PIC12(L)F1501 Data Sheet 8-Pin Flash, 8-Bit Microcontrollers *8-bit, 8-pin devices protected by Microchip's Low Pin Count Patent: U.S. Patent No. 5,847,450. Additional U.S. and foreign patents and applications may be issued or pending. 2011 Microchip Technology Inc. Preliminary DS41615A Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-61341-765-2 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS41615A-page 2 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 8-Pin Flash, 8-Bit Microcontrollers High-Performance RISC CPU: Low-Power Features (PIC12LF1501): * * * * * * Standby Current: - 20 nA @ 1.8V, typical * Watchdog Timer Current: - 200 nA @ 1.8V, typical * Operating Current: - 30 A/MHz @ 1.8V, typical C Compiler Optimized Architecture Only 49 Instructions 1K Words Linear Program Memory Addressing 64 bytes Linear Data Memory Addressing Operating Speed: - DC - 20 MHz clock input - DC - 200 ns instruction cycle * Interrupt Capability with Automatic Context Saving * 16-Level Deep Hardware Stack with Optional Overflow/Underflow Reset * Direct, Indirect and Relative Addressing modes: - Two full 16-bit File Select Registers (FSRs) - FSRs can read program and data memory Peripheral Features: Flexible Oscillator Structure: * 16 MHz Internal Oscillator Block: - Factory calibrated to 1%, typical - Software selectable frequency range from 16 MHz to 31 kHz * 31 kHz Low-Power Internal Oscillator * Three External Clock modes up to 20 MHz Special Microcontroller Features: * Operating Voltage Range: - 1.8V to 3.6V (PIC12LF1501) - 2.3V to 5.5V (PIC12F1501) * Self-Programmable under Software Control * Power-on Reset (POR) * Power-up Timer (PWRT) * Programmable Low-Power Brown-Out Reset (LPBOR) * Extended Watchdog Timer (WDT): - Programmable period from 1 ms to 256s * Programmable Code Protection * In-Circuit Serial ProgrammingTM (ICSPTM) via Two Pins * Enhanced Low-Voltage Programming (LVP) * Power-Saving Sleep mode: - Low-Power Sleep mode - Low-Power BOR (LPBOR) * Integrated Temperature Indicator * 128 Bytes High-Endurance Flash: - 100,000 write Flash endurance (minimum) 2011 Microchip Technology Inc. * Analog-to-Digital Converter (ADC): - 10-bit resolution - 4 external channels - 2 internal channels: - Fixed Voltage Reference and DAC channels - Temperature Indicator channel - Auto acquisition capability - Conversion available during Sleep * 1 Comparator: - Rail-to-rail inputs - Power mode control - Software controllable hysteresis * Voltage Reference module: - Fixed Voltage Reference (FVR) with 1.024V, 2.048V and 4.096V output levels - 1 rail-to-rail resistive 5-bit DAC with positive reference selection * 6 I/O Pins (1 Input-only Pin): - High current sink/source 25 mA/25 mA - Individually programmable weak pull-ups - Individually programmable interrupt-on-change (IOC) pins * Timer0: 8-Bit Timer/Counter with 8-Bit Programmable Prescaler * Enhanced Timer1: - 16-bit timer/counter with prescaler - External Gate Input mode * Timer2: 8-Bit Timer/Counter with 8-Bit Period Register, Prescaler and Postscaler * Four 10-bit PWM modules * 2 Configurable Logic Cell (CLC) modules: - 16 selectable input source signals - Four inputs per module - Software control of combinational/sequential logic/state/clock functions - AND/OR/XOR/D Flop/D Latch/SR/JK - External or internal inputs/outputs - Operation while in Sleep Preliminary DS41615A-page 3 PIC12(L)F1501 Peripheral Features (Continued): * Numerically Controlled Oscillator (NCO): - 20-bit accumulator - 16-bit increment - True linear frequency control - High-speed clock input - Selectable Output modes: - Fixed Duty Cycle (FDC) mode - Pulse Frequency (PF) mode * Complementary Waveform Generator (CWG): - 8 selectable signal sources - Selectable falling and rising edge dead-band control - Polarity control - 4 auto-shutdown sources - Multiple input sources: PWM, CLC, NCO DS41615A-page 4 Preliminary Debug(1) XLP PIC12(L)F1501 (1) 1024 64 6 4 1 1 2/1 4 -- -- 1 2 PIC16(L)F1503 (2) 2048 128 12 8 2 1 2/1 4 -- 1 1 2 PIC16(L)F1507 (3) 2048 128 18 12 -- -- 2/1 4 -- -- 1 2 PIC16(L)F1508 (4) 4096 256 18 12 2 1 2/1 4 1 1 1 4 PIC16(L)F1509 (4) 8192 512 18 12 2 1 2/1 4 1 1 1 4 Note 1: I - Debugging, Integrated on Chip; H - Debugging, Requires Debug Header. 2: One pin is input-only. Data Sheet Index: (Unshaded devices are described in this document.) 1: Future Product PIC12(L)F1501 Data Sheet, 8-Pin Flash, 8-bit Microcontrollers. 2: DS41607 PIC16(L)F1503 Data Sheet, 14-Pin Flash, 8-bit Microcontrollers. 3: DS41586 PIC16(L)F1507 Data Sheet, 20-Pin Flash, 8-bit Microcontrollers. 4: DS41609 PIC16(L)F1508/1509 Data Sheet, 20-Pin Flash, 8-bit Microcontrollers. NCO CLC CWG MSSP (I2C/SPI) EUSART PWM Timers (8/16-bit) DAC Comparators 10-bit ADC (ch) I/O's(2) Data SRAM (bytes) Program Memory Flash (words) Device Data Sheet Index PIC12(L)F1501/PIC16(L)F150X Family Types 1 1 1 1 1 H H H I/H I/H -- -- -- Y Y 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 1: 8-PIN PDIP, SOIC, MSOP, DFN DIAGRAM FOR PIC12(L)F1501 VDD 1 RA5 2 RA4 3 MCLR/VPP/RA3 4 PIC12(L)F1501 PDIP, SOIC, MSOP, DFN 8 VSS 7 RA0/ICSPDAT 6 RA1/ICSPCLK 5 RA2 Note: See Table 1 for location of all peripheral functions. ADC Reference Comparator Timer CWG NCO CLC PWM Interrupt Pull-Up RA0 7 AN0 DACOUT1 C1IN+ -- CWG1B(1) -- CLC2IN1 PWM2 IOC Y ICSPDAT RA1 6 AN1 VREF+ C1IN0- -- -- NCO1(1) CLC2IN0 -- IOC Y ICSPCLK RA2 5 AN2 DACOUT2 C1OUT T0CKI CWG1A(1) CWG1FLT -- CLC1(1) PWM1 INT IOC Y -- RA3 4 -- -- -- T1G(2) -- -- CLC1IN0 -- IOC Y MCLR VPP RA4 3 AN3 -- C1IN1- T1G(1) CWG1B(2) CLC1(2) PWM3 IOC Y CLKOUT T1CKI (2) CLC1IN1 CLC2 PWM4 IOC Y CLKIN RA5 2 VDD 1 -- -- -- -- -- -- -- -- -- -- VDD VSS 8 -- -- -- -- -- -- -- -- -- -- VSS Note 1: 2: -- -- -- CWG1A (2) NCO1 NCO1CLK Basic 8-Pin PDIP/SOIC/MSOP/DFN 8-PIN ALLOCATION TABLE (PIC12(L)F1501) I/O TABLE 1: Default location for peripheral pin function. Alternate location can be selected using the APFCON register. Alternate location for peripheral pin function selected by the APFCON register. 2011 Microchip Technology Inc. Preliminary DS41615A-page 5 PIC12(L)F1501 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 9 2.0 Enhanced Mid-Range CPU ........................................................................................................................................................ 13 3.0 Memory Organization ................................................................................................................................................................. 15 4.0 Device Configuration .................................................................................................................................................................. 39 5.0 Oscillator Module........................................................................................................................................................................ 45 6.0 Resets ........................................................................................................................................................................................ 53 7.0 Interrupts .................................................................................................................................................................................... 61 8.0 Power-Down Mode (Sleep) ........................................................................................................................................................ 75 9.0 Watchdog Timer ......................................................................................................................................................................... 79 10.0 Flash Program Memory Control ................................................................................................................................................. 83 11.0 I/O Ports ..................................................................................................................................................................................... 99 12.0 Interrupt-On-Change ................................................................................................................................................................ 105 13.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 109 14.0 Temperature Indicator Module ................................................................................................................................................. 111 15.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 113 16.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 127 17.0 Comparator Module.................................................................................................................................................................. 131 18.0 Timer0 Module ......................................................................................................................................................................... 141 19.0 Timer1 Module with Gate Control............................................................................................................................................. 145 20.0 Timer2 Module ......................................................................................................................................................................... 157 21.0 Pulse-Width Modulation (PWM) Module .................................................................................................................................. 161 22.0 Configurable Logic Cell (CLC).................................................................................................................................................. 167 23.0 Numerically Controlled Oscillator (NCO) Module ..................................................................................................................... 183 24.0 Complementary Waveform Generator (CWG) Module ............................................................................................................ 193 25.0 In-Circuit Serial ProgrammingTM (ICSPTM) ............................................................................................................................... 209 26.0 Instruction Set Summary .......................................................................................................................................................... 211 27.0 Electrical Specifications............................................................................................................................................................ 225 28.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 247 29.0 Development Support............................................................................................................................................................... 249 30.0 Packaging Information.............................................................................................................................................................. 253 Appendix A: Data Sheet Revision History.......................................................................................................................................... 267 Index .................................................................................................................................................................................................. 269 The Microchip Web Site ..................................................................................................................................................................... 275 Customer Change Notification Service .............................................................................................................................................. 275 Customer Support .............................................................................................................................................................................. 275 Reader Response .............................................................................................................................................................................. 276 Product Identification System............................................................................................................................................................. 277 DS41615A-page 6 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2011 Microchip Technology Inc. Preliminary DS41615A-page 7 PIC12(L)F1501 NOTES: DS41615A-page 8 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 1.0 DEVICE OVERVIEW The PIC12(L)F1501 are described within this data sheet. They are available in 14-pin packages. Figure 1-1 shows a block diagram of the PIC12(L)F1501 devices. Table 1-2 shows the pinout descriptions. Reference Table 1-1 for peripherals available per device. Peripheral PIC12LF1501 DEVICE PERIPHERAL SUMMARY PIC12F1501 TABLE 1-1: Analog-to-Digital Converter (ADC) Complementary Wave Generator (CWG) Digital-to-Analog Converter (DAC) Fixed Voltage Reference (FVR) Numerically Controlled Oscillator (NCO) Temperature Indicator C1 CLC1 CLC2 PWM1 PWM2 PWM3 PWM4 Timer0 Timer1 Timer2 Comparators Configurable Logic Cell (CLC) PWM Modules Timers 2011 Microchip Technology Inc. Preliminary DS41615A-page 9 PIC12(L)F1501 FIGURE 1-1: PIC12(L)F1501 BLOCK DIAGRAM Program Flash Memory RAM CLKOUT Timing Generation CLKIN INTRC Oscillator PORTA CPU (Figure 2-1) MCLR C1 Temp. Indicator Note DS41615A-page 10 1: 2: CLC1 ADC 10-Bit CLC2 FVR Timer0 Timer1 PWM1 Timer2 PWM2 CWG1 PWM3 NCO1 PWM4 DAC See applicable chapters for more information on peripherals. See Table 1-1 for peripherals available on specific devices. Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 1-2: PIC12(L)F1501 PINOUT DESCRIPTION Name RA0/AN0/C1IN+/DACOUT1/ CWG1B(1)/CLC2IN1/PWM2/ ICSPDAT RA1/AN1/VREF+/C1IN0-/ NCO1(1)/CLC2IN0/ICSPCLK RA2/AN2/C1OUT/DACOUT2/ T0CKI/INT/PWM1/CLC1(1)/ CWG1A(1)/CWG1FLT RA3/CLC1IN0/VPP/T1G(2)/MCLR (2) RA4/AN3/C1IN1-/CWG1B / CLC1(2)/PWM3/CLKOUT/T1G(1) Function Input Type RA0 TTL AN0 AN Output Type Description CMOS General purpose I/O. -- A/D Channel input. C1IN+ AN -- Comparator positive input. DACOUT1 -- AN Digital-to-Analog Converter output. CWG1B -- CLC2IN1 ST CMOS CWG complementary output. -- Configurable Logic Cell source input. PWM2 -- ICSPDAT ST CMOS Pulse Width Module source output. CMOS ICSPTM Data I/O. RA1 TTL CMOS General purpose I/O. AN1 AN -- A/D Channel input. VREF+ AN -- A/D Positive Voltage Reference input. C1IN0- AN -- Comparator negative input. NCO1 -- CLC2IN0 ST ICSPCLK ST RA2 ST AN2 AN C1OUT -- CMOS Numerically Controlled Oscillator output. -- Configurable Logic Cell source input. -- ICSPTM Programming Clock. CMOS General purpose I/O. -- A/D Channel input. CMOS Comparator output. DACOUT2 -- AN T0CKI ST -- Digital-to-Analog Converter output. Timer0 clock input. INT ST -- External interrupt. PWM1 -- CMOS Pulse Width Module source output. CLC1 -- CMOS Configurable Logic Cell source output. CWG1A -- CMOS CWG complementary output. CWG1FLT ST -- Complementary Waveform Generator Fault input. RA3 TTL -- General purpose input. CLC1IN0 ST -- Configurable Logic Cell source input. VPP HV -- Programming voltage. T1G ST -- Timer1 Gate input. MCLR ST -- Master Clear with internal pull-up. RA4 TTL AN3 AN -- A/D Channel input. C1IN1- AN -- Comparator negative input. CWG1B -- CMOS CWG complementary output. CMOS Configurable Logic Cell source output. CMOS General purpose I/O. CLC1 -- PWM3 -- CMOS Pulse Width Module source output. CLKOUT -- CMOS FOSC/4 output. T1G ST -- Timer1 Gate input. Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2CTM = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Default location for peripheral pin function. Alternate location can be selected using the APFCON register. 2: Alternate location for peripheral pin function selected by the APFCON register. 2011 Microchip Technology Inc. Preliminary DS41615A-page 11 PIC12(L)F1501 TABLE 1-2: PIC12(L)F1501 PINOUT DESCRIPTION (CONTINUED) Function Input Type RA5 TTL CLKIN CMOS -- External clock input (EC mode). T1CKI ST -- Timer1 clock input. CWG1A -- NCO1 ST -- Numerically Controlled Oscillator output. NCO1CLK ST -- Numerically Controlled Oscillator Clock source input. CLC1IN1 ST -- Configurable Logic Cell source input. CLC2 -- CMOS Configurable Logic Cell source output. PWM4 -- CMOS Pulse Width Module source output. VDD VDD Power -- Positive supply. VSS VSS Power -- Ground reference. Name RA5/CLKIN/T1CKI/CWG1A(2)/ NCO1(2)/NCO1CLK/CLC1IN1/ CLC2/PWM4 Output Type Description CMOS General purpose I/O. CMOS CWG complementary output. Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2CTM = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Default location for peripheral pin function. Alternate location can be selected using the APFCON register. 2: Alternate location for peripheral pin function selected by the APFCON register. DS41615A-page 12 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 2.0 ENHANCED MID-RANGE CPU This family of devices contain an enhanced mid-range 8-bit CPU core. The CPU has 49 instructions. Interrupt capability includes automatic context saving. The hardware stack is 16 levels deep and has Overflow and Underflow Reset capability. Direct, Indirect, and Relative addressing modes are available. Two File Select Registers (FSRs) provide the ability to read program and data memory. * * * * Automatic Interrupt Context Saving 16-level Stack with Overflow and Underflow File Select Registers Instruction Set 2.1 Automatic Interrupt Context Saving During interrupts, certain registers are automatically saved in shadow registers and restored when returning from the interrupt. This saves stack space and user code. See Section 7.5 "Automatic Context Saving", for more information. 2.2 16-level Stack with Overflow and Underflow These devices have an external stack memory 15 bits wide and 16 words deep. A Stack Overflow or Underflow will set the appropriate bit (STKOVF or STKUNF) in the PCON register and, if enabled, will cause a software Reset. See section Section 3.4 "Stack" for more details. 2.3 File Select Registers There are two 16-bit File Select Registers (FSR). FSRs can access all file registers and program memory, which allows one Data Pointer for all memory. When an FSR points to program memory, there is one additional instruction cycle in instructions using INDF to allow the data to be fetched. General purpose memory can now also be addressed linearly, providing the ability to access contiguous data larger than 80 bytes. There are also new instructions to support the FSRs. See Section 3.5 "Indirect Addressing" for more details. 2.4 Instruction Set There are 49 instructions for the enhanced mid-range CPU to support the features of the CPU. See Section 26.0 "Instruction Set Summary" for more details. 2011 Microchip Technology Inc. Preliminary DS41615A-page 13 PIC12(L)F1501 FIGURE 2-1: CORE BLOCK DIAGRAM 15 Configuration 15 MUX Flash Program Memory Program Bus 16-Level 8 Level Stack Stack (13-bit) (15-bit) 14 Instruction Instruction Reg reg 8 Data Bus Program Counter RAM Program Memory Read (PMR) 12 RAM Addr Addr MUX Indirect Addr 12 12 Direct Addr 7 5 BSR FSR Reg reg 15 FSR0reg Reg FSR FSR1 Reg FSR reg 15 STATUS Reg reg STATUS 8 3 CLKIN CLKOUT Instruction Decodeand & Decode Control Timing Generation Internal Oscillator Block DS41615A-page 14 MUX Power-up Timer Power-on Reset Watchdog Timer Brown-out Reset VDD ALU 8 W Reg VSS Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 3.0 MEMORY ORGANIZATION These devices contain the following types of memory: * Program Memory - Configuration Words - Device ID - User ID - Flash Program Memory * Data Memory - Core Registers - Special Function Registers - General Purpose RAM - Common RAM TABLE 3-1: Device * PCL and PCLATH * Stack * Indirect Addressing 3.1 Program Memory Organization The enhanced mid-range core has a 15-bit program counter capable of addressing 32K x 14 program memory space. Table 3-1 shows the memory sizes implemented. Accessing a location above these boundaries will cause a wrap-around within the implemented memory space. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figure 3-1). DEVICE SIZES AND ADDRESSES Program Memory Size (Words) Last Program Memory Address High-Endurance Flash Memory Address Range(1) 1,024 03FFh 0380h-03FFh PIC12F1501 PIC12LF1501 Note 1: The following features are associated with access and control of program memory and data memory: High-Endurance Flash applies to the low byte of each address in the range. 2011 Microchip Technology Inc. Preliminary DS41615A-page 15 PIC12(L)F1501 FIGURE 3-1: PROGRAM MEMORY MAP AND STACK FOR PIC12(L)F1501 PC<14:0> CALL, CALLW RETURN, RETLW Interrupt, RETFIE On-chip Program Memory 15 READING PROGRAM MEMORY AS DATA There are two methods of accessing constants in program memory. The first method is to use tables of RETLW instructions. The second method is to set an FSR to point to the program memory. 3.1.1.1 RETLW Instruction Stack Level 0 Stack Level 1 The RETLW instruction can be used to provide access to tables of constants. The recommended way to create such a table is shown in Example 3-1. Stack Level 15 EXAMPLE 3-1: Reset Vector 0000h Interrupt Vector 0004h 0005h constants BRW RETLW RETLW RETLW RETLW Page 0 Rollover to Page 0 Wraps to Page 0 03FFh 0400h ;Add Index in W to ;program counter to ;select data ;Index0 data ;Index1 data The BRW instruction makes this type of table very simple to implement. If your code must remain portable with previous generations of microcontrollers, then the BRW instruction is not available so the older table read method must be used. Wraps to Page 0 Rollover to Page 0 DATA0 DATA1 DATA2 DATA3 RETLW INSTRUCTION my_function ;... LOTS OF CODE... MOVLW DATA_INDEX call constants ;... THE CONSTANT IS IN W Wraps to Page 0 DS41615A-page 16 3.1.1 7FFFh Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 3.1.1.2 Indirect Read with FSR 3.2.1 The program memory can be accessed as data by setting bit 7 of the FSRxH register and reading the matching INDFx register. The MOVIW instruction will place the lower 8 bits of the addressed word in the W register. Writes to the program memory cannot be performed via the INDF registers. Instructions that access the program memory via the FSR require one extra instruction cycle to complete. Example 3-2 demonstrates accessing the program memory via an FSR. The core registers contain the registers that directly affect the basic operation. The core registers occupy the first 12 addresses of every data memory bank (addresses x00h/x08h through x0Bh/x8Bh). These registers are listed below in Table 3-2. For detailed information, see Table 3-4. TABLE 3-2: The HIGH directive will set bit<7> if a label points to a location in program memory. EXAMPLE 3-2: ACCESSING PROGRAM MEMORY VIA FSR constants RETLW DATA0 ;Index0 data RETLW DATA1 ;Index1 data RETLW DATA2 RETLW DATA3 my_function ;... LOTS OF CODE... MOVLW LOW constants MOVWF FSR1L MOVLW HIGH constants MOVWF FSR1H MOVIW 0[FSR1] ;THE PROGRAM MEMORY IS IN W 3.2 CORE REGISTERS CORE REGISTERS Addresses BANKx x00h or x80h x01h or x81h x02h or x82h x03h or x83h x04h or x84h x05h or x85h x06h or x86h x07h or x87h x08h or x88h x09h or x89h x0Ah or x8Ah x0Bh or x8Bh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON Data Memory Organization The data memory is partitioned into 32 memory banks with 128 bytes in each bank. Each bank consists of (Figure 3-2): * * * * 12 core registers 20 Special Function Registers (SFR) Up to 80 bytes of General Purpose RAM (GPR) 16 bytes of common RAM The active bank is selected by writing the bank number into the Bank Select Register (BSR). Unimplemented memory will read as `0'. All data memory can be accessed either directly (via instructions that use the file registers) or indirectly via the two File Select Registers (FSR). See Section 3.5 "Indirect Addressing" for more information. Data memory uses a 12-bit address. The upper 7 bits of the address define the Bank address and the lower 5 bits select the registers/RAM in that bank. 2011 Microchip Technology Inc. Preliminary DS41615A-page 17 PIC12(L)F1501 3.2.1.1 STATUS Register The STATUS register, shown in Register 3-1, contains: * the arithmetic status of the ALU * the Reset status The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. REGISTER 3-1: U-0 It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits (Refer to Section 26.0 "Instruction Set Summary"). Note 1: The C and DC bits operate as Borrow and Digit Borrow out bits, respectively, in subtraction. STATUS: STATUS REGISTER U-0 -- For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as `000u u1uu' (where u = unchanged). -- U-0 R-1/q R-1/q R/W-0/u R/W-0/u R/W-0/u -- TO PD Z DC(1) C(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared q = Value depends on condition bit 7-5 Unimplemented: Read as `0' bit 4 TO: Time-Out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-Down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Digit Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two's complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register. DS41615A-page 18 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 3.2.2 SPECIAL FUNCTION REGISTER FIGURE 3-2: The Special Function Registers are registers used by the application to control the desired operation of peripheral functions in the device. The Special Function Registers occupy the 20 bytes after the core registers of every data memory bank (addresses x0Ch/x8Ch through x1Fh/x9Fh). The registers associated with the operation of the peripherals are described in the appropriate peripheral chapter of this data sheet. 3.2.3 7-bit Bank Offset 0Bh 0Ch GENERAL PURPOSE RAM Core Registers (12 bytes) Special Function Registers (20 bytes maximum) 1Fh 20h Linear Access to GPR The general purpose RAM can be accessed in a non-banked method via the FSRs. This can simplify access to large memory structures. See Section 3.5.2 "Linear Data Memory" for more information. 3.2.4 Memory Region 00h There are up to 80 bytes of GPR in each data memory bank. The Special Function Registers occupy the 20 bytes after the core registers of every data memory bank (addresses x0Ch/x8Ch through x1Fh/x9Fh). 3.2.3.1 BANKED MEMORY PARTITIONING General Purpose RAM (80 bytes maximum) COMMON RAM There are 16 bytes of common RAM accessible from all banks. 6Fh 70h Common RAM (16 bytes) 7Fh 3.2.5 DEVICE MEMORY MAPS The memory maps for PIC12(L)F1501 are as shown in Table 3-3. 2011 Microchip Technology Inc. Preliminary DS41615A-page 19 DS41615A-page 20 Preliminary -- -- -- PORTA -- -- -- -- PIR1 PIR2 PIR3 -- TMR0 TMR1L TMR1H T1CON T1GCON TMR2 PR2 T2CON Core Registers (Table 3-2) 0FFh 0EFh 0F0h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' ADCON0 ADCON1 ADCON2 TRISA -- -- -- -- PIE1 PIE2 PIE3 -- OPTION_REG PCON WDTCON -- OSCCON OSCSTAT ADRESL ADRESH Core Registers (Table 3-2) BANK 1 17Fh 16Fh 170h 11Dh 11Eh 11Fh 120h 10Bh 10Ch 10Dh 10Eh 10Fh 110h 111h 112h 113h 114h 115h 116h 117h 118h 119h 11Ah 11Bh 11Ch 100h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- APFCON -- DACCON0 DACCON1 -- -- -- LATA -- -- -- -- CM1CON0 CM1CON1 -- -- CMOUT BORCON FVRCON Core Registers (Table 3-2) BANK 2 = Unimplemented data memory locations, read as `0' Common RAM Unimplemented Read as `0' 09Dh 09Eh 09Fh 0A0h 08Bh 08Ch 08Dh 08Eh 08Fh 090h 091h 092h 093h 094h 095h 096h 097h 098h 099h 09Ah 09Bh 09Ch 080h PIC12(L)F1501 MEMORY MAP General Purpose Register 48 Bytes Legend: 07Fh 06Fh 070h 04Fh 050h 00Bh 00Ch 00Dh 00Eh 00Fh 010h 011h 012h 013h 014h 015h 016h 017h 018h 019h 01Ah 01Bh 01Ch 01Dh 01Eh 01Fh 020h 000h BANK 0 TABLE 3-3: 1FFh 1EFh 1F0h 19Dh 19Eh 19Fh 1A0h 18Bh 18Ch 18Dh 18Eh 18Fh 190h 191h 192h 193h 194h 195h 196h 197h 198h 199h 19Ah 19Bh 19Ch 180h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' ANSELA -- -- -- -- PMADRL PMADRH PMDATL PMDATH PMCON1 PMCON2 VREGCON -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 3 27Fh 26Fh 270h 21Dh 21Eh 21Fh 220h 20Bh 20Ch 20Dh 20Eh 20Fh 210h 211h 212h 213h 214h 215h 216h 217h 218h 219h 21Ah 21Bh 21Ch 200h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' WPUA -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 4 2FFh 2EFh 2F0h 29Dh 29Eh 29Fh 2A0h 28Bh 28Ch 28Dh 28Eh 28Fh 290h 291h 292h 293h 294h 295h 296h 297h 298h 299h 29Ah 29Bh 29Ch 280h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 5 37Fh 36Fh 370h 31Dh 31Eh 31Fh 320h 30Bh 30Ch 30Dh 30Eh 30Fh 310h 311h 312h 313h 314h 315h 316h 317h 318h 319h 31Ah 31Bh 31Ch 300h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 6 3FFh 3EFh 3F0h 39Dh 39Eh 39Fh 3A0h 38Bh 38Ch 38Dh 38Eh 38Fh 390h 391h 392h 393h 394h 395h 396h 397h 398h 399h 39Ah 39Bh 39Ch 380h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- IOCAP IOCAN IOCAF -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 7 PIC12(L)F1501 2011 Microchip Technology Inc. 2011 Microchip Technology Inc. Preliminary -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 8 8FFh 8EFh 8F0h 88Bh 88Ch 880h 4FFh Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' Core Registers (Table 3-2) BANK 17 Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- NCO1ACCL NCO1ACCH NCO1ACCU NCO1INCL NCO1INCH -- NCO1CON NCO1CLK Core Registers (Table 3-2) BANK 9 97Fh 96Fh 970h 90Bh 90Ch 900h 57Fh 56Fh 570h 50Bh 50Ch 50Dh 50Eh 50Fh 510h 511h 512h 513h 514h 515h 516h 517h 518h 519h 51Ah 51Bh 51Ch 51Dh 51Eh 51Fh 520h 500h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' Core Registers (Table 3-2) BANK 18 Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 10 = Unimplemented data memory locations, read as `0' Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' Core Registers (Table 3-2 ) BANK 16 Common RAM (Accesses 70h - 7Fh) 4EFh 4F0h 48Bh 48Ch 48Dh 48Eh 48Fh 490h 491h 492h 493h 494h 495h 496h 497h 498h 499h 49Ah 49Bh 49Ch 49Dh 49Eh 49Fh 4A0h 480h 9FFh 9EFh 9F0h 98Bh 98Ch 980h 5FFh 5EFh 5F0h 58Bh 58Ch 58Dh 58Eh 58Fh 590h 591h 592h 593h 594h 595h 596h 597h 598h 599h 59Ah 59Bh 59Ch 59Dh 59Eh 59Fh 5A0h 580h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' Core Registers (Table 3-2) BANK 19 Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 11 PIC12(L)F1501 MEMORY MAP (CONTINUED) Unimplemented Read as `0' Legend: 87Fh 86Fh 870h 80Bh 80Ch 800h 47Fh 46Fh 470h 40Bh 40Ch 40Dh 40Eh 40Fh 410h 411h 412h 413h 414h 415h 416h 417h 418h 419h 41Ah 41Bh 41Ch 41Dh 41Eh 41Fh 420h 400h TABLE 3-3: A7Fh A6Fh A70h A0Bh A0Ch A00h 67Fh 64Fh 650h 60Bh 60Ch 60Dh 60Eh 60Fh 610h 611h 612h 613h 614h 615h 616h 617h 618h 619h 61Ah 61Bh 61Ch 61Dh 61Eh 61Fh 620h 600h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' Core Registers (Table 3-2) BANK 20 Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- PWM1DCL PWM1DCH PWM1CON PWM2DCL PWM2DCH PWM2CON PWM3DCL PWM3DCH PWM3CON PWM4DCL PWM4DCH PWM4CON -- -- -- Core Registers (Table 3-2) BANK 12 AFFh AEFh AF0h A8Bh A8Ch A80h 6FFh 6EFh 6F0h 68Bh 68Ch 68Dh 68Eh 68Fh 690h 691h 692h 693h 694h 695h 696h 697h 698h 699h 69Ah 69Bh 69Ch 69Dh 69Eh 69Fh 6A0h 680h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' Core Registers (Table 3-2) BANK 21 Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- CWG1DBR CWG1DBF CWG1CON0 CWG1CON1 CWG1CON2 -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 13 B7Fh B6Fh B70h B0Bh B0Ch B00h 77Fh 76Fh 770h 70Bh 70Ch 70Dh 70Eh 70Fh 710h 711h 712h 713h 714h 715h 716h 717h 718h 719h 71Ah 71Bh 71Ch 71Dh 71Eh 71Fh 720h 700h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' Core Registers (Table 3-2) BANK 22 Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 14 BFFh BEFh BF0h B8Bh B8Ch B80h 7FFh 7EFh 7F0h 78Bh 78Ch 78Dh 78Eh 78Fh 790h 791h 792h 793h 794h 795h 796h 797h 798h 799h 79Ah 79Bh 79Ch 79Dh 79Eh 79Fh 7A0h 780h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' Core Registers (Table 3-2) BANK 23 Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 15 PIC12(L)F1501 DS41615A-page 21 DS41615A-page 22 Preliminary Legend: CFFh C6Fh C70h C0Bh C0Ch C0Dh C0Eh C0Fh C10h C11h C12h C13h C14h C15h C16h C17h C18h C19h C1Ah C1Bh C1Ch C1Dh C1Eh C1Fh C20h C00h CFFh CEFh CF0h C8Bh C8Ch C8Dh C8Eh C8Fh C90h C91h C92h C93h C94h C95h C96h C97h C98h C99h C9Ah C9Bh C9Ch C9Dh C9Eh C9Fh CA0h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 25 D7Fh D6Fh D70h D0Bh D0Ch D0Dh D0Eh D0Fh D10h D11h D12h D13h D14h D15h D16h D17h D18h D19h D1Ah D1Bh D1Ch D1Dh D1Eh D1Fh D20h D00h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 26 = Unimplemented data memory locations, read as `0'. Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) C80h DFFh DEFh DF0h D8Bh D8Ch D8Dh D8Eh D8Fh D90h D91h D92h D93h D94h D95h D96h D97h D98h D99h D9Ah D9Bh D9Ch D9Dh D9Eh D9Fh DA0h D80h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 27 PIC12(L)F1501 MEMORY MAP (CONTINUED) BANK 24 TABLE 3-3: E7Fh E6Fh E70h E0Bh E0Ch E0Dh E0Eh E0Fh E10h E11h E12h E13h E14h E15h E16h E17h E18h E19h E1Ah E1Bh E1Ch E1Dh E1Eh E1Fh E20h E00h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 28 EFFh EEFh EF0h E8Bh E8Ch E8Dh E8Eh E8Fh E90h E91h E92h E93h E94h E95h E96h E97h E98h E99h E9Ah E9Bh E9Ch E9Dh E9Eh E9Fh EA0h E80h Common RAM (Accesses 70h - 7Fh) Unimplemented Read as `0' -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Core Registers (Table 3-2) BANK 29 Core Registers (Table 3-2) BANK 30 F7Fh F6Fh F70h Common RAM (Accesses 70h - 7Fh) F0Bh F0Ch F0Dh F0Eh F0Fh F10h F11h F12h F13h F14h F15h F16h F17h See Table 3-3 for F18h register mapping F19h details F1Ah F1Bh F1Ch F1Dh F1Eh F1Fh F20h F00h Core Registers (Table 3-2) BANK 31 FFFh FEFh FF0h Common RAM (Accesses 70h - 7Fh) F8Bh F8Ch F8Dh F8Eh F8Fh F90h F91h F92h F93h F94h F95h F96h F97h See Table 3-3 for F98h register mapping F99h details F9Ah F9Bh F9Ch F9Dh F9Eh F9Fh FA0h F80h PIC12(L)F1501 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 3-3: PIC12(L)F1501 MEMORY MAP (CONTINUED) Bank 30 F0Ch F0Dh F0Eh F0Fh F10h F11h F12h F13h F14h F15h F16h F17h F18h F19h F1Ah F1Bh F1Ch F1Dh F1Eh F1Fh F20h F6Fh Legend: Bank 31 -- -- -- CLCDATA CLC1CON CLC1POL CLC1SEL0 CLC1SEL1 CLC1GLS0 CLC1GLS1 CLC1GLS2 CLC1GLS3 CLC2CON CLC2POL CLC2SEL0 CLC2SEL1 CLC2GLS0 CLC2GLS1 CLC2GLS2 CLC2GLS3 F8Ch Unimplemented Read as `0' FE3h FE4h FE5h FE6h FE7h FE8h FE9h FEAh FEBh FECh FEDh FEEh FEFh STATUS_SHAD WREG_SHAD BSR_SHAD PCLATH_SHAD FSR0L_SHAD FSR0H_SHAD FSR1L_SHAD FSR1H_SHAD -- STKPTR TOSL TOSH Unimplemented Read as `0' = Unimplemented data memory locations, read as `0'. 2011 Microchip Technology Inc. Preliminary DS41615A-page 23 PIC12(L)F1501 3.2.6 CORE FUNCTION REGISTERS SUMMARY The Core Function registers listed in Table 3-4 can be addressed from any Bank. TABLE 3-4: Addr Name CORE FUNCTION REGISTERS SUMMARY Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 0-31 x00h or INDF0 x80h Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx uuuu uuuu x01h or INDF1 x81h Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx uuuu uuuu x02h or PCL x82h Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 ---1 1000 ---q quuu x03h or STATUS x83h -- -- -- TO PD Z DC C x04h or FSR0L x84h Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu x05h or FSR0H x85h Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 x06h or FSR1L x86h Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu x07h or FSR1H x87h Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 ---0 0000 ---0 0000 0000 0000 uuuu uuuu -000 0000 -000 0000 0000 0000 0000 0000 x08h or BSR x88h -- x09h or WREG x89h -- BSR<4:0> Working Register x0Ah or PCLATH x8Ah -- x0Bh or INTCON x8Bh GIE Legend: -- Write Buffer for the upper 7 bits of the Program Counter PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as `0', r = reserved. Shaded locations are unimplemented, read as `0'. DS41615A-page 24 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 3-5: Address SPECIAL FUNCTION REGISTER SUMMARY Name Value on all other Resets Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR -- -- RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --xx xxxx Bank 0 00Ch PORTA 00Dh -- Unimplemented -- -- 00Eh -- Unimplemented -- -- 00Fh -- Unimplemented -- -- 010h -- Unimplemented -- -- 011h PIR1 TMR1GIF ADIF -- -- -- -- TMR2IF TMR1IF 00-- --00 00-- --00 012h PIR2 -- -- C1IF -- -- NCO1IF -- -- --0- -0-- --0- -0-- 013h PIR3 -- -- -- -- -- -- CLC2IF CLC1IF ---- --00 ---- --00 014h -- Unimplemented 015h TMR0 Holding Register for the 8-bit Timer0 Count xxxx xxxx uuuu uuuu 016h TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Count xxxx xxxx uuuu uuuu 017h TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Count 018h T1CON 019h T1GCON 01Ah TMR2 Timer2 Module Register 01Bh PR2 Timer2 Period Register 01Ch T2CON 01Dh -- Unimplemented -- -- 01Eh -- Unimplemented -- -- 01Fh -- Unimplemented -- -- -- TMR1CS<1:0> TMR1GE T1GPOL -- T1CKPS<1:0> T1GTM T1GSPM -- T1SYNC T1GGO/ DONE T1GVAL -- xxxx xxxx uuuu uuuu -- TMR1ON T1GSS<1:0> 0000 -0-0 uuuu -u-u 0000 0x00 uuuu uxuu 0000 0000 0000 0000 1111 1111 1111 1111 T2OUTPS<3:0> TMR2ON T2CKPS<1:0> -000 0000 -000 0000 Bank 1 -- -- TRISA5 TRISA4 --(2) 08Ch TRISA 08Dh -- Unimplemented TRISA2 TRISA1 -- -- 08Eh -- Unimplemented -- -- 08Fh -- Unimplemented -- -- 090h -- Unimplemented -- -- 091h PIE1 TMR1GIE ADIE -- -- -- -- TMR2IE TRISA0 --11 1111 --11 1111 TMR1IE 00-- --00 00-- --00 092h PIE2 -- -- C1IE -- -- NCO1IE -- -- --0- -0-- -00- -0-- 093h PIE3 -- -- -- -- -- -- CLC2IE CLC1IE ---- --00 ---- --00 094h -- 095h OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA 096h PCON STKOVF STKUNF -- RWDT 097h WDTCON -- -- 098h -- 099h OSCCON Unimplemented -- RMCLR PS<2:0> RI POR WDTPS<4:0> BOR 00-1 11qq qq-q qquu SWDTEN --01 0110 --01 0110 Unimplemented -- -- IRCF<3:0> 09Ah OSCSTAT 09Bh ADRESL A/D Result Register Low 09Ch ADRESH A/D Result Register High 09Dh ADCON0 -- 09Eh ADCON1 ADFM 09Fh ADCON2 -- -- -- HFIOFR -- -- -- SCS<1:0> LFIOFR -- 1111 1111 1111 1111 -- -011 1-00 -011 1-00 HFIOFS ---0 --00 ---q --qq xxxx xxxx uuuu uuuu xxxx xxxx uuuu uuuu CHS<4:0> ADCS<2:0> TRIGSEL<3:0> GO/DONE -- -- -- -- ADON ADPREF<1:0> -- -- -000 0000 -000 0000 0000 --00 0000 --00 0000 ---- 0000 ---- Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as `0'. Note 1: PIC12F1501 only. 2: Unimplemented, read as `1'. 2011 Microchip Technology Inc. Preliminary DS41615A-page 25 PIC12(L)F1501 TABLE 3-5: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 -- -- LATA5 LATA4 -- LATA2 LATA1 LATA0 Value on POR, BOR Value on all other Resets Bank 2 10Ch LATA 10Dh -- Unimplemented -- -- 10Eh -- Unimplemented -- -- 10Fh -- Unimplemented -- -- 110h -- Unimplemented -- -- 111h CM1CON0 112h CM1CON1 113h -- Unimplemented -- -- 114h -- Unimplemented -- -- 115h CMOUT 116h BORCON SBOREN BORFS 117h FVRCON FVREN FVRRDY 118h DACCON0 DACEN -- DACOE1 DACOE2 119h DACCON1 -- 11Ah to 11Ch C1ON C1OUT C1INTP C1INTN -- -- C1OE C1POL C1PCH<1:0> -- -- C1SP -- C1HYS C1NCH<2:0> -- -- -- -- -- -- -- -- -- TSEN TSRNG CDAFVR<1:0> -- -- C1SYNC MC1OUT BORRDY -- 0000 -100 0000 -100 0000 -000 0000 -000 ADFVR<1:0> DACPSS --xx -xxx --uu -uuu -- DACR<4:0> ---- ---0 ---- ---0 10-- ---q uu-- ---u 0q00 0000 0q00 0000 0-00 -0-- 0-00 -0----0 0000 ---0 0000 -- Unimplemented -- 11Dh APFCON CWG1BSEL CWG1ASEL 11Eh -- Unimplemented -- -- 11Fh -- Unimplemented -- -- -- -- T1GSEL -- CLC1SEL NCO1SEL -- 00-- 0-00 00-- 0-00 Bank 3 18Ch ANSELA 18Dh -- Unimplemented -- -- -- -- 18Eh -- Unimplemented -- -- 18Fh -- Unimplemented -- -- 190h -- Unimplemented -- -- 191h PMADRL Flash Program Memory Address Register Low Byte 192h PMADRH 193h PMDATL 194h PMDATH -- -- 195h PMCON1 --(2) CFGS 196h PMCON2 197h VREGCON(1) 198h to 19Fh -- -- -- ANSA4 -- ANSA2 ANSA1 ANSA0 0000 0000 0000 0000 Flash Program Memory Address Register High Byte -000 0000 -000 0000 Flash Program Memory Read Data Register Low Byte xxxx xxxx uuuu uuuu Flash Program Memory Read Data Register High Byte LWLO --xx xxxx --uu uuuu FREE WRERR WREN WR RD -- -- -- VREGPM Reserved Flash Program Memory Control Register 2 -- -- -- ---1 -111 ---1 -111 0000 x000 0000 q000 0000 0000 0000 0000 Unimplemented ---- --01 ---- --01 -- -- Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as `0'. Note 1: PIC12F1501 only. 2: Unimplemented, read as `1'. DS41615A-page 26 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 3-5: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 -- -- WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 Value on POR, BOR Value on all other Resets Bank 4 20Ch 20Dh to 21Fh WPUA --11 1111 --11 1111 -- Unimplemented -- -- -- Unimplemented -- -- -- Unimplemented -- -- -- Unimplemented -- -- Bank 5 28Ch to 29Fh Bank 6 30Ch to 31Fh Bank 7 38Ch to 390h 391h IOCAP -- -- IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 --00 0000 --00 0000 392h IOCAN -- -- IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 --00 0000 --00 0000 393h IOCAF -- -- IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 --00 0000 --00 0000 394h to 39Fh -- Unimplemented -- -- -- Unimplemented -- -- -- Unimplemented -- -- Bank 8 40Ch to 41Fh Bank 9 48Ch to 497h 498h NCO1ACCL NCO1ACC<7:0> 0000 0000 0000 0000 499h NCO1ACCH NCO1ACC<15:8> 0000 0000 0000 0000 49Ah NCO1ACCU NCO1ACC<19:16> 0000 0000 0000 0000 49Bh NCO1INCL NCO1INC<7:0> 0000 0000 0000 0000 49Ch NCO1INCH NCO1INC<15:8> 0000 0000 0000 0000 49Dh -- 49Eh NCO1CON 49Fh NCO1CLK Unimplemented N1EN -- N1OE N1PWS<2:0> N1OUT N1POL -- -- -- -- -- -- N1PFM N1CKS<1:0> -- 0000 ---0 0000 ---0 0000 --00 0000 --00 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as `0'. Note 1: PIC12F1501 only. 2: Unimplemented, read as `1'. 2011 Microchip Technology Inc. Preliminary DS41615A-page 27 PIC12(L)F1501 TABLE 3-5: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Value on POR, BOR Value on all other Resets Unimplemented -- -- Unimplemented -- -- Unimplemented -- -- Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bank 10 50Ch to 51Fh -- Bank 11 58Ch to 59Fh -- Bank 12 60Ch to 610h -- 611h PWM1DCL 612h PWM1DCH 613h PWM1CON0 614h PWM2DCL 615h PWM2DCH 616h PWM2CON0 617h PWM3DCL 618h PWM3DCH 619h PWM3CON0 61Ah PWM4DCL 61Bh PWM4DCH 61Ch PWM4CON0 61Dh to 61Fh -- PWM1DCL<7:6> -- -- -- -- -- -- -- -- -- -- 0000 ---- 0000 ---- -- -- -- -- 00-- ---- 00-- ---- -- -- -- -- 0000 ---- 0000 ---- -- -- -- -- 00-- ---- 00-- ---- -- -- -- -- 0000 ---- 0000 ---- -- -- -- -- 00-- ---- 00-- ---- -- -- -- PWM1DCH<7:0> PWM1EN PWM1OE PWM2DCL<7:6> PWM1OUT PWM1POL -- -- xxxx xxxx uuuu uuuu PWM2DCH<7:0> PWM2EN PWM2OE PWM3DCL<7:6> PWM2OUT PWM2POL -- -- xxxx xxxx uuuu uuuu PWM3DCH<7:0> PWM3EN PWM3OE PWM4DCL<7:6> PWM3OUT PWM3POL -- -- xxxx xxxx uuuu uuuu PWM4DCH<7:0> PWM4EN PWM4OE PWM4OUT PWM4POL -- 00-- ---- 00-- ---- xxxx xxxx uuuu uuuu 0000 ---- 0000 ---- Unimplemented -- -- Unimplemented -- -- Bank 13 68Ch to 690h -- 691h CWG1DBR -- -- CWG1DBR<5:0> 692h CWG1DBF -- -- CWG1DBF<5:0> 693h CWG1CON0 G1EN G1OEB 694h CWG1CON1 695h CWG1CON2 696h to 69Fh -- G1ASDLB<1:0> G1ASE G1ARSEN G1OEA G1POLB G1POLA G1ASDLA<1:0> -- -- -- -- Unimplemented --00 0000 --00 0000 --xx xxxx --xx xxxx -- -- G1ASDC1 G1ASDFLT G1IS<2:0> G1CS0 0000 0--0 0000 0--0 0000 -000 0000 -000 G1ASDCLC2 00-- -000 00-- -000 -- -- Bank 14-29 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as `0'. Note 1: PIC12F1501 only. 2: Unimplemented, read as `1'. DS41615A-page 28 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 3-5: Address Name SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on POR, BOR Value on all other Resets Unimplemented -- -- Unimplemented -- -- Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Banks 14-29 x0Ch/ x8Ch -- x1Fh/ x9Fh -- Bank 30 F0Ch to F0Eh -- F0Fh CLCDATA -- -- -- -- -- F10h CLC1CON LC1EN LC1OE LC1OUT LC1INTP LC1INTN F11h CLC1POL LC1POL -- -- -- -- MLC1OUT MLC2OUT LC1MODE<2:0> LC1G4POL LC1G3POL LC1G2POL ---- --00 ---- --00 0000 0000 0000 0000 LC1G1POL 0--- xxxx 0--- uuuu F12h CLC1SEL0 -- LC1D2S<2:0> -- LC1D1S<2:0> F13h CLC1SEL1 -- LC1D4S<2:0> -- LC1D3S<2:0> F14h CLC1GLS0 LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T LC1G1D1N xxxx xxxx uuuu uuuu F15h CLC1GLS1 LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T LC1G2D1N xxxx xxxx uuuu uuuu F16h CLC1GLS2 LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T LC1G3D1N xxxx xxxx uuuu uuuu F17h CLC1GLS3 LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T LC1G4D1N xxxx xxxx uuuu uuuu F18h CLC2CON LC2EN LC2OE LC2OUT LC2INTP F19h CLC2POL LC2POL -- -- -- F1Ah CLC2SEL0 -- LC2D2S<2:0> -- LC2D1S<2:0> F1Bh CLC2SEL1 -- LC2D4S<2:0> -- LC2D3S<2:0> F1Ch CLC2GLS0 LC2G1D4T LC2G1D4N LC2G1D3T LC2G1D3N LC2G1D2T LC2G1D2N LC2G1D1T LC2G1D1N xxxx xxxx uuuu uuuu F1Dh CLC2GLS1 LC2G2D4T LC2G2D4N LC2G2D3T LC2G2D3N LC2G2D2T LC2G2D2N LC2G2D1T LC2G2D1N xxxx xxxx uuuu uuuu F1Eh CLC2GLS2 LC2G3D4T LC2G3D4N LC2G3D3T LC2G3D3N LC2G3D2T LC2G3D2N LC2G3D1T LC2G3D1N xxxx xxxx uuuu uuuu F1Fh CLC2GLS3 LC2G4D4T LC2G4D4N LC2G4D3T LC2G4D3N LC2G4D2T LC2G4D2N LC2G4D1T LC2G4D1N xxxx xxxx uuuu uuuu -- Unimplemented F20h to F6Fh LC2INTN -xxx -xxx -uuu -uuu -xxx -xxx -uuu -uuu LC2MODE<2:0> LC2G4POL LC2G3POL LC2G2POL 0000 0000 0000 0000 LC2G1POL 0--- xxxx 0--- uuuu -xxx -xxx -uuu -uuu -xxx -xxx -uuu -uuu -- -- Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as `0'. Note 1: PIC12F1501 only. 2: Unimplemented, read as `1'. 2011 Microchip Technology Inc. Preliminary DS41615A-page 29 PIC12(L)F1501 TABLE 3-5: Address Name SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets -- -- Bank 31 F8Ch -- FE3h -- FE4h STATUS_ Unimplemented -- -- -- -- -- Z_SHAD DC_SHAD C_SHAD ---- -xxx ---- -uuu SHAD FE5h WREG_ Working Register Shadow xxxx xxxx uuuu uuuu SHAD FE6h BSR_ -- -- -- Bank Select Register Shadow ---x xxxx ---u uuuu SHAD FE7h PCLATH_ -- Program Counter Latch High Register Shadow -xxx xxxx uuuu uuuu SHAD FE8h FSR0L_ Indirect Data Memory Address 0 Low Pointer Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 0 High Pointer Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 1 Low Pointer Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 1 High Pointer Shadow xxxx xxxx uuuu uuuu SHAD FE9h FSR0H_ SHAD FEAh FSR1L_ SHAD FEBh FSR1H_ SHAD FECh -- FEDh STKPTR FEEh TOSL FEFh TOSH Unimplemented -- -- -- -- Current Stack Pointer Top-of-Stack Low byte -- -- ---1 1111 ---1 1111 xxxx xxxx uuuu uuuu Top-of-Stack High byte -xxx xxxx -uuu uuuu Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as `0'. Note 1: PIC12F1501 only. 2: Unimplemented, read as `1'. DS41615A-page 30 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 3.3 PCL and PCLATH 3.3.2 The Program Counter (PC) is 15 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<14:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 3-3 shows the five situations for the loading of the PC. FIGURE 3-3: 14 LOADING OF PC IN DIFFERENT SITUATIONS PCH PCL 0 PC 6 7 8 0 PCLATH Instruction with PCL as Destination ALU Result 14 PCH PCL 0 PC 6 4 0 PCLATH GOTO, CALL PCH PCL 0 6 7 0 CALLW W 14 PCH PCL BRW 15 PC + W 14 PCH PCL PC If using BRW, load the W register with the desired unsigned address and execute BRW. The entire PC will be loaded with the address PC + 1 + W. 0 BRA 15 PC + OPCODE <8:0> 3.3.1 BRANCHING The branching instructions add an offset to the PC. This allows relocatable code and code that crosses page boundaries. There are two forms of branching, BRW and BRA. The PC will have incremented to fetch the next instruction in both cases. When using either branching instruction, a PCL memory boundary may be crossed. 