MC33912G5AC / MC34912G5AC Freescale Semiconductor Advance Information Document Number: MC33912 Rev. 8.0, 3/2010 LIN System Basis Chip with DC Motor Pre-driver and Current Sense 33912 The 33912G5/BAC is a Serial Peripheral Interface (SPI) controlled System Basis Chip (SBC), combining many frequently used functions in an MCU based system, plus a Local Interconnect Network (LIN) transceiver. The 33912 has a 5.0 V, 50 mA/60 mA low dropout regulator with full protection and reporting features. The device provides full SPI readable diagnostics and a selectable timing watchdog for detecting errant operation. The LIN Protocol Specification 2.0 and 2.1 compliant LIN transceiver has waveshaping circuitry that can be disabled for higher data rates. Two 50 mA/60 mA high side switches and two 150 mA/160 mA low side switches with output protection are available. All outputs can be pulse-width modulated (PWM). Four high voltage inputs are available for use in contact monitoring, or as external wake-up inputs. These inputs can be used as high voltage Analog Inputs. The voltage on these pins is divided by a selectable ratio and available via an analog multiplexer. The 33912 has three main operating modes: Normal (all functions available), Sleep (VDD off, wake-up via LIN, wake-up inputs (L1-L4), cyclic sense and forced wake-up), and Stop (VDD on with limited current capability, wake-up via CS, LIN bus, wake-up inputs, cyclic sense, forced wake-up and external reset). The 33912 is compatible with LIN Protocol Specification 2.0, 2.1, and SAEJ2602-2. SYSTEM BASIS CHIP WITH LIN 2ND GENERATION AC SUFFIX (Pb-FREE) 98ASH70029A 32-PIN LQFP ORDERING INFORMATION Features * * * * * * * * * Device Temperature Range (TA) MC33912G5AC/R2 - 40C to 125C MC34912G5AC/R2 -40C to 85C Full-duplex SPI interface at frequencies up to 4.0 MHz LIN transceiver capable of up to 100 kbps with wave shaping MC33912BAC/R2 - 40C to 125C Current sense module MC34912BAC/R2 -40C to 85C Four high voltage analog/logic Inputs Configurable window watchdog * See Page 2 for Device Variations Switched/protected 5.0 V output (used for Hall sensors) Two 50 mA high side and two 150 mA/160 mA low side protected switches 5.0 V low drop regulator with fault detection and low voltage reset (LVR) circuitry Pb-free packaging designated by suffix code AC 33912 VBAT VSENSE HS1 VS1 VS2 LIN INTERFACE L1 L2 L3 L4 LIN VDD LGND PGND AGND MCU PWMIN ADOUT0 ADOUT1 MOSI MISO SCLK CS RXD TXD IRQ RST LS1 LS2 ISENSEH ISENSEL HVDD HS2 WDCONF Figure 1. 33912 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. (c) Freescale Semiconductor, Inc., 2009 - 2010. All rights reserved. M Package 32-LQFP MC33912G5AC / MC34912G5AC DEVICE VARIATIONS DEVICE VARIATIONS The 33912G5 data sheet is within MC33912G5 Product Specifications Pages 3 to 47 The 33912BAC data sheet is within MC33912BAC Product Specifications Pages 48 to 90 Table 1. Device Variations for the MC33912 Device MC33912G5AC/R2 Temperature Generation - 40C to 125C 2. Immunity against ISO7637 pulse 3b 2.5 MC34912G5AC/R2 Changes 1. Increase ESD Gun IEC61000-4-2 (gun test contact with 150 pF, 330 ohm test conditions) performance to achieve 6.0 kV min on the LIN pin. 3. Reduce EMC emission level on LIN 4. Improve EMC immunity against RF - target new specification including 3x68pF - 40C to 85C 5. Comply with J2602 conformance test MC33912BAC/R2 - 40C to 125C MC34912BAC/R2 - 40C to 85C 2.0 Initial release 33912 2 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC MC33912G5 PRODUCT SPECIFICATIONS PAGES 3 TO 47 MC33912G5 PRODUCT SPECIFICATIONS PAGES 3 TO 47 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 3 MC33912G5AC / MC34912G5AC INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM RST IRQ INTERRUPT CONTROL MODULE LVI, HVI, ALL OT (VDD,HS,LS,LIN,SD) RESET CONTROL MODULE LVR, WD, EXT C VS1 INTERNAL BUS VS2 VDD AGND VOLTAGE REGULATOR 5V OUTPUT MODULE HVDD LS1 LOW SIDE CONTROL MODULE WINDOW WATCHDOG MODULE LS2 PWMIN PGND VS2 MISO SCLK VS2 SPI & CONTROL HS1 HS2 ANALOG MULTIPLEXER MOSI HIGH SIDE CONTROL MODULE CS ADOUT0 WAKE-UP MODULE VBAT SENSE MODULE VSENSE CHIP TEMPERATURE SENSE MODULE ANALOG INPUT MODULE L1 L2 L3 RXD TXD DIGITAL INPUT MODULE LIN PHYSICAL LAYER L4 LIN ISENSEH CURRENT SENSE MODULE ISENSEL LGND WDCONF ADOUT1 Figure 2. 33912 Simplified Internal Block Diagram 33912 4 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC PIN CONNECTIONS AGND VDD HVDD VSENSE NC VS1 VS2 HS1 32 31 30 29 28 27 26 25 PIN CONNECTIONS MISO 3 22 L2 MOSI 4 21 L3 SCLK 5 20 L4 CS 6 19 LS1 ADOUT0 7 18 PGND PWMIN 8 17 LS2 9 10 11 12 13 14 15 16 ISENSEH L1 ISENSEL 23 LGND 2 LIN TXD WDCONF HS2 ADOUT1 24 IRQ 1 RST RXD Figure 3. 33912 Pin Connections Table 2. 33912 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 24. Pin Pin Name Formal Name Definition 1 RXD Receiver Output This pin is the receiver output of the LIN interface which reports the state of the bus voltage to the MCU interface. 2 TXD Transmitter Input This pin is the transmitter input of the LIN interface which controls the state of the bus output. 3 MISO SPI Output SPI (Serial Peripheral Interface) data output. When CS is high, pin is in the high-impedance state. 4 MOSI SPI Input SPI (Serial Peripheral Interface) data input. 5 SCLK SPI Clock SPI (Serial Peripheral Interface) clock Input. 6 CS SPI Chip Select 7 ADOUT0 Analog Output Pin 0 8 PWMIN PWM Input 9 RST Internal Reset I/O Bidirectional Reset I/O pin - driven low when any internal reset source is asserted. RST is active low. 10 IRQ Internal Interrupt Output Interrupt output pin, indicating wake-up events from Stop mode or events from Normal and Normal request modes. IRQ is active low. 11 ADOUT1 Analog Output Pin 1 SPI (Serial Peripheral Interface) chip select input pin. CS is active low. Analog Multiplexer Output. High Side and Low Side Pulse Width Modulation Input. Current sense analog output. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 5 MC33912G5AC / MC34912G5AC PIN CONNECTIONS Table 2. 33912 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 24. Pin Pin Name Formal Name 12 WDCONF Watchdog Configuration Pin 13 LIN LIN Bus 14 LGND LIN Ground Pin Definition This input pin is for configuration of the watchdog period and allows the disabling of the watchdog. This pin represents the single-wire bus transmitter and receiver. This pin is the device LIN ground connection. It is internally connected to the PGND pin. 15 ISENSEL 16 ISENSEH 17 LS2 19 LS1 18 PGND 20 L4 21 L3 22 L2 23 L1 24 HS2 25 HS1 26 VS2 27 VS1 28 NC Not Connected 29 VSENSE Voltage Sense Pin Battery voltage sense input.(3) 30 HVDD Hall Sensor Supply Output +5.0 V switchable supply output pin.(4) 31 VDD Voltage Regulator Output +5.0 V main voltage regulator output pin.(5) 32 AGND Analog Ground Pin This pin is the device analog ground connection. Current Sense Pins Current Sense differential inputs. Low Side Outputs Relay drivers low side outputs. Power Ground Pin This pin is the device low side ground connection. It is internally connected to the LGND pin. Wake-up Inputs These pins are the wake-up capable digital inputs(1). In addition, all Lx inputs can be sensed analog via the analog multiplexer. High Side Outputs High side switch outputs. Power Supply Pin These pins are device battery level power supply pins. VS2 is supplying the HSx drivers while VS1 supplies the remaining blocks.(2) This pin can be left open or connected to any potential ground or power supply. Notes 1. When used as digital input, a series 33 k resistor must be used to protect against automotive transients. 2. Reverse battery protection series diodes must be used externally to protect the internal circuitry. 3. This pin can be connected directly to the battery line for voltage measurements. The pin is self protected against reverse battery connections. It is strongly recommended to connect a 10 k resistor in series with this pin for protection purposes. 4. External capacitor (1.0 F < C < 10 F; 0.1 < ESR < 5.0 ) required. 5. External capacitor (2.0 F < C < 100 F; 0.1 < ESR < 10 ) required. 33912 6 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit Normal Operation (DC) VSUP(SS) -0.3 to 27 Transient Conditions (load dump) VSUP(PK) -0.3 to 40 VDD -0.3 to 5.5 VIN -0.3 to VDD +0.3 VIN(IRQ) -0.3 to 11 HS1 and HS2 Pin Voltage (DC) VHS - 0.3 to VSUP +0.3 V LS1 and LS2 Pin Voltage (DC) VLS -0.3 to 45 V Normal Operation with a series 33 k resistor (DC) VLxDC -18 to 40 Transient input voltage with external component (according to ISO7637-2) (See Figure 5, page 20) VLxTR 100 ISENSEH and ISENSEL Pin Voltage (DC) VISENSE -0.3 to 40 V VSENSE Pin Voltage (DC) VVSENSE -27 to 40 V Normal Operation (DC) VBUSDC -18 to 40 Transient input voltage with external component (according to ISO7637-2) (See Figure 4, page 20) VBUSTR -150 to 100 IVDD Internally Limited ELECTRICAL RATINGS Supply Voltage at VS1 and VS2 Supply Voltage at VDD Input / Output Pins Voltage V (6) CS, RST, SCLK, PWMIN, ADOUT0, ADOUT1, MOSI, MISO, TXD, RXD, HVDD Interrupt Pin (IRQ)(7) V L1, L2, L3 and L4 Pin Voltage V LIN Pin Voltage VDD output current V V A Notes 6. Exceeding voltage limits on specified pins may cause a malfunction or permanent damage to the device. 7. Extended voltage range for programming purpose only. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 7 MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value ESD Capability Unit V AECQ100 Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 ) LIN Pin VESD1-1 L1, L2, L3, and L4 VESD1-2 8.0k 6.0k all other Pins VESD1-3 2000 Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32) VESD2-1 750 All other Pins (Pins 2-7, 10-15, 18-23, 26-31) VESD2-2 500 LIN pin with 220 pF VESD3-1 20k LIN pin without capacitor VESD3-2 11k VS1/VS2 (100 nF to ground) VESD3-3 > 12k Lx inputs (33 k serial resistor) VESD3-4 6000 LIN pin with 220 pF and without capacitor VESD4-1 8000 VS1/VS2 (100 nF to ground) VESD4-2 8000 VESD4-3 8000 Charge Device Model - JESD22/C101 (CZAP = 4.0 pF) According to LIN Conformance Test Specification / LIN EMC Test Specification, August 2004 (CZAP = 150 pF, RZAP = 330 ) Contact Discharge, Unpowered According to IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 ) Unpowered Lx inputs (33 k serial resistor) THERMAL RATINGS Operating Ambient Temperature (8) Operating Junction Temperature C TA 33912 -40 to 125 34912 -40 to 85 TJ -40 to 150 C Storage Temperature TSTG -55 to 150 C Thermal Resistance, Junction to Ambient RJA Natural Convection, Single Layer board (1s)(8), (9) Natural Convection, Four Layer board (2s2p)(8), (10) Thermal Resistance, Junction to Case(11) Peak Package Reflow Temperature During Reflow(12), (13) C/W 85 56 RJC 23 C/W TPPRT Note 13 C Notes 8. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 9. 10. 11. 12. Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 13. 33912 8 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit VSUP 5.5 - 18 V Functional Operating Voltage(14) VSUPOP - - 27 V Load Dump VSUPLD - - 40 V IRUN - 4.5 10 mA SUPPLY VOLTAGE RANGE (VS1, VS2) Nominal Operating Voltage SUPPLY CURRENT RANGE (VSUP = 13.5 V) Normal Mode (IOUT at VDD = 10 mA), LIN Recessive State(15) Stop Mode, VDD ON with IOUT = 100 A, LIN Recessive State (17) (18) , (15), (16), ISTOP A 5.5 V < VSUP < 12 V - 47 VSUP = 13.5 V - 62 90 13.5 V < VSUP < 18 V - 180 400 5.5 V < VSUP < 12 V - 27 35 VSUP = 13.5 V - 33 48 13.5 V VSUP < 18 V - 160 300 ICYCLIC - 10 - Threshold (measured on VS1)(19) VBATFAIL 1.5 3.0 3.9 Hysteresis (measured on VS1)(19) VBATFAIL_HYS - 0.9 - VSUV 5.55 6.0 6.6 VSUV_HYS - 0.2 - VSOV 18 19.25 20.5 - 1.0 - Sleep Mode, VDD OFF, LIN Recessive State(15), (17) Cyclic Sense Supply Current Adder(19) 80 ISLEEP A A SUPPLY UNDER/OVER-VOLTAGE DETECTIONS Power-On Reset (BATFAIL)(20) V VSUP under-voltage detection (VSUV Flag) (Normal and Normal Request Modes, Interrupt Generated) Threshold (measured on VS1) Hysteresis (measured on VS1) V VSUP over-voltage detection (VSOV Flag) (Normal and Normal Request Modes, Interrupt Generated) Threshold (measured on VS1) Hysteresis (measured on VS1) VSOV_HYS V Notes 14. Device is fully functional. All features are operating. 15. Total current (IVS1 + IVS2) measured at GND pins excluding all loads, cyclic sense disabled. 16. Total IDD current (including loads) below 100 A. 17. Stop and Sleep Modes current will increase if VSUP exceeds13.5 V. 18. 19. 20. This parameter is guaranteed after 90 ms. This parameter is guaranteed by process monitoring but not production tested. The Flag is set during power up sequence. To clear the flag, a SPI read must be performed. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 9 MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic (21) VOLTAGE REGULATOR Symbol Min Typ Max 4.75 5.00 5.25 60 110 200 - 0.1 0.25 Unit (VDD) Normal Mode Output Voltage VDDRUN 1.0 mA < IVDD < 50 mA; 5.5 V < VSUP < 27 V Normal Mode Output Current Limitation IVDDRUN Dropout Voltage(22) VDDDROP IVDD = 50 mA Stop Mode Output Voltage V V VDDSTOP IVDD < 5.0 mA mA V 4.75 5.0 5.25 IVDDSTOP 6.0 13 36 Normal Mode, 5.5 V < VSUP < 18 V; IVDD = 10 mA LRRUN - - 25 Stop Mode, 5.5 V < VSUP < 18 V; IVDD = 1.0 mA LRSTOP - - 25 Normal Mode, 1.0 mA < IVDD < 50 mA LDRUN - - 80 Stop Mode, 0.1 mA < IVDD < 5.0 mA LDSTOP - - 50 90 115 140 TPRE_HYS - 13 - C TSD 150 170 190 C TSD_HYS - 13 - C -2.0 - 2.0 20 35 50 Stop Mode Output Current Limitation Line Regulation mV Load Regulation Over-temperature Prewarning mA mV (Junction)(23) TPRE Interrupt generated, VDDOT Bit Set Over-temperature Prewarning Hysteresis(23) Over-temperature Shutdown Temperature (Junction)(23) (23) Over-temperature Shutdown Hysteresis C HALL SENSOR SUPPLY OUTPUT(24) (HVDD) VDD Voltage matching HVDDACC = (HVDD-VDD) / VDD * 100% HVDDACC IHVDD = 15 mA Current Limitation Dropout Voltage IHVDD HVDDDROP IHVDD = 15 mA; IVDD = 5.0 mA Line Regulation - 160 300 - - 40 mV LDHVDD 1.0 mA > IHVDD > 15 mA; IVDD = 5.0 mA mA mV LRHVDD IHVDD = 5.0 mA; IVDD = 5.0 mA Load Regulation % mV - - 20 Notes 21. Specification with external capacitor 2.0 F < C < 100 F and 100 m ESR 10 . 22. Measured when voltage has dropped 250 mV below its nominal Value (5.0 V). 23. This parameter is guaranteed by process monitoring but not production tested. 24. Specification with external capacitor 1.0 F < C < 10 F and 100 m ESR 10 . 33912 10 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit VRSTTH 4.3 4.5 4.7 V 0.0 - 0.9 -150 -250 -350 1.5 - 8.0 RST INPUT/OUTPUT PIN (RST) VDD Low Voltage Reset Threshold Low-state Output Voltage VOL IOUT = 1.5 mA; 3.5 V VSUP 27 V High-state Output Current (0 V < VOUT < 3.5 V) IOH Pull-down Current Limitation (internally limited) IPD_MAX VOUT = VDD V A mA Low-state Input Voltage VIL -0.3 - 0.3 x VDD V High-state Input Voltage VIH 0.7 x VDD - VDD +0.3 V MISO SPI OUTPUT PIN (MISO) Low-state Output Voltage VOL IOUT = 1.5 mA High-state Output Voltage 0.0 - 1.0 VDD -0.9 - VDD -10 - 10 VOH IOUT = -250 A Tri-state Leakage Current V V ITRIMISO 0 V VMISO VDD A SPI INPUT PINS (MOSI, SCLK, CS) Low-state Input Voltage VIL -0.3 - 0.3 x VDD V High-state Input Voltage VIH 0.7 x VDD - VDD +0.3 V MOSI, SCLK Input Current IIN -10 - 10 10 20 30 0 V VIN VDD CS Pull-up Current A IPUCS 0 V < VIN < 3.5 V A INTERRUPT OUTPUT PIN (IRQ) Low-state Output Voltage VOL IOUT = 1.5 mA High-state Output Voltage 0.0 - 0.8 VDD -0.8 - VDD - - 2.0 VOH IOUT = -250 A Leakage Current V V IOUT VDD VOUT 10 V mA PULSE WIDTH MODULATION INPUT PIN (PWMIN) Low-state Input Voltage VIL -0.3 - 0.3 x VDD V High-state Input Voltage VIH 0.7 x VDD - VDD +0.3 V Pull-up current 0 V < VIN < 3.5 V IPUPWMIN A 10 20 30 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 11 MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max TJ = 25C, ILOAD = 50 mA; VSUP > 9.0 V - - 7.0 TJ = 150C, ILOAD = 50 mA; VSUP > 9.0 V(25) - - 10 TJ = 150C, ILOAD = 30 mA; 5.5 V < VSUP < 9.0 V(25) - - 14 Unit HIGH SIDE OUTPUTS HS1 AND HS2 PINS (HS1, HS2) Output Drain-to-Source On Resistance RDS(ON) Output Current Limitation(26) ILIMHSX 0 V < VOUT < VSUP - 2.0 V mA 60 90 250 - 5.0 7.5 - - 10 VSUP -2.0 - - THSSD 140 160 180 C THSSD_HYS - 10 - C TJ = 25C, ILOAD = 150 mA, VSUP > 9.0 V - - 2.5 TJ = 125C, ILOAD = 150 mA, VSUP > 9.0 V - - 4.5 - - 10 160 275 350 - 7.5 12 Open Load Current Detection (27) IOLHSX Leakage Current ILEAK -0.2 V < VHSX < VS2 + 0.2 V Short-circuit Detection Threshold(28) Over-temperature Shutdown(29), (33) Over-temperature Shutdown A VTHSC 5.5 V < VSUP < 27 V Hysteresis(33) mA V LOW SIDE OUTPUTS LS1 AND LS2 PINS (LS1, LS2) Output Drain-to-Source On Resistance RDS(ON) TJ = 125C, ILOAD = 120 mA, 5.5 V < VSUP < 9.0 V Output Current Limitation(30) ILIMLSX 2.0 V < VOUT < VSUP Open Load Current Detection(31) IOLLSX Leakage Current ILEAK -0.2 V < VOUT < VS1 Active Output Energy Clamp mA A - - 10 VSUP +2.0 - VSUP +5.0 2.0 - - TLSSD 140 160 180 C TLSSD_HYS - 10 - C VCLAMP IOUT = 150 mA Short-circuit Detection Threshold(28) V VTHSC 5.5 V < VSUP < 27 V Over-temperature Shutdown(32), (33) (33) Over-temperature Shutdown Hysteresis mA V Notes 25. This parameter is production tested up to TA = 125C, and guaranteed by process monitoring up to TJ = 150C. 26. 27. 28. 29. 30. 31. 32. 33. When over-current occurs, the corresponding high side stays ON with limited current capability and the HSxCL flag is set in the HSSR. When open load occurs, the flag (HSxOP) is set in the HSSR. HS and LS automatically shutdown if HSOT or LSOT occurs or if the HVSE flag is enabled and an over-voltage occurs. When over-temperature shutdown occurs, both high sides are turned off. All flags in HSSR are set. When over-current occurs, the corresponding low side stays ON with limited current capability and the LSxCL flag is set in the LSSR. When open load occurs, the flag (LSxOP) is set in the LSSR. When over-temperature shutdown occurs, both low sides are turned off. All flags in LSSR are set. Guaranteed by characterization but not production tested 33912 12 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max 2.0 2.5 3.0 Unit L1, L2, L3 AND L4 INPUT PINS (L1, L2, L3, L4) Low Detection Threshold(34) VTHL 5.5 V < VSUP < 27 V High Detection Threshold(34) VTHH 5.5 V < VSUP < 27 V Hysteresis V (34) V 3.0 3.5 4.0 0.4 0.8 1.4 VHYS 5.5 V < VSUP < 27 V Input Current(35) V IIN -0.2 V < VIN < VS1 A -10 - 10 800 1300 2000 LXDS (Lx Divider Select) = 0 0.95 1.0 1.05 LXDS (Lx Divider Select) = 1 3.42 3.6 3.78 -80 6.0 80 -22 2.0 22 96 100 104 96 100 104 REXT 20 - 200 k WDACC -15 - 15 % TA = -40C 2.0 - 2.8 TA = 25C 2.8 3.0 3.6 TA = 125C 3.6 - 4.6 VADOUT0_25 3.1 3.15 3.2 V STTOV 9.0 10.5 12 mV/K STTOV_3T 9.9 10.2 10.5 mV/K 5.0 5.25 5.5 Analog Input Impedance(36) RLXIN Analog Input Divider Ratio (RATIOLx = VLx / VADOUT0) RATIOLX Analog Output offset Ratio VRATIOLx- LXDS (Lx Divider Select) = 0 OFFSET LXDS (Lx Divider Select) = 1 Analog Inputs Matching mV LXMATCHING LXDS (Lx Divider Select) = 0 LXDS (Lx Divider Select) = 1 WINDOW WATCHDOG CONFIGURATION PIN (WDCONF) k % (37) External Resistor Range Watchdog Period Accuracy with External Resistor (Excluding Resistor Accuracy)(38) ANALOG MULTIPLEXER Temperature Sense Analog Output Voltage Temperature Sense Analog Output Voltage per characterization(39) VADOUT0_TEMP V TA = 25C Internal Chip Temperature Sense Gain Internal Chip Temperature Sense Gain per characterization at 3 temperatures(39) See Figure 16, Temperature Sense Gain VSENSE Input Divider Ratio (RATIOVSENSE = VVSENSE / VADOUT0) 5.5 V < VSUP < 27 V Notes 34. 35. 36. 37. RATIOVSENSE The unused Lx pins must be connected to ground. Analog multiplexer input disconnected from Lx input pin. Analog multiplexer input connected to Lx input pin. For VSUP 4.7 V to 18 V 38. Watchdog timing period calculation formula: tPWD [ms] = [0.466 * (REXT - 20)] + 10 with (REXT in k) 39. These limits have been defined after laboratory characterization on 3 lots and 30 samples. These tighten limits could not be guaranteed by production test. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 13 MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Min Typ Max 5.15 5.25 5.35 -30 -10 30 -30 -12.6 0 VDD -0.35 - VDD 0.0 - 0.35 CSGS (Current Sense Gain Select) = 0 29 30 31 CSGS (Current Sense Gain Select) = 1 14 14.5 15 CSGS (Current Sense Gain Select) = 0 2.0 10 30 CSGS (Current Sense Gain Select) = 1 5.0 20 50 CSGS (Current Sense Gain Select) = 0 100 - 200 CSGS (Current Sense Gain Select) = 1 100 - 200 -0.2 - 3.0 CSAZ (Current Sense Auto Zero) = 0 -15 - 15 CSAZ (Current Sense Auto Zero) = 1 -2.0 - 2.0 0.0 - 0.8 VDD -0.8 - VDD VSENSE Input Divider Ratio (RATIOVSENSE=VSENSE/VADOUT0) per characterization(40) Symbol Z 5.5 <VSUP< 27 V VSENSE Output Related Offset VSENSE Output Related Offset per characterization(40) Unit RATIOVSENSEC OFFSETVSENSE mV OFFSETVSENSE _CZ mV ANALOG OUTPUTS (ADOUT0 AND ADOUT1) Maximum Output Voltage VOUT_MAX -5.0 mA < IO < 5.0 mA Minimum Output Voltage V VOUT_MIN -5.0 mA < IO < 5.0 mA V CURRENT SENSE AMPLIFIER (ISENSEH, ISENSEL) Gain Differential Input Impedance Common Mode Input Impedance ISENSEH, ISENSEL Input Voltage Range Input Offset Voltage G DIFF k CM VIN k VIN_OFFSET V mV RXD OUTPUT PIN (LIN PHYSICAL LAYER) (RXD) Low-state Output Voltage VOL IOUT = 1.5 mA High-state Output Voltage VOH IOUT = -250 A V V TXD INPUT PIN (LIN PHYSICAL LAYER) (TXD) Low-state Input Voltage VIL -0.3 - 0.3 x VDD V High-state Input Voltage VIH 0.7 x VDD - VDD +0.3 V IPUIN 10 20 30 A TAGE 5.0 - 6.0 VJ2602_DEG - 400 - Pin Pull-up Current, 0 V < VIN < 3.5 V LIN PHYSICAL LAYER WITH J2602 FEATURE ENABLED (BIT DIS_J2602 = 0) LIN Under-voltage threshold Positive and Negative threshold (VTHP, VTHN) Hysteresis (VTHP - VTHN) VTH_UNDER_VOL V mV Notes 40. These limits have been defined after laboratory characterization on 3 lots and 30 samples. These tighten limits could not be guaranteed by production test. 33912 14 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit Operating Voltage Range VBAT 8.0 - 18 V Supply Voltage Range VSUP 7.0 - 18 V VSUP_NON_OP -0.3 - 40 V 40 90 200 -1.0 - - - - 20 -1.0 - 1.0 - - 100 - - 0.4 0.6 - - (41) LIN PHYSICAL LAYER, TRANSCEIVER (LIN) Voltage Range within which the device is not destroyed Current Limitation for Driver Dominant State IBUS_LIM Driver ON, VBUS = 18 V Input Leakage Current at the receiver mA IBUS_PAS_DOM Driver off; VBUS = 0 V; VBAT = 12 V Leakage Output Current to GND mA IBUS_PAS_REC Driver Off; 8.0 V < VBAT < 18 V; 8.0 V < VBUS < 18 V; VBUS VBAT Control unit disconnected from ground(42) A IBUS_NO_GND GNDDEVICE = VSUP; VBAT = 12 V; 0 < VBUS < 18 V VBAT Disconnected; VSUP_DEVICE = GND; 0 V < VBUS < 18 V(43) Receiver Dominant State mA IBUSNO_BAT A VBUSDOM Receiver Recessive State VSUP VBUSREC Receiver Threshold Center VSUP VBUS_CNT (VTH_DOM + VTH_REC)/2 Receiver Threshold Hysteresis VSUP 0.475 0.5 0.525 - - 0.175 VHYS (VTH_REC - VTH_DOM) VSUP Voltage Drop at the serial Diode in pull-up path VSERDIODE 0.4 1.0 V VBAT_SHIFT VSHIFT_BAT 0 11.5% VBAT VSHIFT_GND 0 11.5% VBAT 5.3 5.8 V GND_SHIFT LIN Wake-up threshold from Stop or Sleep mode (44) LIN Pull-up Resistor to VSUP Over-temperature Shutdown(45) Over-temperature Shutdown Hysteresis VBUSWU RSLAVE 20 30 60 k TLINSD 140 160 180 C TLINSD_HYS - 10 - C Notes 41. Parameters guaranteed for 7.0 V VSUP 18 V. 42. 43. 44. 45. Loss of local ground must not affect communication in the residual network. Node has to sustain the current that can flow under this condition. Bus must remain operational under this condition. This parameter is 100% tested on an Automatic Tester. However, since it has not been monitored during reliability stresses, Freescale does not guarantee this parameter during the product's life time. When over-temperature shutdown occurs, the LIN bus goes in recessive state and the flag LINOT in LINSR is set. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 15 MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 5. Dynamic Electrical Characteristics Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit SPI Operating Frequency f SPIOP - - 4.0 MHz SCLK Clock Period SPI INTERFACE TIMING (SEE Figure 13, PAGE 23) tPSCLK 250 - N/A ns SCLK Clock High Time(46) tWSCLKH 110 - N/A ns SCLK Clock Low Time(46) tWSCLKL 110 - N/A ns Falling Edge of CS to Rising Edge of SCLK(46) tLEAD 100 - N/A ns Falling Edge of SCLK to CS Rising Edge(46) tLAG 100 - N/A ns MOSI to Falling Edge of SCLK(46) tSISU 40 - N/A ns Falling Edge of SCLK to MOSI(46) tSIH 40 - N/A ns MISO Rise Time(46) tRSO - 40 - CL = 220 pF MISO Fall Time(46) ns tFSO CL = 220 pF Time from Falling or Rising Edges of ns - 40 - CS to:(46) ns - MISO Low-impedance tSOEN 0.0 - 50 - MISO High-impedance tSODIS 0.0 - 50 Time from Rising Edge of SCLK to MISO Data Valid(46) tVALID 0.0 - 75 t RST 0.65 1.0 1.35 ms t RSTDF 350 480 900 ns 8.5 10 11.5 0.2 x VDD MISO 0.8 x VDD, CL = 100 pF ns RST OUTPUT PIN Reset Low-level Duration After VDD High (see Figure 12, page 23) Reset Deglitch Filter Time WINDOW WATCHDOG CONFIGURATION PIN (WDCONF) Watchdog Time Period(47) t PWD External Resistor REXT = 20 k (1%) ms External Resistor REXT = 200 k (1%) 79 94 108 Without External Resistor REXT (WDCONF Pin Open) 110 150 205 CMR 70 - - dB SVR 60 - - dB GBP 0.75 3.0 - MHz SR 0.5 - - V/s CURRENT SENSE AMPLIFIER(46) Common Mode Rejection Ratio Supply Voltage Rejection Ratio (48) Gain Bandwidth Product Output Slew-Rate Notes 46. This parameter is guaranteed by process monitoring but not production tested. 47. Watchdog timing period calculation formula: tPWD [ms] = [0.466 * (REXT - 20)] + 10 with (REXT in k) 48. Analog Outputs are supplied by VDD and from 100 Hz to 4.0 kHz 33912 16 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 5. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit t WUF 8.0 20 38 s - - 5.0 t NR TOUT 110 150 205 ms TON 130 200 270 s +35 % L1, L2, L3 AND L4 INPUTS Lx Filter Time Deglitcher(49) STATE MACHINE TIMING Delay Between CS LOW-to-HIGH Transition (at End of SPI Stop Command) and Stop Mode Activation(49) Normal Request Mode Timeout (see Figure 12, page 23) Cyclic Sense ON Time from Stop and Sleep mode(50) t STOP Cyclic Sense Accuracy(49) Delay Between SPI Command and HS /LS Turn On(51) -35 - - 10 s t S-OFF 9.0 V < VSUP < 27 V Delay Between Normal Request and Normal mode After a Watchdog Trigger Command (Normal Request Mode)(49) s t S-ON 9.0 V < VSUP < 27 V Delay Between SPI Command and HS /LS Turn Off(51) s - - 10 - - 10 s t SNR2N Delay Between CS Wake-up (CS LOW to HIGH) in Stop mode and: s Normal Request mode, VDD ON and RST HIGH t WUCS 9.0 15 80 First Accepted SPI Command t WUSPI 90 -- N/A t 2CS 4.0 -- -- 35 50 70 Minimum Time Between Rising and Falling Edge on the CS s J2602 DEGLITCHER VSUP Deglitcher(52) (DIS_J2602 = 0) tJ2602_DEG s Notes 49. This parameter is guaranteed by process monitoring but not production tested. 50. This parameter is 100% tested on an Automatic Tester. However, since it has not been monitored during reliability stresses, Freescale does not guarantee this parameter during the product's life time. 51. Delay between turn on or off command (rising edge on CS) and HS or LS ON or OFF, excluding rise or fall time due to external load. 52. This parameter has not been monitoring during operating life test. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 17 MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 5. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR NORMAL SLEW RATE - 20.0KBIT/SEC ACCORDING TO LIN PHYSICAL LAYER SPECIFICATION(53), (54) Duty Cycle 1: D1 THREC(MAX) = 0.744 * VSUP THDOM(MAX) = 0.581 * VSUP D1 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 50 s, 7.0 V VSUP 18 V Duty Cycle 2: 0.396 -- -- -- -- 0.581 D2 THREC(MIN) = 0.422 * VSUP THDOM(MIN) = 0.284 * VSUP D2 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 50 s, 7.6 V VSUP 18 V LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR SLOW SLEW RATE - 10.4KBIT/SEC ACCORDING TO LIN PHYSICAL LAYER SPECIFICATION(53), (55) Duty Cycle 3: D3 THREC(MAX) = 0.778 * VSUP THDOM(MAX) = 0.616 * VSUP D3 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 96 s, 7.0 V VSUP 18 V Duty Cycle 4: 0.417 -- -- -- -- 0.590 D4 THREC(MIN) = 0.389 * VSUP THDOM(MIN) = 0.251 * VSUP D4 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 96 s, 7.6 V VSUP 18 V Notes 53. Bus load RBUS and CBUS 1.0 nF / 1.0 k, 6.8 nF / 660 , 10 nF / 500 . Measurement thresholds: 50% of TXD signal to LIN signal threshold defined at each parameter. See Figure 6, page 21. 54. See Figure 7, page 21. 55. See Figure 8, page 21. 33912 18 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 5. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit SRFAST -- 20 -- V / s t REC_PD -- 4.2 6.0 t REC_SYM - 2.0 -- 2.0 t PROPWL 42 70 95 t WAKE_SLEEP -- -- 1500 t WAKE_STOP 9.0 27 35 t TXDDOM 0.65 1.0 1.35 - 10 - LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR FAST SLEW RATE LIN Fast Slew Rate (Programming mode) LIN PHYSICAL LAYER: CHARACTERISTICS AND WAKE-UP TIMINGS (56) Propagation Delay and Symmetry(57) s Propagation Delay of Receiver, tREC_PD = MAX (tREC_PDR, tREC_PDF) Symmetry of Receiver Propagation Delay, tREC_PDF - tREC_PDR Bus Wake-Up Deglitcher (Sleep and Stop modes)(58)(62) (59) Bus Wake-Up Event Reported From Sleep Mode (60) From Stop Mode(61) TXD Permanent Dominant State Delay s s s PULSE WIDTH MODULATION INPUT PIN (PWMIN) PWMIN pin(62) Max. frequency to drive HS and LS output pins fPWMIN kHz Notes 56. VSUP from 7.0 to 18 V, bus load RBUS and CBUS 1.0 nF / 1.0 k, 6.8 nF / 660 , 10 nF / 500 . Measurement thresholds: 50% of TXD signal to LIN signal threshold defined at each parameter. See Figure 6, page 21. 57. See Figure 9, page 22 58. See Figure 10, page 22 for Sleep and Figure 11, page 22 for Stop Mode. 59. This parameter is tested on automatic tester but has not been monitoring during operating life test. 60. The measurement is done with 1F capacitor and 0mA current load on VDD. The value takes into account the delay to charge the capacitor. The delay is measured between the bus wake-up threshold (VBUSWU) rising edge of the LIN bus and when VDD reaches 3.0V. See Figure 10, page 22. The delay depends of the load and capacitor on VDD. 61. 62. In Stop Mode, the delay is measured between the bus wake-up threshold (VBUSWU) and the falling edge of the IRQ pin. See Figure 11, page 22. This parameter is guaranteed by process monitoring but not production tested. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 19 MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS 33912 1.0 nF LIN TRANSIENT PULSE GENERATOR (NOTE) GND PGND LGND AGND Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b. Figure 4. Test Circuit for Transient Test Pulses (LIN) 33912 Transient Pulse Generator (Note) 1.0 nF L1, L2, L3, L4 10 k GND PGND LGND AGND Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b,. Figure 5. Test Circuit for Transient Test Pulses (Lx) VSUP TXD LIN R0 RXD C0 R0 AND C0 COMBINATIONS: * 1.0 K and 1.0 nF * 660 and 6.8 nF * 500 and 10 nF Figure 6. Test Circuit for LIN Timing Measurements 33912 20 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TXD tBIT tBIT tBUS_DOM(MAX) VLIN_REC THREC(MAX) 74.4% VSUP THDOM(MAX) 58.1% VSUP tBUS_REC(MIN) Thresholds of receiving node 1 LIN THREC(MIN) THDOM(MIN) Thresholds of receiving node 2 42.2% VSUP 28.4% VSUP tBUS_DOM(MIN) tBUS_REC(MAX) RXD Output of receiving Node 1 tREC_PDF(1) tREC_PDR(1) RXD Output of receiving Node 2 tREC_PDF(2) tREC_PDR(2) Figure 7. LIN Timing Measurements for Normal Slew Rate TXD tBIT tBIT tBUS_DOM(MAX) VLIN_REC THREC(MAX) 77.8% VSUP THDOM(MAX) 61.6% VSUP tBUS_REC(MIN) Thresholds of receiving node 1 LIN THREC(MIN) THDOM(MIN) Thresholds of receiving node 2 38.9% VSUP 25.1% VSUP tBUS_DOM(MIN) tBUS_REC(MAX) RXD Output of receiving Node 1 tREC_PDF(1) tREC_PDR(1) RXD Output of receiving Node 2 tREC_PDR(2) tREC_PDF(2) Figure 8. LIN Timing Measurements for Slow Slew Rate 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 21 MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS VLIN_REC VBUSREC 0.6% VSUP VBUSDOM 0.4% VSUP VSUP LIN BUS SIGNAL RXD tREC_PDF tREC_PDR Figure 9. LIN Receiver Timing VLIN_REC LIN 5.0 V VBUSWU DOMINANT LEVEL 3.0 V VDD tPROPWL tWAKE_SLEEP Figure 10. LIN Wake-Up Sleep Mode Timing VLIN_REC LIN 5.0 V VBUSWU DOMINANT LEVEL IRQ tPROPWL tWAKE_STOP Figure 11. LIN Wake-up Stop Mode Timing 33912 22 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS VSUP VDD RST tNRTOUT tRST Figure 12. Power On Reset and Normal Request Timeout Timing tPSCLK CS tWSCLKH tLEAD tLAG SCLK tWSCLKL tSISU MOSI UNDEFINED D0 tSIH DON'T CARE D7 DON'T CARE tVALID tSODIS tSOEN MISO D0 DON'T CARE D7 Figure 13. SPI Timing Characteristics 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 23 MC33912G5AC / MC34912G5AC FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 33912 was designed and developed as a highly integrated and cost-effective solution for automotive and industrial applications. For automotive body electronics, the 33912 is well suited to perform relay control in applications such as a window lift, sunroof, etc. via the LIN bus. Power switches are provided on the device configured as high side and low side outputs. Other ports are also provided, which include a current and voltage sense port, a Hall Sensor port supply, and four wake-up capable pins. An internal voltage regulator provides power to a MCU device. Also included in this device is a LIN physical layer, which communicates using a single wire. This enables this device to be compatible with 3-wire bus systems, where one wire is used for communication, one for battery, and one for ground. FUNCTIONAL PIN DESCRIPTION See Figure 1, 33912 Simplified Application Diagram, page 1, for a graphic representation of the various pins referred to in the following paragraphs. Also, see the pin diagram on page 5 for a description of the pin locations in the package. RECEIVER OUTPUT PIN (RXD) The RXD pin is a digital output. It is the receiver output of the LIN interface and reports the state of the bus voltage: RXD Low when LIN bus is dominant, RXD High when LIN bus is recessive. TRANSMITTER INPUT PIN (TXD) The TXD pin is a digital input. It is the transmitter input of the LIN interface and controls the state of the bus output (dominant when TXD is Low, recessive when TXD is High). This pin has an internal pull-up to force recessive state in case the input is left floating. LIN BUS PIN (LIN) The LIN pin represents the single-wire bus transmitter and receiver. It is suited for automotive bus systems and is compliant to the LIN bus specification 2.0, 2.1, and SAE J2602-2. The LIN interface is only active during Normal Mode. See Table 6, Operating Modes Overview. MASTER IN SLAVE OUT PIN (MISO) The MISO pin sends data to an SPI-enabled MCU. It is a digital tri-state output used to shift serial data to the microcontroller. Data on this output pin changes on the positive edge of the SCLK. When CS is High, this pin will remain in the high-impedance state. CHIP SELECT PIN (CS) CS is an active low digital input. It must remain low during a valid SPI communication and allow for several devices to be connected in the same SPI bus without contention. A rising edge on CS signals the end of the transmission and the moment the data shifted in is latched. A valid transmission must consist of 8 bits only. While in STOP Mode, a low-to-high level transition on this pin will generate a wake-up condition for the 33912. ANALOG MULTIPLEXER PIN (ADOUT0) The ADOUT0 pin can be configured via the SPI to allow the MCU A/D converter to read the several inputs of the Analog Multiplexer, including the VSENSE, L1, L2, L3, L4 input voltages, and the internal junction temperature. CURRENT SENSE AMPLIFIER PIN (ADOUT1) The ADOUT1 pin is an analog interface to the MCU A/D converter. It allows the MCU to read the output of the current sense amplifier. SERIAL DATA CLOCK PIN (SCLK) The SCLK pin is the SPI clock input. MISO data changes on the positive transition of the SCLK. MOSI is sampled on the negative edge of the SCLK. MASTER OUT SLAVE IN PIN (MOSI) The MOSI digital pin receives SPI data from the MCU. This data input is sampled on the negative edge of SCLK. PWM INPUT CONTROL PIN (PWMIN) This digital input can control the high sides and low sides drivers in Normal Request and Normal Mode. To enable PWM control, the MCU must perform a write operation to the High Side Control Register (HSCR) or the Low Side Control Register (LSCR). This pin has an internal 20 A current pull-up. 33912 24 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION RESET PIN (RST) This bidirectional pin is used to reset the MCU in case the 33912 detects a reset condition, or to inform the 33912 that the MCU has just been reset. After release of the RST pin, Normal Request Mode is entered. The RST pin is an active low filtered input and output formed by a weak pull-up and a switchable pull-down structure which allows this pin to be shorted either to VDD or to GND during software development, without the risk of destroying the driver. INTERRUPT PIN (IRQ) The IRQ pin is a digital output used to signal events or faults to the MCU while in Normal and Normal Request mode or to signal a wake-up from Stop mode. This active low output will transition to high only after the interrupt is acknowledged by a SPI read of the respective status bits. WATCHDOG CONFIGURATION PIN (WDCONF) The WDCONF pin is the configuration pin for the internal watchdog. A resistor can be connected to this pin to configure the window watchdog period. When connected directly to ground, the watchdog will be disabled. When this pin is left open, the watchdog period is fixed to its lower precision internal default value (150 ms typical). GROUND CONNECTION PINS (AGND, PGND, LGND) The AGND, PGND and LGND pins are the Analog and Power ground pins. The AGND pin is the ground reference of the voltage regulator and the current sense module. The PGND and LGND pins are used for high current load return as in the relay-drivers and LIN interface pin. Note: PGND, AGND and LGND pins must be connected together. CURRENT SENSE AMPLIFIER INPUT PINS (ISENSEH AND ISENSEL) The ISENSEH and ISENSEL pins are the input pins of a ground compatible differential amplifier designed to be used to sense the voltage drop over a shunt resistor. The main purpose of this amplifier is to implement accurate current sensors. The gain of the differential amplifier can be set by SPI. LOW SIDE PINS (LS1 AND LS2) LS1 and LS2 are the low side driver outputs. Those outputs are short-circuit protected and include active clamp circuitry to drive inductive loads. Due to the energy clamp voltage on this pin, it can raise above the battery level when switched off. The switches are controlled through the SPI and can be configured to respond to a signal applied to the PWMIN input pin. Both low side switches are protected against overheating. In case of VS1 disconnection and the low sides are still supplied by VBAT through a load, both low sides will have a VDS voltage equal to the clamping value, as stated in the specification. DIGITAL/ANALOG PINS (L1, L2, L3 AND L4) The Lx pins are multi purpose inputs. They can be used as digital inputs, which can be sampled by