ECG006B - WJ Communications, Inc.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 7 April 2006

ECG006

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

Product Features

• DC – 5.5 GHz

• +15.5 dBm P1dB at 1 GHz

• +32 dBm OIP3 at 1 GHz

• 15 dB Gain at 1 GHz

• 3.7 dB Noise Fi gure

• Available in lead-free/green SOT-86,

SOT-363, & SOT-89 package styles

• Internally matched to 50 Ω

Applications

• Mobile Infrastru cture

• CATV / FTTX

• W-LAN / ISM

• RFID

• WiMAX / WiBro

Product Description

The ECG006 is a general-purpose buffer amplifier that

offers high dynamic range in a low-cost surface-mount

package. At 1000 MHz, the ECG006 typically provides 15

dB of gain, +32 dBm Output IP3, and +15.5 dBm P1dB.

The ECG006 consists of Darlington pair amplifiers using

the high reliability InGaP/GaAs HBT process technology

and only requires DC-blocking capacitors, a bias resistor,

and an inductive RF choke for operation. The device is

ideal for wireless applications and is available in low-cost,

surface-mountable plastic lead-free/green/RoHS-compliant

SOT-363, SOT-86 and SOT-89 packages. All devices are

100% RF and DC tested.

The broadband MMIC amplifier can be directly applied to

various current and next generation wireless technologies

such as GPRS, GSM, CDMA, and W-CDMA. In addition,

the ECG006 will work for other various applications within

the DC to 5.5 GHz frequency range such as CATV and

mobile wireless.

Functional Diagram

RF IN GND RF OUT

GND

1 23

ECG006B-G

RF OutRF In

GND

ECG006C-G

RF IN

GND

RF OUT

GND

GND 1

3 4

ECG006F-G

Specifications (1)

Parameter Units Min Typ Max

Operational Bandwidth MHz DC 5500

Test Frequency MHz 1000

Gain dB 15

Output P1dB dBm +15.4

Output IP3 (2) dBm +32

Test Frequency MHz 2000

Gain dB 12 14 18

Input Return Loss dB 18

Output Return Loss dB 14

Output P1dB dBm +12 +15

Output IP3 (2) dBm +32

Noise Figure dB 4.0

Device Voltage V 3.5 3.9 4.3

Device Current mA 45

1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, Rbias = 24.3 Ω, 50 Ω System.

2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The

suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.

Absolute Maximum Rating

Parameter Rating

Operating Case Temperature -40 to +85 °C

Storage Temperature -55 to +150 °C

Device Current 150 mA

RF Input Power (continuous) +12 dBm

Junction Temperature +250 °C

Operation of this device above any of these parameters may cause permanent damage.

Typical Performance (1)

Parameter Units Typical

Frequency MHz 500 900 1900 2140

S21 dB 15.5 15 14.2 14

S11 dB -20 -14 -17.4 -18

S22 dB -16 -13 -14.5 -15

Output P1dB dBm +15.8 +15.4 +15 +15

Output IP3 (2) dBm +32 +32 +30 +30

Noise Figure dB 3.7 3.7 3.7 3.7

Ordering Information

Part No. Description

ECG006B-G InGaP HBT Gain Block

(lead-free/green/RoHS-compliant SOT-89 package)

ECG006C-G InGaP HBT Gain Block

(lead-free/green/RoHS-compliant SOT-86 package)

ECG006F-G InGaP HBT Gain Block

(lead-free/green/RoHS-compliant SOT-363 package)

ECG006B-PCB 700 – 2400 MHz Fully Assembled Eval. Board

ECG006C-PCB 700 – 2400 MHz Fully Assembled Eval. Board

ECG006F-PCB 700 – 2400 MHz Fully Assembled Eval. Board

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 7 April 2006

ECG006

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

Typical Device RF Performance

Supply Bias = +5 V, Rbias = 24.3 Ω, Icc = 45 mA

Frequency MHz 100 500 900 1900 2140 2400 3500 5800

S21 dB 15.3 15.2 15.1 14.5 14.3 14.1 13.9 10.2

S11 dB -20 -18 -14 -17 -18 -20 -17 -12.5

S22 dB -29 -16 -13 -14 -14 -15 -15 -9.5

Output P1dB dBm +15.8 +15.4 +15.2 +15.0 +14.9 +14.6 +14

Output IP3 dBm +31 +31.5 +32 +30 +30 +29.6

Noise Figure dB 3.8 3.7 3.6 3.6 3.6 3.6

1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.9 V, Rbias = 24.3 Ω, Icc = 45 mA typical, 50 Ω System.