0 PC COMPUTED FUNCTION CALLS A computed function CALL allows programs to maintain tables of functions and provide another way to execute state machines or look-up tables. When performing a table read using a computed function CALL, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). 3.3.4 8 PCLATH 3.3.3 The CALLW instruction enables computed calls by combining PCLATH and W to form the destination address. A computed CALLW is accomplished by loading the W register with the desired address and executing CALLW. The PCL register is loaded with the value of W and PCH is loaded with PCLATH. OPCODE <10:0> 14 A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to Application Note AN556, "Implementing a Table Read" (DS00556). If using the CALL instruction, the PCH<2:0> and PCL registers are loaded with the operand of the CALL instruction. PCH<6:3> is loaded with PCLATH<6:3>. 11 PC COMPUTED GOTO If using BRA, the entire PC will be loaded with PC + 1 +, the signed value of the operand of the BRA instruction. MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC<14:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the program counter to be changed by writing the desired upper 7 bits to the PCLATH register. When the lower 8 bits are written to the PCL register, all 15 bits of the program counter will change to the values contained in the PCLATH register and those being written to the PCL register. 2011 Microchip Technology Inc. Preliminary DS41615A-page 31 PIC12(L)F1501 3.4 Stack 3.4.1 The stack is available through the TOSH, TOSL and STKPTR registers. STKPTR is the current value of the Stack Pointer. TOSH:TOSL register pair points to the TOP of the stack. Both registers are read/writable. TOS is split into TOSH and TOSL due to the 15-bit size of the PC. To access the stack, adjust the value of STKPTR, which will position TOSH:TOSL, then read/write to TOSH:TOSL. STKPTR is 5 bits to allow detection of overflow and underflow. All devices have a 16-level x 15-bit wide hardware stack (refer to Figures 3-4 through 3-7). The stack space is not part of either program or data space. The PC is PUSHed onto the stack when CALL or CALLW instructions are executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer if the STVREN bit is programmed to `0` (Configuration Words). This means that after the stack has been PUSHed sixteen times, the seventeenth PUSH overwrites the value that was stored from the first PUSH. The eighteenth PUSH overwrites the second PUSH (and so on). The STKOVF and STKUNF flag bits will be set on an Overflow/Underflow, regardless of whether the Reset is enabled. Note: Care should be taken when modifying the STKPTR while interrupts are enabled. During normal program operation, CALL, CALLW and Interrupts will increment STKPTR while RETLW, RETURN, and RETFIE will decrement STKPTR. At any time, STKPTR can be inspected to see how much stack is left. The STKPTR always points at the currently used place on the stack. Therefore, a CALL or CALLW will increment the STKPTR and then write the PC, and a return will unload the PC and then decrement the STKPTR. Note 1: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, CALLW, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. FIGURE 3-4: ACCESSING THE STACK Reference Figure 3-4 through Figure 3-7 for examples of accessing the stack. ACCESSING THE STACK EXAMPLE 1 TOSH:TOSL 0x0F STKPTR = 0x1F Stack Reset Disabled (STVREN = 0) 0x0E 0x0D 0x0C 0x0B 0x0A Initial Stack Configuration: 0x09 After Reset, the stack is empty. The empty stack is initialized so the Stack Pointer is pointing at 0x1F. If the Stack Overflow/Underflow Reset is enabled, the TOSH/TOSL registers will return `0'. If the Stack Overflow/Underflow Reset is disabled, the TOSH/TOSL registers will return the contents of stack address 0x0F. 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 0x00 TOSH:TOSL DS41615A-page 32 0x1F 0x0000 Preliminary STKPTR = 0x1F Stack Reset Enabled (STVREN = 1) 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 3-5: ACCESSING THE STACK EXAMPLE 2 0x0F 0x0E 0x0D 0x0C 0x0B 0x0A 0x09 This figure shows the stack configuration after the first CALL or a single interrupt. If a RETURN instruction is executed, the return address will be placed in the Program Counter and the Stack Pointer decremented to the empty state (0x1F). 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 TOSH:TOSL FIGURE 3-6: 0x00 Return Address STKPTR = 0x00 ACCESSING THE STACK EXAMPLE 3 0x0F 0x0E 0x0D 0x0C After seven CALLs or six CALLs and an interrupt, the stack looks like the figure on the left. A series of RETURN instructions will repeatedly place the return addresses into the Program Counter and pop the stack. 0x0B 0x0A 0x09 0x08 0x07 TOSH:TOSL 2011 Microchip Technology Inc. 0x06 Return Address 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address 0x00 Return Address Preliminary STKPTR = 0x06 DS41615A-page 33 PIC12(L)F1501 FIGURE 3-7: ACCESSING THE STACK EXAMPLE 4 TOSH:TOSL 3.4.2 0x0F Return Address 0x0E Return Address 0x0D Return Address 0x0C Return Address 0x0B Return Address 0x0A Return Address 0x09 Return Address 0x08 Return Address 0x07 Return Address 0x06 Return Address 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address 0x00 Return Address When the stack is full, the next CALL or an interrupt will set the Stack Pointer to 0x10. This is identical to address 0x00 so the stack will wrap and overwrite the return address at 0x00. If the Stack Overflow/Underflow Reset is enabled, a Reset will occur and location 0x00 will not be overwritten. STKPTR = 0x10 OVERFLOW/UNDERFLOW RESET If the STVREN bit in Configuration Words is programmed to `1', the device will be reset if the stack is PUSHed beyond the sixteenth level or POPed beyond the first level, setting the appropriate bits (STKOVF or STKUNF, respectively) in the PCON register. 3.5 Indirect Addressing The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the File Select Registers (FSR). If the FSRn address specifies one of the two INDFn registers, the read will return `0' and the write will not occur (though Status bits may be affected). The FSRn register value is created by the pair FSRnH and FSRnL. The FSR registers form a 16-bit address that allows an addressing space with 65536 locations. These locations are divided into three memory regions: * Traditional Data Memory * Linear Data Memory * Program Flash Memory DS41615A-page 34 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 3-8: INDIRECT ADDRESSING 0x0000 0x0000 Traditional Data Memory 0x0FFF 0x0FFF 0x1000 Reserved 0x1FFF 0x2000 Linear Data Memory 0x29AF 0x29B0 FSR Address Range Reserved 0x7FFF 0x8000 0x0000 Program Flash Memory 0xFFFF Note: 0x7FFF Not all memory regions are completely implemented. Consult device memory tables for memory limits. 2011 Microchip Technology Inc. Preliminary DS41615A-page 35 PIC12(L)F1501 3.5.1 TRADITIONAL DATA MEMORY The traditional data memory is a region from FSR address 0x000 to FSR address 0xFFF. The addresses correspond to the absolute addresses of all SFR, GPR and common registers. FIGURE 3-9: TRADITIONAL DATA MEMORY MAP Direct Addressing 4 BSR 0 6 Indirect Addressing From Opcode 0 7 0 Bank Select Location Select 0x00 FSRxH 0 0 0 7 FSRxL 0 0 Bank Select 00000 00001 00010 11111 Bank 0 Bank 1 Bank 2 Bank 31 Location Select 0x7F DS41615A-page 36 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 3.5.2 3.5.3 LINEAR DATA MEMORY The linear data memory is the region from FSR address 0x2000 to FSR address 0x29AF. This region is a virtual region that points back to the 80-byte blocks of GPR memory in all the banks. Unimplemented memory reads as 0x00. Use of the linear data memory region allows buffers to be larger than 80 bytes because incrementing the FSR beyond one bank will go directly to the GPR memory of the next bank. The 16 bytes of common memory are not included in the linear data memory region. FIGURE 3-10: 7 FSRnH 0 0 1 LINEAR DATA MEMORY MAP 0 7 FSRnL To make constant data access easier, the entire program Flash memory is mapped to the upper half of the FSR address space. When the MSB of FSRnH is set, the lower 15 bits are the address in program memory which will be accessed through INDF. Only the lower 8 bits of each memory location is accessible via INDF. Writing to the program Flash memory cannot be accomplished via the FSR/INDF interface. All instructions that access program Flash memory via the FSR/INDF interface will require one additional instruction cycle to complete. FIGURE 3-11: 7 1 0 PROGRAM FLASH MEMORY FSRnH PROGRAM FLASH MEMORY MAP 0 Location Select Location Select 0x2000 7 FSRnL 0x8000 0 0x0000 0x020 Bank 0 0x06F 0x0A0 Bank 1 0x0EF 0x120 Program Flash Memory (low 8 bits) Bank 2 0x16F 0xF20 Bank 30 0x29AF 2011 Microchip Technology Inc. 0xF6F Preliminary 0xFFFF 0x7FFF DS41615A-page 37 PIC12(L)F1501 NOTES: DS41615A-page 38 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 4.0 DEVICE CONFIGURATION Device Configuration consists of Configuration Words, Code Protection and Device ID. 4.1 Configuration Words There are several Configuration Word bits that allow different oscillator and memory protection options. These are implemented as Configuration Word 1 at 8007h and Configuration Word 2 at 8008h. 2011 Microchip Technology Inc. Preliminary DS41615A-page 39 PIC12(L)F1501 REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1 U-1 U-1 R/P-1 -- -- CLKOUTEN R/P-1 R/P-1 U-1 BOREN<1:0> -- bit 13 R/P-1 R/P-1 R/P-1 CP MCLRE PWRTE bit 8 R/P-1 R/P-1 U-1 WDTE<1:0> R/P-1 R/P-1 FOSC<1:0> -- bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `1' `0' = Bit is cleared `1' = Bit is set -n = Value when blank or after Bulk Erase bit 13-12 Unimplemented: Read as `1' bit 11 CLKOUTEN: Clock Out Enable bit 1 = CLKOUT function is disabled. I/O function on the CLKOUT pin 0 = CLKOUT function is enabled on the CLKOUT pin bit 10-9 BOREN<1:0>: Brown-out Reset Enable bits(1) 11 = BOR enabled 10 = BOR enabled during operation and disabled in Sleep 01 = BOR controlled by SBOREN bit of the BORCON register 00 = BOR disabled bit 8 Unimplemented: Read as `1' bit 7 CP: Code Protection bit(2) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 6 MCLRE: MCLR/VPP Pin Function Select bit If LVP bit = 1: This bit is ignored. If LVP bit = 0: 1 =MCLR/VPP pin function is MCLR; Weak pull-up enabled. 0 =MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUE3 bit. bit 5 PWRTE: Power-Up Timer Enable bit 1 = PWRT disabled 0 = PWRT enabled bit 4-3 WDTE<1:0>: Watchdog Timer Enable bits 11 = WDT enabled 10 = WDT enabled while running and disabled in Sleep 01 = WDT controlled by the SWDTEN bit in the WDTCON register 00 = WDT disabled bit 2 Unimplemented: Read as `1' bit 1-0 FOSC<1:0>: Oscillator Selection bits 11 = ECH: External Clock, High-Power mode: on CLKIN pin 10 = ECM: External Clock, Medium-Power mode: on CLKIN pin 01 = ECL: External Clock, Low-Power mode: on CLKIN pin 00 = INTOSC oscillator: I/O function on CLKIN pin Note 1: 2: Enabling Brown-out Reset does not automatically enable Power-up Timer. Once enabled, code-protect can only be disabled by bulk erasing the device. DS41615A-page 40 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 4-2: CONFIG2: CONFIGURATION WORD 2 R/P-1 U-1 R/P-1 R/P-1 R/P-1 U-1 LVP -- LPBOR BORV STVREN -- bit 13 bit 8 U-1 U-1 U-1 U-1 U-1 U-1 -- -- -- -- -- -- R/P-1 R/P-1 WRT<1:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `1' `0' = Bit is cleared `1' = Bit is set -n = Value when blank or after Bulk Erase bit 13 LVP: Low-Voltage Programming Enable bit(1) 1 = Low-voltage programming enabled 0 = High-voltage on MCLR must be used for programming bit 12 Unimplemented: Read as `1' bit 11 LPBOR: Low-Power BOR Enable bit 1 = Low-Power Brown-out Reset is disabled 0 = Low-Power Brown-out Reset is enabled bit 10 BORV: Brown-out Reset Voltage Selection bit(2) 1 = Brown-out Reset voltage (Vbor), low trip point selected 0 = Brown-out Reset voltage (Vbor), high trip point selected bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit 1 = Stack Overflow or Underflow will cause a Reset 0 = Stack Overflow or Underflow will not cause a Reset bit 8-2 Unimplemented: Read as `1' bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits 1 kW Flash memory: 11 = Write protection off 10 = 000h to 0FFh write-protected, 100h to 3FFh may be modified 01 = 000h to 1FFh write-protected, 200h to 3FFh may be modified 00 = 000h to 3FFh write-protected, no addresses may be modified Note 1: 2: The LVP bit cannot be programmed to `0' when Programming mode is entered via LVP. See Vbor parameter for specific trip point voltages. 2011 Microchip Technology Inc. Preliminary DS41615A-page 41 PIC12(L)F1501 4.2 Code Protection Code protection allows the device to be protected from unauthorized access. Internal access to the program memory is unaffected by any code protection setting. 4.2.1 PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in Configuration Words. When CP = 0, external reads and writes of program memory are inhibited and a read will return all `0's. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. See Section 4.3 "Write Protection" for more information. 4.3 Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as bootloader software, can be protected while allowing other regions of the program memory to be modified. The WRT<1:0> bits in Configuration Words define the size of the program memory block that is protected. 4.4 User ID Four memory locations (8000h-8003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are readable and writable during normal execution. See Section 10.4 "User ID, Device ID and Configuration Word Access" for more information on accessing these memory locations. For more information on checksum calculation, see the "PIC12(L)F1501/PIC16(L)F150X Memory Programming Specification" (DS41573). DS41615A-page 42 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 4.5 Device ID and Revision ID The memory location 8006h is where the Device ID and Revision ID are stored. The upper nine bits hold the Device ID. The lower five bits hold the Revision ID. See Section 10.4 "User ID, Device ID and Configuration Word Access" for more information on accessing these memory locations. Development tools, such as device programmers and debuggers, may be used to read the Device ID and Revision ID. REGISTER 4-3: DEVICEID: DEVICE ID REGISTER R R R R R R DEV<8:3> bit 13 R R bit 8 R R R DEV<2:0> R R R REV<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `1' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared P = Programmable bit bit 13-5 DEV<8:0>: Device ID bits Device bit 4-0 DEVICEID<13:0> Values DEV<8:0> REV<4:0> PIC12F1501 10 1100 110 x xxxx PIC12LF1501 10 1101 100 x xxxx REV<4:0>: Revision ID bits These bits are used to identify the revision (see Table under DEV<8:0> above). 2011 Microchip Technology Inc. Preliminary DS41615A-page 43 PIC12(L)F1501 NOTES: DS41615A-page 44 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 5.0 OSCILLATOR MODULE The oscillator module can be configured in one of the following clock modes. 5.1 Overview 1. The oscillator module has a wide variety of clock sources and selection features that allow it to be used in a wide range of applications while maximizing performance and minimizing power consumption. Figure 5-1 illustrates a block diagram of the oscillator module. 2. 3. 4. ECL - External Clock Low-Power mode (0 MHz to 0.5 MHz) ECM - External Clock Medium-Power mode (0.5 MHz to 4 MHz) ECH - External Clock High-Power mode (4 MHz to 20 MHz) INTOSC - Internal oscillator (31 kHz to 16 MHz) Clock Source modes are selected by the FOSC<1:0> bits in the Configuration Words. The FOSC bits determine the type of oscillator that will be used when the device is first powered. The EC clock mode relies on an external logic level signal as the device clock source. The INTOSC internal oscillator block produces low and high-frequency clock sources, designated LFINTOSC and HFINTOSC. (see Internal Oscillator Block, Figure 5-1). A wide selection of device clock frequencies may be derived from these clock sources. SIMPLIFIED PIC(R) MCU CLOCK SOURCE BLOCK DIAGRAM FIGURE 5-1: CLKIN EC EC Sleep MUX CLKIN 16 MHz Source 16 MHz (HFINTOSC) Postscaler Internal Oscillator Block 31 kHz Source 16 MHz 8 MHz 4 MHz 2 MHz 1 MHz 500 kHz 250 kHz 125 kHz 62.5 kHz 31.25 kHz MUX IRCF<3:0> CPU and Peripherals Internal Oscillator Clock Control FOSC<1:0> SCS<1:0> 31 kHz 31 kHz (LFINTOSC) 2011 Microchip Technology Inc. WDT, PWRT and other modules Preliminary DS41615A-page 45 PIC12(L)F1501 5.2 Clock Source Types 5.2.1.1 Clock sources can be classified as external or internal. External clock sources rely on external circuitry for the clock source to function. Examples are: oscillator modules (EC mode). Internal clock sources are contained within the oscillator module. The oscillator block has two internal oscillators that are used to generate two system clock sources: the 16 MHz High-Frequency Internal Oscillator (HFINTOSC) and the 31 kHz Low-Frequency Internal Oscillator (LFINTOSC). The system clock can be selected between external or internal clock sources via the System Clock Select (SCS) bits in the OSCCON register. See Section 5.3 "Clock Switching" for additional information. 5.2.1 EXTERNAL CLOCK SOURCES An external clock source can be used as the device system clock by performing one of the following actions: * Program the FOSC<1:0> bits in the Configuration Words to select an external clock source that will be used as the default system clock upon a device Reset. * Clear the SCS<1:0> bits in the OSCCON register to switch the system clock source to: - An external clock source determined by the value of the FOSC bits. See Section 5.3 "Clock Switching"for more information. DS41615A-page 46 EC Mode The External Clock (EC) mode allows an externally generated logic level signal to be the system clock source. When operating in this mode, an external clock source is connected to the CLKIN input. CLKOUT is available for general purpose I/O or CLKOUT. Figure 5-2 shows the pin connections for EC mode. EC mode has 3 power modes to select from through Configuration Words: * High power, 4-20 MHz (FOSC = 11) * Medium power, 0.5-4 MHz (FOSC = 10) * Low power, 0-0.5 MHz (FOSC = 01) When EC mode is selected, there is no delay in operation after a Power-on Reset (POR) or wake-up from Sleep. Because the PIC(R) MCU design is fully static, stopping the external clock input will have the effect of halting the device while leaving all data intact. Upon restarting the external clock, the device will resume operation as if no time had elapsed. FIGURE 5-2: Clock from Ext. System FOSC/4 or I/O(1) Note 1: Preliminary EXTERNAL CLOCK (EC) MODE OPERATION CLKIN PIC(R) MCU CLKOUT Output depends upon CLKOUTEN bit of the Configuration Words. 2011 Microchip Technology Inc. PIC12(L)F1501 5.2.2 INTERNAL CLOCK SOURCES 5.2.2.2 The device may be configured to use the internal oscillator block as the system clock by performing one of the following actions: * Program the FOSC<1:0> bits in Configuration Words to select the INTOSC clock source, which will be used as the default system clock upon a device Reset. * Write the SCS<1:0> bits in the OSCCON register to switch the system clock source to the internal oscillator during run-time. See Section 5.3 "Clock Switching"for more information. In INTOSC mode, CLKIN is available for general purpose I/O. CLKOUT is available for general purpose I/O or CLKOUT. The function of the CLKOUT pin is determined by the CLKOUTEN bit in Configuration Words. The internal oscillator block has two independent oscillators clock sources. 1. 2. The HFINTOSC (High-Frequency Internal Oscillator) is factory calibrated and operates at 16 MHz. The LFINTOSC (Low-Frequency Internal Oscillator) is uncalibrated and operates at 31 kHz. 5.2.2.1 HFINTOSC LFINTOSC The Low-Frequency Internal Oscillator (LFINTOSC) is an uncalibrated 31 kHz internal clock source. The output of the LFINTOSC connects to a multiplexer (see Figure 5-1). Select 31 kHz, via software, using the IRCF<3:0> bits of the OSCCON register. See Section 5.2.2.4 "Internal Oscillator Clock Switch Timing" for more information. The LFINTOSC is also the frequency for the Power-up Timer (PWRT) and Watchdog Timer (WDT). The LFINTOSC is enabled by selecting 31 kHz (IRCF<3:0> bits of the OSCCON register = 000x) as the system clock source (SCS bits of the OSCCON register = 1x), or when any of the following are enabled: * Configure the IRCF<3:0> bits of the OSCCON register for the desired LF frequency, and * FOSC<1:0> = 00, or * Set the System Clock Source (SCS) bits of the OSCCON register to `1x' Peripherals that use the LFINTOSC are: * Power-up Timer (PWRT) * Watchdog Timer (WDT) The Low-Frequency Internal Oscillator Ready bit (LFIOFR) of the OSCSTAT register indicates when the LFINTOSC is running. The High-Frequency Internal Oscillator (HFINTOSC) is a factory calibrated 16 MHz internal clock source. The outputs of the HFINTOSC connects to a prescaler and multiplexer (see Figure 5-1). One of multiple frequencies derived from the HFINTOSC can be selected via software using the IRCF<3:0> bits of the OSCCON register. See Section 5.2.2.4 "Internal Oscillator Clock Switch Timing" for more information. The HFINTOSC is enabled by: * Configure the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and * FOSC<1:0> = 00, or * Set the System Clock Source (SCS) bits of the OSCCON register to `1x'. A fast start-up oscillator allows internal circuits to power-up and stabilize before switching to HFINTOSC. The High-Frequency Internal Oscillator Ready bit (HFIOFR) of the OSCSTAT register indicates when the HFINTOSC is running. The High-Frequency Internal Oscillator Stable bit (HFIOFS) of the OSCSTAT register indicates when the HFINTOSC is running within 0.5% of its final value. 2011 Microchip Technology Inc. Preliminary DS41615A-page 47 PIC12(L)F1501 5.2.2.3 Internal Oscillator Frequency Selection 5.2.2.4 The system clock speed can be selected via software using the Internal Oscillator Frequency Select bits IRCF<3:0> of the OSCCON register. The outputs of the 16 MHz HFINTOSC postscaler and the LFINTOSC connect to a multiplexer (see Figure 5-1). The Internal Oscillator Frequency Select bits IRCF<3:0> of the OSCCON register select the frequency output of the internal oscillators. One of the following frequencies can be selected via software: Note: When switching between the HFINTOSC and the LFINTOSC, the new oscillator may already be shut down to save power (see Figure 5-3). If this is the case, there is a delay after the IRCF<3:0> bits of the OSCCON register are modified before the frequency selection takes place. The OSCSTAT register will reflect the current active status of the HFINTOSC and LFINTOSC oscillators. The sequence of a frequency selection is as follows: 1. * HFINTOSC - 16 MHz - 8 MHz - 4 MHz - 2 MHz - 1 MHz - 500 kHz (default after Reset) - 250 kHz - 125 kHz - 62.5 kHz - 31.25 kHz * LFINTOSC - 31 kHz Internal Oscillator Clock Switch Timing 2. 3. 4. IRCF<3:0> bits of the OSCCON register are modified. If the new clock is shut down, a clock start-up delay is started. Clock switch circuitry waits for a falling edge of the current clock. Clock switch is complete. See Figure 5-3 for more details. If the internal oscillator speed is switched between two clocks of the same source, there is no start-up delay before the new frequency is selected. Start-up delay specifications are located in the oscillator tables of Section 27.0 "Electrical Specifications". Following any Reset, the IRCF<3:0> bits of the OSCCON register are set to `0111' and the frequency selection is set to 500 kHz. The user can modify the IRCF bits to select a different frequency. The IRCF<3:0> bits of the OSCCON register allow duplicate selections for some frequencies. These duplicate choices can offer system design trade-offs. Lower power consumption can be obtained when changing oscillator sources for a given frequency. Faster transition times can be obtained between frequency changes that use the same oscillator source. DS41615A-page 48 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 5-3: HFINTOSC INTERNAL OSCILLATOR SWITCH TIMING LFINTOSC (WDT disabled) HFINTOSC Start-up Time 2-cycle Sync Running 2-cycle Sync Running LFINTOSC IRCF <3:0> 0 0 System Clock HFINTOSC LFINTOSC (WDT enabled) HFINTOSC LFINTOSC 0 IRCF <3:0> 0 System Clock LFINTOSC HFINTOSC LFINTOSC turns off unless WDT is enabled LFINTOSC Start-up Time 2-cycle Sync Running HFINTOSC IRCF <3:0> =0 0 System Clock 2011 Microchip Technology Inc. Preliminary DS41615A-page 49 PIC12(L)F1501 5.3 Clock Switching 5.3.1 The system clock source can be switched between external and internal clock sources via software using the System Clock Select (SCS) bits of the OSCCON register. The following clock sources can be selected using the SCS bits: * Default system oscillator determined by FOSC bits in Configuration Words * Internal Oscillator Block (INTOSC) SYSTEM CLOCK SELECT (SCS) BITS The System Clock Select (SCS) bits of the OSCCON register selects the system clock source that is used for the CPU and peripherals. * When the SCS bits of the OSCCON register = 00, the system clock source is determined by value of the FOSC<1:0> bits in the Configuration Words. * When the SCS bits of the OSCCON register = 1x, the system clock source is chosen by the internal oscillator frequency selected by the IRCF<3:0> bits of the OSCCON register. After a Reset, the SCS bits of the OSCCON register are always cleared. When switching between clock sources, a delay is required to allow the new clock to stabilize. These oscillator delays are shown in Table 5-2. TABLE 5-1: OSCILLATOR SWITCHING DELAYS Switch From Switch To Frequency Oscillator Delay Sleep/POR LFINTOSC HFINTOSC 31 kHz 31.25 kHz-16 MHz 2 cycles EC DC - 20 MHz LFINTOSC EC DC - 20 MHz 1 cycle of each Any clock source HFINTOSC 31.25 kHz-16 MHz 2 s (approx.) Any clock source LFINTOSC 31 kHz 1 cycle of each DS41615A-page 50 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 5.4 Oscillator Control Registers REGISTER 5-1: U-0 OSCCON: OSCILLATOR CONTROL REGISTER R/W-0/0 R/W-1/1 R/W-1/1 R/W-1/1 IRCF<3:0> -- U-0 R/W-0/0 -- bit 7 R/W-0/0 SCS<1:0> bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 Unimplemented: Read as `0' bit 6-3 IRCF<3:0>: Internal Oscillator Frequency Select bits 1111 = 16 MHz 1110 = 8 MHz 1101 = 4 MHz 1100 = 2 MHz 1011 = 1 MHz 1010 = 500 kHz(1) 1001 = 250 kHz(1) 1000 = 125 kHz(1) 0111 = 500 kHz (default upon Reset) 0110 = 250 kHz 0101 = 125 kHz 0100 = 62.5 kHz 001x = 31.25 kHz 000x = 31 kHz (LFINTOSC) bit 2 Unimplemented: Read as `0' bit 1-0 SCS<1:0>: System Clock Select bits 1x = Internal oscillator block 01 = Reserved 00 = Clock determined by FOSC<1:0> in Configuration Words Note 1: Duplicate frequency derived from HFINTOSC. 2011 Microchip Technology Inc. Preliminary DS41615A-page 51 PIC12(L)F1501 REGISTER 5-2: OSCSTAT: OSCILLATOR STATUS REGISTER U-0 U-0 U-0 R-0/q U-0 U-0 R-0/q R-0/q -- -- -- HFIOFR -- -- LFIOFR HFIOFS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared q = Conditional bit 7-5 Unimplemented: Read as `0' bit 4 HFIOFR: High-Frequency Internal Oscillator Ready bit 1 = 16 MHz Internal Oscillator (HFINTOSC) is ready 0 = 16 MHz Internal Oscillator (HFINTOSC) is not ready bit 3-2 Unimplemented: Read as `0' bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit 1 = 31 kHz Internal Oscillator (LFINTOSC) is ready 0 = 31 kHz Internal Oscillator (LFINTOSC) is not ready bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit 1 = 16 MHz Internal Oscillator (HFINTOSC) is stable 0 = 16 MHz Internal Oscillator (HFINTOSC) is not yet stable TABLE 5-2: Name SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Bit 7 OSCCON CONFIG1 Legend: Bit 4 Bit 3 IRCF<3:0> -- -- -- Bit 2 Bit 1 -- HFIOFR -- Bit 0 SCS<1:0> -- LFIOFR Register on Page 51 HFIOFS 52 -- = unimplemented location, read as `0'. Shaded cells are not used by clock sources. TABLE 5-3: Name Bit 5 -- OSCSTAT Legend: Bit 6 SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 -- -- -- -- CLKOUTEN 7:0 CP MCLRE PWRTE WDTE<1:0> Bit 10/2 Bit 9/1 BOREN<1:0> -- Bit 8/0 -- FOSC<1:0> Register on Page 40 -- = unimplemented location, read as `0'. Shaded cells are not used by clock sources. DS41615A-page 52 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 6.0 RESETS There are multiple ways to reset this device: * * * * * * * * * Power-on Reset (POR) Brown-out Reset (BOR) Low-Power Brown-out Reset (LPBOR) MCLR Reset WDT Reset RESET instruction Stack Overflow Stack Underflow Programming mode exit To allow VDD to stabilize, an optional Power-up Timer can be enabled to extend the Reset time after a BOR or POR event. A simplified block diagram of the On-chip Reset Circuit is shown in Figure 6-1. FIGURE 6-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT ICSPTM Programming Mode Exit RESET Instruction Stack Pointer MCLRE MCLR Sleep WDT Time-out Device Reset Power-on Reset VDD Brown-out Reset R PWRT Done LPBOR Reset PWRTE LFINTOSC BOR Active(1) Note 1: See Table 6-1 for BOR active conditions. 2011 Microchip Technology Inc. Preliminary DS41615A-page 53 PIC12(L)F1501 6.1 Power-on Reset (POR) 6.2 Brown-Out Reset (BOR) The POR circuit holds the device in Reset until VDD has reached an acceptable level for minimum operation. Slow rising VDD, fast operating speeds or analog performance may require greater than minimum VDD. The PWRT, BOR or MCLR features can be used to extend the start-up period until all device operation conditions have been met. The BOR circuit holds the device in Reset when VDD reaches a selectable minimum level. Between the POR and BOR, complete voltage range coverage for execution protection can be implemented. 6.1.1 * * * * POWER-UP TIMER (PWRT) The Power-up Timer provides a nominal 64 ms time-out on POR or Brown-out Reset. The device is held in Reset as long as PWRT is active. The PWRT delay allows additional time for the VDD to rise to an acceptable level. The Power-up Timer is enabled by clearing the PWRTE bit in Configuration Words. The Power-up Timer starts after the release of the POR and BOR. For additional information, refer to Application Note AN607, "Power-up Trouble Shooting" (DS00607). TABLE 6-1: The Brown-out Reset module has four operating modes controlled by the BOREN<1:0> bits in Configuration Words. The four operating modes are: BOR is always on BOR is off when in Sleep BOR is controlled by software BOR is always off Refer to Table 6-1 for more information. The Brown-out Reset voltage level is selectable by configuring the BORV bit in Configuration Words. A VDD noise rejection filter prevents the BOR from triggering on small events. If VDD falls below VBOR for a duration greater than parameter TBORDC, the device will reset. See Figure 6-2 for more information. BOR OPERATING MODES BOREN<1:0> SBOREN Device Mode BOR Mode 11 X X Active 10 X Awake Active Sleep Disabled 1 X Active 0 X Disabled X X Disabled 01 00 Instruction Execution upon: Release of POR or Wake-up from Sleep Waits for BOR ready(1) (BORRDY = 1) Waits for BOR ready (BORRDY = 1) Waits for BOR ready(1) (BORRDY = 1) Begins immediately (BORRDY = x) Note 1: In these specific cases, "Release of POR" and "Wake-up from Sleep", there is no delay in start-up. The BOR ready flag, (BORRDY = 1), will be set before the CPU is ready to execute instructions because the BOR circuit is forced on by the BOREN<1:0> bits. 6.2.1 BOR IS ALWAYS ON 6.2.3 When the BOREN bits of Configuration Words are programmed to `11', the BOR is always on. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. BOR protection is active during Sleep. The BOR does not delay wake-up from Sleep. 6.2.2 BOR IS OFF IN SLEEP When the BOREN bits of Configuration Words are programmed to `10', the BOR is on, except in Sleep. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. BOR CONTROLLED BY SOFTWARE When the BOREN bits of Configuration Words are programmed to `01', the BOR is controlled by the SBOREN bit of the BORCON register. The device start-up is not delayed by the BOR ready condition or the VDD level. BOR protection begins as soon as the BOR circuit is ready. The status of the BOR circuit is reflected in the BORRDY bit of the BORCON register. BOR protection is unchanged by Sleep. BOR protection is not active during Sleep. The device wake-up will be delayed until the BOR is ready. DS41615A-page 54 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 6-2: BROWN-OUT SITUATIONS VDD VBOR Internal Reset TPWRT(1) VDD VBOR Internal < TPWRT Reset TPWRT(1) VDD VBOR Internal Reset Note 1: TPWRT(1) TPWRT delay only if PWRTE bit is programmed to `0'. REGISTER 6-1: BORCON: BROWN-OUT RESET CONTROL REGISTER R/W-1/u R/W-0/u U-0 U-0 U-0 U-0 U-0 R-q/u SBOREN BORFS -- -- -- -- -- BORRDY bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared q = Value depends on condition bit 7 SBOREN: Software Brown-out Reset Enable bit If BOREN <1:0> in Configuration Words 01: SBOREN is read/write, but has no effect on the BOR. If BOREN <1:0> in Configuration Words = 01: 1 = BOR Enabled 0 = BOR Disabled bit 6 BORFS: Brown-out Reset Fast Start bit(1) If BOREN<1:0> = 11 (Always on) or BOREN<1:0> = 00 (Always off) BORFS is Read/Write, but has no effect. If BOREN <1:0> = 10 (Disabled in Sleep) or BOREN<1:0> = 01 (Under software control): 1 = Band gap is forced on always (covers sleep/wake-up/operating cases) 0 = Band gap operates normally, and may turn off bit 5-1 Unimplemented: Read as `0' bit 0 BORRDY: Brown-out Reset Circuit Ready Status bit 1 = The Brown-out Reset circuit is active 0 = The Brown-out Reset circuit is inactive Note 1: BOREN<1:0> bits are located in Configuration Words. 2011 Microchip Technology Inc. Preliminary DS41615A-page 55 PIC12(L)F1501 6.3 Low-Power Brown-out Reset (LPBOR) 6.5 The Low-Power Brown-Out Reset (LPBOR) is an essential part of the Reset subsystem. Refer to Figure 6-1 to see how the BOR interacts with other modules. The LPBOR is used to monitor the external VDD pin. When too low of a voltage is detected, the device is held in Reset. When this occurs, a register bit (BOR) is changed to indicate that a BOR Reset has occurred. The same bit is set for both the BOR and the LPBOR. Refer to Register 6-2. 6.3.1 ENABLING LPBOR The LPBOR is controlled by the LPBOR bit of Configuration Words. When the device is erased, the LPBOR module defaults to disabled. 6.3.1.1 LPBOR Module Output The output of the LPBOR module is a signal indicating whether or not a Reset is to be asserted. This signal is OR'd together with the Reset signal of the BOR module to provide the generic BOR signal which goes to the PCON register and to the power control block. 6.4 MCLR Watchdog Timer (WDT) Reset The Watchdog Timer generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The TO and PD bits in the STATUS register are changed to indicate the WDT Reset. See Section 9.0 "Watchdog Timer" for more information. 6.6 RESET Instruction A RESET instruction will cause a device Reset. The RI bit in the PCON register will be set to `0'. See Table 6-4 for default conditions after a RESET instruction has occurred. 6.7 Stack Overflow/Underflow Reset The device can reset when the Stack Overflows or Underflows. The STKOVF or STKUNF bits of the PCON register indicate the Reset condition. These Resets are enabled by setting the STVREN bit in Configuration Words. See Section 3.4.2 "Overflow/Underflow Reset" for more information. 6.8 Programming Mode Exit Upon exit of Programming mode, the device will behave as if a POR had just occurred. The MCLR is an optional external input that can reset the device. The MCLR function is controlled by the MCLRE bit of Configuration Words and the LVP bit of Configuration Words (Table 6-2). 6.9 TABLE 6-2: The Power-up Timer is controlled by the PWRTE bit of Configuration Words. MCLR CONFIGURATION MCLRE LVP MCLR 0 0 Disabled 1 0 Enabled x 1 Enabled 6.4.1 MCLR ENABLED A Reset does not drive the MCLR pin low. MCLR DISABLED When MCLR is disabled, the pin functions as a general purpose input and the internal weak pull-up is under software control. See Section 11.2 "PORTA Registers" for more information. DS41615A-page 56 Start-up Sequence Upon the release of a POR or BOR, the following must occur before the device will begin executing: The device has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. 6.4.2 The Power-up Timer optionally delays device execution after a BOR or POR event. This timer is typically used to allow VDD to stabilize before allowing the device to start running. 6.10 When MCLR is enabled and the pin is held low, the device is held in Reset. The MCLR pin is connected to VDD through an internal weak pull-up. Note: Power-Up Timer 1. 2. Power-up Timer runs to completion (if enabled). MCLR must be released (if enabled). The total time-out will vary based on oscillator configuration and Power-up Timer configuration. See Section 5.0 "Oscillator Module" for more information. The Power-up Timer runs independently of MCLR Reset. If MCLR is kept low long enough, the Power-up Timer will expire. Upon bringing MCLR high, the device will begin execution immediately (see Figure 6-3). This is useful for testing purposes or to synchronize more than one device operating in parallel. Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 6-3: RESET START-UP SEQUENCE VDD Internal POR TPWRT Power-Up Timer MCLR TMCLR Internal RESET Internal Oscillator Oscillator FOSC External Clock (EC) CLKIN FOSC 2011 Microchip Technology Inc. Preliminary DS41615A-page 57 PIC12(L)F1501 6.11 Determining the Cause of a Reset Upon any Reset, multiple bits in the STATUS and PCON registers are updated to indicate the cause of the Reset. Table 6-3 and Table 6-4 show the Reset conditions of these registers. TABLE 6-3: RESET STATUS BITS AND THEIR SIGNIFICANCE STKOVF STKUNF RWDT RMCLR RI POR BOR TO PD Condition 0 0 1 1 1 0 x 1 1 Power-on Reset 0 0 1 1 1 0 x 0 x Illegal, TO is set on POR 0 0 1 1 1 0 x x 0 Illegal, PD is set on POR 0 0 u 1 1 u 0 1 1 Brown-out Reset u u 0 u u u u 0 u WDT Reset u u u u u u u 0 0 WDT Wake-up from Sleep u u u u u u u 1 0 Interrupt Wake-up from Sleep u u u 0 u u u u u MCLR Reset during normal operation u u u 0 u u u 1 0 MCLR Reset during Sleep u u u u 0 u u u u RESET Instruction Executed 1 u u u u u u u u Stack Overflow Reset (STVREN = 1) u 1 u u u u u u u Stack Underflow Reset (STVREN = 1) TABLE 6-4: RESET CONDITION FOR SPECIAL REGISTERS(2) Program Counter STATUS Register PCON Register Power-on Reset 0000h ---1 1000 00-- 110x MCLR Reset during normal operation 0000h ---u uuuu uu-- 0uuu MCLR Reset during Sleep 0000h ---1 0uuu uu-- 0uuu WDT Reset 0000h ---0 uuuu uu-- uuuu WDT Wake-up from Sleep PC + 1 ---0 0uuu uu-- uuuu Brown-out Reset 0000h ---1 1uuu 00-- 11u0 ---1 0uuu uu-- uuuu ---u uuuu uu-- u0uu Condition Interrupt Wake-up from Sleep RESET Instruction Executed PC + 1 (1) 0000h Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1u-- uuuu Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1-- uuuu Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as `0'. Note 1: When the wake-up is due to an interrupt and the Global Interrupt Enable bit (GIE) is set, the return address is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1. 2: If a Status bit is not implemented, that bit will be read as `0'. DS41615A-page 58 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 6.12 Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: * * * * * * * Power-on Reset (POR) Brown-out Reset (BOR) Reset Instruction Reset (RI) MCLR Reset (RMCLR) Watchdog Timer Reset (RWDT) Stack Underflow Reset (STKUNF) Stack Overflow Reset (STKOVF) The PCON register bits are shown in Register 6-2. REGISTER 6-2: PCON: POWER CONTROL REGISTER R/W/HS-0/q R/W/HS-0/q U-0 STKOVF STKUNF -- R/W/HC-1/q R/W/HC-1/q RWDT R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u RI POR BOR RMCLR bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared q = Value depends on condition bit 7 STKOVF: Stack Overflow Flag bit 1 = A Stack Overflow occurred 0 = A Stack Overflow has not occurred or cleared by firmware bit 6 STKUNF: Stack Underflow Flag bit 1 = A Stack Underflow occurred 0 = A Stack Underflow has not occurred or cleared by firmware bit 5 Unimplemented: Read as `0' bit 4 RWDT: Watchdog Timer Reset Flag bit 1 = A Watchdog Timer Reset has not occurred or set by firmware 0 = A Watchdog Timer Reset has occurred (cleared by hardware) bit 3 RMCLR: MCLR Reset Flag bit 1 = A MCLR Reset has not occurred or set by firmware 0 = A MCLR Reset has occurred (cleared by hardware) bit 2 RI: RESET Instruction Flag bit 1 = A RESET instruction has not been executed or set by firmware 0 = A RESET instruction has been executed (cleared by hardware) bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset occurs) 2011 Microchip Technology Inc. Preliminary DS41615A-page 59 PIC12(L)F1501 TABLE 6-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BORCON SBOREN BORFS -- -- -- -- -- BORRDY 55 PCON STKOVF STKUNF -- RWDT RMCLR RI POR BOR 59 STATUS -- -- -- TO PD Z DC C 18 WDTCON -- -- SWDTEN 81 WDTPS<4:0> Legend: -- = unimplemented bit, reads as `0'. Shaded cells are not used by Resets. Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. TABLE 6-6: Name CONFIG1 CONFIG2 SUMMARY OF CONFIGURATION WORD WITH RESETS Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 -- -- -- -- CLKOUTEN 7:0 CP 13:8 -- -- LVP -- LPBOR BORV 7:0 -- -- -- -- -- -- MCLRE PWRTE WDTE<1:0> Bit 10/2 Bit 9/1 BOREN<1:0> -- Bit 8/0 -- FOSC<1:0> STVREN -- WRT<1:0> Register on Page 40 41 Legend: -- = unimplemented location, read as `0'. Shaded cells are not used by Resets. DS41615A-page 60 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 7.0 INTERRUPTS The interrupt feature allows certain events to preempt normal program flow. Firmware is used to determine the source of the interrupt and act accordingly. Some interrupts can be configured to wake the MCU from Sleep mode. This chapter contains the following information for Interrupts: * * * * * Operation Interrupt Latency Interrupts During Sleep INT Pin Automatic Context Saving Many peripherals produce interrupts. Refer to the corresponding chapters for details. A block diagram of the interrupt logic is shown in Figure 7-1. FIGURE 7-1: INTERRUPT LOGIC TMR0IF TMR0IE Peripheral Interrupts (TMR1IF) PIR1<0> (TMR1IF) PIR1<0> Wake-up (If in Sleep mode) INTF INTE IOCIF IOCIE Interrupt to CPU PEIE PIRn<7> PIEn<7> 2011 Microchip Technology Inc. GIE Preliminary DS41615A-page 61 PIC12(L)F1501 7.1 Operation 7.2 Interrupts are disabled upon any device Reset. They are enabled by setting the following bits: * GIE bit of the INTCON register * Interrupt Enable bit(s) for the specific interrupt event(s) * PEIE bit of the INTCON register (if the Interrupt Enable bit of the interrupt event is contained in the PIE1, PIE2 and PIE3 registers) Interrupt Latency Interrupt latency is defined as the time from when the interrupt event occurs to the time code execution at the interrupt vector begins. The latency for synchronous interrupts is 3 or 4 instruction cycles. For asynchronous interrupts, the latency is 3 to 5 instruction cycles, depending on when the interrupt occurs. See Figure 7-2 and Figure 7.3 for more details. The INTCON, PIR1, PIR2 and PIR3 registers record individual interrupts via interrupt flag bits. Interrupt flag bits will be set, regardless of the status of the GIE, PEIE and individual interrupt enable bits. The following events happen when an interrupt event occurs while the GIE bit is set: * Current prefetched instruction is flushed * GIE bit is cleared * Current Program Counter (PC) is pushed onto the stack * Critical registers are automatically saved to the shadow registers (See "Section 7.5 "Automatic Context Saving".") * PC is loaded with the interrupt vector 0004h The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector. The RETFIE instruction exits the ISR by popping the previous address from the stack, restoring the saved context from the shadow registers and setting the GIE bit. For additional information on a specific interrupt's operation, refer to its peripheral chapter. Note 1: Individual interrupt flag bits are set, regardless of the state of any other enable bits. 2: All interrupts will be ignored while the GIE bit is cleared. Any interrupt occurring while the GIE bit is clear will be serviced when the GIE bit is set again. DS41615A-page 62 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 7-2: INTERRUPT LATENCY Fosc Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKR Interrupt Sampled during Q1 Interrupt GIE PC Execute PC-1 PC 1 Cycle Instruction at PC PC+1 0004h 0005h Inst(PC) NOP NOP Inst(0004h) PC+1/FSR ADDR New PC/ PC+1 0004h 0005h Inst(PC) NOP NOP Inst(0004h) FSR ADDR PC+1 PC+2 0004h 0005h INST(PC) NOP NOP NOP Inst(0004h) Inst(0005h) FSR ADDR PC+1 0004h 0005h INST(PC) NOP NOP Inst(0004h) Interrupt GIE PC Execute PC-1 PC 2 Cycle Instruction at PC Interrupt GIE PC Execute PC-1 PC 3 Cycle Instruction at PC Interrupt GIE PC Execute PC-1 PC 3 Cycle Instruction at PC 2011 Microchip Technology Inc. Preliminary PC+2 NOP NOP DS41615A-page 63 PIC12(L)F1501 FIGURE 7-3: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 FOSC CLKOUT (3) INT pin (1) (1) INTF Interrupt Latency (2) (4) GIE INSTRUCTION FLOW PC Instruction Fetched Instruction Executed Note 1: PC Inst (PC) Inst (PC - 1) PC + 1 Inst (PC + 1) Inst (PC) PC + 1 -- Forced NOP 0004h 0005h Inst (0004h) Inst (0005h) Forced NOP Inst (0004h) INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: For minimum width of INT pulse, refer to AC specifications in Section 27.0 "Electrical Specifications"". 4: INTF is enabled to be set any time during the Q4-Q1 cycles. DS41615A-page 64 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 7.3 Interrupts During Sleep Some interrupts can be used to wake from Sleep. To wake from Sleep, the peripheral must be able to operate without the system clock. The interrupt source must have the appropriate Interrupt Enable bit(s) set prior to entering Sleep. On waking from Sleep, if the GIE bit is also set, the processor will branch to the interrupt vector. Otherwise, the processor will continue executing instructions after the SLEEP instruction. The instruction directly after the SLEEP instruction will always be executed before branching to the ISR. Refer to Section 8.0 "Power-Down Mode (Sleep)" for more details. 7.4 INT Pin The INT pin can be used to generate an asynchronous edge-triggered interrupt. This interrupt is enabled by setting the INTE bit of the INTCON register. The INTEDG bit of the OPTION_REG register determines on which edge the interrupt will occur. When the INTEDG bit is set, the rising edge will cause the interrupt. When the INTEDG bit is clear, the falling edge will cause the interrupt. The INTF bit of the INTCON register will be set when a valid edge appears on the INT pin. If the GIE and INTE bits are also set, the processor will redirect program execution to the interrupt vector. 