To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
5. When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
© 1987
BIPOLAR ANALO G INTEG RATED CIRCUIT
µ
µµ
µ
PC4071
J-FET INPUT LOW-NOISE OPERATIONAL AMPLIFIER
DATA SHEET
Document No. G15204EJ4V0DS00 (4th edition)
(Previous No. IC-1616)
Date Published November 2000 NS CP(K)
Printed in Japan
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
The mark ★ shows major revised points.
DESCRIPTION
The
µ
PC4071 is a J-FET input operational amplifier. This product is designed as low noise version of the
µ
PC4081.
The features of the
µ
PC4071 are more improved input equivalent noise voltage, input offset voltage and input bias
current than those of
µ
PC4081. By these features, the
µ
PC4071 is excellent choice for wide variety of applications
including audio preamplifier and active filter.
FEATURES
•Low noise: en = 18 nV/ Hz (TYP.)
•Very low input bias and offset currents
•Output short circuit protection
•High input impedance...J-FET Input stage
•Internal frequency compensation
•High slew rate...13 V/
µ
s (TYP.)
ORDERING INFORMATION
Part Number Package
µ
PC4071C 8-pin plastic DIP (7.62 mm (300))
µ
PC4071G2 8-pin plastic SOP (5.72 mm (225))
EQUIVALENT CIRCUIT PIN CONFIGURATION (Top View)
PC4071C, 4071G2
1
2
3
4
8
7
6
5
NC
V
+
OUT
OFFSET
NULL
+
_
OFFSET
NULL
I
I
I
N
V
µ
_
Remark NC : No Connection
R
1
R
8
R
9
R
6
D
1
R
7
R
10
R
11
D
2
Q
15
R
4
R
2
R
5
R
3
I
I
I
N
(2) Q
1
Q
2
Q
8
Q
16
Q
9
Q
10
Q
12
Q
13
Q
5
Q
14
Q
3
Q
4
Q
11
Q
6
Q
7
C
1
OFFSET
NULL OFFSET
NULL
OUT
V
–
V
+
(3)
(1) (5) (6)
(4)
(7)
Data Sheet G15204EJ4V0DS
2
µ
µµ
µ
PC4071
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Parameter Symbol Ratings Unit
Voltage bet ween V+ and V– Not e 1 V+ – V––0.3 to +36 V
Different i al Input Vol t age VID ±30 V
Input Vol tageNote 2 VIV––0.3 to V+ +0.3 V
Output Vol t ageNo te 3 VOV––0.3 to V+ +0.3 V
C PackageNote 4 350 mWPower Dissipatio n
G2 PackageNote 5
PT
440 mW
Output Short Circuit DurationNot e 6 Indefinite sec
Operating Ambi ent Temperature TA–20 to +80 °C
Storage Temperat ure Tstg –55 to +125 °C
Notes 1. Reverse connection of supply voltage can cause destruction.
2. The input voltage should be allowed to input without damage or destruction. Even during the transition
period of supply voltage, power on/off etc., this specification should be kept. The normal operation will
establish when the both inputs are within the Common Mode Input Voltage Range of electrical
characteristics.
3. This specification is the voltage which should be allowed to supply to the output terminal from external
without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this
specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of
electrical characteristics.
4. Thermal derating factor is –5.0 mV/°C when operating ambient temperature is higher than 55°C.
5. Thermal derating factor is –4.4 mV/°C when operating ambient temperature is higher than 25°C.
6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4
and Note 5.
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol MIN. TYP. MAX. Unit
Supply V ol tage V±±5±16 V
Output Current IO±10 mA
Capaciti ve Load (AV = +1, Rf = 0 Ω)C
L100 pF
OFFSET VOLTAGE NULL CIRCUIT
+
_
2
35
1
6
100 kΩ
VR
1
V
_
Remark The OFFSET NULL pins should be left
open or connected to V– via a resistor as
shown in the left figure. Don't connect to
any lines other than V–, otherwise
mulfunction, degradation, or failure may
occur.
