the JTAG channel may optionally enable the two additional JTAG

signals, TSTAT and TERR.

The following symbolic logic equation specifies the conditions enabling the four basic JTAG

signals (TMS, TCK, TDI, and TDO) on their respective port C pins. For purposes of

discussion, the logic label JTAG_ON is used. When JTAG_ON is true, the four pins are

enabled for JTAG. When JTAG_ON is false, the four pins can be used for general PSD I/O.

JTAG_ON = PSDsoft_enabled +

/* An NVM configuration bit inside the PSD is set by the designer

in the PSDsoft Express Configuration utility. This dedicates the

pins for JTAG at all times (compliant with IEEE 1149.1 */

Microcontroller_enabled +

/* The microcontroller can set a bit at run-time by writing to the

PSD register, JTAG Enable. This register is located at address CSIOP

+ offset C7h. Setting the JTAG_ENABLE bit in this register will

enable the pins for JTAG use. This bit is cleared by a PSD reset or

the microcontroller. See Table 36 for bit definition. */

PSD_product_term_enabled;

/* A dedicated product term (PT) inside the PSD can be used to

enable the JTAG pins. This PT has the reserved name JTAGSEL. Once

defined as a node in PSDabel, the designer can write an equation for

JTAGSEL. This method is used when the port C JTAG pins are

multiplexed with other I/O signals. It is recommended to logically

tie the node JTAGSEL to the JEN\ signal on the Flashlink cable when

multiplexing JTAG signals. See Application Note 1153 for details. */

The state of the PSD Reset (RESET) signal does not interrupt (or prevent) JTAG operations

if the JTAG pins are dedicated by an NVM configuration bit (via PSDsoft Express). However,

Programming in-circuit using the JTAG serial interface PSD8XXFX

88/128 Doc ID 7833 Rev 7

Reset (RESET) will prevent or interrupt JTAG operations if the JTAG enable register is used

to enable the JTAG pins.

The PSD supports JTAG In-System-Configuration (ISC) commands, but not Boundary

Scan. The PSDsoft Express software tool and FlashLINK JTAG programming cable

implement the JTAG In-System-Configuration (ISC) commands. A definition of these JTAG

In-System-Configuration (ISC) commands and sequences is defined in a supplemental

document available from ST. This document is needed only as a reference for designers

who use a FlashLINK to program their PSD.

19.2 JTAG extensions

TSTAT and TERR are two JTAG extension signals enabled by an “ISC_ENABLE” command

received over the four standard JTAG signals (TMS, TCK, TDI, and TDO). They are used to

speed Program and Erase cycles by indicating status on PSD signals instead of having to

scan the status out serially using the standard JTAG channel. See Application Note

AN1153.

TERR indicates if an error has occurred when erasing a sector or programming a byte in

Flash memory. This signal goes low (active) when an Error condition occurs, and stays low

until an “ISC_CLEAR” command is executed or a chip Reset (RESET) pulse is received

after an “ISC_DISABLE” command.

TSTAT behaves the same as Ready/Busy described in Section 6.3.1: Ready/Busy (PC3).

TSTAT is high when the PSD device is in READ mode (primary and secondary Flash

memory contents can be read). TSTAT is low when Flash memory program or erase cycles

are in progress, and also when data is being written to the secondary Flash memory.

TSTAT and TERR can be configured as open-drain type signals during an “ISC_ENABLE”

command. This facilitates a wired-OR connection of TSTAT signals from multiple PSD

devices and a wired-OR connection of TERR signals from those same devices. This is

useful when several PSD devices are “chained” together in a JTAG environment.

19.3 Security and Flash memory protection

When the security bit is set, the device cannot be read on a device programmer or through

the JTAG port. When using the JTAG port, only a Full Chip Erase command is allowed.

All other Program, Erase and Verify commands are blocked. Full Chip Erase returns the part

to a non-secured blank state. The Security bit can be set in PSDsoft Express configuration.

All primary and secondary Flash memory sectors can individually be sector protected

against erasures. The sector protect bits can be set in PSDsoft Express configuration.

PSD8XXFX Programming in-circuit using the JTAG serial interface

Doc ID 7833 Rev 7 89/128

Table 35. JTAG port signals

Port C pin JTAG signals Description

PC0 TMS mode Select

PC1 TCK Clock

PC3 TSTAT Status

PC4 TERR Error flag

PC5 TDI Serial Data In

PC6 TDO Serial Data Out

Initial delivery state PSD8XXFX

90/128 Doc ID 7833 Rev 7

20 Initial delivery state

When delivered from ST, the PSD device has all bits in the memory and PLDs set to ’1.’ The

PSD Configuration register bits are set to ’0.’ The code, configuration, and PLD logic are

loaded using the programming procedure. Information for programming the device is

available directly from ST. Please contact your local sales representative.

Table 36. JTAG Enable register(1)

1. The state of Reset (RESET) does not interrupt (or prevent) JTAG operations if the JTAG signals are

dedicated by an NVM Configuration bit (via PSDsoft Express). However, Reset (RESET) prevents or

interrupts JTAG operations if the JTAG enable register is used to enable the JTAG signals.

Bit Name Description

Bit 0 JTAG_Enable

0 =

off JTAG port is disabled.

1 =

on JTAG port is enabled.

Bit 1 X 0 Not used, and should be set to zero.

Bit 2 X 0 Not used, and should be set to zero.

Bit 3 X 0 Not used, and should be set to zero.

Bit 4 X 0 Not used, and should be set to zero.

Bit 5 X 0 Not used, and should be set to zero.

Bit 6 X 0 Not used, and should be set to zero.

Bit 7 X 0 Not used, and should be set to zero.

PSD8XXFX Maximum rating

Doc ID 7833 Rev 7 91/128

21 Maximum rating

Stressing the device above the rating listed in the Absolute Maximum Ratings” table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the operating sections of

this specification is not implied. Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Table 37. Absolute maximum ratings

Symbol Parameter Min. Max. Unit

TSTG Storage temperature –65 125 °C

TLEAD

Lead temperature during soldering (20 seconds

max.)(1)

1. IPC/JEDEC J-STD-020A

235 °C

VIO Input and output voltage (Q = VOH or Hi-Z) –0.6 7.0 V

VCC Supply voltage –0.6 7.0 V

VPP Device programmer supply voltage –0.6 14.0 V

VESD

Electrostatic discharge voltage (human body model)

(2)

2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)

–2000 2000 V

AC/DC parameters PSD8XXFX

92/128 Doc ID 7833 Rev 7

22 AC/DC parameters

This section summarizes the operating and measurement conditions, and the DC and AC

characteristics of the device:

●DC electrical specifications

●AC timing specifications

– PLD timings

Combinatorial timings

Synchronous clock mode

Asynchronous clock mode

Input macrocell timings

– MCU timings

READ timings

WRITE timings

Peripheral mode timings

Power-down and Reset timings

The parameters in the DC and AC Characteristic tables that follow are derived from tests

performed under the Measurement Conditions summarized in the relevant tables. Designers

should check that the operating conditions in their circuit match the measurement conditions

when relying on the quoted parameters.