7.5 Automatic Context Saving Upon entering an interrupt, the return PC address is saved on the stack. Additionally, the following registers are automatically saved in the Shadow registers: * * * * * W register STATUS register (except for TO and PD) BSR register FSR registers PCLATH register Upon exiting the Interrupt Service Routine, these registers are automatically restored. Any modifications to these registers during the ISR will be lost. If modifications to any of these registers are desired, the corresponding Shadow register should be modified and the value will be restored when exiting the ISR. The Shadow registers are available in Bank 31 and are readable and writable. Depending on the user's application, other registers may also need to be saved. 2011 Microchip Technology Inc. Preliminary DS41615A-page 65 PIC12(L)F1501 7.6 Interrupt Control Registers 7.6.1 Note: INTCON REGISTER The INTCON register is a readable and writable register, that contains the various enable and flag bits for TMR0 register overflow, interrupt-on-change and external INT pin interrupts. REGISTER 7-1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. INTCON: INTERRUPT CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 GIE: Global Interrupt Enable bit 1 = Enables all active interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all active peripheral interrupts 0 = Disables all peripheral interrupts bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCIE: Interrupt-on-Change Enable bit 1 = Enables the interrupt-on-change 0 = Disables the interrupt-on-change bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed 0 = TMR0 register did not overflow bit 1 INTF: INT External Interrupt Flag bit 1 = The INT external interrupt occurred 0 = The INT external interrupt did not occur bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit(1) 1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state Note 1: The IOCIF Flag bit is read-only and cleared when all the interrupt-on-change flags in the IOCBF register have been cleared by software. DS41615A-page 66 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 7.6.2 PIE1 REGISTER The PIE1 register contains the interrupt enable bits, as shown in Register 7-2. REGISTER 7-2: Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 TMR1GIE ADIE -- -- -- -- TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit 1 = Enables the Timer1 Gate Acquisition interrupt 0 = Disables the Timer1 Gate Acquisition interrupt bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5-2 Unimplemented: Read as `0' bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit 1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt 2011 Microchip Technology Inc. Preliminary DS41615A-page 67 PIC12(L)F1501 7.6.3 PIE2 REGISTER The PIE2 register contains the interrupt enable bits, as shown in Register 7-3. REGISTER 7-3: Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 U-0 U-0 R/W-0/0 U-0 U-0 R/W-0/0 U-0 U-0 -- -- C1IE -- -- NCO1IE -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5 C1IE: Comparator C1 Interrupt Enable bit 1 = Enables the Comparator C1 interrupt 0 = Disables the Comparator C1 interrupt bit 4-3 Unimplemented: Read as `0' bit 2 NCO1IE: Numerically Controlled Oscillator Interrupt Enable bit 1 = Enables the NCO interrupt 0 = Disables the NCO interrupt bit 1-0 Unimplemented: Read as `0' DS41615A-page 68 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 7.6.4 PIE3 REGISTER The PIE3 register contains the interrupt enable bits, as shown in Register 7-4. REGISTER 7-4: Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 -- -- -- -- -- -- CLC2IE CLC1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-2 Unimplemented: Read as `0' bit 1 CLC2IE: Configurable Logic Block 2 Interrupt Enable bit 1 = Enables the CLC 2 interrupt 0 = Disables the CLC 2 interrupt bit 0 CLC1IE: Configurable Logic Block 1 Interrupt Enable bit 1 = Enables the CLC 1 interrupt 0 = Disables the CLC 1 interrupt 2011 Microchip Technology Inc. Preliminary DS41615A-page 69 PIC12(L)F1501 7.6.5 PIR1 REGISTER The PIR1 register contains the interrupt flag bits, as shown in Register 7-5. REGISTER 7-5: Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 TMR1GIF ADIF -- -- -- -- TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 ADIF: A/D Converter Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5-2 Unimplemented: Read as `0' bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending DS41615A-page 70 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 7.6.6 PIR2 REGISTER The PIR2 register contains the interrupt flag bits, as shown in Register 7-6. REGISTER 7-6: Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2 U-0 U-0 R/W-0/0 U-0 U-0 R/W-0/0 U-0 U-0 -- -- C1IF -- -- NCO1IF -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5 C1IF: Numerically Controlled Oscillator Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4-3 Unimplemented: Read as `0' bit 2 NCO1IF: Numerically Controlled Oscillator Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1-0 Unimplemented: Read as `0' 2011 Microchip Technology Inc. Preliminary DS41615A-page 71 PIC12(L)F1501 7.6.7 PIR3 REGISTER The PIR3 register contains the interrupt flag bits, as shown in Register 7-7. REGISTER 7-7: Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. PIR3: PERIPHERAL INTERRUPT REQUEST REGISTER 3 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 -- -- -- -- -- -- CLC2IF CLC1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-2 Unimplemented: Read as `0' bit 1 CLC2IF: Configurable Logic Block 2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 CLC1IF: Configurable Logic Block 1 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending DS41615A-page 72 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 7-1: Name INTCON SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 66 OPTION_REG WPUEN PIE1 TMR1GIE INTEDG TMR0CS TMR0SE PSA PS<2:0> ADIE -- -- -- -- TMR2IE 143 TMR1IE 67 PIE2 -- -- C1IE -- -- NCO1IE -- -- 68 PIE3 -- -- -- -- -- -- CLC2IE CLC1IE 69 PIR1 TMR1GIF ADIF -- -- -- -- TMR2IF TMR1IF 70 PIR2 -- -- C1IF -- -- NCO1IF -- -- 71 PIR3 -- -- -- -- -- -- CLC2IF CLC1IF 72 Legend: -- = unimplemented location, read as `0'. Shaded cells are not used by Interrupts. 2011 Microchip Technology Inc. Preliminary DS41615A-page 73 PIC12(L)F1501 NOTES: DS41615A-page 74 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 8.0 POWER-DOWN MODE (SLEEP) The Power-Down mode is entered by executing a SLEEP instruction. Upon entering Sleep mode, the following conditions exist: 1. 2. 3. 4. 5. 6. 7. 8. WDT will be cleared but keeps running, if enabled for operation during Sleep. PD bit of the STATUS register is cleared. TO bit of the STATUS register is set. CPU clock is disabled. 31 kHz LFINTOSC is unaffected and peripherals that operate from it may continue operation in Sleep. ADC is unaffected, if the dedicated FRC clock is selected. I/O ports maintain the status they had before SLEEP was executed (driving high, low or high-impedance). Resets other than WDT are not affected by Sleep mode. Refer to individual chapters for more details on peripheral operation during Sleep. To minimize current consumption, the following conditions should be considered: * * * * * * I/O pins should not be floating External circuitry sinking current from I/O pins Internal circuitry sourcing current from I/O pins Current draw from pins with internal weak pull-ups Modules using 31 kHz LFINTOSC CWG, NCO and CLC modules using HFINTOSC I/O pins that are high-impedance inputs should be pulled to VDD or VSS externally to avoid switching currents caused by floating inputs. Examples of internal circuitry that might be sourcing current include the FVR module. See Section 13.0 "Fixed Voltage Reference (FVR)" for more information on this module. 2011 Microchip Technology Inc. 8.1 Wake-up from Sleep The device can wake-up from Sleep through one of the following events: 1. External Reset input on MCLR pin, if enabled 2. BOR Reset, if enabled 3. POR Reset 4. Watchdog Timer, if enabled 5. Any external interrupt 6. Interrupts by peripherals capable of running during Sleep (see individual peripheral for more information) The first three events will cause a device Reset. The last three events are considered a continuation of program execution. To determine whether a device Reset or wake-up event occurred, refer to Section 6.11 "Determining the Cause of a Reset". When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE bit is disabled, the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is enabled, the device executes the instruction after the SLEEP instruction, the device will then call the Interrupt Service Routine. In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up. 8.1.1 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: * If the interrupt occurs before the execution of a SLEEP instruction: - SLEEP instruction will execute as a NOP. - WDT and WDT prescaler will not be cleared - TO bit of the STATUS register will not be set - PD bit of the STATUS register will not be cleared. * If the interrupt occurs during or after the execution of a SLEEP instruction: - SLEEP instruction will be completely executed - Device will immediately wake-up from Sleep - WDT and WDT prescaler will be cleared - TO bit of the STATUS register will be set - PD bit of the STATUS register will be cleared Preliminary DS41615A-page 75 PIC12(L)F1501 Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. FIGURE 8-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKIN(1) CLKOUT(2) Interrupt Latency (3) Interrupt flag GIE bit (INTCON reg.) Processor in Sleep Instruction Flow PC Instruction Fetched Instruction Executed Note 1: 2: 3: PC Inst(PC) = Sleep Inst(PC - 1) PC + 1 PC + 2 PC + 2 Inst(PC + 1) Inst(PC + 2) Sleep Inst(PC + 1) PC + 2 Forced NOP 0004h 0005h Inst(0004h) Inst(0005h) Forced NOP Inst(0004h) External clock. High, Medium, Low mode assumed. CLKOUT is shown here for timing reference. GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. DS41615A-page 76 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 8.2 Low-Power Sleep Mode 8.2.2 The PIC12F1501 device contains an internal Low Dropout (LDO) voltage regulator, which allows the device I/O pins to operate at voltages up to 5.5V while the internal device logic operates at a lower voltage. The LDO and its associated reference circuitry must remain active when the device is in Sleep mode. The PIC12F1501 allows the user to optimize the operating current in Sleep, depending on the application requirements. A Low-Power Sleep mode can be selected by setting the VREGPM bit of the VREGCON register. With this bit set, the LDO and reference circuitry are placed in a low-power state when the device is in Sleep. 8.2.1 SLEEP CURRENT VS. WAKE-UP TIME In the default operating mode, the LDO and reference circuitry remain in the normal configuration while in Sleep. The device is able to exit Sleep mode quickly since all circuits remain active. In Low-Power Sleep mode, when waking up from Sleep, an extra delay time is required for these circuits to return to the normal configuration and stabilize. The Low-Power Sleep mode is beneficial for applications that stay in Sleep mode for long periods of time. The Normal mode is beneficial for applications that need to wake from Sleep quickly and frequently. 2011 Microchip Technology Inc. PERIPHERAL USAGE IN SLEEP Some peripherals that can operate in Sleep mode will not operate properly with the Low-Power Sleep mode selected. The LDO will remain in the Normal Power mode when those peripherals are enabled. The Low-Power Sleep mode is intended for use with these peripherals: * * * * Brown-Out Reset (BOR) Watchdog Timer (WDT) External interrupt pin/Interrupt-on-change pins Timer1 (with external clock source) The Complementary Waveform Generator (CWG), the Numerically Controlled Oscillator (NCO) and the Configurable Logic Cell (CLC) modules can utilize the HFINTOSC oscillator as either a clock source or as an input source. Under certain conditions, when the HFINTOSC is selected for use with the CWG, NCO or CLC modules, the HFINTOSC will remain active during Sleep. This will have a direct effect on the Sleep mode current. Please refer to sections 22.5 "Operation During Sleep", 23.7 "Operation In Sleep" and 24.10 "Operation During Sleep" for more information. Note: Preliminary The PIC12LF1501 does not have a configurable Low-Power Sleep mode. PIC12LF1501 is an unregulated device and is always in the lowest power state when in Sleep, with no wake-up time penalty. This device has a lower maximum VDD and I/O voltage than the PIC12F1501. See Section 25.0 "Electrical Specifications" for more information. DS41615A-page 77 PIC12(L)F1501 VREGCON: VOLTAGE REGULATOR CONTROL REGISTER(1) REGISTER 8-1: U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-1/1 -- -- -- -- -- -- VREGPM Reserved bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-2 Unimplemented: Read as `0' bit 1 VREGPM: Voltage Regulator Power Mode Selection bit 1 = Low-Power Sleep mode enabled in Sleep Draws lowest current in Sleep, slower wake-up 0 = Normal Power mode enabled in Sleep Draws higher current in Sleep, faster wake-up bit 0 Reserved: Read as `1'. Maintain this bit set. Note 1: PIC12F1501 only. TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 66 -- -- IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 107 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 107 IOCAP2 IOCAP1 IOCAP0 107 IOCAF IOCAN -- -- IOCAN5 IOCAP -- -- IOCAP5 IOCAP4 IOCAP3 PIE1 TMR1GIE ADIE -- -- -- -- TMR2IE TMR1IE 67 PIE2 -- -- C1IE -- -- NCO1IE -- -- 68 PIE3 -- -- -- -- -- -- CLC2IE CLC1IE 69 PIR1 TMR1GIF ADIF -- -- -- -- TMR2IF TMR1IF 70 PIR2 -- -- C1IF -- -- NCO1IF -- -- 71 PIR3 -- -- -- -- -- -- CLC2IF CLC1IF 72 STATUS -- -- -- TO PD Z DC C 18 WDTCON -- -- SWDTEN 81 WDTPS<4:0> Legend: -- = unimplemented, read as `0'. Shaded cells are not used in Power-Down mode. DS41615A-page 78 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 9.0 WATCHDOG TIMER The Watchdog Timer is a system timer that generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The Watchdog Timer is typically used to recover the system from unexpected events. The WDT has the following features: * Independent clock source * Multiple operating modes - WDT is always on - WDT is off when in Sleep - WDT is controlled by software - WDT is always off * Configurable time-out period is from 1 ms to 256 seconds (typical) * Multiple Reset conditions * Operation during Sleep FIGURE 9-1: WATCHDOG TIMER BLOCK DIAGRAM WDTE<1:0> = 01 SWDTEN WDTE<1:0> = 11 LFINTOSC 23-bit Programmable Prescaler WDT WDT Time-out WDTE<1:0> = 10 Sleep 2011 Microchip Technology Inc. WDTPS<4:0> Preliminary DS41615A-page 79 PIC12(L)F1501 9.1 Independent Clock Source 9.3 Time-Out Period The WDT derives its time base from the 31 kHz LFINTOSC internal oscillator. Time intervals in this chapter are based on a nominal interval of 1 ms. See Section 27.0 "Electrical Specifications" for the LFINTOSC tolerances. The WDTPS bits of the WDTCON register set the time-out period from 1 ms to 256 seconds (nominal). After a Reset, the default time-out period is 2 seconds. 9.2 The WDT is cleared when any of the following conditions occur: WDT Operating Modes The Watchdog Timer module has four operating modes controlled by the WDTE<1:0> bits in Configuration Words. See Table 9-1. 9.4 Clearing the WDT When the WDTE bits of Configuration Words are set to `11', the WDT is always on. * * * * * * WDT protection is active during Sleep. See Table 9-2 for more information. 9.2.2 9.5 9.2.1 WDT IS ALWAYS ON WDT IS OFF IN SLEEP When the WDTE bits of Configuration Words are set to `10', the WDT is on, except in Sleep. WDT protection is not active during Sleep. 9.2.3 WDT CONTROLLED BY SOFTWARE When the WDTE bits of Configuration Words are set to `01', the WDT is controlled by the SWDTEN bit of the WDTCON register. WDT protection is unchanged by Sleep. See Table 9-1 for more details. TABLE 9-1: Operation During Sleep When the device enters Sleep, the WDT is cleared. If the WDT is enabled during Sleep, the WDT resumes counting. When the device exits Sleep, the WDT is cleared again. When a WDT time-out occurs while the device is in Sleep, no Reset is generated. Instead, the device wakes up and resumes operation. The TO and PD bits in the STATUS register are changed to indicate the event. The RWDT bit in the PCON register can also be used. See Section 3.0 "Memory Organization" for more information. WDT OPERATING MODES WDTE<1:0> SWDTEN Device Mode WDT Mode 11 X X Active 10 X Awake Active Sleep Disabled 1 01 X 0 00 TABLE 9-2: Any Reset CLRWDT instruction is executed Device enters Sleep Device wakes up from Sleep Oscillator fail WDT is disabled X X Active Disabled Disabled WDT CLEARING CONDITIONS Conditions WDT WDTE<1:0> = 00 WDTE<1:0> = 01 and SWDTEN = 0 WDTE<1:0> = 10 and enter Sleep Cleared CLRWDT Command Oscillator Fail Detected Exit Sleep + System Clock = INTOSC, EXTCLK Change INTOSC divider (IRCF bits) DS41615A-page 80 Unaffected Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 9.6 Watchdog Control Register REGISTER 9-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 -- -- R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 WDTPS<4:0> bit 7 R/W-0/0 SWDTEN bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits(1) Bit Value = Prescale Rate 00000 = 1:32 (Interval 1 ms nominal) 00001 = 1:64 (Interval 2 ms nominal) 00010 = 1:128 (Interval 4 ms nominal) 00011 = 1:256 (Interval 8 ms nominal) 00100 = 1:512 (Interval 16 ms nominal) 00101 = 1:1024 (Interval 32 ms nominal) 00110 = 1:2048 (Interval 64 ms nominal) 00111 = 1:4096 (Interval 128 ms nominal) 01000 = 1:8192 (Interval 256 ms nominal) 01001 = 1:16384 (Interval 512 ms nominal) 01010 = 1:32768 (Interval 1s nominal) 01011 = 1:65536 (Interval 2s nominal) (Reset value) 01100 = 1:131072 (217) (Interval 4s nominal) 01101 = 1:262144 (218) (Interval 8s nominal) 01110 = 1:524288 (219) (Interval 16s nominal) 01111 = 1:1048576 (220) (Interval 32s nominal) 10000 = 1:2097152 (221) (Interval 64s nominal) 10001 = 1:4194304 (222) (Interval 128s nominal) 10010 = 1:8388608 (223) (Interval 256s nominal) 10011 = Reserved. Results in minimum interval (1:32) * * * 11111 = Reserved. Results in minimum interval (1:32) bit 0 Note 1: SWDTEN: Software Enable/Disable for Watchdog Timer bit If WDTE<1:0> = 00: This bit is ignored. If WDTE<1:0> = 01: 1 = WDT is turned on 0 = WDT is turned off If WDTE<1:0> = 1x: This bit is ignored. Times are approximate. WDT time is based on 31 kHz LFINTOSC. 2011 Microchip Technology Inc. Preliminary DS41615A-page 81 PIC12(L)F1501 TABLE 9-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Name Bit 7 OSCCON Bit 6 -- PCON Bit 5 Bit 4 Bit 3 IRCF<3:0> STKUNF -- RWDT STATUS -- -- -- TO WDTCON -- -- CONFIG1 Legend: Bit 0 SCS<1:0> RMCLR RI POR PD Z DC WDTPS<4:0> Register on Page 51 BOR 59 C 18 SWDTEN 81 x = unknown, u = unchanged, - = unimplemented locations read as `0'. Shaded cells are not used by Watchdog Timer. TABLE 9-4: Name Bit 1 -- STKOVF Legend: Bit 2 SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 -- -- -- -- CLKOUTEN 7:0 CP MCLRE PWRTE WDTE<1:0> Bit 10/2 Bit 9/1 BOREN<1:0> -- Bit 8/0 -- FOSC<1:0> Register on Page 40 -- = unimplemented location, read as `0'. Shaded cells are not used by Watchdog Timer. DS41615A-page 82 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 10.0 FLASH PROGRAM MEMORY CONTROL The Flash program memory is readable and writable during normal operation over the full VDD range. Program memory is indirectly addressed using Special Function Registers (SFRs). The SFRs used to access program memory are: * * * * * * PMCON1 PMCON2 PMDATL PMDATH PMADRL PMADRH Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set, in software. They are cleared by hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental, premature termination of a write operation. The WREN bit, when set, will allow a write operation to occur. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit and execute the appropriate error handling routine. The PMCON2 register is a write-only register. Attempting to read the PMCON2 register will return all `0's. When accessing the program memory, the PMDATH:PMDATL register pair forms a 2-byte word that holds the 14-bit data for read/write, and the PMADRH:PMADRL register pair forms a 2-byte word that holds the 15-bit address of the program memory location being read. The write time is controlled by an on-chip timer. The write/ erase voltages are generated by an on-chip charge pump. The Flash program memory can be protected in two ways; by code protection (CP bit in Configuration Words) and write protection (WRT<1:0> bits in Configuration Words). 0)(1), disables access, reading Code protection (CP = and writing, to the Flash program memory via external device programmers. Code protection does not affect the self-write and erase functionality. Code protection can only be reset by a device programmer performing a Bulk Erase to the device, clearing all Flash program memory, Configuration bits and User IDs. To enable writes to the program memory, a specific pattern (the unlock sequence), must be written to the PMCON2 register. The required unlock sequence prevents inadvertent writes to the program memory write latches and Flash program memory. 10.2 It is important to understand the Flash program memory structure for erase and programming operations. Flash program memory is arranged in rows. A row consists of a fixed number of 14-bit program memory words. A row is the minimum size that can be erased by user software. After a row has been erased, the user can reprogram all or a portion of this row. Data to be written into the program memory row is written to 14-bit wide data write latches. These write latches are not directly accessible to the user, but may be loaded via sequential writes to the PMDATH:PMDATL register pair. Note: Write protection prohibits self-write and erase to a portion or all of the Flash program memory as defined by the bits WRT<1:0>. Write protection does not affect a device programmers ability to read, write or erase the device. Note 1: Code protection of the entire Flash program memory array is enabled by clearing the CP bit of Configuration Words. 10.1 PMADRL and PMADRH Registers The PMADRH:PMADRL register pair can address up to a maximum of 16K words of program memory. When selecting a program address value, the MSB of the address is written to the PMADRH register and the LSB is written to the PMADRL register. 10.1.1 If the user wants to modify only a portion of a previously programmed row, then the contents of the entire row must be read and saved in RAM prior to the erase. Then, new data and retained data can be written into the write latches to reprogram the row of Flash program memory. However, any unprogrammed locations can be written without first erasing the row. In this case, it is not necessary to save and rewrite the other previously programmed locations. See Table 10-1 for Erase Row size and the number of write latches for Flash program memory. TABLE 10-1: Device PMCON1 AND PMCON2 REGISTERS PMCON1 is the control register for Flash program memory accesses. 2011 Microchip Technology Inc. Flash Program Memory Overview PIC12F1501 PIC12LF1501 Preliminary FLASH MEMORY ORGANIZATION BY DEVICE Row Erase (words) Write Latches (words) 16 16 DS41615A-page 83 PIC12(L)F1501 10.2.1 READING THE FLASH PROGRAM MEMORY FIGURE 10-1: To read a program memory location, the user must: 1. 2. 3. Write the desired address to the PMADRH:PMADRL register pair. Clear the CFGS bit of the PMCON1 register. Then, set control bit RD of the PMCON1 register. Once the read control bit is set, the program memory Flash controller will use the second instruction cycle to read the data. This causes the second instruction immediately following the "BSF PMCON1,RD" instruction to be ignored. The data is available in the very next cycle, in the PMDATH:PMDATL register pair; therefore, it can be read as two bytes in the following instructions. PMDATH:PMDATL register pair will hold this value until another read or until it is written to by the user. Note: The two instructions following a program memory read are required to be NOPs. This prevents the user from executing a two-cycle instruction on the next instruction after the RD bit is set. FLASH PROGRAM MEMORY READ FLOWCHART Start Read Operation Select Program or Configuration Memory (CFGS) Select Word Address (PMADRH:PMADRL) Initiate Read operation (RD = 1) Instruction Fetched ignored NOP execution forced Instruction Fetched ignored NOP execution forced Data read now in PMDATH:PMDATL End Read Operation DS41615A-page 84 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 10-2: FLASH PROGRAM MEMORY READ CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC Flash ADDR Flash Data PC + 1 INSTR (PC) INSTR(PC - 1) executed here PC +3 PC+3 PMADRH,PMADRL INSTR (PC + 1) BSF PMCON1,RD executed here PMDATH,PMDATL INSTR(PC + 1) instruction ignored Forced NOP executed here PC + 4 INSTR (PC + 3) INSTR(PC + 2) instruction ignored Forced NOP executed here PC + 5 INSTR (PC + 4) INSTR(PC + 3) executed here INSTR(PC + 4) executed here RD bit PMDATH PMDATL Register EXAMPLE 10-1: FLASH PROGRAM MEMORY READ * This code block will read 1 word of program * memory at the memory address: PROG_ADDR_HI: PROG_ADDR_LO * data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL MOVLW MOVWF MOVLW MOVWF PMADRL PROG_ADDR_LO PMADRL PROG_ADDR_HI PMADRH ; Select Bank for PMCON registers ; ; Store LSB of address ; ; Store MSB of address BCF BSF NOP NOP PMCON1,CFGS PMCON1,RD ; ; ; ; Do not select Configuration Space Initiate read Ignored (Figure 10-2) Ignored (Figure 10-2) MOVF MOVWF MOVF MOVWF PMDATL,W PROG_DATA_LO PMDATH,W PROG_DATA_HI ; ; ; ; Get LSB of word Store in user location Get MSB of word Store in user location 2011 Microchip Technology Inc. Preliminary DS41615A-page 85 PIC12(L)F1501 10.2.2 FLASH MEMORY UNLOCK SEQUENCE FIGURE 10-3: The unlock sequence is a mechanism that protects the Flash program memory from unintended self-write programming or erasing. The sequence must be executed and completed without interruption to successfully complete any of the following operations: * Row Erase * Load program memory write latches * Write of program memory write latches to program memory * Write of program memory write latches to User IDs FLASH PROGRAM MEMORY UNLOCK SEQUENCE FLOWCHART Start Unlock Sequence Write 055h to PMCON2 The unlock sequence consists of the following steps: Write 0AAh to PMCON2 1. Write 55h to PMCON2 Initiate Write or Erase operation (WR = 1) 2. Write AAh to PMCON2 3. Set the WR bit in PMCON1 4. NOP instruction 5. NOP instruction Once the WR bit is set, the processor will always force two NOP instructions. When an Erase Row or Program Row operation is being performed, the processor will stall internal operations (typical 2 ms), until the operation is complete and then resume with the next instruction. When the operation is loading the program memory write latches, the processor will always force the two NOP instructions and continue uninterrupted with the next instruction. Instruction Fetched ignored NOP execution forced Instruction Fetched ignored NOP execution forced End Unlock Sequence Since the unlock sequence must not be interrupted, global interrupts should be disabled prior to the unlock sequence and re-enabled after the unlock sequence is completed. DS41615A-page 86 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 10.2.3 ERASING FLASH PROGRAM MEMORY FIGURE 10-4: While executing code, program memory can only be erased by rows. To erase a row: 1. 2. 3. 4. 5. Load the PMADRH:PMADRL register pair with any address within the row to be erased. Clear the CFGS bit of the PMCON1 register. Set the FREE and WREN bits of the PMCON1 register. Write 55h, then AAh, to PMCON2 (Flash programming unlock sequence). Set control bit WR of the PMCON1 register to begin the erase operation. See Example 10-2. After the "BSF PMCON1,WR" instruction, the processor requires two cycles to set up the erase operation. The user must place two NOP instructions after the WR bit is set. The processor will halt internal operations for the typical 2 ms erase time. This is not Sleep mode as the clocks and peripherals will continue to run. After the erase cycle, the processor will resume operation with the third instruction after the PMCON1 write instruction. FLASH PROGRAM MEMORY ERASE FLOWCHART Start Erase Operation Disable Interrupts (GIE = 0) Select Program or Configuration Memory (CFGS) Select Row Address (PMADRH:PMADRL) Select Erase Operation (FREE = 1) Enable Write/Erase Operation (WREN = 1) Unlock Sequence Figure 10-3 (FIGURE x-x) CPU stalls while Erase operation completes (2ms typical) Disable Write/Erase Operation (WREN = 0) Re-enable Interrupts (GIE = 1) End Erase Operation 2011 Microchip Technology Inc. Preliminary DS41615A-page 87 PIC12(L)F1501 EXAMPLE 10-2: ERASING ONE ROW OF PROGRAM MEMORY Required Sequence ; This row erase routine assumes the following: ; 1. A valid address within the erase row is loaded in ADDRH:ADDRL ; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF BANKSEL MOVF MOVWF MOVF MOVWF BCF BSF BSF INTCON,GIE PMADRL ADDRL,W PMADRL ADDRH,W PMADRH PMCON1,CFGS PMCON1,FREE PMCON1,WREN MOVLW MOVWF MOVLW MOVWF BSF NOP NOP 55h PMCON2 0AAh PMCON2 PMCON1,WR BCF BSF DS41615A-page 88 PMCON1,WREN INTCON,GIE ; Disable ints so required sequences will execute properly ; Load lower 8 bits of erase address boundary ; Load upper 6 bits of erase address boundary ; Not configuration space ; Specify an erase operation ; Enable writes ; ; ; ; ; ; ; ; ; ; Start of required sequence to initiate erase Write 55h Write AAh Set WR bit to begin erase NOP instructions are forced as processor starts row erase of program memory. The processor stalls until the erase process is complete after erase processor continues with 3rd instruction ; Disable writes ; Enable interrupts Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 10.2.4 WRITING TO FLASH PROGRAM MEMORY Program memory is programmed using the following steps: 1. 2. 3. 4. Load the address in PMADRH:PMADRL of the row to be programmed. Load each write latch with data. Initiate a programming operation. Repeat steps 1 through 3 until all data is written. The following steps should be completed to load the write latches and program a row of program memory. These steps are divided into two parts. First, each write latch is loaded with data from the PMDATH:PMDATL using the unlock sequence with LWLO = 1. When the last word to be loaded into the write latch is ready, the LWLO bit is cleared and the unlock sequence executed. This initiates the programming operation, writing all the latches into Flash program memory. Note: Before writing to program memory, the word(s) to be written must be erased or previously unwritten. Program memory can only be erased one row at a time. No automatic erase occurs upon the initiation of the write. Program memory can be written one or more words at a time. The maximum number of words written at one time is equal to the number of write latches. See Figure 10-5 (row writes to program memory with 16 write latches) for more details. The write latches are aligned to the Flash row address boundary defined by the upper 11-bits of PMADRH:PMADRL, (PMADRH<6:0>:PMADRL<7:4>) with the lower 4-bits of PMADRL, (PMADRL<3:0>) determining the write latch being loaded. Write operations do not cross these boundaries. At the completion of a program memory write operation, the data in the write latches is reset to contain 0x3FFF. The special unlock sequence is required to load a write latch with data or initiate a Flash programming operation. If the unlock sequence is interrupted, writing to the latches or program memory will not be initiated. 1. 2. 3. Set the WREN bit of the PMCON1 register. Clear the CFGS bit of the PMCON1 register. Set the LWLO bit of the PMCON1 register. When the LWLO bit of the PMCON1 register is `1', the write sequence will only load the write latches and will not initiate the write to Flash program memory. 4. Load the PMADRH:PMADRL register pair with the address of the location to be written. 5. Load the PMDATH:PMDATL register pair with the program memory data to be written. 6. Execute the unlock sequence (Section 10.2.2 "Flash Memory Unlock Sequence"). The write latch is now loaded. 7. Increment the PMADRH:PMADRL register pair to point to the next location. 8. Repeat steps 5 through 7 until all but the last write latch has been loaded. 9. Clear the LWLO bit of the PMCON1 register. When the LWLO bit of the PMCON1 register is `0', the write sequence will initiate the write to Flash program memory. 10. Load the PMDATH:PMDATL register pair with the program memory data to be written. 11. Execute the unlock sequence (Section 10.2.2 "Flash Memory Unlock Sequence"). The entire program memory latch content is now written to Flash program memory. Note: The program memory write latches are reset to the blank state (0x3FFF) at the completion of every write or erase operation. As a result, it is not necessary to load all the program memory write latches. Unloaded latches will remain in the blank state. An example of the complete write sequence is shown in Example 10-3. The initial address is loaded into the PMADRH:PMADRL register pair; the data is loaded using indirect addressing. 2011 Microchip Technology Inc. Preliminary DS41615A-page 89 6 r10 7 - r9 FIGURE 10-5: r8 r7 r6 PMADRH DS41615A-page 90 11 r4 r3 r2 PMADRH<6:0> :PMADRL<7:4> r5 0 7 r1 c3 Preliminary c0 CFGS = 0 PMADRL<4:0> 4 c1 0 CFGS = 1 c2 PMADRL Row Address Decode r0 5 4 0000h 0010h 0020h 7FE0h 000h 001h 002h 7FEh 800h PMDATH 6 8004h - 8005h reserved USER ID 0 - 3 7FF1h 7FE1h 0021h 0011h 0001h Addr 14 Write Latch #1 01h 14 8000h - 8003h 7FF0h Addr 14 Write Latch #0 00h 14 Row 7FFh - 5 0 14 7 14 0 Configuration Words Configuration Memory 8007h - 8008h 8006h DEVICEID REVID 7FFEh 7FEEh 002Eh 001Eh 000Eh Addr 14 14 7FFFh 7FEFh 002Fh 001Fh 001Fh Addr 14 Write Latch #15 0Fh reserved 8009h - 801Fh Write Latch #14 0Eh PMDATL 8 Flash Program Memory Program Memory Write Latches - 7 BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 16 WRITE LATCHES PIC12(L)F1501 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 10-6: FLASH PROGRAM MEMORY WRITE FLOWCHART Start Write Operation Determine number of words to be written into Program or Configuration Memory. The number of words cannot exceed the number of words per row. (word_cnt) Disable Interrupts (GIE = 0) Select Program or Config. Memory (CFGS) Select Row Address (PMADRH:PMADRL) Enable Write/Erase Operation (WREN = 1) Load the value to write (PMDATH:PMDATL) Update the word counter (word_cnt--) Last word to write ? Yes No Unlock Sequence (Figure10-3 x-x) Figure Select Write Operation (FREE = 0) No delay when writing to Program Memory Latches Load Write Latches Only (LWLO = 1) Increment Address (PMADRH:PMADRL++) Write Latches to Flash (LWLO = 0) Unlock Sequence (Figure10-3 x-x) Figure CPU stalls while Write operation completes (2ms typical) Disable Write/Erase Operation (WREN = 0) Re-enable Interrupts (GIE = 1) End Write Operation 2011 Microchip Technology Inc. Preliminary DS41615A-page 91 PIC12(L)F1501 EXAMPLE 10-3: ; ; ; ; ; ; ; WRITING TO FLASH PROGRAM MEMORY This write routine assumes the following: 1. 32 bytes of data are loaded, starting at the address in DATA_ADDR 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR, stored in little endian format 3. A valid starting address (the least significant bits = 00000) is loaded in ADDRH:ADDRL 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF BANKSEL MOVF MOVWF MOVF MOVWF MOVLW MOVWF MOVLW MOVWF BCF BSF BSF INTCON,GIE PMADRH ADDRH,W PMADRH ADDRL,W PMADRL LOW DATA_ADDR FSR0L HIGH DATA_ADDR FSR0H PMCON1,CFGS PMCON1,WREN PMCON1,LWLO ; ; ; ; ; ; ; ; ; ; ; ; ; Disable ints so required sequences will execute properly Bank 3 Load initial address MOVIW MOVWF MOVIW MOVWF FSR0++ PMDATL FSR0++ PMDATH ; Load first data byte into lower ; ; Load second data byte into upper ; MOVF XORLW ANDLW BTFSC GOTO PMADRL,W 0x0F 0x0F STATUS,Z START_WRITE ; Check if lower bits of address are '00000' ; Check if we're on the last of 16 addresses ; ; Exit if last of 16 words, ; MOVLW MOVWF MOVLW MOVWF BSF NOP 55h PMCON2 0AAh PMCON2 PMCON1,WR ; ; ; ; ; ; ; ; PMADRL,F LOOP ; Still loading latches Increment address ; Write next latches PMCON1,LWLO ; No more loading latches - Actually start Flash program ; memory write 55h PMCON2 0AAh PMCON2 PMCON1,WR ; ; ; ; ; ; ; ; ; ; ; ; ; Load initial data address Load initial data address Not configuration space Enable writes Only Load Write Latches Required Sequence LOOP NOP INCF GOTO Required Sequence START_WRITE BCF MOVLW MOVWF MOVLW MOVWF BSF NOP NOP BCF BSF DS41615A-page 92 PMCON1,WREN INTCON,GIE Start of required write sequence: Write 55h Write AAh Set WR bit to begin write NOP instructions are forced as processor loads program memory write latches Start of required write sequence: Write 55h Write AAh Set WR bit to begin write NOP instructions are forced as processor writes all the program memory write latches simultaneously to program memory. After NOPs, the processor stalls until the self-write process in complete after write processor continues with 3rd instruction Disable writes Enable interrupts Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 10.3 Modifying Flash Program Memory FIGURE 10-7: When modifying existing data in a program memory row, and data within that row must be preserved, it must first be read and saved in a RAM image. Program memory is modified using the following steps: 1. 2. 3. 4. 5. 6. 7. Load the starting address of the row to be modified. Read the existing data from the row into a RAM image. Modify the RAM image to contain the new data to be written into program memory. Load the starting address of the row to be rewritten. Erase the program memory row. Load the write latches with data from the RAM image. Initiate a programming operation. FLASH PROGRAM MEMORY MODIFY FLOWCHART Start Modify Operation Read Operation (Figure10-2 x.x) Figure An image of the entire row read must be stored in RAM Modify Image The words to be modified are changed in the RAM image Erase Operation (Figure10-4 x.x) Figure Write Operation use RAM image (Figure10-5 x.x) Figure End Modify Operation 2011 Microchip Technology Inc. Preliminary DS41615A-page 93 PIC12(L)F1501 10.4 User ID, Device ID and Configuration Word Access Instead of accessing program memory, the User ID's, Device ID/Revision ID and Configuration Words can be accessed when CFGS = 1 in the PMCON1 register. This is the region that would be pointed to by PC<15> = 1, but not all addresses are accessible. Different access may exist for reads and writes. Refer to Table 10-2. When read access is initiated on an address outside the parameters listed in Table 10-2, the PMDATH:PMDATL register pair is cleared, reading back `0's. TABLE 10-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS = 1) Address Function 8000h-8003h 8006h 8007h-8008h Read Access Write Access Yes Yes Yes Yes No No User IDs Device ID/Revision ID Configuration Words 1 and 2 EXAMPLE 10-4: CONFIGURATION WORD AND DEVICE ID ACCESS * This code block will read 1 word of program memory at the memory address: * PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL MOVLW MOVWF CLRF PMADRL PROG_ADDR_LO PMADRL PMADRH ; Select correct Bank ; ; Store LSB of address ; Clear MSB of address BSF BCF BSF NOP NOP BSF PMCON1,CFGS INTCON,GIE PMCON1,RD INTCON,GIE ; ; ; ; ; ; Select Configuration Space Disable interrupts Initiate read Executed (See Figure 10-2) Ignored (See Figure 10-2) Restore interrupts MOVF MOVWF MOVF MOVWF PMDATL,W PROG_DATA_LO PMDATH,W PROG_DATA_HI ; ; ; ; Get LSB of word Store in user location Get MSB of word Store in user location DS41615A-page 94 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 10.5 Write Verify It is considered good programming practice to verify that program memory writes agree with the intended value. Since program memory is stored as a full page then the stored program memory contents are compared with the intended data stored in RAM after the last write is complete. FIGURE 10-8: FLASH PROGRAM MEMORY VERIFY FLOWCHART Start Verify Operation This routine assumes that the last row of data written was from an image saved in RAM. This image will be used to verify the data currently stored in Flash Program Memory. Read Operation (Figure x.x) Figure 10-2 PMDAT = RAM image ? Yes No No Fail Verify Operation Last Word ? Yes End Verify Operation 2011 Microchip Technology Inc. Preliminary DS41615A-page 95 PIC12(L)F1501 10.6 Flash Program Memory Control Registers REGISTER 10-1: R/W-x/u PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PMDAT<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-0 PMDAT<7:0>: Read/write value for Least Significant bits of program memory REGISTER 10-2: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER U-0 U-0 -- -- R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PMDAT<13:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-0 PMDAT<13:8>: Read/write value for Most Significant bits of program memory REGISTER 10-3: R/W-0/0 PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PMADR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-0 PMADR<7:0>: Specifies the Least Significant bits for program memory address REGISTER 10-4: U-1 PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER R/W-0/0 R/W-0/0 -- R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PMADR<14:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 Unimplemented: Read as `1' bit 6-0 PMADR<14:8>: Specifies the Most Significant bits for program memory address DS41615A-page 96 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 10-5: PMCON1: PROGRAM MEMORY CONTROL 1 REGISTER U-1(1) R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W/HC-x/q(2) R/W-0/0 R/S/HC-0/0 R/S/HC-0/0 -- CFGS LWLO FREE WRERR WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared HC = Bit is cleared by hardware bit 7 Unimplemented: Read as `1' bit 6 CFGS: Configuration Select bit 1 = Access Configuration, User ID and Device ID Registers 0 = Access Flash program memory bit 5 LWLO: Load Write Latches Only bit(3) 1 = Only the addressed program memory write latch is loaded/updated on the next WR command 0 = The addressed program memory write latch is loaded/updated and a write of all program memory write latches will be initiated on the next WR command bit 4 FREE: Program Flash Erase Enable bit 1 = Performs an erase operation on the next WR command (hardware cleared upon completion) 0 = Performs an write operation on the next WR command bit 3 WRERR: Program/Erase Error Flag bit 1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set automatically on any set attempt (write `1') of the WR bit). 0 = The program or erase operation completed normally bit 2 WREN: Program/Erase Enable bit 1 = Allows program/erase cycles 0 = Inhibits programming/erasing of program Flash bit 1 WR: Write Control bit 1 = Initiates a program Flash program/erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete. The WR bit can only be set (not cleared) in software. 0 = Program/erase operation to the Flash is complete and inactive bit 0 RD: Read Control bit 1 = Initiates a program Flash read. Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. 0 = Does not initiate a program Flash read Note 1: 2: 3: Unimplemented bit, read as `1'. The WRERR bit is automatically set by hardware when a program memory write or erase operation is started (WR = 1). The LWLO bit is ignored during a program memory erase operation (FREE = 1). 2011 Microchip Technology Inc. Preliminary DS41615A-page 97 PIC12(L)F1501 REGISTER 10-6: W-0/0 PMCON2: PROGRAM MEMORY CONTROL 2 REGISTER W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 Program Memory Control Register 2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-0 Flash Memory Unlock Pattern bits To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the PMCON1 register. The value written to this register is used to unlock the writes. There are specific timing requirements on these writes. TABLE 10-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH FLASH PROGRAM MEMORY Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page -- CFGS LWLO FREE WRERR WREN WR RD 97 PMCON1 PMCON2 Program Memory Control Register 2 98 PMADRL PMADRL<7:0> 96 -- PMADRH PMADRH<6:0> PMDATL PMDATH -- -- INTCON GIE PEIE Legend: CONFIG1 CONFIG2 Legend: 96 PMDATH<5:0> TMR0IE INTE IOCIE 96 TMR0IF INTF IOCIF 66 -- = unimplemented location, read as `0'. Shaded cells are not used by Flash program memory module. TABLE 10-4: Name 96 PMDATL<7:0> Bits SUMMARY OF CONFIGURATION WORD WITH FLASH PROGRAM MEMORY Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 -- CLKOUTEN Bit 10/2 13:8 -- -- -- 7:0 CP MCLRE PWRTE 13:8 -- -- LVP -- LPBOR BORV 7:0 -- -- -- -- -- -- WDTE<1:0> Bit 9/1 Bit 8/0 BOREN<1:0> -- -- FOSC<1:0> STVREN WRT<1:0> -- Register on Page 40 41 -- = unimplemented location, read as `0'. Shaded cells are not used by Flash program memory. DS41615A-page 98 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 11.0 I/O PORTS FIGURE 11-1: GENERIC I/O PORT OPERATION Each port has three standard registers for its operation. These registers are: * TRISx registers (data direction) * PORTx registers (reads the levels on the pins of the device) * LATx registers (output latch) Read LATx D Some ports may have one or more of the following additional registers. These registers are: Write LATx Write PORTx * ANSELx (analog select) * WPUx (weak pull-up) CK VDD Data Bus I/O pin Read PORTx To peripherals ANSELx Device PORTA PORT AVAILABILITY PER DEVICE PIC12(L)F1501 EXAMPLE 11-1: ; ; ; ; The Data Latch (LATx registers) is useful for read-modify-write operations on the value that the I/O pins are driving. A write operation to the LATx register has the same effect as a write to the corresponding PORTx register. A read of the LATx register reads of the values held in the I/O PORT latches, while a read of the PORTx register reads the actual I/O pin value. Ports that support analog inputs have an associated ANSELx register. When an ANSEL bit is set, the digital input buffer associated with that bit is disabled. Disabling the input buffer prevents analog signal levels on the pin between a logic high and low from causing excessive current in the logic input circuitry. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 11-1. 2011 Microchip Technology Inc. Q Data Register In general, when a peripheral is enabled on a port pin, that pin cannot be used as a general purpose output. However, the pin can still be read. TABLE 11-1: TRISx VSS INITIALIZING PORTA This code example illustrates initializing the PORTA register. The other ports are initialized in the same manner. BANKSEL CLRF BANKSEL CLRF BANKSEL CLRF BANKSEL MOVLW MOVWF Preliminary PORTA PORTA LATA LATA ANSELA ANSELA TRISA B'00111000' TRISA ; ;Init PORTA ;Data Latch ; ; ;digital I/O ; ;Set RA<5:3> as inputs ;and set RA<2:0> as ;outputs DS41615A-page 99 PIC12(L)F1501 11.1 Alternate Pin Function The Alternate Pin Function Control (APFCON) register is used to steer specific peripheral input and output functions between different pins. The APFCON register is shown in Register 11-1. For this device family, the following functions can be moved between different pins. * * * * * These bits have no effect on the values of any TRIS register. PORT and TRIS overrides will be routed to the correct pin. The unselected pin will be unaffected. SDO SS T1G CLC1 NCO1 REGISTER 11-1: APFCON: ALTERNATE PIN FUNCTION CONTROL REGISTER R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 CWG1BSEL CWG1ASEL -- -- T1GSEL -- CLC1SEL NCO1SEL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 CWG1BSEL: Pin Selection bit 1 = CWG1B function is on RA4 0 = CWG1B function is on RA0 bit 6 CWG1ASEL: Pin Selection bit 1 = CWG1A function is on RA5 0 = CWG1A function is on RA2 bit 5-4 Unimplemented: Read as `0' bit 3 T1GSEL: Pin Selection bit 1 = T1G function is on RA3 0 = T1G function is on RA4 bit 2 Unimplemented: Read as `0' bit 1 CLC1SEL: Pin Selection bit 1 = CLC1 function is on RA4 0 = CLC1 function is on RA2 bit 0 NCO1SEL: Pin Selection bit 1 = NCO1 function is on RA5 0 = NCO1 function is on RA1 DS41615A-page 100 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 11.2 PORTA Registers 11.2.2 PORTA is a 6-bit wide, bidirectional port. The corresponding data direction register is TRISA (Register 11-3). Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input (i.e., disable the output driver). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., enables output driver and puts the contents of the output latch on the selected pin). The exception is RA3, which is input only and its TRIS bit will always read as `1'. Example 11-1 shows how to initialize an I/O port. Reading the PORTA register (Register 11-2) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATA). Each PORTA pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 11-2. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input functions, such as ADC and comparator inputs, are not shown in the priority lists. These inputs are active when the I/O pin is set for Analog mode using the ANSELx registers. Digital output functions may control the pin when it is in Analog mode with the priority shown in Table 11-2. TABLE 11-2: Function Priority(1) RA0 ICSPDAT DACOUT1 CWG1B(2) PWM2 RA0 RA1 NCO1(2) RA1 RA2 DACOUT2 CWG1A(2) CWG1FLT CLC1(2) C1OUT PWM1 RA2 RA3 None RA4 CLKOUT CWG1B(3) CLC1(3) PWM3 RA4 RA5 CWG1A(3) CLC2 NCO1(3) PWM4 RA5 ANSELA REGISTER The ANSELA register (Register 11-5) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELA bit high will cause all digital reads on the pin to be read as `0' and allow analog functions on the pin to operate correctly. The state of the ANSELA bits has no effect on digital output functions. A pin with TRIS clear and ANSEL set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: The ANSELA bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to `0' by user software. 2011 Microchip Technology Inc. Note 1: 2: 3: Preliminary PORTA OUTPUT PRIORITY Pin Name The TRISA register (Register 11-3) controls the PORTA pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISA register are maintained set when using them as analog inputs. I/O pins configured as analog input always read `0'. 11.2.1 PORTA FUNCTIONS AND OUTPUT PRIORITIES Priority listed from highest to lowest. Default pin (see APFCON register). Alternate pin (see APFCON register). DS41615A-page 101 PIC12(L)F1501 REGISTER 11-2: PORTA: PORTA REGISTER U-0 U-0 R/W-x/x R/W-x/x R-x/x R/W-x/x R/W-x/x R/W-x/x -- -- RA5 RA4 RA3 RA2 RA1 RA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-0 RA<5:0>: PORTA I/O Value bits(1) 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values. REGISTER 11-3: TRISA: PORTA TRI-STATE REGISTER U-0 U-0 R/W-1/1 R/W-1/1 U-1 R/W-1/1 R/W-1/1 R/W-1/1 -- -- TRISA5 TRISA4 --(1) TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-4 TRISA<5:4>: PORTA Tri-State Control bit 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output bit 3 Unimplemented: Read as `1' bit 2-0 TRISA<2:0>: PORTA Tri-State Control bit 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output Note 1: Unimplemented, read as `1'. DS41615A-page 102 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 11-4: LATA: PORTA DATA LATCH REGISTER U-0 U-0 R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u -- -- LATA5 LATA4 -- LATA2 LATA1 LATA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-4 LATA<5:4>: RA<5:4> Output Latch Value bits(1) bit 3 Unimplemented: Read as `0' bit 2-0 LATA<2:0>: RA<2:0> Output Latch Value bits(1) Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values. REGISTER 11-5: ANSELA: PORTA ANALOG SELECT REGISTER U-0 U-0 U-0 R/W-1/1 U-0 R/W-1/1 R/W-1/1 R/W-1/1 -- -- -- ANSA4 -- ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-5 Unimplemented: Read as `0' bit 4 ANSA4: Analog Select between Analog or Digital Function on pins RA4, respectively 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. 0 = Digital I/O. Pin is assigned to port or digital special function. bit 3 Unimplemented: Read as `0' bit 2-0 ANSA<2:0>: Analog Select between Analog or Digital Function on pins RA<2:0>, respectively 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. 0 = Digital I/O. Pin is assigned to port or digital special function. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. 2011 Microchip Technology Inc. Preliminary DS41615A-page 103 PIC12(L)F1501 REGISTER 11-6: WPUA: WEAK PULL-UP PORTA REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 -- -- WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-0 WPUA<5:0>: Weak Pull-up Register bits(3) 1 = Pull-up enabled 0 = Pull-up disabled Note 1: 2: 3: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. The weak pull-up device is automatically disabled if the pin is in configured as an output. For the WPUA3 bit, when MCLRE = 1, weak pull-up is internally enabled, but not reported here. TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Name Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSA4 -- ANSA2 ANSA1 ANSA0 103 -- CLC1SEL NCO1SEL 100 LATA2 LATA1 LATA0 103 Bit 7 Bit 6 Bit 5 Bit 4 -- -- -- ANSELA CWG1BSEL CWG1ASEL -- -- T1GSEL -- -- LATA5 LATA4 -- WPUEN INTEDG TMR0CS TMR0SE PSA PORTA -- -- RA5 RA4 RA3 RA2 RA1 RA0 102 TRISA -- -- TRISA5 TRISA4 --(1) TRISA2 TRISA1 TRISA0 102 -- -- WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 104 APFCON LATA OPTION_REG WPUA Legend: Note 1: CONFIG1 Legend: 143 x = unknown, u = unchanged, - = unimplemented locations read as `0'. Shaded cells are not used by PORTA. Unimplemented, read as `1'. TABLE 11-4: Name PS<2:0> SUMMARY OF CONFIGURATION WORD WITH PORTA Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 -- CLKOUTEN 13:8 -- -- -- 7:0 CP MCLRE PWRTE Bit 10/2 WDTE<1:0> Bit 9/1 BOREN<1:0> -- Bit 8/0 -- FOSC<1:0> Register on Page 40 -- = unimplemented location, read as `0'. Shaded cells are not used by PORTA. DS41615A-page 104 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 12.0 INTERRUPT-ON-CHANGE 12.3 The PORTA and PORTB pins can be configured to operate as Interrupt-On-Change (IOC) pins. An interrupt can be generated by detecting a signal that has either a rising edge or a falling edge. Any individual port pin, or combination of port pins, can be configured to generate an interrupt. The interrupt-on-change module has the following features: * * * * Interrupt-on-Change enable (Master Switch) Individual pin configuration Rising and falling edge detection Individual pin interrupt flags The IOCAFx and IOCBFx bits located in the IOCAF and IOCBF registers, respectively, are status flags that correspond to the interrupt-on-change pins of the associated port. If an expected edge is detected on an appropriately enabled pin, then the status flag for that pin will be set, and an interrupt will be generated if the IOCIE bit is set. The IOCIF bit of the INTCON register reflects the status of all IOCAFx and IOCBFx bits. 12.4 Clearing Interrupt Flags The individual status flags, (IOCAFx and IOCBFx bits), can be cleared by resetting them to zero. If another edge is detected during this clearing operation, the associated status flag will be set at the end of the sequence, regardless of the value actually being written. Figure 12-1 is a block diagram of the IOC module. 12.1 Interrupt Flags Enabling the Module To allow individual port pins to generate an interrupt, the IOCIE bit of the INTCON register must be set. If the IOCIE bit is disabled, the edge detection on the pin will still occur, but an interrupt will not be generated. In order to ensure that no detected edge is lost while clearing flags, only AND operations masking out known changed bits should be performed. The following sequence is an example of what should be performed. 12.2 Individual Pin Configuration EXAMPLE 12-1: For each port pin, a rising edge detector and a falling edge detector are present. To enable a pin to detect a rising edge, the associated bit of the IOCxP register is set. To enable a pin to detect a falling edge, the associated bit of the IOCxN register is set. MOVLW XORWF ANDWF A pin can be configured to detect rising and falling edges simultaneously by setting both associated bits of the IOCxP and IOCxN registers, respectively. 12.5 CLEARING INTERRUPT FLAGS (PORTA EXAMPLE) 0xff IOCAF, W IOCAF, F Operation in Sleep The interrupt-on-change interrupt sequence will wake the device from Sleep mode, if the IOCIE bit is set. If an edge is detected while in Sleep mode, the IOCxF register will be updated prior to the first instruction executed out of Sleep. 2011 Microchip Technology Inc. Preliminary DS41615A-page 105 PIC12(L)F1501 FIGURE 12-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM (PORTA EXAMPLE) IOCANx D Q4Q1 Q CK Edge Detect R RAx IOCAPx D Data Bus = 0 or 1 Q Write IOCAFx CK D S Q To Data Bus IOCAFx CK IOCIE R Q2 From all other IOCAFx individual pin detectors Q1 Q2 Q3 Q4 Q4Q1 DS41615A-page 106 Q1 Q1 Q2 Q2 Q3 Q4 Q4Q1 IOC interrupt to CPU core Q3 Q4 Q4 Q4Q1 Preliminary Q4Q1 2011 Microchip Technology Inc. PIC12(L)F1501 12.6 Interrupt-On-Change Registers REGISTER 12-1: IOCAP: INTERRUPT-ON-CHANGE PORTA POSITIVE EDGE REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 -- -- IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-0 IOCAP<5:0>: Interrupt-on-Change PORTA Positive Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a positive going edge. IOCAFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 12-2: IOCAN: INTERRUPT-ON-CHANGE PORTA NEGATIVE EDGE REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 -- -- IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-0 IOCAN<5:0>: Interrupt-on-Change PORTA Negative Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a negative going edge. IOCAFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 12-3: IOCAF: INTERRUPT-ON-CHANGE PORTA FLAG REGISTER U-0 U-0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 -- -- IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared HS - Bit is set in hardware bit 7-6 Unimplemented: Read as `0' bit 5-0 IOCAF<5:0>: Interrupt-on-Change PORTA Flag bits 1 = An enabled change was detected on the associated pin. Set when IOCAPx = 1 and a rising edge was detected on RAx, or when IOCANx = 1 and a falling edge was detected on RAx. 0 = No change was detected, or the user cleared the detected change 2011 Microchip Technology Inc. Preliminary DS41615A-page 107 PIC12(L)F1501 TABLE 12-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA -- -- -- ANSA4 -- ANSA2 ANSA1 ANSA0 103 INTCON Name GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 66 IOCAF -- -- IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 107 IOCAN -- -- IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 107 IOCAP -- -- IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 107 TRISA4 --(1) TRISA2 TRISA1 TRISA0 102 -- TRISA Legend: Note 1: -- TRISA5 -- = unimplemented location, read as `0'. Shaded cells are not used by interrupt-on-change. Unimplemented, read as `1'. DS41615A-page 108 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 13.0 FIXED VOLTAGE REFERENCE (FVR) The Fixed Voltage Reference, or FVR, is a stable voltage reference, independent of VDD, with 1.024V, 2.048V or 4.096V selectable output levels. The output of the FVR can be configured to supply a reference voltage to the following: * ADC input channel * Comparator positive input * Comparator negative input The FVR can be enabled by setting the FVREN bit of the FVRCON register. 13.1 Independent Gain Amplifier The output of the FVR supplied to the ADC and comparators is routed through a programmable gain amplifier. Each amplifier can be programmed for a gain of 1x, 2x or 4x, to produce the three possible voltage levels. FIGURE 13-1: The ADFVR<1:0> bits of the FVRCON register are used to enable and configure the gain amplifier settings for the reference supplied to the ADC module. Reference Section 15.0 "Analog-to-Digital Converter (ADC) Module" for additional information. The CDAFVR<1:0> bits of the FVRCON register are used to enable and configure the gain amplifier settings for the reference supplied to the comparator modules. Reference Section 17.0 "Comparator Module" for additional information. 13.2 FVR Stabilization Period When the Fixed Voltage Reference module is enabled, it requires time for the reference and amplifier circuits to stabilize. Once the circuits stabilize and are ready for use, the FVRRDY bit of the FVRCON register will be set. See Section 27.0 "Electrical Specifications" for the minimum delay requirement. VOLTAGE REFERENCE BLOCK DIAGRAM ADFVR<1:0> CDAFVR<1:0> 2 X1 X2 X4 FVR BUFFER1 (To ADC Module) X1 X2 X4 FVR BUFFER2 (To Comparators) 2 FVREN + FVRRDY _ Any peripheral requiring the Fixed Reference (See Table 13-1) TABLE 13-1: Peripheral PERIPHERALS REQUIRING THE FIXED VOLTAGE REFERENCE (FVR) Conditions Description HFINTOSC FOSC<1:0> = 00 and IRCF<3:0> = 000x BOREN<1:0> = 11 BOR always enabled. BOR BOREN<1:0> = 10 and BORFS = 1 BOR disabled in Sleep mode, BOR Fast Start enabled. BOREN<1:0> = 01 and BORFS = 1 BOR under software control, BOR Fast Start enabled. LDO All PIC12F1501 devices, when VREGPM = 1 and not in Sleep The device runs off of the Low-Power Regulator when in Sleep mode. 2011 Microchip Technology Inc. INTOSC is active and device is not in Sleep. Preliminary DS41615A-page 109 PIC12(L)F1501 13.3 FVR Control Registers REGISTER 13-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER R/W-0/0 R-q/q R/W-0/0 R/W-0/0 FVREN FVRRDY(1) TSEN TSRNG R/W-0/0 R/W-0/0 R/W-0/0 CDAFVR<1:0> R/W-0/0 ADFVR<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared q = Value depends on condition bit 7 FVREN: Fixed Voltage Reference Enable bit 1 = Fixed Voltage Reference is enabled 0 = Fixed Voltage Reference is disabled bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(1) 1 = Fixed Voltage Reference output is ready for use 0 = Fixed Voltage Reference output is not ready or not enabled bit 5 TSEN: Temperature Indicator Enable bit(3) 1 = Temperature Indicator is enabled 0 = Temperature Indicator is disabled bit 4 TSRNG: Temperature Indicator Range Selection bit(3) 1 = VOUT = VDD - 4VT (High Range) 0 = VOUT = VDD - 2VT (Low Range) bit 3-2 CDAFVR<1:0>: Comparator Fixed Voltage Reference Selection bits 11 = Comparator Fixed Voltage Reference Peripheral output is 4x (4.096V)(2) 10 = Comparator Fixed Voltage Reference Peripheral output is 2x (2.048V)(2) 01 = Comparator Fixed Voltage Reference Peripheral output is 1x (1.024V) 00 = Comparator Fixed Voltage Reference Peripheral output is off bit 1-0 ADFVR<1:0>: ADC Fixed Voltage Reference Selection bit 11 = ADC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2) 10 = ADC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2) 01 = ADC Fixed Voltage Reference Peripheral output is 1x (1.024V) 00 = ADC Fixed Voltage Reference Peripheral output is off Note 1: 2: 3: FVRRDY is always `1' for the PIC12F1501 devices. Fixed Voltage Reference output cannot exceed VDD. See Section 14.0 "Temperature Indicator Module" for additional information. TABLE 13-2: Name FVRCON Legend: SUMMARY OF REGISTERS ASSOCIATED WITH THE FIXED VOLTAGE REFERENCE Bit 7 Bit 6 Bit 5 Bit 4 FVREN FVRRDY TSEN TSRNG Bit 3 Bit 2 CDAFVR>1:0> Bit 1 Bit 0 ADFVR<1:0> Register on page 110 Shaded cells are unused by the Fixed Voltage Reference module. DS41615A-page 110 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 14.0 TEMPERATURE INDICATOR MODULE FIGURE 14-1: This family of devices is equipped with a temperature circuit designed to measure the operating temperature of the silicon die. The circuit's range of operating temperature falls between -40C and +85C. The output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. TEMPERATURE CIRCUIT DIAGRAM VDD TSEN TSRNG The circuit may be used as a temperature threshold detector or a more accurate temperature indicator, depending on the level of calibration performed. A onepoint calibration allows the circuit to indicate a temperature closely surrounding that point. A two-point calibration allows the circuit to sense the entire range of temperature more accurately. Reference Application Note AN1333, "Use and Calibration of the Internal Temperature Indicator" (DS01333) for more details regarding the calibration process. 14.1 Circuit Operation 14.2 Figure 14-1 shows a simplified block diagram of the temperature circuit. The proportional voltage output is achieved by measuring the forward voltage drop across multiple silicon junctions. Equation 14-1 describes the output characteristics of the temperature indicator. EQUATION 14-1: VOUT VOUT RANGES To ADC Minimum Operating VDD When the temperature circuit is operated in low range, the device may be operated at any operating voltage that is within specifications. When the temperature circuit is operated in high range, the device operating voltage, VDD, must be high enough to ensure that the temperature circuit is correctly biased. Table 14-1 shows the recommended minimum VDD vs. range setting. High Range: VOUT = VDD - 4VT TABLE 14-1: Low Range: VOUT = VDD - 2VT The temperature sense circuit is integrated with the Fixed Voltage Reference (FVR) module. See Section 13.0 "Fixed Voltage Reference (FVR)" for more information. The circuit is enabled by setting the TSEN bit of the FVRCON register. When disabled, the circuit draws no current. The circuit operates in either high or low range. The high range, selected by setting the TSRNG bit of the FVRCON register, provides a wider output voltage. This provides more resolution over the temperature range, but may be less consistent from part to part. This range requires a higher bias voltage to operate and thus, a higher VDD is needed. The low range is selected by clearing the TSRNG bit of the FVRCON register. The low range generates a lower voltage drop and thus, a lower bias voltage is needed to operate the circuit. The low range is provided for low voltage operation. 2011 Microchip Technology Inc. RECOMMENDED VDD VS. RANGE Min. VDD, TSRNG = 1 Min. VDD, TSRNG = 0 3.6V 1.8V 14.3 Temperature Output The output of the circuit is measured using the internal Analog-to-Digital Converter. A channel is reserved for the temperature circuit output. Refer to Section 15.0 "Analog-to-Digital Converter (ADC) Module" for detailed information. 14.4 ADC Acquisition Time To ensure accurate temperature measurements, the user must wait at least 200 s after the ADC input multiplexer is connected to the temperature indicator output before the conversion is performed. In addition, the user must wait 200 s between sequential conversions of the temperature indicator output. Preliminary DS41615A-page 111 PIC12(L)F1501 TABLE 14-2: Name FVRCON Legend: SUMMARY OF REGISTERS ASSOCIATED WITH THE TEMPERATURE INDICATOR Bit 7 Bit 6 Bit 5 Bit 4 FVREN FVRRDY TSEN TSRNG Bit 3 Bit 2 CDAFVR<1:0> Bit 1 Bit 0 ADFVR<1:0> Register on page 118 Shaded cells are unused by the temperature indicator module. DS41615A-page 112 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 15.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESH:ADRESL register pair). Figure 15-1 shows the block diagram of the ADC. The ADC voltage reference is software selectable to be either internally generated or externally supplied. FIGURE 15-1: ADC BLOCK DIAGRAM VDD ADPREF = 00 VREF+ AN0 00000 VREF+/AN1 00001 AN2 00010 AN3 Reserved 00011 00100 ADPREF = 10 VREF- = VSS VREF+ ADC 10 GO/DONE Reserved 11100 Temp Indicator 11101 DAC FVR Buffer1 11110 ADFM 0 = Left Justify 1 = Right Justify 16 ADON 11111 VSS ADRESH ADRESL CHS<4:0> Note 1: When ADON = 0, all multiplexer inputs are disconnected. 2011 Microchip Technology Inc. Preliminary DS41615A-page 113 PIC12(L)F1501 15.1 ADC Configuration 15.1.4 When configuring and using the ADC the following functions must be considered: * * * * * * Port configuration Channel selection ADC voltage reference selection ADC conversion clock source Interrupt control Result formatting 15.1.1 The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ANSEL bits. Refer to Section 11.0 "I/O Ports" for more information. Note: 15.1.2 The source of the conversion clock is software selectable via the ADCS bits of the ADCON1 register. There are seven possible clock options: * * * * * * * PORT CONFIGURATION Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. FOSC/2 FOSC/4 FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (dedicated internal oscillator) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11.5 TAD periods as shown in Figure 15-2. For correct conversion, the appropriate TAD specification must be met. Refer to the A/D conversion requirements in Section 27.0 "Electrical Specifications" for more information. Table 15-1 gives examples of appropriate ADC clock selections. Note: CHANNEL SELECTION There are 7 channel selections available: * * * * CONVERSION CLOCK AN<3:0> pins Temperature Indicator DAC FVR (Fixed Voltage Reference) Output Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. Refer to Section 13.0 "Fixed Voltage Reference (FVR)" and Section 14.0 "Temperature Indicator Module" for more information on these channel selections. The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section 15.2 "ADC Operation" for more information. 15.1.3 ADC VOLTAGE REFERENCE The ADPREF bits of the ADCON1 register provides control of the positive voltage reference. The positive voltage reference can be: * VREF+ pin * VDD See Section 13.0 "Fixed Voltage Reference (FVR)" for more details on the Fixed Voltage Reference. DS41615A-page 114 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 15-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES ADC Clock Period (TAD) Device Frequency (FOSC) ADC Clock Source ADCS<2:0> 20 MHz 16 MHz 8 MHz 4 MHz 1 MHz FOSC/2 000 100 ns(2) 125 ns(2) 250 ns(2) 500 ns(2) 2.0 s FOSC/4 100 (2) 200 ns (2) 250 ns (2) FOSC/8 001 400 ns(2) 0.5 s(2) FOSC/16 101 800 ns 1.0 s FOSC/32 1.6 s 010 2.0 s FOSC/64 110 3.2 s 4.0 s FRC x11 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) Legend: Note 1: 2: 3: 4: 1.0 s 4.0 s 1.0 s 2.0 s 8.0 s(3) 2.0 s 4.0 s 16.0 s(3) 500 ns 4.0 s (3) 8.0 s 1.0-6.0 s(1,4) (3) 8.0 s (3) 16.0 s 1.0-6.0 s(1,4) 32.0 s(3) 64.0 s(3) 1.0-6.0 s(1,4) Shaded cells are outside of recommended range. The FRC source has a typical TAD time of 1.6 s for VDD. These values violate the minimum required TAD time. For faster conversion times, the selection of another clock source is recommended. The ADC clock period (TAD) and total ADC conversion time can be minimized when the ADC clock is derived from the system clock FOSC. However, the FRC clock source must be used when conversions are to be performed with the device in Sleep mode. FIGURE 15-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES TCY - TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 b4 b1 b0 b6 b7 b2 b8 b3 b9 b5 Conversion starts Holding capacitor is disconnected from analog input (typically 100 ns) Set GO bit On the following cycle: ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. 2011 Microchip Technology Inc. Preliminary DS41615A-page 115 PIC12(L)F1501 15.1.5 INTERRUPTS 15.1.6 The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC Interrupt Flag is the ADIF bit in the PIR1 register. The ADC Interrupt Enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. RESULT FORMATTING The 10-bit A/D conversion result can be supplied in two formats, left justified or right justified. The ADFM bit of the ADCON1 register controls the output format. Figure 15-3 shows the two output formats. Note 1: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. 2: The ADC operates during Sleep only when the FRC oscillator is selected. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the GIE and PEIE bits of the INTCON register must be disabled. If the GIE and PEIE bits of the INTCON register are enabled, execution will switch to the Interrupt Service Routine. FIGURE 15-3: 10-BIT A/D CONVERSION RESULT FORMAT ADRESH (ADFM = 0) ADRESL MSB LSB bit 7 bit 0 bit 7 Unimplemented: Read as `0' 10-bit A/D Result (ADFM = 1) MSB bit 7 LSB bit 0 Unimplemented: Read as `0' DS41615A-page 116 bit 0 bit 7 bit 0 10-bit A/D Result Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 15.2 15.2.1 ADC Operation 15.2.4 STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a `1'. Setting the GO/ DONE bit of the ADCON0 register to a `1' will start the Analog-to-Digital conversion. Note: 15.2.2 The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 15.2.6 "A/D Conversion Procedure". COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: * Clear the GO/DONE bit * Set the ADIF Interrupt Flag bit * Update the ADRESH and ADRESL registers with new conversion result 15.2.3 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH and ADRESL registers will be updated with the partially complete Analog-to-Digital conversion sample. Incomplete bits will match the last bit converted. Note: A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. 2011 Microchip Technology Inc. ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. When the FRC clock source is selected, the ADC waits one additional instruction before starting the conversion. This allows the SLEEP instruction to be executed, which can reduce system noise during the conversion. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off, although the ADON bit remains set. 15.2.5 AUTO-CONVERSION TRIGGER The auto-conversion trigger allows periodic ADC measurements without software intervention. When a rising edge of the selected source occurs, the GO/DONE bit is set by hardware. The auto-conversion trigger source is selected with the TRIGSEL<3:0> bits of the ADCON2 register. Using the auto-conversion trigger does not assure proper ADC timing. It is the user's responsibility to ensure that the ADC timing requirements are met. Auto-conversion sources are: * * * * * * TMR0 TMR1 TMR2 C1 CLC1 CLC2 Preliminary DS41615A-page 117 PIC12(L)F1501 15.2.6 A/D CONVERSION PROCEDURE EXAMPLE 15-1: This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. 2. 3. 4. 5. 6. 7. 8. Configure Port: * Disable pin output driver (Refer to the TRIS register) * Configure pin as analog (Refer to the ANSEL register) Configure the ADC module: * Select ADC conversion clock * Configure voltage reference * Select ADC input channel * Turn on ADC module Configure ADC interrupt (optional): * Clear ADC interrupt flag * Enable ADC interrupt * Enable peripheral interrupt * Enable global interrupt(1) Wait the required acquisition time(2). Start conversion by setting the GO/DONE bit. Wait for ADC conversion to complete by one of the following: * Polling the GO/DONE bit * Waiting for the ADC interrupt (interrupts enabled) Read ADC Result. Clear the ADC interrupt flag (required if interrupt is enabled). A/D CONVERSION ;This code block configures the ADC ;for polling, Vdd and Vss references, Frc ;clock and AN0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSEL ADCON1 ; MOVLW B'11110000' ;Right justify, Frc ;clock MOVWF ADCON1 ;Vdd and Vss Vref+ BANKSEL TRISA ; BSF TRISA,0 ;Set RA0 to input BANKSEL ANSEL ; BSF ANSEL,0 ;Set RA0 to analog BANKSEL ADCON0 ; MOVLW B'00000001' ;Select channel AN0 MOVWF ADCON0 ;Turn ADC On CALL SampleTime ;Acquisiton delay BSF ADCON0,ADGO ;Start conversion BTFSC ADCON0,ADGO ;Is conversion done? GOTO $-1 ;No, test again BANKSEL ADRESH ; MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;store in GPR space BANKSEL ADRESL ; MOVF ADRESL,W ;Read lower 8 bits MOVWF RESULTLO ;Store in GPR space Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Refer to Section 15.3 "A/D Acquisition Requirements". DS41615A-page 118 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 15.2.7 ADC REGISTER DEFINITIONS The following registers are used to control the operation of the ADC. REGISTER 15-1: U-0 ADCON0: A/D CONTROL REGISTER 0 R/W-0/0 R/W-0/0 -- R/W-0/0 R/W-0/0 CHS<4:0> R/W-0/0 R/W-0/0 R/W-0/0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 Unimplemented: Read as `0' bit 6-2 CHS<4:0>: Analog Channel Select bits 00000 = AN0 00001 = AN1 00010 = AN2 00011 = AN3 00100 = Reserved. No channel connected. * * * 11100 = Reserved. No channel connected. 11101 = Temperature Indicator(1) 11110 = DAC (Digital-to-Analog Converter)(2) 11111 = FVR (Fixed Voltage Reference) Buffer 1 Output(3) bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: 2: 3: See Section 14.0 "Temperature Indicator Module" for more information. See Section 16.0 "Digital-to-Analog Converter (DAC) Module" for more information. See Section 13.0 "Fixed Voltage Reference (FVR)" for more information. 2011 Microchip Technology Inc. Preliminary DS41615A-page 119 PIC12(L)F1501 REGISTER 15-2: R/W-0/0 ADCON1: A/D CONTROL REGISTER 1 R/W-0/0 ADFM R/W-0/0 R/W-0/0 ADCS<2:0> U-0 U-0 -- -- R/W-0/0 R/W-0/0 ADPREF<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 ADFM: A/D Result Format Select bit 1 = Right justified. Six Most Significant bits of ADRESH are set to `0' when the conversion result is loaded. 0 = Left justified. Six Least Significant bits of ADRESL are set to `0' when the conversion result is loaded. bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits 000 = FOSC/2 001 = FOSC/8 010 = FOSC/32 011 = FRC (clock supplied from a dedicated RC oscillator) 100 = FOSC/4 101 = FOSC/16 110 = FOSC/64 111 = FRC (clock supplied from a dedicated RC oscillator) bit 3-2 Unimplemented: Read as `0' bit 1-0 ADPREF<1:0>: A/D Positive Voltage Reference Configuration bits 00 = VREF+ is connected to VDD 01 = Reserved 10 = VREF+ is connected to external VREF+ pin(1) 11 = Reserved Note 1: When selecting the VREF+ pin as the source of the positive reference, be aware that a minimum voltage specification exists. See Section 27.0 "Electrical Specifications" for details. DS41615A-page 120 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 15-3: R/W-0/0 ADCON2: A/D CONTROL REGISTER 2 R/W-0/0 R/W-0/0 R/W-0/0 TRIGSEL<3:0> U-0 U-0 U-0 U-0 -- -- -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-4 TRIGSEL<3:0>: Auto-Conversion Trigger Selection bits(1) 0000 = No auto-conversion trigger selected 0001 = Reserved 0010 = Reserved 0011 = TMR0 Overflow(2) 0100 = TMR1 Overflow(2) 0101 = TMR2 Match to PR2(2) 0110 = C1OUT 0111 = Reserved 1000 = CLC1 1001 = CLC2 1010 = Reserved 1011 = Reserved 1100 = Reserved 1101 = Reserved 1110 = Reserved 1111 = Reserved bit 3-0 Unimplemented: Read as `0' Note 1: 2: This is a rising edge sensitive input for all sources. Signal also sets its corresponding interrupt flag. 2011 Microchip Technology Inc. Preliminary DS41615A-page 121 PIC12(L)F1501 REGISTER 15-4: R/W-x/u ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<9:2> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-0 ADRES<9:2>: ADC Result Register bits Upper 8 bits of 10-bit conversion result REGISTER 15-5: R/W-x/u ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 R/W-x/u ADRES<1:0> R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u -- -- -- -- -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 ADRES<1:0>: ADC Result Register bits Lower 2 bits of 10-bit conversion result bit 5-0 Reserved: Do not use. DS41615A-page 122 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 15-6: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u -- -- -- -- -- -- R/W-x/u R/W-x/u ADRES<9:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-2 Reserved: Do not use. bit 1-0 ADRES<9:8>: ADC Result Register bits Upper 2 bits of 10-bit conversion result REGISTER 15-7: R/W-x/u ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-0 ADRES<7:0>: ADC Result Register bits Lower 8 bits of 10-bit conversion result 2011 Microchip Technology Inc. Preliminary DS41615A-page 123 PIC12(L)F1501 15.3 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 15-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), refer to Figure 15-4. The maximum recommended impedance for analog sources is 10 k. As the EQUATION 15-1: Assumptions: source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 15-1 may be used. This equation assumes that 1/2 LSb error is used (1,024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. ACQUISITION TIME EXAMPLE Temperature = 50C and external impedance of 10k 5.0V V DD T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = T AMP + T C + T COFF = 2s + T C + Temperature - 25C 0.05s/C The value for TC can be approximated with the following equations: 1 = V CHOLD V AP P LI ED 1 - -------------------------n+1 2 -1 ;[1] VCHOLD charged to within 1/2 lsb -TC ---------- RC V AP P LI ED 1 - e = V CHOLD ;[2] VCHOLD charge response to VAPPLIED - Tc --------- 1 RC ;combining [1] and [2] V AP P LI ED 1 - e = V A PP LIE D 1 - -------------------------n+1 2 -1 Note: Where n = number of bits of the ADC. Solving for TC: T C = - C HOLD R IC + R SS + R S ln(1/2047) = - 12.5pF 1k + 7k + 10k ln(0.0004885) = 1.12 s Therefore: T A CQ = 5s + 1.12 s + 50C- 25C 0.05 s/C = 7.37s Note 1: The reference voltage (VREF+) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. DS41615A-page 124 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 15-4: ANALOG INPUT MODEL VDD Analog Input pin Rs VT 0.6V CPIN 5 pF VA RIC 1k Sampling Switch SS Rss I LEAKAGE(1) VT 0.6V CHOLD = 10 pF VREF- Legend: CHOLD CPIN 6V 5V VDD 4V 3V 2V = Sample/Hold Capacitance = Input Capacitance RSS I LEAKAGE = Leakage current at the pin due to various junctions RIC = Interconnect Resistance RSS = Resistance of Sampling Switch SS = Sampling Switch VT = Threshold Voltage Note 1: FIGURE 15-5: 5 6 7 8 9 10 11 Sampling Switch (k) Refer to Section 27.0 "Electrical Specifications". ADC TRANSFER FUNCTION Full-Scale Range 3FFh 3FEh ADC Output Code 3FDh 3FCh 3FBh 03h 02h 01h 00h Analog Input Voltage 0.5 LSB VREF- 2011 Microchip Technology Inc. 1.5 LSB Zero-Scale Transition Full-Scale Transition Preliminary VREF+ DS41615A-page 125 PIC12(L)F1501 TABLE 15-2: Name SUMMARY OF REGISTERS ASSOCIATED WITH ADC Bit 7 ADCON0 -- ADCON1 ADFM ADCON2 Bit 6 Bit 5 Bit 4 Bit 2 -- -- ADPREF<1:0> 120 -- -- -- 121 CHS<4:0> ADCS<2:0> TRIGSEL<3:0> Bit 1 Bit 0 GO/DONE ADON Register on Page Bit 3 -- 119 ADRESH A/D Result Register High 122, 123 ADRESL A/D Result Register Low 122, 123 ANSELA -- -- -- ANSA4 -- ANSA2 ANSA1 ANSA0 103 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 66 PIE1 TMR1GIE ADIE -- -- -- -- TMR2IE TMR1IE 67 PIR1 TMR1GIF ADIF -- -- -- -- TMR2IF TMR1IF 70 -- -- TRISA5 TRISA4 --(1) TRISA2 TRISA1 TRISA0 102 FVREN FVRRDY TSEN TSRNG TRISA FVRCON Legend: Note 1: CDAFVR<1:0> ADFVR<1:0> 110 x = unknown, u = unchanged, -- = unimplemented read as `0', q = value depends on condition. Shaded cells are not used for ADC module. Unimplemented, read as `1'. DS41615A-page 126 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 16.0 DIGITAL-TO-ANALOG CONVERTER (DAC) MODULE The Digital-to-Analog Converter supplies a variable voltage reference, ratiometric with the input source, with 32 selectable output levels. The input of the DAC can be connected to: 16.1 Output Voltage Selection The DAC has 32 voltage level ranges. The 32 levels are set with the DACR<4:0> bits of the DACCON1 register. The DAC output voltage is determined by the following equations: * External VREF+ pin * VDD supply voltage The output of the DAC can be configured to supply a reference voltage to the following: * * * * Comparator positive input ADC input channel DACOUT1 pin DACOUT2 pin The Digital-to-Analog Converter (DAC) can be enabled by setting the DACEN bit of the DACCON0 register. EQUATION 16-1: DAC OUTPUT VOLTAGE IF DACEN = 1 DACR 4:0 VOUT = VSOURCE+ - VSOURCE- ----------------------------+ VSOURCE5 2 IF DACEN = 0 and DACLPS = 1 and DACR[4:0] = 11111 V OUT = V SOURCE + IF DACEN = 0 and DACLPS = 0 and DACR[4:0] = 00000 V OUT = V SOURCE - VSOURCE+ = VDD, VREF, or FVR BUFFER 2 VSOURCE- = VSS 16.2 Ratiometric Output Level 16.3 The DAC output value is derived using a resistor ladder with each end of the ladder tied to a positive and negative voltage reference input source. If the voltage of either input source fluctuates, a similar fluctuation will result in the DAC output value. The value of the individual resistors within the ladder can be found in Section 27.0 "Electrical Specifications". DAC Voltage Reference Output The DAC voltage can be output to the DACOUT1 and DACOUT2 pins by setting the respective DACOE1 and DACOE2 pins of the DACCON0 register. Selecting the DAC reference voltage for output on either DACOUTx pin automatically overrides the digital output buffer and digital input threshold detector functions of that pin. Reading the DACOUTx pin when it has been configured for DAC reference voltage output will always return a `0'. Due to the limited current drive capability, a buffer must be used on the DAC voltage reference output for external connections to either DACOUTx pin. Figure 16-2 shows an example buffering technique. 2011 Microchip Technology Inc. Preliminary DS41615A-page 127 PIC12(L)F1501 FIGURE 16-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM Digital-to-Analog Converter (DAC) VSOURCE+ VDD DACR<4:0> 5 VREF+ R R DACPSS R DACEN R 32 Steps R 32-to-1 MUX R DAC (To Comparator and ADC Module) R DACOUT1 R DACOE1 VSOURCE- DACOUT2 DACOE2 FIGURE 16-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE PIC(R) MCU DAC Module R Voltage Reference Output Impedance DS41615A-page 128 DACOUTX Preliminary + - Buffered DAC Output 2011 Microchip Technology Inc. PIC12(L)F1501 16.4 Operation During Sleep When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the DACCON0 register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 16.5 Effects of a Reset A device Reset affects the following: * DAC is disabled. * DAC output voltage is removed from the DACOUT pin. * The DACR<4:0> range select bits are cleared. 2011 Microchip Technology Inc. Preliminary DS41615A-page 129 PIC12(L)F1501 16.6 DAC Control Registers REGISTER 16-1: DACCON0: VOLTAGE REFERENCE CONTROL REGISTER 0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0 U-0 DACEN -- DACOE1 DACOE2 -- DACPSS -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 DACEN: DAC Enable bit 1 = DAC is enabled 0 = DAC is disabled bit 6 Unimplemented: Read as `0' bit 5 DACOE1: DAC Voltage Output Enable bit 1 = DAC voltage level is also an output on the DACOUT1 pin 0 = DAC voltage level is disconnected from the DACOUT1 pin bit 4 DACOE2: DAC Voltage Output Enable bit 1 = DAC voltage level is also an output on the DACOUT2 pin 0 = DAC voltage level is disconnected from the DACOUT2 pin bit 3 Unimplemented: Read as `0' bit 2 DACPSS: DAC Positive Source Select bit 1= VREF+ pin 0= VDD bit 1-0 Unimplemented: Read as `0' REGISTER 16-2: DACCON1: VOLTAGE REFERENCE CONTROL REGISTER 1 U-0 U-0 U-0 -- -- -- R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 DACR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-5 Unimplemented: Read as `0' bit 4-0 DACR<4:0>: DAC Voltage Output Select bits TABLE 16-1: Name SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC MODULE Bit 7 Bit 6 Bit 5 Bit 4 FVRCON FVREN FVRRDY TSEN TSRNG DACCON0 DACEN -- DACOE1 DACOE2 -- -- -- DACCON1 Legend: Bit 3 Bit 2 CDAFVR<1:0> -- DACPSS Register on page Bit 1 Bit 0 ADFVR1 ADFVR0 161 -- -- 130 DACR<4:0> 130 -- = Unimplemented location, read as `0'. Shaded cells are not used with the DAC module. DS41615A-page 130 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 17.0 COMPARATOR MODULE FIGURE 17-1: Comparators are used to interface analog circuits to a digital circuit by comparing two analog voltages and providing a digital indication of their relative magnitudes. Comparators are very useful mixed signal building blocks because they provide analog functionality independent of program execution. The analog comparator module includes the following features: * * * * * * * * * Independent comparator control Programmable input selection Comparator output is available internally/externally Programmable output polarity Interrupt-on-change Wake-up from Sleep Programmable Speed/Power optimization PWM shutdown Programmable and fixed voltage reference 17.1 SINGLE COMPARATOR VIN+ + VIN- - Output VINVIN+ Output Note: Comparator Overview The black areas of the output of the comparator represents the uncertainty due to input offsets and response time. A single comparator is shown in Figure 17-1 along with the relationship between the analog input levels and the digital output. When the analog voltage at VIN+ is less than the analog voltage at VIN-, the output of the comparator is a digital low level. When the analog voltage at VIN+ is greater than the analog voltage at VIN-, the output of the comparator is a digital high level. The comparators available for this device are located in Table 17-1. TABLE 17-1: COMPARATOR AVAILABILITY PER DEVICE Device C1 PIC12F1501 PIC12LF1501 2011 Microchip Technology Inc. Preliminary DS41615A-page 131 PIC12(L)F1501 FIGURE 17-2: COMPARATOR MODULES SIMPLIFIED BLOCK DIAGRAM CxNCH<2:0> CxON(1) 3 C12IN0- 0 C12IN1C12IN2- 1 MUX 2 (2) C12IN3- 3 FVR Buffer2 4 det Set CxIF 0 MUX 1 (2) DAC FVR Buffer2 CxINTN Interrupt det CXPOL CxVN D Cx CxVP CXIN+ CxINTP Interrupt CXOUT MCXOUT Q To Data Bus + EN Q1 CxHYS CxSP async_CxOUT To CWG 2 3 CXSYNC CxON CXPCH<1:0> CXOE TRIS bit CXOUT 0 2 D (from Timer1) T1CLK Note 1: 2: Q 1 SYNC_CXOUT To Timer1, CLCx, ADC When CxON = 0, the comparator will produce a `0' at the output. When CxON = 0, all multiplexer inputs are disconnected. DS41615A-page 132 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 17.2 Comparator Control 17.2.3 Each comparator has 2 control registers: CMxCON0 and CMxCON1. The CMxCON0 registers (see Register 17-1) contain Control and Status bits for the following: * * * * * * Enable Output selection Output polarity Speed/Power selection Hysteresis enable Output synchronization Inverting the output of the comparator is functionally equivalent to swapping the comparator inputs. The polarity of the comparator output can be inverted by setting the CxPOL bit of the CMxCON0 register. Clearing the CxPOL bit results in a non-inverted output. Table 17-2 shows the output state versus input conditions, including polarity control. TABLE 17-2: Interrupt enable Interrupt edge polarity Positive input channel selection Negative input channel selection 17.2.1 CxPOL CxOUT CxVN > CxVP 0 0 CxVN < CxVP 0 1 CxVN > CxVP 1 1 CxVN < CxVP 1 0 17.2.4 COMPARATOR ENABLE Setting the CxON bit of the CMxCON0 register enables the comparator for operation. Clearing the CxON bit disables the comparator resulting in minimum current consumption. 17.2.2 COMPARATOR OUTPUT SELECTION COMPARATOR OUTPUT STATE VS. INPUT CONDITIONS Input Condition The CMxCON1 registers (see Register 17-2) contain Control bits for the following: * * * * COMPARATOR OUTPUT POLARITY COMPARATOR SPEED/POWER SELECTION The trade-off between speed or power can be optimized during program execution with the CxSP control bit. The default state for this bit is `1' which selects the normal speed mode. Device power consumption can be optimized at the cost of slower comparator propagation delay by clearing the CxSP bit to `0'. The output of the comparator can be monitored by reading either the CxOUT bit of the CMxCON0 register or the MCxOUT bit of the CMOUT register. In order to make the output available for an external connection, the following conditions must be true: * CxOE bit of the CMxCON0 register must be set * Corresponding TRIS bit must be cleared * CxON bit of the CMxCON0 register must be set Note 1: The CxOE bit of the CMxCON0 register overrides the PORT data latch. Setting the CxON bit of the CMxCON0 register has no impact on the port override. 2: The internal output of the comparator is latched with each instruction cycle. Unless otherwise specified, external outputs are not latched. 2011 Microchip Technology Inc. Preliminary DS41615A-page 133 PIC12(L)F1501 17.3 Comparator Hysteresis 17.5 A selectable amount of separation voltage can be added to the input pins of each comparator to provide a hysteresis function to the overall operation. Hysteresis is enabled by setting the CxHYS bit of the CMxCON0 register. Comparator Interrupt An interrupt can be generated upon a change in the output value of the comparator for each comparator, a rising edge detector and a falling edge detector are present. See Section 27.0 "Electrical Specifications" for more information. When either edge detector is triggered and its associated enable bit is set (CxINTP and/or CxINTN bits of the CMxCON1 register), the Corresponding Interrupt Flag bit (CxIF bit of the PIR2 register) will be set. 17.4 To enable the interrupt, you must set the following bits: Timer1 Gate Operation The output resulting from a comparator operation can be used as a source for gate control of Timer1. See Section 19.5 "Timer1 Gate" for more information. This feature is useful for timing the duration or interval of an analog event. It is recommended that the comparator output be synchronized to Timer1. This ensures that Timer1 does not increment while a change in the comparator is occurring. 17.4.1 COMPARATOR OUTPUT SYNCHRONIZATION The output from a comparator can be synchronized with Timer1 by setting the CxSYNC bit of the CMxCON0 register. Once enabled, the comparator output is latched on the falling edge of the Timer1 source clock. If a prescaler is used with Timer1, the comparator output is latched after the prescaling function. To prevent a race condition, the comparator output is latched on the falling edge of the Timer1 clock source and Timer1 increments on the rising edge of its clock source. See the Comparator Block Diagram (Figure 17-2) and the Timer1 Block Diagram (Figure 19-1) for more information. * CxON, CxPOL and CxSP bits of the CMxCON0 register * CxIE bit of the PIE2 register * CxINTP bit of the CMxCON1 register (for a rising edge detection) * CxINTN bit of the CMxCON1 register (for a falling edge detection) * PEIE and GIE bits of the INTCON register The associated interrupt flag bit, CxIF bit of the PIR2 register, must be cleared in software. If another edge is detected while this flag is being cleared, the flag will still be set at the end of the sequence. Note: 17.6 Although a comparator is disabled, an interrupt can be generated by changing the output polarity with the CxPOL bit of the CMxCON0 register, or by switching the comparator on or off with the CxON bit of the CMxCON0 register. Comparator Positive Input Selection Configuring the CxPCH<1:0> bits of the CMxCON1 register directs an internal voltage reference or an analog pin to the non-inverting input of the comparator: * * * * CxIN+ analog pin DAC FVR (Fixed Voltage Reference) VSS (Ground) See Section 13.0 "Fixed Voltage Reference (FVR)" for more information on the Fixed Voltage Reference module. See Section 16.0 "Digital-to-Analog Converter (DAC) Module" for more information on the DAC input signal. Any time the comparator is disabled (CxON = 0), all comparator inputs are disabled. DS41615A-page 134 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 17.7 Comparator Negative Input Selection 17.9 The CxNCH<1:0> bits of the CMxCON0 register direct one of the input sources to the comparator inverting input. Note: 17.8 To use CxIN+ and CxINx- pins as analog input, the appropriate bits must be set in the ANSEL register and the corresponding TRIS bits must also be set to disable the output drivers. Comparator Response Time The comparator output is indeterminate for a period of time after the change of an input source or the selection of a new reference voltage. This period is referred to as the response time. The response time of the comparator differs from the settling time of the voltage reference. Therefore, both of these times must be considered when determining the total response time to a comparator input change. See the Comparator and Voltage Reference Specifications in Section 27.0 "Electrical Specifications" for more details. 