PhotoMOS
RELAYS
GU (General Use) Type
1-Channel (Form A)
High Capacity 4-Pin Type
cUL
pending VDE
pending
mm inch
4.78
.188 6.4
.252
3.2
.126
1
2
4
3
FEATURES
1. Greatly increased load current.
2. Reinforced insulation 5,000 V type.
3. Greatly impro ved specs allow you to
use this in place of mercury and
mechanical relays.
4. Compact 4-pin DIP size.
TYPICAL APPLICATIONS
• Security market
(use in I/O f or alarm and security de vices,
etc.)
• Measuring instrument market
TYPES
*Indicate the peak AC and DC values.
Note: For space reasons, the initial letters of the product number “AQY”, the SMD terminal shape indicator “A” and the pac kage type indicator "X" and
"Z" are omitted from the seal.
Type I/O isolation
voltage
Output rating* Part No. Packing quantity
Through hole
terminal Surface-mount terminal
Load
voltage Load
current Tube packing style Tape and reel packing style Tube Tape and reel
Picked from the
1/2-pin side Picked from the
3/4-pin side
AC/DC
type Reinforced
5,000 V 60 V 1.1 A AQY212GH AQY212GHA AQY212GHAX AQY212GHAZ 1 tube contains
100 pcs.
1 batch contains
1,000 pcs. 1,000 pcs.
RATING
1. Absolute maximum ratings (Ambient temperature: 25
°
C 77
°
F)
Item Symbol AQY212GH Remarks
Input
LED forward current I
F
50 mA
LED reverse voltage V
R
5 V
Peak forward current I
FP
1 A f = 100 Hz, Duty factor = 0.1%
Power dissipation P
in
75 mW
Output
Load voltage (peak AC) V
L
60 V
Continuous load current
(peak AC) I
L
1.1 A
Peak load current I
peak
3.0 A 100ms (1 shot), V
L
= DC
Power dissipation P
out
500 mW
Total power dissipation P
T
550 mW
I/O isolation voltage V
iso
5,000 V AC
Temperature limits Operating T
opr
–40
°
C to +85
°
C –40
°
F to +185
°
FNon-condensing at low temperatures
Storage T
stg
–40
°
C to +100
°
C –40
°
F to +212
°
F
AQY212GH.fm1 y[WQOOQNU Sœ@˛jœ@ ªPQ QT“
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2
2. Electrical characteristics (Ambient temperature: 25
°
C 77
°
F)
Note: Recommendable LED forward current I
F
= 5 to 10 mA. For type of connection, see Page 4.
*Turn on/Turn off time
Item Symbol AQY212GH Condition
Input
LED operate
current Typical I
Fon
1.1 mA I
L
= 100mA
Maximum 3 mA
LED turn off
current Minimum I
Foff
0.3 mA I
L
= 100mA
Typical 1.0 mA
LED dropout
voltage Typical V
F
1.14 V (1.32 V at IF = 50 mA) I
F
= 5 mA
Maximum 1.5 V
Output On resistance Typical R
on
0.34
Ω
I
F
= 5 mA
I
L
= Max.
Within 1 s on time
Maximum 0.7
Ω
Off state leakage
current Maximum I
Leak
1
µ
AI
F
= 0
V
L
= Max.
Transfer
characteristics
Turn on time* Typical T
on
1.3 ms I
F
= 5 mA
I
L
= 100 mA
V
L
= 10 V
Maximum 5.0 ms
Turn off time* Typical T
off
0.1 ms I
F
= 5 mA
I
L
= 100 mA
V
L
= 10 V
Maximum 0.5 ms
I/O capacitance Typical C
iso
0.8 pF f = 1 MHz
V
B
= 0
Maximum 1.5 pF
Initial I/O isolation
resistance Minimum R
iso
1,000 M
Ω
500 V DC
Ton
Input
Output 10%
90%
Toff
REFERENCE DATA
1. Load current vs. ambient temperature
characteristics
Allowable ambient temperature: –40
°
C to +85
°
C
–40
°
F to +185
°
F
2. On resistance vs. ambient temperature
characteristics
Measured portion: between terminals 3 and 4;
LED current: 5 mA; Load voltage: Max. (DC)
Continuous load current: Max.(DC)
3. Turn on time vs. ambient temperature
characteristics
LED current: 5 mA; Load voltage: 10 V (DC);
Continuous load current: 100 mA (DC)
0
1
2
Ambient temperature, °C
Load current, A
2.5
3
0204060
8085 100
–40 –20
0.5
1.5
0–40 –20
0.2
0204060
80
Ambient temperature, °C
On resistance, Ω
85
0.6
0.8
1
0.4
0
2
Ambient temperature, °C
Turn on time, ms
–40 –20
5
0204060
80
1
3
4
85
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4. Turn off time vs. ambient temperature
characteristics
LED current: 5 mA; Load voltage: 10 V (DC);
Continuous load current: 100 mA (DC)
5. LED operate current vs. ambient
temperature characteristics
Load voltage: 10 V (DC);
Continuous load current: 100mA (DC)