The following are issues concerning the parameters presented:

●In the DC specification the supply current is given for different modes of operation.

Before calculating the total power consumption, determine the percentage of time that

the PSD is in each mode. Also, the supply power is considerably different if the Turbo

Bit is ’0.’

●The AC power component gives the PLD, Flash memory, and SRAM mA/MHz

specification. Figure 34 and Figure 35 show the PLD mA/MHz as a function of the

number of Product Terms (PT) used.

●In the PLD timing parameters, add the required delay when Turbo Bit is ’0.’

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 93/128

Figure 34. PLD ICC /frequency consumption (5 V range)

Figure 35. PLD ICC /frequency consumption (3 V range)

100

110

VCC = 5V

010155 20 25

HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)

ICC – (mA)

TURBO ON (100%)

TURBO ON (25%)

TURBO OFF

PT 100%

PT 25%

AI02894

VCC = 3V

010155 20 25

ICC – (mA)

TURBO ON (100%)

TURBO ON (25%)

TURBO OFF

HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)

PT 100%

PT 25%

AI03100

Table 38. Example of PSD typical power calculation at VCC=5.0 V (Turbo mode on) (1)

Conditions

Highest Composite PLD input frequency

(Freq PLD) = 8 MHz

MCU ALE frequency (Freq ALE) = 4 MHz

% Flash memory access = 80%

% SRAM access = 15%

% I/O access = 5% (no additional power above base)

Operational modes

% Normal = 10%

% Power-down mode = 90%

AC/DC parameters PSD8XXFX

94/128 Doc ID 7833 Rev 7

Number of product terms used

(from fitter report) = 45 PT

% of total product terms = 45/182 = 24.7%

Turbo mode = ON

Calculation (using typical values)

ICC total = Ipwrdown x %pwrdown + %normal x (ICC (ac) + ICC (dc))

= Ipwrdown x %pwrdown + % normal x (%flash x 2.5 mA/MHz x Freq ALE

+ %SRAM x 1.5 mA/MHz x Freq ALE

+ % PLD x 2 mA/MHz x Freq PLD

+ #PT x 400 µA/PT)

= 50 µA x 0.90 + 0.1 x (0.8 x 2.5 mA/MHz x 4 MHz

+ 0.15 x 1.5 mA/MHz x 4 MHz

+ 2 mA/MHz x 8 MHz

+ 45 x 0.4 mA/PT)

= 45 µA + 0.1 x (8 + 0.9 + 16 + 18 mA)

= 45 µA + 0.1 x 42.9

= 45 µA + 4.29 mA

= 4.34 mA

1. This is the operating power with no EEPROM WRITE or Flash memory Erase cycles in progress. Calculation is based on

IOUT = 0 mA.

Table 38. Example of PSD typical power calculation at VCC=5.0 V (Turbo mode on) (1)

Conditions

Table 39. Example of PSD typical power calculation at VCC = 5.0 V (Turbo mode off) (1)

Conditions

Highest Composite PLD input frequency

(Freq PLD) = 8 MHz

MCU ALE frequency (Freq ALE) = 4 MHz

% Flash memory access = 80%

% SRAM access = 15%

% I/O access = 5% (no additional power above base)

Operational modes

% Normal = 10%

% Power-down mode = 90%

Number of product terms used

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 95/128

(from fitter report) = 45 PT

% of total product terms = 45/182 = 24.7%

Turbo mode = Off

Calculation (using typical values)

ICC total = Ipwrdown x %pwrdown + %normal x (ICC (ac) + ICC (dc))

= Ipwrdown x %pwrdown + % normal x (%flash x 2.5mA/MHz x Freq ALE

+ %SRAM x 1.5mA/MHz x Freq ALE

+ % PLD x (from graph using Freq PLD))

= 50 µA x 0.90 + 0.1 x (0.8 x 2.5mA/MHz x 4 MHz

+ 0.15 x 1.5mA/MHz x 4 MHz

+ 24mA)

= 45 µA + 0.1 x (8 + 0.9 + 24)

= 45 µA + 0.1 x 32.9

= 45 µA + 3.29mA

= 3.34mA

1. This is the operating power with no EEPROM WRITE or Flash memory Erase cycles in progress. Calculation is based on

IOUT = 0 mA.

Table 39. Example of PSD typical power calculation at VCC = 5.0 V (Turbo mode off)

Conditions

Table 40. Operating conditions (5 V devices)

Symbol Parameter Min. Max. Unit

VCC Supply voltage 4.5 5.5 V

Ambient operating temperature (industrial) –40 85 °C

Ambient operating temperature (commercial) 0 70 °C

Table 41. Operating conditions (3 V devices)

Symbol Parameter Min. Max. Unit

VCC Supply voltage 3.0 3.6 V

Ambient operating temperature (industrial) –40 85 °C

Ambient operating temperature (commercial) 0 70 °C

AC/DC parameters PSD8XXFX

96/128 Doc ID 7833 Rev 7

Table 42. AC signal letters for PLD timing(1)

1. Example: tAVLX = time from address valid to ALE invalid.

Letter Signal description

A Address input

C CEout output

D Input data

E E output

G Internal WDOG_ON signal

I Interrupt input

LALE input

N RESET input or output

P Port signal output

Q Output data

RWR

, UDS, LDS, DS, IORD, PSEN inputs

S Chip Select input

TR/W input

W Internal PDN signal

M Output macrocell

Table 43. AC signal behavior symbols for PLD timing(1)

1. Example: tAVLX = time from address valid to ALE invalid.

Letter AC signal description

tTime

L Logic level low or ALE

H Logic level high

VValid

X No longer a valid logic level(2)

2. Output Hi-Z is defined as the point where data out is no longer driven.

ZFloat

PW Pulse width

Table 44. AC measurement conditions

Symbol Parameter Min. Max. Unit

CLLoad capacitance 30 pF

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 97/128

Figure 36. AC measurement I/O waveform

Figure 37. AC measurement load circuit

Figure 38. Switching waveforms – key

Table 45. Capacitance(1)

1. Sampled only, not 100% tested.

Symbol Parameter Test condition Typ.(2)

2. Typical values are for TA = 25°C and nominal supply voltages.

Max. Unit

CIN

Input capacitance (for input

pins) VIN = 0V 4 6 pF

COUT

Output capacitance (for

input/output pins) VOUT = 0V 8 12 pF

CVPP

Capacitance (for

CNTL2/VPP)VPP = 0V 18 25 pF

3.0V

Test Point 1.5V

AI03103b

Device

Under Test

2.01 V

195 Ω

CL = 30 pF

(Including Scope and

Jig Capacitance)

AI03104b

Device

Under Test

2.01 V

195 Ω

CL = 30 pF

(Including Scope and

Jig Capacitance)

AI03104b

AC/DC parameters PSD8XXFX

98/128 Doc ID 7833 Rev 7

Table 46. DC characteristics (5 V devices)