2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.

3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.

G ain vs. Frequency

500 1000 1500 2000 2500 3000

Frequency (M H z)

Gain

+25C -40C +85C

S11, S22 vs. Frequency

-25

-20

-15

-10

-5

0123456

Frequency (GHz)

S11, S22

(

)

S11

Vde vs. Icc

3.00 3.20 3.40 3.60 3.80 4.00 4.20 4.40

Vde (V)

Icc (mA)

+25C

O IP3 vs. Frequency

500 1000 1500 2000 2500 3000

Frequency (MH z)

OIP3

(

dBm

)

+25°C -40°C +85°C

Noise Figure vs. Frequency

2.5

3.5

500 1000 1500 2000

Frequency (M H z)

(

)

P1dB vs. Frequency

500 1000 1500 2000 2500 3000

Frequency (M H z)

P1dB

(

dBm

)

+25°C -40°C +85°C

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 7 April 2006

ECG006

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

Recommended Application Circuit

ECG006B-PCB

ECG006C-PCB

ECG006F-PCB

Recommended Component Values

Reference Frequency (MHz)

Designator 50 500 900 1900 2200 2500 3500

L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH

C1, C2, C4 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF

1. The proper values for the components are dependent u pon the intended frequency of operation.

2. The follow ing values are contained on the evaluation board to achieve optimal broadband performance:

Ref. Desig. Value / Type Size

L1 39 nH wirewound inductor 0603

C1, C2 56 pF chip capacitor 0603

C3 0.018 μF chip capacitor 0603

C4 Do Not Place

R4 24.3Ω 1% tolerance 0805

Recommended Bias Resistor Values

Supply

Voltage R1 value Size

5 V 24.4 ohms 0805

6 V 46.7 ohms 0805

8 V 91 ohms 1210

9 V 113 ohms 1210

10 V 136 ohms 2010

12 V 180 ohms 2010

The proper value for R1 is dependent upon the supply

voltage and allows for bias stability over temperature.

WJ recommends a minimum supply bias of +5 V. A

1% tolerance resistor is recommended.

Blocking

Capacitor

RF OUT

RF Choke

0.018 µF

Bias

Resisto

RF IN

Bypass

Capacito

Blocking

acito

Vcc

Icc = 45 m

ECG006

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 7 April 2006

ECG006

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

ECG006B-G Mechanical Information

This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free

(maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.

Outline Drawing

Land Pattern

Product Marking

The component will be marked with an

“E006G” designator with an alphanumeric lot

code on the top surface of the package. The

obsolete tin-lead package is marked with an

“E006” designator followed by an

alphanumeric lot code; it may also have been

marked with a “E” designator followed by a 3-

digit numeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1A

Value: Passes between 250 and 500V

Test: Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +260 °C convection reflow

Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper p erformance o f this

device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the

part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a

heatsink. Ensure that the ground / thermal via region contacts the

heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in degrees.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 5 of 7 April 2006

ECG006

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

ECG006C-G Mechanical Information

This package is lead-free/Green/RoHS-compliant. The plating material on the pins is annealed matte tin over copper. It is compatible with

both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.

Outline Drawing

Land Pattern

Product Marking

The component will be marked with a two-digit

numeric lot code (shown as “XX”) followed

with an “I” designator on the top surface of the

package. The obsolete tin-lead package is

marked with a two-digit numeric lot code

followed with a “N” designator; it may also

have been marked with a “N” designator

followed by a two-digit lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1A

Value: Passes between 250 and 500V

Test: Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +260 °C convection reflow

Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper p erformance o f this

device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the

part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a

heatsink. Ensure that the ground / thermal via region contacts the

heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in degrees.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 6 of 7 April 2006

ECG006

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

ECG006F-G Mechanical Information

This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible with

both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.

Outline Drawing

Land Pattern

Product Marking

The component will be marked with a two-

digit numeric lot code (shown as “XX”)

followed with a “7” designator on the top

surface of the package. The obsolete tin-

lead package is marked with a two-digit

numeric lot code followed with a “3”

designator; it may also have been marked

with a “30” designator followed by a letter

lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1A

Value: Passes between 250 and 500V

Test: Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +260 °C convection reflow

Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper performance

of this device. Vias should use a .35mm (#80 / .0135”)

diameter drill and have a final plated thru diameter of .25 mm

(.010”).

