1
®
OPA4243
FEATURES
MICRO-SIZE, TSSOP PACKAGE
SINGLE-SUPPLY OPERATION
WIDE SUPPLY RANGE: 2.2V to 36V
LOW QUIESCENT CURRENT: 45µA/chan
WIDE BANDWIDTH: 430kHz
WIDE INPUT/OUTPUT SWING
DESCRIPTION
The OPA4243 is a four-channel op amp specifically
designed for high density, space-limited applications,
such as LCD bias drivers, PCMCIA cards, battery-
packs and portable instruments. In addition to small
size, this part features wide output swing, very low
quiescent current, and low bias current. Other features
include unity gain stability and the best speed power
ratio available. Power supplies in the range of 2.2V to
36V (±1.1V to ±18V) can be used.
Each channel uses completely independent circuitry
for lowest crosstalk and freedom from interaction,
even when overloaded. In addition, the amplifier is
free from output inversion when the inputs are driven
to the rail. The OPA4243EA is supplied in the minia-
ture TSSOP-14 surface mount package. Specifications
apply from –40°C to +85°C. However, as the exten-
sive typical performance curves indicate, the OPA4243
can be used over the full –55°C to +125°C range. A
SPICE macromodel is available for design analysis.
Quad OPERATIONAL AMPLIFIER
Micro
POWER, Single-Supply
®
OPA4243
APPLICATIONS
LCD DISPLAY DRIVERS
BATTERY POWERED SYSTEMS
PORTABLE EQUIPMENT
PCMCIA CARDS
BATTERY PACKS AND POWER SUPPLIES
CONSUMER PRODUCTS
© 1999 Burr-Brown Corporation PDS-1562A Printed in U.S.A. November, 1999
For most current data sheet and other product
information, visit www.burr-brown.com
®
OPA4243
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Output D
–Input D
+Input D
–V
+Input C
–Input C
Output C
Output A
–Input A
+Input A
+V
+Input B
–Input B
Output B
OPA4243EA
TSSOP-14
®
OPA4243
SBOS118
2
®
OPA4243
SPECIFICATIONS: VS = +2.6V to +36V
Boldface limits apply over the specified temperature range, TA = –40°C to +85°C
At TA = +25°C, RL = 20k connected to ground, unless otherwise noted.
OPA4243EA
PARAMETER CONDITIONS MIN TYP(1) MAX UNITS
OFFSET VOLTAGE
Input Offset Voltage VOS VS = ±7.5V, VCM = 0 ±2±5mV
Over Temperature ±6mV
vs Temperature dVOS/dT TA = –40°C to +85°C±2.5 µV/°C
vs Power Supply PSRR VS = +2.6V to +36V 2.5 100 µV/V
Over Temperature VS = +2.6V to +36V 100 µV/V
Channel Separation 140 dB
INPUT BIAS CURRENT
Input Bias Current IRVCM = VS/2 –10 –25 nA
Input Offset Current IOS VCM = VS/2 ±1±10 nA
NOISE
Input Noise Voltage, f = 0.1 to 10Hz 0.4 µVp-p
Input Noise Voltage Density, f = 1kHz en22 nV/Hz
Current Noise Density, f = 1kHz in40 fA/Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range VCM 0 (V+) – 0.9 V
Common-Mode Rejection CMRR VS = ±18V, VCM = –18V to +17.1V 82 104 dB
Over Temperature VS = ±18V, VCM = –18V to +17.1V 82 dB
INPUT IMPEDANCE
Differential 106 || 2 || pF
Common-Mode 109 || 2 || pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain AOL VO = 0.5V to (V+) – 0.9 86 104 dB
Over Temperature VO = 0.5V to (V+) – 0.9 86 dB
FREQUENCY RESPONSE
Gain-Bandwidth Product GBW 430 kHz
Slew Rate SR G = 1 –0.1, ±0.16 V/µs
Setting Time, 0.01% 10V Step 150 µs
Overload Recovery Time VIN • Gain = VS8µs
OUTPUT
Voltage Output, Positive VOAOL 80dB, RL = 20k to VS/2 (V+) – 0.9 (V+) – 0.75 V
Over Temperature AOL 80dB, RL = 20k to VS/2 (V+) – 0.9 (V+) – 0.75 V
Voltage Output, Negative AOL 80dB, RL = 20k to VS/2 0.5 0.2 V
Over Temperature AOL 80dB, RL = 20k to VS/2 0.5 0.2 V
Voltage Output, Positive AOL 80dB, RL = 20k to Ground (V+) – 0.75 V
Over Temperature AOL 80dB, RL = 20k to Ground (V+) – 0.75 V
Voltage Output, Negative AOL 80dB, RL = 20k to Ground 0.1 V
Over Temperature AOL 80dB, RL = 20k to Ground 0.1 V
Short-Circuit Current ISC –25, +12 mA
Capacitive Load Drive CLOAD See Typical Curve
POWER SUPPLY
Specified Voltage Range VSOver Temperature +2.6 +36 V
Minimum Operating Voltage +2.2 V
Quiescent Current IOIO = 0 45 60 µA
Over Temperature IO = 0 70 µA
TEMPERATURE RANGE
Specified Range –40 85 °C
Operating Range –55 125 °C
Storage Range –65 150 °C
Thermal Resistance
θ
JA
TSSOP-14 Surface Mount 100 °C/W
NOTE: (1) VS = +15V.
