Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC171 –
E F O 4004
Product Code
Ceramic
Resonators
EFO
Nominal Oscillation
Frequency
4004
Frequency
Tolerance
±1.0 %
±0.3 %
±0.5 %
0
3
5
Design No.
Packaging Style
B
E
Bulk Pack
Embossed
Taping
Type
Chip Type with 2-terminals
PM
LM
PS
DM
4to13MHz
16 to 20 MHz
30 to 50 MHz
4to13MHz
12 to 20 MHz
4.00 MHz
(Example)
123456789101112
1695
4005
16.93 MHz
40.0 MHz
E F O 3584
Product Code
Ceramic
Resonators
EFO
Frequency
Tolerance
±1.0 %
±0.3 %
±0.5 %
0
3
5
Design No.
Packaging Style
B
E
Bulk Pack
Embossed
Taping
123456789101112
Nominal Oscillation
Frequency
3584
Type
Chip Type with 2-terminals
P
D
2to13MHz
13.1 to 20 MHz
3.58 MHz
(Example)
1695 16.93 MHz
■Recommended Applications
● Clock generator for microprocessors
● Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
Ceramic Resonators, Chip Type
(2 Array Type)
Type: EFOP
Type: EFOD
Type: EFOPS
Type: EFOPM
Type: EFODM
Type: EFOLM
■Features
● Encased in a ceramic package
● High reliability against soldering heat and mechanical
stress
● Moisture-proof sealing
● 1.2 mm maximum in thickness (PS/PM/DM/LM)
● Designed for refl ow soldering
● Flat-bottom plate for better mounting
● RoHS compliant
■Handling Precautions (See Page 175 to 176)
■Explanation of Part Numbers
Part Number Frequency range
(MHz)
Frequency Temperature Characteristics
(–20 to +80 °C)
Attached Capacitors
(Reference)
EFOP 2.00 to 8.39 ±0.3 % 33 pF
8.40 to 13.0 ±1.0 %
EFOD 13.1 to 20.0 ±1.0 % 33 pF
EFOPS 4.00 to 8.39 ±0.6 % 21 pF
8.40 to 13.0 ±1.0 %
EFOPM 4.00 to 8.39 ±0.3 % 33 pF
8.40 to 13.0 ±1.0 %
EFODM 12.0 to 20.0 ±1.0 % 18 pF
EFOLM 16.0 to 20.0 ±1.0 % 10 pF
30.0 to 50.0 ±0.3 %
■Packaging Specifi cations
See Page 174, 177
00 Sep. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC172 –
(7.30)
7.80
+0.50
-
0.20
1.60±0.20
(2.70)
3.20
+0.30
-
0.20
4-(1.30)
2.50±0.20 2.50±0.20
4-(1.00)
6–R(0.20)
Serial No.
Oscillating Frequency
Terminal
Electrodes
2–(1.00)
(7.30) (2.70)
7.80
1.20 max.
+0.50
–0.20
2.50±0.20 2.50±0.20
+0.30
–0.20
3.20
Serial No.
Oscillating Frequency
Terminal
Electrodes
6–R(0.20)
2-0.9 to 1.2
4.2
2.5 2.5
(0.15)
6-(0.60)
4.50±0.20
1.20 max.
(1.60)
2.00±0.30
2–(0.55)
2–1.50±0.20
Serial No.
Oscillating Frequency
Terminal
Electrodes
2-0.8
2.6
1.51.5
1.6
2-0.55
(5.00)
6–R(0.20)
4–(1.20)
4–(1.20)
(2.70)
5.50+0.50
–0.20 3.20+0.25
–0.15
1.90±0.20
1.60±0.20
1.90±0.20
Serial No.
Oscillating Frequency
Terminal
Electrodes
2-1.2
4.2
1.9 1.9
■Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFOP]·····2.0 to 13.0 MHz
[Type EFOPM]·····4.0 to 13.0 MHz
[Type EFOP, EFOPM]
[Type EFOPS][Type EFOPS]·····4.0 to 13.0 MHz
[Type EFOD]·····13.1 to 20.0 MHz [Type EFOD]
00 Sep. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC173 –
2-0.8
3.9
1.351.35
2-0.7 to 1.0
4.6
1.6 1.6
(3.90) (3.10)
2–(0.80)
1.20 max.
2–1.60±0.20
6–R(0.20)
+0.50
–0.20
4.40
+0.30
–0.20
3.60
Serial No.
Oscillating Frequency
Terminal
Electrodes
4.10±0.20
1.20 max.
(2.40)
6–R(0.20)
(3.70)
2.90±0.30
2–(0.80)
2–1.35±0.20
Serial No.
