ASMT- Mx2x / ASMT- MxEx Moonstone 3W Power LED Light Source Data Sheet Description Features The Moonstone 3W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. x Available in Cool White & Warm White color The Cool White Power LED is available in various color temperature ranging from 4000K to 10000K and Warm White Power LED ranging from 2600K to 4000K. x High current operation The low profile package design is suitable for a wide variety of applications especially where height is a constraint. x Silicone encapsulation The package is compatible with reflow soldering. This will give more freedom and flexibility to the light source designer. x MSL 4 products Applications x Sign backlight x Safety, exit and emergency sign lightings x Specialty lighting such as task lighting and reading lights x Retail display x Commercial lighting x Accent or marker lightings, strip or step lightings x Portable lightings, bicycle head lamp, torch lights. x Decorative lighting x Architectural lighting x Pathway lighting x Street lighting x Pedestrian street lighting x Tunnel lighting x Energy efficient x Exposed pad for excellent heat transfer x Suitable for reflow soldering process x Long operation life x Wide viewing angle x Non-ESD sensitive (threshold > 16KV) x Available in both electrically isolated and non-isolated metal heat slug Specifications x InGaN Technology x 3.5V (max) at 350mA x 110 viewing angle Package Dimensions 10.00 1 Anode 2 Cathode 3 Heat Sink 3.30 8.50 Metal Slug 1.27 3 LED O 5.26 10.60 8.50 O 8.00 2.00 5.25 1.30 2 1 5.08 0.81 Figure 1. ASMT-Mx2x / ASMT-MxEx package outline drawing. Notes: 1. All dimensions are in millimeters. 2. Unless otherwise stated, the tolerance for dimension is 0.1mm. 3. Metal slug is connected to anode for electrically non-isolated option. 2 + - ZENER Part Numbering System ASMT - M x1 x2 x3 - N x4 x5 x6 x7 Packaging Option Color Bin Selection Max Flux Bin Selection Min Flux Bin Selection Heat Sink 0 - Electrically Non-isolated 2 - Electrically Isolated Silicone Type 2 - Non-diffused E - Diffused Color W - Cool White Y - Warm White Note: 1. Please refer to Page 8 for selection details. Device Selection Guide (TJ = 25C) Luminous Flux, )v[1,2] (lm) Part Number Color Min. Typ. Max. Test Current (mA) Die Technology Electrically Isolated Metal Slug ASMT-MW20-NLN00 Cool White 73.0 85.0 161.0 350 InGaN No Warm White 73.0 75.0 124.0 350 InGaN ASMT-MW22-NLN00 ASMT-MY20-NLM00 Yes ASMT-MY22-NLM00 ASMT-MWE0-NLM00 ASMT-MWE2-NLM00 ASMT-MYE0-NKM00 ASMT-MYE2-NKM00 Yes Cool White Diffused 73.0 80.0 124.0 350 InGaN Warm White Diffused 56.0 70.0 124.0 350 InGaN No Yes Notes: 1. )V is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is 10%. 3 No No Yes Absolute Maximum Ratings Parameter ASMT-Mx2x / ASMT-MxEx Units DC Forward Current [1] 700 mA Peak Pulsing Current [2] 1000 mA Power Dissipation 3010 mW LED Junction Temperature 125 C Operating Metal Slug Temperature Range at 350 mA -40 to +120 C Operating Metal Slug Temperature Range at 700 mA -40 to +95 C Storage Temperature Range -40 to +120 C Soldering Temperature Refer to Figure 11 Reverse Voltage [3] Not recommended Note: 1. Derate linearly based on Figure 9. 