2011 Microchip Technology Inc. Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 17-3. Since the analog input pins share their connection with a digital input, they have reverse biased ESD protection diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. A maximum source impedance of 10 k is recommended for the analog sources. Also, any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current to minimize inaccuracies introduced. Note 1: When reading a PORT register, all pins configured as analog inputs will read as a `0'. Pins configured as digital inputs will convert as an analog input, according to the input specification. Preliminary 2: Analog levels on any pin defined as a digital input, may cause the input buffer to consume more current than is specified. DS41615A-page 135 PIC12(L)F1501 FIGURE 17-3: ANALOG INPUT MODEL VDD Rs < 10K Analog Input pin VT 0.6V RIC To Comparator VA CPIN 5 pF VT 0.6V ILEAKAGE(1) Vss Legend: CPIN = Input Capacitance ILEAKAGE = Leakage Current at the pin due to various junctions = Interconnect Resistance RIC = Source Impedance RS = Analog Voltage VA = Threshold Voltage VT Note 1: DS41615A-page 136 See Section 27.0 "Electrical Specifications". Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 17-1: CMxCON0: COMPARATOR Cx CONTROL REGISTER 0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 U-0 R/W-1/1 R/W-0/0 R/W-0/0 CxON CxOUT CxOE CxPOL -- CxSP CxHYS CxSYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 CxON: Comparator Enable bit 1 = Comparator is enabled and consumes no active power 0 = Comparator is disabled bit 6 CxOUT: Comparator Output bit If CxPOL = 1 (inverted polarity): 1 = CxVP < CxVN 0 = CxVP > CxVN If CxPOL = 0 (non-inverted polarity): 1 = CxVP > CxVN 0 = CxVP < CxVN bit 5 CxOE: Comparator Output Enable bit 1 = CxOUT is present on the CxOUT pin. Requires that the associated TRIS bit be cleared to actually drive the pin. Not affected by CxON. 0 = CxOUT is internal only bit 4 CxPOL: Comparator Output Polarity Select bit 1 = Comparator output is inverted 0 = Comparator output is not inverted bit 3 Unimplemented: Read as `0' bit 2 CxSP: Comparator Speed/Power Select bit 1 = Comparator operates in normal power, higher speed mode 0 = Comparator operates in low-power, low-speed mode bit 1 CxHYS: Comparator Hysteresis Enable bit 1 = Comparator hysteresis enabled 0 = Comparator hysteresis disabled bit 0 CxSYNC: Comparator Output Synchronous Mode bit 1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source. Output updated on the falling edge of Timer1 clock source. 0 = Comparator output to Timer1 and I/O pin is asynchronous. 2011 Microchip Technology Inc. Preliminary DS41615A-page 137 PIC12(L)F1501 REGISTER 17-2: CMxCON1: COMPARATOR Cx CONTROL REGISTER 1 R/W-0/0 R/W-0/0 CxINTP CxINTN R/W-0/0 R/W-0/0 CxPCH<1:0> U-0 R/W-0/0 R/W-0/0 R/W-0/0 CxNCH<2:0> -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 CxINTP: Comparator Interrupt on Positive Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit 0 = No interrupt flag will be set on a positive going edge of the CxOUT bit bit 6 CxINTN: Comparator Interrupt on Negative Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit 0 = No interrupt flag will be set on a negative going edge of the CxOUT bit bit 5-4 CxPCH<1:0>: Comparator Positive Input Channel Select bits 11 = CxVP connects to VSS 10 = CxVP connects to FVR Voltage Reference 01 = CxVP connects to DAC Voltage Reference 00 = CxVP connects to CxIN+ pin bit 3 Unimplemented: Read as `0' bit 2-0 CxNCH<2:0>: Comparator Negative Input Channel Select bits 111 = Reserved 110 = Reserved 101 = Reserved 100 = CxVN connects to FVR Voltage reference 011 = CxVN connects to C12IN3- pin 010 = CxVN connects to C12IN2- pin 001 = CxVN connects to C12IN1- pin 000 = CxVN connects to C12IN0- pin REGISTER 17-3: U-0 CMOUT: COMPARATOR OUTPUT REGISTER U-0 -- -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 R-0/0 -- MC1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-1 Unimplemented: Read as `0' bit 0 MC1OUT: Mirror Copy of C1OUT bit DS41615A-page 138 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 17-3: Name ANSELA SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page -- -- -- ANSA4 -- ANSA2 ANSA1 ANSA0 103 C1OE C1POL -- C1SP C1HYS C1SYNC 137 CM1CON0 C1ON C1OUT CM1CON1 C1NTP C1INTN -- -- -- -- -- -- -- MC1OUT 138 DACEN -- DACOE1 DACOE2 -- DACPSS -- -- 130 CDAFVR<1:0> CMOUT DACCON0 C1PCH<1:0> -- C1NCH<2:0> 138 -- -- -- FVRCON FVREN FVRRDY TSEN TSRNG INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 66 PIE2 -- -- C1IE -- -- NCO1IE -- -- 68 PIR2 -- -- C1IF -- -- NCO1IF -- -- 71 RA5 RA4 RA3 RA2 RA1 RA0 102 DACCON1 DACR<4:0> 130 ADFVR<1:0> 110 PORTA -- -- LATA -- -- LATA5 LATA4 -- LATA2 LATA1 LATA0 103 TRISA -- -- TRISA5 TRISA4 --(1) TRISA2 TRISA1 TRISA0 102 Legend: Note 1: -- = unimplemented location, read as `0'. Shaded cells are unused by the comparator module. Unimplemented, read as `1'. 2011 Microchip Technology Inc. Preliminary DS41615A-page 139 PIC12(L)F1501 NOTES: DS41615A-page 140 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 18.0 TIMER0 MODULE 18.1.2 8-BIT COUNTER MODE The Timer0 module is an 8-bit timer/counter with the following features: In 8-Bit Counter mode, the Timer0 module will increment on every rising or falling edge of the T0CKI pin. * * * * * * 8-Bit Counter mode using the T0CKI pin is selected by setting the TMR0CS bit in the OPTION_REG register to `1'. 8-bit timer/counter register (TMR0) 8-bit prescaler (independent of Watchdog Timer) Programmable internal or external clock source Programmable external clock edge selection Interrupt on overflow TMR0 can be used to gate Timer1 The rising or falling transition of the incrementing edge for either input source is determined by the TMR0SE bit in the OPTION_REG register. Figure 18-1 is a block diagram of the Timer0 module. 18.1 Timer0 Operation The Timer0 module can be used as either an 8-bit timer or an 8-bit counter. 18.1.1 8-BIT TIMER MODE The Timer0 module will increment every instruction cycle, if used without a prescaler. 8-Bit Timer mode is selected by clearing the TMR0CS bit of the OPTION_REG register. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: The value written to the TMR0 register can be adjusted, in order to account for the two instruction cycle delay when TMR0 is written. FIGURE 18-1: BLOCK DIAGRAM OF THE TIMER0 FOSC/4 Data Bus 0 T0CKI 1 1 8 Sync 2 TCY TMR0 0 TMR0SE TMR0CS 8-bit Prescaler PSA Set Flag bit TMR0IF on Overflow Overflow to Timer1 8 PS<2:0> 2011 Microchip Technology Inc. Preliminary DS41615A-page 141 PIC12(L)F1501 18.1.3 SOFTWARE PROGRAMMABLE PRESCALER A software programmable prescaler is available for exclusive use with Timer0. The prescaler is enabled by clearing the PSA bit of the OPTION_REG register. Note: The Watchdog Timer (WDT) uses its own independent prescaler. There are 8 prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION_REG register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be disabled by setting the PSA bit of the OPTION_REG register. The prescaler is not readable or writable. All instructions writing to the TMR0 register will clear the prescaler. 18.1.4 TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The TMR0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The TMR0IF bit can only be cleared in software. The Timer0 interrupt enable is the TMR0IE bit of the INTCON register. Note: 18.1.5 The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. 8-BIT COUNTER MODE SYNCHRONIZATION When in 8-Bit Counter mode, the incrementing edge on the T0CKI pin must be synchronized to the instruction clock. Synchronization can be accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the instruction clock. The high and low periods of the external clocking source must meet the timing requirements as shown in Section 27.0 "Electrical Specifications". 18.1.6 OPERATION DURING SLEEP Timer0 cannot operate while the processor is in Sleep mode. The contents of the TMR0 register will remain unchanged while the processor is in Sleep mode. DS41615A-page 142 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 18.2 Option and Timer0 Control Register REGISTER 18-1: OPTION_REG: OPTION REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 WPUEN INTEDG TMR0CS TMR0SE PSA R/W-1/1 R/W-1/1 R/W-1/1 PS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 WPUEN: Weak Pull-Up Enable bit 1 = All weak pull-ups are disabled (except MCLR, if it is enabled) 0 = Weak pull-ups are enabled by individual WPUx latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 TMR0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 TMR0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is not assigned to the Timer0 module 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits TABLE 18-1: Name Bit Value Timer0 Rate 000 001 010 011 100 101 110 111 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Bit 7 Bit 6 ADCON2 INTCON TMR0 Legend: * Note 1: Bit 4 TRIGSEL<3:0> OPTION_REG TRISA Bit 5 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page -- -- -- -- 121 TMR0IF INTF IOCIF GIE PEIE TMR0IE INTE IOCIE WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> Holding Register for the 8-bit Timer0 Count -- -- TRISA5 TRISA4 66 143 141* --(1) TRISA2 TRISA1 TRISA0 102 -- = Unimplemented location, read as `0'. Shaded cells are not used by the Timer0 module. Page provides register information. Unimplemented, read as `1'. 2011 Microchip Technology Inc. Preliminary DS41615A-page 143 PIC12(L)F1501 NOTES: DS41615A-page 144 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 19.0 TIMER1 MODULE WITH GATE CONTROL * Gate Single-Pulse mode * Gate Value Status * Gate Event Interrupt The Timer1 module is a 16-bit timer/counter with the following features: Figure 19-1 is a block diagram of the Timer1 module. * * * * * * * 16-bit timer/counter register pair (TMR1H:TMR1L) Programmable internal or external clock source 2-bit prescaler Optionally synchronized comparator out Multiple Timer1 gate (count enable) sources Interrupt on overflow Wake-up on overflow (external clock, Asynchronous mode only) * Special Event Trigger * Selectable Gate Source Polarity * Gate Toggle mode FIGURE 19-1: TIMER1 BLOCK DIAGRAM T1GSS<1:0> 00 T1G From Timer0 Overflow T1GSPM 01 0 t1g_in sync_C1OUT 10 Reserved Single Pulse 11 TMR1ON T1GPOL T1GVAL 0 D Q CK R Q 1 Acq. Control 1 Q1 Data Bus D Q RD T1GCON EN Interrupt T1GGO/DONE Set TMR1GIF det T1GTM TMR1GE Set flag bit TMR1IF on Overflow To ADC Auto-Conversion TMR1ON TMR1(2) TMR1H TMR1L EN Q D T1CLK Synchronized Clock Input 0 1 TMR1CS<1:0> LFINTOSC T1SYNC 11 (1) Synchronize(3) Prescaler 1, 2, 4, 8 det 10 T1CKI FOSC Internal Clock 01 FOSC/4 Internal Clock 00 2 T1CKPS<1:0> FOSC/2 Internal Clock Sleep input Note 1: ST Buffer is high speed type when using T1CKI. 2: Timer1 register increments on rising edge. 3: Synchronize does not operate while in Sleep. 2011 Microchip Technology Inc. Preliminary DS41615A-page 145 PIC12(L)F1501 19.1 Timer1 Operation 19.2 The Timer1 module is a 16-bit incrementing counter which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. When used with an internal clock source, the module is a timer and increments on every instruction cycle. When used with an external clock source, the module can be used as either a timer or counter and increments on every selected edge of the external source. Timer1 is enabled by configuring the TMR1ON and TMR1GE bits in the T1CON and T1GCON registers, respectively. Table 19-1 displays the Timer1 enable selections. TABLE 19-1: TIMER1 ENABLE SELECTIONS Clock Source Selection The TMR1CS<1:0> bits of the T1CON register are used to select the clock source for Timer1. Table 19-2 displays the clock source selections. 19.2.1 INTERNAL CLOCK SOURCE When the internal clock source is selected the TMR1H:TMR1L register pair will increment on multiples of FOSC as determined by the Timer1 prescaler. When the FOSC internal clock source is selected, the Timer1 register value will increment by four counts every instruction clock cycle. Due to this condition, a 2 LSB error in resolution will occur when reading the Timer1 value. To utilize the full resolution of Timer1, an asynchronous input signal must be used to gate the Timer1 clock input. The following asynchronous sources may be used: * Asynchronous event on the T1G pin to Timer1 gate Timer1 Operation TMR1ON TMR1GE 0 0 Off 19.2.2 0 1 Off 1 0 Always On When the external clock source is selected, the Timer1 module may work as a timer or a counter. 1 1 Count Enabled EXTERNAL CLOCK SOURCE When enabled to count, Timer1 is incremented on the rising edge of the external clock input T1CKI. The external clock source can be synchronized to the microcontroller system clock or it can run asynchronously. Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge after any one or more of the following conditions: * * * * TABLE 19-2: Timer1 enabled after POR Write to TMR1H or TMR1L Timer1 is disabled Timer1 is disabled (TMR1ON = 0) when T1CKI is high then Timer1 is enabled (TMR1ON=1) when T1CKI is low. CLOCK SOURCE SELECTIONS TMR1CS<1:0> T1OSCEN Clock Source 11 x LFINTOSC 10 0 External Clocking on T1CKI Pin 01 x System Clock (FOSC) 00 x Instruction Clock (FOSC/4) DS41615A-page 146 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 19.3 Timer1 Prescaler Timer1 has four prescaler options allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. 19.4 Timer1 Operation in Asynchronous Counter Mode If control bit T1SYNC of the T1CON register is set, the external clock input is not synchronized. The timer increments asynchronously to the internal phase clocks. If the external clock source is selected then the timer will continue to run during Sleep and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (see Section 19.4.1 "Reading and Writing Timer1 in Asynchronous Counter Mode"). Note: 19.4.1 When switching from synchronous to asynchronous operation, it is possible to skip an increment. When switching from asynchronous to synchronous operation, it is possible to produce an additional increment. When Timer1 Gate Enable mode is enabled, Timer1 will increment on the rising edge of the Timer1 clock source. When Timer1 Gate Enable mode is disabled, no incrementing will occur and Timer1 will hold the current count. See Figure 19-3 for timing details. TABLE 19-3: TIMER1 GATE ENABLE SELECTIONS T1CLK T1GPOL T1G 0 0 Counts 0 1 Holds Count 1 0 Holds Count 1 1 Counts 19.5.2 Timer1 Operation TIMER1 GATE SOURCE SELECTION Timer1 gate source selections are shown in Table 19-4. Source selection is controlled by the T1GSS<1:0> bits of the T1GCON register. The polarity for each available source is also selectable. Polarity selection is controlled by the T1GPOL bit of the T1GCON register. TABLE 19-4: TIMER1 GATE SOURCES T1GSS READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L while the timer is running from an external asynchronous clock will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the timer may overflow between the reads. Timer1 Gate Source 00 Timer1 Gate Pin 01 Overflow of Timer0 (TMR0 increments from FFh to 00h) 10 Comparator 1 Output sync_C1OUT (optionally synchronized comparator output) 11 Reserved For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the TMR1H:TMR1L register pair. 19.5 Timer1 Gate Timer1 can be configured to count freely or the count can be enabled and disabled using Timer1 gate circuitry. This is also referred to as Timer1 Gate Enable. Timer1 gate can also be driven by multiple selectable sources. 19.5.1 TIMER1 GATE ENABLE The Timer1 Gate Enable mode is enabled by setting the TMR1GE bit of the T1GCON register. The polarity of the Timer1 Gate Enable mode is configured using the T1GPOL bit of the T1GCON register. 2011 Microchip Technology Inc. Preliminary DS41615A-page 147 PIC12(L)F1501 19.5.2.1 T1G Pin Gate Operation 19.5.5 The T1G pin is one source for Timer1 Gate Control. It can be used to supply an external source to the Timer1 gate circuitry. 19.5.2.2 Timer0 Overflow Gate Operation When Timer0 increments from FFh to 00h, a low-to-high pulse will automatically be generated and internally supplied to the Timer1 gate circuitry. 19.5.3 TIMER1 GATE TOGGLE MODE When Timer1 Gate Toggle mode is enabled, it is possible to measure the full-cycle length of a Timer1 gate signal, as opposed to the duration of a single level pulse. The Timer1 gate source is routed through a flip-flop that changes state on every incrementing edge of the signal. See Figure 19-4 for timing details. TIMER1 GATE VALUE STATUS When Timer1 Gate Value Status is utilized, it is possible to read the most current level of the gate control value. The value is stored in the T1GVAL bit in the T1GCON register. The T1GVAL bit is valid even when the Timer1 gate is not enabled (TMR1GE bit is cleared). 19.5.6 TIMER1 GATE EVENT INTERRUPT When Timer1 Gate Event Interrupt is enabled, it is possible to generate an interrupt upon the completion of a gate event. When the falling edge of T1GVAL occurs, the TMR1GIF flag bit in the PIR1 register will be set. If the TMR1GIE bit in the PIE1 register is set, then an interrupt will be recognized. The TMR1GIF flag bit operates even when the Timer1 gate is not enabled (TMR1GE bit is cleared). Timer1 Gate Toggle mode is enabled by setting the T1GTM bit of the T1GCON register. When the T1GTM bit is cleared, the flip-flop is cleared and held clear. This is necessary in order to control which edge is measured. Note: 19.5.4 Enabling Toggle mode at the same time as changing the gate polarity may result in indeterminate operation. TIMER1 GATE SINGLE-PULSE MODE When Timer1 Gate Single-Pulse mode is enabled, it is possible to capture a single pulse gate event. Timer1 Gate Single-Pulse mode is first enabled by setting the T1GSPM bit in the T1GCON register. Next, the T1GGO/DONE bit in the T1GCON register must be set. The Timer1 will be fully enabled on the next incrementing edge. On the next trailing edge of the pulse, the T1GGO/DONE bit will automatically be cleared. No other gate events will be allowed to increment Timer1 until the T1GGO/DONE bit is once again set in software. See Figure 19-5 for timing details. If the Single Pulse Gate mode is disabled by clearing the T1GSPM bit in the T1GCON register, the T1GGO/DONE bit should also be cleared. Enabling the Toggle mode and the Single-Pulse mode simultaneously will permit both sections to work together. This allows the cycle times on the Timer1 gate source to be measured. See Figure 19-6 for timing details. DS41615A-page 148 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 19.6 Timer1 Interrupt 19.7.1 The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: * * * * TMR1ON bit of the T1CON register TMR1IE bit of the PIE1 register PEIE bit of the INTCON register GIE bit of the INTCON register ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 11.1 "Alternate Pin Function" for more information. The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. Note: 19.7 Timer1 Operation During Sleep Timer1 can only operate during Sleep when setup in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To set up the timer to wake the device: * * * * * TMR1ON bit of the T1CON register must be set TMR1IE bit of the PIE1 register must be set PEIE bit of the INTCON register must be set T1SYNC bit of the T1CON register must be set TMR1CS bits of the T1CON register must be configured The device will wake-up on an overflow and execute the next instructions. If the GIE bit of the INTCON register is set, the device will call the Interrupt Service Routine. Timer1 oscillator will continue to operate in Sleep regardless of the T1SYNC bit setting. FIGURE 19-2: TIMER1 INCREMENTING EDGE T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: 2: Arrows indicate counter increments. In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock. 2011 Microchip Technology Inc. Preliminary DS41615A-page 149 PIC12(L)F1501 FIGURE 19-3: TIMER1 GATE ENABLE MODE TMR1GE T1GPOL t1g_in T1CKI T1GVAL Timer1 N FIGURE 19-4: N+1 N+2 N+3 N+4 TIMER1 GATE TOGGLE MODE TMR1GE T1GPOL T1GTM t1g_in T1CKI T1GVAL Timer1 DS41615A-page 150 N N+1 N+2 N+3 N+4 Preliminary N+5 N+6 N+7 N+8 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 19-5: TIMER1 GATE SINGLE-PULSE MODE TMR1GE T1GPOL T1GSPM T1GGO/ Cleared by hardware on falling edge of T1GVAL Set by software DONE Counting enabled on rising edge of T1G t1g_in T1CKI T1GVAL Timer1 TMR1GIF N N+1 Set by hardware on falling edge of T1GVAL Cleared by software 2011 Microchip Technology Inc. N+2 Preliminary Cleared by software DS41615A-page 151 PIC12(L)F1501 FIGURE 19-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE TMR1GE T1GPOL T1GSPM T1GTM T1GGO/ Cleared by hardware on falling edge of T1GVAL Set by software DONE Counting enabled on rising edge of T1G t1g_in T1CKI T1GVAL Timer1 TMR1GIF DS41615A-page 152 N Cleared by software N+1 N+2 N+3 Set by hardware on falling edge of T1GVAL Preliminary N+4 Cleared by software 2011 Microchip Technology Inc. PIC12(L)F1501 19.8 Timer1 Control Registers REGISTER 19-1: R/W-0/u T1CON: TIMER1 CONTROL REGISTER R/W-0/u TMR1CS<1:0> R/W-0/u R/W-0/u T1CKPS<1:0> U-0 R/W-0/u U-0 R/W-0/u -- T1SYNC -- TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 TMR1CS<1:0>: Timer1 Clock Source Select bits 11 = Timer1 clock source is LFINTOSC 10 = Timer1 clock source is T1CKI pin (on rising edge) 01 = Timer1 clock source is system clock (FOSC) 00 = Timer1 clock source is instruction clock (FOSC/4) bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3 Unimplemented: Read as `0' bit 2 T1SYNC: Timer1 Synchronization Control bit 1 = Do not synchronize asynchronous clock input 0 = Synchronize asynchronous clock input with system clock (FOSC) bit 1 Unimplemented: Read as `0' bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 and clears Timer1 gate flip-flop 2011 Microchip Technology Inc. Preliminary DS41615A-page 153 PIC12(L)F1501 REGISTER 19-2: T1GCON: TIMER1 GATE CONTROL REGISTER R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W/HC-0/u R-x/x TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ DONE T1GVAL R/W-0/u R/W-0/u T1GSS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared HC = Bit is cleared by hardware bit 7 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 counting is controlled by the Timer1 gate function 0 = Timer1 counts regardless of Timer1 gate function bit 6 T1GPOL: Timer1 Gate Polarity bit 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 5 T1GTM: Timer1 Gate Toggle Mode bit 1 = Timer1 Gate Toggle mode is enabled 0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared Timer1 gate flip-flop toggles on every rising edge. bit 4 T1GSPM: Timer1 Gate Single-Pulse Mode bit 1 = Timer1 Gate Single-Pulse mode is enabled and is controlling Timer1 gate 0 = Timer1 Gate Single-Pulse mode is disabled bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit 1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge 0 = Timer1 gate single-pulse acquisition has completed or has not been started bit 2 T1GVAL: Timer1 Gate Current State bit Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L. Unaffected by Timer1 Gate Enable (TMR1GE). bit 0 T1GSS<1:0>: Timer1 Gate Source Select bits 11 = Reserved 10 = Comparator 1 optionally synchronized output (sync_C1OUT) 01 = Timer0 overflow output 00 = Timer1 gate pin DS41615A-page 154 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 19.8.1 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 11.1 "Alternate Pin Function" for more information. TABLE 19-5: Name SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA -- -- -- ANSA4 -- ANSA2 ANSA1 ANSA0 103 APFCON CWG1BSEL CWG1ASEL -- -- T1GSEL -- CLC1SEL NCO1SEL 100 66 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF PIE1 INTCON TMR1GIE ADIE -- -- -- -- TMR2IE TMR1IE 67 PIR1 TMR1GIF ADIF -- -- -- -- TMR2IF TMR1IF 70 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Count TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Count -- TRISA T1CON T1GCON -- TMR1CS<1:0> TMR1GE T1GPOL TRISA5 TRISA4 T1CKPS<1:0> T1GTM T1GSPM --(1) 149* 149* TRISA2 TRISA1 TRISA0 -- T1SYNC -- TMR1ON T1GGO/ T1GVAL T1GSS<1:0> 102 153 154 DONE Legend: Note * 1: -- = unimplemented location, read as `0'. Shaded cells are not used by the Timer1 module. Page provides register information. Unimplemented, read as `1'. 2011 Microchip Technology Inc. Preliminary DS41615A-page 155 PIC12(L)F1501 NOTES: DS41615A-page 156 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 20.0 TIMER2 MODULE The Timer2 module incorporates the following features: * 8-bit Timer and Period registers (TMR2 and PR2, respectively) * Readable and writable (both registers) * Software programmable prescaler (1:1, 1:4, 1:16, and 1:64) * Software programmable postscaler (1:1 to 1:16) * Interrupt on TMR2 match with PR2, respectively See Figure 20-1 for a block diagram of Timer2. FIGURE 20-1: TIMER2 BLOCK DIAGRAM TMR2 Output FOSC/4 Prescaler 1:1, 1:4, 1:16, 1:64 2 TMR2 Comparator Sets Flag bit TMR2IF Reset Postscaler 1:1 to 1:16 EQ T2CKPS<1:0> 4 PR2 T2OUTPS<3:0> 2011 Microchip Technology Inc. Preliminary DS41615A-page 157 PIC12(L)F1501 20.1 Timer2 Operation 20.3 The clock input to the Timer2 module is the system instruction clock (FOSC/4). TMR2 increments from 00h on each clock edge. A 4-bit counter/prescaler on the clock input allows direct input, divide-by-4 and divide-by-16 prescale options. These options are selected by the prescaler control bits, T2CKPS<1:0> of the T2CON register. The value of TMR2 is compared to that of the Period register, PR2, on each clock cycle. When the two values match, the comparator generates a match signal as the timer output. This signal also resets the value of TMR2 to 00h on the next cycle and drives the output Section 20.2 "Timer2 counter/postscaler (see Interrupt"). Timer2 Output The unscaled output of TMR2 is available primarily to the PWMx module, where it is used as a time base for operation. 20.4 Timer2 Operation During Sleep Timer2 cannot be operated while the processor is in Sleep mode. The contents of the TMR2 and PR2 registers will remain unchanged while the processor is in Sleep mode. The TMR2 and PR2 registers are both directly readable and writable. The TMR2 register is cleared on any device Reset, whereas the PR2 register initializes to FFh. Both the prescaler and postscaler counters are cleared on the following events: * * * * * * * * * a write to the TMR2 register a write to the T2CON register Power-on Reset (POR) Brown-out Reset (BOR) MCLR Reset Watchdog Timer (WDT) Reset Stack Overflow Reset Stack Underflow Reset RESET Instruction Note: 20.2 TMR2 is not cleared when T2CON is written. Timer2 Interrupt Timer2 can also generate an optional device interrupt. The Timer2 output signal (TMR2-to-PR2 match) provides the input for the 4-bit counter/postscaler. This counter generates the TMR2 match interrupt flag which is latched in TMR2IF of the PIR1 register. The interrupt is enabled by setting the TMR2 Match Interrupt Enable bit, TMR2IE of the PIE1 register. A range of 16 postscale options (from 1:1 through 1:16 inclusive) can be selected with the postscaler control bits, T2OUTPS<3:0>, of the T2CON register. DS41615A-page 158 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 20-1: U-0 T2CON: TIMER2 CONTROL REGISTER R/W-0/0 -- R/W-0/0 R/W-0/0 R/W-0/0 T2OUTPS<3:0> R/W-0/0 R/W-0/0 TMR2ON bit 7 R/W-0/0 T2CKPS<1:0> bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 Unimplemented: Read as `0' bit 6-3 T2OUTPS<3:0>: Timer2 Output Postscaler Select bits 0000 = 1:1 Postscaler 0001 = 1:2 Postscaler 0010 = 1:3 Postscaler 0011 = 1:4 Postscaler 0100 = 1:5 Postscaler 0101 = 1:6 Postscaler 0110 = 1:7 Postscaler 0111 = 1:8 Postscaler 1000 = 1:9 Postscaler 1001 = 1:10 Postscaler 1010 = 1:11 Postscaler 1011 = 1:12 Postscaler 1100 = 1:13 Postscaler 1101 = 1:14 Postscaler 1110 = 1:15 Postscaler 1111 = 1:16 Postscaler bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 10 = Prescaler is 16 11 = Prescaler is 64 2011 Microchip Technology Inc. Preliminary DS41615A-page 159 PIC12(L)F1501 TABLE 20-1: Name INTCON SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 66 PIE1 TMR1GIE ADIE -- -- -- -- TMR2IE TMR1IE 67 PIR1 TMR1GIF ADIF -- -- -- -- TMR2IF TMR1IF PR2 Timer2 Module Period Register 70 157* PWM1CON PWM1EN PWM1OE PWM1OUT PWM1POL -- -- -- -- 165 PWM2CON PWM2EN PWM2OE PWM2OUT PWM2POL -- -- -- -- 165 PWM3CON PWM3EN PWM3OE PWM3OUT PWM3POL -- -- -- -- 165 PWM4CON PWM4EN PWM4OE PWM4OUT PWM4POL -- -- -- -- 165 T2CON TMR2 Legend: * -- T2OUTPS<3:0> TMR2ON T2CKPS<1:0> Holding Register for the 8-bit TMR2 Count 159 157* -- = unimplemented location, read as `0'. Shaded cells are not used for Timer2 module. Page provides register information. DS41615A-page 160 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 21.0 PULSE-WIDTH MODULATION (PWM) MODULE For a step-by-step procedure on how to set up this module for PWM operation, refer to Section 21.1.9 "Setup for PWM Operation using PWMx Pins". The PWM module generates a Pulse-Width Modulated signal determined by the duty cycle, period, and resolution that are configured by the following registers: * * * * * FIGURE 21-1: PWM OUTPUT Period PR2 T2CON PWMxDCH PWMxDCL PWMxCON Pulse Width TMR2 = 0 TMR2 = PR2 TMR2 = PWMxDCH<7:0>:PWMxDCL<7:6> Figure 21-2 shows a simplified block diagram of PWM operation. Figure 21-1 shows a typical waveform of the PWM signal. FIGURE 21-2: SIMPLIFIED PWM BLOCK DIAGRAM Duty Cycle registers PWMxDCL<7:6> PWMxDCH PWMxOUT to other peripherals: CLC and CWG Latched (Not visible to user) Output Enable (PWMxOE) TRIS Control Comparator R Q 0 PWMx S Q 1 TMR2 Module TMR2 Output Polarity (PWMxPOL) (1) Comparator PR2 Note 1: Clear Timer, PWMx pin and latch Duty Cycle 8-bit timer is concatenated with the two Least Significant bits of 1/FOSC adjusted by the Timer2 prescaler to create a 10-bit time base. 2011 Microchip Technology Inc. Preliminary DS41615A-page 161 PIC12(L)F1501 21.1 PWMx Pin Configuration All PWM outputs are multiplexed with the PORT data latch. The user must configure the pins as outputs by clearing the associated TRIS bits. Note: 21.1.1 Clearing the PWMxOE bit will relinquish control of the PWMx pin. FUNDAMENTAL OPERATION The PWM module produces a 10-bit resolution output. Timer2 and PR2 set the period of the PWM. The PWMxDCL and PWMxDCH registers configure the duty cycle. The period is common to all PWM modules, whereas the duty cycle is independently controlled. Note: The Timer2 postscaler is not used in the determination of the PWM frequency. The postscaler could be used to have a servo update rate at a different frequency than the PWM output. All PWM outputs associated with Timer2 are set when TMR2 is cleared. Each PWMx is cleared when TMR2 is equal to the value specified in the corresponding PWMxDCH (8 MSb) and PWMxDCL<7:6> (2 LSb) registers. When the value is greater than or equal to PR2, the PWM output is never cleared (100% duty cycle). Note: 21.1.2 When TMR2 is equal to PR2, the following three events occur on the next increment cycle: * TMR2 is cleared * The PWM output is active. (Exception: When the PWM duty cycle = 0%, the PWM output will remain inactive.) * The PWMxDCH and PWMxDCL register values are latched into the buffers. Note: 21.1.4 Equation 21-2 is used to calculate the PWM pulse width. Equation 21-3 is used to calculate the PWM duty cycle ratio. EQUATION 21-2: T OS C (TMR2 Prescale Value) Note: TOSC = 1/FOSC EQUATION 21-3: EQUATION 21-1: PWM PERIOD DUTY CYCLE RATIO PWMxDCH:PWMxDCL<7:6> Duty Cycle Ratio = ----------------------------------------------------------------------------------4 PR2 + 1 PWM PERIOD The PWM period is specified by the PR2 register of Timer2. The PWM period can be calculated using the formula of Equation 21-1. PULSE WIDTH Pulse Width = PWMxDCH:PWMxDCL<7:6> The output polarity is inverted by setting the PWMxPOL bit of the PWMxCON register. 21.1.3 PWM DUTY CYCLE The PWM duty cycle is specified by writing a 10-bit value to the PWMxDCH and PWMxDCL register pair. The PWMxDCH register contains the eight MSbs and the PWMxDCL<7:6>, the two LSbs. The PWMxDCH and PWMxDCL registers can be written to at any time. The PWMxDCH and PWMxDCL registers are double buffered. The buffers are updated when Timer2 matches PR2. Care should be taken to update both registers before the timer match occurs. PWM OUTPUT POLARITY The Timer2 postscaler has no effect on the PWM operation. The 8-bit timer TMR2 register is concatenated with the two Least Significant bits of 1/FOSC, adjusted by the Timer2 prescaler to create the 10-bit time base. The system clock is used if the Timer2 prescaler is set to 1:1. PWM Period = PR2 + 1 4 T OSC (TMR2 Prescale Value) Note: TOSC = 1/FOSC DS41615A-page 162 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 21.1.5 PWM RESOLUTION The resolution determines the number of available duty cycles for a given period. For example, a 10-bit resolution will result in 1024 discrete duty cycles, whereas an 8-bit resolution will result in 256 discrete duty cycles. The maximum PWM resolution is 10 bits when PR2 is 255. The resolution is a function of the PR2 register value as shown by Equation 21-4. EQUATION 21-4: PWM RESOLUTION log 4 PR2 + 1 Resolution = ------------------------------------------ bits log 2 Note: If the pulse width value is greater than the period the assigned PWM pin(s) will remain unchanged. TABLE 21-1: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz) PWM Frequency 0.31 kHz Timer Prescale (1, 4, 64) PR2 Value 78.12 kHz 156.3 kHz 208.3 kHz 64 4 1 1 1 1 0xFF 0xFF 0x3F 0x1F 0x17 10 10 10 8 7 6.6 EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz) PWM Frequency 0.31 kHz Timer Prescale (1, 4, 64) PR2 Value 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz 64 4 1 1 1 1 0x65 0x65 0x65 0x19 0x0C 0x09 8 8 8 6 5 5 Maximum Resolution (bits) 21.1.6 19.53 kHz 0xFF Maximum Resolution (bits) TABLE 21-2: 4.88 kHz OPERATION IN SLEEP MODE In Sleep mode, the TMR2 register will not increment and the state of the module will not change. If the PWMx pin is driving a value, it will continue to drive that value. When the device wakes up, TMR2 will continue from its previous state. 21.1.7 CHANGES IN SYSTEM CLOCK FREQUENCY The PWM frequency is derived from the system clock frequency (FOSC). Any changes in the system clock frequency will result in changes to the PWM frequency. Refer to Section 5.0 "Oscillator Module" for additional details. 21.1.8 EFFECTS OF RESET Any Reset will force all ports to Input mode and the PWM registers to their Reset states. 2011 Microchip Technology Inc. Preliminary DS41615A-page 163 PIC12(L)F1501 21.1.9 SETUP FOR PWM OPERATION USING PWMx PINS The following steps should be taken when configuring the module for PWM operation using the PWMx pins: 1. Disable the PWMx pin output driver(s) by setting the associated TRIS bit(s). 2. Clear the PWMxCON register. 3. Load the PR2 register with the PWM period value. 4. Clear the PWMxDCH register and bits <7:6> of the PWMxDCL register. 5. Configure and start Timer2: * Clear the TMR2IF interrupt flag bit of the PIR1 register. See Note below. * Configure the T2CKPS bits of the T2CON register with the Timer2 prescale value. * Enable Timer2 by setting the TMR2ON bit of the T2CON register. 6. Enable PWM output pin and wait until Timer2 overflows, TMR2IF bit of the PIR1 register is set. See Note below. 7. Enable the PWMx pin output driver(s) by clearing the associated TRIS bit(s) and setting the PWMxOE bit of the PWMxCON register. 8. Configure the PWM module by loading the PWMxCON register with the appropriate values. Note 1: In order to send a complete duty cycle and period on the first PWM output, the above steps must be followed in the order given. If it is not critical to start with a complete PWM signal, then move Step 8 to replace Step 4. 2: For operation with other peripherals only, disable PWMx pin outputs. DS41615A-page 164 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 21.2 PWM Register Definitions REGISTER 21-1: PWMxCON: PWM CONTROL REGISTER R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 U-0 U-0 U-0 U-0 PWMxEN PWMxOE PWMxOUT PWMxPOL -- -- -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 PWMxEN: PWM Module Enable bit 1 = PWM module is enabled 0 = PWM module is disabled bit 6 PWMxOE: PWM Module Output Enable bit 1 = Output to PWMx pin is enabled 0 = Output to PWMx pin is disabled bit 5 PWMxOUT: PWM Module Output Value bit bit 4 PWMxPOL: PWMx Output Polarity Select bit 1 = PWM output is active-low 0 = PWM output is active-high bit 3-0 Unimplemented: Read as `0' 2011 Microchip Technology Inc. Preliminary DS41615A-page 165 PIC12(L)F1501 REGISTER 21-2: R/W-x/u PWMxDCH: PWM DUTY CYCLE HIGH BITS R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PWMxDCH<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-0 PWMxDCH<7:0>: PWM Duty Cycle Most Significant bits These bits are the MSbs of the PWM duty cycle. The two LSbs are found in the PWMxDCL register. REGISTER 21-3: R/W-x/u PWMxDCL: PWM DUTY CYCLE LOW BITS R/W-x/u PWMxDCL<7:6> U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-6 PWMxDCL<7:6>: PWM Duty Cycle Least Significant bits These bits are the LSbs of the PWM duty cycle. The MSbs are found in the PWMxDCH register. bit 5-0 Unimplemented: Read as `0' TABLE 21-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH PWM Bit 7 Bit 6 Bit 5 PWM1EN PWM1OE PWM1OUT PR2 Bit 3 Bit 2 Bit 1 Bit 0 -- -- -- Timer2 module Period Register PWM1CON PWM1DCH PWM1DCL PWM2CON PWM2DCL PWM3CON PWM1DCL<7:6> PWM2EN PWM2OE PWM4CON -- PWM2DCL<7:6> PWM3OE -- -- -- -- -- -- PWM2POL -- -- -- -- PWM3DCL<7:6> PWM4OE -- -- -- -- -- -- PWM3OUT PWM3POL -- -- -- -- -- -- -- -- -- -- PWM4POL -- -- -- -- PWM4DCH<7:0> PWM4DCL PWM4DCL<7:6> T2CON -- -- -- -- T2OUTPS<3:0> TMR2 -- Legend: * 1: -- TRISA5 TRISA4 -- TMR2ON --(1) 166 165 166 165 166 -- -- T2CKPS<1:0> Timer2 module Register TRISA 166 166 PWM4OUT PWM4DCH 166 166 PWM3DCH<7:0> PWM4EN 165 166 PWM2DCH<7:0> PWM3EN Register on Page 157* PWM2OUT PWM3DCH PWM3DCL PWM1POL PWM1DCH<7:0> PWM2DCH Note Bit 4 166 159 157* TRISA2 TRISA1 TRISA0 102 - = Unimplemented locations, read as `0', u = unchanged, x = unknown. Shaded cells are not used by the PWM. Page provides register information. Unimplemented, read as `1'. DS41615A-page 166 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 22.0 CONFIGURABLE LOGIC CELL (CLC) The Configurable Logic Cell (CLC) provides programmable logic that operates outside the speed limitations of software execution. The logic cell takes up to 16 input signals and through the use of configurable gates reduces the 16 inputs to four logic lines that drive one of eight selectable single-output logic functions. Input sources are a combination of the following: * * * * I/O pins Internal clocks Peripherals Register bits The output can be directed internally to peripherals and to an output pin. CLCxIN[0] CLCxIN[1] CLCxIN[2] CLCxIN[3] CLCxIN[4] CLCxIN[5] CLCxIN[6] CLCxIN[7] CLCxIN[8] CLCxIN[9] CLCxIN[10] CLCxIN[11] CLCxIN[12] CLCxIN[13] CLCxIN[14] CLCxIN[15] Possible configurations include: * Combinatorial Logic - AND - NAND - AND-OR - AND-OR-INVERT - OR-XOR - OR-XNOR * Latches - S-R - Clocked D with Set and Reset - Transparent D with Set and Reset - Clocked J-K with Reset CLCx SIMPLIFIED BLOCK DIAGRAM D Q1 Input Data Selection Gates FIGURE 22-1: Refer to Figure 22-1 for a simplified diagram showing signal flow through the CLCx. MLCxOUT LE LCxOE LCxEN lcxg1 LCxOUT Q TRIS Control lcxg2 Logic lcxg3 Function lcxq lcx_out CLCx lcxg4 LCxPOL LCxMODE<2:0> Interrupt det LCxINTP LCxINTN sets CLCxIF flag Interrupt det Note: See Figure 22-2. 2011 Microchip Technology Inc. Preliminary DS41615A-page 167 PIC12(L)F1501 22.1 CLCx Setup 22.1.1 Programming the CLCx module is performed by configuring the 4 stages in the logic signal flow. The 4 stages are: * * * * Data selection Data gating Logic function selection Output polarity Each stage is setup at run time by writing to the corresponding CLCx Special Function Registers. This has the added advantage of permitting logic reconfiguration on-the-fly during program execution. DATA SELECTION There are 16 signals available as inputs to the configurable logic. Four 8-input multiplexers are used to select the inputs to pass on to the next stage. The 16 inputs to the multiplexers are arranged in groups of four. Each group is available to two of the four multiplexers, in each case, paired with a different group. This arrangement makes possible selection of up to two from a group without precluding a selection from another group. Data inputs are selected with the CLCxSEL0 and CLCxSEL1 registers (Register 22-3 and Register 22-4, respectively). Data inputs are selected with CLCxSEL0 and CLCxSEL1 registers (Register 22-3 and Register 22-4, respectively). Data selection is through four multiplexers as indicated on the left side of Figure 22-2. Data inputs in the figure are identified by a generic numbered input name. Table 22-1 correlates the generic input name to the actual signal for each CLC module. The columns labeled lcxd1 through lcxd4 indicate the MUX output for the selected data input. D1S through D4S are abbreviations for the MUX select input codes: LCxD1S<2:0> through LCxD4S<2:0>, respectively. Selecting a data input in a column excludes all other inputs in that column. Note: TABLE 22-1: Data selections are undefined at power-up. CLCx DATA INPUT SELECTION Data Input lcxd1 D1S lcxd2 D2S lcxd3 D3S lcxd4 D4S CLC 1 CLC 2 CLCxIN[0] 000 -- -- 100 CLC1IN0 CLC2IN0 CLCxIN[1] 001 -- -- 101 CLC1IN1 CLC2IN1 CLCxIN[2] 010 -- -- 110 sync_C1OUT sync_C1OUT CLCxIN[3] 011 -- -- 111 Reserved Reserved CLCxIN[4] 100 000 -- -- FOSC FOSC CLCxIN[5] 101 001 -- -- TMR0IF TMR0IF CLCxIN[6] 110 010 -- -- TMR1IF TMR1IF CLCxIN[7] 111 011 -- -- TMR2 = PR2 TMR2 = PR2 CLCxIN[8] -- 100 000 -- lc1_out lc1_out CLCxIN[9] -- 101 001 -- lc2_out lc2_out CLCxIN[10] -- 110 010 -- Reserved Reserved CLCxIN[11] -- 111 011 -- Reserved Reserved CLCxIN[12] -- -- 100 000 NCO1OUT LFINTOSC CLCxIN[13] -- -- 101 001 HFINTOSC ADFRC CLCxIN[14] -- -- 110 010 PWM3OUT PWM1OUT CLCxIN[15] -- -- 111 011 PWM4OUT PWM2OUT DS41615A-page 168 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 22.1.2 DATA GATING Outputs from the input multiplexers are directed to the desired logic function input through the data gating stage. Each data gate can direct any combination of the four selected inputs. Note: 22.1.3 Data gating is undefined at power-up. The gate stage is more than just signal direction. The gate can be configured to direct each input signal as inverted or non-inverted data. Directed signals are ANDed together in each gate. The output of each gate can be inverted before going on to the logic function stage. The gating is in essence a 1-to-4 input AND/NAND/OR/NOR gate. When every input is inverted and the output is inverted, the gate is an OR of all enabled data inputs. When the inputs and output are not inverted, the gate is an AND or all enabled inputs. Table 22-2 summarizes the basic logic that can be obtained in gate 1 by using the gate logic select bits. The table shows the logic of four input variables, but each gate can be configured to use less than four. If no inputs are selected, the output will be zero or one, depending on the gate output polarity bit. TABLE 22-2: LCxG1POL Gate Logic 0x55 1 AND 0x55 0 NAND 0xAA 1 NOR 0xAA 0 OR 0x00 0 Logic 0 0x00 1 Logic 1 LOGIC FUNCTION There are 8 available logic functions including: * * * * * * * * AND-OR OR-XOR AND S-R Latch D Flip-Flop with Set and Reset D Flip-Flop with Reset J-K Flip-Flop with Reset Transparent Latch with Set and Reset Logic functions are shown in Figure 22-3. Each logic function has four inputs and one output. The four inputs are the four data gate outputs of the previous stage. The output is fed to the inversion stage and from there to other peripherals, an output pin, and back to the CLCx itself. 22.1.4 OUTPUT POLARITY The last stage in the configurable logic cell is the output polarity. Setting the LCxPOL bit of the CLCxCON register inverts the output signal from the logic stage. Changing the polarity while the interrupts are enabled will cause an interrupt for the resulting output transition. DATA GATING LOGIC CLCxGLS0 Data gating is indicated in the right side of Figure 22-2. Only one gate is shown in detail. The remaining three gates are configured identically with the exception that the data enables correspond to the enables for that gate. It is possible (but not recommended) to select both the true and negated values of an input. When this is done, the gate output is zero, regardless of the other inputs, but may emit logic glitches (transient-induced pulses). If the output of the channel must be zero or one, the recommended method is to set all gate bits to zero and use the gate polarity bit to set the desired level. Data gating is configured with the logic gate select registers as follows: * * * * Gate 1: CLCxGLS0 (Register 22-5) Gate 2: CLCxGLS1 (Register 22-6) Gate 3: CLCxGLS2 (Register 22-7) Gate 4: CLCxGLS3 (Register 22-8) Register number suffixes are different than the gate numbers because other variations of this module have multiple gate selections in the same register. 2011 Microchip Technology Inc. Preliminary DS41615A-page 169 PIC12(L)F1501 22.1.5 CLCx SETUP STEPS The following steps should be followed when setting up the CLCx: * Disable CLCx by clearing the LCxEN bit. * Select desired inputs using CLCxSEL0 and CLCxSEL1 registers (See Table 22-1). * Clear any associated ANSEL bits. * Set all TRIS bits associated with inputs. * Clear all TRIS bits associated with outputs. * Enable the chosen inputs through the four gates using CLCxGLS0, CLCxGLS1, CLCxGLS2, and CLCxGLS3 registers. * Select the gate output polarities with the LCxPOLy bits of the CLCxPOL register. * Select the desired logic function with the LCxMODE<2:0> bits of the CLCxCON register. * Select the desired polarity of the logic output with the LCxPOL bit of the CLCxPOL register. (This step may be combined with the previous gate output polarity step). * If driving the CLCx pin, set the LCxOE bit of the CLCxCON register and also clear the TRIS bit corresponding to that output. * If interrupts are desired, configure the following bits: - Set the LCxINTP bit in the CLCxCON register for rising event. - Set the LCxINTN bit in the CLCxCON register or falling event. - Set the CLCxIE bit of the associated PIE registers. - Set the GIE and PEIE bits of the INTCON register. * Enable the CLCx by setting the LCxEN bit of the CLCxCON register. 