Oscillating Frequency
Terminal
Electrodes
+5V
14 13 11 9
752
For Oscillation Circuit
Frequency Counter
Ceramic
Resonator
1M
3
14
+5V
14 13 11 9
For Loop Gain
1M
Ceramic
Resonator
1
IN
0.01
G=20 log (V0/V1)
V0
V1
OUT
FET probe
10 Mmin.
2pFmax.
T.G.
Output
=–20 dBm
7524
3
–0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080 –0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080 –0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080
8.4
to
13 MHz
2.0
to
8.39 MHz
8.4 to 13MHz
4.0
to
8.39 MHz
Temperature (°C)
Oscillation Frequency Drift
(%)
Temperature (°C)
Oscillation Frequency Drift
(%)
Temperature (°C)
Oscillation Frequency Drift
(%)
Type EFOP Type EFOD Type EFOPS
[Type EFODM]
[Type EFOLM]
■Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFODM]·····12.0 to 20.0MHz
[Type EFOLM]·····16.0 to 20.0, 30.0 to 50.0 MHz
■Test Circuits Diagram
Frequency IC
2.00 to 8.39 MHz
µPD4069UBC,
TC4069UBP
or similar
8.40 to 50.0 MHz
µPD74HCU,
TC74HCU04AP
or similar
■Typical Characteristics ····· Temperature Characteristics
00 Sep. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC174 –
–0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080 –0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080 –0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080
30 to 50 MHz
16 to 20 MHz
2.0 to8.39MHz
8.4 to 13MHz
Temperature (°C) Temperature (°C) Temperature (°C)
Oscillation Frequency Drift
(%)
Oscillation Frequency Drift
(%)
Oscillation Frequency Drift
(%)
Type EFOPM Type EFODM Type EFOLM
T
C
E
D
r
φ
B
Wt
φ
A
Chip Component
Tape running
direction
Feeding hole Chip pocket
t
1
t
2
P
2
P
0
P
1
A
F
B
E
W
φD
0
3.20
7.80
FE
W
t
1
t
2
P
1
A
φD
0
2.00
4.50
P
0
P
2
B
Feeding hole
Chip pocket
Chip Component Tape running direction
Feeding hole Chip pocket
Chip Component Tape running direction
Type EFOLM (Example)
F
B
E
W
t
1
t
2
P
2
P
0
P
1
A
φD
0
3.60
4.40
■Typical Characteristics ····· Temperature Characteristics
■Packaging Specifi cations
Supplied in bulk or taped & reel packing style
● Standard Packing Quantity
● Dimensions for Reel in mm (not to scale)
● Embossed Taping
[Type EFOP, EFOPM] [Type EFOPS]
[Type EFOP, EFOPM]
[Type EFOPS, EFOD, EDODM, EFOLM]
[Type EFOD, EFODM, EFOLM]
Dim.
(mm)
φAφBC D E
330±5 80 min. 13.0±0.5 21.0±0.8 2.0±0.5
Dim.
(mm)
WT t r
16.4+2.0 22.4 max. 3 max. 1.0
0
Dim.
(mm)
φAφBC D E
180±5 60 min. 13.0±0.5 21.0±0.8 2.0±0.5
Dim.
(mm)
WT t r
12.4+2.0 18.4 max. 3 max. 1.0
0
Dim. (mm) A B
12
Type EFOD 3.7± 0.2 6.0±0.2
Type EFODM 3.4±0.2 4.6±0.2
Type EFOLM 4.1±0.2 4.9± 0.2
Dim.
(mm)
ABWFEP
1
2.6±0.2 5.1±0.2 12.0±0.3 5.5±0.1
1.75±0.10
4.0±0.1
Dim.
(mm)
P2P0φD0t1t2
2.0±0.14.0±0.1 1.5
+0.1
0.6 max.
3.0 max.
0
Dim.
(mm)
ABWFEP
1
3.7±0.2 8.3±0.2 16.0±0.3 7.5±0.1
1.75±0.10
8.0±0.1
Dim.
(mm)
P2P0φD0t1t2
2.0±0.14.0±0.1 1.5
+0.1
0.3
3.5 max.
0
Dim.
(mm)
ABWFEP
1
12
12.0±0.3 5.5±0.1
1.75±0.10
8.0±0.1
Dim.
(mm)
P2P0φD0t1t2
2.0±0.14.0±0.1 1.5
+0.1
0.6 max.
3.0 max.
0
Type Embossed Taping Bulk
EFOP, EFOPM 2500 pcs./reel
500 pcs./bagEFOPS 2000 pcs./reel
EFOD, EFODM, EFOLM
1000 pcs./reel
00 Sep. 2008