reading the SPI and used for wake-up when 33912 is in low power mode or used as analog inputs for the analog multiplexer. When used to sense voltage outside the module, a 33 kohm series resistor must be used on each input. When used as wake-up inputs L1-L4 can be configured to operate in cyclic-sense mode. In this mode one or both of the high side switches are configured to be periodically turned on and sample the wake-up inputs. If a state change is detected between two cycles a wake-up is initiated. The 33912 can also wake-up from Stop or Sleep by a simple state change on L1-L4. When used as analog inputs, the voltage present on the Lx pins is scaled down by an selectable internal voltage divider and can be routed to the ADOUT0 output through the analog multiplexer. Note: If an Lx input is selected in the analog multiplexer, it will be disabled as a digital input and remains disabled in low power mode. No wake-up feature is available in that condition. When an Lx input is not selected in the analog multiplexer, the voltage divider is disconnected from that input. HIGH SIDE OUTPUT PINS (HS1 AND HS2) These two high side switches are able to drive loads such as relays or lamps. Their structures are connected to the VS2 supply pin. The pins are short-circuit protected and both outputs are also protected against overheating. HS1 and HS2 are controlled by SPI and can respond to a signal applied to the PWMIN input pin. HS1 and HS2 outputs can also be used during low-power mode for the cyclic-sense of the wake inputs. POWER SUPPLY PINS (VS1 AND VS2) Those are the battery level voltage supply pins. In an application, VS1 and VS2 pins must be protected against reverse battery connection and negative transient voltages with external components. These pins sustain standard automotive voltage conditions such as a load dump at 40 V. The high side switches (HS1 and HS2) are supplied by the VS2 pin. All other internal blocks are supplied by the VS1 pin. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 25 MC33912G5AC / MC34912G5AC FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION VOLTAGE SENSE PIN (VSENSE) This input can be connected directly to the battery line. It is protected against battery reverse connection. The voltage present in this input is scaled down by an internal voltage divider, and can be routed to the ADOUT0 output pin and used by the MCU to read the battery voltage. The ESD structure on this pin allows for excursion up to +40 V and down to -27 V, allowing this pin to be connected directly to the battery line. It is strongly recommended to connect a 10 kohm resistor in series with this pin for protection purposes. HALL SENSOR SWITCHABLE SUPPLY PIN (HVDD) The HVDD pin needs to be connected to an external capacitor to stabilize the regulated output voltage. +5V MAIN REGULATOR OUTPUT PIN (VDD) An external capacitor has to be placed on the VDD pin to stabilize the regulated output voltage. The VDD pin is intended to supply a microcontroller. The pin is current limited against shorts to GND and over-temperature protected. During Stop mode, the voltage regulator does not operate with its full drive capabilities and the output current is limited. During Sleep mode, the regulator output is completely shut down. This pin provides a switchable supply for external hall sensors. While in Normal Mode, this current limited output can be controlled through the SPI. 33912 26 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES INTRODUCTION The 33912 offers three main operating modes: Normal (Run), Stop, and Sleep (Low Power). In Normal mode, the device is active and is operating under normal application conditions. The Stop and Sleep modes are low power modes with wake-up capabilities. In Stop mode, the voltage regulator still supplies the MCU with VDD (limited current capability), while in Sleep mode the voltage regulator is turned off (VDD = 0 V). Wake-up from Stop mode is initiated by a wake-up interrupt. Wake-up from Sleep mode is done by a reset and the voltage regulator is turned back on. The selection of the different modes is controlled by the MOD1:2 bits in the Mode Control Register (MCR). Figure 14 describes how transitions are done between the different operating modes. Table 6, 29, gives an overview of the operating modes. RESET MODE The 33912 enters the Reset mode after a power up. In this mode, the RST pin is low for 1.0 ms (typical value). After this delay, it enters the Normal Request mode and the RST pin is driven high. The Reset mode is entered if a reset condition occurs (VDD low, watchdog trigger fail, after wake-up from Sleep mode, Normal Request mode timeout occurs). NORMAL REQUEST MODE This is a temporary mode automatically accessed by the device after the Reset mode, or after a wake-up from Stop mode. In Normal Request mode, the VDD regulator is ON, the RESET pin is High, and the LIN is operating in RX Only mode. As soon as the device enters in the Normal Request mode an internal timer is started for 150 ms (typical value). During these 150 ms, the MCU must configure the Timing Control Register (TIMCR) and the Mode Control Register (MCR) with MOD2 and MOD1 bits set = 0, to enter the Normal mode. If within the 150 ms timeout, the MCU does not command the 33912 to Normal mode, it will enter in Reset mode. If the WDCONF pin is grounded in order to disable the watchdog function, it goes directly in Normal mode after the Reset mode. NORMAL MODE In Normal mode, all 33912 functions are active and can be controlled by the SPI interface and the PWMIN pin. The VDD regulator is ON and delivers its full current capability. If an external resistor is connected between the WDCONF pin and the Ground, the window watchdog function will be enabled. The wake-up inputs (L1-L4) can be read as digital inputs or have its voltage routed through the analog-multiplexer. The LIN interface has slew rate and timing compatible with the LIN protocol specification 2.0, 2.1 and SAEJ2602. The LIN bus can transmit and receive information. The high side and low side switches are active and have PWM capability according to the SPI configuration. The interrupts are generated to report failures for VSUP over/under-voltage, thermal shutdown, or thermal shutdown prewarning on the main regulator. SLEEP MODE The Sleep mode is a low power mode. From Normal mode, the device enters into Sleep mode by sending one SPI command through the Mode Control Register (MCR), or (VDD low > 150 ms) with VSUV = 0. When in Reset mode, a VDD under-voltage condition with no VSUP undervoltage (VSUV = 0) will send the device to Sleep mode. All blocks are in their lowest power consumption condition. Only some wake-up sources (wake-up inputs with or without cyclic sense, forced wake-up and LIN receiver) are active. The 5.0 V regulator is OFF. The internal low-power oscillator may be active if the IC is configured for cyclic-sense. In this condition, one of the high side switches is turned on periodically and the wake-up inputs are sampled. Wake-up from Sleep mode is similar to a power-up. The device goes in Reset mode except that the SPI will report the wake-up source and the BATFAIL flag is not set. STOP MODE The Stop mode is the second low power mode, but in this case the 5.0 V regulator is ON with limited current drive capability. The application MCU is always supplied while the 33912 is operating in Stop mode. The device can enter into Stop mode only by sending the SPI command. When the application is in this mode, it can wake-up from the 33912 side (for example: cyclic sense, force wake-up, LIN bus, wake inputs) or the MCU side (CS, RST pins). Wake-up from Stop mode will transition the 33912 to Normal Request mode and generates an interrupt except if the wake-up event is a low to high transition on the CS pin or comes from the RST pin. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 27 MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES Normal Request Timeout Expired (t NRTOUT ) Normal Request timeout expired (NR TOUT) VVDD Low DD Low VDD High and Normal Request VVDDLow Low DD VVDD LOW (>t NRTOUT ) expired) Expired DD Low (>NRTOUT andand VSUV =0 VSUV =0 Wake-up Wake-Up (Reset) (Reset) Sleep Command SLEEP Command Sleep Stop STOPCommand Command Normal WD Failed WD failed Wake-up (Interrupt) Wake-Up Interrupt Reset Reset Delay (t Delay VDD High and Reset RST) expired RST) (tExpired WD Disabled WD disabled Power Up WDtrigger Trigger WD Power Down Stop VDD VDD Low Low Legend WD: Watchdog Notes: WD Disabled: Watchdog disabled (WDCONF pin connected to GND) WD - meansisWatchdog WD Trigger: Watchdog triggered by SPI command WD means or Watchdog disabled (WDCONF terminal connected to GND) WD Failed: No disabled watchdog- trigger trigger occurs in closed window WD trigger - means Watchdog is triggered by SPI command Stop Command: Stop command sent via SPI WD failed - means no Watchdog trigger or trigger occurs in closed window Sleep Command: Sleep command sent via SPI STOP Command - means STOP command sent via SPI Wake-up from Stop Mode: L1, L2, L3 or L4 state change, LIN bus wake-up, Periodic wake-up, CS rising edge wake-up or RST wake-up. SLEEP Command means command via wake-up, SPI Wake-up from Sleep Mode: L1,- L2, L3 orSLEEP L4 state change, send LIN bus Periodic wake-up. Wake-Up - means L1 or L2 state change or LIN bus wake up or SS rising edge Figure 14. Operating Modes and Transitions 33912 28 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES Table 6. Operating Modes Overview Function VDD Reset Mode Normal Request Mode Normal Mode Stop Mode Sleep Mode Full Full Full Stop - - SPI(63) SPI - - - SPI/PWM(64) SPI/PWM - HSx - (64) Analog Mux - SPI SPI - - Lx - Inputs Inputs Wake-up Wake-up Current Sense On On On - - LIN - Rx-Only HVDD LSx SPI/PWM SPI/PWM Full/Rx-Only Rx-Only/Wake-up Watchdog - 150 ms (typ.) timeout On(67)/Off Voltage Monitoring VSUP/VDD VSUP/VDD VSUP/VDD Notes 63. 64. 65. 66. 67. Note (65) Note(66) Wake-up - - VDD - Operation can be enabled/controlled by the SPI. Operation can be controlled by the PWMIN input. HSx switches can be configured for cyclic sense operation in Stop mode. HSx switches can be configured for cyclic sense operation in Sleep mode. Windowing operation when enabled by an external resistor. INTERRUPTS Low-voltage Interrupt: Interrupts are used to signal a microcontroller that a peripheral needs to be serviced. The interrupts which can be generated, change according to the operating mode. While in Normal and Normal Request modes, the 33912 signals through interrupts special conditions which may require a MCU software action. Interrupts are not generated until all pending wake-up sources are read in the Interrupt Source Register (ISR). While in Stop mode, interrupts are used to signal wake-up events. Sleep mode does not use interrupts. Wake-up is performed by powering-up the MCU. In Normal and Normal Request mode the wake-up source can be read by SPI. The interrupts are signaled to the MCU by a low logic level of the IRQ pin, which will remain low until the interrupt is acknowledged by a SPI read command of the ISR register. The IRQ pin will then be driven high. Interrupts are only asserted while in Normal, Normal Request and Stop mode. Interrupts are not generated while the RST pin is low. The following is a list of the interrupt sources in Normal and Normal Request modes. Some of these can be masked by writing to the SPI - Interrupt Mask Register (IMR). Signals when the supply line (VS1) voltage drops below the VSUV threshold (VSUV). High-voltage Interrupt: Signals when the supply line (VS1) voltage increases above the VSOV threshold (VSOV). Over-temperature Prewarning: Signals when the 33912 temperature has reached the preshutdown warning threshold. It is used to warn the MCU that an over-temperature shutdown in the main 5.0 V regulator is imminent. LIN Over-temperature Shutdown / TXD Stuck At Dominant / RXD Short-circuit: These signal fault conditions within the LIN interface will cause the LIN driver to be disabled. In order to restart the operation, the fault must be removed and TXD must go recessive. High Side Over-temperature Shutdown: Signals a shutdown in the high side outputs. Low Side Over-temperature Shutdown: Signals a shutdown in the low side outputs. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 29 MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES RESET To reset a MCU the 33912 drives the RST pin low for the time the reset condition lasts. After the reset source is removed, the state machine will drive the RST output low for at least 1.0ms (typical value) before driving it high. In the 33912, four main reset sources exist: 5.0 V Regulator Low-voltage-Reset (VRSTTH) The 5.0 V regulator output VDD is continuously monitored against brown outs. If the supply monitor detects that the voltage at the VDD pin has dropped below the reset threshold VRSTTH the 33912 will issue a reset. In case of overtemperature, the voltage regulator will be disabled and the voltage monitoring will issue a VDDOT Flag independently of the VDD voltage. In order to select and activate direct wake-up from Lx inputs, the Wake-up Control Register (WUCR) must be configured with appropriate LxWE inputs enabled or disabled. The wake-up input's state is read through the Wake-up Status Register (WUSR). Lx inputs are also used to perform cyclic-sense wake-up. Note: Selecting an Lx input in the analog multiplexer before entering low power mode will disable the wake-up capability of the Lx input Wake-up from Wake-up inputs (L1-L4) with cyclic sense timer enabled During Sleep mode, the 5V regulator is not active, hence all wake-up requests from Sleep mode require a power-up/ reset sequence. The SBCLIN can wake-up at the end of a cyclic sense period if on one of the four wake-up input lines (L1-L4) a state change occurs. One or both HSx switch can be activated in Sleep or Stop modes from an internal timer. Cyclic sense and force wake-up are exclusive. If cyclic sense is enabled, the force wake-up can not be enabled. In order to select and activate the cyclic sense wake-up from Lx inputs, before entering in low power modes (Stop or Sleep modes), the following SPI set-up has to be performed: In WUCR: select the Lx input to WU-enable. In HSCR: enable the desired HSx. * In TIMCR: select the CS/WD bit and determine the cyclic sense period with CYSTx bits. * Perform Goto Sleep/Stop command. External Reset Forced Wake-up The 33912 has a bidirectional reset pin which drives the device to a safe state (same as Reset mode) for as long as this pin is held low. The RST pin must be held low long enough to pass the internal glitch filter and get recognized by the internal reset circuit. This functionality is also active in Stop mode. After the RST pin is released, there is no extra t RST to be considered. The 33912 can wake-up automatically after a predetermined time spent in Sleep or Stop mode. Cyclic sense and Forced wake-up are exclusive. If Forced wake-up is enabled, the Cyclic Sense can not be enabled. To determine the wake-up period, the following SPI set-up has to be sent before entering in low power modes: * In TIMCR: select the CS/WD bit and determine the low power mode period with CYSTx bits. * In HSCR: all HSx bits must be disabled. Window Watchdog Overflow If the watchdog counter is not properly serviced while its window is open, the 33912 will detect an MCU software runaway and will reset the microcontroller. Wake-up From Sleep Mode WAKE-UP CAPABILITIES Once entered into one of the low-power modes (Sleep or Stop) only wake-up sources can bring the device into Normal mode operation. In Stop mode, a wake-up is signaled to the MCU as an interrupt, while in Sleep mode the wake-up is performed by activating the 5.0 V regulator and resetting the MCU. In both cases the MCU can detect the wake-up source by accessing the SPI registers and reading the Interrupt Source Register. There is no specific SPI register bit to signal a CS wake-up or external reset. If necessary this condition is detected by excluding all other possible wake-up sources. Wake-up from Wake-up inputs (L1-L4) with cyclic sense disabled CS Wake-up While in Stop mode, a rising edge on the CS will cause a wake-up. The CS wake-up does not generate an interrupt, and is not reported on SPI. LIN Wake-up While in the low-power mode, the 33912 monitors the activity on the LIN bus. A dominant pulse larger than t PROPWL followed by a dominant to recessive transition will cause a LIN wake-up. This behavior protects the system from a short to ground bus condition. The bit RXONLY = 1 from LINCR Register disables the LIN wake-up from Stop mode. The wake-up lines are dedicated to sense state changes of external switches and wake-up the MCU (in Sleep or Stop mode). 33912 30 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES RST Wake-up While in Stop mode, the 33912 can wake-up when the RST pin is held low long enough to pass the internal glitch filter. Then, the 33912 will change to Normal Request or Normal modes depending on the WDCONF pin configuration. The RST wake-up does not generate an interrupt and is not reported via SPI. From Stop mode, the following wake-up events can be configured: * Wake-up from Lx inputs without cyclic sense * Cyclic sense wake-up inputs * Force wake-up * CS wake-up * LIN wake-up * RST wake-up From Sleep mode, the following wake-up events can be configured: * Wake-up from Lx inputs without cyclic sense * Cyclic sense wake-up inputs * Force wake-up * LIN wake-up WINDOW WATCHDOG The 33912 includes a configurable window watchdog which is active in Normal mode. The watchdog can be configured by an external resistor connected to the WDCONF pin. The resistor is used to achieve higher precision in the timebase used for the watchdog. SPI clears are performed by writing through the SPI in the MOD bits of the Mode Control Register (MCR). During the first half of the SPI timeout, watchdog clears are not allowed, but after the first half of the SPI timeout window, the clear operation opens. If a clear operation is performed outside the window, the 33912 will reset the MCU, in the same way as when the watchdog overflows. WINDOW CLOSED NO WATCHDOG CLEAR ALLOWED WD TIMING X 50% WINDOW OPEN FOR WATCHDOG CLEAR WD TIMING X 50% WD PERIOD (tPWD) WD TIMING SELECTED BY RESISTOR ON WDCONF PIN Figure 15. Window Watchdog Operation To disable the watchdog function in Normal mode the user must connect the WDCONF pin to ground. This measure effectively disables Normal Request mode. The WDOFF bit in the Watchdog Status Register (WDSR) will be set. This condition is only detected during Reset mode. If neither a resistor nor a connection to ground is detected, the watchdog falls back to the internal lower precision timebase of 150 ms (typ.) and signals the faulty condition through the Watchdog Status Register (WDSR). The watchdog timebase can be further divided by a prescaler which can be configured by the Timing Control Register (TIMCR). During Normal Request mode, the window watchdog is not active but there is a 150 ms (typ.) timeout for leaving the Normal Request mode. In case of a timeout, the 33912 will enter into Reset mode, resetting the microcontroller before entering again into Normal Request mode. FAULTS DETECTION MANAGEMENT The 33912 has the capability to detect faults like an over or under-voltage on VS1, TxD in permanent Dominant State, Over-temperature on HS, LIN. It is able to take corrective actions accordingly. Most of faults are monitoring through SPI and the Interrupt pin. The microcontroller can also take actions. The following table summarizes all fault sources the device is able to detect with associated conditions. The status for a device recovery and the SPI or pins monitoring are also described. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 31 MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES Table 7. Fault Detection Management Conditions MONITORING(69) BLOCK FAULT BATTERY FAIL VSUP OVERVOLTAGE Power Supply MODE All modes Normal, Normal Request VSUP UNDERVOLTAGE VDD UNDERVOLTAGE CONDITION FALLOUT VSUP<3.0 V (typ) then power-up VSUP > 19.25 V (typ) In Normal mode, HS and LS shutdown if bit HVSE=1 (reg MCR) VSUP < 6.0 V (typ) All except Sleep VDD < 4.5 V (typ) RECOVERY REG (FLAG, BIT) INTERRUPT Condition gone VSR (BATFAIL, 0) - Condition gone, to re-enable HS or LS write to HSCR or LSCR registers VSR (VSOV,3) - (70) VSR (VSUV,2) Reset (68) IRQ low + ISR (0101) IRQ low + ISR (0101) - - Condition gone VDD OVER-TEMP PREWARNING VDD OVERTEMPERATURE All except Low Power modes RXD PIN SHORT CIRCUIT LIN TXD PIN PERMANENT DOMINANT Normal, Normal Request VDD shutdown, Reset then Sleep RXD pin shorted to GND or 5 V LIN trans shutdown TXD pin low for more than 1s (typ) Temperature > 160C (typ) HIGH SIDE DRIVERS OVERTEMPERATURE Temperature > 160C (typ) HS2 OPEN-LOAD DETECTION - Temperature > 170C (typ) LIN DRIVER OVERTEMPERATURE HS1 OPEN-LOAD DETECTION High Side Temperature > 115C (typ) LIN transmitter shutdown VSR (VDDOT,1) IRQ low + ISR (0101) - - LINSR, (RXSHORT,3) LIN transmitter reenabled once the condition is gone and TXD is high LINSR (TXDOM,2) IRQ low + ISR (0100)(70) LINSR (LINOT,1) Both HS thermal shutdown Condition gone, to re-enable HS write to HSCR reg All flags in HSSR are set IRQ low + ISR (0010) (70) HSSR (HS1OP,1) Normal, Normal Request Current through HSx < 5.0 mA (typ) HSSR (HS2OP,3) Condition gone HS1 OVERCURRENT HS2 OVERCURRENT LOW SIDE DRIVERS OVERTEMPERATURE LS1 OPEN-LOAD Low Side LS2 OPEN-LOAD Normal, Normal Request Temperature > 160C (typ) Both LS thermal shutdown HSSR (HS2CL,2) Condition gone, to re-enable LS write to LSCR reg All flags in LSSR are set IRQ low + ISR (0011) (70) LSSR (LS2OP,3) - Normal Request The MCU did not command the device to Normal mode within the 150 ms timeout after reset Reset WATCHDOG TIMEOUT Normal WD timeout or WD clear within the window closed Reset WATCHDOG ERROR Normal WDCONF pin is floating WD internal lower precision timebase 150 ms (typ) NORMAL REQUEST TIME-OUT EXPIRED HSSR (HS1CL,0) LSSR (LS1OP,1) Current through LSx < 7.5mA (typ) LSx on with limited current capability 160 mA (min) LS2 OVER-CURRENT Notes 68. 69. 70. HSx on with limited current capability 60 mA (min) Current through LSx tends to rise above the current limit 160 mA (min) LS1 OVER-CURRENT Watchdog Current through HSx tends to rise above the current limit 60 mA (min) LSSR (LS1CL,0) - LSSR (LS2CL,2) WDSR (WDTO, 3) Connect WDCONF to a resistor or to GND WDSR (WDERR, 2) When in Reset mode a VDD under-voltage condition combined with no VSUP under-voltage (VSUV=0) will send the device to Sleep mode. Registers to be read when back in Normal Request or Normal mode depending on the fault. Interrupts only generated in Normal, Normal Request and Stop modes Unless masked, If masked IRQ remains high and the ISR flags are not set. 33912 32 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES TEMPERATURE SENSE GAIN The analog multiplexer can be configured via SPI to allow the ADOUT0 pin to deliver the internal junction temperature of the device. The graph below illustrates the internal chip temp sense obtained per characterization at 3 temperatures with 3 different lots and 30 samples. Temperature Sense Analog Output Voltage 5 4.5 Vadout0 (V) 4 3.5 3 2.5 2 -50 0 50 100 150 Temperature (C) Figure 16. Temperature Sense Gain HIGH SIDE OUTPUT PINS HS1 AND HS2 These outputs are two high side drivers intended to drive small resistive loads or LEDs incorporating the following features: * PWM capability (software maskable) * Open load detection * Current limitation * Over-temperature shutdown (with maskable interrupt) * High-voltage shutdown (software maskable) * Cyclic sense The high side switches are controlled by the bits HS1:2 in the High Side Control Register (HSCR). PWM Capability (direct access) Each high side driver offers additional (to the SPI control) direct control via the PWMIN pin. If both the bits HS1 and PWMHS1 are set in the High Side Control Register (HSCR), then the HS1 driver is turned on if the PWMIN pin is high and turned of if the PWMIN pin is low. This applies to HS2 configuring HS2 and PWMHS2 bits. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 33 MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES Interrupt Control Module MOD1:2 HSx HSxOP VDD VDD PWMIN High-Side Interrupt High Voltage Shutdown HVSE PWMHSx VS2 on/off Control Status HSxCL High Side Driver charge pump open load detection current limitation over-temperture shutdown (interrupt maskable) high voltage shutdown (maskable) Cyclic Sense HSx Wakeup Module Figure 17. High Side Drivers HS1 and HS2 Open Load Detection Each high side driver signals an open load condition if the current through the high side is below the open load current threshold. The open load condition is indicated with the bits HS1OP and HS2OP in the High Side Status Register (HSSR). Current Limitation Each high side driver has an output current limitation. In combination with the over-temperature shutdown the highside drivers are protected against over-current and shortcircuit failures. When the driver operates in the current limitation area, it is indicated with the bits HS1CL and HS2CL in the HSSR. Note: If the driver is operating in current limitation mode, excessive power might be dissipated. A write to the High Side Control Register (HSCR), when the over-temperature condition is gone, will re-enable the high side drivers. High-voltage Shutdown In case of a high voltage condition and if the high voltage shutdown is enabled (bit HVSE in the Mode Control Register (MCR) is set both high side drivers are shut down. A write to the High Side Control Register (HSCR), when the high voltage condition is gone, will re-enable the high side drivers. Sleep And Stop Mode The high side drivers can be enabled to operate in Sleep and Stop mode for cyclic sensing. Also see Table 6, Operating Modes Overview. Over-temperature Protection (HS Interrupt) LOW SIDE OUTPUT PINS LS1 AND LS2 Both high side drivers are protected against overtemperature. In case of an over-temperature condition both high side drivers are shut down and the event is latched in the Interrupt Control Module. The shutdown is indicated as HS Interrupt in the Interrupt Source Register (ISR). A thermal shutdown of the high side drivers is indicated by setting all HSxOP and HSxCL bits simultaneously. These outputs are two low side drivers intended to drive relays incorporating the following features: If the bit HSM is set in the Interrupt Mask Register (IMR), then an interrupt (IRQ) is generated. * PWM capability (software maskable) * Open load detection * Current limitation * Over-temperature shutdown (with maskable interrupt) * Active clamp (for driving relays) * High-voltage shutdown (software maskable) The low side switches are controlled by the bit LS1:2 in the Low Side Control Register (LSCR). 