22.2 CLCx Interrupts An interrupt will be generated upon a change in the output value of the CLCx when the appropriate interrupt enables are set. A rising edge detector and a falling edge detector are present in each CLC for this purpose. The CLCxIF bit of the associated PIR registers, must be cleared in software as part of the interrupt service. If another edge is detected while this flag is being cleared, the flag will still be set at the end of the sequence. 22.3 Output Mirror Copies Mirror copies of all LCxCON output bits are contained in the CLCxDATA register. Reading this register reads the outputs of all CLCs simultaneously. This prevents any reading skew introduced by testing or reading the CLCxOUT bits in the individual CLCxCON registers. 22.4 Effects of a Reset The CLCxCON register is cleared to zero as the result of a Reset. All other selection and gating values remain unchanged. 22.5 Operation During Sleep The CLC module operates independently from the system clock and will continue to run during Sleep, provided that the input sources selected remain active. The HFINTOSC remains active during Sleep when the CLC module is enabled and the HFINTOSC is selected as an input source, regardless of the system clock source selected. In other words, if the HFINTOSC is simultaneously selected as the system clock and as a CLC input source, when the CLC is enabled, the CPU will go idle during Sleep, but the CLC will continue to operate and the HFINTOSC will remain active. This will have a direct effect on the Sleep mode current. 22.6 Alternate Pin Locations This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 11.1 "Alternate Pin Function" for more information. The CLCxIF bit of the associated PIR registers will be set when either edge detector is triggered and its associated enable bit is set. The LCxINTP enables rising edge interrupts and the LCxINTN bit enables falling edge interrupts. Both are located in the CLCxCON register. To fully enable the interrupt, set the following bits: * LCxON bit of the CLCxCON register * CLCxIE bit of the associated PIE registers * LCxINTP bit of the CLCxCON register (for a rising edge detection) * LCxINTN bit of the CLCxCON register (for a falling edge detection) * PEIE and GIE bits of the INTCON register DS41615A-page 170 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 22-2: CLCxIN[0] CLCxIN[1] CLCxIN[2] CLCxIN[3] CLCxIN[4] CLCxIN[5] CLCxIN[6] CLCxIN[7] INPUT DATA SELECTION AND GATING Data Selection 000 Data GATE 1 lcxd1T LCxD1G1T lcxd1N LCxD1G1N 111 LCxD2G1T LCxD1S<2:0> LCxD2G1N CLCxIN[4] CLCxIN[5] CLCxIN[6] CLCxIN[7] CLCxIN[8] CLCxIN[9] CLCxIN[10] CLCxIN[11] LCxD3G1T lcxd2T LCxD3G1N LCxD4G1T 111 LCxD4G1N 000 Data GATE 2 lcxg2 lcxd3T (Same as Data GATE 1) lcxd3N Data GATE 3 111 lcxg3 LCxD3S<2:0> CLCxIN[12] CLCxIN[13] CLCxIN[14] CLCxIN[15] CLCxIN[0] CLCxIN[1] CLCxIN[2] CLCxIN[3] LCxG1POL lcxd2N LCxD2S<2:0> CLCxIN[8] CLCxIN[9] CLCxIN[10] CLCxIN[11] CLCxIN[12] CLCxIN[13] CLCxIN[14] CLCxIN[15] lcxg1 000 (Same as Data GATE 1) Data GATE 4 000 lcxg4 (Same as Data GATE 1) lcxd4T lcxd4N 111 LCxD4S<2:0> Note: All controls are undefined at power-up. 2011 Microchip Technology Inc. Preliminary DS41615A-page 171 PIC12(L)F1501 FIGURE 22-3: PROGRAMMABLE LOGIC FUNCTIONS AND - OR OR - XOR lcxg1 lcxg1 lcxg2 lcxg2 lcxq lcxg3 lcxq lcxg3 lcxg4 lcxg4 LCxMODE<2:0>= 000 LCxMODE<2:0>= 001 4-Input AND S-R Latch lcxg1 lcxg1 lcxg2 lcxg2 lcxq lcxg3 S lcxg3 lcxg4 R lcxg4 LCxMODE<2:0>= 010 lcxq Q LCxMODE<2:0>= 011 1-Input D Flip-Flop with S and R 2-Input D Flip-Flop with R lcxg4 lcxg2 D S lcxg4 Q lcxq D lcxg2 lcxg1 lcxg1 Q lcxq R R lcxg3 lcxg3 LCxMODE<2:0>= 100 LCxMODE<2:0>= 101 J-K Flip-Flop with R 1-Input Transparent Latch with S and R lcxg4 lcxg2 J Q lcxq lcxg1 lcxg4 K R lcxg2 D lcxg1 LE lcxg3 S Q lcxq R lcxg3 LCxMODE<2:0>= 110 DS41615A-page 172 LCxMODE<2:0>= 111 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 22.7 CLCx Control Registers REGISTER 22-1: CLCxCON: CONFIGURABLE LOGIC CELL CONTROL REGISTER R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 LCxEN LCxOE LCxOUT LCxINTP LCxINTN R/W-0/0 R/W-0/0 R/W-0/0 LCxMODE<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 LCxEN: Configurable Logic Cell Enable bit 1 = Configurable logic cell is enabled and mixing input signals 0 = Configurable logic cell is disabled and has logic zero output bit 6 LCxOE: Configurable Logic Cell Output Enable bit 1 = Configurable logic cell port pin output enabled 0 = Configurable logic cell port pin output disabled bit 5 LCxOUT: Configurable Logic Cell Data Output bit Read-only: logic cell output data, after LCxPOL; sampled from lcx_out wire. bit 4 LCxINTP: Configurable Logic Cell Positive Edge Going Interrupt Enable bit 1 = CLCxIF will be set when a rising edge occurs on lcx_out 0 = CLCxIF will not be set bit 3 LCxINTN: Configurable Logic Cell Negative Edge Going Interrupt Enable bit 1 = CLCxIF will be set when a falling edge occurs on lcx_out 0 = CLCxIF will not be set bit 2-0 LCxMODE<2:0>: Configurable Logic Cell Functional Mode bits 111 = Cell is 1-input transparent latch with S and R 110 = Cell is J-K flip-flop with R 101 = Cell is 2-input D flip-flop with R 100 = Cell is 1-input D flip-flop with S and R 011 = Cell is S-R latch 010 = Cell is 4-input AND 001 = Cell is OR-XOR 000 = Cell is AND-OR 2011 Microchip Technology Inc. Preliminary DS41615A-page 173 PIC12(L)F1501 REGISTER 22-2: CLCxPOL: SIGNAL POLARITY CONTROL REGISTER R/W-0/0 U-0 U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxPOL -- -- -- LCxG4POL LCxG3POL LCxG2POL LCxG1POL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 LCxPOL: LCOUT Polarity Control bit 1 = The output of the logic cell is inverted 0 = The output of the logic cell is not inverted bit 6-4 Unimplemented: Read as `0' bit 3 LCxG4POL: Gate 4 Output Polarity Control bit 1 = The output of gate 4 is inverted when applied to the logic cell 0 = The output of gate 4 is not inverted bit 2 LCxG3POL: Gate 3 Output Polarity Control bit 1 = The output of gate 3 is inverted when applied to the logic cell 0 = The output of gate 3 is not inverted bit 1 LCxG2POL: Gate 2 Output Polarity Control bit 1 = The output of gate 2 is inverted when applied to the logic cell 0 = The output of gate 2 is not inverted bit 0 LCxG1POL: Gate 1 Output Polarity Control bit 1 = The output of gate 1 is inverted when applied to the logic cell 0 = The output of gate 1 is not inverted DS41615A-page 174 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 22-3: U-0 CLCxSEL0: MULTIPLEXER DATA 1 AND 2 SELECT REGISTER R/W-x/u -- R/W-x/u R/W-x/u LCxD2S<2:0> U-0 -- R/W-x/u R/W-x/u R/W-x/u LCxD1S<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 Unimplemented: Read as `0' bit 6-4 LCxD2S<2:0>: Input Data 2 Selection Control bits(1) 111 = CLCxIN[11] is selected for lcxd2 110 = CLCxIN[10] is selected for lcxd2 101 = CLCxIN[9] is selected for lcxd2 100 = CLCxIN[8] is selected for lcxd2 011 = CLCxIN[7] is selected for lcxd2 010 = CLCxIN[6] is selected for lcxd2 001 = CLCxIN[5] is selected for lcxd2 000 = CLCxIN[4] is selected for lcxd2 bit 3 Unimplemented: Read as `0' bit 2-0 LCxD1S<2:0>: Input Data 1 Selection Control bits(1) 111 = CLCxIN[7] is selected for lcxd1 110 = CLCxIN[6] is selected for lcxd1 101 = CLCxIN[5] is selected for lcxd1 100 = CLCxIN[4] is selected for lcxd1 011 = CLCxIN[3] is selected for lcxd1 010 = CLCxIN[2] is selected for lcxd1 001 = CLCxIN[1] is selected for lcxd1 000 = CLCxIN[0] is selected for lcxd1 Note 1: See Table 22-1 for signal names associated with inputs. 2011 Microchip Technology Inc. Preliminary DS41615A-page 175 PIC12(L)F1501 REGISTER 22-4: U-0 CLCxSEL1: MULTIPLEXER DATA 3 AND 4 SELECT REGISTER R/W-x/u -- R/W-x/u R/W-x/u LCxD4S<2:0> U-0 -- R/W-x/u R/W-x/u R/W-x/u LCxD3S<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 Unimplemented: Read as `0' bit 6-4 LCxD4S<2:0>: Input Data 4 Selection Control bits(1) 111 = CLCxIN[3] is selected for lcxd4 110 = CLCxIN[2] is selected for lcxd4 101 = CLCxIN[1] is selected for lcxd4 100 = CLCxIN[0] is selected for lcxd4 011 = CLCxIN[15] is selected for lcxd4 010 = CLCxIN[14] is selected for lcxd4 001 = CLCxIN[13] is selected for lcxd4 000 = CLCxIN[12] is selected for lcxd4 bit 3 Unimplemented: Read as `0' bit 2-0 LCxD3S<2:0>: Input Data 3 Selection Control bits(1) 111 = CLCxIN[15] is selected for lcxd3 110 = CLCxIN[14] is selected for lcxd3 101 = CLCxIN[13] is selected for lcxd3 100 = CLCxIN[12] is selected for lcxd3 011 = CLCxIN[11] is selected for lcxd3 010 = CLCxIN[10] is selected for lcxd3 001 = CLCxIN[9] is selected for lcxd3 000 = CLCxIN[8] is selected for lcxd3 Note 1: See Table 22-1 for signal names associated with inputs. DS41615A-page 176 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 22-5: CLCxGLS0: GATE 1 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG1D4T LCxG1D4N LCxG1D3T LCxG1D3N LCxG1D2T LCxG1D2N LCxG1D1T LCxG1D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 LCxG1D4T: Gate 1 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg1 0 = lcxd4T is not gated into lcxg1 bit 6 LCxG1D4N: Gate 1 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg1 0 = lcxd4N is not gated into lcxg1 bit 5 LCxG1D3T: Gate 1 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg1 0 = lcxd3T is not gated into lcxg1 bit 4 LCxG1D3N: Gate 1 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg1 0 = lcxd3N is not gated into lcxg1 bit 3 LCxG1D2T: Gate 1 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg1 0 = lcxd2T is not gated into lcxg1 bit 2 LCxG1D2N: Gate 1 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg1 0 = lcxd2N is not gated into lcxg1 bit 1 LCxG1D1T: Gate 1 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg1 0 = lcxd1T is not gated into lcxg1 bit 0 LCxG1D1N: Gate 1 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg1 0 = lcxd1N is not gated into lcxg1 2011 Microchip Technology Inc. Preliminary DS41615A-page 177 PIC12(L)F1501 REGISTER 22-6: CLCxGLS1: GATE 2 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG2D4T LCxG2D4N LCxG2D3T LCxG2D3N LCxG2D2T LCxG2D2N LCxG2D1T LCxG2D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 LCxG2D4T: Gate 2 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg2 0 = lcxd4T is not gated into lcxg2 bit 6 LCxG2D4N: Gate 2 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg2 0 = lcxd4N is not gated into lcxg2 bit 5 LCxG2D3T: Gate 2 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg2 0 = lcxd3T is not gated into lcxg2 bit 4 LCxG2D3N: Gate 2 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg2 0 = lcxd3N is not gated into lcxg2 bit 3 LCxG2D2T: Gate 2 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg2 0 = lcxd2T is not gated into lcxg2 bit 2 LCxG2D2N: Gate 2 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg2 0 = lcxd2N is not gated into lcxg2 bit 1 LCxG2D1T: Gate 2 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg2 0 = lcxd1T is not gated into lcxg2 bit 0 LCxG2D1N: Gate 2 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg2 0 = lcxd1N is not gated into lcxg2 DS41615A-page 178 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 22-7: CLCxGLS2: GATE 3 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG3D4T LCxG3D4N LCxG3D3T LCxG3D3N LCxG3D2T LCxG3D2N LCxG3D1T LCxG3D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 LCxG3D4T: Gate 3 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg3 0 = lcxd4T is not gated into lcxg3 bit 6 LCxG3D4N: Gate 3 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg3 0 = lcxd4N is not gated into lcxg3 bit 5 LCxG3D3T: Gate 3 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg3 0 = lcxd3T is not gated into lcxg3 bit 4 LCxG3D3N: Gate 3 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg3 0 = lcxd3N is not gated into lcxg3 bit 3 LCxG3D2T: Gate 3 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg3 0 = lcxd2T is not gated into lcxg3 bit 2 LCxG3D2N: Gate 3 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg3 0 = lcxd2N is not gated into lcxg3 bit 1 LCxG3D1T: Gate 3 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg3 0 = lcxd1T is not gated into lcxg3 bit 0 LCxG3D1N: Gate 3 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg3 0 = lcxd1N is not gated into lcxg3 2011 Microchip Technology Inc. Preliminary DS41615A-page 179 PIC12(L)F1501 REGISTER 22-8: CLCxGLS3: GATE 4 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG4D4T LCxG4D4N LCxG4D3T LCxG4D3N LCxG4D2T LCxG4D2N LCxG4D1T LCxG4D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 LCxG4D4T: Gate 4 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg4 0 = lcxd4T is not gated into lcxg4 bit 6 LCxG4D4N: Gate 4 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg4 0 = lcxd4N is not gated into lcxg4 bit 5 LCxG4D3T: Gate 4 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg4 0 = lcxd3T is not gated into lcxg4 bit 4 LCxG4D3N: Gate 4 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg4 0 = lcxd3N is not gated into lcxg4 bit 3 LCxG4D2T: Gate 4 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg4 0 = lcxd2T is not gated into lcxg4 bit 2 LCxG4D2N: Gate 4 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg4 0 = lcxd2N is not gated into lcxg4 bit 1 LCxG4D1T: Gate 4 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg4 0 = lcxd1T is not gated into lcxg4 bit 0 LCxG4D1N: Gate 4 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg4 0 = lcxd1N is not gated into lcxg4 DS41615A-page 180 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 22-9: CLCDATA: CLC DATA OUTPUT U-0 U-0 U-0 U-0 U-0 U-0 R-0 R-0 -- -- -- -- -- -- MLC2OUT MLC1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-2 Unimplemented: Read as `0' bit 1 MLC2OUT: Mirror copy of LC2OUT bit bit 0 MLC1OUT: Mirror copy of LC1OUT bit 2011 Microchip Technology Inc. Preliminary DS41615A-page 181 PIC12(L)F1501 TABLE 22-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH CLCx Bit7 Bit6 Bit5 Bit4 BIt3 Bit2 -- Bit1 Bit0 Register on Page CLC1SEL NCO1SEL 100 -- -- T1GSEL CLC1CON LC1EN LC1OE LC1OUT LC1INTP LC1INTN CLC2CON LC2EN LC2OE LC2OUT LC2INTP LC2INTN CLCDATA -- -- -- -- -- -- MLC2OUT MLC1OUT 177 CLC1GLS0 LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T LC1G1D1N 177 CLC1GLS1 LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T LC1G2D1N 178 CLC1GLS2 LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T LC1G3D1N 179 CLC1GLS3 LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T LC1G4D1N 180 CLC1POL LC1POL -- -- -- LC1G4POL LC1G3POL LC1G2POL LC1G1POL 174 CLC1SEL0 -- APFCON CWG1BSEL CWG1ASEL LC1D2S<2:0> LC1MODE<2:0> 173 LC2MODE<2:0> -- 173 LC1D1S<2:0> 175 CLC1SEL1 -- CLC2GLS0 LC2G1D4T LC2G1D4N LC2G1D3T LC2G1D3N LC2G1D2T LC2G1D2N LC2G1D1T LC2G1D1N 177 CLC2GLS1 LC2G2D4T LC2G2D4N LC2G2D3T LC2G2D3N LC2G2D2T LC2G2D2N LC2G2D1T LC2G2D1N 178 CLC2GLS2 LC2G3D4T LC2G3D4N LC2G3D3T LC2G3D3N LC2G3D2T LC2G3D2N LC2G3D1T LC2G3D1N 179 CLC2GLS3 LC2G4D4T LC2G4D4N LC2G4D3T LC2G4D3N LC2G4D2T LC2G4D2N LC2G4D1T LC2G4D1N 180 -- -- -- LC2G4POL LC2G3POL LC2G2POL LC2G1POL 174 LC1D4S<2:0> -- LC1D3S<2:0> 176 CLC2POL LC2POL CLC2SEL0 -- LC2D2S<2:0> -- LC2D1S<2:0> 175 CLC2SEL1 -- LC2D4S<2:0> -- LC2D3S<2:0> 176 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 66 PIE3 -- -- -- -- -- -- CLC2IE CLC1IE 69 PIR3 -- -- -- -- -- -- CLC2IF CLC1IF 72 TRISA -- -- TRISA5 TRISA4 --(1) TRISA2 TRISA1 TRISA0 102 Legend: Note 1: -- = unimplemented read as `0',. Shaded cells are not used for CLC module. Unimplemented, read as `1'. DS41615A-page 182 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 23.0 NUMERICALLY CONTROLLED OSCILLATOR (NCO) MODULE The Numerically Controlled Oscillator (NCOx) module is a timer that uses the overflow from the addition of an increment value to divide the input frequency. The advantage of the addition method over simple counter driven timer is that the resolution of division does not vary with the divider value. The NCOx is most useful for applications that require frequency accuracy and fine resolution at a fixed duty cycle. Features of the NCOx include: * * * * * * * 16-bit increment function Fixed Duty Cycle (FDC) mode Pulse Frequency (PF) mode Output pulse width control Multiple clock input sources Output polarity control Interrupt capability Figure 23-1 is a simplified block diagram of the NCOx module. 2011 Microchip Technology Inc. Preliminary DS41615A-page 183 DS41615A-page 184 Preliminary Note 1: 2 NxEN NxCKS<2:0> 00 01 10 11 20 (1) NCOx Clock 20 Accumulator 16 Buffer 16 Increment Ripple Counter NCOx Clock Overflow Q Q R Q Q S NxPWS<2:0> Reset 3 Overflow D Interrupt event NxPOL NxPFM 1 0 NUMERICALLY CONTROLLED OSCILLATOR (NCOx) MODULE SIMPLIFIED BLOCK DIAGRAM The increment registers are double-buffered to allow for value changes to be made without first disabling the NCOx module. They are shown here for reference. The buffers are not user-accessible. HFINTOSC FOSC LC1OUT NCO1CLK FIGURE 23-1: NxOE NCOxOUT NCOx TRIS Control To CLC, CWG Set NCOxIF flag PIC12(L)F1501 2011 Microchip Technology Inc. PIC12(L)F1501 23.1 NCOx OPERATION 23.1.3 ADDER The NCOx operates by repeatedly adding a fixed value to an accumulator. Additions occur at the input clock rate. The accumulator will overflow with a carry periodically, which is the raw NCOx output. This effectively reduces the input clock by the ratio of the addition value to the maximum accumulator value. See Equation 23-1. The NCOx Adder is a full adder, which operates independently from the system clock. The addition of the previous result and the increment value replaces the accumulator value on the rising edge of each input clock. The NCOx output can be further modified by stretching the pulse or toggling a flip-flop. The modified NCOx output is then distributed internally to other peripherals and optionally output to a pin. The accumulator overflow also generates an interrupt. The increment value is stored in two 8-bit registers making up a 16-bit increment. In order of LSB to MSB they are: The NCOx period changes in discrete steps to create an average frequency. This output depends on the ability of the receiving circuit (i.e., CWG or external resonant converter circuitry) to average the NCOx output to reduce uncertainty. Both of the registers are readable and writeable. The increment registers are double-buffered to allow for value changes to be made without first disabling the NCOx module. 23.1.1 NCOx CLOCK SOURCES Clock sources available to the NCOx include: * * * * HFINTOSC FOSC LCxOUT CLKIN pin 23.1.4 INCREMENT REGISTERS * NCOxINCL * NCOxINCH The buffer loads are immediate when the module is disabled. Writing to the NCOxINCH register first is necessary because then the buffer is loaded synchronously with the NCOx operation after the write is executed on the NCOxINCL register. Note: The increment buffer registers are not user-accessible. The NCOx clock source is selected by configuring the NxCKS<2:0> bits in the NCOxCLK register. 23.1.2 ACCUMULATOR The accumulator is a 20-bit register. Read and write access to the accumulator is available through three registers: * NCOxACCL * NCOxACCH * NCOxACCU EQUATION 23-1: NCO Clock Frequency Increment Value F OVERFLOW = --------------------------------------------------------------------------------------------------------------n 2 n = Accumulator width in bits 2011 Microchip Technology Inc. Preliminary DS41615A-page 185 PIC12(L)F1501 23.2 FIXED DUTY CYCLE (FDC) MODE In Fixed Duty Cycle (FDC) mode, every time the accumulator overflows, the output is toggled. This provides a 50% duty cycle, provided that the increment value remains constant. For more information, see Figure 23-2. The FDC mode is selected by clearing the NxPFM bit in the NCOxCON register. 23.3 PULSE FREQUENCY (PF) MODE In Pulse Frequency (PF) mode, every time the accumulator overflows, the output becomes active for one or more clock periods. Once the clock period expires, the output returns to an inactive state. This provides a pulsed output. The output becomes active on the rising clock edge immediately following the overflow event. For more information, see Figure 23-2. The value of the active and inactive states depends on the polarity bit, NxPOL in the NCOxCON register. The PF mode is selected by setting the NxPFM bit in the NCOxCON register. 23.3.1 OUTPUT PULSE WIDTH CONTROL When operating in PF mode, the active state of the output can vary in width by multiple clock periods. Various pulse widths are selected with the NxPWS<2:0> bits in the NCOxCLK register. When the selected pulse width is greater than the accumulator overflow time frame, the output of the NCOx operation is indeterminate. 23.4 OUTPUT POLARITY CONTROL The last stage in the NCOx module is the output polarity. The NxPOL bit in the NCOxCON register selects the output polarity. Changing the polarity while the interrupts are enabled will cause an interrupt for the resulting output transition. The NCOx output can be used internally by source code or other peripherals. Accomplish this by reading the NxOUT (read-only) bit of the NCOxCON register. DS41615A-page 186 Preliminary 2011 Microchip Technology Inc. DS41615A-page 187 Preliminary NCOx Output PF mode NCOx PWS = 010 NCOx Output PF mode NCOX PWS = 000 NCOx Output FDC mode Interrupt Event Overflow PWS = 000 NCOx Accumulator Value Accumulator Input Overflow NCOx Accumulator Input NCOx Increment Value 0000h 02000h 2000h 04000h 4000h 06000h 6000h 08000h 0C000h Tadder 0E000h 8000h A000h C000h Overflow is the MSB of the accumulator 0A000h FDC OUTPUT MODE OPERATION DIAGRAM Clock Source FIGURE 23-2: E000h 10000h Tadder 0000h Tadder_ 02000h 2000h 2000h 04000h 4000h 06000h 6000h 08000h 8000h 0A000h A000h 0C000h C000h 0E000h E000h 10000h Tadder 0000h 02000h 2000h 04000h PIC12(L)F1501 2011 Microchip Technology Inc. PIC12(L)F1501 23.5 Interrupts When the accumulator overflows, the NCOx Interrupt Flag bit, NCOxIF, of the PIRx register is set. To enable the interrupt event, the following bits must be set: * * * * NxEN bit of the NCOxCON register NCOxIE bit of the PIEx register PEIE bit of the INTCON register GIE bit of the INTCON register The interrupt must be cleared by software by clearing the NCOxIF bit in the Interrupt Service Routine. 23.6 Effects of a Reset All of the NCOx registers are cleared to zero as the result of a Reset. 23.7 Operation In Sleep The NCO module operates independently from the system clock and will continue to run during Sleep, provided that the clock source selected remains active. The HFINTOSC remains active during Sleep when the NCO module is enabled and the HFINTOSC is selected as the clock source, regardless of the system clock source selected. In other words, if the HFINTOSC is simultaneously selected as the system clock and the NCO clock source, when the NCO is enabled, the CPU will go idle during Sleep, but the NCO will continue to operate and the HFINTOSC will remain active. This will have a direct effect on the Sleep mode current. 23.8 Alternate Pin Locations This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 11.1 "Alternate Pin Function" for more information. DS41615A-page 188 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 23.9 NCOx Control Registers REGISTER 23-1: NCOxCON: NCOx CONTROL REGISTER R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 NxEN NxOE NxOUT NxPOL -- -- -- NxPFM bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 NxEN: NCOx Enable bit 1 = NCOx module is enabled 0 = NCOx module is disabled bit 6 NxOE: NCOx Output Enable bit 1 = NCOx output pin is enabled 0 = NCOx output pin is disabled bit 5 NxOUT: NCOx Output bit 1 = NCOx output is high 0 = NCOx output is low bit 4 NxPOL: NCOx Polarity bit 1 = NCOx output signal is active-high 0 = NCOx output signal is active-low bit 3-1 Unimplemented: Read as `0'. bit 0 NxPFM: NCOx Pulse Frequency Mode bit 1 = NCOx operates in Pulse Frequency mode 0 = NCOx operates in Fixed Duty Cycle mode REGISTER 23-2: R/W-0/0 NCOxCLK: NCOx INPUT CLOCK CONTROL REGISTER R/W-0/0 R/W-0/0 NxPWS<2:0> U-0 U-0 U-0 -- -- -- R/W-0/0 R/W-0/0 NxCKS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-5 NxPWS<2:0>: NCOx Output Pulse Width Select bits(1, 2) 111 = 128 NCOx clock periods 110 = 64 NCOx clock periods 101 = 32 NCOx clock periods 100 = 16 NCOx clock periods 011 = 8 NCOx clock periods 010 = 4 NCOx clock periods 001 = 2 NCOx clock periods 000 = 1 NCOx clock periods bit 4-2 Unimplemented: Read as `0' bit 1-0 NxCKS<1:0>: NCOx Clock Source Select bits 11 = NCO1CLK 10 = LC1OUT 01 = FOSC 00 = HFINTOSC (16 MHz) Note 1: NxPWS applies only when operating in Pulse Frequency mode. 2: If NCOx pulse width is greater than NCOx overflow period, operation is undeterminate. 2011 Microchip Technology Inc. Preliminary DS41615A-page 189 PIC12(L)F1501 REGISTER 23-3: R/W-0/0 NCOxACCL: NCOx ACCUMULATOR REGISTER - LOW BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 NCOxACC<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-0 NCOxACC<7:0>: NCOx Accumulator, low byte REGISTER 23-4: R/W-0/0 NCOxACCH: NCOx ACCUMULATOR REGISTER - HIGH BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 NCOxACC<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-0 NCOxACC<15:8>: NCOx Accumulator, high byte REGISTER 23-5: NCOxACCU: NCOx ACCUMULATOR REGISTER - UPPER BYTE U-0 U-0 U-0 U-0 -- -- -- -- R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 NCOxACC<19:16> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-4 Unimplemented: Read as `0' bit 3-0 NCOxACC<19:16>: NCOx Accumulator, upper byte DS41615A-page 190 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 23-6: R/W-0/0 NCOxINCL: NCOx INCREMENT REGISTER - LOW BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1 NCOxINC<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-0 NCOxINC<7:0>: NCOx Increment, low byte REGISTER 23-7: R/W-0/0 NCOxINCH: NCOx INCREMENT REGISTER - HIGH BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 NCOxINC<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7-0 NCOxINC<15:8>: NCOx Increment, high byte 2011 Microchip Technology Inc. Preliminary DS41615A-page 191 PIC12(L)F1501 TABLE 23-1: Name SUMMARY OF REGISTERS ASSOCIATED WITH NCOx Bit 7 APFCON Bit 6 CWG1BSEL CWG1ASEL INTCON GIE PEIE Bit 2 Bit 1 Bit 0 Register on Page T1GSEL -- CLC1SEL NCO1SEL 100 IOCIE TMR0IF INTF IOCIF 66 Bit 5 Bit 4 Bit 3 -- -- TMR0IE INTE NCO1ACCH NCO1ACC<15:8> 190 NCO1ACCL NCO1ACC<7:0> 190 -- NCO1ACCU NCO1CLK NCO1CON NCO1ACC<19:16> N1PWS<2:0> N1EN N1OE N1OUT NCO1INCH -- -- -- N1POL -- -- 190 N1CKS<1:0> -- N1PFM NCO1INC<15:8> NCO1INCL 189 189 191 NCO1INC<7:0> 191 PIE2 -- -- C1IE -- -- NCO1IE -- -- PIR2 -- -- C1IF -- -- NCO1IF -- -- 71 TRISA -- -- TRISA5 TRISA4 --(1) TRISA2 TRISA1 TRISA0 102 Legend: Note 1: 68 x = unknown, u = unchanged, -- = unimplemented read as `0', q = value depends on condition. Shaded cells are not used for ADC module. Unimplemented, read as `1'. DS41615A-page 192 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 24.0 COMPLEMENTARY WAVEFORM GENERATOR (CWG) MODULE The Complementary Waveform Generator (CWG) produces a complementary waveform with dead-band delay from a selection of input sources. The CWG module has the following features: * * * * * Selectable dead-band clock source control Selectable input sources Output enable control Output polarity control Dead-band control with independent 6-bit rising and falling edge dead-band counters * Auto-shutdown control with: - Selectable shutdown sources - Auto-restart enable - Auto-shutdown pin override control 2011 Microchip Technology Inc. Preliminary DS41615A-page 193 2011 Microchip Technology Inc. Preliminary 1 D Q Q Q EN 6 R CWGxDBF R = = GxPOLB GxPOLA x = CWG module number GxASE Data Bit WRITE LC2OUT GxASCLC GxARSEN Q R set dominate Q S S shutdown GxASE GxASDLB `0' R S EN 6 CWGxDBR 2 11 10 00 11 `1' Auto-Shutdown Source Input Source cwg_clock 10 `1' 00 2 `0' GxASDLA GxASDFLT async_C1OUT GxASDC1 3 1 SIMPLIFIED CWG BLOCK DIAGRAM CWG1FLT (INT pin) async_C1OUT Reserved PWM1OUT PWM2OUT PWM3OUT PWM4OUT NCO1OUT LC1OUT GxIS HFINTOSC FOSC GxCS FIGURE 24-1: GxASDLB = 01 1 0 0 1 GxASDLA = 01 TRISx TRISx CWGxB GxOEB CWGxA GxOEA PIC12(L)F1501 DS41615A-page 194 PIC12(L)F1501 FIGURE 24-2: TYPICAL CWG OPERATION WITH PWM1 (NO AUTO-SHUTDOWN) cwg_clock PWM1 CWGxA Rising Edge Dead Band Falling Edge Dead Band Rising Edge Dead Band Rising Edge D Falling Edge Dead Band CWGxB 2011 Microchip Technology Inc. Preliminary DS41615A-page 195 PIC12(L)F1501 24.1 Fundamental Operation 24.4.2 The CWG generates a two output complementary waveform from one of four selectable input sources. The off-to-on transition of each output can be delayed from the on-to-off transition of the other output, thereby, creating a time delay immediately where neither output is driven. This is referred to as dead time and is covered in Section 24.5 "Dead-Band Control". A typical operating waveform, with dead band, generated from a single input signal is shown in Figure 24-2. It may be necessary to guard against the possibility of circuit faults or a feedback event arriving too late or not at all. In this case, the active drive must be terminated before the Fault condition causes damage. This is referred to as auto-shutdown and is covered in Section 24.9 "Auto-shutdown Control". POLARITY CONTROL The polarity of each CWG output can be selected independently. When the output polarity bit is set, the corresponding output is active high. Clearing the output polarity bit configures the corresponding output as active low. However, polarity does not affect the override levels. Output polarity is selected with the GxPOLA and GxPOLB bits of the CWGxCON0 register. 24.5 Dead-Band Control Dead-band control provides for non-overlapping output signals to prevent shoot-through current in power switches. The CWG contains two 6-bit dead-band counters. One dead-band counter is used for the rising edge of the input source control. The other is used for the falling edge of the input source control. The CWG module allows the following clock sources to be selected: Dead band is timed by counting CWG clock periods from zero up to the value in the rising or falling deadband counter registers. See CWGxDBR and CWGxDBF registers (Register 24-4 and Register 24-5, respectively). * Fosc (system clock) * HFINTOSC (16 MHz only) 24.6 24.2 Clock Source The clock sources are selected using the G1CS0 bit of the CWGxCON0 register (Register 24-1). 24.3 Selectable Input Sources The CWG can generate the complementary waveform for the following input sources: * * * * * * * async_C1OUT PWM1 PWM2 PWM3 PWM4 N1OUT LC1OUT The rising edge dead band delays the turn-on of the CWGxA output from when the CWGxB output is turned off. The rising edge dead-band time starts when the rising edge of the input source signal goes true. When this happens, the CWGxB output is immediately turned off and the rising edge dead-band delay time starts. When the rising edge dead-band delay time is reached, the CWGxA output is turned on. The CWGxDBR register sets the duration of the deadband interval on the rising edge of the input source signal. This duration is from 0 to 64 counts of dead band. The input sources are selected using the GxIS<2:0> bits in the CWGxCON1 register (Register 24-2). 24.4 Rising Edge Dead Band Output Control Dead band is always counted off the edge on the input source signal. A count of 0 (zero) indicates that no dead band is present. If the input source signal is not present for enough time for the count to be completed, no output will be seen on the respective output. Immediately after the CWG module is enabled, the complementary drive is configured with both CWGxA and CWGxB drives cleared. 24.4.1 OUTPUT ENABLES Each CWG output pin has individual output enable control. Output enables are selected with the GxOEA and GxOEB bits of the CWGxCON0 register. When an output enable control is cleared, the module asserts no control over the pin. When an output enable is set, the override value or active PWM waveform is applied to the pin per the port priority selection. The output pin enables are dependent on the module enable bit, GxEN. When GxEN is cleared, CWG output enables and CWG drive levels have no effect. DS41615A-page 196 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 24.7 Falling Edge Dead Band The falling edge dead band delays the turn-on of the CWGxB output from when the CWGxA output is turned off. The falling edge dead-band time starts when the falling edge of the input source goes true. When this happens, the CWGxA output is immediately turned off and the falling edge dead-band delay time starts. When the falling edge dead-band delay time is reached, the CWGxB output is turned on. The CWGxDBF register sets the duration of the deadband interval on the falling edge of the input source signal. This duration is from 0 to 64 counts of dead band. Dead band is always counted off the edge on the input source signal. A count of 0 (zero) indicates that no dead band is present. If the input source signal is not present for enough time for the count to be completed, no output will be seen on the respective output. Refer to Figure 24-3 and Figure 24-4 for examples. 24.8 Dead-Band Uncertainty When the rising and falling edges of the input source triggers the dead-band counters, the input may be asynchronous. This will create some uncertainty in the deadband time delay. The maximum uncertainty is equal to one CWG clock period. Refer to Equation 24-1 for more detail. 2011 Microchip Technology Inc. Preliminary DS41615A-page 197 2011 Microchip Technology Inc. Preliminary CWGxB CWGxA Input Source cwg_clock FIGURE 24-4: CWGxB CWGxA Input Source cwg_clock FIGURE 24-3: source shorter than dead band DEAD-BAND OPERATION, CWGxDBR = 03H, CWGxDBF = 04H, SOURCE SHORTER THAN DEAD BAND DEAD-BAND OPERATION, CWGxDBR = 01H, CWGxDBF = 02H PIC12(L)F1501 DS41615A-page 198 PIC12(L)F1501 EQUATION 24-1: DEAD-BAND UNCERTAINTY 1 TDEADBAND_UNCERTAINTY = ----------------------------Fcwg_clock Example: Fcwg_clock = 16 MHz Therefore: 1 TDEADBAND_UNCERTAINTY = ----------------------------Fcwg_clock 1 = ------------------16 MHz = 625ns 2011 Microchip Technology Inc. Preliminary DS41615A-page 199 PIC12(L)F1501 24.9 Auto-shutdown Control 24.10 Operation During Sleep Auto-shutdown is a method to immediately override the CWG output levels with specific overrides that allow for safe shutdown of the circuit. The shutdown state can be either cleared automatically or held until cleared by software. 24.9.1 SHUTDOWN The shutdown state can be entered by either of the following two methods: * Software generated * External Input 24.9.1.1 Software Generated Shutdown Setting the GxASE bit of the CWGxCON2 register will force the CWG into the shutdown state. When auto-restart is disabled, the shutdown state will persist as long as the GxASE bit is set. When auto-restart is enabled, the GxASE bit will clear automatically and resume operation on the next rising edge event. See Figure 24-6. 24.9.1.2 External Input Source External shutdown inputs provide the fastest way to safely suspend CWG operation in the event of a Fault condition. When any of the selected shutdown inputs goes active, the CWG outputs will immediately go to the selected override levels without software delay. Any combination of two input sources can be selected to cause a shutdown condition. The sources are: The CWG module operates independently from the system clock and will continue to run during Sleep, provided that the clock and input sources selected remain active. The HFINTOSC remains active during Sleep, provided that the CWG module is enabled, the input source is active, and the HFINTOSC is selected as the clock source, regardless of the system clock source selected. In other words, if the HFINTOSC is simultaneously selected as the system clock and the CWG clock source, when the CWG is enabled and the input source is active, the CPU will go idle during Sleep, but the CWG will continue to operate and the HFINTOSC will remain active. This will have a direct effect on the Sleep mode current. 24.11 Alternate Pin Locations This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 11.1 "Alternate Pin Function" for more information. * async_C1OUT * LC2OUT * CWG1FLT Shutdown inputs are selected using the GxASDS0 and GxASDS1 bits of the CWGxCON2 register. (Register 24-3). Note: Shutdown inputs are level sensitive, not edge sensitive. The shutdown state cannot be cleared, except by disabling autoshutdown, as long as the shutdown input level persists. DS41615A-page 200 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 24.12 Configuring the CWG 24.12.1 The following steps illustrate how to properly configure the CWG to ensure a synchronous start: The levels driven to the output pins, while the shutdown input is true, are controlled by the GxASDLA and GxASDLB bits of the CWGxCON2 register (Register 24-3). GxASDLA controls the CWG1A override level and GxASDLB controls the CWG1B override level. The control bit logic level corresponds to the output logic drive level while in the shutdown state. The polarity control does not apply to the override level. 1. 2. 3. 4. 5. 6. 7. 8. 9. Ensure that the TRIS control bits corresponding to CWGxA and CWGxB are set so that both are configured as inputs. Clear the GxEN bit, if not already cleared. Set desired dead-band times with the CWGxDBR and CWGxDBF registers. Setup the following controls in CWGxCON2 auto-shutdown register: * Select desired shutdown source. * Select both output overrides to the desired levels (this is necessary even if not using auto-shutdown because start-up will be from a shutdown state). * Set the GxASE bit and clear the GxARSEN bit. Select the desired input source using the CWGxCON1 register. Configure the following controls in CWGxCON0 register: * Select desired clock source. * Select the desired output polarities. * Set the output enables for the outputs to be used. Set the GxEN bit. Clear TRIS control bits corresponding to CWGxA and CWGxB to be used to configure those pins as outputs. If auto-restart is to be used, set the GxARSEN bit and the GxASE bit will be cleared automatically. Otherwise, clear the GxASE bit to start the CWG. 2011 Microchip Technology Inc. 24.12.2 PIN OVERRIDE LEVELS AUTO-SHUTDOWN RESTART After an auto-shutdown event has occurred, there are two ways to have resume operation: * Software controlled * Auto-restart The restart method is selected with the GxARSEN bit of the CWGxCON2 register. Waveforms of software controlled and automatic restarts are shown in Figure 24-5 and Figure 24-6. 24.12.2.1 Software Controlled Restart When the GxARSEN bit of the CWGxCON2 register is cleared, the CWG must be restarted after an auto-shutdown event by software. Clearing the shutdown state requires all selected shutdown inputs to be low, otherwise the GxASE bit will remain set. The overrides will remain in effect until the first rising edge event after the GxASE bit is cleared. The CWG will then resume operation. 24.12.2.2 Auto-Restart When the GxARSEN bit of the CWGxCON2 register is set, the CWG will restart from the auto-shutdown state automatically. The GxASE bit will clear automatically when all shutdown sources go low. The overrides will remain in effect until the first rising edge event after the GxASE bit is cleared. The CWG will then resume operation. Preliminary DS41615A-page 201 2011 Microchip Technology Inc. Preliminary CWG1B CWG1A GxASE Shutdown Source CWG Input Source FIGURE 24-6: GxASE Cleared by Software Output Resumes No Shutdown Shutdown Tri-State (No Pulse) Tri-State (No Pulse) Shutdown Event Ceases Output Resumes GxASE auto-cleared by hardware SHUTDOWN FUNCTIONALITY, AUTO-RESTART ENABLED (GxARSEN = 1,GxASDLA = 01, GxASDLB = 01) Tri-State (No Pulse) CWG1B Shutdown Tri-State (No Pulse) No Shutdown Shutdown Event Ceases SHUTDOWN FUNCTIONALITY, AUTO-RESTART DISABLED (GxARSEN = 0,GxASDLA = 01, GxASDLB = 01) CWG1A GxASE Shutdown Source CWG Input Source FIGURE 24-5: PIC12(L)F1501 DS41615A-page 202 PIC12(L)F1501 24.13 CWG Control Registers REGISTER 24-1: CWGxCON0: CWG CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 GxEN GxOEB GxOEA GxPOLB GxPOLA -- -- GxCS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared q = Value depends on condition bit 7 GxEN: CWGx Enable bit 1 = Module is enabled 0 = Module is disabled bit 6 GxOEB: CWGxB Output Enable bit 1 = CWGxB is available on appropriate I/O pin 0 = CWGxB is not available on appropriate I/O pin bit 5 GxOEA: CWGxA Output Enable bit 1 = CWGxA is available on appropriate I/O pin 0 = CWGxA is not available on appropriate I/O pin bit 4 GxPOLB: CWGxB Output Polarity bit 1 = Output is inverted polarity 0 = Output is normal polarity bit 3 GxPOLA: CWGxA Output Polarity bit 1 = Output is inverted polarity 0 = Output is normal polarity bit 2-1 Unimplemented: Read as `0' bit 0 GxCS0: CWGx Clock Source bit 1 = HFINTOSC 0 = FOSC 2011 Microchip Technology Inc. Preliminary DS41615A-page 203 PIC12(L)F1501 REGISTER 24-2: R/W-x/u CWGxCON1: CWG CONTROL REGISTER 1 R/W-x/u GxASDLB<1:0> R/W-x/u R/W-x/u U-0 GxASDLA<1:0> -- R/W-0/0 R/W-0/0 R/W-0/0 GxIS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared q = Value depends on condition bit 7-6 GxASDLB<1:0>: CWGx Shutdown State for CWGxB When an auto shutdown event is present (GxASE = 1): 11 = CWGxB pin is driven to `1', regardless of the setting of the GxPOLB bit. 10 = CWGxB pin is driven to `0', regardless of the setting of the GxPOLB bit. 01 = CWGxB pin is tri-stated 00 = CWGxB pin is driven to it's inactive state after the selected dead-band interval. GxPOLB still will control the polarity of the output. bit 5-4 GxASDLA<1:0>: CWGx Shutdown State for CWGxA When an auto shutdown event is present (GxASE = 1): 11 = CWGxA pin is driven to `1', regardless of the setting of the GxPOLA bit. 10 = CWGxA pin is driven to `0', regardless of the setting of the GxPOLA bit. 01 = CWGxA pin is tri-stated 00 = CWGxA pin is driven to it's inactive state after the selected dead-band interval. GxPOLA still will control the polarity of the output. bit 3 Unimplemented: Read as `0' bit 2-0 GxIS<2:0>: CWGx Input Source Select bits 111 = LC1OUT 110 = N1OUT 101 = PWM4OUT 100 = PWM3OUT 011 = PWM2OUT 010 = PWM1OUT 001 = async_C1OUT 000 = Reserved DS41615A-page 204 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 REGISTER 24-3: CWGxCON2: CWG CONTROL REGISTER 2 R/W-0/0 R/W-0/0 G1ASE G1ARSEN U-0 -- U-0 -- U-0 R/W-0/0 R/W-0/0 R/W-0/0 -- G1ASDC1 G1ASDFLT G1ASDCLC2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared q = Value depends on condition bit 7 G1ASE: Auto-Shutdown Event Status bit 1 = An auto-shutdown event has occurred 0 = No auto-shutdown event has occurred bit 6 G1ARSEN: Auto-Restart Enable bit 1 = Auto-restart is enabled 0 = Auto-restart is disabled bit 5-3 Unimplemented: Read as `0' bit 2 G1ASDC1: CWG Auto-shutdown on Comparator 1 Enable bit 1 = Shutdown when Comparator 1 output is high 0 = Comparator 1 output has no effect on shutdown bit 1 G1ASDFLT: CWG Auto-shutdown on FLT Enable bit 1 = Shutdown when CWG1FLT in put is low 0 = CWG1FLT input has no effect on shutdown bit 0 G1ASDCLC2: CWG Auto-shutdown on CLC2 Enable bit 1 = Shutdown when LC2OUT is high 0 = LC2OUT has no effect on shutdown 2011 Microchip Technology Inc. Preliminary DS41615A-page 205 PIC12(L)F1501 REGISTER 24-4: U-0 CWGxDBR: COMPLEMENTARY WAVEFORM GENERATOR (CWGx) RISING DEAD-BAND COUNT REGISTER U-0 -- R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u CWGxDBR<5:0> -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as `0' bit 5-0 CWGxDBR<5:0>: Complementary Waveform Generator (CWGx) Rising counts 11 1111 = 63-64 counts of dead band 11 1110 = 62-63 counts of dead band 00 0010 = 2-3 counts of dead band 00 0001 = 1-2 counts of dead band 00 0000 = 0 counts of dead band REGISTER 24-5: CWGxDBF: COMPLEMENTARY WAVEFORM GENERATOR (CWGx) FALLING DEAD-BAND COUNT REGISTER U-0 U-0 -- -- R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u CWGxDBF<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as `0' bit 5-0 CWGxDBF<5:0>: Complementary Waveform Generator (CWGx) Falling counts 11 1111 = 63-64 counts of dead band 11 1110 = 62-63 counts of dead band 00 0010 = 2-3 counts of dead band 00 0001 = 1-2 counts of dead band 00 0000 = 0 counts of dead band. Dead-band generation is bypassed. DS41615A-page 206 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 24.13.1 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 11.1 "Alternate Pin Function" for more information. TABLE 24-1: Name SUMMARY OF REGISTERS ASSOCIATED WITH CWG Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA -- -- -- ANSA4 -- ANSA2 ANSA1 ANSA0 103 APFCON CWG1BSEL CWG1ASEL -- -- T1GSEL -- CLC1SEL NCO1SEL 100 G1EN G1OEB G1OEA G1POLB G1POLA -- -- G1CS0 -- -- -- G1ASDC1 CWG1CON0 CWG1CON1 CWG1CON2 CWG1DBF CWG1DBR TRISA Legend: Note 1: G1ASDLB<1:0> G1ASDLA<1:0> G1IS<1:0> 203 204 G1ASE G1ARSEN -- -- CWG1DBF<5:0> 206 -- CWG1DBR<5:0> 206 -- -- -- -- TRISA5 -- TRISA4 --(1) TRISA2 G1ASDFLT TRISA1 G1ASDCLC2 TRISA0 205 102 x = unknown, u = unchanged, - = unimplemented locations read as `0'. Shaded cells are not used by CWG. Unimplemented, read as `1'. 2011 Microchip Technology Inc. Preliminary DS41615A-page 207 PIC12(L)F1501 NOTES: DS41615A-page 208 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 25.0 IN-CIRCUIT SERIAL PROGRAMMINGTM (ICSPTM) 25.3 ICSPTM programming allows customers to manufacture circuit boards with unprogrammed devices. Programming can be done after the assembly process, allowing the device to be programmed with the most recent firmware or a custom firmware. Five pins are needed for ICSPTM programming: * ICSPCLK * ICSPDAT * MCLR/VPP * VDD * VSS Connection to a target device is typically done through an ICSPTM header. A commonly found connector on development tools is the RJ-11 in the 6P6C (6 pin, 6 connector) configuration. See Figure 25-1. FIGURE 25-1: VDD In Program/Verify mode the program memory, user IDs and the Configuration Words are programmed through serial communications. The ICSPDAT pin is a bidirectional I/O used for transferring the serial data and the ICSPCLK pin is the clock input. For more information on ICSPTM refer to the "PIC16193X/PIC16LF193X Memory Programming Specification" (DS41360). 25.1 The Low-Voltage Programming Entry mode allows the PIC(R) Flash MCUs to be programmed using VDD only, without high voltage. When the LVP bit of Configuration Words is set to `1', the low-voltage ICSP programming entry is enabled. To disable the Low-Voltage ICSP mode, the LVP bit must be programmed to `0'. ICSPDAT NC 2 4 6 ICSPCLK 1 3 5 Target VSS PC Board Bottom Side Pin Description* 1 = VPP/MCLR High-Voltage Programming Entry Mode Low-Voltage Programming Entry Mode ICD RJ-11 STYLE CONNECTOR INTERFACE VPP/MCLR 2 = VDD Target 3 = VSS (ground) 4 = ICSPDAT The device is placed into High-Voltage Programming Entry mode by holding the ICSPCLK and ICSPDAT pins low then raising the voltage on MCLR/VPP to VIHH. 25.2 Common Programming Interfaces 5 = ICSPCLK 6 = No Connect Another connector often found in use with the PICkitTM programmers is a standard 6-pin header with 0.1 inch spacing. Refer to Figure 25-2. Entry into the Low-Voltage Programming Entry mode requires the following steps: 1. 