DATA SH EET
Product specification
File under Integrated Circuits, IC06 2000 Mar 15
INTEGRATED CIRCUITS
74AHC123A; 74AHCT123A
Dual retriggerable monostable
multivibrator with reset
2000 Mar 15 2
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
FEATURES
•ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V
CDM EIA/JESD22-C101 exceeds 1000 V
•All inputs have Schmitt-trigger actions
•Inputs accept voltages higher than VCC
•For AHC only: operates with CMOS input levels
•For AHCT only: operates with TTL input levels
•Specified from −40 to +85 °C and −40 to +125 °C
•DC triggered from active HIGH or active LOW inputs
•Retriggerable for very long pulses up to 100% duty
factor
•Direct reset terminates output pulse
•Output capability: standard (except for nREXT/CEXT).
DESCRIPTION
The 74AHC/AHCT123A are high-speed Si-gate CMOS
devices and are pin compatible with Low power Schottky
TTL (LSTTL). They are specified in compliance with
JEDEC standard no.7A.
The74AHC/AHCT123Aaredualretriggerablemonostable
multivibrators with output pulse width control by three
methods. The basic pulse time is programmed by
selection of an external resistor (REXT) and capacitor
(CEXT). The external resistor and capacitor are normally
connected as shown in Fig.6.
Once triggered, the basic output pulse width may be
extendedbyretriggeringthegatedactiveLOW-goingedge
input (nA) or the active HIGH-going edge input (nB).
By repeating this process, the output pulse period
(nQ = HIGH, nQ = LOW) can be made as long as desired.
Alternativelyan outputdelay canbe terminatedat anytime
by a LOW-going edge on input nRD, which also inhibits the
triggering.
An internal connection from nRDto the input gate makes it
possible to trigger the circuit by a positive-going signal at
input nRD as shown in the function table. Figs 8 and 9
illustrate pulse control by retriggering and early reset. The
basic output pulse width is essentially determined by the
value of the external timing components REXT and CEXT.
When CEXT ≥10 nF, the typical output pulse width is
definedas: tW=R
EXT ×CEXT wheretW= pulse widthin ns;
REXT = external resistor in kΩ; CEXT = external capacitor
in pF. Schmitt-trigger action at all inputs makes the circuit
highly tolerant to slower input rise and fall times. The ‘123’
is identical to the ‘423’ but can be triggered via the reset
input.
2000 Mar 15 3
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
QUICK REFERENCE DATA
GND = 0 V; Tamb =25°C; tr=t
f≤3.0 ns.
Notes
1. CPD is used to determine the dynamic power dissipation (PDin µW).
PD=C
PD ×VCC2×fi+∑(CL×VCC2×fo)×CEXT ×VCC2×fo+D×16 ×VCC where:
fi= input frequency in MHz;
fo= output frequency in MHz;
∑(CL×VCC2×fo) = sum of outputs;
D = duty factor in %;
CL= output load capacitance in pF;
CEXT = timing capacitance in pF;
VCC = supply voltage in Volts.
2. The condition is VI= GND to VCC.
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
AHC AHCT
tPHL/tPLH propagation delay CL= 15 pF; VCC =5V;
R
EXT =5kΩ; CEXT =0pF
n
A, nB to nQ, nQ 5.1 5.0 ns
nRDto nQ, nQ 5.6 5.2 ns
CIinput capacitance VI=V
CC or GND 5 3 pF
COoutput capacitance 4 4 pF
CPD power dissipation capacitance CL= 50 pF; f = 1 MHz; notes 1
and 2 57 58 pF
2000 Mar 15 4
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
FUNCTION TABLE
See note 1.
Notes
1 H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
↑= LOW-to-HIGH CP transition;
↓= HIGH-to-LOW CP transition.
2 If the monostable multivibrator was triggered before this condition was established, the pulse will be continued as
programmed.