3
®
OPA4243
Supply Voltage, V+ to V–.................................................................... 36V
Input Voltage Range(2) ................................... (V–) – 0.3V to (V+) + 0.3V
Input Current(2) ................................................................................. 10mA
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature ..................................................–55°C to +125°C
Storage Temperature .....................................................–65°C to +150°C
Junction Temperature...................................................................... 150°C
Lead Temperature (soldering, 10s) ................................................. 300°C
ESD Capability ................................................................................ 2000V
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Inputs are diode-clamped to the supply rails and should
be current-limited to 10mA or less if input voltages can exceed rails by more
than 0.3V. (3) Short-circuit to ground, one amplifier per package.
ABSOLUTE MAXIMUM RATINGS(1)
PACKAGE/ORDERING INFORMATION
PACKAGE SPECIFIED
DRAWING TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE NUMBER RANGE MARKING NUMBER(1) MEDIA
OPA4243EA TSSOP-14 357 –40°C to +85°C OPA4243EA OPA4243EA/250 Tape and Reel
"""""OPA4243EA/2K5 Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “OPA4243EA” will get a single 2500-piece Tape and Reel.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
4
®
OPA4243
TYPICAL PERFORMANCE CURVES
At TA = +25°C, RL = 20k connected to ground, unless otherwise noted.
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
Frequency (Hz)
Voltage Noise (nVHz)
1000
100
10
11 10 100 1k 10k 100k
Current Noise (fAHz)
1000
100
10
1
Voltage Noise
Current Noise
60
55
50
45
40
35
30
20
–30
–25
–20
–15
+15
+10
+5
0
Short-Circuit Current (mA)
Quiescent Current (µA)
QUIESCENT CURRENT vs TEMPERATURE
–75 –50 –25 025
50 75 100 125
Temperature (°C)
V
S
= ±15V
–I
SC
+I
SC
I
Q
180
160
140
120
100
80
60
40
20
0
–20
OPEN-LOOP GAIN AND PHASE vs FREQUENCY
1
Frequency (Hz)
10 100 1k 10k 100k 1M
0
–20
–40
–60
–80
–100
–120
–140
–160
–180
–200
A
OL
(dB)
Phase(°)
V
S
= ±15V
Gain
Phase
POWER SUPPLY AND COMMON-MODE
REJECTION RATIO vs FREQUENCY
110 100 1k 10k 100k 1M
Frequency (Hz)
120
110
100
90
80
70
60
50
40
30
PSRR, CMRR (dB)
VS = ±15V
CMRR
PSRR
52
48
44
40
36
32
28
24
Quiescent Current (µA)
04812
16 20 24 28 32 36
35
30
25
20
15
10
5
0
Short-Circuit Current (mA)
Supply Voltage (V)
QUIESCENT CURRENT AND SHORT-CIRCUIT
vs SUPPLY VOLTAGE
+I
SC
–I
SC
I
Q
160
150
140
130
120
110
100
90
80
70
60
CHANNEL SEPARATION
110 100 1k 10k 100k
Separation (dB)
V
S
= ±15V
Frequency (Hz)
5
®
OPA4243
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, RL = 20k connected to ground, unless otherwise noted.