2. MCLR is brought to VIL. A 32-bit key sequence is presented on ICSPDAT, while clocking ICSPCLK. Once the key sequence is complete, MCLR must be held at VIL for as long as Program/Verify mode is to be maintained. If low-voltage programming is enabled (LVP = 1), the MCLR Reset function is automatically enabled and cannot be disabled. See Section MCLR for more information. The LVP bit can only be reprogrammed to `0' by using the High-Voltage Programming mode. 2011 Microchip Technology Inc. Preliminary DS41615A-page 209 PIC12(L)F1501 FIGURE 25-2: PICkitTM PROGRAMMER STYLE CONNECTOR INTERFACE Pin 1 Indicator Pin Description* 1 = VPP/MCLR 1 2 3 4 5 6 2 = VDD Target 3 = VSS (ground) 4 = ICSPDAT 5 = ICSPCLK 6 = No Connect * The 6-pin header (0.100" spacing) accepts 0.025" square pins. For additional interface recommendations, refer to your specific device programmer manual prior to PCB design. It is recommended that isolation devices be used to separate the programming pins from other circuitry. The type of isolation is highly dependent on the specific application and may include devices such as resistors, diodes, or even jumpers. See Figure 25-3 for more information. FIGURE 25-3: TYPICAL CONNECTION FOR ICSPTM PROGRAMMING External Programming Signals Device to be Programmed VDD VDD VDD VPP MCLR/VPP VSS VSS Data ICSPDAT Clock ICSPCLK * * * To Normal Connections * Isolation devices (as required). DS41615A-page 210 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 26.0 INSTRUCTION SET SUMMARY 26.1 Read-Modify-Write Operations * Byte Oriented * Bit Oriented * Literal and Control Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (R-M-W) operation. The register is read, the data is modified, and the result is stored according to either the instruction, or the destination designator `d'. A read operation is performed on a register even if the instruction writes to that register. The literal and control category contains the most varied instruction word format. TABLE 26-1: Each instruction is a 14-bit word containing the operation code (opcode) and all required operands. The op codes are broken into three broad categories. Table 26-3 lists the instructions recognized by the MPASMTM assembler. All instructions are executed within a single instruction cycle, with the following exceptions, which may take two or three cycles: * Subroutine takes two cycles (CALL, CALLW) * Returns from interrupts or subroutines take two cycles (RETURN, RETLW, RETFIE) * Program branching takes two cycles (GOTO, BRA, BRW, BTFSS, BTFSC, DECFSZ, INCSFZ) * One additional instruction cycle will be used when any instruction references an indirect file register and the file select register is pointing to program memory. One instruction cycle consists of 4 oscillator cycles; for an oscillator frequency of 4 MHz, this gives a nominal instruction execution rate of 1 MHz. All instruction examples use the format `0xhh' to represent a hexadecimal number, where `h' signifies a hexadecimal digit. OPCODE FIELD DESCRIPTIONS Field f Description Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don't care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. n FSR or INDF number. (0-1) mm Pre-post increment-decrement mode selection TABLE 26-2: ABBREVIATION DESCRIPTIONS Field PC Program Counter TO Time-out bit C DC Z PD 2011 Microchip Technology Inc. Description Preliminary Carry bit Digit carry bit Zero bit Power-down bit DS41615A-page 211 PIC12(L)F1501 FIGURE 26-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address Literal and control operations General 13 OPCODE 8 7 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 10 OPCODE 0 k (literal) k = 11-bit immediate value MOVLP instruction only 13 OPCODE 7 6 0 k (literal) k = 7-bit immediate value MOVLB instruction only 13 OPCODE 5 4 0 k (literal) k = 5-bit immediate value BRA instruction only 13 OPCODE 9 8 0 k (literal) k = 9-bit immediate value FSR Offset instructions 13 OPCODE 7 6 n 5 0 k (literal) n = appropriate FSR k = 6-bit immediate value FSR Increment instructions 13 OPCODE 3 2 1 0 n m (mode) n = appropriate FSR m = 2-bit mode value OPCODE only 13 0 OPCODE DS41615A-page 212 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 26-3: PIC12(L)F1501 ENHANCED INSTRUCTION SET Mnemonic, Operands Description Cycles 14-Bit Opcode MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ADDWFC ANDWF ASRF LSLF LSRF CLRF CLRW COMF DECF INCF IORWF MOVF MOVWF RLF RRF SUBWF SUBWFB SWAPF XORWF f, d f, d f, d f, d f, d f, d f - f, d f, d f, d f, d f, d f f, d f, d f, d f, d f, d f, d Add W and f Add with Carry W and f AND W with f Arithmetic Right Shift Logical Left Shift Logical Right Shift Clear f Clear W Complement f Decrement f Increment f Inclusive OR W with f Move f Move W to f Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Subtract with Borrow W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 00 11 00 11 11 11 00 00 00 00 00 00 00 00 00 00 00 11 00 00 0111 1101 0101 0111 0101 0110 0001 0001 1001 0011 1010 0100 1000 0000 1101 1100 0010 1011 1110 0110 dfff dfff dfff dfff dfff dfff lfff 0000 dfff dfff dfff dfff dfff 1fff dfff dfff dfff dfff dfff dfff ffff ffff ffff ffff ffff ffff ffff 00xx ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff C, DC, Z C, DC, Z Z C, Z C, Z C, Z Z Z Z Z Z Z Z C C C, DC, Z C, DC, Z Z 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 BYTE ORIENTED SKIP OPERATIONS DECFSZ INCFSZ f, d f, d Decrement f, Skip if 0 Increment f, Skip if 0 BCF BSF f, b f, b Bit Clear f Bit Set f 1(2) 1(2) 00 00 1, 2 1, 2 1011 dfff ffff 1111 dfff ffff BIT-ORIENTED FILE REGISTER OPERATIONS 1 1 01 01 00bb bfff ffff 01bb bfff ffff 2 2 1, 2 1, 2 BIT-ORIENTED SKIP OPERATIONS BTFSC BTFSS f, b f, b Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 (2) 1 (2) 01 01 10bb bfff ffff 11bb bfff ffff 1 1 1 1 1 1 1 1 11 11 11 00 11 11 11 11 1110 1001 1000 0000 0001 0000 1100 1010 LITERAL OPERATIONS ADDLW ANDLW IORLW MOVLB MOVLP MOVLW SUBLW XORLW k k k k k k k k Add literal and W AND literal with W Inclusive OR literal with W Move literal to BSR Move literal to PCLATH Move literal to W Subtract W from literal Exclusive OR literal with W kkkk kkkk kkkk 001k 1kkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk C, DC, Z Z Z C, DC, Z Z Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. 2011 Microchip Technology Inc. Preliminary DS41615A-page 213 PIC12(L)F1501 TABLE 26-3: PIC12(L)F1501 ENHANCED INSTRUCTION SET (CONTINUED) Mnemonic, Operands Description Cycles 14-Bit Opcode MSb LSb Status Affected Notes CONTROL OPERATIONS 2 2 2 2 2 2 2 2 BRA BRW CALL CALLW GOTO RETFIE RETLW RETURN k - k - k k k - Relative Branch Relative Branch with W Call Subroutine Call Subroutine with W Go to address Return from interrupt Return with literal in W Return from Subroutine CLRWDT NOP OPTION RESET SLEEP TRIS - - - - - f Clear Watchdog Timer No Operation Load OPTION_REG register with W Software device Reset Go into Standby mode Load TRIS register with W ADDFSR MOVIW n, k n mm MOVWI k[n] n mm Add Literal k to FSRn Move Indirect FSRn to W with pre/post inc/dec modifier, mm Move INDFn to W, Indexed Indirect. Move W to Indirect FSRn with pre/post inc/dec modifier, mm Move W to INDFn, Indexed Indirect. 11 00 10 00 10 00 11 00 001k 0000 0kkk 0000 1kkk 0000 0100 0000 kkkk 0000 kkkk 0000 kkkk 0000 kkkk 0000 kkkk 1011 kkkk 1010 kkkk 1001 kkkk 1000 00 00 00 00 00 00 0000 0000 0000 0000 0000 0000 0110 0000 0110 0000 0110 0110 0100 TO, PD 0000 0010 0001 0011 TO, PD 0fff INHERENT OPERATIONS 1 1 1 1 1 1 C-COMPILER OPTIMIZED k[n] 1 1 11 00 1 1 11 00 0001 0nkk kkkk 0000 0001 0nmm Z kkkk 1111 0nkk 1nmm Z 0000 0001 kkkk 1 11 1111 1nkk 2, 3 2 2, 3 2 Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. 3: See Table in the MOVIW and MOVWI instruction descriptions. DS41615A-page 214 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 26.2 Instruction Descriptions ADDFSR Add Literal to FSRn ANDLW AND literal with W Syntax: [ label ] ADDFSR FSRn, k Syntax: [ label ] ANDLW Operands: -32 k 31 n [ 0, 1] Operands: 0 k 255 Operation: FSR(n) + k FSR(n) Status Affected: None Description: The signed 6-bit literal `k' is added to the contents of the FSRnH:FSRnL register pair. k Operation: (W) .AND. (k) (W) Status Affected: Z Description: The contents of W register are AND'ed with the eight-bit literal `k'. The result is placed in the W register. ANDWF AND W with f Syntax: [ label ] ANDWF Operands: 0 f 127 d 0,1 FSRn is limited to the range 0000h-FFFFh. Moving beyond these bounds will cause the FSR to wrap-around. ADDLW Add literal and W Syntax: [ label ] ADDLW Operands: 0 k 255 Operation: (W) + k (W) Operation: (W) .AND. (f) (destination) Status Affected: C, DC, Z Status Affected: Z Description: The contents of the W register are added to the eight-bit literal `k' and the result is placed in the W register. Description: AND the W register with register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. ASRF Arithmetic Right Shift ADDWF Add W and f Syntax: [ label ] ASRF Syntax: [ label ] ADDWF Operands: Operands: 0 f 127 d 0,1 0 f 127 d [0,1] Operation: Operation: (W) + (f) (destination) Status Affected: C, DC, Z (f<7>) dest<7> (f<7:1>) dest<6:0>, (f<0>) C, Description: Add the contents of the W register with register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. k f,d f {,d} Status Affected: C, Z Description: The contents of register `f' are shifted one bit to the right through the Carry flag. The MSb remains unchanged. If `d' is `0', the result is placed in W. If `d' is `1', the result is stored back in register `f'. register f ADDWFC ADD W and CARRY bit to f Syntax: [ label ] ADDWFC Operands: 0 f 127 d [0,1] Operation: (W) + (f) + (C) dest Status Affected: C, DC, Z Description: Add W, the Carry flag and data memory location `f'. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed in data memory location `f'. 2011 Microchip Technology Inc. f,d C f {,d} Preliminary DS41615A-page 215 PIC12(L)F1501 BCF Bit Clear f Syntax: [ label ] BCF f,b BTFSC Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b 0 f 127 0b7 Operands: 0 f 127 0b7 Operands: Operation: 0 (f<b>) Operation: skip if (f<b>) = 0 Status Affected: None Status Affected: None Description: Bit `b' in register `f' is cleared. Description: If bit `b' in register `f' is `1', the next instruction is executed. If bit `b', in register `f', is `0', the next instruction is discarded, and a NOP is executed instead, making this a 2-cycle instruction. BRA Relative Branch BTFSS Bit Test f, Skip if Set Syntax: [ label ] BRA label [ label ] BRA $+k Syntax: [ label ] BTFSS f,b Operands: Operands: -256 label - PC + 1 255 -256 k 255 0 f 127 0b<7 Operation: skip if (f<b>) = 1 Operation: (PC) + 1 + k PC Status Affected: None Status Affected: None Description: Description: Add the signed 9-bit literal `k' to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 1 + k. This instruction is a two-cycle instruction. This branch has a limited range. If bit `b' in register `f' is `0', the next instruction is executed. If bit `b' is `1', then the next instruction is discarded and a NOP is executed instead, making this a 2-cycle instruction. BRW Relative Branch with W Syntax: [ label ] BRW Operands: None Operation: (PC) + (W) PC Status Affected: None Description: Add the contents of W (unsigned) to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 1 + (W). This instruction is a two-cycle instruction. BSF Bit Set f Syntax: [ label ] BSF Operands: 0 f 127 0b7 Operation: 1 (f<b>) Status Affected: None Description: Bit `b' in register `f' is set. DS41615A-page 216 f,b Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 CALL Call Subroutine CLRWDT Clear Watchdog Timer Syntax: [ label ] CALL k Syntax: [ label ] CLRWDT Operands: 0 k 2047 Operands: None Operation: (PC)+ 1 TOS, k PC<10:0>, (PCLATH<4:3>) PC<12:11> Operation: Status Affected: None 00h WDT 0 WDT prescaler, 1 TO 1 PD Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The eleven-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. CALLW Subroutine Call With W COMF Complement f Syntax: [ label ] CALLW Syntax: [ label ] COMF Operands: None Operands: Operation: (PC) +1 TOS, (W) PC<7:0>, (PCLATH<6:0>) PC<14:8> 0 f 127 d [0,1] Operation: (f) (destination) Status Affected: Z Description: The contents of register `f' are complemented. If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. DECF Decrement f Syntax: [ label ] DECF f,d Status Affected: None Description: Subroutine call with W. First, the return address (PC + 1) is pushed onto the return stack. Then, the contents of W is loaded into PC<7:0>, and the contents of PCLATH into PC<14:8>. CALLW is a two-cycle instruction. CLRF Clear f Syntax: [ label ] CLRF f f,d Operands: 0 f 127 Operands: Operation: 00h (f) 1Z 0 f 127 d [0,1] Operation: (f) - 1 (destination) Status Affected: Z Status Affected: Z Description: The contents of register `f' are cleared and the Z bit is set. Description: Decrement register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h (W) 1Z Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. 2011 Microchip Technology Inc. Preliminary DS41615A-page 217 PIC12(L)F1501 DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - 1 (destination); skip if result = 0 Operation: (f) + 1 (destination), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register `f' are decremented. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. If the result is `1', the next instruction is executed. If the result is `0', then a NOP is executed instead, making it a 2-cycle instruction. Description: The contents of register `f' are incremented. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. If the result is `1', the next instruction is executed. If the result is `0', a NOP is executed instead, making it a 2-cycle instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] Syntax: [ label ] GOTO k INCFSZ f,d IORLW k Operands: 0 k 2047 Operands: 0 k 255 Operation: k PC<10:0> PCLATH<4:3> PC<12:11> Operation: (W) .OR. k (W) Status Affected: Z Status Affected: None Description: Description: GOTO is an unconditional branch. The eleven-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a two-cycle instruction. The contents of the W register are OR'ed with the eight-bit literal `k'. The result is placed in the W register. INCF Increment f IORWF Inclusive OR W with f Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination) Operation: (W) .OR. (f) (destination) Status Affected: Z Status Affected: Z Description: The contents of register `f' are incremented. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. Description: Inclusive OR the W register with register `f'. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. DS41615A-page 218 INCF f,d Preliminary IORWF f,d 2011 Microchip Technology Inc. PIC12(L)F1501 LSLF Logical Left Shift f {,d} MOVF Move f Syntax: [ label ] LSLF Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f<7>) C (f<6:0>) dest<7:1> 0 dest<0> Operation: (f) (dest) Status Affected: C, Z Description: The contents of register `f' are shifted one bit to the left through the Carry flag. A `0' is shifted into the LSb. If `d' is `0', the result is placed in W. If `d' is `1', the result is stored back in register `f'. C register f 0 Status Affected: Z Description: The contents of register f is moved to a destination dependent upon the status of d. If d = 0,destination is W register. If d = 1, the destination is file register f itself. d = 1 is useful to test a file register since status flag Z is affected. Words: 1 Cycles: 1 Example: Logical Right Shift Syntax: [ label ] LSRF Operands: 0 f 127 d [0,1] Operation: 0 dest<7> (f<7:1>) dest<6:0>, (f<0>) C, Status Affected: C, Z Description: The contents of register `f' are shifted one bit to the right through the Carry flag. A `0' is shifted into the MSb. If `d' is `0', the result is placed in W. If `d' is `1', the result is stored back in register `f'. 2011 Microchip Technology Inc. f {,d} register f MOVF FSR, 0 After Instruction W = value in FSR register Z = 1 LSRF 0 MOVF f,d C Preliminary DS41615A-page 219 PIC12(L)F1501 MOVIW Move INDFn to W Syntax: [ label ] MOVIW ++FSRn [ label ] MOVIW --FSRn [ label ] MOVIW FSRn++ [ label ] MOVIW FSRn-[ label ] MOVIW k[FSRn] Operands: n [0,1] mm [00,01, 10, 11] -32 k 31 Operation: INDFn W Effective address is determined by * FSR + 1 (preincrement) * FSR - 1 (predecrement) * FSR + k (relative offset) After the Move, the FSR value will be either: * FSR + 1 (all increments) * FSR - 1 (all decrements) * Unchanged Status Affected: MOVLP Move literal to PCLATH Syntax: [ label ] MOVLP k Operands: 0 k 127 Operation: k PCLATH Status Affected: None Description: The seven-bit literal `k' is loaded into the PCLATH register. MOVLW Move literal to W Syntax: [ label ] Operands: 0 k 255 Operation: k (W) Status Affected: None Description: The eight-bit literal `k' is loaded into W register. The "don't cares" will assemble as `0's. Words: 1 1 Z Mode Syntax mm Cycles: Preincrement ++FSRn 00 Example: Predecrement --FSRn 01 Postincrement FSRn++ 10 Postdecrement FSRn-- 11 Description: Note: The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the FSRn. Syntax: [ label ] MOVLB k Operands: 0 k 15 Operation: k BSR Status Affected: None Description: The five-bit literal `k' is loaded into the Bank Select Register (BSR). DS41615A-page 220 0x5A MOVWF Move W to f Syntax: [ label ] MOVWF Operands: 0 f 127 Operation: (W) (f) 0x5A f Status Affected: None Description: Move data from W register to register `f'. Words: 1 Cycles: 1 Example: FSRn is limited to the range 0000h-FFFFh. Incrementing/decrementing it beyond these bounds will cause it to wrap-around. Move literal to BSR MOVLW After Instruction W = This instruction is used to move data between W and one of the indirect registers (INDFn). Before/after this move, the pointer (FSRn) is updated by pre/post incrementing/decrementing it. MOVLB MOVLW k Preliminary MOVWF OPTION_REG Before Instruction OPTION_REG = W = After Instruction OPTION_REG = W = 0xFF 0x4F 0x4F 0x4F 2011 Microchip Technology Inc. PIC12(L)F1501 MOVWI Move W to INDFn Syntax: [ label ] MOVWI ++FSRn [ label ] MOVWI --FSRn [ label ] MOVWI FSRn++ [ label ] MOVWI FSRn-[ label ] MOVWI k[FSRn] Operands: Operation: Status Affected: n [0,1] mm [00,01, 10, 11] -32 k 31 W INDFn Effective address is determined by * FSR + 1 (preincrement) * FSR - 1 (predecrement) * FSR + k (relative offset) After the Move, the FSR value will be either: * FSR + 1 (all increments) * FSR - 1 (all decrements) Unchanged None Mode Syntax mm Preincrement ++FSRn 00 Predecrement --FSRn 01 Postincrement FSRn++ 10 Postdecrement FSRn-- 11 Description: This instruction is used to move data between W and one of the indirect registers (INDFn). Before/after this move, the pointer (FSRn) is updated by pre/post incrementing/decrementing it. Note: The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the FSRn. NOP No Operation Syntax: [ label ] Operands: None Operation: No operation Status Affected: None Description: No operation Words: 1 Cycles: 1 Example: NOP NOP OPTION Load OPTION_REG Register with W Syntax: [ label ] OPTION Operands: None Operation: (W) OPTION_REG Status Affected: None Description: Move data from W register to OPTION_REG register. RESET Software Reset Syntax: [ label ] RESET Operands: None Operation: Execute a device Reset. Resets the nRI flag of the PCON register. Status Affected: None Description: This instruction provides a way to execute a hardware Reset by software. FSRn is limited to the range 0000h-FFFFh. Incrementing/decrementing it beyond these bounds will cause it to wrap-around. The increment/decrement operation on FSRn WILL NOT affect any Status bits. 2011 Microchip Technology Inc. Preliminary DS41615A-page 221 PIC12(L)F1501 RETFIE Return from Interrupt Syntax: [ label ] RETURN RETFIE k Return from Subroutine Syntax: [ label ] None RETURN Operands: None Operands: Operation: TOS PC, 1 GIE Operation: TOS PC Status Affected: None Status Affected: None Description: Description: Return from Interrupt. Stack is POPed and Top-of-Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a two-cycle instruction. Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. Words: 1 Cycles: 2 Example: RETFIE After Interrupt PC = GIE = TOS 1 RETLW Return with literal in W Syntax: [ label ] Operands: 0 k 255 Operation: k (W); TOS PC Status Affected: None Description: The W register is loaded with the eight bit literal `k'. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. Words: 1 Cycles: 2 Example: TABLE RETLW k Rotate Left f through Carry Syntax: [ label ] Operands: 0 f 127 d [ 0, 1] Operation: See description below Status Affected: C Description: The contents of register `f' are rotated one bit to the left through the Carry flag. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is stored back in register `f'. RLF C CALL TABLE;W contains table ;offset value * ;W now has table value * * ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; * * * RETLW kn ; End of table Before Instruction W = After Instruction W = DS41615A-page 222 RLF Words: 1 Cycles: 1 Example: RLF f,d Register f REG1,0 Before Instruction REG1 C After Instruction REG1 W C = = 1110 0110 0 = = = 1110 0110 1100 1100 1 0x07 value of k8 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 SUBLW Subtract W from literal Syntax: [ label ] RRF Rotate Right f through Carry Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: See description below Status Affected: C, DC, Z Status Affected: C Description: Description: The contents of register `f' are rotated one bit to the right through the Carry flag. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. The W register is subtracted (2's complement method) from the eight-bit literal `k'. The result is placed in the W register. RRF f,d C SUBLW k Operands: 0 k 255 Operation: k - (W) W) Register f C=0 Wk C=1 Wk DC = 0 W<3:0> k<3:0> DC = 1 W<3:0> k<3:0> SLEEP Enter Sleep mode SUBWF Subtract W from f Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: (f) - (W) destination) Status Affected: C, DC, Z Description: Subtract (2's complement method) W register from register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f. SLEEP Operands: None Operation: 00h WDT, 0 WDT prescaler, 1 TO, 0 PD Status Affected: TO, PD Description: The power-down Status bit, PD is cleared. Time-out Status bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. 2011 Microchip Technology Inc. SUBWF f,d C=0 Wf C=1 Wf DC = 0 W<3:0> f<3:0> DC = 1 W<3:0> f<3:0> SUBWFB Subtract W from f with Borrow Syntax: SUBWFB Operands: 0 f 127 d [0,1] Operation: (f) - (W) - (B) dest f {,d} Status Affected: C, DC, Z Description: Subtract W and the BORROW flag (CARRY) from register `f' (2's complement method). If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. Preliminary DS41615A-page 223 PIC12(L)F1501 SWAPF Swap Nibbles in f XORLW Exclusive OR literal with W Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: SWAPF f,d (f<3:0>) (destination<7:4>), (f<7:4>) (destination<3:0>) XORLW k Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR'ed with the eight-bit literal `k'. The result is placed in the W register. Status Affected: None Description: The upper and lower nibbles of register `f' are exchanged. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed in register `f'. TRIS Load TRIS Register with W XORWF Exclusive OR W with f Syntax: [ label ] TRIS f Syntax: [ label ] Operands: 5f7 Operands: Operation: (W) TRIS register `f' 0 f 127 d [0,1] Status Affected: None Operation: (W) .XOR. (f) destination) Status Affected: Z Description: Exclusive OR the contents of the W register with register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. Description: DS41615A-page 224 Move data from W register to TRIS register. When `f' = 5, TRISA is loaded. When `f' = 6, TRISB is loaded. When `f' = 7, TRISC is loaded. Preliminary XORWF f,d 2011 Microchip Technology Inc. PIC12(L)F1501 27.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings() Ambient temperature under bias....................................................................................................... -40C to +125C Storage temperature ........................................................................................................................ -65C to +150C Voltage on VDD with respect to VSS, PIC12F1501 ............................................................................. -0.3V to +6.5V Voltage on VDD with respect to VSS, PIC12LF1501 ........................................................................... -0.3V to +4.0V Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V) Total power dissipation(1) ............................................................................................................................... 800 mW Maximum current out of VSS pin, -40C TA +85C for industrial............................................................... 210 mA Maximum current out of VSS pin, -40C TA +125C for extended .............................................................. 95 mA Maximum current into VDD pin, -40C TA +85C for industrial.................................................................. 150 mA Maximum current into VDD pin, -40C TA +125C for extended ................................................................. 70 mA Clamp current, IK (VPIN < 0 or VPIN > VDD) 20 mA Maximum output current sunk by any I/O pin.................................................................................................... 25 mA Maximum output current sourced by any I/O pin .............................................................................................. 25 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOl x IOL). NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. 2011 Microchip Technology Inc. Preliminary DS41615A-page 225 PIC12(L)F1501 PIC12F1501 VOLTAGE FREQUENCY GRAPH, -40C TA +125C FIGURE 27-1: VDD (V) 5.5 2.5 2.3 4 0 10 16 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 27-1 for each Oscillator mode's supported frequencies. PIC12LF1501 VOLTAGE FREQUENCY GRAPH, -40C TA +125C VDD (V) FIGURE 27-2: 3.6 2.5 1.8 0 4 10 16 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 27-1 for each Oscillator mode's supported frequencies. DS41615A-page 226 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 27.1 DC Characteristics: PIC12(L)F1501-I/E (Industrial, Extended) PIC12LF1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended PIC12F1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended Param. No. D001 Sym. VDD Characteristic VDR Units Conditions PIC12LF1501 1.8 2.5 -- -- 3.6 3.6 V V FOSC 16 MHz: FOSC 20 MHz PIC12F1501 2.3 2.5 -- -- 5.5 5.5 V V FOSC 16 MHz: FOSC 20 MHz PIC12LF1501 1.5 -- -- V Device in Sleep mode PIC12F1501 1.65 -- -- V Device in Sleep mode PIC12LF1501 -- 1.6 -- V PIC12F1501 -- 1.7 -- V PIC12LF1501 -- 0.8 -- V PIC12F1501 -- 1.7 -- V Power-on Reset Release Voltage D002A* D002B* VPORR* Max. RAM Data Retention Voltage(1) D002* D002A* VPOR* Typ Supply Voltage D001 D002* Min. Power-on Reset Rearm Voltage D002B* D003 VADFVR Fixed Voltage Reference Voltage for ADC, Initial Accuracy -- -- -- -- -- -- 1 1 1 1 1 1 -- -- -- -- -- -- % D003C* TCVFVR Temperature Coefficient, Fixed Voltage Reference -- -130 -- ppm/C D003D* VFVR/ VIN Line Regulation, Fixed Voltage Reference -- 0.270 -- %/V D004* SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 -- -- V/ms 1.024V, VDD 2.5V, 85C (NOTE 2) 1.024V, VDD 2.5V, 125C (NOTE 2) 2.048V, VDD 2.5V, 85C 2.048V, VDD 2.5V, 125C 4.096V, VDD 4.75V, 85C 4.096V, VDD 4.75V, 125C See Section 6.1 "Power-on Reset (POR)" for details. * Note These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 2: For proper operation, the minimum value of the ADC positive voltage reference must be 1.8V or greater. When selecting the FVR or the VREF+ pin as the source of the ADC positive voltage reference, be aware that the voltage must be 1.8V or greater. 2011 Microchip Technology Inc. Preliminary DS41615A-page 227 PIC12(L)F1501 FIGURE 27-3: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR VSS NPOR POR REARM VSS TVLOW(2) Note 1: 2: 3: DS41615A-page 228 TPOR(3) When NPOR is low, the device is held in Reset. TPOR 1 s typical. TVLOW 2.7 s typical. Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 27.2 DC Characteristics: PIC12(L)F1501-I/E (Industrial, Extended) PIC12LF1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended PIC12F1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended Param No. Device Characteristics Conditions Min. Typ Max. Units -- 25 140 A 1.8 -- 45 230 A 3.0 -- 60 180 A 2.3 -- 80 240 A 3.0 -- 100 320 A 5.0 -- 100 250 A 1.8 -- 180 430 A 3.0 -- 160 275 A 2.3 -- 210 450 A 3.0 -- 260 650 A 5.0 -- 2.5 18 A 1.8 -- 4.0 20 A 3.0 -- 14 58 A 2.3 -- 15 65 A 3.0 Note VDD Supply Current (IDD)(1, 2) D013 D013 D014 D014 D015 D015 D017* D017* D018 D018 -- 16 70 A 5.0 -- 0.40 0.70 mA 1.8 -- 0.60 1.10 mA 3.0 -- 0.50 0.75 mA 2.3 -- 0.60 1.15 mA 3.0 -- 0.70 1.35 mA 5.0 -- 0.60 1.2 mA 1.8 -- 1.0 1.75 mA 3.0 -- 0.74 1.2 mA 2.3 -- 0.96 1.8 mA 3.0 -- 1.03 2.0 mA 5.0 -- 6 17 A 1.8 -- 8 20 A 3.0 D019A -- 14 25 A 3.0 -- 15 30 A 5.0 D019B -- 15 165 A 1.8 -- 20 190 A 3.0 D019A FOSC = 1 MHz EC Oscillator mode, Medium-power mode FOSC = 1 MHz EC Oscillator mode Medium-power mode FOSC = 4 MHz EC Oscillator mode, Medium-power mode FOSC = 4 MHz EC Oscillator mode Medium-power mode FOSC = 31 kHz LFINTOSC mode FOSC = 31 kHz LFINTOSC mode FOSC = 8 MHz HFINTOSC mode FOSC = 8 MHz HFINTOSC mode FOSC = 16 MHz HFINTOSC mode FOSC = 16 MHz HFINTOSC mode FOSC = 32 kHz ECL mode FOSC = 32 kHz ECL mode FOSC = 500 kHz ECM mode * These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: CLKIN = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 2011 Microchip Technology Inc. Preliminary DS41615A-page 229 PIC12(L)F1501 27.2 DC Characteristics: PIC12(L)F1501-I/E (Industrial, Extended) (Continued) PIC12LF1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended PIC12F1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended Param No. Device Characteristics Conditions Min. Typ Max. Units -- 34 210 A 3.0 -- 37 270 A 5.0 D019C -- 0.65 -- mA 3.0 FOSC = 20 MHz ECH mode D019C -- 0.75 -- mA 3.0 -- 0.87 -- mA 5.0 FOSC = 20 MHz ECH mode VDD Note Supply Current (IDD)(1, 2) D019B FOSC = 500 kHz ECM mode * These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: CLKIN = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. DS41615A-page 230 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 27.3 DC Characteristics: PIC12(L)F1501-I/E (Power-Down) PIC12LF1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended PIC12F1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended Param No. Device Characteristics Power-down Base Current D022 D022 D023 D023 D023A D023A Conditions Typ Max. +85C Max. +125C Units -- .02 1.0 2.4 A -- .03 1.1 3.0 A 3.0 -- 10 35 40 A 2.3 -- 11 42 48 A 3.0 -- 12 45 61 A 5.0 -- 0.2 1.5 2.4 A 1.8 -- 0.5 2.0 3.0 A 3.0 -- 11 38 44 A 2.3 -- 12 43 48 A 3.0 Min. VDD Note (IPD)(2) 1.8 -- 13 48 65 A 5.0 -- 13 22 25 A 1.8 -- 22 24 27 A 3.0 -- 23 62 65 A 2.3 -- 30 72 75 A 3.0 WDT, BOR, FVR, and T1OSC disabled, all Peripherals Inactive WDT, BOR, FVR, and T1OSC disabled, all Peripherals Inactive LPWDT Current (Note 1) LPWDT Current (Note 1) FVR current (Note 1) FVR current (Note 1) -- 34 115 120 A 5.0 D024 -- 7 14 16 A 3.0 BOR Current (Note 1) D024 -- 15 47 50 A 3.0 BOR Current (Note 1) -- 17 55 66 A 5.0 D024A -- 0.2 5 7 A 3.0 LPBOR Current D024A -- 10 25 40 A 3.0 LPBOR Current -- 12 30 50 A 5.0 -- 0.03 3.5 4.0 A 1.8 -- 0.04 4.0 4.5 A 3.0 -- 10 39 45 A 2.3 -- 11 43 49 A 3.0 -- 12 46 65 A 5.0 -- 250 1.5 3.0 A 1.8 -- 250 2.0 3.5 A 3.0 -- 280 38 45 A 2.3 -- 280 43 49 A 3.0 -- 280 46 65 A 5.0 D026 D026 D026A* D026A* * Legend: Note 1: 2: 3: A/D Current (Note 1, Note 3), no conversion in progress A/D Current (Note 1, Note 3), no conversion in progress A/D Current (Note 1, Note 3), conversion in progress A/D Current (Note 1, Note 3), conversion in progress These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. TBD = To Be Determined The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. A/D oscillator source is FRC. 2011 Microchip Technology Inc. Preliminary DS41615A-page 231 PIC12(L)F1501 27.3 DC Characteristics: PIC12(L)F1501-I/E (Power-Down) (Continued) PIC12LF1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended PIC12F1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended Param No. Device Characteristics Max. +85C Max. +125C Units -- 20 43 55 A 1.8 -- 21 45 60 A 3.0 -- 30 53 65 A 2.3 -- 31 57 70 A 3.0 Power-down Base Current (IPD) D027* D027* D027A* D027A* D028* D028* D028A* D028A* * Legend: Note 1: 2: 3: Conditions Typ Min. VDD Note (2) -- 32 61 75 A 5.0 -- 7 20 35 A 1.8 -- 80 25 40 A 3.0 -- 17 30 45 A 2.3 -- 18 37 55 A 3.0 -- 19 40 60 A 5.0 -- 21 44 56 A 1.8 -- 22 46 61 A 3.0 -- 31 54 66 A 2.3 -- 32 58 71 A 3.0 -- 33 62 76 A 5.0 -- 8 21 36 A 1.8 -- 81 26 41 A 3.0 -- 18 31 46 A 2.3 -- 19 38 56 A 3.0 -- 20 41 61 A 5.0 1 Comparator Enabled (HP Mode) 1 Comparator Enabled (HP Mode) 1 Comparator Enabled (LP Mode) 1 Comparator Enabled (LP Mode) 2 Comparators Enabled (HP Mode) 2 Comparators Enabled (HP Mode) 2 Comparators Enabled (LP Mode) 2 Comparators Enabled (LP Mode) These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. TBD = To Be Determined The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. A/D oscillator source is FRC. DS41615A-page 232 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 27.3 DC Characteristics: PIC12(L)F1501-I/E (Power-Down) (Continued) PIC12LF1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended PIC12F1501 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended Param No. Device Characteristics Min. Typ Max. +85C Power-down Base Current (IPD) in Low-Power Sleep D029A -- D029B -- D029C -- D029D -- D029E -- * Legend: Note 1: 2: 3: Max. +125C Units Conditions Note VDD mode(2) 0.1 1.5 2.0 A 2.3 0.2 1.7 2.3 A 3.0 0.3 1.9 2.5 A 5.0 18 40 45 A 2.3 18.5 45 50 A 3.0 19 47 52 A 5.0 8.0 20 25 A 3.0 9.5 24 30 A 5.0 3.2 13 18 A 2.3 3.5 14 19 A 3.0 3.6 15 20 A 5.0 17.0 40 45 A 2.3 17.5 42 47 A 3.0 18.0 43 48 A 5.0 Base FVR Enabled BOR Enabled Comparator Enabled (LP mode) Comparator Enabled (HP mode) These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. TBD = To Be Determined The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. A/D oscillator source is FRC. 2011 Microchip Technology Inc. Preliminary DS41615A-page 233 PIC12(L)F1501 27.4 DC Characteristics: PIC12(L)F1501-I/E DC CHARACTERISTICS Param No. Sym. VIL Characteristic Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended Min. Typ Max. Units Conditions Input Low Voltage I/O PORT: D030 with TTL buffer D030A D031 with Schmitt Trigger buffer D032 MCLR VIH -- -- 0.8 V 4.5V VDD 5.5V -- -- 0.15 VDD V 1.8V VDD 4.5V -- -- 0.2 VDD V 2.0V VDD 5.5V -- -- 0.2 VDD V -- -- Input High Voltage I/O ports: D040 with TTL buffer D040A D041 with Schmitt Trigger buffer D042 MCLR IIL 2.0 -- -- V 4.5V VDD 5.5V 0.25 VDD + 0.8 -- -- V 1.8V VDD 4.5V 2.0V VDD 5.5V 0.8 VDD -- -- V 0.8 VDD -- -- V nA Input Leakage Current(1) D060 I/O ports -- 5 125 5 1000 nA VSS VPIN VDD, Pin at highimpedance at 85C 125C D061 MCLR(2) -- 50 200 nA VSS VPIN VDD at 85C 25 25 100 140 200 300 A VDD = 3.3V, VPIN = VSS VDD = 5.0V, VPIN = VSS -- -- 0.6 V IOL = 8mA, VDD = 5V IOL = 6mA, VDD = 3.3V IOL = 1.8mA, VDD = 1.8V VDD - 0.7 -- -- V IOH = 3.5mA, VDD = 5V IOH = 3mA, VDD = 3.3V IOH = 1mA, VDD = 1.8V -- 50 pF IPUR Weak Pull-up Current D070* VOL D080 Output Low Voltage(3) I/O ports VOH D090 Output High Voltage(3) I/O ports Capacitive Loading Specs on Output Pins D101A* CIO All I/O pins -- * These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Negative current is defined as current sourced by the pin. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Including OSC2 in CLKOUT mode. DS41615A-page 234 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 27.5 Memory Programming Requirements Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C DC CHARACTERISTICS Param No. Sym. Characteristic Min. Typ Max. Units Conditions Program Memory Programming Specifications D110 VIHH Voltage on MCLR/VPP pin 8.0 -- 9.0 V D111 IDDP Supply Current during Programming -- -- 10 mA D112 VBE VDD for Bulk Erase 2.7 -- VDD max. V D113 VPEW VDD for Write or Row Erase VDD min. -- VDD max. V D114 IPPPGM Current on MCLR/VPP during Erase/ Write -- 1.0 -- mA D115 IDDPGM Current on VDD during Erase/Write -- 5.0 -- mA 10K -- -- E/W (Note 2) Program Flash Memory D121 EP Cell Endurance -40C to +85C (Note 1) D122 VPR VDD for Read VDD min. -- VDD max. V D123 TIW Self-timed Write Cycle Time -- 2 2.5 ms D124 TRETD Characteristic Retention -- 40 -- Year Provided no other specifications are violated D125 EHEFC High-Endurance Flash Cell 100K -- -- E/W 0C to +60C, Lower byte, Last 128 Addresses in Flash Memory Note 1: 2: Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Self-write and Block Erase. Required only if single-supply programming is disabled. 2011 Microchip Technology Inc. Preliminary DS41615A-page 235 PIC12(L)F1501 27.6 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Param No. TH01 TH02 TH03 TH04 TH05 Sym. Characteristic JA Thermal Resistance Junction to Ambient JC TJMAX PD Thermal Resistance Junction to Case Maximum Junction Temperature Power Dissipation PINTERNAL Internal Power Dissipation Typ. Units Conditions 89.3 C/W 8-pin PDIP package 149.5 C/W 8-pin SOIC package 211 C/W 8-pin MSOP package 56.7 C/W 8-pin DFN 3X3mm package 68 C/W 8-pin DFN 2X3mm package 43.1 C/W 8-pin PDIP package 39.9 C/W 8-pin SOIC package 39 C/W 8-pin MSOP package 9 C/W 8-pin DFN 3X3mm package 12.7 C/W 8-pin DFN 2X3mm package 150 C -- W PD = PINTERNAL + PI/O -- W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation -- W PI/O = (IOL * VOL) + (IOH * (VDD - VOH)) TH07 PDER Derated Power -- W PDER = PDMAX (TJ - TA)/JA(2) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature. 3: TJ = Junction Temperature. DS41615A-page 236 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 27.7 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDIx do SDO dt Data in io I/O PORT mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-impedance) L Low FIGURE 27-4: T Time osc rd rw sc ss t0 t1 wr CLKIN RD RD or WR SCKx SS T0CKI T1CKI WR P R V Z Period Rise Valid High-impedance LOAD CONDITIONS Load Condition Pin CL VSS Legend: CL = 50 pF for all pins 2011 Microchip Technology Inc. Preliminary DS41615A-page 237 PIC12(L)F1501 27.8 AC Characteristics: PIC12(L)F1501-I/E FIGURE 27-5: CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 CLKIN OS12 OS02 OS11 OS03 CLKOUT (CLKOUT Mode) Note 1: See Table 27-3. TABLE 27-1: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Param No. OS01 Sym. FOSC Characteristic External CLKIN Frequency(1) Min. Typ Max. Units Conditions DC -- 0.5 MHz EC Oscillator mode (low) DC -- 4 MHz EC Oscillator mode (medium) EC Oscillator mode (high) DC -- 20 MHz OS02 TOSC External CLKIN Period(1) 50 -- ns EC mode OS03 TCY Instruction Cycle Time(1) 200 -- DC ns TCY = FOSC/4 * These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min" values with an external clock applied to CLKIN pin. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. TABLE 27-2: OSCILLATOR PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40C TA +125C Param No. Sym. Characteristic Freq. Tolerance Min. Typ Max. Units Conditions OS08 HFOSC Internal Calibrated HFINTOSC Frequency(1) 10% -- 16.0 -- MHz 0C TA +85C OS09 LFOSC Internal LFINTOSC Frequency -- -- 31 -- kHz -40C TA +125C OS10* TIOSC ST HFINTOSC Wake-up from Sleep Start-up Time -- -- 5 8 s * These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. DS41615A-page 238 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 FIGURE 27-6: CLKOUT AND I/O TIMING Cycle Write Fetch Read Execute Q4 Q1 Q2 Q3 FOSC OS12 OS11 OS20 OS21 CLKOUT OS19 OS18 OS16 OS13 OS17 I/O pin (Input) OS14 OS15 I/O pin (Output) New Value Old Value OS18, OS19 TABLE 27-3: CLKOUT AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40C TA +125C Param No. OS11 OS12 Sym. TosH2ckL Characteristic Min. Typ Max. Units Conditions FOSC to CLKOUT (1) -- -- 70 ns VDD = 3.3-5.0V (1) -- -- 72 ns VDD = 3.3-5.0V TosH2ckH FOSC to CLKOUT valid(1) OS13 TckL2ioV CLKOUT to Port out OS14 OS15 OS16 TioV2ckH TosH2ioV TosH2ioI OS17 TioV2osH OS18* TioR Port input valid before CLKOUT(1) Fosc (Q1 cycle) to Port out valid Fosc (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to Fosc(Q2 cycle) (I/O in setup time) Port output rise time(2) OS19* TioF Port output fall time(2) -- -- 20 ns TOSC + 200 ns -- 50 -- 50 -- -- 70* -- ns ns ns 20 -- -- ns -- -- -- -- 25 25 15 40 28 15 -- -- 32 72 55 30 -- -- ns OS20* Tinp OS21* Tioc INT pin input high or low time Interrupt-on-change new input level time * These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. Note 1: Measurements are taken in EC mode where CLKOUT output is 4 x TOSC. 2011 Microchip Technology Inc. Preliminary ns VDD = 3.3-5.0V VDD = 3.3-5.0V VDD = 2.0V VDD = 5.0V VDD = 2.0V VDD = 5.0V ns ns DS41615A-page 239 PIC12(L)F1501 FIGURE 27-7: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out Internal Reset(1) Watchdog Timer Reset(1) 31 34 34 I/O pins Note 1: Asserted low. FIGURE 27-8: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR and VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset 33(1) (due to BOR) Note 1: 64 ms delay only if PWRTE bit in the Configuration Words is programmed to `0'. 2 ms delay if PWRTE = 0 and VREGEN = 1. DS41615A-page 240 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 27-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40C TA +125C Param No. Sym. Characteristic Min. Typ Max. Units Conditions 2 5 -- -- -- -- s s VDD = 3.3-5V, -40C to +85C VDD = 3.3-5V 10 16 27 ms VDD = 3.3V-5V, 1:16 Prescaler used 30 TMCL MCLR Pulse Width (low) 31 TWDTLP Low-Power Watchdog Timer Time-out Period 33* TPWRT Power-up Timer Period, PWRTE = 0 40 65 140 ms 34* TIOZ I/O high-impedance from MCLR Low or Watchdog Timer Reset -- -- 2.0 s 35 VBOR Brown-out Reset Voltage: BORV = 0 2.55 2.70 2.85 V PIC12(L)F1501 BORV = 1 2.30 1.80 2.40 1.90 2.55 2.05 V V PIC12F1501 PIC12LF1501 0 25 50 mV -40C to +85C 1 3 5 s VDD VBOR Brown-out Reset Hysteresis 36* VHYST 37* TBORDC Brown-out Reset DC Response Time * These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. FIGURE 27-9: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 T1CKI 45 46 47 49 TMR0 or TMR1 2011 Microchip Technology Inc. Preliminary DS41615A-page 241 PIC12(L)F1501 TABLE 27-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40C TA +125C Param No. 40* Sym. Characteristic TT0H T0CKI High Pulse Width Min. No Prescaler TT0L T0CKI Low Pulse Width No Prescaler TT0P T0CKI Period 45* TT1H T1CKI High Synchronous, No Prescaler Time Synchronous, with Prescaler -- -- ns -- -- ns 0.5 TCY + 20 -- -- ns 10 -- -- ns Greater of: 20 or TCY + 40 N -- -- ns 0.5 TCY + 20 -- -- ns 15 -- -- ns Asynchronous 46* TT1L T1CKI Low Time Units 10 With Prescaler 42* Max. 0.5 TCY + 20 With Prescaler 41* Typ 30 -- -- ns Synchronous, No Prescaler 0.5 TCY + 20 -- -- ns Synchronous, with Prescaler 15 -- -- ns Asynchronous 30 -- -- ns Greater of: 30 or TCY + 40 N -- -- ns 47* TT1P 49* TCKEZTMR1 Delay from External Clock Edge to Timer Increment T1CKI Input Synchronous Period Asynchronous 60 -- -- ns 2 TOSC -- 7 TOSC -- Conditions N = prescale value (2, 4, ..., 256) N = prescale value (1, 2, 4, 8) Timers in Sync mode * These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: For proper operation, the minimum value of the ADC positive voltage reference must be 1.8V or greater. When selecting the FVR or the VREF+ pin as the source of the ADC positive voltage reference, be aware that the voltage must be 1.8V or greater. TABLE 27-6: PIC12(L)F1501 A/D CONVERTER (ADC) CHARACTERISTICS: Standard Operating Conditions (unless otherwise stated) Operating temperature Tested at 25C Param Sym. No. Characteristic Min. Typ Max. Units Conditions AD01 NR Resolution -- -- 10 AD02 EIL Integral Error -- -- 1.7 AD03 EDL Differential Error -- -- 1 AD04 EOFF Offset Error -- -- 2.5 LSb VREF = 3.0V AD05 EGN -- -- 2.0 LSb VREF = 3.0V AD06 VREF Reference Voltage(3) 1.8 -- VDD V AD07 VAIN Full-Scale Range VSS -- VREF V AD08 ZAIN Recommended Impedance of Analog Voltage Source -- -- 10 k * Note 1: 2: 3: 4: 5: Gain Error bit LSb VREF = 3.0V LSb No missing codes VREF = 3.0V VREF = (VREF+ minus VREF-) (NOTE 5) Can go higher if external 0.01F capacitor is present on input pin. These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Total Absolute Error includes integral, differential, offset and gain errors. The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. ADC VREF is from external VREF+ pin, VDD pin, whichever is selected as reference input. When ADC is off, it will not consume any current other than leakage current. The power-down current specification includes any such leakage from the ADC module. FVR voltage selected must be 2.048V or 4.096V. DS41615A-page 242 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 27-7: PIC12(L)F1501 A/D CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Param No. Sym. Characteristic AD130* TAD AD131 TCNV AD132* TACQ Min. Typ Max. Units Conditions A/D Clock Period 1.0 -- 9.0 s TOSC-based A/D Internal FRC Oscillator Period 1.0 1.6 6.0 s ADCS<1:0> = 11 (ADFRC mode) Conversion Time (not including Acquisition Time)(1) -- 11 -- TAD Set GO/DONE bit to conversion complete Acquisition Time -- 5.0 -- s * These parameters are characterized but not tested. Data in "Typ" column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The ADRES register may be read on the following TCY cycle. FIGURE 27-10: PIC12(L)F1501 A/D CONVERSION TIMING (NORMAL MODE) BSF ADCON0, GO AD134 1 TCY (TOSC/2(1)) AD131 Q4 AD130 A/D CLK 9 A/D Data 8 7 6 3 OLD_DATA ADRES 1 0 NEW_DATA 1 TCY ADIF GO Sample 2 DONE AD132 Sampling Stopped Note 1: If the A/D clock source is selected as FRC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 2011 Microchip Technology Inc. Preliminary DS41615A-page 243 PIC12(L)F1501 FIGURE 27-11: PIC12(L)F1501 A/D CONVERSION TIMING (SLEEP MODE) BSF ADCON0, GO AD134 (TOSC/2 + TCY(1)) 1 TCY AD131 Q4 AD130 A/D CLK 9 A/D Data 8 7 6 OLD_DATA ADRES 3 2 1 0 NEW_DATA ADIF 1 TCY GO DONE Sample AD132 Sampling Stopped Note 1: If the A/D clock source is selected as FRC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. DS41615A-page 244 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 27-8: COMPARATOR SPECIFICATIONS Operating Conditions: 1.8V < VDD < 5.5V, -40C < TA < +125C (unless otherwise stated). Param No. Sym. Characteristics Typ. Max. Units -- 7.5 60 mV Comments CM01 Vioff CM02 Vicm Input Common Mode Voltage 0 -- VDD V CM03* CMRR Common Mode Rejection Ratio -- 50 -- dB CM04A Response Time Rising Edge -- 400 800 ns High Power Mode CM04B Response Time Falling Edge -- 200 400 ns High Power Mode Response Time Rising Edge -- 1200 -- ns Low Power Mode Response Time Falling Edge -- 550 -- ns CM04C Input Offset Voltage Min. Tresp CM04D CM05* Tmc2ov Comparator Mode Change to Output Valid -- -- 10 s CM06 Chyster Comparator Hysteresis -- 65 -- mV * High Power Mode, Vicm = VDD/2 Hysteresis ON These parameters are characterized but not tested. TABLE 27-9: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS Operating Conditions: 2.5V < VDD < 5.5V, -40C < TA < +125C (unless otherwise stated). Param No. Sym. Characteristics Min. Typ. Max. Units VDD/32 -- V DAC01* CLSB Step Size -- DAC02* CACC Absolute Accuracy -- -- 1/2 LSb DAC03* CR Unit Resistor Value (R) -- 5000 -- CST Time(1) -- -- 10 s DAC04* * Note 1: Settling Comments These parameters are characterized but not tested. Settling time measured while DACR<4:0> transitions from `0000' to `1111'. 