ANALOG DEVICES LC?MOS High Speed jxP-Compatible 8-Bit ADC with Track/Hold Function AD7820 FEATURES Fast Conversion Time: 1.364s max Built-In Track-and-Hold Function No Missed Codes No User Trims Required Single +5V Supply Ratiometric Operation No External Clock Extended Temperature Range Operation Skinny 20-Pin DIP, SOIC and 20-Terminal Surface Mount Packages GENERAL DESCRIPTION The AD7820 is a high speed, microprocessor-compatible 8-bit analog-to-digital converter which uses a half-flash conversion technique to achieve a conversion time of 1.36us. The converter has a OV to +5V analog input voltage range with a single + 5V supply. The half-flash technique consists of 31 comparators, a most significant 4-bit ADC and a least significant 4-bit ADC. The input to the AD7820 is tracked and held by the input sampling circuitry, eliminating the need for an external sample-and-hold for signals with slew rates less than 100mV/ys. The part is designed for ease of microprocessor interface with the AD7820 appearing as a memory location or I/O port without the need for external interfacing logic. All digital outputs use latched, three-state output buffer circuitry to allow direct con- nection to a microprocessor data bus or system input port. A non-three state overflow output is also provided to allow cascading of devices to give higher resolution. The AD7820 is fabricated in an advanced, all ion-implanted, high speed, Linear Compatible CMOS (LC2MOS) process and features a low maximum power dissipation of 75mW. It is available in 20-pin DIPs, SOICs and in 20-terminal surface mount packages. REV. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No licanse is granted by implica tion or otherwise under any patent or patent rights of Analog Devices. FUNCTIONAL BLOCK DIAGRAM Vop Veer (+) (12 OFL Vaee() (41 vai DBO-DB7 DATAOUT DRIVERS Vaer( +) % 4-8IT FLASH ADC (4LSB] TIMING AND CONTROL NC CIRCUITRY 7 6 13 8 GNO MoDE WaRDY CS Ro int PRODUCT HIGHLIGHTS 1. Fast Conversion Time The half-flash conversion technique, coupled with fabrication on Analog Devices LC?MOS process, enables very fast con- version times. The maximum conversion time for the WR-RD mode is 1.36us, with 1.6.s the maximum for the RD mode. 2. Total Unadjusted Error The AD7820 features an excellent total unadjusted error figure of less than 1/2LSB over the full operating temperature range. The part is also guaranteed to have no missing codes over the entire temperature range. 3. Built-In Track-and-Hold The analog input circuitry uses sampled-data comparators, which by nature have a built-in track-and-hold function. As a result, input signals with slew rates up to 100mV/us can be converted to 8-bits without external sample-and-hold. This corresponds to a 5V peak-to-peak, 7kHz sine-wave signal. 4, Single Supply Operation from a single +5V supply with a positive voltage reference allows operation of the AD7820 in microprocessor systems without any additional power supplies. One Technology Way, P.O. Box $106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703 Twx: 710/394-6577 Telex: 924491 Cable: ANALOG NORWOODMASS eooreorree PINS 2-5, 14-17(Von = +5V; Veer (-+)= + 5V: Vper () = GND = OV unless otherwise stated). AD? 870 SPEC | F| C ATI 0 N S All specifications T,,j, t0 Trax unless otherwise specified. Specifications apply for _ RD Mode (Pin 7 = 0V) Parameter K Version L Version B, T Versions C, U Versions Units