Symbol Parameter

Test condition

(in addition to those in

Tab le 40)

Min. Typ. Max. Unit

VIH Input high voltage 4.5 V < VCC < 5.5 V 2 VCC +0.5 V

VIL Input low voltage 4.5 V < VCC < 5.5 V –0.5 0.8 V

VIH1 Reset high level input voltage (1) 0.8VCC VCC +0.5 V

VIL1 Reset low level input voltage (1) –0.5 0.2VCC –

0.1 V

VHYS Reset pin hysteresis 0.3 V

VLKO

VCC (min) for Flash Erase and

Program 2.5 4.2 V

VOL Output low voltage IOL = 20 µA, VCC = 4.5 V 0.01 0.1 V

IOL = 8 mA, VCC = 4.5 V 0.25 0.45 V

VOH Output high voltage IOH = –20 µA, VCC = 4.5 V 4.4 4.49 V

IOH = –2 mA, VCC = 4.5 V 2.4 3.9 V

ISB

Standby supply current

for Power-down mode CSI >VCC –0.3 V(2)(3) 50 200 µA

ILI input leakage current VSS < VIN < VCC –1 ±0.1 1 µA

ILO Output leakage current 0.45 < VOUT < VCC –10 ±5 10 µA

ICC

(DC)(4)

Operating

supply current

PLD only

PLD_TURBO = off,

f = 0 MHz(4) 0 µA/PT

PLD_TURBO = on,

f = 0 MHz 400 700 µA/PT

Flash memory

During Flash memory

WRITE/Erase only 15 30 mA

Read only, f = 0 MHz 0 0 mA

SRAM f = 0 MHz 0 0 mA

ICC

(AC)(4)

PLD AC adder (5)

Flash memory AC adder 2.5 3.5 mA/MHz

SRAM AC adder 1.5 3.0 mA/MHz

1. Reset (RESET) has hysteresis. VIL1 is valid at or below 0.2VCC –0.1. VIH1 is valid at or above 0.8VCC.

2. CSI deselected or internal Power-down mode is active.

3. PLD is in non-Turbo mode, and none of the inputs are switching.

4. IOUT = 0 mA

5. Please see Figure 34 for the PLD current calculation.

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 99/128

Table 47. DC Characteristics (3 V devices)

Symbol Parameter Conditions Min. Typ. Max. Unit

VIH High level input voltage 3.0 V < VCC < 3.6 V 0.7VCC VCC +0.5 V

VIL Low level input voltage 3.0 V < VCC < 3.6 V –0.5 0.8 V

VIH1 Reset high level input voltage (1) 0.8VCC VCC +0.5 V

VIL1 Reset low level input voltage (1) –0.5 0.2VCC –

0.1 V

VHYS Reset pin hysteresis 0.3 V

VLKO

VCC (min) for Flash Erase and

Program 1.5 2.2 V

VOL Output low voltage IOL = 20 µA, VCC = 3.0 V 0.01 0.1 V

IOL = 4 mA, VCC = 3.0 V 0.15 0.45 V

VOH Output high voltage IOH = –20 µA, VCC = 3.0 V 2.9 2.99 V

IOH = –1 mA, VCC = 3.0 V 2.7 2.8 V

ISB

Standby supply current

for Power-down mode CSI >VCC –0.3 V(2)(3) 25 100 µA

ILI Input leakage current VSS < VIN < VCC –1 ±0.1 1 µA

ILO Output leakage current 0.45 < VIN < VCC –10 ±5 10 µA

ICC

(DC)(4)

Operating

supply current

PLD only

PLD_TURBO = off,

f = 0 MHz(3) 0 µA/PT

PLD_TURBO = on,

f = 0 MHz 200 400 µA/PT

Flash memory

During Flash memory

WRITE/Erase only 10 25 mA

Read only, f = 0 MHz 0 0 mA

SRAM f = 0 MHz 0 0 mA

ICC

(AC)(4)

PLD AC adder (5)

Flash memory AC adder 1.5 2.0 mA/MHz

SRAM AC adder 0.8 1.5 mA/MHz

1. Reset (RESET) has hysteresis. VIL1 is valid at or below 0.2VCC –0.1. VIH1 is valid at or above 0.8VCC.

2. CSI deselected or internal Power-down mode is active.

3. PLD is in non-Turbo mode, and none of the inputs are switching.

4. IOUT = 0 mA

5. Please see Figure 35 for the PLD current calculation.

AC/DC parameters PSD8XXFX

100/128 Doc ID 7833 Rev 7

Figure 39. Input to output disable / enable

tER tEA

INPUT

INPUT TO

OUTPUT

ENABLE/DISABLE

AI02863

Table 48. CPLD combinatorial timing (5 V devices)

Symbol Parameter Conditions

-70 -90 -15 Fast

Aloc

Turbo

off

Slew

rate

(1)

Unit

MinMaxMinMaxMinMax

tPD

CPLD input

pin/feedback to

CPLD combinatorial

output

20 25 32 + 2 + 10 – 2 ns

tEA

CPLD input to CPLD

output enable 21 26 32 + 10 – 2 ns

tER

CPLD input to CPLD

output disable 21 26 32 + 10 – 2 ns

tARP

CPLD register clear

or preset delay 21 26 33 + 10 – 2 ns

tARPW

CPLD register clear

or preset pulse width 10 20 29 + 10 ns

tARD CPLD array delay Any

macrocell 11 16 22 + 2 ns

1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount.

Table 49. CPLD combinatorial timing (3 V devices)

Symbol Parameter Conditions

-12 -15 -20 PT

Aloc

Tur bo

off

Slew

rate

(1)

Unit

Min Max Min Max Min Max

tPD

CPLD input

pin/feedback to

CPLD combinatorial

output

40 45 50 + 4 + 20 – 6 ns

tEA

CPLD input to CPLD

output enable 43 45 50 + 20 – 6 ns

tER

CPLD input to CPLD

output disable 43 45 50 + 20 – 6 ns

tARP

CPLD register clear

or preset delay 40 43 48 + 20 – 6 ns

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 101/128

Figure 40. Synchronous clock mode timing – PLD

tARPW

CPLD register clear

or preset pulse width 25 30 35 + 20 ns

tARD CPLD array delay Any

macrocell 25 29 33 + 4 ns

1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount.