33912 34 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES To protect the device against over-voltage when an inductive load (relay) is turned off. An active clamp will reenable the low side FET if the voltage on the LS1 or LS2 pin exceeds a certain level. If both the bits LS1 and PWMLS1 are set in the Low Side Control Register (LSCR), then the LS1 driver is turned on if the PWMIN pin is high and turned off if the PWMIN pin is low. The same applies to the LS2 and PWMLS2 bits for the LS2 driver. PWM Capability (direct access) Each low side driver offers additional (to the SPI control) direct control via the PWMIN pin. HVSE VDD Interrupt Control Module VDD MOD1:2 LSx LSxOP PWMLSx Low Side Interrupt High-voltage Shutdown PWMIN active clamp LSx on/off Control LSxCL Status Low Side Driver (active clamp) Open-load Detection Current Limitation Over-temperture Shutdown (interrupt maskable) High-voltage shutdown (maskable) PGND Figure 18. Low Side Drivers LS1 and LS2 Open Load Detection High-voltage Shutdown Each low side driver signals an open load condition if the current through the low side is below the open load current threshold. The open load condition is indicated with the bit LS1OP and LS2OP in the Low Side Status Register (LSSR). In case of a high-voltage condition and if the high-voltage shutdown is enabed (bit HVSE in the Mode Control Register (MCR) is set) both low sides drivers are shut down. A write to the Low Side Control Register (LSCR), when the high-voltage condition is gone, will re-enable the low side drivers. Current Limitation Each low side driver has a current limitation. In combination with the over-temperature shutdown the low side drivers are protected against over-current and shortcircuit failures. When the drivers operate in current limitation, this is indicated with the bits LS1CL and LS2CL in the LSSR. Note: If the drivers are operating in current limitation mode excessive power might be dissipated. Over-temperature Protection (LS Interrupt) Both low side drivers are protected against overtemperature. In case of an over-temperature condition both low side drivers are shut down and the event is latched in the Interrupt Control Module. The shutdown is indicated as an LS Interrupt in the Interrupt Source Register (ISR). If the bit LSM is set in the Interrupt Mask Register (IMR) then an Interrupt (IRQ) is generated. A write to the Low Side Control Register (LSCR), when the over-temperature condition is gone, will re-enable the low side drivers. Sleep And Stop Mode The low side drivers are disabled in Sleep and Stop mode. Also see Table 6, Operating Modes Overview. LIN PHYSICAL LAYER The LIN bus pin provides a physical layer for single-wire communication in automotive applications. The LIN physical layer is designed to meet the LIN physical layer specification and has the following features: * LIN physical layer 2.0, 2.1 and SAEJ2602 compliant * Slew rate selection * Over-temperature shutdown * Advanced diagnostics The LIN driver is a low side MOSFET with thermal shutdown. An internal pull-up resistor with a serial diode structure is integrated, so no external pull-up components are required for the application in a slave node. The fall time from dominant to recessive and the rise time from recessive to dominant is controlled. The symmetry between both slopes is guaranteed. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 35 MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES LIN Pin The LIN pin offers a high susceptibility immunity level from external disturbance, guaranteeing communication during external disturbance. WAKE-UP MODULE LIN Wake-up MOD1:2 LSR0:1 J2602 VS1 LIN DRIVER RXONLY Slope and Slew Rate Control RXSHORT Over-temperature Shutdown (interrupt maskable) TXDOM LINOT 30 K LIN TXD SLOPE CONTROL WAKE-UP FILTER LGND RXD RECEIVER Figure 19. LIN Interface Slew Rate Selection The slew rate can be selected for optimized operation at 10.4 and 20 kBit/s as well as a fast baud rate for test and programming. The slew rate can be adapted with the bits LSR1:0 in the LIN Control Register (LINCR). The initial slew rate is optimized for 20 kBit/s. J2602 Conformance To be compliant with the SAE J2602-2 specification, the J2602 feature has to be enabled in the LINCR Register (bit DIS_J2602 sets to 0). The LIN transmitter is disabled in case of a VSUP under-voltage condition occurs and TXD is in Recessive State: the LIN bus goes in Recessive State and RXD goes high. The LIN transmitter is not disabled if TXD is in Dominant State. A deglitcher on Vsup (tJ2602_DEG) is implemented to avoid false switching. If the (DIS_J2602) bit is set to 1, the J2602 feature is disabled and the communication TXD-LIN-RXD works for VSUP down to 4.6 V (typical value) and then the communication is interrupted. The (DIS_J2602) bit is set per default to 0. Over-temperature Shutdown (LIN Interrupt) The output low side FET is protected against overtemperature conditions. In case of an over-temperature condition, the transmitter will be shut down and the LINOT bit in the LIN Status Register (LINSR) is set. If the LINM bit is set in the Interrupt Mask Register (IMR), an Interrupt IRQ will be generated. The transmitter is automatically re-enabled once the condition is gone and TXD is high. RXD Short-circuit Detection (LIN Interrupt) The LIN transceiver has a short-circuit detection for the RXD output pin. If the device transmits and in case of a short- 33912 36 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES circuit condition, either 5.0 V or Ground, the RXSHORT bit in the LIN Status Register (LINSR) is set and the transmitter is shut down. If the LINM bit is set in the Interrupt Mask Register (IMR), an Interrupt IRQ will be generated. The transmitter is automatically re-enabled once the condition is gone (transition on RXD) and TXD is high. A read of the LIN Status Register (LINSR) without the RXD pin short-circuit condition will clear the bit RXSHORT. TXD Dominant Detection (LIN Interrupt) The LIN transceiver monitors the TXD input pin to detect a stuck in dominant (0 V) condition. In case of a stuck condition (TXD pin 0 V for more than 1 second (typ.)), the transmitter is shut down and the TXDOM bit in the LIN Status Register (LINSR) is set. If the LINM bit is set in the IMR, an Interrupt IRQ will be generated. The transmitter is automatically re-enabled once TXD is high. A read of the LIN Status Register (LINSR) with the TXD pin at 5.0 V will clear the bit TXDOM. LIN Receiver Operation Only While in Normal mode, the activation of the RXONLY bit disables the LIN TXD driver. In case of a LIN error condition, this bit is automatically set. If Stop mode is selected with this bit set, the LIN wake-up functionality is disabled and the RXD pin will reflect the state of the LIN bus. STOP Mode And Wake-up Feature During Stop mode operation, the transmitter of the physical layer is disabled. The receiver is still active and able to detect wake-up events on the LIN bus line. A dominant level longer than TPROPWL followed by a rising edge will generate a wake-up interrupt, and will be reported in the Interrupt Source Register (ISR). Also see Figure 11, page 22. SLEEP Mode And Wake-up Feature During Sleep mode operation, the transmitter of the physical layer is disabled. The receiver must be active to detect wake-up events on the LIN bus line. A dominant level longer than TPROPWL followed by a rising edge will generate a system wake-up (Reset), and will be reported in the Interrupt Source Register (ISR). Also see Figure 10, page 22. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 37 MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS LOGIC COMMANDS AND REGISTERS 33912 SPI INTERFACE AND CONFIGURATION * MISO -- Master-in Slave-out * SCLK-- Serial Clock A complete data transfer via the SPI consists of 1 byte. The master sends 4 bits of address (A3:A0) + 4 bits of control information (C3:C0) and the slave replies with 4 system status bits (VMS,LINS,HSS,LSS) + 4 bits of status information (S3:S0). The serial peripheral interface creates the communication link between a microcontroller (master) and the 33912. The interface consists of four pins (see Figure 20): * CS -- Chip Select * MOSI -- Master-out Slave-in CS Register Write Data MOSI A3 A2 A1 A0 C3 C2 C1 C0 S1 S0 Register Read Data MISO VMS LINS HSS LSS S3 S2 SCLK Read Data Latch Rising: 33912 changes MISO/ MCU changes MOSI Write Data Latch Falling: 33912 samples MOSI/ MCU samples MISO Figure 20. SPI Protocol During the inactive phase of the CS (HIGH), the new data The rising edge of the Chip Select CS indicates the end of transfer is prepared. the transfer and latches the write data (MOSI) into the register. The CS high forces MISO to the high-impedance The falling edge of the CS indicates the start of a new data state. transfer and puts the MISO in the low-impedance state and Register reset values are described along with the reset latches the analog status data (Register read data). condition. Reset condition is the condition causing the bit to With the rising edge of the SPI clock (SCLK), the data is be set to its reset value. The main reset conditions are: moved to MISO/MOSI pins. With the falling edge of the SPI - Power-On Reset (POR): the level at which the logic is clock (SCLK), the data is sampled by the receiver. reset and BATFAIL flag sets. The data transfer is only valid if exactly 8 sample clock - Reset mode edges are present during the active (low) phase of CS. - Reset done by the RST pin (ext_reset) 33912 38 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS SPI REGISTER OVERVIEW Table 8. System Status Register Adress(A3:A0) $0 - $F BIT Register Name / Read / Write Information SYSSR - System Status Register R 7 6 5 4 VMS LINS HSS LSS Table 9 summarizes the SPI Register content for Control Information (C3:C0)=W and status information (S3:S0) = R. Table 9. SPI Register Overview Adress(A3:A0) BIT Register Name / Read / Write Information 3 2 1 0 MCR - Mode Control Register W HVSE 0 MOD2 MOD1 VSR - Voltage Status Register R VSOV VSUV VDDOT BATFAIL VSR - Voltage Status Register R VSOV VSUV VDDOT BATFAIL WUCR - Wake-up Control Register W L4WE L3WE L2WE L1WE WUSR - Wake-up Status Register R L4 L3 L2 L1 WUSR - Wake-up Status Register R L4 L3 L2 L1 LINCR - LIN Control Register W DIS_J2602 RXONLY LSR1 LSR0 LINSR - LIN Status Register R RXSHORT TXDOM LINOT 0 LINSR - LIN Status Register R RXSHORT TXDOM LINOT 0 HSCR - High Side Control Register W PWMHS2 PWMHS1 HS2 HS1 HSSR - High Side Status Register R HS2OP HS2CL HS1OP HS1CL HSSR - High Side Status Register R HS2OP HS2CL HS1OP HS1CL LSCR - Low Side Control Register W PWMLS2 PWMLS1 LS2 LS1 LSSR - Low Side Status Register R LS2OP LS2CL LS1OP LS1CL LSSR - Low Side Status Register R LS2OP LS2CL LS1OP LS1CL TIMCR - Timing Control Register W CS/WD WD2 WD1 WD0 CYST2 CYST1 CYST0 WDSR - Watchdog Status Register R WDTO WDERR WDOFF WDWO $B WDSR - Watchdog Status Register R WDTO WDERR WDOFF WDWO $C AMUXCR - Analog Multiplexer Control Register W LXDS MX2 MX1 MX0 $D CFR - Configuration Register W HVDD CYSX8 CSAZ CSGS IMR - Interrupt Mask Register W HSM LSM LINM VMM ISR - Interrupt Source Register R ISR3 ISR2 ISR1 ISR0 ISR - Interrupt Source Register R ISR3 ISR2 ISR1 ISR0 $0 $1 $2 $3 $4 $5 $6 $7 $8 $9 $A $E $F 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 39 MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS REGISTER DEFINITIONS 1 = High Side Status bit set 0 = None System Status Register - SYSSR The System Status Register (SYSSR) is always transferred with every SPI transmission and gives a quick system status overview. It summarizes the status of the Voltage Monitor Status (VMS), LIN Status (LINS), High Side Status (HSS), and the Low Side Status (LSS). HS1CL HS1OP HSS HS2CL HS2OP Table 10. System Status Register Figure 23. High Side Status S7 S6 S5 S4 VMS LINS HSS LSS LSS - Low Side Switch Status Read VMS - Voltage Monitor Status This read-only bit indicates that one or more bits in the VSR are set. This read-only bit indicates that one or more bits in the LSSR are set. 1 = Low Side Status bit set 0 = None 1 = Voltage Monitor bit set 0 = None LS1CL LS1OP BATFAIL VDDOT VSUV LSS LS2CL LS2OP VMS Figure 24. Low Side Status VSOV Mode Control Register - MCR Figure 21. Voltage Monitor Status LINS - LIN Status This read-only bit indicates that one or more bits in the LINSR are set. 1 = LIN Status bit set 0 = None LINOT TXDOM LINS The Mode Control Register (MCR) allows switching between the operation modes and to configure the 33912. Writing the MCR will return the VSR. Table 11. Mode Control Register - $0 C3 C2 C1 C0 Write HVSE 0 MOD2 MOD1 Reset Value 1 0 - - Reset Condition POR POR - - RXSHORT Figure 22. LIN Status HSS - High Side Switch Status This read-only bit indicates that one or more bits in the HSSR are set. HVSE - High-voltage Shutdown Enable This write-only bit enables/disables automatic shutdown of the high side and the low side drivers during a high-voltage VSOV condition. 