3 One HIGH-level output pulse.
4 One LOW-level output pulse.
ORDERING INFORMATION
INPUTS OUTPUTS
nRDnAnB nQ nQ
LXX L H
XHX L
(2) H(2)
XXL L
(2) H(2)
HL↑(3) (4)
H↓H(3) (4)
↑LH (3) (4)
TYPE NUMBER PACKAGES
TEMPERATURE
RANGE PINS PACKAGE MATERIAL CODE
74AHC123AD −40 to +125 °C 16 SO plastic SOT109-1
74AHC123APW 16 TSSOP plastic SOT403-1
74AHCT123AD 16 SO plastic SOT109-1
74AHCT123APW 16 TSSOP plastic SOT403-1
2000 Mar 15 5
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
PINNING
PIN SYMBOL DESCRIPTION
1, 9 1A, 2A trigger inputs (negative-edge triggered)
2, 10 1B, 2B trigger inputs (positive-edge triggered)
3, 11 1RD,2R
Ddirect reset LOW and trigger action at positive edge
4, 12 1Q, 2Q outputs (active LOW)
5, 13 2Q, 1Q outputs (active HIGH)
6, 14 2CEXT, 1CEXT external capacitor connection
7, 15 2REXT/CEXT, 1REXT/CEXT external resistor/capacitor connection
8 GND ground (0 V)
16 VCC DC supply voltage
handbook, halfpage
1A
1B
1RD
1Q
2Q
2CEXT
2REXT/CEXT
GND
VCC
1REXT/CEXT
1CEXT
1Q
2RD
2B
2Q
2A
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
123
MNA514
Fig.1 Pin configuration.
handbook, halfpage
1Q
Q
2RD
RD
S
2REXT/CEXT
13
7
1REXT/CEXT 15
2CEXT 6
1CEXT 14
2Q 5
1Q
Q4
2Q 12
9
MNA515
1RD
2A
11A
10 2B
2
11
3
1B
T
Fig.2 Logic diagram.
2000 Mar 15 6
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
handbook, halfpage
MNA516
CX
&
6
5
12
RCX
R
7
9
11
10
CX
&
14
13
4
RCX
R
15
1
3
2
Fig.3 IEC logic symbol.
handbook, halfpage
1Q
Q
2RD
RD
S
2REXT/CEXT
13
7
1REXT/CEXT 15
2CEXT 6
1CEXT 14
2Q 5
1Q
Q4
2Q 12
9
MNA517
1RD
2A
11A
10 2B
2
11
3
1B
T
Fig.4 Functional diagram.
2000 Mar 15 7
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
handbook, full pagewidth
MNA518
nREXT/CEXT
VCC
VCC VCC
R
RD
A
BR
CL
CL CL
CL CL
Q
Q
R
R
Fig.5 Logic diagram (one flip-flop).
For minimum noise generation, it is recommended to ground pins 6 (2CEXT) and 14 (1CEXT) externally to pin 8 (GND).
2000 Mar 15 8
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
handbook, halfpage
VCC
REXT
to nCEXT
(pin 14 or 6) to nREXT/CEXT
(pin 15 or 7)
CEXT
MNA519
Fig.6 Timing component connections.
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS 74AHC 74AHCT UNIT
MIN. TYP. MAX. MIN. TYP. MAX.
VCC DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V
VIinput voltage 0 −5.5 0 −5.5 V
VOoutput voltage 0 −VCC 0−VCC V
Tamb operating ambient
temperature see DC and AC
characteristics per device −40 +25 +85 −40 +25 +85 °C
−40 +25 +125 −40 +25 +125 °C
tr, tfinput rise and fall
time ratios VCC = 3.3 ±0.3 V −−100 −−−ns/V
VCC =5±0.5 V −−20 −−20 ns/V
REXT external timing
resistor VCC =2V 5 −−5−−kΩ
V
CC >3V 1 −−1−−kΩ
C
EXT external timing
capacitor no limits pF
2000 Mar 15 9
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. For SO packages: above 70 °C the value of PD derates linearly with 8 mW/K.