Table 49. CPLD combinatorial timing (3 V devices) (continued)

Symbol Parameter Conditions

-12 -15 -20 PT

Aloc

Tur bo

off

Slew

rate

(1)

Unit

Min Max Min Max Min Max

tCH tCL

tCO

CLKIN

INPUT

REGISTERED

OUTPUT

AI02860

Table 50. CPLD macrocell Synchronous clock mode timing (5 V devices)

Symbol Parameter Conditions

-70 -90 -15 Fast

Aloc

Tur bo

off

Slew

rate

(1)

Unit

Min Max Min Max Min Max

fMAX

Maximum

frequency

External

feedback

1/(tS+tCO) 40.0 30.30 25.00 MHz

Maximum

frequency

Internal

feedback (fCNT)

1/(tS+tCO–10) 66.6 43.48 31.25 MHz

Maximum

frequency

Pipelined data

1/(tCH+tCL) 83.3 50.00 35.71 MHz

tSInput setup time 12 15 20 + 2 + 10 ns

tHInput hold time 0 0 0 ns

tCH Clock high time Clock input 6 10 15 ns

tCL Clock low time Clock input 6 10 15 ns

tCO

Clock to output

delay Clock input 13 18 22 – 2 ns

AC/DC parameters PSD8XXFX

102/128 Doc ID 7833 Rev 7

tARD

CPLD array

delay Any macrocell 11 16 22 + 2 ns

tMIN

Minimum clock

period(2) tCH+tCL 12 20 30 ns

1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount.

2. CLKIN (PD1) tCLCL = tCH + tCL.

Table 50. CPLD macrocell Synchronous clock mode timing (5 V devices) (continued)

Symbol Parameter Conditions

-70 -90 -15 Fast

Aloc

Tur bo

off

Slew

rate

(1)

Unit

Min Max Min Max Min Max

Table 51. CPLD macrocell synchronous clock mode timing (3 V devices)

Symbol Parameter Conditions

-12 -15 -20 PT

Aloc

Turbo

off

Slew

rate

(1)

Unit

Min Max Min Max Min Max

fMAX

Maximum

frequency

External feedback

1/(tS+tCO) 22.2 18.8 15.8 MHz

Maximum

frequency

Internal feedback

(fCNT)

1/(tS+tCO–10) 28.5 23.2 18.8 MHz

Maximum

frequency

Pipelined data

1/(tCH+tCL) 40.0 33.3 31.2 MHz

tSInput setup time 20 25 30 + 4 + 20 ns

tHInput hold time 0 0 0 ns

tCH Clock high time Clock input 15 15 16 ns

tCL Clock low time Clock input 10 15 16 ns

tCO

Clock to output

delay Clock input 25 28 33 – 6 ns

tARD CPLD array delay Any macrocell 25 29 33 + 4 ns

tMIN

Minimum clock

period(2) tCH+tCL 25 29 32 ns

1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount.

2. CLKIN (PD1) tCLCL = tCH + tCL.

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 103/128

Figure 41. Asynchronous Reset / Preset

Figure 42. Asynchronous Clock mode Timing (product term clock)

tARP

OUTPUT

tARPW

RESET/PRESET

INPUT

AI02864

tCHA tCLA

tCOA

tHAtSA

CLOCK

INPUT

REGISTERED

OUTPUT

AI02859

Table 52. CPLD macrocell asynchronous clock mode timing (5 V devices)

Symbol Parameter Conditions

-70 -90 -15 PT

Aloc

Turbo

off

Slew

rate Unit

Min Max Min Max Min Max

fMAXA

Maximum

frequency

External

feedback

1/(tSA+tCOA) 38.4 26.32 21.27 MHz

Maximum

frequency

Internal

feedback

(fCNTA)

1/(tSA+tCOA–10) 62.5 35.71 27.78 MHz

Maximum

frequency

Pipelined data

1/(tCHA+tCLA) 71.4 41.67 35.71 MHz

tSA

Input setup

time 7 8 12 + 2 + 10 ns

tHA

Input hold

time 81214 ns

tCHA

Clock input

high time 9 12 15 + 10 ns

tCLA

Clock input

low time 9 12 15 + 10 ns

AC/DC parameters PSD8XXFX

104/128 Doc ID 7833 Rev 7

tCOA

Clock to

output delay 21 30 37 + 10 – 2 ns

tARDA

CPLD array

delay Any macrocell 11 16 22 + 2 ns

tMINA

Minimum

clock period 1/fCNTA 16 28 39 ns

Table 52. CPLD macrocell asynchronous clock mode timing (5 V devices) (continued)

Symbol Parameter Conditions

-70 -90 -15 PT

Aloc

Turbo

off

Slew

rate Unit

Min Max Min Max Min Max

Table 53. CPLD macrocell Asynchronous clock mode timing (3 V devices)

Symbol Parameter Conditions

-12 -15 -20 PT

Aloc

Tur bo

off

Slew

rate Unit

Min Max Min Max Min Max

fMAXA

Maximum

frequency

External

feedback

1/(tSA+tCOA) 21.7 19.2 16.9 MHz

Maximum

frequency

Internal

feedback

(fCNTA)

1/(tSA+tCOA–10) 27.8 23.8 20.4 MHz

Maximum

frequency

Pipelined data

1/(tCHA+tCLA) 33.3 27 24.4 MHz

tSA Input setup time 10 12 13 + 4 + 20 ns

tHA Input hold time 12 15 17 ns

tCHA Clock high time 17 22 25 + 20 ns

tCLA Clock low time 13 15 16 + 20 ns

tCOA

Clock to output

delay 36 40 46 + 20 – 6 ns

tARD

CPLD array

delay Any macrocell 25 29 33 + 4 ns

tMINA

Minimum clock

period 1/fCNTA 36 42 49 ns

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 105/128

Figure 43. Input macrocell timing (product term clock)

tINH tINL

tINO

tIH

tIS

PT CLOCK

INPUT

OUTPUT

AI03101

Table 54. Input macrocell timing (5 V devices)

Symbol Parameter Conditions

-70 -90 -15 PT

Aloc

Tur bo

off Unit

Min Max Min Max Min Max

tIS Input setup time (1) 000 ns

tIH Input hold time (1) 15 20 26 + 10 ns

tINH NIB input high time (1) 91218 ns

tINL NIB input low time (1) 91218 ns

tINO

NIB input to combinatorial

delay

(1) 34 46 59 + 2 + 10 ns

1. Inputs from port A, B, and C relative to register/ latch clock from the PLD. ALE/AS latch timings refer to tAVLX and tLXAX.

Table 55. input macrocell timing (3 V devices)

Symbol Parameter Conditions

-12 -15 -20 PT

Aloc

Tur bo

off Unit

Min Max Min Max Min Max

tIS Input setup time (1) 000 ns

tIH Input hold time (1) 25 25 30 + 20 ns

tINH NIB input high time (1) 12 13 15 ns

tINL NIB input low time (1) 12 13 15 ns

tINO

NIB input to combinatorial

delay

(1) 46 62 70 + 4 + 20 ns

1. Inputs from port A, B, and C relative to register/ latch clock from the PLD. ALE latch timings refer to tAVLX and tLXAX.