★
Data Sheet G15204EJ4V0DS 3
µ
µµ
µ
PC4071
ELECTRICAL CHARACTERISTICS (TA = 25°C, V±
±±
± = ±
±±
±15 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Input Offset V ol t age VIO RS ≤ 50 Ω±3±10 mV
Input Offset Current Note 7 IIO ±5±50 pA
Input Bi as Current Not e 7 IB30 200 pA
Large Signal Vol tage Gain AVRL ≥ 2 kΩ , VO = ±10 V 25000 200000
Supply Current ICC IO = 0 A 2.0 2.7 mA
Common Mode Rejection Rati o CMR 70 86 dB
Supply V ol tage Reject i on Ratio SVR 70 86 dB
RL ≥ 10 kΩ±12 ±13.5 VOutput Vol t age Swing Vom
RL ≥ 2 kΩ±10 ±12 V
Common Model I nput Voltage Range VICM ±10 V
Slew Rate SR AV = 1 13 V/
µ
s
Unity Gain Frequency funity 3MHz
Input Equi valent Noise Voltage VnRS = 100 Ω, f = 10 Hz to 10 kHz 4
µ
Vr.m.s.
Input Equi valent Noise Voltage Density enRS = 100 Ω, f = 1 kHz 18 nV/√Hz
Input Offset V ol t age VIO RS ≤ 50 Ω, TA = –20 to +70°C±13mV
Average VIO Tem perature Drift ∆VIO/∆TT
A = –20 to +70°C±10
µ
V/°C
Input Offset Current No te 7 IIO TA = –20 to +70°C±2nA
Input Bi as CurrentNot e 7 IBTA = –20 to +70°C7nA
Notes 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input
stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the
junction temperature close to the operating ambient temperature.
Data Sheet G15204EJ4V0DS
4
µ
µµ
µ
PC4071
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.)
20
600
500
400
300
200
100
0
−5
00
10
20
30
40
10
20
30
−4
−3
−2
−1
0
0.01
0.1
1.0
10
100
1
2
3
4
5
0
20
40
60
80
100
120
100 1 k 10 k
±
10
±
20
100 k 1 M 10 M
−40 −20 0 20
T
A
- Operating Ambient Temperature - °C
INPUT OFFSET VOLTAGE INPUT BIAS CURRENT
T
A
- Operating Ambient Temperature - °C
40 60 80
1
−200 20406080
100 10 k 1 M1 k10 100 k 10 M
40 60 80 100
PC4071G2
PC4071C
T
A
- Operating Ambient Temperature - °C
f - Frequency - Hz V
±
- Supply Voltage - V
LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING
f - Frequency - Hz
POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE
P
T
- Total Power Dissipation - mWV
om
- Output Voltage Swing - V
p-p
V
IO
- Input Offset Voltage - mV
A
V
- Open Loop Voltage Gain - dBV
om
- Output Voltage Swing - V
p-p
I
B
- Input Bias Current - nA
V
±
= ±15 V
R
L
= 2 kΩ
V
±
=
±
15 V V
±
=
±
15 V
µ
µ
200°C/W
227°C/W
V= ±15 V R
L
= 10 kΩ
±
V= ±10 V
±
V= ±5 V
±
R
L
= 10 kΩ
Data Sheet G15204EJ4V0DS 5
µ
µµ
µ
PC4071
VO - Output Voltage - V
VOLTAGE FOLLOWER PULSE RESPONSE
t - Time - s
µ
0
−5
0
5
123
Voltage Density - nV/ Hz
en - Input Equivalent Noise
INPUT EQUIVALENT NOISE VOLTAGE DENSITY
f - Frequency - Hz
10
10
10
10
10
1100 1 k 10 k 100 k
OUTPUT VOLTAGE SWING
RL - Load Resistance - Ω
0300 1 k 10 k
10
20
30
R
S
= 100 Ω
V =
±
15 V
V =
±
15 V
AV = +1
RL = 2 kΩ
CL = 100 pF
V± = ±15 V
4
VI - Input Voltage - V /
−5
0
5
±
±
100 3 k
Vom - Output Voltage Swing - Vp-p
ICC - Supply Current - mA
SUPPLY CURRENT
V± - Supply Voltage - V
±5
0
0.5
1.0
1.5
2.0
2.5
±10 ±15 ±20
4
3
2
Data Sheet G15204EJ4V0DS
6
µ
µµ
µ
PC4071
PACKAGE DRAWINGS (Unit : mm)
14
85
ITEM MILLIMETERS
NOTES
1. Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
P8C-100-300B,C-2
N 0.25
P 0.9 MIN.
R0∼15°
A 10.16 MAX.
B 1.27 MAX.
F 1.4 MIN.
G 3.2±0.3
J 5.08 MAX.
K 7.62 (T.P.)
C 2.54 (T.P.)
D 0.50±0.10
H 0.51 MIN.
I 4.31 MAX.
L 6.4
M 0.25+0.10
−0.05
2. ltem "K" to center of leads when formed parallel.
M
A
R
M
P
I
J
H
G
F
DN
C
B
8-PIN PLASTIC DIP (7.62mm(300))
L
K
★
Data Sheet G15204EJ4V0DS 7
µ
µµ
µ
PC4071
ITEM
B
C
I
8-PIN PLASTIC SOP (5.72 mm (225))
D
E
F
G
H
J
P
MILLIMETERS
1.27 (T.P.)
0.78 MAX.
4.4±0.15
0.1±0.1
0.42
1.59±0.21
6.5±0.3
1.49
+0.08
−0.07
1.1±0.2
3°+7°
−3°
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition. A 5.2 +0.17
−0.20
K
L
M
N
0.6±0.2
0.17
0.12
0.10
+0.08
−0.07
S8GM-50-225B-6
85
14
S
M
C
detail of lead end
A
M
SN
FG
B
E
D
P
H
IJ
K
L
Data Sheet G15204EJ4V0DS
8
µ
µµ
µ
PC4071
RECOMMENDED SOLDER ING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL"(C10535E).
Type of Surface Mount Device
µ
µµ
µ
PC4071G2: 8-pin plastic SOP (5.72 mm (225))
Process Conditions Symbol
Infrared Ray Reflow Peak temperature: 230°C or below (P ackage s urface tem perature),
Reflow ti m e: 30 seconds or less (at 210°C or higher),
Maxim um num ber of reflow proc esses: 1 time.
IR30-00-1
Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature),
Reflow ti m e: 40 seconds or less (at 200°C or higher),
Maxim um num ber of reflow proc esses: 1 time.
VP15-00-1
Wave Solderi ng Solder tem perature: 260°C or below, Fl ow time: 10 seconds or l ess,
Maxim um num ber of flow proc esses: 1 time,
Pre-heating t em perature: 120°C or below (Package surface tem perature).
WS60-00-1
Partial Heating Method Pin temperature: 300°C or bel ow,
Heat tim e: 3 seconds or l ess (Per each side of the devic e).
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µ
µµ
µ
PC4071C: 8-pin plastic DIP (7.62 mm (300))
Process Conditions
Wave Solderi ng
(only to l eads)
Solder tem perat ure: 260°C or below,
Flow time: 10 seconds or l ess.
Partial Heating Method Pin tem perat ure: 300°C or below,
Heat tim e: 3 seconds or l ess (per each l ead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
★
Data Sheet G15204EJ4V0DS 9
µ
µµ
µ
PC4071
[MEMO]
Data Sheet G15204EJ4V0DS
10
µ
µµ
µ
PC4071
[MEMO]
Data Sheet G15204EJ4V0DS 11
µ
µµ
µ
PC4071
[MEMO]
µ
µµ
µ
PC4071
M8E 00. 4
The information in this document is current as of November, 2000. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