For TSSOP packages: above 60 °C the value of PD derates linearly with 5.5 mW/K.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC DC supply voltage −0.5 +7.0 V
VIinput voltage −0.5 +7.0 V
IIK DC input diode current VI<−0.5 V; note 1 −−20 mA
IOK DC output clamping diode current VO<−0.5 Vor VO>V
CC + 0.5
V; note 1 −±20 mA
IODC output sink current −0.5V<V
O<V
CC + 0.5 V −±25 mA
ICC DC VCC or GND current −±75 mA
Tstg storage temperature −65 +150 °C
PDpower dissipation per package for temperature range:
−40 to +125 °C; note 2 −500 mW
2000 Mar 15 10
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
DC CHARACTERISTICS
Family 74AHC
Over recommended operating conditions; voltages are referenced to GND (ground=0V).
Note
1. Voltage on pin nREXT/CEXT = 0.5 ×VCC and pin REXT/CEXT in OFF-state during test.
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
OTHER VCC (V) 25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VIH HIGH-level input
voltage 2.0 1.5 −−1.5 −1.5 −V
3.0 2.1 −−2.1 −2.1 −V
5.5 3.85 −−3.85 −3.85 −V
VIL LOW-level input
voltage 2.0 −−0.5 −0.5 −0.5 V
3.0 −−0.9 −0.9 −0.9 V
5.5 −−1.65 −1.65 −1.65 V
VOH HIGH-leveloutput
voltage VI=V
IH or VIL;
IO=−50 µA2.0 1.9 2.0 −1.9 −1.9 −V
3.0 2.9 3.0 −2.9 −2.9 −V
4.5 4.4 4.5 −4.4 −4.4 −V
VI=V
IH or VIL;
IO=−4.0 mA 3.0 2.58 −−2.48 −2.40 −V
VI=V
IH or VIL;
IO=−8.0 mA 4.5 3.94 −−3.8 −3.70 −V
VOL LOW-level output
voltage VI=V
IH or VIL;
IO=50µA2.0 −0 0.1 −0.1 −0.1 V
3.0 −0 0.1 −0.1 −0.1 V
4.5 −0 0.1 −0.1 −0.1 V
VI=V
IH or VIL;
IO= 4.0 mA 3.0 −−0.36 −0.44 −0.55 V
VI=V
IH or VIL;
IO= 8.0 mA 4.5 −−0.36 −0.44 −0.55 V
IIinput leakage
current;
REXT/CEXT
VI=V
CC
or GND; note 1 5.5 −−±0.25 −±2.5 −±10.0 µA
input leakage
current;
nA, nB, nRD
VI=V
CC or GND 5.5 −−±0.1 −±1.0 −±2.0 µA
ICC quiescent supply
current VI=V
CC
or GND; IO=0 5.5 −−4.0 −40 −80 µA
quiescent supply
current active
state (per circuit)
VI=V
CC
or GND; note 1 3−160 250 −280 −280 µA
4.5 −380 500 −650 −650 µA
5.5 −560 750 −975 −975 µA
CIinput capacitance −−510−10 −10 pF
2000 Mar 15 11
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
Family 74AHCT
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).