AC/DC parameters PSD8XXFX

106/128 Doc ID 7833 Rev 7

Figure 44. READ timing

1. tAVLX and tLXAX are not required for 80C251 in Page mode or 80C51XA in Burst mode.

tAVLX tLXAX1

tLVLX

tAVQV

tSLQV

tRLQV tRHQX

tRHQZ

tELTL

tEHEL

tRLRH

tTHEH

tAVPV

ADDRESS

VALID

ADDRESS

VALID

DATA

VALID

DATA

VALID

ADDRESS OUT

ALE/AS

A/D

MULTIPLEXED

BUS

ADDRESS

NON-MULTIPLEXED

BUS

DATA

NON-MULTIPLEXED

BUS

CSI

(PSEN, DS)

R/W

AI02895

Table 56. READ timing (5 V devices)

Symbol Parameter Conditions

-70 -90 -15 Turbo

off Unit

Min Max Min Max Min Max

tLVL X ALE or AS pulse width 15 20 28 ns

tAVLX Address setup time (1) 4 6 10 ns

tLXAX Address hold time (1) 7 8 11 ns

tAVQV Address valid to data valid (1) 70 90 150 + 10 ns

tSLQV CS valid to data valid 75 100 150 ns

tRLQV

RD to data valid 8-bit bus (2) 24 32 40 ns

RD or PSEN to data valid

8-bit bus, 8031, 80251

(3) 31 38 45 ns

tRHQX RD data hold time (4) 000 ns

tRLRH RD pulse width (4) 27 32 38 ns

tRHQZ RD to data high-Z (4) 20 25 30 ns

tEHEL E pulse width 27 32 38 ns

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 107/128

tTHEH R/W setup time to Enable 6 10 18 ns

tELTL R/W hold time After Enable 0 0 0 ns

tAVPV

Address input valid to

Address output delay

(5) 20 25 30 ns

1. Any input used to select an internal PSD function.

2. RD timing has the same timing as DS, LDS, and UDS signals.

3. RD and PSEN have the same timing.

4. RD timing has the same timing as DS, LDS, UDS, and PSEN signals.

5. In multiplexed mode, latched addresses generated from ADIO delay to address output on any port.

Table 56. READ timing (5 V devices) (continued)

Symbol Parameter Conditions

-70 -90 -15 Turbo

off Unit

Min Max Min Max Min Max

Table 57. READ timing (3 V devices)

Symbol Parameter Conditions

-12 -15 -20 Turbo

off Unit

Min Max Min Max Min Max

tLVL X ALE or AS pulse width 26 26 30 ns

tAVLX Address setup time (1) 91012 ns

tLXAX Address hold time (1) 91214 ns

tAVQV Address valid to data valid (1) 120 150 200 + 20 ns

tSLQV CS valid to data valid 120 150 200 ns

tRLQV

RD to data valid 8-bit bus (2) 35 35 40 ns

RD or PSEN to data valid 8-bit bus,

8031, 80251

(3) 45 50 55 ns

tRHQX RD data hold time (4) 000 ns

tRLRH RD pulse width 38 40 45 ns

tRHQZ RD to data high-Z (4) 38 40 45 ns

tEHEL E pulse width 40 45 52 ns

tTHEH R/W setup time to enable 15 18 20 ns

tELTL R/W hold time after enable 0 0 0 ns

tAVPV

Address input valid to

address output delay

(5) 33 35 40 ns

1. Any input used to select an internal PSD function.

2. RD timing has the same timing as DS, LDS, and UDS signals.

3. RD and PSEN have the same timing for 8031.

4. RD timing has the same timing as DS, LDS, UDS, and PSEN signals.

5. In multiplexed mode latched address generated from ADIO delay to address output on any port.

AC/DC parameters PSD8XXFX

108/128 Doc ID 7833 Rev 7

Figure 45. WRITE timing

tAVLX tLXAX

tLVLX

tAVWL

tSLWL

tWHDX

tWHAX

tELTL

tEHEL

tWLMV

tWLWH

tDVWH

tTHEH

tAVPV

ADDRESS

VALID

ADDRESS

VALID

DATA

VALID

DATA

VALID

ADDRESS OUT

tWHPV

STANDARD

MCU I/O OUT

ALE/AS

A/D

MULTIPLEXED

BUS

ADDRESS

NON-MULTIPLEXED

BUS

DATA

NON-MULTIPLEXED

BUS

CSI

(DS)

R/ W

AI02896

Table 58. WRITE timing (5 V devices)

Symbol Parameter Conditions

-70 -90 -15

Unit

Min Max Min Max Min Max

tLVL X ALE or AS pulse width 15 20 28 ns

tAVLX Address setup time (1) 4 6 10 ns

tLXAX Address hold time (1) 7 8 11 ns

tAVWL

Address valid to leading

edge of WR

(1)(2) 81520ns

tSLWL CS valid to leading edge of WR (2) 12 15 20 ns

tDVWH WR data setup time (2) 25 35 45 ns

tWHDX WR data hold time (2) 455ns

tWLWH WR pulse widthpulse width (2) 31 35 45 ns

tWHAX1 Trailing edge of WR to address invalid (2) 6 8 10 ns

tWHAX2

Trailing edge of WR to DPLD address

invalid

(2)(3) 000ns

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 109/128

tWHPV

Trailing edge of WR to port output

valid using I/O port data register

(2) 27 30 38 ns

tDVMV

Data valid to port output valid

using macrocell register

Preset/Clear

(2)(4) 42 55 65 ns

tAVPV

Address input valid to address

output delay

(5) 20 25 30 ns

tWLMV

WR valid to port output valid using

macrocell register Preset/Clear

(2)(6) 48 55 65 ns

1. Any input used to select an internal PSD function.

2. WR has the same timing as E, LDS, UDS, WRL, and WRH signals.

3. tWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal PSD memory.

4. Assuming WRITE is active before data becomes valid.

5. In multiplexed mode, latched address generated from ADIO delay to address output on any port.

6. Assuming data is stable before active WRITE signal.

Table 58. WRITE timing (5 V devices) (continued)

Symbol Parameter Conditions

-70 -90 -15

Unit

Min Max Min Max Min Max

Table 59. WRITE timing (3 V devices)

Symbol Parameter Conditions

-12 -15 -20

Unit

MinMaxMinMaxMinMax

tLVL X ALE or AS pulse width 26 26 30

tAVLX Address setup time (1) 91012ns

tLXAX Address hold time (1) 91214ns

tAVWL

Address valid to Leading

Edge of WR

(1)(2) 17 20 25 ns

tSLWL CS valid to Leading Edge of WR (2) 17 20 25 ns

tDVWH WR data setup time (2) 45 45 50 ns

tWHDX WR data hold time (2) 7 8 10 ns

tWLWH WR pulse width (2) 46 48 53 ns

tWHAX1 Trailing edge of WR to address invalid (2) 10 12 17 ns

tWHAX2

Trailing edge of WR to DPLD address

invalid

(2)(3) 000ns

tWHPV

Trailing edge of WR to port output

valid using I/O port data register

(2) 33 35 40 ns

tDVMV

Data valid to port output valid

using macrocell register Preset/Clear

(2)(4) 70 70 80 ns

AC/DC parameters PSD8XXFX

110/128 Doc ID 7833 Rev 7

tAVPV Address input valid to address output delay (5) 33 35 40 ns

tWLMV

WR valid to port output valid using

macrocell register Preset/Clear

(2)(6) 70 70 80 ns

1. Any input used to select an internal PSD function.

2. WR has the same timing as E, LDS, UDS, WRL, and WRH signals.

3. tWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal PSD memory.