2011 Microchip Technology Inc. Preliminary DS41615A-page 245 PIC12(L)F1501 NOTES: DS41615A-page 246 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 28.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS Graphs and charts are not available at this time. 2011 Microchip Technology Inc. Preliminary DS41615A-page 247 PIC12(L)F1501 NOTES: DS41615A-page 248 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 29.0 DEVELOPMENT SUPPORT 29.1 The PIC(R) microcontrollers and dsPIC(R) digital signal controllers are supported with a full range of software and hardware development tools: * Integrated Development Environment - MPLAB(R) IDE Software * Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C(R) for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families * Simulators - MPLAB SIM Software Simulator * Emulators - MPLAB REAL ICETM In-Circuit Emulator * In-Circuit Debuggers - MPLAB ICD 3 - PICkitTM 3 Debug Express * Device Programmers - PICkitTM 2 Programmer - MPLAB PM3 Device Programmer * Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows(R) operating system-based application that contains: * A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) * A full-featured editor with color-coded context * A multiple project manager * Customizable data windows with direct edit of contents * High-level source code debugging * Mouse over variable inspection * Drag and drop variables from source to watch windows * Extensive on-line help * Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: * Edit your source files (either C or assembly) * One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) * Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. 2011 Microchip Technology Inc. Preliminary DS41615A-page 249 PIC12(L)F1501 29.2 MPLAB C Compilers for Various Device Families The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip's PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 29.3 HI-TECH C for Various Device Families For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel(R) standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip's PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. 29.4 29.5 * Efficient linking of single libraries instead of many smaller files * Enhanced code maintainability by grouping related modules together * Flexible creation of libraries with easy module listing, replacement, deletion and extraction 29.6 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: * * * * * * Support for the entire device instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility * Integration into MPLAB IDE projects * User-defined macros to streamline assembly code * Conditional assembly for multi-purpose source files * Directives that allow complete control over the assembly process DS41615A-page 250 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 29.7 MPLAB SIM Software Simulator 29.9 The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC(R) DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 29.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip's next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC(R) Flash MCUs and dsPIC(R) Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 2011 Microchip Technology Inc. MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC(R) Flash microcontrollers and dsPIC(R) DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 29.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC(R) and dsPIC(R) Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial ProgrammingTM. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user's guide, lessons, tutorial, compiler and MPLAB IDE software. Preliminary DS41615A-page 251 PIC12(L)F1501 29.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express 29.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits The PICkitTM 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip's Flash families of microcontrollers. The full featured Windows(R) programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip's powerful MPLAB Integrated Development Environment (IDE) the PICkitTM 2 enables in-circuit debugging on most PIC(R) microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user's guide, lessons, tutorial, compiler and MPLAB IDE software. 29.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSPTM cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. DS41615A-page 252 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEMTM and dsPICDEMTM demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ(R) security ICs, CAN, IrDA(R), PowerSmart battery management, SEEVAL(R) evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 30.0 PACKAGING INFORMATION 30.1 Package Marking Information 8-Lead PDIP (300 mil) Example 12F1501 I/P e3 017 1110 XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (3.90 mm) Example 12F1501 I/SN1110 017 NNN Legend: XX...X Y YY WW NNN e3 * Note: * Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Standard PICmicro(R) device marking consists of Microchip part number, year code, week code and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 2011 Microchip Technology Inc. Preliminary DS41615A-page 253 PIC12(L)F1501 Package Marking Information (Continued) 8-Lead MSOP (3x3 mm) Example F1501I 110017 8-Lead DFN (2x3x0.9 mm) Example BAK 110 10 8-Lead DFN (3x3x0.9 mm) Example XXXX YYWW NNN MFB1 1110 017 PIN 1 DS41615A-page 254 PIN 1 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 TABLE 30-1: 8-LEAD 2x3 DFN (MC) TOP MARKING Part Number PIC12F1501-E/MC Marking BAK PIC12F1501-I/MC BAL PIC12LF1501-E/MC BAM PIC12LF1501-I/MC BAP TABLE 30-2: 8-LEAD 3x3 QFN (MF) TOP MARKING Part Number PIC12F1501-E/MF Marking MFA1 PIC12F1501-I/MF MFB1 PIC12LF1501-E/MF MFC1 PIC12LF1501-I/MF MFD1 2011 Microchip Technology Inc. Preliminary DS41615A-page 255 PIC12(L)F1501 30.2 Package Details The following sections give the technical details of the packages. 3 & ' !&" & 4# *!( !!& 4 %& &#& && 255***' '5 4 N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b 6&! '! 9'&! 7"') %! 7,8. 7 7 & ; < & & 7: 1, = = - 1!& & = = . - - ##4 "# & 4!! "# >#& ##4>#& . < : 9& -< -? 9 - < ) ? ) < 1 = = & & 9# 6 4!! 9#>#& 9 * 9#>#& : * + - !"#$%&" ' ()"&'"!&) &#*& & & # +%&, & !& - '! !#.# &"#' #%! & "! ! #%! & "! !! &$#/ !# '! #& .0 1,21!'! &$& "! **& "&& ! DS41615A-page 256 Preliminary * ,<1 2011 Microchip Technology Inc. PIC12(L)F1501 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2011 Microchip Technology Inc. Preliminary DS41615A-page 257 PIC12(L)F1501 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS41615A-page 258 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 ! ""#$%& !' 3 & ' !&" & 4# *!( !!& 4 %& &#& && 255***' '5 4 2011 Microchip Technology Inc. Preliminary DS41615A-page 259 PIC12(L)F1501 ( " ! )*( ( ! 3 & ' !&" & 4# *!( !!& 4 %& &#& && 255***' '5 4 D N E E1 NOTE 1 1 2 e b A2 A c L L1 A1 6&! '! 9'&! 7"') %! 99. . 7 7 7: ; < & : 8 & = = < = ##4 4!! &# %% ?1, : >#& . ##4>#& . -1, : 9& -1, 3 &9& 9 3 & & 9 3 & 9# 4!! 1, ? < .3 R = <R < = - 9#>#& ) = !"#$%&" ' ()"&'"!&) &#*& & & # '! !#.# &"#' #%! & "! ! #%! & "! !! &$#'' !# - '! #& .0 1,2 1!'! &$& "! **& "&& ! .32 % '! ("!"*& "&& (% % '& " !! DS41615A-page 260 Preliminary * ,1 2011 Microchip Technology Inc. PIC12(L)F1501 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2011 Microchip Technology Inc. Preliminary DS41615A-page 261 PIC12(L)F1501 + $ )*(',--%&+ 3 & ' !&" & 4# *!( !!& 4 %& &#& && 255***' '5 4 D e b N N L K E2 E EXPOSED PAD NOTE 1 2 1 NOTE 1 1 2 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 6&! '! 9'&! 7"') %! 99. . 7 7 7: ; < & : 8 & < &# %% , && 4!! 1, - .3 : 9& 1, : >#& . .$ !##9& - = .$ !##>#& . = ) - 9 - U = = , &&>#& , &&9& , &&& .$ !## -1, !"#$%&" ' ()"&'"!&) &#*& & & # 4' ' $ !#&) !&#! - 4!!*!"&# '! #& .0 1,2 1!'! &$& "! **& "&& ! .32 % '! ("!"*& "&& (% % '& " !! DS41615A-page 262 Preliminary * ,-, 2011 Microchip Technology Inc. PIC12(L)F1501 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2011 Microchip Technology Inc. Preliminary DS41615A-page 263 PIC12(L)F1501 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS41615A-page 264 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2011 Microchip Technology Inc. Preliminary DS41615A-page 265 PIC12(L)F1501 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS41615A-page 266 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 APPENDIX A: DATA SHEET REVISION HISTORY Revision A Original release (11/2011). 2011 Microchip Technology Inc. Preliminary DS41615A-page 267 PIC12(L)F1501 NOTES: DS41615A-page 268 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 INDEX A A/D Specifications.................................................... 242, 243 Absolute Maximum Ratings .............................................. 225 AC Characteristics Industrial and Extended ............................................ 238 Load Conditions ........................................................ 237 ADC .................................................................................. 113 Acquisition Requirements ......................................... 124 Associated registers.................................................. 126 Block Diagram........................................................... 113 Calculating Acquisition Time..................................... 124 Channel Selection..................................................... 114 Configuration............................................................. 114 Configuring Interrupt ................................................. 118 Conversion Clock...................................................... 114 Conversion Procedure .............................................. 118 Internal Sampling Switch (RSS) Impedance.............. 124 Interrupts................................................................... 116 Operation .................................................................. 117 Operation During Sleep ............................................ 117 Port Configuration ..................................................... 114 Reference Voltage (VREF)......................................... 114 Source Impedance.................................................... 124 Starting an A/D Conversion ...................................... 116 ADCON0 Register....................................................... 25, 119 ADCON1 Register....................................................... 25, 120 ADCON2 Register............................................................. 121 ADDFSR ........................................................................... 215 ADDWFC .......................................................................... 215 ADRESH Register............................................................... 25 ADRESH Register (ADFM = 0) ......................................... 122 ADRESH Register (ADFM = 1) ......................................... 123 ADRESL Register (ADFM = 0).......................................... 122 ADRESL Register (ADFM = 1).......................................... 123 Alternate Pin Function....................................................... 100 Analog-to-Digital Converter. See ADC ANSELA Register ............................................................. 103 APFCON Register............................................................. 100 Assembler MPASM Assembler................................................... 250 Automatic Context Saving................................................... 65 B Bank 10 ............................................................................... 28 Bank 11 ............................................................................... 28 Bank 12 ............................................................................... 28 Bank 13 ............................................................................... 28 Bank 14-29.......................................................................... 28 Bank 2 ................................................................................. 26 Bank 3 ................................................................................. 26 Bank 30 ............................................................................... 29 Bank 4 ................................................................................. 27 Bank 5 ................................................................................. 27 Bank 6 ................................................................................. 27 Bank 7 ................................................................................. 27 Bank 8 ................................................................................. 27 Bank 9 ................................................................................. 27 Block Diagrams ADC .......................................................................... 113 ADC Transfer Function ............................................. 125 Analog Input Model ........................................... 125, 136 Clock Source............................................................... 45 2011 Microchip Technology Inc. Comparator............................................................... 132 Digital-to-Analog Converter (DAC) ........................... 128 Generic I/O Port.......................................................... 99 Interrupt Logic............................................................. 61 NCO.......................................................................... 184 On-Chip Reset Circuit................................................. 53 PIC12(L)F1501 ....................................................... 5, 10 PWM......................................................................... 161 Timer0 ...................................................................... 141 Timer1 ...................................................................... 145 Timer1 Gate.............................................. 150, 151, 152 Timer2 ...................................................................... 157 Voltage Reference.................................................... 109 Voltage Reference Output Buffer Example .............. 128 BORCON Register.............................................................. 55 BRA .................................................................................. 216 Brown-out Reset (BOR)...................................................... 55 Specifications ........................................................... 241 Timing and Characteristics ....................................... 240 C C Compilers MPLAB C18.............................................................. 250 CALL................................................................................. 217 CALLW ............................................................................. 217 CLCDATA Register........................................................... 181 CLCxCON Register .......................................................... 173 CLCxGLS0 Register ......................................................... 177 CLCxGLS1 Register ......................................................... 178 CLCxGLS2 Register ......................................................... 179 CLCxGLS3 Register ......................................................... 180 CLCxPOL Register ........................................................... 174 CLCxSEL0 Register.......................................................... 175 Clock Sources External Modes........................................................... 46 EC ...................................................................... 46 Internal Modes............................................................ 47 HFINTOSC ......................................................... 47 Internal Oscillator Clock Switch Timing .............. 48 LFINTOSC.......................................................... 47 Clock Switching .................................................................. 50 CMOUT Register .............................................................. 138 CMxCON0 Register .......................................................... 137 CMxCON1 Register .......................................................... 138 Code Examples A/D Conversion ........................................................ 118 Initializing PORTA ...................................................... 99 Writing to Flash Program Memory.............................. 92 Comparator Associated Registers................................................ 139 Operation.................................................................. 131 Comparator Module .......................................................... 131 Cx Output State Versus Input Conditions................. 133 Comparator Specifications................................................ 245 Comparators C2OUT as T1 Gate................................................... 147 Complementary Waveform Generator (CWG).......... 193, 194 CONFIG1 Register ............................................................. 40 CONFIG2 Register ............................................................. 41 Core Function Register....................................................... 24 Customer Change Notification Service............................. 275 Customer Notification Service .......................................... 275 Customer Support............................................................. 275 CWG Preliminary DS41615A-page 269 PIC12(L)F1501 Auto-shutdown Control ............................................. 200 Clock Source............................................................. 196 Output Control........................................................... 196 Selectable Input Sources .......................................... 196 CWGxCON0 Register ....................................................... 203 CWGxCON1 Register ....................................................... 204 CWGxCON2 Register ....................................................... 205 CWGxDBF Register .......................................................... 206 CWGxDBR Register.......................................................... 206 D DACCON0 (Digital-to-Analog Converter Control 0) Register..................................................................... 130 DACCON1 (Digital-to-Analog Converter Control 1) Register..................................................................... 130 Data Memory....................................................................... 17 DC and AC Characteristics ............................................... 247 DC Characteristics Extended and Industrial ............................................ 234 Industrial and Extended ............................................ 227 Development Support ....................................................... 249 Device Configuration........................................................... 39 Code Protection .......................................................... 42 Configuration Word ..................................................... 39 User ID .................................................................. 42, 43 Device ID Register .............................................................. 43 Device Overview ............................................................. 9, 79 Digital-to-Analog Converter (DAC).................................... 127 Associated Registers ................................................ 130 Effects of a Reset...................................................... 128 Specifications ............................................................ 245 E Effects of Reset PWM mode ............................................................... 163 Electrical Specifications .................................................... 225 Enhanced Mid-Range CPU................................................. 13 Errata .................................................................................... 7 Extended Instruction Set ADDFSR ................................................................... 215 F Firmware Instructions........................................................ 211 Fixed Voltage Reference (FVR) ........................................ 109 Associated Registers ................................................ 110 Flash Program Memory....................................................... 83 Associated Registers .................................................. 98 Configuration Word w/ Flash Program Memory .......... 98 Erasing ........................................................................ 87 Modifying..................................................................... 93 Write Verify ................................................................. 95 Writing ......................................................................... 89 Flash Program Memory Control .......................................... 83 FSR Register....................................................................... 24 FVRCON (Fixed Voltage Reference Control) Register ..... 110 I INDF Register ..................................................................... 24 Indirect Addressing ............................................................. 34 Instruction Format ............................................................. 212 Instruction Set ................................................................... 211 ADDLW ..................................................................... 215 ADDWF ..................................................................... 215 ADDWFC .................................................................. 215 ANDLW ..................................................................... 215 ANDWF ..................................................................... 215 DS41615A-page 270 BRA .......................................................................... 216 CALL......................................................................... 217 CALLW ..................................................................... 217 LSLF ......................................................................... 219 LSRF ........................................................................ 219 MOVF ....................................................................... 219 MOVIW ..................................................................... 220 MOVLB ..................................................................... 220 MOVWI ..................................................................... 221 OPTION .................................................................... 221 RESET...................................................................... 221 SUBWFB .................................................................. 223 TRIS ......................................................................... 224 BCF .......................................................................... 216 BSF........................................................................... 216 BTFSC ...................................................................... 216 BTFSS ...................................................................... 216 CALL......................................................................... 217 CLRF ........................................................................ 217 CLRW ....................................................................... 217 CLRWDT .................................................................. 217 COMF ....................................................................... 217 DECF ........................................................................ 217 DECFSZ ................................................................... 218 GOTO ....................................................................... 218 INCF ......................................................................... 218 INCFSZ..................................................................... 218 IORLW ...................................................................... 218 IORWF...................................................................... 218 MOVLW .................................................................... 220 MOVWF .................................................................... 220 NOP .......................................................................... 221 RETFIE ..................................................................... 222 RETLW ..................................................................... 222 RETURN................................................................... 222 RLF ........................................................................... 222 RRF .......................................................................... 223 SLEEP ...................................................................... 223 SUBLW ..................................................................... 223 SUBWF..................................................................... 223 SWAPF ..................................................................... 224 XORLW .................................................................... 224 XORWF .................................................................... 224 INTCON Register................................................................ 66 Internal Oscillator Block INTOSC Specifications ................................................... 238 Internal Sampling Switch (RSS) Impedance...................... 124 Internet Address ............................................................... 275 Interrupt-On-Change......................................................... 105 Associated Registers ................................................ 108 Interrupts............................................................................. 61 ADC .......................................................................... 118 Associated registers w/ Interrupts............................... 73 TMR1 ........................................................................ 149 INTOSC Specifications ..................................................... 238 IOCAF Register ................................................................ 107 IOCAN Register ................................................................ 107 IOCAP Register ................................................................ 107 L LATA Register .................................................................. 103 Load Conditions................................................................ 237 LSLF ................................................................................. 219 LSRF................................................................................. 219 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 M MCLR .................................................................................. 56 Internal ........................................................................ 56 Memory Organization.......................................................... 15 Data ............................................................................ 17 Program ...................................................................... 15 Microchip Internet Web Site .............................................. 275 MOVIW ............................................................................. 220 MOVLB ............................................................................. 220 MOVWI ............................................................................. 221 MPLAB ASM30 Assembler, Linker, Librarian ................... 250 MPLAB Integrated Development Environment Software .. 249 MPLAB PM3 Device Programmer .................................... 252 MPLAB REAL ICE In-Circuit Emulator System................. 251 MPLINK Object Linker/MPLIB Object Librarian ................ 250 N NCO Associated registers.................................................. 192 NCOxACCH Register........................................................ 190 NCOxACCL Register ........................................................ 190 NCOxACCU Register........................................................ 190 NCOxCLK Register ........................................................... 189 NCOxCON Register .......................................................... 189 NCOxINCH Register ......................................................... 191 NCOxINCL Register.......................................................... 191 Numerically Controlled Oscillator (NCO)........................... 183 O OPCODE Field Descriptions ............................................. 211 OPTION ............................................................................ 221 OPTION Register .............................................................. 143 OSCCON Register .............................................................. 51 Oscillator Associated Registers .................................................. 52 Associated registers.................................................. 207 Oscillator Module ................................................................ 45 ECH ............................................................................ 45 ECL ............................................................................. 45 ECM ............................................................................ 45 INTOSC ...................................................................... 45 Oscillator Parameters ....................................................... 238 Oscillator Specifications .................................................... 238 Oscillator Start-up Timer (OST) Specifications............................................................ 241 OSCSTAT Register............................................................. 52 P Packaging ......................................................................... 253 Marking ............................................................. 253, 254 PDIP Details.............................................................. 255 PCL and PCLATH ............................................................... 14 PCL Register....................................................................... 24 PCLATH Register ............................................................... 24 PCON Register ............................................................. 25, 59 PIE1 Register ................................................................ 25, 67 PIE2 Register ................................................................ 25, 68 PIE3 Register ................................................................ 25, 69 PIR1 Register................................................................ 25, 70 PIR2 Register................................................................ 25, 71 PIR3 Register................................................................ 25, 72 PMADR Registers ............................................................... 83 PMADRH Registers ............................................................ 83 PMADRL Register............................................................... 96 PMADRL Registers ............................................................. 83 2011 Microchip Technology Inc. PMCON1 Register ........................................................ 83, 97 PMCON2 Register ........................................................ 83, 98 PMDATH Register .............................................................. 96 PMDATL Register............................................................... 96 PMDRH Register ................................................................ 96 PORTA ............................................................................. 101 ANSELA Register ..................................................... 101 Associated Registers................................................ 104 LATA Register ............................................................ 26 PORTA Register......................................................... 25 Specifications ........................................................... 239 PORTA Register ............................................................... 102 Power-Down Mode (Sleep)................................................. 75 Associated Registers.................................................. 78 Power-on Reset .................................................................. 54 Power-up Time-out Sequence ............................................ 56 Power-up Timer (PWRT) .................................................... 54 Specifications ........................................................... 241 PR2 Register ...................................................................... 25 Program Memory ................................................................ 15 Map and Stack (PIC12(L)F1501................................. 16 Programming, Device Instructions.................................... 211 Pulse Width Modulation (PWM)........................................ 161 Associated registers w/ PWM................................... 166 PWM Mode Duty Cycle ........................................................ 162 Effects of Reset ................................................ 163 Example PWM Frequencies and Resolutions, 20 MHZ................................ 163 Example PWM Frequencies and Resolutions, 8 MHz .................................. 163 Operation in Sleep Mode.................................. 163 Setup for Operation using PWMx pins ............. 164 System Clock Frequency Changes .................. 163 PWM Period ............................................................. 162 Setup for PWM Operation using PWMx Pins ........... 164 PWMxCON Register......................................................... 165 PWMxDCH Register ......................................................... 166 PWMxDCL Register.......................................................... 166 R Reader Response............................................................. 276 Read-Modify-Write Operations ......................................... 211 Registers ADCON0 (ADC Control 0) ........................................ 119 ADCON1 (ADC Control 1) ........................................ 120 ADCON2 (ADC Control 2) ........................................ 121 ADRESH (ADC Result High) with ADFM = 0) .......... 122 ADRESH (ADC Result High) with ADFM = 1) .......... 123 ADRESL (ADC Result Low) with ADFM = 0)............ 122 ADRESL (ADC Result Low) with ADFM = 1)............ 123 ANSELA (PORTA Analog Select) ............................ 103 APFCON (Alternate Pin Function Control) ............... 100 BORCON Brown-out Reset Control) .......................... 55 CLCDATA (Data Output) .......................................... 181 CLCxCON (CLCx Control)........................................ 173 CLCxGLS0 (Gate 1 Logic Select)............................. 177 CLCxGLS1 (Gate 2 Logic Select)............................. 178 CLCxGLS2 (Gate 3 Logic Select)............................. 179 CLCxGLS3 (Gate 4 Logic Select)............................. 180 CLCxPOL (Signal Polarity Control) .......................... 174 CLCxSEL0 (Multiplexer Data 1 and 2 Select) .......... 175 CMOUT (Comparator Output) .................................. 138 CMxCON0 (Cx Control) ............................................ 137 CMxCON1 (Cx Control 1)......................................... 138 Configuration Word 1.................................................. 40 Preliminary DS41615A-page 271 PIC12(L)F1501 Configuration Word 2 .................................................. 41 Core Function, Summary ............................................ 24 CWGxCON0 (CWG Control 0).................................. 203 CWGxCON1 (CWG Control 1).................................. 204 CWGxCON2 (CWG Control 1).................................. 205 CWGxDBF (CWGx Dead Band Falling Count) ......... 206 CWGxDBR (CWGx Dead Band Rising Count) ......... 206 DACCON0 ................................................................ 130 DACCON1 ................................................................ 130 Device ID .................................................................... 43 FVRCON ................................................................... 110 INTCON (Interrupt Control) ......................................... 66 IOCAF (Interrupt-on-Change PORTA Flag) .............. 107 IOCAN (Interrupt-on-Change PORTA Negative Edge) ................................................. 107 IOCAP (Interrupt-on-Change PORTA Positive Edge)................................................... 107 LATA (Data Latch PORTA) ....................................... 103 NCOxACCH (NCOx Accumulator High Byte) ........... 190 NCOxACCL (NCOx Accumulator Low Byte)............. 190 NCOxACCU (NCOx Accumulator Upper Byte) ......... 190 NCOxCLK (NCOx Clock Control) ............................. 189 NCOxCON (NCOx Control) ...................................... 189 NCOxINCH (NCOx Increment High Byte)................. 191 NCOxINCL (NCOx Increment Low Byte) .................. 191 OPTION_REG (OPTION) ......................................... 143 OSCCON (Oscillator Control) ..................................... 51 OSCSTAT (Oscillator Status) ..................................... 52 PCON (Power Control Register) ................................. 59 PCON (Power Control) ............................................... 59 PIE1 (Peripheral Interrupt Enable 1) ........................... 67 PIE2 (Peripheral Interrupt Enable 2) ........................... 68 PIE3 (Peripheral Interrupt Enable 3) ........................... 69 PIR1 (Peripheral Interrupt Register 1) ........................ 70 PIR2 (Peripheral Interrupt Request 2) ........................ 71 PIR3 (Peripheral Interrupt Request 3) ........................ 72 PMADRL (Program Memory Address)........................ 96 PMCON1 (Program Memory Control 1) ...................... 97 PMCON2 (Program Memory Control 2) ...................... 98 PMDATH (Program Memory Data) ............................. 96 PMDATL (Program Memory Data).............................. 96 PMDRH (Program Memory Address).......................... 96 PORTA...................................................................... 102 PWMxCON (PWM Control)....................................... 165 PWMxDCH (PWM Control) ....................................... 166 PWMxDCL (PWM Control) ....................................... 166 Special Function, Summary ........................................ 25 STATUS ...................................................................... 18 T1CON (Timer1 Control)........................................... 153 T1GCON (Timer1 Gate Control) ............................... 154 T2CON ...................................................................... 159 TRISA (Tri-State PORTA) ......................................... 102 VREGCON (Voltage Regulator Control) ..................... 78 WDTCON (Watchdog Timer Control).......................... 81 WPUA (Weak Pull-up PORTA) ................................. 104 RESET .............................................................................. 221 Reset................................................................................... 53 Reset Instruction ................................................................. 56 Resets ................................................................................. 53 Associated Registers .................................................. 60 Revision History ................................................................ 267 S Accessing ................................................................... 32 Reset .......................................................................... 34 Stack Overflow/Underflow .................................................. 56 STATUS Register ............................................................... 18 SUBWFB .......................................................................... 223 T T1CON Register ......................................................... 25, 153 T1GCON Register ............................................................ 154 T2CON (Timer2) Register................................................. 159 T2CON Register ................................................................. 25 Temperature Indicator Associated Registers ................................................ 112 Temperature Indicator Module.......................................... 111 Thermal Considerations.................................................... 236 Timer0............................................................................... 141 Associated Registers ................................................ 143 Operation .................................................................. 141 Specifications ........................................................... 242 Timer1............................................................................... 145 Associated registers ......................................... 155, 207 Asynchronous Counter Mode ................................... 147 Reading and Writing ......................................... 147 Clock Source Selection............................................. 146 Interrupt .................................................................... 149 Operation .................................................................. 146 Operation During Sleep ............................................ 149 Prescaler .................................................................. 147 Specifications ........................................................... 242 Timer1 Gate Selecting Source .............................................. 147 TMR1H Register ....................................................... 145 TMR1L Register........................................................ 145 Timer2............................................................................... 157 Associated registers ................................................. 160 Timers Timer1 T1CON ............................................................. 153 T1GCON........................................................... 154 Timer2 T2CON ............................................................. 159 Timing Diagrams A/D Conversion......................................................... 243 A/D Conversion (Sleep Mode) .................................. 244 Brown-out Reset (BOR)............................................ 240 Brown-out Reset Situations ........................................ 55 CLKOUT and I/O ...................................................... 239 Clock Timing ............................................................. 238 Comparator Output ................................................... 131 INT Pin Interrupt ......................................................... 64 Internal Oscillator Switch Timing ................................ 49 Reset Start-up Sequence ........................................... 57 Reset, WDT, OST and Power-up Timer ................... 240 Timer0 and Timer1 External Clock ........................... 241 Timer1 Incrementing Edge ....................................... 149 Wake-up from Interrupt............................................... 76 Timing Parameter Symbology .......................................... 237 TMR0 Register.................................................................... 25 TMR1H Register ................................................................. 25 TMR1L Register.................................................................. 25 TMR2 Register.................................................................... 25 TRIS.................................................................................. 224 TRISA Register........................................................... 25, 102 Software Simulator (MPLAB SIM)..................................... 251 Special Function Registers (SFRs) ..................................... 25 Stack ................................................................................... 32 DS41615A-page 272 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 V VREF. SEE ADC Reference Voltage VREGCON Register ........................................................... 78 W Wake-up Using Interrupts ................................................... 75 Watchdog Timer (WDT) ...................................................... 56 Associated Registers .................................................. 82 Modes ......................................................................... 80 Specifications............................................................ 241 WDTCON Register ............................................................. 81 WPUA Register ................................................................. 104 Write Protection .................................................................. 42 WWW Address.................................................................. 275 WWW, On-Line Support ....................................................... 7 2011 Microchip Technology Inc. Preliminary DS41615A-page 273 PIC12(L)F1501 NOTES: DS41615A-page 274 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. 2011 Microchip Technology Inc. Preliminary DS41615A-page 275 PIC12(L)F1501 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: PIC12(L)F1501 Literature Number: DS41615A Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS41615A-page 276 Preliminary 2011 Microchip Technology Inc. PIC12(L)F1501 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO. Device - X Tape and Reel Temperature Option Range /XX XXX Package Pattern Examples: a) b) Device: PIC12F1501, PIC12LF1501 Tape and Reel Option: Blank T = Standard packaging (tube or tray) = Tape and Reel(1) Temperature Range: I E = -40C to +85C = -40C to +125C Package: MC MF MS P SN Pattern: = = = = = (Industrial) (Extended) Micro Lead Frame (DFN) 2x3 Micro Lead Frame (DFN) 3x3 MSOP Plastic DIP SOIC QTP, SQTP, Code or Special Requirements (blank otherwise) 2011 Microchip Technology Inc. c) PIC12LF1501T - I/SN Tape and Reel, Industrial temperature, SOIC package PIC12F1501 - I/P Industrial temperature PDIP package PIC12F1501 - E/MF Extended temperature, DFN package Preliminary Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS41615A-page 277 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-330-9305 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 DS41615A-page 278 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 08/02/11 Preliminary 2011 Microchip Technology Inc.