6. LED turn off current vs. ambient temperature
characteristics
Load voltage: 10 V (DC);
Continuous load current: 100mA (DC)
0
0.4
0.8
0.6
Ambient temperature, °C
Turn off time, ms
–40 –20
1
0204060
80
0.2
85
0
2
3
Ambient temperature, °C
LED operate current, mA
–40 –20
5
0204060
8085
1
4
0
2
3
Ambient temperature, °C
LED turn off current, mA
–40 –20 0204060
80
1
5
4
85
7. LED dropout voltage vs. ambient
temperature characteristics
LED current: 5 to 50 mA
8. Voltage vs. current characteristics of output
at MOS portion
Measured portion: between terminals 3 and 4;
Ambient temperature: 25
°
C 77
°
F
9. Off state leakage current
Measured portion: between terminals 3 and 4;
Ambient temperature: 25
°
C 77
°
F
1
1.1
1.2
1.3
1.4
Ambient temperature, °C
LED dropout voltage, V
–40 –20 0204060
8085
1.5
50mA
30mA
20mA
10mA
5mA
Voltage, V
Current, mA
1
–1
3
2
–3
–2
10.5
–1 –0.5
030 40 60
Load voltage, V
Off state leakage current, A
10
10-12
10-10
10 20
10-6
10-8
50
-4
10. LED forward current vs. turn on time
characteristics
Measured portion: between terminals 3 and 4;
Load voltage: 10 V (DC);
Continuous load current: 100 mA (DC);
Ambient temperature: 25
°
C 77
°
F
11. LED forward current vs. turn off time
characteristics
Measured portion: between terminals 3 and 4;
Load voltage: 10 V (DC);
Continuous load current: 100 mA (DC);
Ambient temperature: 25
°
C 77
°
F
12. Applied voltage vs. output capacitance
characteristics
Measured portion: between terminals 3 and 4;
Frequency: 1 MHz;
Ambient temperature: 25
°
C 77
°
F
0
1
2
3
5
LED forward current, mA
Turn on time, ms
10 20 30 40 50
4
0LED forward current, mA
Turn off time, ms
0
0.1
0.3
0.2
10 20 30 40
0.5
500
0.4
0
100
200
800
Applied voltage, V
Output capacitance, pF
10 20 30 40 50
500
400
300
600
0
700
60
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DIMENSIONS
mm inch
Through hole terminal type
Terminal thickness = 0.2 .008
General tolerance:
±
0.1
±
.004
Surface mount terminal type
Terminal thickness = 0.2 .008
General tolerance:
±
0.1
±
.004
4.78
.188
6.4
.252
2.7
.106
7.62±0.05
.300±.002
Max. 10°
Max. 10°
1.0
.039
0.33
.013
0.2
.008
3.0
.118
0.47
.019
3.2±0.1
.126±.004
0.47
.019
2.54
.100
4.78
.188
6.4
.252
1.0
.039
2.7
.106
7.62±0.05
.300±.002
Max. 10°
1.0
.039
1.0
.039
2.7
.106
0.47
.019
0.47
.019
2.54
.100
0.2
.008±0.2
0
±.008
0
PC board pattern (BOTTOM VIEW)
Tolerance:
±
0.1
±
.004
Mounting pad (TOP VIEW)
Tolerance:
±
0.1
±
.004
4-0.8 dia.
4-.031 dia.
7.62
.300
6.4
.252
2.54
.100
2.54
.100
8.3
.327
1.9
.0751.5
.059 2.54
.100
SCHEMATIC AND WIRING DIAGRAMS
Notes: E
1
: Power source at input side; I
F
: LED forward current; V
L
: Load voltage; I
L
: Load current;
Schematic Output
configura-
tion Load Connec-
tion Wiring diagram
1a AC/DC —
1
2
4
3
1
IFIL
23
4
VL (AC,DC)
Load
Load
IL
4
3VL (AC,DC)
E1
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Cautions for Use
SAFETY WARNINGS
• Do not use the product under conditions
that exceed the range of its specifications.
It may cause overheating, smoke, or fire.
• Do not touch the recharging unit while
the power is on. There is a danger of
electrical shock. Be sure to turn off the
power when performing mounting,
maintenance, or repair operations on the
rela y (including connecting parts such as
the terminal board and socket).
• Check the connection diagrams in the
catalog and be sure to connect the
terminals correctly. Erroneous
connections could lead to unexpected
operating errors, overheating, or fire.
NOTES
1. Short across terminals
Do not short circuit between terminals
when relay is energized. There is
possibility of breaking the internal IC.
2. Surge voltages at the input
If reverse surge voltages are present at
the input terminals, connect a diode in
reverse parallel across the input terminals
and keep the reverse voltages below the
reverse breakdown voltage.