Coaditioas/Comments ACCURACY Resolution 8 8 8 8 Bits Total Unadjusted Error +1 +12 +1 +12 LSB max Wain Resolution for which No Missing Codes are guaranteed 8 8 8 8 Bits REFERENCE INPUT Input Resistance 1.0/4.0 1.0/4.0 1.0/4.0 1.0/4.0 kN min/kN max Vrzr( + ) Input Voltage Range Veer (-Vpp Veer (- Vpp VreF(~ YVpp Vrer(- YVpp Vmin/V max Vaer ( ) Input Voltage Range GND/Vrer( +) GND/Vper(+) GND/Vrer(+) GND/Vrer(+) V min/V max ANALOG INPUT Input Voltage Range Vrer( - /Vrer + ) Vrer( - YVrer +) Vrer( - YVeer( +) Vrer( - Vrer +) V min/V max Input Leakage Current +3 +3 +3 +3 vA max Input Capacitance 45 45 45 45 pF yp LOGIC INPUTS CS, WR,RD Vinu 2.4 2.4 2.4 2.4 Vmin Vint 0.8 0.8 0.8 0.8 V max Ina (CS, RD) 1 1 1 1 A max Tnn (WR) 3 3 3 3 pA max line -1 ~1 -1 -1 pA max Input Capacitance? 8 8 8 8 pF max Typically SpF MODE Vinu 3.5 3.5 3.5 3.5 V min Vint 1.5 LS 1.5 L5 V max Inu 200 200 200 200 A max 50 pA typ Iwi -1 -1 -1 -1 pA max Input Capacitance 8 8 8 8 pF max Typically SpF LOGIC OUTPUTS DBO-DB7, OFL, INT Vou 4.0 4.0 4.0 4.0 V min Isource= 360nA Vo. 0.4 0.4 0.4 0.4 Vmax Isivx = 1.6mA lout (DBO-DB7) +3 +3 +3 +3 pA max Floating State Leakage Output Capacitance* 8 8 8 8 pF max Typically SpF RDY Vor 0.4 0.4 0.4 0.4 V max Ign = 2.6mA lout +3 +3 +3 +3 A max Floating State Leakage Ourput Capacitance? 8 8 8g 8 pF max Typically 5pF SLEW RATE, TRACKING? 0.2 0.2 0.2 0.2 Vipstyp 0.1 0.1 0.1 0.1 V/s max POWER SUPPLY Vop 5 5 5 $ Volts + 5% for Specified Performance Ipp* 15 15 20 20 mA max CS=RD=0V Power Dissipation 0 40 ou 0 mW typ Power Supply Sensitivity +4 214 +14 +4 LSB max + VI6LSB typ Vpp =5V +5% NOTES "Temperature Ranges are as follows: K, L Versions: ~ 40C to + 85C B, C Versions: 49C + 88C T, U Versions: $5C to + 125C ?Total Unadjusted Error includes offset, full-scale and linearity errors. Sample tested at 25C by Product Assurance to ensure compliance. See Typical Performance Characteristics. Specifications subject to change without notice. -2- REV. APr AD7820 TIMING CHARACTERISTICS! (,,= +5:Ves(-+)=+5V; Vs ()= END =0V unless otherwise stated) Limit at Limit at Limit at 25C Tino | max Trains D max Parameter (All Versions) (K,L,B,C Versions) (T,U Versions) Units Conditions/Comments less 0 0 0 ns min CS TO RD/WR Setup Time tosH 0 0 0 ns min CS TORD/WR Hold Time trpy 70 90 100 ns max CS to Delay. Pull-Up Resistor 5k. terp 1.6 2.0 2.5 ps max Conversion Time (RD Mode) tacco? tcrp +20 terp +35 tcrp +50 ns max Data Access Time (RD Mode) tyr? 125 - - ns typ RD to INT Delay (RD Mode) 175 225 225 ns max ton 60 80 100 ns max Data Hold Time tp 500 600 600 ns min Delay Time between Conversions twr 600 600 600 ns min Write Pulse Width 50 50 50 jus max tap 600 700 700 ns min Delay Time between WR and RD Pulses tacc? 160 225 250 ns max Data Access Time (WRRD Mode, see Fig. 5b) try 140 200 225 ns max RD toINT Delay trrr2 700 - - ns typ WR toINT Delay 1000 1400 1700 ns max tacc?? 70 90 110 ns max Data Access Time (WR-RD Mode, see Fig. 5a) triwr2 100 130 150 ms max WR to INT Delay (Stand-Alone Operation) tp 50 65 75 ns max Data Access Time after INT (Stand-Alone Operation) NOTES 'Sample tested at 25C to ensure compliance. All input control signals are specified with tr=tf=20ns 2c. = S0pF. 3Measured with load circuits of Figure 1 and defined as the time required for an output to cross 0.8V or 2.4V. Defined as the time required for the data lines to change 0.5V when loaded with the circuits of Figure 2. Specifications subject to change without notice. Test Circuits DBN 3k 100pF DGND L a. High-Zto Von 5V 3k. DBN 100pF Ci senw b. High-Zto Vo, Figure 1. Load Circuits for Data Access Time Test REV. A DBN 3kQ DGND b (10% to 90% of +5V) and timed from a voltage level of 1.6V. 10pF a. Vou to High-Z 5V 3k. DBN 10pF Leno b. Vo. to High-Z Figure 2. Load Circuits for Data Hold Time TestAD7820 ABSOLUTE MAXIMUM RATINGS* VpptoGND .......... 