1 = automatic shutdown enabled 0 = automatic shutdown disabled 33912 40 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS MOD2, MOD1 - Mode Control Bits These write-only bits select the operating mode and allow clearing the watchdog in accordance with Table 8 Mode Control Bits. 1 = POR Reset has occurred 0 = POR Reset has not occurred Wake-up Control Register - WUCR MOD2 MOD1 Description This register is used to control the digital wake-up inputs. Writing the WUCR will return the Wake-Up Status Register (WUSR). 0 0 Normal Mode Table 14. Wake-Up Control Register - $2 0 1 Stop Mode 1 0 Sleep Mode 1 1 Normal Mode + Watchdog Clear Table 12. Mode Control Bits Voltage Status Register - VSR Returns the status of the several voltage monitors. This register is also returned when writing to the Mode Control Register (MCR). C2 C1 C0 Write L4WE L3WE L2WE L1WE Reset Value 1 1 1 1 Reset Condition POR, Reset mode or ext_reset LxWE - Wake-up Input x Enable Table 13. Voltage Status Register - $0/$1 Read C3 S3 S2 S1 S0 VSOV VSUV VDDOT BATFAIL VSOV - VSUP Over-voltage This read-only bit indicates an over-voltage condition on the VS1 pin. 1 = Over-voltage condition. 0 = Normal condition. VSUV - VSUP Under-voltage This read-only bit indicates an under-voltage condition on the VS1 pin. 1 = Under-voltage condition. 0 = Normal condition. VDDOT - Main Voltage Regulator Over-temperature Warning This read-only bit indicates that the main voltage regulator temperature reached the Over-temperature Prewarning Threshold. 1 = Over-temperature Prewarning 0 = Normal BATFAIL - Battery Fail Flag. This read-only bit is set during power-up and indicates that the 33912 had a Power-On-Reset (POR). Any access to the MCR or VSR will clear the BATFAIL flag. This write-only bit enables/disables which Lx inputs are enabled. In Stop and Sleep mode the LxWE bit determines which wake inputs are active for wake-up. If one of the Lx inputs is selected on the analog multiplexer, the corresponding LxWE is masked to 0. 1 = Wake-up Input x enabled. 0 = Wake-up Input x disabled. Wake-up Status Register - WUSR This register is used to monitor the digital wake-up inputs and is also returned when writing to the WUCR. Table 15. Wake-up Status Register - $2/$3 Read S3 S2 S1 S0 L4 L3 L2 L1 Lx - Wake-up input x This read-only bit indicates the status of the corresponding Lx input. If the Lx input is not enabled, then the according Wake-up status will return 0. After a wake-up from Stop or Sleep mode these bits also allow to determine which input has caused the wake-up, by first reading the Interrupt Status Register (ISR) and then reading the WUSR. The source of the wake-up is only reported on the first WUCR or WUSR access. 1 = Lx pin high, or Lx is the source of the wake-up. 0 = Lx pin low, disabled or selected as an analog input. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 41 MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS LIN Control Register - LINCR LIN Status Register - LINSR This register controls the LIN physical interface block. Writing the LIN Control Register (LINCR) returns the LIN Status Register (LINSR). Table 16. LIN Control Register - $4 This register returns the status of the LIN physical interface block and is also returned when writing to the LINCR. C3 C2 C1 C0 Write DIS_J2602 RXONLY LSR1 LSR0 Reset Value 0 0 0 0 POR POR, Reset mode, ext_reset or LIN failure gone* Table 18. LIN Status Register - $4/$5 Read Reset Condition S3 S2 S1 S0 RXSHORT TXDOM LINOT 0 RXSHORT - RXD Pin Short-circuit POR * LIN failure gone: if LIN failure (over-temp, TXD/RXD short) was set, the flag resets automatically when the failure is gone. J2602 - LIN Dominant Voltage Select This write-only bit controls the J2602 circuitry. If the circuitry is enabled (bit sets to 0), the TXD-LIN-RXD communication works down to the battery under-voltage condition is detected. Below, the bus is in recessive state. If the circuitry is disabled (bit sets to 1), the communication TXD-LIN-RXD works down to 4.6 V (typical value). 0 = Enabled J2602 feature. 1 = Disabled J2602 feature. RXONLY - LIN Receiver Operation Only This write-only bit controls the behavior of the LIN transmitter. In Normal mode, the activation of the RXONLY bit disables the LIN transmitter. In case of a LIN error condition, this bit is automatically set. In Stop mode this bit disables the LIN wake-up functionality, and the RXD pin will reflect the state of the LIN bus. 1 = only LIN receiver active (Normal mode) or LIN wakeup disabled (Stop mode). 0 = LIN fully enabled. LSRx - LIN Slew-Rate This read-only bit indicates a short-circuit condition on the RXD pin (shorted either to 5.0 V or to Ground). The shortcircuit delay must be a worst case of 8s to be detected and to shut down the driver. To clear this bit, it must be read after the condition is gone (transition detected on RXD pin). The LIN driver is automatically re-enabled once the condition is gone and TXD is high. 1 = RXD short-circuit condition. 0 = None. TXDOM - TXD Permanent Dominant This read-only bit signals the detection of a TXD pin stuck at dominant (Ground) condition and the resultant shutdown in the LIN transmitter. This condition is detected after the TXD pin remains in dominant state for more than 1 second (typical value). To clear this bit, it must be read after TXD has gone high. The LIN driver is automatically re-enabled once TXD goes High. 1 = TXD stuck at dominant fault detected. 0 = None. LINOT - LIN Driver Over-temperature This read-only bit signals that the LIN transceiver was shutdown due to over-temperature. The transmitter is automatically re-enabled after the over-temperature condition is gone and TXD is high. The LINOT bit is cleared after SPI read once the condition is gone. 1 = LIN over-temperature shutdown 0 = None This write-only bit controls the LIN driver slew-rate in accordance with Table . Table 17. LIN Slew Rate Control LSR1 LSR0 Description 0 0 Normal Slew Rate (up to 20 kb/s) 0 1 Slow Slew Rate (up to 10 kb/s) 1 0 Fast Slew Rate (up to 100 kb/s) 1 1 Reserved 33912 42 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS High Side Control Register - HSCR Low Side Control Register - LSCR This register controls the operation of the high side drivers. Writing to this register returns the High Side Status Register (HSSR). This register controls the operation of the low side drivers. Writing the Low Side Control Register (LSCR) will also return the Low Side Status Register (LSSR). Table 19. High Side Control Register - $6 Table 21. Low Side Control Register - $8 C3 C2 C1 C0 Write PWMHS2 PWMHS1 HS2 HS1 Reset Value 0 0 0 0 Reset Condition POR, Reset mode, ext_reset, HSx over-temp or (VSOV & HVSE) POR C3 C2 C1 C0 Write PWMLS2 PWMLS1 LS2 LS1 Reset Value 0 0 0 0 Reset Condition POR, Reset mode, ext_reset, LSx over-temp or (VSOV & HVSE) POR PWMHSx - PWM Input Control Enable. PWMLx - PWM Input Control Enable. This write-only bit enables/disables the PWMIN input pin to control the respective high side switch. The corresponding high side switch must be enabled (HSx bit). 1 = PWMIN input controls HSx output. 0 = HSx is controlled only by SPI. This write-only bit enables/disables the PWMIN input pin to control the respective low side switch. The corresponding low side switch must be enabled (LSx bit). 1 = PWMIN input controls LSx. 0 = LSx is controlled only by SPI. HSx - HSx Switch Control. LSx - LSx Switch Control. This write-only bit enables/disables the corresponding high side switch. 1 = HSx switch on. 0 = HSx switch off. This write-only bit enables/disables the corresponding low side switch. 1 = LSx switch on. 0 = LSx switch off. High Side Status Register - HSSR Low Side Status Register - LSSR This register returns the status of the high side switches and is also returned when writing to the HSCR. This register returns the status of the low side switches and is also returned when writing to the LSCR. Table 20. High Side Status Register - $6/$7 Read S3 S2 S1 S0 HS2OP HS2CL HS1OP HS1CL Table 22. Low Side Status Register - $8/$9 Read C3 C2 C1 C0 LS2OP LS2CL LS1OP LS1CL High Side Thermal Shutdown Low Side Thermal Shutdown A thermal shutdown of the high side drivers is indicated by setting all HSxOP and HSxCL bits simultaneously. A thermal shutdown of the low side drivers is indicated by setting all LSxOP and LSxCL bits simultaneously. HSxOP - High Side Switch Open-Load Detection LSxOP - Low Side Switch Open-Load Detection This read-only bit signals that the high side switches are conducting current below a certain threshold indicating possible load disconnection. This read-only bit signals that the low side switches are conducting current below a certain threshold indicating possible load disconnection. 1 = HSx Open Load detected (or thermal shutdown) 0 = Normal 1 = LSx Open Load detected (or thermal shutdown) 0 = Normal HSxCL - High Side Current Limitation LSxCL - Low Side Current Limitation This read-only bit indicates that the respective high side switch is operating in current limitation mode. 1 = HSx in current limitation (or thermal shutdown) 0 = Normal This read-only bit indicates that the respective low side switch is operating in current limitation mode. 1 = LSx in current limitation (or thermal shutdown) 0 = Normal 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 43 MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS Timing Control Register - TIMCR This register allows to configure the watchdog, the cyclic sense and Forced Wake-up periods. Writing to the Timing Control Register (TIMCR) will also return the Watchdog Status Register (WDSR). Table 23. Timing Control Register - $A C3 Write C2 C1 C0 WD2 WD1 WD0 CYST2 CYST1 CYST0 0 0 0 CS/WD Reset Value - Reset Condition - POR CS/WD - Cyclic Sense or Watchdog Prescaler Select This write-only bit selects which prescaler is being written to, the Cyclic Sense/Forced Wake-up prescaler or the Watchdog prescaler. 1 = Cyclic Sense/Forced Wake-up Prescaler selected 0 = Watchdog Prescaler select WDx - Watchdog Prescaler This write-only bits selects the divider for the watchdog prescaler and therefore selects the watchdog period in accordance with Table 24. This configuration is valid only if windowing watchdog is active. Table 24. watchdog Prescaler WD2 WD1 WD0 Prescaler Divider 0 0 0 1 0 0 1 2 0 1 0 4 0 1 1 6 1 0 0 8 1 0 1 10 1 1 0 12 1 1 1 14 CYSTx - Cyclic Sense Period Prescaler Select This write-only bits selects the interval for the wake-up cyclic sensing together with the bit CYSX8 in the Configuration Register (CFR) (see page 45). This option is only active if one of the high side switches is enabled when entering in Stop or Sleep mode. Otherwise, a timed wake-up is performed after the period shown in Table 25. Table 25. Cyclic Sense and Force Wake up Interval CYSX8(71) CYST2 CYST1 CYST0 Interval X 0 0 0 No cyclic sense(72) 0 0 0 1 20 ms 0 0 1 0 40 ms 0 0 1 1 60 ms 0 1 0 0 80 ms 0 1 0 1 100 ms 0 1 1 0 120 ms 0 1 1 1 140 ms 1 0 0 1 160 ms 1 0 1 0 320 ms 1 0 1 1 480 ms 1 1 0 0 640 ms 1 1 0 1 800 ms 1 1 1 0 960 ms 1 1 1 1 1120 ms Notes 71. bit CYSX8 is located in Configuration Register (CFR) 72. No Cyclic Sense and no Force Wake-up available. Watchdog Status Register - WDSR This register returns the Watchdog status information and is also returned when writing to the TIMCR. Table 26. Watchdog Status Register - $A/$B Read S3 S2 S1 S0 WDTO WDERR WDOFF WDWO WDTO - Watchdog Timeout This read-only bit signals the last reset was caused by either a watchdog timeout or by an attempt to clear the Watchdog within the window closed. Any access to this register or the Timing Control Register (TIMCR) will clear the WDTO bit. 1 = Last reset caused by watchdog timeout 0 = None 33912 44 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS WDERR - Watchdog Error Table 28. Analog Multiplexer Channel Select This read-only bit signals the detection of a missing watchdog resistor. In this condition the watchdog is using the internal, lower precision timebase. The Windowing function is disabled. 