ZXTN2011G
Document number: DS33662 Rev. 3 - 2
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ZXTN2011G
100V NPN MEDIUM POWER LOW SATURATION TRANSISTOR IN SOT223
Features
BVCEO > 100V
IC = 6A Continuous Collector Current
ICM = 10A Peak Pulse Current
Low Saturation Voltage VCE(sat) < 65mV max @ 1A
RSAT = 36 @ Ic =6A for Low Equivalent On-Resistance
hFE Specified up to 10A for High Gain Hold Up
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT223
Case Material: Molded Plastic. “Green” Molding Compound.
UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin Plated Leads.
Solderable per MIL-STD-202, Method 208
Weight: 0.112 grams (Approximate)
Applications
Line Switching
Motor Driving (including DC fans)
High Side Switches
Subscriber Line Interface Cards (SLIC)
Ordering Information (Note 4)
Part Number
Marking
Reel Size (inches)
Tape Width (mm)
ZXTN2011GTA
ZXTN2011
7
12
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
SOT223
Top View
Pin-Out Top View
Device Schematic
SOT223
Green
ZXTN 2011 = Product Type Marking Code
YWW = Date Code Marking
Y or Y = Last Digit of Year (ex: 5= 2015)
WW or WW = Week Code (01~53)
YWW
ZXTN
2011
ZXTN2011G
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Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
VCBO
200
V
Collector-Emitter Voltage
VCEO
100
V
Emitter-Base Voltage
VEBO
7
V
Continuous Collector Current
IC
6
A
Peak Pulse Current
ICM
10
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation
Linear Derating Factor
(Note 5)
PD
3.0
24
W
mW/°C
(Note 6)
1.6
12.8
Thermal Resistance, Junction to Ambient
(Note 5)
RJA
42
°C/W
(Note 6)
RJA
78
Thermal Resistance, Junction to Lead
(Note 7)
RJL
8.8
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
ESD Ratings (Note 8)
Characteristic
Symbol
Value
Unit
JEDEC Class
Electrostatic Discharge - Human Body Model
ESD HBM
4,000
V
3A
Electrostatic Discharge - Machine Model
ESD MM
400
V
C
Notes: 5. For a device mounted with the collector lead on 52mm x 52mm 2oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air
conditions whilst operating in steady-state.
6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper.
7. Thermal resistance from junction to solder-point (at the end of the collector lead).
8. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
ZXTN2011G
Document number: DS33662 Rev. 3 - 2
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Thermal Characteristics and Derating Information
100m 110 100
10m
100m
1
10
Single Pulse. Tamb=25°C
See note (5)
VCE(sat)
Limit
100µs
1ms
10ms
100ms
1s
DC
Safe Operating Area
IC Collector Current (A)
VCE Collector-Emitter Voltage (V) 020 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
3.0
See note (6)
See note (5)
Derating Curve
Temperature (°C)
Max Power Dissipation (W)
100µ 1m 10m 100m 110 100 1k
0
10
20
30
40 See note (5)
Transient Thermal Impedance
D=0.5
D=0.2
D=0.1
Single Pulse
D=0.05
Thermal Resistance (°C/W)
Pulse Width (s) 100µ 1m 10m 100m 110 100 1k
1
10
100 Single Pulse. Tamb=25°C
See note (5)
Pulse Power Dissipation
Pulse Width (s)
Max Power Dissipation (W)
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Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Collector-Base Breakdown Voltage
BVCBO
200
235
V
IC = 100µA
Collector-Emitter Breakdown Voltage
BVCER
200
235
V
IC = 1µA, RB 1kΩ
Collector-Emitter Breakdown Voltage (Note 9)
BVCEO
100
115
V
IC = 10mA
Emitter-Base Breakdown Voltage
BVEBO
7
8.1
V
IE = 100µA
Collector Cutoff Current
ICBO
50
0.5
nA
µA
VCB = 150V
VCB = 150V, TA = +100°C
Collector Cutoff Current
ICER
R1kΩ
100
0.5
nA
µA
VCB = 150V
VCB = 150V, TA = +100°C
Emitter Cutoff Current
IEBO
10
nA
VEB = 6V
Collector-Emitter Saturation Voltage (Note 9)
VCE(sat)
21
50
95
190
35
65
125
220
mV
IC = 0.1A, IB = 5mA
IC = 1A, IB = 100mA
IC = 2A, IB = 100mA
IC = 5A, IB = 500mA
Base-Emitter Saturation Voltage (Note 9)
VBE(sat)
1.02
1.12
V
IC = 5A, IB = 500mA
Base-Emitter Turn-on Voltage (Note 9)
VBE(on)
0.92
1
V
IC = 5A, VCE = 2V
DC Current Gain (Note 9)
hFE
100
100
30
10
230
200
60
20
300
IC = 10mA, VCE = 2V
IC = 2A, VCE = 2V
IC = 5A, VCE = 2V
IC = 10A, VCE = 2V
Transition Frequency
fT
130
MHz
VCE = 10V, IC = 100mA,
f = 50MHz
Output Capacitance (Note 9)
Cobo
26
pF
VCB = 10V, f = 1MHz
Switching Times
tON
41
ns
VCC = 10V, IC = 1A,
IB1 = -IB2 = 100mA
tOFF
1,010
Note: 9. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.
ZXTN2011G
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Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
1m 10m 100m 110
10m
100m
1
1m 10m 100m 110
0.0
0.1
0.2
0.3
0.4
0.5
0.6
1m 10m 100m 110
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1m 10m 100m 110
0.4
0.6
0.8
1.0
1.2
1.4
1m 10m 100m 110
0.4
0.6
0.8
1.0
1.2
1.4
0
50
100
150
200
250
VCE(SAT) v IC
Tamb=25°C
IC/IB=50
IC/IB=20
IC/IB=10
VCE(SAT) (V)
IC Collector Current (A)
VBE(SAT) v IC
IC/IB=10
100°C
25°C
-55°C
VCE(SAT) (V)
IC Collector Current (A)
hFE v IC
VCE=2V
-55°C
25°C
100°C
Normalised Gain
IC Collector Current (A)
25°C
VCE(SAT) v IC
IC/IB=10
100°C
-55°C
VBE(SAT) (V)
IC Collector Current (A)
VBE(ON) v IC
VCE=2V
100°C
25°C
-55°C
VBE(ON) (V)
IC Collector Current (A)
Typical Gain (hFE)
ZXTN2011G
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Package Outline Dimensions
Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version.
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version.
For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between device
terminals and PCB tracking.
SOT223
Dim
Min
Max
Typ
A
1.55
1.65
1.60
A1
0.010
0.15
0.05
b
0.60
0.80
0.70
b1
2.90
3.10
3.00
C
0.20
0.30
0.25
D
6.45
6.55
6.50
E
3.45
3.55
3.50
E1
6.90
7.10
7.00
e
-
-
4.60
e1
-
-
2.30
L
0.85
1.05
0.95
Q
0.84
0.94
0.89
All Dimensions in mm
Dimensions
Value (in mm)
C
2.30
C1
6.40
X
1.20
X1
3.30
Y
1.60
Y1
1.60
C2
8.00
A1
A
D
b
e
e1
b1
C
E1
L
0°-10°
Q
E
0.25
Seating
Plane
Gauge
Plane
X1
Y1
Y
XC
C1 Y2
ZXTN2011G
Document number: DS33662 Rev. 3 - 2
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