APDS-9120-020 - Avago Technologies

APDS-9120

Integrated Optical Proximity Sensors

Data Sheet

Description

Avago’s APDS-9120 is an integrated optical proximity

sensor that combines built-in signal conditioning and

space-saving packaging technology.

This integrated sensor provides ease of use, as it elimi-

nates design eﬀorts required in implementing external

LED drivers, signal ﬁltering and ampliﬁcation, sunlight

and ambient light immunity and LED stuck high protec-

tion circuit.

APDS-9120 is designed to be a robust proximity sensor.

It has artiﬁcial light immunity and operates in sunlight

exposure. Both analog and/or digital output options are

available.

To maximize power savings and battery life in applications

such as portable or battery-operated devices, APDS-9120

has a shutdown mode feature. With an external limiting

resistor, the LED current of the optical proximity sensors

can be conﬁgured to various levels. The pulse width,

burst rate, duty cycle and frequency can be controlled

to minimize power consumption. These features make it

ideal for low power mobile and handheld devices.

Application Support Information

The Application Engineering Group is available to assist

you with the application design associated with APDS-

9120 module. You can contact them through your local

sales representatives for additional details.

Features

x Small form factor with conditioning IC, emitter and

detector integrated into one single package

– H1.1mm x W4.4mm x L4.4mm

x Low power consumption

– LED pulse width control

– Low shut down current

– External LED drive-current control

x Shutdown current 1PA max

x Supply voltage : 2.4 V to 3.6 V

x Typical detection distance 30mm based on Kodak 18%

grey card

x Artiﬁcial light immunity

x Operational in sunlight conditions

x Analog & Digital output available

– Built in hysteresis comparator for digital output

x LED stuck Hi protection

Applications

x PDA and mobile phones

x Portable and Handheld devices

x Personal Computers/Notebooks

x Contactless Switches

Ordering Information

Part Number Package Type Shipping Option

APDS-9120-020 Tape & Reel 2500

Absolute Maximum Ratings (Ta=25°C)

Parameter Symbol Min. Max. Units Conditions

Supply Voltage VCC 0 4.0 V

Peak LED Current ILEDpk 0 500 mA Pulsed at 12.5% Duty-cycle

Reﬂow Soldering Temperature 260 °C

Input Logic Voltage VI 0 4.0 V

Recommended Operating Conditions

Parameter Symbol Min. Max. Units Conditions

Operating Temperature TA-40 85 °C

Storage Temperature TS-40 100 °C

Supply Voltage VCC 2.4 3.6 V

Electrical & Optical Speciﬁcations (Ta=25°C)

Parameters Symbol Min. Typ. Max. Units Conditions

Input

Logic High Voltage, LEDON VIH 1.6 – VCC V

Logic High Voltage, ENB VIH 1.4 – VCC V For VCC = 2.4V

1.5 – VCC V For 2.4 <VCC d 3V

1.7 – VCC V For 3 < VCC d 3.6V

Logic Low Voltage, LEDON VIL 0 – 0.3 V

Logic Low Voltage, ENB VIL 0 – 0.3 V

Logic High Input Current, LEDON IIH – 0.1 1 PAVI ≥ VIH

Logic High Input Current, ENB IIH – 0.1 1 PAVI ≥ VIH

Logic Low Input Current, LEDON IIL – 0.1 1 PAVI ≤ VIL

Logic Low Input Current, ENB IIL – 0.1 1 PAVI ≤ VIL

Shutdown Current ISD – 0.3 1 PAVCC = 3V, ENB = 3V

Idle Current ICC – 500 650 PAVCC = 3V, ENB = 0V

Output

Analog Output VPFILT 1.25 1.9 2.55 V VCC = 3V, ENB = 0V, LEDON = 10

kHz, 50% DC, Continuous pulses;

R3 = 1Mohm, C3 = 3.3nF;

Kodak 18% grey card at detectable

distance = 10mm from the APDS-

9120

Digital Output VOL 0 – 0.3 V IDOUT(Low) = 2mA, VCC = 3V

Rise Time(DOUT) TR–1–PsV

CC = 3V, R2 = 10k:,

Frequency = 10kHz

Fall Time(DOUT) TF–1–PsV

CC = 3V, R2 = 10k:,

Frequency = 10kHz

Transmitter

Max ILED Pulse Width Max-PW – 120 – PsVCC = 3V, ENB = 0V

ILED Peak Pulse Current ILEDpk 85 120 155 mA VCC = 3V, R1 = 10:

Hysterisis Comparator

Hysterisis VHYS – 40 – mV VCC = 3V

Threshold Voltage VTH – 655 – mV VCC = 3V

Ambient light tolerance 100k -Iux Sun light

10K -Incandescent

5K -Fluorescent

10K -Halogen

APDS-9120 Internal Block Diagram

V-I

Converter

LED Driver with

Stuck High

Protection

Sunlight

Cancellation

TIA

(4) Vcc(7) ENBAR

(5) LEDON

(10) GND

(9) DOUT

(6) LEDK

(1) PFILT

VIO

LED

(3) NC3

(8) NC8

(2) NC2

Comparator

APDS-9120 I/O Pins Conﬁguration Table

Pin Symbol Type Description

1 PFILT Analog

O/P

Analog Output

Connect to integration circuit

(R3 & C3)

2 NC2 – No Connection

3 NC3 – No Connection

CC Supply Voltage Supply

5 LEDON Digital

I/P

LED Driver Input

LEDA will turn oﬀ when LEDON is

stuck in high state for more than

Max-PW

6 LEDK LED

Cathode

Connect to a current limiting resistor

7 ENBAR Digital

I/P

Power Down Enable

ENB = 0 Normal mode operation

ENB = 1 Shut down mode

8 NC8 – No Connection

9 DOUT Digital

O/P

Digital Output

An open drain output that requires

a pull-up resistor of recommended

value 10k:

DOUT = Low when VPFILT > VTH

DOUT = High when VPFILT < VTH

10 GND Ground Ground

LED spectal response

0.00

0.20

0.40

0.60

0.80

1.00

700 800 900 1000 1100 1200

Wavelength in nm

Relative response

Rel Icc Vs Vcc

0.90

0.92

0.94

0.96

0.98

1.00

1.02

1.04

2.4 2.6 2.8 3 3.2 3.4 3.6

Vcc

Rel Icc

Rel Icc Vs Vcc

Avg ISD Vs Temp

000.0E+0

50.0E-9

100.0E-9

150.0E-9

200.0E-9

250.0E-9

300.0E-9

350.0E-9

400.0E-9

-40 -20 0 20 40 60 80 100

Tem

in De

rees

Avg ISD

Detector Spectral response

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

600 700 800 900 1000 1100

Wavelength in nm

Rel response

Avg Rel Icc Vs Temp at Vcc=3V

0.9

0.92

0.94

0.96

0.98

1.02

-40 -20 0 20 40 60 80 100

Temp in Degress

Avg Rel Icc

Rel PFILT Vs Vcc

0.2

0.4

0.6

0.8

1.2

2.4 2.6 2.8 3 3.2 3.4 3.6

Vcc

REl PFLT

Avg Rel Icc Vs Temp at Vcc=3V

Avg ISD Vs Temp Rel PFILT Vs Vcc

Typical Characteristics

Figure 1. LED emitting spectrum Figure 2. PIN spectral sensitivity

Figure 3. Relative supply current over supply voltage Figure 4. Average relative supply current over temperature

Figure 5. Average shutdown current over temperature Figure 6. Relative output PFILT over supply voltage

Figure 7. Average relative output PFILT over temperature Figure 8. Relative ILED current over temperature

Figure 9. Relative output PFILT over detection distance Figure 10. Angular response