4. Assuming WRITE is active before data becomes valid.

5. In multiplexed mode, latched address generated from ADIO delay to address output on any port.

6. Assuming data is stable before active WRITE signal.

Table 59. WRITE timing (3 V devices) (continued)

Symbol Parameter Conditions

-12 -15 -20

Unit

Min Max Min Max Min Max

Table 60. Program, WRITE and Erase times (5 V devices)

Symbol Parameter Min. Typ. Max. Unit

Flash Program 8.5 s

Flash Bulk Erase (pre-programmed)(1) 330s

Flash Bulk Erase (not pre-programmed) 5 s

tWHQV3 Sector Erase (pre-programmed) 1 30 s

tWHQV2 Sector Erase (not pre-programmed) 2.2 s

tWHQV1 Byte Program 14 1200 µs

Program/Erase cycles (per sector) 100,000 cycles

tWHWLO Sector Erase timeout 100 µs

tQ7VQV DQ7 valid to output (DQ7-DQ0) valid (data polling)(2) 30 ns

1. The whole memory is programmed to 00h before erase.

2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.

Table 61. Program, WRITE and Erase times (3 V devices)

Symbol Parameter Min. Typ. Max. Unit

Flash Program 8.5 s

Flash Bulk Erase (pre-programmed)(1) 330s

Flash Bulk Erase (not pre-programmed) 5 s

tWHQV3 Sector Erase (pre-programmed) 1 30 s

tWHQV2 Sector Erase (not pre-programmed) 2.2 s

tWHQV1 Byte Program 14 1200 µs

Program / Erase Cycles (per sector) 100,000 cycles

tWHWLO Sector Erase timeout 100 µs

tQ7VQV DQ7 valid to Output (DQ7-DQ0) valid (data polling)(2) 30 ns

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 111/128

Figure 46. Peripheral I/O READ timing

1. The whole memory is programmed to 00h before erase.

2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.

tQXRH (PA)

tRLQV (PA)

tRLRH (PA)

tDVQV (PA)

tRHQZ (PA)

tSLQV (PA)

tAVQV (PA)

ADDRESS DATA VALID

ALE/AS

A/D BUS

DATA ON PORT A

CSI

AI02897

Table 62. Port A Peripheral Data mode READ timing (5 V devices)

Symbol Parameter Conditions

-70 -90 -15 Turbo

off Unit

Min Max Min Max Min Max

tAVQV–PA Address valid to data valid (1) 37 39 45 + 10 ns

tSLQV–PA CSI valid to data valid 27 35 45 + 10 ns

tRLQV–PA

RD to data valid (2)(3) 21 32 40 ns

RD to data valid 8031 mode 32 38 45 ns

tDVQV–PA Data In to data out valid 22 30 38 ns

tQXRH–PA RD data hold time 0 0 0 ns

tRLRH–PA RD pulse width (2) 27 32 38 ns

tRHQZ–PA RD to data high-Z (2) 23 25 30 ns

1. Any input used to select port A Data Peripheral mode.

2. RD has the same timing as DS, LDS, UDS, and PSEN (in 8031 combined mode).

3. Data is already stable on port A.

AC/DC parameters PSD8XXFX

112/128 Doc ID 7833 Rev 7

Figure 47. Peripheral I/O WRITE timing

Table 63. Port A Peripheral Data mode READ timing (3V devices)

Symbol Parameter Conditions

-12 -15 -20 Turbo

off Unit

Min Max Min Max Min Max

tAVQV–PA Address valid to data valid (1) 50 50 50 + 20 ns

tSLQV–PA CSI valid to data valid 37 45 50 + 20 ns

tRLQV–PA

RD to data valid (2)(3) 37 40 45 ns

RD to data valid 8031 mode 45 45 50 ns

tDVQV–PA Data In to data Out valid 38 40 45 ns

tQXRH–PA RD data hold time 0 0 0 ns

tRLRH–PA RD pulse width (2) 36 36 46 ns

tRHQZ–PA RD to data high-Z (2) 36 40 45 ns

1. Any input used to select port A Data Peripheral mode.

2. RD has the same timing as DS, LDS, UDS, and PSEN (in 8031 combined mode).

3. Data is already stable on port A.

tDVQV (PA)

tWLQV (PA) tWHQZ (PA)

ADDRESS DATA OUT

A/D BUS

PORT A

DATA OUT

ALE/AS

AI02898

Table 64. Port A Peripheral Data mode WRITE timing (5 V devices)

Symbol Parameter Conditions

-70 -90 -15

Unit

Min Max Min Max Min Max

tWLQV–PA WR to data propagation delay (1) 25 35 40 ns

tDVQV–PA Data to port A data propagation delay (2) 22 30 38 ns

tWHQZ–PA WR invalid to port A tri-state (1) 20 25 33 ns

1. WR has the same timing as the E, LDS, UDS, WRL, and WRH signals.

2. Data stable on ADIO pins to data on port A.

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 113/128

Figure 48. Reset (RESET) timing

Table 65. Port A Peripheral Data mode WRITE timing (3 V devices)

Symbol Parameter Conditions

-12 -15 -20

Unit

Min Max Min Max Min Max

tWLQV–PA WR to data propagation delay (1) 42 45 55 ns

tDVQV–PA Data to port A data propagation delay (2) 38 40 45 ns

tWHQZ–PA WR invalid to port A tri-state (1) 33 33 35 ns

1. WR has the same timing as the E, LDS, UDS, WRL, and WRH signals.

2. Data stable on ADIO pins to data on port A.

tNLNH-PO tOPR

AI02866b

RESET

tNLNH

tNLNH-A tOPR

VCC(min)

Power-On Reset Warm Reset

Table 66. Reset (RESET) timing (5 V devices)

Symbol Parameter Conditions Min Max Unit

tNLNH RESET active low time(1) 150 ns

tNLNH–PO Power-on Reset active low time 1 ms

tNLNH–A Warm Reset (on the PSD834Fx)(2) 25 µs

tOPR RESET high to operational device 120 ns

1. Reset (RESET) does not reset Flash memory program or erase cycles.

2. Warm reset aborts Flash memory program or erase cycles, and puts the device in READ mode.

Table 67. Reset (RESET) timing (3 V devices)

Symbol Parameter Conditions Min Max Unit

tNLNH RESET active low time(1) 300 ns

tNLNH–PO Power-on Reset active low time 1 ms

tNLNH–A Warm Reset (on the PSD834Fx)(2) 25 µs

tOPR RESET high to operational device 300 ns

1. Reset (RESET) does not reset Flash memory program or erase cycles.

2. Warm reset aborts Flash memory program or erase cycles, and puts the device in READ mode.

AC/DC parameters PSD8XXFX

114/128 Doc ID 7833 Rev 7

Figure 49. ISC timing

ISCCH

TCK

TDI/TMS

ISC OUTPUTS/TDO

ISCCL

ISCPH

ISCPSU

ISCPVZ

ISCPZV

ISCPCO

AI02865

Table 68. ISC timing (5 V devices)