2. Pulse condition: duty factor = 10%, Frequency = 1 kHz. 3. Not designed for reverse bias operation. Optical Characteristics at 350 mA (TJ = 25C) Correlated Color Temperature, CCT (Kelvin) Viewing Angle 2T1/2 [1] () Luminous Efficiency (lm/W) Part Number Color Min. Max. Typ. Typ. ASMT-MW20-NLN00 Cool White 4000 10000 110 76 Warm White 2600 4000 110 67 Cool White Diffused 4000 10000 110 71 Warm White Diffused 2600 4000 110 63 ASMT-MW22-NLN00 ASMT-MY20-NLM00 ASMT-MY22-NLM00 ASMT-MWE0-NLM00 ASMT-MWE2-NLM00 ASMT-MYE0-NKM00 ASMT-MYE2-NKM00 Notes: 1. T1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4 Electrical Characteristic at 350 mA (TJ = 25C) Forward Voltage, VF (Volts) Thermal Resistance, RTj-ms (C/W) [1] Temperature Coefficient of Forward Voltage (mV/C), 'VF/'TJ Dice Type Min. Typ. Max. Typ. Typ. InGaN 2.8 3.2 3.5 10 -1.5 to -3.5 Luminous Flux, V (lm) Forward Voltage, VF (Volts) Note: 1. RTj-ms is the Thermal Resistance from LED junction to metal slug. Optical and Electrical Characteristic at 700 mA (TJ = 25C) Part Number Color Typ. Typ. ASMT-MW20-NLN00 Cool White 155 3.6 Warm White 135 3.6 Cool White Diffused 145 3.6 Warm White Diffused 130 3.6 ASMT-MW22-NLN00 ASMT-MY20-NLM00 ASMT-MY22-NLM00 ASMT-MWE0-NLM00 ASMT-MWE2-NLM00 ASMT-MYE0-NKM00 ASMT-MYE2-NKM00 5 WARM WHITE COOL WHITE 380 430 480 530 580 630 WAVELENGTH - nm 680 RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 mA) RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 730 780 0 0 0.5 1 1.5 2 2.5 FORWARD VOLTAGE - V 3 3.5 600 700 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 5. Radiation Pattern. 1.4 D= 0.05 0.10 0.25 0.50 1.00 1.0 0.8 1.2 D = PULSE CURRENT, IP - A 1.2 PULSE CURRENT, IP - A -60 -90 1.4 0.6 0.4 D= tp T 0.0 0.00001 0.0001 0.001 0.01 0.1 1 PULSE DURATION, tp - sec Figure 6. Maximum pulse current vs. ambient temperature. Derated based on TA = 25C, RTJ-A = 30C/W. 6 200 300 400 500 MONO PULSE CURRENT - mA 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 4 Figure 4. Forward Current vs. Forward Voltage. 0.2 100 Figure 3. Relative Luminous Flux vs. Forward Current. NORMALIZED INTENSITY FORWARD CURRENT - mA Figure 2. Relative Intensity vs. Wavelength. 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 tp tp T tp IF T 1.0 0.8 0.6 D= 0.05 0.10 0.25 0.50 1.00 0.4 0.2 IF T 10 100 0.0 0.00001 0.0001 0.001 0.01 0.1 1 PULSE DURATION, tp - sec Figure 7. Maximum pulse current vs. ambient temperature. Derated based on TA = 85C, RTJ-A = 30C/W. 10 100 RELATIVE LIGHT OUTPUT (NORMALIZED AT 25C) 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 WARM WHITE COOL WHITE -50 -25 0 25 50 75 JUNCTION TEMPERATURE, TJ - C 100 125 800 800 700 700 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA Figure 8. Relative Light Output vs. Junction Temperature. 600 500 400 RTJ-A = 20C/W RTJ-A = 25C/W RTJ-A = 30C/W 300 200 100 0 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE - C 120 140 Figure 9. Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125C, RJ-A = 20C/W, 25C/W and 30C/W. 600 500 400 RTJ-MS = 10C/W 300 200 100 0 0 20 40 60 80 100 120 TMS - METAL SLUG TEMPERATURE - C 140 Figure 10. Maximum Forward Current vs. Metal Slug Temperature. Derated based on TJMAX = 125C, RJ-MS = 10C/W. 10.700.10 TEMPERATURE 10 - 30 SEC. 217C 200C 8.400.10 255 - 260C 3C/SEC. MAX. 6C/SEC. MAX. 150C 17.000.20 1.000.10 3C/SEC. MAX. 3.10.10 100 SEC. MAX. 60 - 120 SEC. 5.080.10 TIME Figure 11. Recommended Reflow Soldering. (Acc. to J-STD-020C) Figure 12. Recommended soldering land pattern. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 7 Option Selection Details Flux Bin Limit [x4, x5] Luminous Flux (lm) at IF = 350mA ASMT - M x1 x2 x3 - N x4 x5 x6 x7 x4 - Minimum Flux Bin x5 - Maximum Flux Bin x6 - Color Bin Selection x7 - Packaging Option Bin Min. Max. K 56.0 73.0 L 73.0 95.0 M 95.0 124.0 N 124.0 161.0 Tolerance for each bin limits is 10%. Color Bin Selections [x3] Individual reel will contain parts from one color bin selection only. Cool White Warm White Selection Bin ID Selection Bin ID 0 Full Distribution 0 Full