© Semiconductor Components Industries, LLC, 2016
August, 2020 − Rev. 15
1Publication Order Number:
MURD620CT/D
Switch-mode
Power Rectifier
DPAK Surface Mount Package
MURD620CT, NRVUD620CT,
SRVUD620CT,
SNRVUD620CT
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
•Ultrafast 35 Nanosecond Recovery Time
•Low Forward Voltage Drop
•Low Leakage
•ESD Rating:
♦Human Body Model = 3B (> 8 kV)
♦Machine Model = C (> 400 V)
•NRVUD, SRVUD and SNRVUD Prefixes for Automotive and Other
Applications Requiring Unique Site and Control Change
Requirements; AEC−Q101 Qualified and PPAP Capable
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics:
•Case: Epoxy, Molded
•Weight: 0.4 Gram (Approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
ULTRAFAST RECTIFIER
6.0 AMPERES
200 VOLTS
1
3
4
www.onsemi.com
DPAK
CASE 369C
MARKING DIAGRAMS
Device Package Shipping†
ORDERING INFORMATION
MURD620CTT4G DPAK
(Pb−Free)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MURD620CTG DPAK
(Pb−Free)
75 Units / Rail
A = Assembly Location*
Y = Year
WW = Work Week
U620T = Device Code (MURD/NRVUD/
SNRVUD620CT)
US620T = Device Code (SRVUD620CT)
G = Pb−Free Package
AYWW
U
620TG
NRVUD620CTG DPAK
(Pb−Free)
75 Units / Rail
NRVUD620CTT4G DPAK
(Pb−Free)
2,500 /
Tape & Reel
AYWW
U
S620TG
SRVUD620CTT4G DPAK
(Pb−Free)
2,500 /
Tape & Reel
SNRVUD620CTT4G DPAK
(Pb−Free)
2,500 /
Tape & Reel
NRVUD620CTG−
VF01
DPAK
(Pb−Free)
2,500 /
Tape & Reel
* The Assembly Location Code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter
pin), the front side assembly code may be blank.
MURD620CT, NRVUD620CT, SRVUD620CT, SNRVUD620CT
www.onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
200 V
Average Rectified Forward Current
(TC = 140°C)
Per Diode
Per Device
IF(AV)
3.0
6.0
A
Peak Repetitive Forward Current
(Square Wave, Duty = 0.5, TC = 145°C)
Per Diode
IF
6.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, 60 Hz)
IFSM 50
A
Operating Junction and Storage Temperature Range TJ, Tstg −65 to +175 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS (Per Diode)
Characteristic Symbol Value Unit
Thermal Resistance, Junction−to−Case RqJC 9°C/W
Thermal Resistance, Junction−to−Ambient (Note 1) RqJA 80 °C/W
1. Rating applies when surface mounted on the minimum pad sizes recommended.
ELECTRICAL CHARACTERISTICS (Per Diode)
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage Drop (Note 2)
(iF = 3 Amps, TC = 25°C)
(iF = 3 Amps, TC = 125°C)
(iF = 6 Amps, TC = 25°C)
(iF = 6 Amps, TC = 125°C)
vF1
0.96
1.2
1.13
V
Maximum Instantaneous Reverse Current (Note 2)
(TJ = 25°C, Rated dc Voltage)
(TJ = 125°C, Rated dc Voltage)
iR5
250
mA
Maximum Reverse Recovery Time
(IF = 1 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25°C)
(IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25°C)
trr 35
25
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
MURD620CT, NRVUD620CT, SRVUD620CT, SNRVUD620CT
www.onsemi.com
3
TYPICAL CHARACTERISTICS
0.0001
0.001
0.01
0.1
1
10
100
0 20 40 60 80 100 120 140 160 180 200
Figure 1. Typical Forward Voltage (Per Leg)
vF, INSTANTANEOUS VOLTAGE (V)
0 0.60.2 0.8
30
0.1
0.3
0.2
2.0
1.0
100
20
7.0
3.0
0.5
5.0
50
, INSTANTANEOUS FORWARD CURRENT (AMPS)
F
1.4
VR, REVERSE VOLTAGE (V)
TJ = 175°C
Figure 2. Typical Leakage Current* (Per Leg)
IF(AV), AVERAGE FORWARD CURRENT (A)
0 3.02.0
0
2.0
1.0
3.0
5.0
4.0
14
7.0
6.0
P
1.0 10
Figure 3. Average Power Dissipation (Per Leg)
0.4
0.7
10
70
1.0 1.2
100°C
TJ = 25°C175°C
100°C
25°C
6.05.04.0 9.08.07.0
9.0
8.0
* The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these curves if VR is sufficiently below rated
VR.
i
150°C
11
10
13
12
, AVERAGE POWER DISSIPATION (WATTS)
F(AV)
TJ = 175°C
IPK/IAV = 20
SINE
WAVE
SQUARE
WAVE
dc
10
5.0
150°C
IR, REVERSE CURRENT (mA)
TC, CASE TEMPERATURE (°C)
100
1.0
2.0
3.0
4.0
5.0
IF(AV)
0
6.0
7.0
8.0
110 120 130 140 150 160 170 180
Figure 4. Current Derating, Case (Per Leg)
020
1.0
1.5
2.5
3.5
4.0
0
40 60 80 100
TA, AMBIENT TEMPERATURE (°C)
IF(AV)
Figure 5. Current Derating, Ambient (Per Leg)
RATED VOLTAGE APPLIED
RqJC = 9°C/W
, AVERAGE FORWARD CURRENT (AMPS)
SINE WAVE
OR
SQUARE WAVE
dc
, AVERAGE FORWARD CURRENT (AMPS)
TJ = 175°C
120 140 160 180 200
0.5
2.0
3.0
SINE WAVE
OR
SQUARE WAVE
SURFACE MOUNTED ON
MIN. PAD SIZE RECOMMENDED
RATED VOLTAGE APPLIED
RqJA = 80°C/W
dc
TJ = 175°C
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE F DATE 21 JUL 2015
SCALE 1:1
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
STYLE 4:
PIN 1. CATHODE
2. ANODE
3. GATE
4. ANODE
STYLE 5:
PIN 1. GATE
2. ANODE
3. CATHODE
4. ANODE
STYLE 6:
PIN 1. MT1
2. MT2
3. GATE
4. MT2
STYLE 7:
PIN 1. GATE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
123
4
STYLE 8:
PIN 1. N/C
2. CATHODE
3. ANODE
4. CATHODE
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. RESISTOR ADJUST
4. CATHODE
STYLE 10:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. ANODE
b
D
E
b3
L3
L4b2
M
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D0.235 0.245 5.97 6.22
E0.250 0.265 6.35 6.73
A0.086 0.094 2.18 2.38
b0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.028 0.045 0.72 1.14
c0.018 0.024 0.46 0.61
e0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
12 3
4
XXXXXX = Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
AYWW
XXX
XXXXXG
XXXXXXG
ALYWW
DiscreteIC
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒmm
inchesǓ
SCALE 3:1
GENERIC
MARKING DIAGRAM*
*This information is generic. Please refer
to device data sheet for actual part
marking.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.114 REF 2.90 REF
L2 0.020 BSC 0.51 BSC
A1
H
DET AIL A
SEATING
PLANE
A
B
C
L1
L
H
L2 GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
eBOTTOM VIEW
Z
BOTTOM VIEW
SIDE VIEW
TOP VIEW
ALTERNATE
CONSTRUCTIONS
NOTE 7
Z
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0 Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON10527D
ON SEMICONDUCTOR STANDARD
REF TO JEDEC TO−252
DPAK SINGLE GAUGE SURFACE MOUNT
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
DOCUMENT NUMBER:
98AON10527D
PAGE 2 OF 2
ISSUE REVISION DATE
ORELEASED FOR PRODUCTION. REQ. BY L. GAN 24 SEP 2001
AADDED STYLE 8. REQ. BY S. ALLEN. 06 AUG 2008
BADDED STYLE 9. REQ. BY D. WARNER. 16 JAN 2009
CADDED STYLE 10. REQ. BY S. ALLEN. 09 JUN 2009
DRELABELED DRAWING TO JEDEC STANDARDS. ADDED SIDE VIEW DETAIL A.
CORRECTED MARKING INFORMATION. REQ. BY D. TRUHITTE. 29 JUN 2010
EADDED ALTERNATE CONSTRUCTION BOTTOM VIEW. MODIFIED DIMENSIONS
b2 AND L1. CORRECTED MARKING DIAGRAM FOR DISCRETE. REQ. BY I. CAM-
BALIZA.
06 FEB 2014
FADDED SECOND ALTERNATE CONSTRUCTION BOTTOM VIEW. REQ. BY K.
MUSTAFA. 21 JUL 2015
© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. F Case Outline Number
:
369C
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, af filiates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
www.onsemi.com
1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
◊