Angular Response

Avg Rel PFILT Vs Temp at 3V

0.2

0.4

0.6

0.8

1.2

-40 -20 0 20 40 60 80 100

Temp in Degrees

Avg Rel PFLT

Rel ILED Vs Vcc

0.2

0.4

0.6

0.8

1.2

1.4

1.6

2.4 2.6 2.8 3 3.2 3.4 3.6

Vcc

Rel ILED

Rel PFILT Vs Distance

0.2

0.4

0.6

0.8

1.2

0102030405060

Distance in mm

Rel PFLT

Angular Response

0.2

0.4

0.6

0.8

-90 -70 -50 -30 -10 10 30 50 70 90

le in De

rees

Rel response

Avg Rel PFILT Vs Temp at 3V Rel ILED Vs Vcc

Rel PFILT Vs Distance

2.11

0.18

1.17

1.02

910

LED

Detector

0.20

±0.05

0.05

1.10

1.201.20

4.4

0.30

±0.05

0.90

0.48

0.95

0.70

1.50 1.05

0.70 1.060.75

1.20

0.8

1.201.20

R0.15

0.05

1.2 0.8

YWW

Laser Groove

APDS-9120 Package Dimensions

TOP VIEW SIDE VIEW

Pin 1 : PFILT

Pin 2 : NC2

Pin 3 : NC3

Pin 4 : Vcc

Pin 5 : LEDON

Pin 6 : LEDK

Pin 7 : ENBAR

Pin 8 : NC8

Pin 9 : DOUT

Pin 10 : GND

BOTTOM VIEW

Notes:

1. All dimensions are in millimeters. Dimension tolerance is ±0.1 mm unless otherwise stated.

2. This package contains no lead.

3. Do NOT connect the bottom exposed pads.

4. No PCB circuitry under the device.

MARKING DETAILS

Font type : Stroke Roman

Font size : 0.3mm

Marking type : Laser

Format : YWW

Y = Year (last digit)

WW = Week number (two digits)

Tape and Reel Dimensions

9° 9° MAX

4.68 ± 0.10 4.68±0.10

0.28 ± 0.02

0.138 ± 0.10

Dimensions in mm

Ø1.00 ± 0.25

5.50 ± 0.05

1.75 ± 0.10

2.00 ± 0.05 4.00 ± 0.10

8.00 ± 0.10 Ø1.50 ± 0.10

12.0 ± 0.30

–0.10

Reel Drawings

SMT Assembly Application Note

1.1 Solder Pad, Mask and Metal Stencil Aperture

1.2 Recommended Land Pattern

Figure 11. Stencil and PCBA

Figure 12. Recommended Land Pattern

Metal Stencil For Solder

Paste Printing

Stencil

Aperture

Solder

Mask

Land

Pattern

PCBA

Notes:

1. Do NOT connect the NC (no connect) pins.

2. Manual soldering on APDS-9120 is not recommended.

Please refer to Recommended Reﬂow Proﬁle for soldering.

4.7

4.4

Unit: mm

Tolerance: ±0.1mm

Land Pattern

4.7

4.4

1.2

1.0

1.15

0.4

1.20 0.8

0.9

R 0.2

1.3 Recommended Metal Solder Stencil Aperture

It is recommended that a 0.11 mm thick stencil be used for solder paste printing. Aperture opening for shield pad is

0.8mm x 0.4mm (as per land pattern). This is to ensure adequate printed solder paste volume and no shorting.

Figure 13. Solder Stencil Aperture

Figure 14. Adjacent Land Keepout and Solder Mask Areas

1.4 Adjacent Land Keepout and Solder Mask Areas

Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no

other SMD components within this area.

The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm.

Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended.

0.11

4.7

Unit: mm

Aperture Opening

5.7 mm

Solder Mask Area

Min. 0.2 mm

Recommended Pickup Nozzle

Dimension in mm

TOP VIEW

SIDE VIEW

BOTTOM VIEW

APDS-9120 Typical Timing Waveforms

Note:

Pulses at LEDON can only be activated at least 20us after ENB turn from high to low.

Burst Pulses

>50ns

VCC

ENB

LEDON

PFLIT

DOUT

>20Ps

VTH

Typical Application Circuit

GND DOUT

ENBAR

LEDON

VCC

NC3

PFILT

NC2

NC8

LEDK

Vcc

VI0

C1C2

109

APDS-9120

MCU

Note:

1. Do NOT connect the NC (no connect) pins

Recommended Operating Condition

(a) Recommended burst pulse to drive LEDON (pin5) :

Pulsing

waveform

50μs

Time with pulsing = Period x

Number of pulses = 5 ms

Interval time between

burst pulses = 1s

R1 10 ohm

Iled (typ) 120mA

Number of Burst Pulse 50

Period of Burst Pulse 100Ps

Duty Cycle of Burst Pulse 50%

Interval Between Burst Pulse 1 sec

(b) Recommended components used:

Component Recommended Values

R1 10 ohm

R2 10k ohm

R3 1M ohm

C1 100nF, Ceramic

C2 6.8PF, Tantalum

C3 3.3nF, Ceramic

Note:

1. R3 and C3 are integrated circuit that can be

adjusted to meet desired detectable distance

2. Detectable distance is the distance when the

object is ﬁrst detected to trigger a “LOW” at

DOUT (pin9).