0000 ee eee OV, +7V Digital Input Voltage to GND (Pins 6-8, 13) 0 we ek 0,3V, Vop +0.3V Digital Output Voltage to GND (Pins 2-5, 9, 14-18) .......... -0.3V, Vpp +0.3V VREF (+) toGND .......... VREF (-),; Vpp +0.3V Vrer()toGND ............0-. OV, Vrer (+) VmtoGND............... 0.3V, Vpp +0.3V Operating Temperature Range Storage Temperature Range. ........ Lead Temperature (Soldering, 10secs) ........ + 300C Power Dissipation (Any Package) to +75C ..... 450mW Derates above +75C by .........0.2000- 6mW/C *Suresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above Commercial (K, L Versions) Industrial (B, C Versions) Extended (T, U Versions) CAUTION: 40C to + 85C 40C to + 85C 55C to + 125C those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD (electrostatic discharge) sensitive device. The digital control inputs are diode protected; however, permanent damage may occur on unconnected devices subject to high energy electro- static fields. Unused devices must be stored in conductive foam or shunts. The protective foam should be discharged to the destination socket before devices are inserted. WARNING! ar 1 ESD SENSITIVE DEVICE ORDERING GUIDE Total Temperature Unadjusted | Package Model! Range Error(Max) | Option AD7820KN 40Cto + 85C | + 1LSB N-20 AD7820LN 40Cto + 85C | +1/2LSB N-20 AD7820KP 40Cto + 85C | +1LSB P-20A AD7820LP -40Cto +85C | +1/2LSB P-20A AD7820KR 40Cto +85C | +1LSB R-20 AD7820LR 40Cto + 85C | +1/2LSB R-20 AD7820BQ 40C to +85C | +1LSB Q-20 AD7820CQ 40Cto + 85C | +1/2LSB Q-20 AD7820TQ 55C to + 125C | + 1LSB Q-20 AD7820UQ 55Cto + 125C | + 1/2LSB Q-20 AD7820TE 55C to + 125C | + 1LSB E-20A AD7820UE 55C to + 125C | + 1/2LSB E-20A NOTES 'To order MIL-STD-883, Class B processed parts, add/883B to part number. Contact your local sales office for military data sheet. For U.S. Standard Military Drawing (SMD), see DESC drawing #5962-88650. 2E = Leadless Ceramic Chip Carrier; N = Plastic DIP; P = Plastic Leaded Chip Carrier; Q = Cerdip; R =SOIC. PIN CONFIGURATIONS DIP, SOIC LCCC PLCC VS BeBe va [7] [20] Yoo BRS y 6as> 2 32 7 20 48 312] [7 [20] [19 Deo | 2 13] NC ~ oB1 | 3 18] OFL oO DB2 4 18 OFL pp2 (4 he] OFL pee [* [7] 87 IMs DBa 5 17 DB7 {MSB) D ves [5 ap7sz0 [6] Bs _ AD7820 bes [5 AD7820 [17] DB? (MSB) _ TOP VIEW WRIRDY 6 TOP VIEW 16 DBS wrepv [6 TOP VIEW [16] pes WRRDY | 6} (Notto Scale} | 15] DBS MODE 7 (Not to Scale) 15 DBS MODE fF (Not to Scale) Hs] bes move [7 [14] bes AD 8 14 DBS w [a Fa} bes RO [8 13] cS 3 10 11 12 13 INT | 9 12] Vrer (+) lg e777 10} [11]] 12 | - eg~-~- rFavtT GND | 10 11] Vrer t~-) 4 b gEeitie NC=NO CONNECT > > ob t NC=NO CONNECT NC=NO CONNECT > > 4 REV. ANAA Vp = 4.78 1, | J terp- CONVERSION TIME- ps | z i Vop=5.25V - 100 -50 o T,- AMBIENT TEMPERATURE - C Conversion Time {RD Model) vs. Temperature 100 2.0 Vpo =5V Vase =5V 15 Ta= 25C tp=500ns a twa=600ns ! = 10 a z a 0.5 a 200 300 400 500 600 700 800 tan~ ns Accuracy vs. tap SNR- dB 1 2345 7 20 30 4050 70 100 INPUT FREQUENCY - kHz ENCODE RATE = 400kHz INPUT SIGNAL = 