125
120
115
110
105
100
95
90
85
80–75 –50 –25 025 50 75 100 125
AOL, CMRR, PSRR vs TEMPERATURE
Temperature(°C)
VS = ±15V
PSRR
CMRR
AOL
0
–2
–4
–6
–8
–10
–12
–14
–16
Input Bias Current (nA)
INPUT BIAS CURRENT vs TEMPERATURE
–60 –40 –20 020 40 60 80 100 120 140
Temperature (C°)
–I
B
+I
B
V
S
= ±15V
30
25
20
15
10
5
0
–3.2 –2.4 –1.6 –0.8 0 0.8 1.6 2.4 3.2
Offset Voltage (mV)
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Production Distribution (%)
VS = ±7.5V
–30
–25
–20
–15
–10
–5
0–15 –10 –5 0510 15
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
V
S
= ±15V
Common-Mode Voltage (V)
120
100
80
60
40
20
0
COMMON-MODE REJECTION
vs SUPPY VOLTAGE
04812 16 20 24 28 32 36
Suppy Voltage (V)
CMRR (dB)
12
8
4
0012345678910
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
V
OS
Drift (µV/°C)
V
S
= ±7.5V
Production Distribution (%)
6
®
OPA4243
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
15
14
13
12
11
10
–10
–11
–12
–13
–14
–15 0 ±2 ±4 ±6 ±8 ±10 ±14±12
Output Current (mA)
Output Voltage Swing (V)
25°C
125°C –55°C
–55°C
125°C
25°C
R
L
to V
S
/2
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, RL = 20k connected to ground, unless otherwise noted.
30
25
20
15
10
5
030 35 40 45 50 55
Quiescent Current Per Channel (µA)
Production Distribution (%)
QUIESCENT CURRENT
PRODUCTION DISTRIBUTION
25 60
40
35
30
25
20
15
10
5
0100 1k 10k 100k 1M
Frequency(Hz)
Output Voltage (Vp-p)
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
VS = 2.7V
VS =15V
VS = 36V
70%
60%
50%
40%
30%
20%
10%
0% 10 100 1k 10k
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
Load Capacitance (pF)
Overshoot (%)
G = +1, R
L
=
G = +1, R
L
= 20k
G = +2, R
L
= 20k
G = +3, R
L
= 20k
120
110
100
90
80
70
60 110 100
OPEN-LOOP GAIN vs LOAD RESISTANCE
Gain(dB)
Load (k)
V
S
= ±15V,
V
O
= ±5V
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00–75 –25 25 75 125 175
Temperature (°C)
SLEW RATE vs TEMPERATURE
V
S
= ±7.5, R
L
= 20k,
C
L
= 100pF, Gain = +1
+SR
–SR
Slew Rate (V/µs)
7
®
OPA4243
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = + 25°C, RL = 20k connected to ground, unless otherwise noted.
LARGE-SIGNAL STEP RESPONSE
(VS = ± 7.5, G = +1, RL = 20k, CL = 100pF)
2V/div
50µs/div
SMALL-SIGNAL STEP RESPONSE
(V
S
= ±7.5V, G = +1, R
L
= 20k, C
L
= 100pF)
50mV/div
10µs/div
APPLICATION INFORMATION
The OPA4243 is unity-gain stable and suitable for a wide
range of general-purpose applications. The power supply
pins should be bypassed with 0.01µF ceramic capacitors.
OPERATING VOLTAGE
The OPA4243 can operate from single supply (2.2V to 36V)
or dual supplies (±1.1V to ±18V) with excellent perfor-
mance. Unlike most op amps which are specified at only one
supply voltage, the OPA4243 is specified for real world
applications; a single set of specifications applies through-
out the 2.6V to 36V supply range. This allows the designer
to have the same assured performance at any supply voltage
within this range.
In addition, many key parameters are guaranteed over the
specified temperature range, –40°C to +85°C. Most behav-
iors remain unchanged throughout the full operating voltage
range. Parameters, which vary significantly with operating
voltage or temperature, are shown in the typical perfor-
mance curves.
PRINTED CIRCUIT BOARD LAYOUT
See Burr-Brown Application Note AB-132 for specific PC
board layout recommendations.
INPUT PROTECTION
Rail-to-rail input signals will not cause damage or invert the
output of the OPA4243. To protect against ESD and exces-
sive input voltage (beyond the supply rails) the OPA4243
includes diodes from the input terminals to the power supply
rails. Normally, these diodes are reversed biased and have
negligible effect on circuit operation. However, if the input
voltage is allowed to exceed the supply voltages by enough
to forward bias these diodes (generally, 0.3V to 0.6V)
excessive input current could flow. If this condition could
occur (for example, if an input signal is applied when the op
amp supply voltage is zero), care should be taken to limit the
input current to less than 10mA to avoid damage. An input
signal beyond the supplies, with power applied, can cause an
unexpected output inversion.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
OPA4243EA/250 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA4243EA/250E4 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA4243EA/2K5 ACTIVE TSSOP PW 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA4243EA/2K5E4 ACTIVE TSSOP PW 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 22-Oct-2007
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA4243EA/250 TSSOP PW 14 250 180.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
OPA4243EA/2K5 TSSOP PW 14 2500 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA4243EA/250 TSSOP PW 14 250 210.0 185.0 35.0
OPA4243EA/2K5 TSSOP PW 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated