ASMT- Mx2x / ASMT- MxEx
Moonstone£ 3W Power LED Light Source
Data Sheet
Description
The Moonstone£ 3W Power LED Light Source is a high
performance energy ecient device which can handle
high thermal and high driving current. The exposed pad
design has excellent heat transfer from the package to the
motherboard.
The Cool White Power LED is available in various color
temperature ranging from 4000K to 10000K and Warm
White Power LED ranging from 2600K to 4000K.
The low prole package design is suitable for a wide variety
of applications especially where height is a constraint.
The package is compatible with reow soldering. This
will give more freedom and exibility to the light source
designer.
Applications
x Sign backlight
x Safety, exit and emergency sign lightings
x Specialty lighting such as task lighting and reading
lights
x Retail display
x Commercial lighting
x Accent or marker lightings, strip or step lightings
x Portable lightings, bicycle head lamp, torch lights.
x Decorative lighting
x Architectural lighting
x Pathway lighting
x Street lighting
x Pedestrian street lighting
x Tunnel lighting
Features
x Available in Cool White & Warm White color
x Energy ecient
x Exposed pad for excellent heat transfer
x Suitable for reow soldering process
x High current operation
x Long operation life
x Wide viewing angle
x Silicone encapsulation
x Non-ESD sensitive (threshold > 16KV)
x MSL 4 products
x Available in both electrically isolated and non-isolated
metal heat slug
Specications
x InGaN Technology
x 3.5V (max) at 350mA
x 110° viewing angle
2
Package Dimensions
Notes:
1. All dimensions are in millimeters.
2. Unless otherwise stated, the tolerance for dimension is ±0.1mm.
3. Metal slug is connected to anode for electrically non-isolated option.
Metal Slug
Cathode
Anode1
2
3
10.00
8.50
3
12
8.50
Ø 5.26
Ø 8.00
5.08 0.81
2.00 5.25
1.30
10.60
1.27
3.30
Heat Sink
LED
ZENER
+
−
Figure 1. ASMT-Mx2x / ASMT-MxEx package outline drawing.
3
Part Numbering System
Note:
1. Please refer to Page 8 for selection details.
Device Selection Guide (TJ = 25°C)
Part Number
Color
Luminous Flux, )v[1,2] (lm) Test Current
(mA)
Die
Technology
Electrically
Isolated Metal SlugMin. Typ. Max.
ASMT-MW20-NLN00 Cool White 73.0 85.0 161.0 350 InGaN No
ASMT-MW22-NLN00 Yes
ASMT-MY20-NLM00 Warm White 73.0 75.0 124.0 350 InGaN No
ASMT-MY22-NLM00 Yes
ASMT-MWE0-NLM00 Cool White
Diused
73.0 80.0 124.0 350 InGaN No
ASMT-MWE2-NLM00 Yes
ASMT-MYE0-NKM00 Warm White
Diused
56.0 70.0 124.0 350 InGaN No
ASMT-MYE2-NKM00 Yes
Notes:
1. )V is the total luminous ux output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux tolerance is ±10%.
ASMT – M x1 x2 x3 – N x4 x5 x6 x7
Packaging Option
Color Bin Selection
Max Flux Bin Selection
Min Flux Bin Selection
Color
Silicone Type
Heat Sink
0 – Electrically Non-isolated
2 – Electrically Isolated
W – Cool White
Y – Warm White
2 – Non-diffused
E – Diffused
4
Absolute Maximum Ratings
Parameter ASMT-Mx2x / ASMT-MxEx Units
DC Forward Current [1] 700 mA
Peak Pulsing Current [2] 1000 mA
Power Dissipation 3010 mW
LED Junction Temperature 125 °C
Operating Metal Slug Temperature Range at 350 mA -40 to +120 °C
Operating Metal Slug Temperature Range at 700 mA -40 to +95 °C
Storage Temperature Range -40 to +120 °C
Soldering Temperature Refer to Figure 11
Reverse Voltage [3] Not recommended
Note:
1. Derate linearly based on Figure 9.
2. Pulse condition: duty factor = 10%, Frequency = 1 kHz.
3. Not designed for reverse bias operation.
Optical Characteristics at 350 mA (TJ = 25°C)
Part Number Color
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle
2T½ [1] (°)
Luminous Eciency
(lm/W)
Min. Max. Typ. Typ.
ASMT-MW20-NLN00 Cool White 4000 10000 110 76
ASMT-MW22-NLN00
ASMT-MY20-NLM00 Warm White 2600 4000 110 67
ASMT-MY22-NLM00
ASMT-MWE0-NLM00 Cool White Diused 4000 10000 110 71
ASMT-MWE2-NLM00
ASMT-MYE0-NKM00 Warm White Diused 2600 4000 110 63
ASMT-MYE2-NKM00
Notes:
1. T½ is the o-axis angle where the luminous intensity is ½ the peak intensity.
5
Electrical Characteristic at 350 mA (TJ = 25°C)
Dice Type
Forward Voltage,
VF (Volts)
Thermal Resistance,
RTj-ms (°C/W) [1]
Temperature Coecient of
Forward Voltage (mV/°C),
'V
F/'TJ
Min. Typ. Max. Typ. Typ.
InGaN 2.8 3.2 3.5 10 -1.5 to -3.5
Note:
1. RTj-ms is the Thermal Resistance from LED junction to metal slug.
Optical and Electrical Characteristic at 700 mA (TJ = 25°C)
Part Number Color
Luminous Flux,
ΦV (lm)
Forward Voltage,
VF (Volts)
Typ. Typ.
ASMT-MW20-NLN00 Cool White 155 3.6
ASMT-MW22-NLN00
ASMT-MY20-NLM00 Warm White 135 3.6
ASMT-MY22-NLM00
ASMT-MWE0-NLM00 Cool White Diused 145 3.6
ASMT-MWE2-NLM00
ASMT-MYE0-NKM00 Warm White Diused 130 3.6
ASMT-MYE2-NKM00
6
Figure 2. Relative Intensity vs. Wavelength. Figure 3. Relative Luminous Flux vs. Forward Current.
Figure 4. Forward Current vs. Forward Voltage. Figure 5. Radiation Pattern.
Figure 6. Maximum pulse current vs. ambient temperature.
Derated based on TA = 25°C, RTJ-A = 30°C/W.
Figure 7. Maximum pulse current vs. ambient temperature.
Derated based on TA = 85°C, RTJ-A = 30°C/W.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
WARM WHITE
COOL WHITE
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
PULSE DURATION, tp - sec PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
PULSE CURRENT, IP - A
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
0 100 200 300 400 500 600 700
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 350 mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
D=tp
T
tp
IF
T
D =
0.05
0.10
0.25
0.50
1.00
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
D=tp
T
tp
IF
TD =
0.05
0.10
0.25
0.50
1.00
0
50
100
150
200
250
300
350
400
450
500
550
600
650
700
0 0.5 1 1.5 2 2.5 3 3.5 4
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
7
Figure 9. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 125°C, RθJ-A = 20°C/W, 25°C/W and 30°C/W.
Figure 10. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 125°C, RθJ-MS = 10°C/W.
Figure 11. Recommended Reow Soldering. Figure 12. Recommended soldering land pattern.
(Acc. to J-STD-020C)
217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 - 30 SEC.
TIME
TEMPERATURE
10.70±0.10
8.40±0.10
3.1±0.10
5.08±0.10
1.00±0.10
17.00±0.20
Figure 8. Relative Light Output vs. Junction Temperature.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
-50 -25 0 25 50 75 100 125
JUNCTION TEMPERATURE, TJ - °C
RELATIVE LIGHT OUTPUT
(NORMALIZED AT 25°C)
WARM WHITE
COOL WHITE
0
100
200
300
400
500
600
700
800
020 40 60 80 100 120 140
TA - AMBIENT TEMPERATURE - °C
MAX ALLOWABLE DC CURRENT - mA
0
100
200
300
400
500
600
700
800
0 20406080100 120 140
TMS - METAL SLUG TEMPERATURE - °C
MAX ALLOWABLE DC CURRENT - mA
RTJ-MS = 10°C/W
RTJ-A = 30°C/W
RTJ-A = 20°C/W
RTJ-A = 25°C/W
Note:
For detail information on reow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
8
Color Bin Selections [x3]
Individual reel will contain parts from one color bin selection only.
Cool White
Selection Bin ID
0 Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
G G only
H H only
L A and G only
M B and H only
N A and C only
P B and D only
Q E and C only
R F and D only
S G and H only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
2 G, H, A and B only
4 C, D, E and F only
Warm White
Selection Bin ID
0 Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
N A and C only
P B and D only
Q E and C only
R F and D only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
4 C, D, E and F only
Flux Bin Limit [x4, x5]
Bin
Luminous Flux (lm) at IF = 350mA
Min. Max.
K 56.0 73.0
L 73.0 95.0
M 95.0 124.0
N 124.0 161.0
Tolerance for each bin limits is ±10%.
Option Selection Details
ASMT – M x1 x2 x3 – N x4 x5 x6 x7
x4 – Minimum Flux Bin
x5 – Maximum Flux Bin
x6 – Color Bin Selection
x7 – Packaging Option
9
Color Bin Limit
Cool Color Limits
White (Chromaticity Coordinates)
Bin A X 0.367 0.362 0.329 0.329
Y 0.400 0.372 0.345 0.369
Bin B X 0.362 0.356 0.329 0.329
Y 0.372 0.330 0.302 0.345
Bin C X 0.329 0.329 0.305 0.301
Y 0.369 0.345 0.322 0.342
Bin D X 0.329 0.329 0.311 0.305
Y 0.345 0.302 0.285 0.322
Bin E X 0.303 0.307 0.283 0.274
Y 0.333 0.311 0.284 0.301
Bin F X 0.307 0.311 0.290 0.283
Y 0.311 0.285 0.265 0.284
Bin G X 0.388 0.379 0.362 0.367
Y 0.417 0.383 0.372 0.400
Bin H X 0.379 0.369 0.356 0.362
Y 0.383 0.343 0.330 0.372
Tolerance: ± 0.01
Warm Color Limits
White (Chromaticity Coordinates)
Bin A X 0.452 0.488 0.470 0.438
Y 0.434 0.447 0.414 0.403
Bin B X 0.438 0.470 0.452 0.424
Y 0.403 0.414 0.384 0.376
Bin C X 0.407 0.418 0.452 0.438
Y 0.393 0.422 0.434 0.403
Bin D X 0.395 0.407 0.438 0.424
Y 0.362 0.393 0.403 0.376
Bin E X 0.381 0.387 0.418 0.407
Y 0.377 0.404 0.422 0.393
Bin F X 0.373 0.381 0.407 0.395
Y 0.349 0.377 0.393 0.362
Tolerance: ± 0.01
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
Y - COORDINATE
Y - COORDINATE
B
C
ED
A
F
7k
10k
4.0k
G
H
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
B
C
E
D
A
F
3.0k
3.5k
4.0k
2.6k
5.6k
4.5k
Black Body Curve
Black Body Curve
Packaging Option [x7]
Selection Option
0 Tube
1 Tape and Reel
Example
ASMT-MW20-NLNZ0
ASMT-MW20-Nxxxx – Cool White, Electrically Non-isolated
Heat Sink, Non-diused
x4 = L – Minimum Flux Bin L
x5 = N – Maximum Flux Bin N
x6 = Z – Color Bin A and B only
x7 = 0 – Tube Option
Figure 14. Color bins (Warm White).Figure 13. Color bins (Cool White).
10
Dim Value
AO8.80±0.10
BO16.45±0.10
KO3.60±0.1
E 1.75±0.10
F 11.50±0.10
W 24.0±0.10
P 16.0±0.10
Q'ty/Reel 250 units
All dimensions in millimeters.
Tape & Reel – Option 1
Packing Tube – Option 0
Figure 15. Tube dimensions
Figure 16. Carrier tape dimensions
535.00
1.00
5.45
5.80
4.65
5.50
10.10
37.00
8.30
TOP VIEW
SIDE VIEW
A
A
B
Ao
B
P
SECTION B
SECTION A
Ko
W
F
E
Bo
2.5
11
Reel Dimension
R10.00
60.0º
268.00
330.00 ± 1.00
99.50 ± 1.00
2.30 2.30
24.0+1.00
−0.00
13.50 ± 0.50
2.50 ± 0.50
R10.50 ± 0.50
120.0º
END
MINIMUM OF 160 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS
MINIMUM OF 390 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
START
Figure 17. Carrier tape leader and trailer dimensions.
Figure 18. Reel dimensions.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1452EN - October 5, 2010
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly or
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
Moisture Sensitivity
This product is qualied as Moisture Sensitive Level 4 per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reow the LEDs per the original MSL
rating.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 72 hours.
C. Control for unnished reel
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their
oor life of 72 hours.
E. Baking is required if
– HIC “10%” indicator is not blue and “5%” indicator is
pink.
– The LEDs are exposed to condition of >30°C/60% RH
at any time.
– The LEDs oor life exceeded 72hrs.
Recommended baking condition: 60±5°C for 20hrs.
DISCLAIMER: Avago’s products and software are not specically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear
facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make
claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.