Optical Window Design Reference

Please refer to AN 5464: APDS-9120-020 Integrated Optical Proximity Sensor Window Guide Design.

http://www.avagotech.com/docs/AV02-2401EN/

Moisture Proof Packaging

All APDS-9120 options are shipped in moisture proof

package. Once opened, moisture absorption begins. This

part is compliant to JEDEC MSL 3.

Units in A Sealed

Mositure-Proof

Package

Package Is

Opened (Unsealed)

Environment

less than 30 deg C, and

less than 60% RH ?

Package Is

Opened less

than 168 hours ?

Perform Recommended

Baking Conditions

No Baking

Is Necessary

Yes

Baking Conditions:

Package Temperature Time

In Reel 60C 48 hours

In Bulk 100C 4 hours

If the parts are not stored in dry conditions, they must be

baked before reﬂow to prevent damage to the parts.

Baking should only be done once.

Recommended Storage Conditions:

Storage Temperature 100C to 300C

Relative Humidity below 60% RH

Time from unsealing to soldering:

After removal from the bag, the parts should be soldered

within 168 hours if stored at the recommended storage

conditions. If times longer than 168 hours are needed, the

parts must be stored in a dry box.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-1937EN - March 24, 2010

Process Zone Symbol 'T

Maximum 'T/'time

or Duration

Heat Up P1, R1 25°C to 150°C 3°C/s

Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s

Solder Reﬂow P3, R3

P3, R4

200°C to 260°C

260°C to 200°C

3°C/s

-6°C/s

Cool Down P4, R5 200°C to 25°C -6°C/s

Time maintained above liquidus point, 217°C > 217°C 60s to 120s

Peak Temperature 260°C –

Time within 5°C of actual Peak Temperature – 20s to 40s

Time 25°C to Peak Temperature 25°C to 260°C 8mins

Recommended Reﬂow Proﬁle

50 100 300150 200 250

t-TIME

(SECONDS)

120

150

180

200

230

255

T - TEMPERATURE (°C)

R3 R4

217

MAX 260C

60 sec to 90 sec

Above 217 C

HEAT

SOLDER PASTE DRY

SOLDER

REFLOW

COOL DOWN

The reﬂow proﬁle is a straight-line representation of

a nominal temperature proﬁle for a convective reﬂow

solder process. The temperature proﬁle is divided into

four process zones, each with diﬀerent 'T/'time tem-

perature change rates or duration. The 'T/'time rates

or duration are detailed in the above table. The tempera-

tures are measured at the component to printed circuit

board connections.

In process zone P1, the PC board and component pins are

heated to a temperature of 150°C to activate the ﬂux in

the solder paste. The temperature ramp up rate, R1, is

limited to 3°C per second to allow for even heating of

both the PC board and component pins.

Process zone P2 should be of suﬃcient time duration (100 to

180 seconds) to dry the solder paste. The temperature is

raised to a level just below the liquidus point of the solder.

Process zone P3 is the solder reﬂow zone. In zone P3, the tem-

perature is quickly raised above the liquidus point of solder

to 260°C (500°F) for optimum results. The dwell time above

the liquidus point of solder should be between 60 and 90

seconds. This is to assure proper coalescing of the solder

paste into liquid solder and the formation of good solder

connections. Beyond the recommended dwell time the in-

termetallic growth within the solder connections becomes

excessive, resulting in the formation of weak and unreli-

able connections. The temperature is then rapidly reduced

to a point below the solidus temperature of the solder to

allow the solder within the connections to freeze solid.

Process zone P4 is the cool down after solder freeze. The cool

down rate, R5, from the liquidus point of the solder to

25°C (77°F) should not exceed 6°C per second maximum.

This limitation is necessary to allow the PC board and

component pins to change dimensions evenly, putting

minimal stresses on the component.

It is recommended to perform reﬂow soldering no more

than twice.