Note
1. Voltage on pin nREXT/CEXT = 0.5 ×VCC and pin REXT/CEXT in OFF-state during test.
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
OTHER VCC (V) 25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VIH HIGH-level input
voltage 4.5 to 5.5 2.0 −−2.0 −2.0 −V
VIL LOW-level input
voltage 4.5 to 5.5 −−0.8 −0.8 −0.8 V
VOH HIGH-leveloutput
voltage VI=V
IH or VIL;
IO=−50 µA4.5 4.4 4.5 −4.4 −4.4 −V
VI=V
IH or VIL;
IO=−8.0 mA 4.5 3.94 −−3.8 −3.70 −V
VOL LOW-level output
voltage VI=V
IH or VIL;
IO=50µA4.5 −0 0.1 −0.1 −0.1 V
VI=V
IH or VIL;
IO= 8.0 mA 4.5 −−0.36 −0.44 −0.55 V
IIinput leakage
current;
REXT/CEXT
VI=V
CC
or GND; note 1 5.5 −−±0.25 −±2.5 −±10.0 µA
input leakage
current;
nA, nB, nRD
VI=V
CC
or GND 5.5 −−±0.1 −±1.0 −±2.0 µA
ICC quiescent supply
current VI=V
CC
or GND; IO=0 5.5 −−4.0 −40 −80 µA
quiescent supply
current active
state (per circuit)
VI=V
CC
or GND; note 1 4.5 −380 500 −650 −650 µA
5.5 −560 750 −975 −975 µA
CIinput capacitance −−310−10 −10 pF
2000 Mar 15 12
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
AC CHARACTERISTICS
Type 74AHC123A
GND = 0 V; tr=t
f≤3.0 ns.
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
WAVEFORMS CL25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VCC = 3.0 to 3.6 V; note 1
tPHL/tPLH propagationdelay;
nA, nB to nQ, nQ CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
15 pF −7.4 20.6 1.0 24.0 1.0 26.0 ns
propagationdelay;
nRDto nQ, nQ CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
−8.2 22.4 1.0 26.0 1.0 26.0 ns
propagationdelay;
nRDto nQ, nQ
(reset)
CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
−6.4 15.8 1.0 18.5 1.0 20.0 ns
propagationdelay;
nA, nB to nQ , nQ CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
50 pF −10.5 24.1 1.0 27.5 1.0 30.0 ns
propagationdelay;
nRD to nQ, nQ CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
−11.7 25.9 1.0 29.5 1.0 32.0 ns
propagationdelay;
nRDto nQ, nQ
(reset)
CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
−9.2 19.3 1.0 22.0 1.0 24.5 ns
tWtrigger pulse
width; nA = LOW see Fig 8 5.0 −− 5.0 −5.0 −ns
trigger pulse
width; nB = HIGH see Fig 8 5.0 −− 5.0 −5.0 −ns
reset pulse width;
nRD=LOW see Fig 9 5.0 −− 5.0 −5.0 −ns
output pulse
width;nQ = HIGH;
nQ = LOW
CEXT = 28 pF;
REXT =2kΩ;
note 3; see Figs 8,
9 and 10
−115 240 −300 −300 ns
CEXT = 0.01 µF;
REXT =10kΩ;
note 3; see Figs 8,
9 and 10
90 100 110 90 110 85 115 µs
CEXT = 0.1 µF;
REXT =10kΩ;
note 3; see Figs 8,
9 and 10
0.9 1 1.1 0.9 1.1 0.85 1.15 ms
2000 Mar 15 13
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
VCC = 3.0 to 3.6 V; note 1
trt retrigger time;
nAtonB C
EXT = 100 pF;
REXT =1kΩ; see
Figs 8, 9 and 10
50 pF −60 −−−−−ns
CEXT = 0.01 µF;
REXT =1kΩ; see
Figs 8, 9 and 10
−1.5 −−−−−µs
V
CC = 4.5 to 5.5 V; note 2
tPHL/tPLH propagationdelay;
nA, nB to nQ, nQ CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
15 pF −5.1 12 1.0 14.0 1.0 15.5 ns
propagationdelay;
nRDto nQ, nQ CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
−5.6 12.9 1.0 15.0 1.0 16.5 ns
propagationdelay;
nRDto nQ, nQ
(reset)
CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
−4.4 9.4 1.0 11.0 1.0 12.0 ns
propagationdelay;
nA, nB to nQ, nQ CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
50 pF −7.3 14 1.0 16.0 1.0 17.5 ns
propagationdelay;
nRDto nQ, nQ CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
−8.1 14.9 1.0 17.0 1.0 19.0 ns
propagationdelay;
nRDto nQ, nQ
(reset)
CEXT = 0 pF;
REXT =5kΩ;