2. Add as much copper as possible to inner and outer la yers near

the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via

region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in

degrees.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 7 of 7 April 2006

ECG006

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

Typical Device S-Parameters – ECG006B-G

S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25°C, calibrated to device leads)

Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)

50 -16.18 -2.18 15.76 178.02 -18.89 -0.38 -14.36 -2.29

500 -16.13 -22.13 15.57 160.12 -18.77 -2.87 -14.40 -26.41

1000 -15.97 -44.58 15.21 141.76 -18.46 -5.33 -14.15 -51.57

1500 -15.79 -68.38 14.80 124.56 -17.94 -9.45 -13.78 -77.30

2000 -15.34 -96.24 14.57 108.50 -17.29 -14.37 -13.23 -104.15

2500 -14.99 -124.42 14.34 91.11 -16.69 -21.48 -12.79 -131.75

3000 -14.73 -153.90 14.02 74.20 -16.16 -29.16 -12.22 -160.58

3500 -14.29 174.59 13.65 56.77 -15.76 -38.37 -11.63 170.65

4000 -13.38 141.41 13.22 39.56 -15.49 -47.75 -10.44 143.61

4500 -11.80 110.87 12.66 22.19 -15.29 -57.59 -9.04 117.68

5000 -9.66 85.53 12.00 5.48 -15.28 -68.56 -7.50 96.34

5500 -7.85 63.77 11.20 -10.89 -15.43 -79.10 -6.12 76.71

6000 -6.37 47.01 10.36 -26.75 -15.69 -89.87 -4.95 59.58

Typical Device S-Parameters – ECG006C-F

S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25°C, calibrated to device leads)

Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)

50 -13.66 -1.22 15.30 178.47 -18.67 -0.33 -12.25 -1.92

500 -13.64 -13.39 15.23 164.32 -18.59 0.29 -12.33 -20.62

1000 -14.11 -23.99 15.01 149.00 -18.38 0.78 -12.52 -41.41

1500 -15.20 -35.45 14.72 134.06 -17.99 0.29 -13.08 -62.51

2000 -17.86 -52.47 14.44 119.89 -17.52 -0.93 -14.31 -82.78

2500 -20.46 -93.43 14.06 105.18 -17.12 -3.33 -15.20 -99.71

3000 -18.86 -135.97 13.53 91.27 -16.59 -6.24 -15.01 -124.98

3500 -17.20 -158.47 12.99 77.75 -16.21 -10.91 -14.89 -157.99

4000 -16.45 -171.80 12.38 65.03 -15.93 -15.16 -14.50 170.24

4500 -17.31 166.84 11.76 52.68 -15.73 -19.74 -13.75 147.52

5000 -16.22 136.42 11.25 40.65 -15.52 -24.35 -12.08 133.59

5500 -13.68 110.91 10.56 28.09 -15.42 -29.98 -10.21 119.31

6000 -11.01 97.79 9.95 17.28 -15.43 -34.96 -8.73 106.39

Typical Device S-Parameters – ECG006F-G

S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25°C, calibrated to device leads)

Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)

50 -16.22 -0.52 15.76 178.32 -18.82 -0.82 -14.16 -2.06

500 -14.87 -18.97 15.63 165.77 -18.87 1.49 -12.83 -24.91

1000 -16.45 -51.46 15.51 151.31 -18.40 1.44 -14.19 -55.98

1500 -16.41 -95.69 15.22 137.15 -18.07 0.35 -14.59 -93.37

2000 -14.08 -118.65 14.79 123.39 -17.74 -1.31 -13.52 -120.99

2500 -12.50 -114.48 14.48 112.93 -17.16 -2.57 -13.05 -122.53

3000 -12.18 -126.96 14.14 100.74 -16.80 -4.49 -12.19 -138.80

3500 -11.70 -139.53 13.94 88.52 -16.16 -8.66 -11.93 -159.41

4000 -10.97 -158.51 13.57 75.28 -15.72 -12.48 -11.00 174.63

4500 -10.24 178.62 13.03 62.14 -15.50 -19.07 -9.10 151.63

5000 -9.06 161.58 12.33 51.12 -15.19 -24.71 -7.50 139.14

5500 -8.32 150.77 11.60 42.08 -15.22 -28.00 -6.87 136.14

6000 -7.84 140.56 10.95 33.72 -15.14 -30.97 -6.78 137.51

Device S-parameters are available for download off of the website at: http://www.wj.com