Symbol Parameter Conditions

-70 -90 -15

Unit

Min Max Min Max Min Max

tISCCF

Clock (TCK, PC1) frequency (except for

PLD)

(1) 20 18 14 MHz

tISCCH

Clock (TCK, PC1) high time (except for

PLD)

(1) 23 26 31 ns

tISCCL

Clock (TCK, PC1) low time (except for

PLD)

(1) 23 26 31 ns

tISCCFP Clock (TCK, PC1) frequency (PLD only) (2) 222MHz

tISCCHP Clock (TCK, PC1) high time (PLD only) (2) 240 240 240 ns

tISCCLP Clock (TCK, PC1) low time (PLD only) (2) 240 240 240 ns

tISCPSU ISC port setup time 7 8 10 ns

tISCPH ISC port hold up time 5 5 5 ns

tISCPCO ISC port clock to output 21 23 25 ns

tISCPZV ISC port high-impedance to valid output 21 23 25 ns

tISCPVZ

ISC port valid output to

high-Impedance 21 23 25 ns

1. For non-PLD Programming, Erase or in ISC by-pass mode.

2. For program or erase PLD only.

PSD8XXFX AC/DC parameters

Doc ID 7833 Rev 7 115/128

Table 69. ISC timing (3 V devices)

Symbol Parameter Conditions

-12 -15 -20

Unit

Min Max Min Max Min Max

tISCCF

Clock (TCK, PC1) frequency (except for

PLD)

(1) 12 10 9 MHz

tISCCH

Clock (TCK, PC1) high time (except for

PLD)

(1) 40 45 51 ns

tISCCL

Clock (TCK, PC1) low time (except for

PLD)

(1) 40 45 51 ns

tISCCFP Clock (TCK, PC1) frequency (PLD only) (2) 222MHz

tISCCHP Clock (TCK, PC1) high time (PLD only) (2) 240 240 240 ns

tISCCLP Clock (TCK, PC1) low time (PLD only) (2) 240 240 240 ns

tISCPSU ISC port setup time 12 13 15 ns

tISCPH ISC port hold up time 5 5 5 ns

tISCPCO ISC port clock to output 30 36 40 ns

tISCPZV ISC port high-Impedance to valid Output 30 36 40 ns

tISCPVZ ISC port valid Output to high-Impedance 30 36 40 ns

1. For non-PLD Programming, Erase or in ISC by-pass mode.

2. For program or erase PLD only.

Table 70. Power-down timing (5 V devices)

Symbol Parameter Conditions

-70 -90 -15

Unit

Min Max Min Max Min Max

tLVDV ALE access time from Power-down 80 90 150 ns

tCLWH

Maximum delay from APD Enable to

Internal PDN valid signal

Using CLKIN

(PD1) 15 * tCLCL(1) µs

1. tCLCL is the period of CLKIN (PD1).

Table 71. Power-down timing (3 V devices)

Symbol Parameter Conditions

-12 -15 -20

Unit

Min Max Min Max Min Max

tLVDV ALE access time from Power-down 145 150 200 ns

tCLWH

Maximum Delay from APD Enable to

Internal PDN valid Signal

Using CLKIN

(PD1) 15 * tCLCL(1) µs

1. tCLCL is the period of CLKIN (PD1).

Package mechanical PSD8XXFX

116/128 Doc ID 7833 Rev 7

23 Package mechanical

In order to meet environmental requirements, ST offers this device in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

PSD8XXFX Package mechanical

Doc ID 7833 Rev 7 117/128

Figure 50. PQFP52 - 52-pin plastic quad flat package mechanical drawing

1. Drawing is not to scale.

Table 72. PQFP52 - 52-pin plastic quad flat package mechanical dimensions

Symbol

mm inches

Typ. Min. Max. Typ. Min. Max.

A 2.350 0.0930

A1 0.250 0.0100

A2 2.000 1.800 2.100 0.0790 0.0770 0.0830

b 0.220 0.380 0.0090 0.0150

c 0.110 0.230 0.0040 0.0090

D 13.200 13.150 13.250 0.5200 0.5180 0.5220

D1 10.000 9.950 10.050 0.3940 0.3920 0.3960

D2 7.800 – – 0.3070 – –

E 13.200 13.150 13.250 0.5200 0.5180 0.5220

E1 10.000 9.950 10.050 0.3940 0.3920 0.3960

E2 7.800 – – 0.3070 – –

e 0.650 – – 0.0260

L 0.880 0.730 1.030 0.0350 0.0290 0.0410

L1 1.600 – – 0.0630

α0° 7° 0° 7°

N52 52

Nd 13 13

Ne 13 13

CP 0.100 0.0040

QFP-A

LA1 α

Package mechanical PSD8XXFX

118/128 Doc ID 7833 Rev 7

Figure 51. PLCC52 - 52-lead plastic lead chip carrier package mechanical drawing

1. Drawing is not to scale.

Table 73. PLCC52-52-lead plastic lead chip carrier mechanical dimensions

Symbol

mm inches

Typ. Min. Max. Typ. Min. Max.

A 4.190 4.570 0.1650 0.1800

A1 2.540 2.790 0.1000 0.1100

A2 – 0.910 – 0.0360

B 0.330 0.530 0.0130 0.0210

B1 0.660 0.810 0.0260 0.0320

C 0.2460 0.2610 0.0097 0.0103

D 19.940 20.190 0.7850 0.7950

D1 19.050 19.150 0.7500 0.7540

D2 17.530 18.540 0.6900 0.7300

E 19.940 20.190 0.7850 0.7950

E1 19.050 19.150 0.7500 0.7540

E2 17.530 18.540 0.6900 0.7300

e 1.270 – – 0.050 – –

R 0.890 – – 0.035 – –

N52 52

Nd 13 13

Ne 13 13

PLCC-B

E1 E

1 N

D2/E2 e

D3/E3

PSD8XXFX Package mechanical

Doc ID 7833 Rev 7 119/128

Figure 52. TQFP64 - 64-lead thin quad flatpack, package outline

1. Drawing is not to scale.

Table 74. TQFP64 - 64-lead thin quad flatpack, package mechanical data

Symb.

mm inches

Typ. Min. Max. Typ. Min. Max.

A 1.420 1.540 0.0560 0.0610

A1 0.100 0.070 0.140 0.0040 0.0030 0.0050

A2 1.400 1.360 1.440 0.0550 0.0540 0.0570

a 3.5°0.0°7.0°3.5°0.0°7.0°

b 0.350 0.330 0.380 0.0140 0.0130 0.0150

c 0.170 0.006

D 16.000 15.900 16.100 0.6300 0.6260 0.6340

D1 14.000 13.980 14.030 0.5510 0.5500 0.5520

D2 12.000 11.950 12.050 0.4720 0.4700 0.4740

E 16.000 15.900 16.100 0.6300 0.6260 0.6340

E1 14.000 13.980 14.030 0.5510 0.5500 0.5520

E2 12.000 11.950 12.050 0.4720 0.4700 0.4740

e 0.800 0.750 0.850 0.0310 0.0300 0.0330

L 0.600 0.450 0.750 0.0240 0.0180 0.0300

L1 1.000 0.940 1.060 0.0390 0.0370 0.0420

CP 0.100 0.0040

N64 64

Nd 16 16

Ne 16 16

QFP-A

LA1 α

Part numbering PSD8XXFX

120/128 Doc ID 7833 Rev 7

24 Part numbering

For a list of available options (e.g., speed, package) or for further information on any aspect

of this device, please contact your nearest ST Sales Office.