see Figs 7 and 11
−6.3 11.4 1.0 13.0 1.0 14.5 ns
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
WAVEFORMS CL25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
2000 Mar 15 14
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
Notes
1. Typical values are measured at VCC = 3.3 V and Tamb =25°C.
2. Typical values are measured at VCC = 5.0 V and Tamb =25°C.
3. For CEXT ≥10 nF the typical value of the pulse width tW (µs) = REXT (kΩ)×CEXT (nF).
VCC = 4.5 to 5.5 V; note 2
tWtrigger pulse
width; nA = LOW see Fig 8 50 pF 5.0 −− 5.0 −5.0 −ns
trigger pulse
width; nB = HIGH see Fig 8 5.0 −− 5.0 −5.0 −ns
reset pulse width;
nRD=LOW see Fig 9 5.0 −− 5.0 −5.0 −ns
output pulse
width;nQ = HIGH;
nQ = LOW
CEXT = 28 pF;
REXT =2kΩ;
note 3; see Figs 8,
9 and 10
−100 200 −240 −240 ns
CEXT = 0.01 µF;
REXT =10kΩ;
note 3; see
Figs 8, 9 and 10
90 100 110 90 110 85 115 µs
CEXT = 0.1 µF;
REXT =10kΩ;
note 3; see Figs 8,
9 and 10
0.9 1 1.1 0.9 1.1 0.85 1.15 ms
trt retrigger time;
nAtonB C
EXT = 100 pF;
REXT =1kΩ; see
Figs 8, 9 and 10
−39 −−−−−ns
CEXT = 0.01 µF;
REXT =1kΩ; see
Figs 8, 9 and 10
−1.2 −−−−−µs
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
WAVEFORMS CL25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
2000 Mar 15 15
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
Type 74AHCT123A
GND = 0 V; tr=t
f≤3.0 ns.
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
WAVEFORMS CL25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VCC = 4.5 to 5.5 V; note 1
tPHL/tPLH propagationdelay;
nA, nB to nQ, nQ CEXT = 0 pF;
REXT =5kΩ; see
Figs 7 and 11
15 pF −5.0 12 1.0 14 1.0 15.5 ns
propagationdelay;
nRDto nQ, nQ CEXT = 0 pF;
REXT =5kΩ; see
Figs 7 and 11
−5.2 12.9 1.0 15.0 1.0 16.5 ns
propagationdelay;
nRDto nQ, nQ
(reset)
CEXT = 0 pF;
REXT =5kΩ; see
Figs 7 and 11
−4.7 9.4 1.0 11 1.0 12.0 ns
propagationdelay;
nA, nB to nQ, nQ CEXT = 0 pF;
REXT =5kΩ; see
Figs 7 and 11
50 pF −7.1 14 1.0 16 1.0 17.5 ns
propagationdelay;
nRDto nQ, nQ CEXT = 0 pF;
REXT =5kΩ; see
Figs 7 and 11
−7.5 14.9 1.0 17.0 1.0 18.5 ns
propagationdelay;
nRDto nQ, nQ
(reset)
CEXT = 0 pF;
REXT =5kΩ; see
Figs 7 and 11
−6.7 11.4 1.0 13 1.0 14.5 ns
tWtrigger pulse
width; nA=LOW see Fig 8 50 pF 5.0 −− 5.0 −5.0 −ns
trigger pulse
width; nB = HIGH see Fig 8 5.0 −− 5.0 −5.0 −ns
reset pulse width;
nRD=LOW see Fig 9 5.0 −− 5.0 −5.0 −ns
outputpulsewidth;
nQ = HIGH;
nQ = LOW
CEXT =28pF;
R
EXT =2kΩ; note 2;
seeFigs 8, 9 and 10
−100 200 −240 −240 ns
CEXT = 0.01 µF;
REXT =10kΩ;
note 2; see
Figs 8, 9 and 10
90 100 110 90 110 85 115 µs
CEXT = 0.1 µF;
REXT =10kΩ;
