Approval sheet
Page 5 of 7 ASC_MR18-20-25X_V03 June.2011
CATALOGUE NUMBERS
The resistors have a catalogue number starting with .
MR25 X 472_ J T L
Size code
MR25 : 2512
MR20 : 2010
MR18 : 1218
Type code
X :
±5%: 1Ω-10MΩ
±1%: 10Ω-1MΩ
W :
±1%: < 10Ω; >1MΩ
Resistance code
±5%: E24: 2 significant digits
followed by no. of zeros
100Ω = 101_
10KΩ = 103
±11%: E96: 3 significant
digits followed by no. of
zeros
102Ω =1020
37.4KΩ =3742
Tolerance
F : ±1%
J : ±5%
P : Jumper
Packaging code
T : 7” Reeled taping
Q : 10” Reeled taping
G : 13” Reeled taping
B : Bulk
Termination
code
L = Sn base
(lead free)
* Anti-Sulfuration test conditions: H2S 3ppm, 40’C, RH 90%, 1000hrs, criteria: +/-1% !
* 100% CCD visual inspection to guarantee visual quality !
TEST AND REQUIREMENTS
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
REQUIREMENT
TEST PROCEDURE / TEST METHOD Resistor 0Ω
ΩΩ
Ω
Electrical
Characteristics
JISC5201-1: 1998
Clause 4.8
-
DC resistance values measurement
-
Temperature Coefficient of Resistance (T.C.R)
Natural resistance change per change in degree centigrade.
( )
6
121
12 10×
−
ttR RR
(ppm/°C) t
1
: 20°C+5°C-1°C
R
1
: Resistance at reference temperature
R
2
: Resistance at test temperature
Within the specified tolerance
Refer to “QUICK REFERENCE DATA”
Resistance to
soldering heat
(R.S.H)
MIL-STD-202
method 210
Un-mounted chips completely immersed for 10±1second in a SAC
solder bath at 270℃±5ºC ∆R/R max. ±(0.5%+0.05Ω)
No visible damage