Table 75. Ordering information scheme

Example: PSD8 1 3 F 2 V A – 15 J 1 T

Device Type

PSD8 = 8-bit PSD with register Logic

SRAM Capacity

1 = 16 Kbit

3 = 64 Kbit

5 = 256 Kbit

Flash Memory Capacity

3 = 1 Mbit (128K x 8)

4 = 2 Mbit (256K x 8)

2nd Flash Memory

2 = 256 Kbit Flash memory + SRAM

3 = SRAM but no Flash memory

4 = 256 Kbit Flash memory but no SRAM

5 = no Flash memory + no SRAM

Operating voltage

blank = VCC = 4.5 to 5.5V

V = VCC = 3.0 to 3.6V

Silicon Revision

A = Revision A

Speed

70 = 70ns

90 = 90ns

12 = 120ns

15 = 150ns

20 = 200ns

Package

J = ECOPACK-compliant PLCC52

M = ECOPACK-compliant PQFP52

U =ECOPACK-compliant TQFP64

Temperature Range

blank = 0 to 70°C (commercial)

I = –40 to 85°C (industrial)

Option

T = Tape & Reel Packing

PSD8XXFX PQFP52 pin assignments

Doc ID 7833 Rev 7 121/128

Appendix A PQFP52 pin assignments

Table 76. PQFP52 connections (see Features)

Pin number Pin assignments

1PD2

2PD1

3PD0

4PC7

5PC6

6PC5

7PC4

9GND

10 PC3

11 PC2

12 PC1

13 PC0

14 PA7

15 PA6

16 PA5

17 PA4

18 PA3

19 GND

20 PA2

21 PA1

22 PA0

23 AD0

24 AD1

25 AD2

26 AD3

27 AD4

28 AD5

29 AD6

30 AD7

31 VCC

32 AD8

PQFP52 pin assignments PSD8XXFX

122/128 Doc ID 7833 Rev 7

33 AD9

34 AD10

35 AD11

36 AD12

37 AD13

38 AD14

39 AD15

40 CNTL0

41 RESET

42 CNTL2

43 CNTL1

44 PB7

45 PB6

46 GND

47 PB5

48 PB4

49 PB3

50 PB2

51 PB1

52 PB0

Table 76. PQFP52 connections (see Features) (continued)

Pin number Pin assignments

PSD8XXFX PLCC52 pin assignments

Doc ID 7833 Rev 7 123/128

Appendix B PLCC52 pin assignments

Table 77. PLCC52 connections (see Features)

Pin number Pin assignments

1GND

2 PB5

3 PB4

4 PB3

5 PB2

6 PB1

7 PB0

8PD2

9PD1

10 PD0

11 PC7

12 PC6

13 PC5

14 PC4

15 VCC

16 GND

17 PC3

18 PC2

19 PC1

20 PC0

21 PA7

22 PA6

23 PA5

24 PA4

25 PA3

26 GND

27 PA2

28 PA1

29 PA0

30 AD0

31 AD1

32 AD2

PLCC52 pin assignments PSD8XXFX

124/128 Doc ID 7833 Rev 7

33 AD3

34 AD4

35 AD5

36 AD6

37 AD7

38 VCC

39 AD8

40 AD9

41 AD10

42 AD11

43 AD12

44 AD13

45 AD14

46 AD15

47 CNTL0

48 RESET

49 CNTL2

50 CNTL1

51 PB7

52 PB6

Table 77. PLCC52 connections (see Features) (continued)

Pin number Pin assignments

PSD8XXFX TQFP64 pin assignments

Doc ID 7833 Rev 7 125/128

Appendix C TQFP64 pin assignments

Table 78. TQFP64 connections (see Features)

Pin number Pin assignments

1PD2

2PD1

3PD0

4PC7

5PC6

6PC5

10 GND

11 GND

12 PC3

13 PC2

14 PC1

15 PC0

16 NC

17 NC

18 NC

19 PA7

20 PA6

21 PA5

22 PA4

23 PA3

24 GND

25 GND

26 PA2

27 PA1

28 PA0

29 AD0

30 AD1

31 N/D

32 AD2

TQFP64 pin assignments PSD8XXFX

126/128 Doc ID 7833 Rev 7

33 AD3

34 AD4

35 AD5

36 AD6

37 AD7

38 VCC

39 VCC

40 AD8

41 AD9

42 AD10

43 AD11

44 AD12

45 AD13

46 AD14

47 AD15

48 CNTL0

49 NC

50 RESET

51 CNTL2

52 CNTL1

53 PB7

54 PB6

55 GND

56 GND

57 PB5

58 PB4

59 PB3

60 PB2

61 PB1

62 PB0

63 NC

64 NC

Table 78. TQFP64 connections (see Features) (continued)

Pin number Pin assignments

PSD8XXFX Revision history
Doc ID 7833 Rev 7 127/128
         
Revision history
         
Table 79. Document revision history
Date Revision Changes
15-Oct-99 1.0 Initial release as a WSI document
27-Oct-00 1.1 Port A Peripheral Data mode Read Timing, changed to 50
30-Nov-00 1.2 PSD85xF2 added
23-Oct-01 2.0 Document rewritten using the ST template
07-Apr-03 3.0 v2.2 Template applied; voltage correction (Tab le 7 5 )
12-Jun-03 3.1 Fix errors in PQFQ52 Connections
02-Oct-03 3.2 Correct Instructions (Ta bl e 1 0 ); update disclaimer, Title for EDOCS 
application
17-Nov-03 3.3 Correct package references (Features)
04-Jun-04 4.0
Reformatted (adjust RPN list); added Ta bl e 9 ; added ‘U’ package 
(64-pin) (Features, Figure 3, Figure 52; Ta bl e 7 4 , Tabl e 7 5 , 
Ta bl e 7 8 ); 5V split from original
05-Jan-06 5.0 Added Silicon Revision A into part numbering scheme. See Ta bl e 7 5
13-Feb-2009 6
Document reformatted. 
Removed root part number PSD813F3.
SRAM standby mode removed. Backup battery feature removed.
All products are delivered in ECOPACK-compliant packages. 
Section 23: Package mechanical updated.
Minor text modifications.
05-May-2009 7 Corrected pin 7 of TQFP64 package in Figure 3: TQFP64 
connections. 

PSD8XXFX

128/128 Doc ID 7833 Rev 7

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