note 2; see
Figs 8, 9 and 10
0.9 1 1.1 0.9 1.1 0.85 1.15 ms
2000 Mar 15 16
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
Notes
1. Typical values are measured at VCC = 5.0 V and Tamb =25°C.
2. For CEXT ≥10 nF the typical value of the pulse width tW (µs) = REXT (kΩ)×CEXT (nF).
VCC = 4.5 to 5.5 V; note 1
trt retrigger time;
nAtonB C
EXT = 100 pF;
REXT =1kΩ; see
Figs 8, 9 and 10
50 pF −60 −−−−−ns
CEXT = 0.01 µF;
REXT =1kΩ; see
Figs 8, 9 and 10
−1.5 −−−−−µs
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
WAVEFORMS CL25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
2000 Mar 15 17
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
AC WAVEFORMS
handbook, full pagewidth
tPHL
tPHL tPLH tPHL
tPLH
tPLH
VM(1)
VM(2)
VM(2)
VM(1)
VM(1)
VM(1)
tW
tW
tW
tW
tW
tW + trt
trt
MNA520
nB input
nA input
nRD input
nQ output
nQ output
Fig.7 Input (nA, nB, nRD) to output (nQ, nQ) propagation delays, the input and output pulse widths and the input
retrigger time.
FAMILY VIINPUT
REQUIREMENTS VM(1)
INPUT VM(2)
OUTPUT
AHC GND to VCC 50% VCC 50% VCC
AHCT GND to 3.0 V 1.5 V 50% VCC
2000 Mar 15 18
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
handbook, full pagewidth
MNA521
tWtW
tW
tW
trt tW
nB input
nA input
nQ output
Fig.8 Output pulse control using retrigger pulse; nRD= HIGH.
handbook, full pagewidth
MNA522
tWtW
tW
nB input
nRD input
nQ output
Fig.9 Output pulse control using reset input nRD; nA = LOW.
2000 Mar 15 19
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
handbook, full pagewidth
tW + trt
tW
tW
trt
MNA523
nB input
nA input
nRD input
nREXT/CEXT
nQ output
nQ output
Fig.10 Input and output timing.
Fig.11 Load circuitry for switching times.
TEST S1
tPLH/tPHL open
tPLZ/tPZL VCC
tPHZ/tPZH GND
handbook, full pagewidth
open
GND
VCC
VCC
VIVO
MNA183
D.U.T.
CL
RT
1000 Ω
PULSE
GENERATOR
S1
Definitions for test circuit.
CL= load capacitance including jig and probe capacitance (See Chapter “AC characteristics”).
RT= termination resistance should be equal to the output impedance Zo of the pulse generator.
2000 Mar 15 20
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
PACKAGE OUTLINES
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 10.0
9.8 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT109-1 97-05-22
99-12-27
076E07 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.39
0.38 0.16
0.15 0.050
1.05
0.041
0.244
0.228 0.028
0.020 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
2000 Mar 15 21
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 5.1
4.9 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.40
0.06 8
0
o
o
0.13 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1 MO-153 95-04-04
99-12-27
wM
bp
D
Z
e
0.25
18
16 9
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
A
max.
1.10
pin 1 index
2000 Mar 15 22
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
SOLDERING
Introduction to soldering surface mount packages
Thistextgives avery briefinsight toacomplex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuitboardby screenprinting, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemount devices(SMDs)or printed-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
•Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
•For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
•Forpackageswith leadsonfour sides,thefootprint must
be placed at a 45°angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Mar 15 23
Philips Semiconductors Product specification
Dual retriggerable monostable multivibrator
with reset 74AHC123A;
74AHCT123A
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE SOLDERING METHOD
WAVE REFLOW(1)
BGA, LFBGA, SQFP, TFBGA not suitable suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2) suitable
PLCC(3), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(3)(4) suitable
SSOP, TSSOP, VSO not recommended(5) suitable
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2000 69
Philips Semiconductors – a world wide company
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Printed in The Netherlands 613507/01/pp24 Date of release: 2000 Mar 15 Document order number: 9397 750 06696