Distribution A A only A A only B B only B B only C C only C C only D D only D D only E E only E E only F F only F F only G G only N A and C only H H only P B and D only L A and G only Q E and C only M B and H only R F and D only N A and C only U E and F only P B and D only W C and D only Q E and C only Z A and B only R F and D only 1 A, B, C and D only S G and H only 4 C, D, E and F only U E and F only W C and D only Z A and B only 1 A, B, C and D only 2 G, H, A and B only 4 C, D, E and F only 8 Color Bin Limit Cool White Color Limits (Chromaticity Coordinates) Warm White Color Limits (Chromaticity Coordinates) Bin A X Y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 Bin A X Y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 Bin B X Y 0.362 0.372 0.356 0.330 0.329 0.302 0.329 0.345 Bin B X Y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 Bin C X Y 0.329 0.369 0.329 0.345 0.305 0.322 0.301 0.342 Bin C X Y 0.407 0.393 0.418 0.422 0.452 0.434 0.438 0.403 Bin D X Y 0.329 0.345 0.329 0.302 0.311 0.285 0.305 0.322 Bin D X Y 0.395 0.362 0.407 0.393 0.438 0.403 0.424 0.376 Bin E X Y 0.303 0.333 0.307 0.311 0.283 0.284 0.274 0.301 Bin E X Y 0.381 0.377 0.387 0.404 0.418 0.422 0.407 0.393 Bin F X Y 0.307 0.311 0.311 0.285 0.290 0.265 0.283 0.284 Bin F X Y 0.373 0.349 0.381 0.377 0.407 0.393 0.395 0.362 Bin G X Y 0.388 0.417 0.379 0.383 0.362 0.372 0.367 0.400 Tolerance: 0.01 Bin H X Y 0.379 0.383 0.369 0.343 0.356 0.330 0.362 0.372 0.44 0.42 0.40 G 0.38 A 4.0k 0.36 4.5k C B H 0.34 5.6k Black Body Curve 0.32 7k D E 0.30 10k F 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X - COORDINATE 0.48 0.46 0.44 Y - COORDINATE Y - COORDINATE Tolerance: 0.01 A 0.42 C 0.40 0.38 0.36 E 4.0k F 3.5k D 3.0k B 2.6k Black Body Curve 0.34 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 X - COORDINATE Figure 13. Color bins (Cool White). Figure 14. Color bins (Warm White). Packaging Option [x7] Example Selection Option ASMT-MW20-NLNZ0 0 Tube 1 Tape and Reel ASMT-MW20-Nxxxx - Cool White, Electrically Non-isolated Heat Sink, Non-diffused x4 = L - Minimum Flux Bin L x5 = N - Maximum Flux Bin N x6 = Z - Color Bin A and B only x7 = 0 - Tube Option 9 Packing Tube - Option 0 1.00 5.80 4.65 5.50 37.00 5.45 10.10 8.30 535.00 SIDE VIEW TOP VIEW Figure 15. Tube dimensions Tape & Reel - Option 1 E A Value AO 8.800.10 BO 16.450.10 KO 3.600.1 E 1.750.10 F 11.500.10 W 24.00.10 P 16.00.10 Q'ty/Reel 250 units B Bo W F Dim 2.5 B A Ko P SECTION A All dimensions in millimeters. Ao SECTION B Figure 16. Carrier tape dimensions 10 END START MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 17. Carrier tape leader and trailer dimensions. Reel Dimension +1.00 24.0 -0.00 2.30 2.30 0 2.50 0.50 0 60. 99.50 1.00 R10.0 0 0.5 268.00 R1 13.50 330.00 1.00 120.0 Figure 18. Reel dimensions. 11 .50 0 0.50 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C/60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 72 hours. C. Control for unfinished reel Moisture Sensitivity This product is qualified as Moisture Sensitive Level 4 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). - For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembly boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 72 hours. E. Baking is required if - HIC "10%" indicator is not blue and "5%" indicator is pink. - The LEDs are exposed to condition of >30C/60% RH at any time. - The LEDs floor life exceeded 72hrs. Recommended baking condition: 605C for 20hrs. DISCLAIMER: Avago's products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2010 Avago Technologies. All rights reserved. AV02-1452EN - October 5, 2010