1. General description
The HEF4001B is a quad 2-in put NOR gate. The output s are fully bu ffered for the highest
noise immunity and pattern insensitivity to output impedance.
It operates over a recommended VDD power supply r ange of 3 V to 15 V referenced to V SS
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.
2. Features and benefits
Fully static operation
5 V, 10 V, and 15 V parametric ratings
St andardized symmetrical output characte ristics
Specified from 40 C to +125 C
Complies with JEDEC standard JESD 13-B
Inputs and outputs are protected against electrosta tic effects
3. Ordering information
4. Functional diagram
HEF4001B
Quad 2-input NOR gate
Rev. 9 — 21 November 2011 Product data sheet
Table 1. Ordering information
All types operate from
40
C to +125
C
Type number Package
Name Description Version
HEF4001BP DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1
HEF4001BT SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
Fig 1. Functional di ag ram Fig 2. Logic diagram (one ga te)
001aag194
1
23
1B
1A 1Y
5
64
2B
2A 2Y
8
910
3B
3A 3Y
12
13 11
4B
4A 4Y
001aag195
nY
nA
nB
HEF4001B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 21 November 2011 2 of 12
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
5. Pinning information
5.1 Pinning
5.2 Pin description
6. Functional description
[1] H = HIGH voltage level; L = LOW voltage level.
Fig 3. Pin configuratio n
HEF4001B
1A VDD
1B 4B
1Y 4A
2Y 4Y
2A 3Y
2B 3B
VSS 3A
001aag196
1
2
3
4
5
6
7 8
10
9
12
11
14
13
Table 2. Pin description
Symbol Pin Description
nA 1, 5, 8, 12 input
nB 2, 6, 9, 13 input
nY 3, 4, 10, 11 output
VSS 7 ground (0 V)
VDD 14 supply voltage
Table 3. Function table[1]
Input Output
nA nB nY
LLH
LHL
HLL
HHL
HEF4001B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 21 November 2011 3 of 12
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
7. Limiting values
[1] For DIP14 packages: above Tamb = 70 C, Ptot derates linearly with 12 mW/K.
[2] For SO14 packages: above Tamb = 70 C, Ptot derates linearly with 8 mW/K.
8. Recommended operating conditions
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0.5 +18 V
IIK input clamping current VI<0.5 V or VI>V
DD + 0.5 V - 10 mA
VIinput voltage 0.5 VDD + 0.5 V
IOK output clamping curre nt VO<0.5 V or VO>V
DD + 0.5 V - 10 mA
II/O input/output current - 10 mA
IDD supply current - 50 mA
Tstg storage temperature 65 +150 C
Tamb ambient temperature 40 +125 C
Ptot total power dissipation Tamb = 40 C to + 125 C
DIP14 [1] -750mW
SO14 [2] -500mW
P power dissipation per output - 100 mW
Table 5. Recommended operating con ditions
Symbol Parameter Conditions Min Typ Max Unit
VDD supply voltage 3 - 15 V
VIinput voltage 0 - VDD V
Tamb ambient temperature in free air 40 - +125 C
t/V input transition rise and fall rate VDD = 5 V --3.75s/V
VDD = 10 V --0.5s/V
VDD = 15 V --0.08s/V
HEF4001B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 21 November 2011 4 of 12
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
9. Static characteristics
Table 6. Static characteristics
VSS = 0 V; VI=V
SS or VDD; unless otherwise specified.
Symbol Parameter Conditions VDD Tamb = 40 C Tamb = +25 C Tamb = +85 C Tamb = +125 CUnit
Min Max Min Max Min Max Min Max
VIH HIGH-level
input voltage IO < 1 A 5 V 3.5 - 3.5 - 3.5 - 3.5 - V
10 V7.0-7.0-7.0-7.0 - V
15 V 11.0 - 11.0 - 11.0 - 11.0 - V
VIL LOW-level
input voltage IO < 1 A 5 V - 1.5 - 1.5 - 1.5 - 1.5 V
10 V - 3.0 - 3.0 - 3.0 - 3 .0 V
15 V - 4.0 - 4.0 - 4.0 - 4 .0 V
VOH HIGH-level
output voltage IO < 1 A 5 V 4.95 - 4.95 - 4.95 - 4.95 - V
10 V 9.95 - 9.95 - 9.95 - 9.95 - V
15 V 14.95 - 14.95 - 14.95 - 14.95 - V
VOL LOW-level
output voltage IO < 1 A 5 V - 0.05 - 0.05 - 0.05 - 0.05 V
10 V - 0.05 - 0.05 - 0.05 - 0.05 V
15 V - 0.05 - 0.05 - 0.05 - 0.05 V
IOH HIGH-level
output current VO = 2.5 V 5 V - 1.7 - 1.4 - 1.1 - 1.1 mA
VO = 4.6 V 5 V - 0.64 - 0.5 - 0.36 - 0.36 mA
VO = 9.5 V 10 V - 1.6 - 1.3 - 0.9 - 0.9 mA
VO = 13.5 V 15 V - 4.2 - 3.4 - 2.4 - 2.4 mA
IOL LOW-level
output current VO = 0.4 V 5 V 0.64 - 0.5 - 0.36 - 0.36 - mA
VO = 0.5 V 10 V 1.6 - 1.3 - 0.9 - 0.9 - mA
VO = 1.5 V 15 V 4.2 - 3.4 - 2.4 - 2.4 - mA
IIinput leakage
current 15 V - 0.1 - 0.1 - 1.0 - 1.0 A
IDD supply current all valid input
combinations;
IO=0A
5 V - 0.25 - 0.25 - 7.5 - 7.5 A
10 V - 0.5 - 0.5 - 15.0 - 15.0 A
15 V - 1.0 - 1.0 - 30.0 - 30.0 A
CIinput
capacitance ---7.5-- - -pF
HEF4001B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 21 November 2011 5 of 12
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
10. Dynamic characteristics
[1] The typical value of the propagation delay and output transition time can be calculated with the extrapolation formula (CL in pF).