5V p-p MEASUREMENT BANDWIDTH = 80kHz 10 Signal-Noise Ratio vs. Input Frequency REV. A 12 2.0 | 4 " Vop=5V Vaer=5 ts eee, . = Ins e 10 5 3 tuo = 600ns z Voo=5.25V = * 2 > (9 5 2 > 1.0 z z & A < 3 8 - Vop=5V 2 a + Von =4.75V| 05 N 7 So PP ee 6 0 -100 50 0 50 100 150 200 300 400 500 600 700 Ta- AMBIENT TEMPERATURE - C. twa- ns. Power Supply Current vs. Temperature Accuracy vs. twr (not including reference ladder} 2.0 20 ] Vpp =5V Ta=25C Von=5V Vrer=5V 15 Ta= 25C 15 a twr=600ns 2 4 tap = 600ns 3 I 5 & 2 wo 10 10 5 E 3 Z N y =} 0.5 ~ 05 sw o 0 300 400 500 600 700 800 900 0 1 2 3 4 5 tpns suse =A Vrer~V Accuracy vs. tp Accuracy vs Vrer [Veer = Vaer(t+) Veer ()] 2.0 10 e Von =5V i S 8 Fe 15 2 iF Vv, =2.4V } Isounce Vout a Voo=4.75V i To & - 6 = 5 J 8 10 Le 4 ae 5 | g e Vpo =5 Von =5.25V 5 4 Pe tz z2 oa = = E Isieaxs Vour= 040 ha # \e AA 3 Z 05 4 u 2 Z 0 o 100 50 o 50 100 150 100 50 0 50 100 150 Ta AMBIENT TEMPERATURE - C T,~ AMBIENT TEMPERATURE C twr_, Internal Time Delay vs. Output Current vs. Temperature Temperature _5-AD7820 PIN FUNCTION DESCRIPTION PIN 1 Ne nub Ww 10 11 12 13 14 15 16 17 18 19 20 MNEMONIC DESCRIPTION Vin DBO DBl DB2 DB3 WR/RDY Mode GND Vrer ) VreK +) DB4 DBS DB6 DB7 OFL NC Vpp Analog Input. Range: Vrrr( ) to Veer +). Data Output. Three State Output, bit 0 (LSB) Data Output. Three State Output, bit 1 Data Output. Three State Output, bit 2 Data Output. Three State Output, bit 3 WRITE control input/READY status output. See Digital Interface section. Mode Selection Input. It determines whether the device operates in the WR-RD or RD mode. It is internally tied to GND through a 50,,A current source. See Digital Interface section. READ Input. RD must be low to access data from the part. See Digital Interface section. INTERRUPT Output. INT going low indicates that the conversion is complete. INT returns high on the rising edge of RD or CS. See Digital Interface section. Ground Lower limit of reference span. Range: GNDtinri) REV. A In the first of these options the processor waits for the INT status line to go low before reading the data (see Figure 5a). INT typically goes low 700ns after the rising edge of WR. It indicates that conversion is complete and that the data result is in the output latch. With CS low, the data outputs (DB0-DB7) are activated when RD goes low. INT is reset by the rising edge of RD or CS. The alternative option can be used to shorten the conversion time. To achieve this, the status of the INT line is ignored and RD can be brought low 600ns after the rising edge of WR. In this case RD going low transfers the data result into the output latch and activates the data outputs (DB0-DB7). INT also goes low on the falling edge of RD and is reset on the rising edge of RD or CS. The timing for this interface is shown in Figure 5b. twr _ | 3 tesm =| f ft _/ tess t te 1 RD + f DB0-087 7 VALID - DATA + pee ome fb jo tacc:o| Figure 5b. WR-RD Mode (tap 1k 5 GND OFL - 5kO (A +5V Ll MODE WR 7 Ko AD7820 ee] LCH Vaer (+) DB? Vin DBO Vaer() | GND OFL Vin (+4Vp, 3kHz max) +5V bos Figure 10. 9-Bit Resolution 25k -10- Vin cs AD7820* __ Vrer (+) INT Vop DB? | Veer () GND DBO MODE a TTT Vv *SAMPLE RATE IS 20kHz. Figure 11. Telcom A/D Converter REV. AAD7820 CLK ae Vina | Vins wr CS WR Vner GND +15V CS Ap7820 t Vop AD7224 RD RESET Vrer(-) Vout | Vo +5V Vo DB7 DB? t 0.1pF t 47 pF LDAC MODE DBO DBO y AGND Vaer]_ Vree (+) DGND Vss Vina V Vo = Vy; INB _ 5V REF IF Vina