3. Recommended LED f orward current
(I
F
)
It is recommended that the LED forward
current (I
F
) be kept at 5mA.
4. Ripple in the input power supply
If ripple is present in the input power
supply, observe the following:
1) For LED operate current at E
min
,
maintain the value mentioned in the tab le
of “Note 3. Recommended LED forward
current (I
F
).”
2) Keep the LED operate current at 50
mA or less at E
max
.
5. Output spike voltages
1) If an inductive load generates spike
voltages which exceed the absolute
maximum rating, the spike voltage must
be limited.
Typical circuits are shown below.
2) If spike voltages generated at the load
are limited with a clamp diode and the
circuit wires are long, spike voltages will
occur by inductance . Keep wires as short
as possible to minimize inductance.
6. Cleaning solvents compatibility
Dip cleaning with an organic solvent is
recommended for removal of solder flux,
dust, etc. Select a cleaning solvent from
the following table. If ultrasonic cleaning is
used, the severity of factors such as
frequency, output power and cleaning
solvent selected may cause loose wires
and other defects. Make sure these
conditions are correct before use. For
details, please consult us.
1
2
4
3
Emin. Emax.
1
2
4
Load
Add a clamp diode
to the load
Add a CR snubber
circuit to the load
Load
3
1
2
4
3
Cleaning solvent Compatibility
(
❍
: Yes
✕
: No)
Chlorine-
base • Trichlene
• Chloroethlene
❍
Adueous • Indusco
• Hollis
• Lonco Terg
❍
Alcohol-
base • IPA
• Ethanol
❍
Others • Thinner
• Gasoline
✕
7. Soldering
1) When soldering PC board terminals,
keep soldering time to within 10 s at
260
°
C 500
°
F.
2) When soldering surface-mount
terminals, the following conditions are
recommended.
(1) IR (Infrared reflow) soldering method (2) Vapor phase soldering method (3) Double wave soldering method
T1
T2
T3
T1 = 155 to 165°C 311 to 329°F
T2 = 180°C 200°C 356 to 392°F
T3 = 245°C 473°F or less
t1 = 120 s or less
t2 = 30 s or less
t1t2
T2
T1
t1t2
T1 = 180 to 200°C 366 to 392°F
T2 = 215°C 419°F or less
t1 = 40 s
t2 = 90 s or less
T2
T1
t1t2t3
T1 = 155 to 165°C 311 to 329°F
T2 = 260°C 500°F or less
t1 = 60 s or less
t2+t3 = 5 s or less
(4) Soldering iron method
Tip temperature: 280 to 300
°
C 536 to
572
°
F
Wattage: 30 to 60 W
Soldering time: within 5 s
(5) Others
Check mounting conditions before using
other soldering methods (hot-air, hot
plate, pulse heater, etc.)
• The temperature profile indicates the
temperature of the soldered terminal on
the surf ace of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
• The conditions for the infrared reflow
soldering apply when preheating using
the VPS method.
AQY212GH.fm5 y[WQOOQNU Sœ@˛jœ@ ªPQ QT“
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6
8. The following shows the packaging format
mm inch
1) Tape and reel
Type Tape dimensions Dimensions of paper tape reel
4-pin SMD
type
(1) When picked from 1/2-pin side: Part No. AQY❍❍❍GHAX (Shown above)
(2) When picked from 3/4-pin side: Part No. AQY❍❍❍GHAZ
Device mounted
on tape
Direction of picking
Tractor feed holes
1.5 dia.
.059 dia.
1.55±0.1 dia.
.061±.004 dia.
±0.1
– 0
±.004
–0
4±0.1
.157±.004
2±0.1
.079±.004
10.2±0.1
.402±.004
12±0.1
.472±.004
0.3±0.05
.012±.002
4.2±0.3
.165±.012
12±0.3
.472±.012
5.5±0.1
.217±.004
1.75±0.1
.069±.004
5.25±0.1
.207±.004
80±1 dia.
3.150±.039 dia.
13±0.5 dia.
.512±.020 dia.
21±0.8
.827±.031
13.5±2.0
.531±.079 2±0.5
.079±.020
2±0.5
.079±.020 300±2 dia.
11.811±.079 dia.
80±1 dia.
3.150±.039 dia.
2) Tube
Devices are packaged in a tube so pin No .
1 is on the stopper B side. Observe
correct orientation when mounting them
on PC boards.
9. Transportation and storage
1) Extreme vibration during transport will
warp the lead or damage the relay.
Handle the outer and inner boxes with
care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
• Temperature: 0 to 45
°
C 32 to 113
°
F
• Humidity: Less than 70% R.H.
• Atomosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
Stopper B Stopper A
AQY212GH.fm6 y[WQOOQNU Sœ@˛jœ@ ªPQ QT“