Table 7. Dynamic characteristics
Tamb = 25
C; for wavefo rms see Figure 4; for test circuit see Figure 5; unless otherwise specified.
Symbol Parameter Extrapolation formula[1] VDD Min Typ Max Unit
tPHL HIGH to LOW propagation delay 33 + 0.55 CL5 V - 60 120 ns
14 + 0.23 CL10 V - 25 50 ns
12 + 0.16 CL15 V - 20 40 ns
tPLH LOW to HIGH propagation delay 23 + 0.55 CL5 V - 50 100 ns
14 + 0.23 CL10 V - 25 45 ns
12 + 0.16 CL15 V - 20 35 ns
tTHL HIGH to LOW output transition time 10 + 1.00 CL5 V - 60 120 ns
9 + 0.42 CL10 V - 30 60 ns
6 + 0.28 CL15 V - 20 40 ns
tTLH LOW to HIGH output transition time 10 + 1.00 CL5 V - 60 120 ns
9 + 0.42 CL10 V - 30 60 ns
6 + 0.28 CL15 V - 20 40 ns
Table 8. Dynamic power dissipation
VSS = 0 V; tr = tf
20 ns; Tamb = 25
C.
Symbol Parameter VDD Typical formula Where
PDdynamic power dissipation 5 V PD = 1100 fi + (fo CL) VDD2 (W) fi = input frequ ency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
(fo CL) = sum of the outputs;
VDD = supply voltage in V.
10 V PD = 5000 fi + (fo CL) VDD2 (W)
15 V PD = 14200 fi + (fo CL) VDD2 (W)
HEF4001B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 21 November 2011 6 of 12
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
11. Waveforms
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 4. Prop a ga tio n de la y, output transition time
001aag197
input
output
tPLH
tPHL
0 V
VI
VM
VM
VOH
VOL tTLH
tTHL
90 %
10 %
10 %
90 %
trtf
Table 9. Measurement points
Supply voltage Input Output
VDD VMVM
5 V to 15 V 0.5VDD 0.5VDD
Test data is given in Table 10.
Definitions for test circuit:
DUT = Device Under Test.
CL= load capacitance including jig and probe capacitance.
RT= termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig 5. Test circuit for measuring switching times
VDD
VIVO
001aag182
DUT
CL
RT
G
Table 10. Test data
Supply voltage Input Load
VDD VItr, tfCL
5 V to 15 V VSS or VDD 20 ns 5 0 pF
HEF4001B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 21 November 2011 7 of 12
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
12. Package outline
Fig 6. Package outline SOT27-1 (DIP14)
UNIT A
max. 1 2 (1) (1)
b1cD (1)
Z
Ee M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT27-1 99-12-27
03-02-13
A
min. A
max. bmax.
w
ME
e1
1.73
1.13 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.24.2 0.51 3.2
0.068
0.044 0.021
0.015 0.77
0.73
0.014
0.009 0.26
0.24 0.14
0.12 0.010.1 0.3 0.32
0.31 0.39
0.33 0.0870.17 0.02 0.13
050G04 MO-001 SC-501-14
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
14
1
8
7
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1
HEF4001B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 21 November 2011 8 of 12
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
Fig 7. Package outline SOT108-1 (SO14)
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 8.75
8.55 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
7
8
1
14
y
076E06 MS-012
pin 1 index
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.35
0.34 0.16
0.15 0.05
1.05
0.041
0.244
0.228 0.028
0.024 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
99-12-27
03-02-19
0 2.5 5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
HEF4001B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 21 November 2011 9 of 12
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
13. Abbreviations
14. Revision history
Table 11. Abbreviations
Acronym Description
DUT Device Under Test
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
HEF4001B v.9 20111121 Product data sheet - HEF4001B v.8
Modifications: Legal pages updated.
Changes in “General description” and “Features and benefits”.
Section “Applications” removed.
HEF4001B v.8 20110913 Product data sheet - HEF40 01B v.7
HEF4001B v.7 20091027 Product data sheet - HEF4001B v.6
HEF4001B v.6 20090618 Product data sheet - HEF4001B v.5
HEF4001B v.5 20080327 Product data sheet - HEF4001B v.4
HEF4001B v.4 20070731 Product data sheet - HEF4001B_CNV v.3
HEF4001B_CNV v.3 19950101 Product specification - HEF4001B_CNV v.2
HEF4001B_CNV v.2 19950101 Product specification - -
HEF4001B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 21 November 2011 10 of 12
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still unde r
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sh eet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ionThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those descri bed in the
Product data sheet.
15.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, bre ach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semi conductors’ aggreg ate and cumulative li ability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and with out
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from competent authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
HEF4001B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 21 November 2011 11 of 12
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neither qua lified nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting f rom customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
15.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors HEF4001B
Quad 2-input NOR gate
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of rele ase: 21 Novem ber 2011
Document iden tifier: HE F4001B
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 1
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Functional description . . . . . . . . . . . . . . . . . . . 2
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Recommended operating conditions. . . . . . . . 3
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
16 Contact information. . . . . . . . . . . . . . . . . . . . . 11
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12