1 = WDCONF pin resistor missing 0 = WDCONF pin resistor not floating MX2 MX1 MX0 Meaning 0 0 0 Disabled 0 0 1 Reserved 0 1 0 Die Temperature Sensor 0 1 1 VSENSE input 1 0 0 L1 input WDOFF - Watchdog Off 1 0 1 L2 input This read-only bit signals that the watchdog pin connected to Ground and therefore disabled. In this case watchdog timeouts are disabled and the device automatically enters Normal mode out of Reset. This might be necessary for software debugging and for programming the Flash memory. 1 = Watchdog is disabled 0 = Watchdog is enabled 1 1 0 L3 input 1 1 1 L4 input WDWO - Watchdog Window Open This read-only bit signals when the watchdog window is open for clears. The purpose of this bit is for testing. Should be ignored in case WDERR is High. 1 = Watchdog window open 0 = Watchdog window closed Analog Multiplexer Control Register - MUXCR This register controls the analog multiplexer and selects the divider ration for the Lx input divider. Table 27. Analog Multiplexer Control Register -$C C3 C2 C1 C0 Write LXDS MX2 MX1 MX0 Reset Value 1 0 0 0 Reset Condition POR POR, Reset mode or ext_reset LXDS - Lx Analog Input Divider Select This write-only bit selects the resistor divider for the Lx analog inputs. Voltage is internally clamped to VDD. 0 = Lx Analog divider: 1 1 = Lx Analog divider: 3.6 (typ.) MXx - Analog Multiplexer Input Select These write-only bits selects which analog input is multiplexed to the ADOUT0 pin according to Table 28. When disabled or when in Stop or Sleep mode, the output buffer is not powered and the ADOUT0 output is left floating to achieve lower current consumption. Configuration Register - CFR This register controls the Hall Sensor Supply enable/ disable, the cyclic sense timing multiplier, enables/disables the Current Sense Auto-zero function and selects the gain for the current sense amplifier. Table 29. Configuration Register - $D C3 C2 C1 C0 Write HVDD CYSX8 CSAZ CSGS Reset Value 0 0 0 0 Reset Condition POR, Reset mode or ext_reset POR POR POR HVDD - Hall Sensor Supply Enable This write-only bit enables/disables the state of the hall sensor supply. 1 = HVDD on 0 = HVDD off CYSX8 - Cyclic Sense Timing x 8. This write-only bit influences the cyclic sense and Forced Wake-up period as shown in Table 25. 1 = Multiplier enabled 0 = None CSAZ - Current Sense Auto-Zero Function Enable This write-only bit enables/disables the circuitry to lower the offset voltage of the current sense amplifier. 1 = Auto-zero function enabled 0 = Auto-zero function disabled CSGS - Current Sense Amplifier Gain Select This write-only bit selects the gain of the current sense amplifier. 1 = 14.5 (typ.) 0 = 30 (typ.) 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 45 MC33912G5AC / MC34912G5AC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS Interrupt Mask Register - IMR LINM - LIN Interrupts Mask This register allows masking of some of the interrupt sources. No interrupt will be generated to the MCU and no flag will be set in the ISR register. The 5.0 V Regulator overtemperature prewarning interrupt and under-voltage (VSUV) interrupts can not be masked and will always cause an interrupt. This write-only bit enables/disables interrupts generated in the LIN block. 1 = LIN Interrupts Enabled 0 = LIN Interrupts Disabled VMM - Voltage Monitor Interrupt Mask Writing to the IMR will return the ISR. This write-only bit enables/disables interrupts generated in the Voltage Monitor block. The only maskable interrupt in the Voltage Monitor Block is the VSUP over-voltage interrupt. 1 = Interrupts Enabled 0 = Interrupts Disabled Table 30. Interrupt Mask Register - $E C3 C2 C1 C0 Write HSM LSM LINM VMM Reset Value 1 1 1 1 Reset Condition Interrupt Source Register - ISR This register allows the MCU to determine the source of the last interrupt or wake-up respectively. A read of the register acknowledges the interrupt and leads IRQ pin to high, in case there are no other pending interrupts. If there are pending interrupts, IRQ will be driven high for 10 s and then be driven low again. This register is also returned when writing to the Interrupt Mask Register (IMR). POR HSM - High Side Interrupt Mask This write-only bit enables/disables interrupts generated in the high side block. 1 = HS Interrupts Enabled 0 = HS Interrupts Disabled Table 31. Interrupt Source Register - $E/$F LSM - Low Side Interrupt Mask This write-only bit enables/disables interrupts generated in the low side block. 1 = LS Interrupts Enabled 0 = LS Interrupts Disabled Read S3 S2 S1 S0 ISR3 ISR2 ISR1 ISR0 ISRx - Interrupt Source Register These read-only bits indicate the interrupt source following Table 32. If no interrupt is pending then all bits are 0. In case more than one interrupt is pending, the interrupt sources are handled sequentially multiplex. Table 32. Interrupt Sources Interrupt Source ISR3 ISR2 ISR1 ISR0 Priority none maskable maskable 0 0 0 0 no interrupt no interrupt none 0 0 0 1 Lx Wake-up from Stop and Sleep mode - highest 0 0 1 0 - HS Interrupt (Over-temperature) 0 0 1 1 - LS Interrupt (Over-temperature) 0 1 0 0 LIN Wake-up LIN Interrupt (RXSHORT, TXDOM, LIN OT) 0 1 0 1 Voltage Monitor Interrupt Voltage Monitor Interrupt (Low Voltage and VDD over-temperature) (High Voltage) Forced Wake-up - 0 1 1 0 lowest 33912 46 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912G5AC / MC34912G5AC TYPICAL APPLICATION TYPICAL APPLICATION The 33912 can be configured in several applications. The figure below shows the 33912 in the typical Slave Node Application. V BAT VS2 VS1 D1 C2 C1 C4 Interrupt Control Module LVI, HVI, HTI, OCI IRQ C3 Internal Bus VDD Voltage Regulator C5 AGND HVDD 5V Output Module VDD IRQ Reset Control Module LVR, HVR, HTR, WD, RST LS1 Low Side Control Module RST TIMER LS2 HB Type Relay PGND Window Watchdog Module PWMIN HS1 HS2 MISO MOSI Chip Temp Sense Module SCLK Analog Multiplexer SPI & CONTROL SPI CS VSENSE VBAT Sense Module R2 L1 Analog Input Module A/D R1 Motor Output High Side Control Module MCU Hall Sensor Supply ADOUT0 R3 L2 Wake Up Module L3 Digital Input Module L4 R4 Analog Input R5 Analog Input RXD LIN Physical Layer SCI LIN LIN TXD C6 ISENSEH Current Sense Module ADOUT1 WDCONF LGND AGND ISENSEL PGND A/D R6 R7 Typical Component Values: C1 = 47 F; C2 = C4 = 100 nF; C3 = 10 F; C5 = 4.7 F; C6 = 22 0pF or 68 pF R1 = 10 k; R2 = R3 = 10 k; R4 = R5 = 33 k; R6 = 20 ; R7 = 20 k200 k Recommended Configuration of the not Connected Pins (NC): Pin 28 = this pin is not internally connected and may be used for PCB routing optimization. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 47 MC33912BAC / MC34912BAC MC33912BAC PRODUCT SPECIFICATIONS PAGES 48 TO 90 MC33912BAC PRODUCT SPECIFICATIONS PAGES 48 TO 90 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 48 MC33912BAC / MC34912BAC INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM RST IRQ INTERRUPT CONTROL MODULE LVI, HVI, HTI, OCI RESET CONTROL MODULE LVR, HVR, HTR, WD VS1 INTERNAL BUS VS2 VDD AGND VOLTAGE REGULATOR 5V OUTPUT MODULE HVDD LS1 LOW SIDE CONTROL MODULE WINDOW WATCHDOG MODULE LS2 PWMIN PGND VS2 MISO SCLK SPI & CONTROL VS2 HS1 HS2 ANALOG MULTIPLEXER MOSI HIGH SIDE CONTROL MODULE CS ADOUT0 WAKE-UP MODULE VBAT SENSE MODULE VSENSE CHIP TEMPERATURE SENSE MODULE ANALOG INPUT MODULE L1 L2 L3 RXD TXD DIGITAL INPUT MODULE LIN PHYSICAL LAYER L4 LIN ISENSEH CURRENT SENSE MODULE ISENSEL LGND WDCONF ADOUT1 Figure 25. 33912 Simplified Internal Block Diagram 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 49 MC33912BAC / MC34912BAC PIN CONNECTIONS AGND VDD HVDD VSENSE NC VS1 VS2 HS1 32 31 30 29 28 27 26 25 PIN CONNECTIONS MISO 3 22 L2 MOSI 4 21 L3 SCLK 5 20 L4 CS 6 19 LS1 ADOUT0 7 18 PGND PWMIN 8 17 LS2 9 10 11 12 13 14 15 16 ISENSEH L1 ISENSEL 23 LGND 2 LIN TXD WDCONF HS2 ADOUT1 24 IRQ 1 RST RXD Figure 26. 33912 Pin Connections Table 33. 33912 Pin Definitions A functional description of each pin can be found in the Functional Pin Description on page 68. Pin Pin Name Formal Name Definition 1 RXD Receiver Output This pin is the receiver output of the LIN interface which reports the state of the bus voltage to the MCU interface. 2 TXD Transmitter Input This pin is the transmitter input of the LIN interface which controls the state of the bus output. 3 MISO SPI Output SPI (Serial Peripheral Interface) data output. When CS is high, pin is in the high-impedance state. 4 MOSI SPI Input SPI (Serial Peripheral Interface) data input. 5 SCLK SPI Clock SPI (Serial Peripheral Interface) clock Input. 6 CS SPI Chip Select 7 ADOUT0 Analog Output Pin 0 8 PWMIN PWM Input 9 RST Internal Reset I/O Bidirectional Reset I/O pin - driven low when any internal reset source is asserted. RST is active low. 10 IRQ Internal Interrupt Output Interrupt output pin, indicating wake-up events from Stop mode or events from Normal and Normal request modes. IRQ is active low. 11 ADOUT1 Analog Output Pin 1 SPI (Serial Peripheral Interface) chip select input pin. CS is active low. Analog Multiplexer Output. High Side and Low Side Pulse Width Modulation Input. Current sense analog output. 33912 50 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC PIN CONNECTIONS Table 33. 33912 Pin Definitions A functional description of each pin can be found in the Functional Pin Description on page 68. Pin Pin Name Formal Name 12 WDCONF Watchdog Configuration Pin 13 LIN LIN Bus 14 LGND LIN Ground Pin 15 ISENSEL 16 ISENSEH 17 LS2 19 LS1 18 PGND 20 L4 21 L3 22 L2 23 L1 24 HS2 25 HS1 26 VS2 27 VS1 29 Current Sense Pins Definition This input pin is for configuration of the watchdog period and allows the disabling of the watchdog. This pin represents the single-wire bus transmitter and receiver. This pin is the device LIN ground connection. It is internally connected to the PGND pin. Current Sense differential inputs. Low Side Outputs Relay drivers low side outputs. Power Ground Pin This pin is the device low side ground connection. It is internally connected to the LGND pin. Wake-up Inputs These pins are the wake-up capable digital inputs(73). In addition, all Lx inputs can be sensed analog via the analog multiplexer. High Side Outputs High side switch outputs. Power Supply Pin These pins are device battery level power supply pins.VS2 is supplying the HSx drivers while VS1 supplies the remaining blocks.(74) VSENSE Voltage Sense Pin Battery voltage sense input.(75) 30 HVDD Hall Sensor Supply Output +5.0 V switchable supply output pin.(76) 31 VDD Voltage Regulator Output +5.0 V main voltage regulator output pin.(77) 32 AGND Analog Ground Pin This pin is the device analog ground connection. Notes 73. When used as digital input, a series 33 k resistor must be used to protect against automotive transients. 74. Reverse battery protection series diodes must be used externally to protect the internal circuitry. 75. This pin can be connected directly to the battery line for voltage measurements. The pin is self protected against reverse battery connections. It is strongly recommended to connect a 10k resistor in series with this pin for protection purposes. 76. External capacitor (1.0 F < C < 10 F; 0.1 < ESR < 5.0 ) required. 77. External capacitor (2.0 F < C < 100 F; 0.1 < ESR < 10.0 ) required. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 51 MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 34. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit Normal Operation (DC) VSUP(SS) -0.3 to 27 Transient Conditions (load dump) VSUP(PK) -0.3 to 40 VDD -0.3 to 5.5 VIN -0.3 to VDD +0.3 VIN(IRQ) -0.3 to 11 HS1 and HS2 Pin Voltage (DC) VHS - 0.3 to VSUP +0.3 V LS1 and LS2 Pin Voltage (DC) VLS -0.3 to 45 V Normal Operation with a series 33 k resistor (DC) VLxDC -18 to 40 Transient input voltage with external component (according to ISO7637-2) (See Figure 28) VLxTR 100 ISENSEH and ISENSEL Pin Voltage (DC) VISENSE -0.3 to 40 V VSENSE Pin Voltage (DC) VVSENSE -27 to 40 V Normal Operation (DC) VBUSDC -18 to 40 Transient input voltage with external component (according to ISO7637-2) (See Figure 27) VBUSTR -150 to 100 IVDD Internally Limited Human Body Model - LIN Pin VESD1-1 8000 Human Body Model - all other Pins VESD1-2 2000 VESD2 150 Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32) VESD3-1 750 All other Pins (Pins 2-7, 10-15, 18-23, 26-31) VESD3-2 500 ELECTRICAL RATINGS Supply Voltage at VS1 and VS2 Supply Voltage at VDD Input / Output Pins Voltage V (78) CS, RST, SCLK, PWMIN, ADOUT0, ADOUT1, MOSI, MISO, TXD, RXD, HVDD Interrupt Pin (IRQ)(79) V L1, L2, L3 and L4 Pin Voltage V LIN Pin Voltage VDD output current V ESD Voltage(80) Machine Model V A V Charge Device Model Notes 78. Exceeding voltage limits on specified pins may cause a malfunction or permanent damage to the device. 79. Extended voltage range for programming purpose only. 80. Testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), Machine Model (CZAP = 200 pF, RZAP = 0 ) and the Charge Device Model, Robotic (CZAP = 4.0 pF). 33912 52 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 34. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit THERMAL RATINGS Operating Ambient Temperature (81) C TA Operating Junction Temperature 33912 -40 to 125 34912 -40 to 85 TJ -40 to 150 C Storage Temperature TSTG -55 to 150 C Thermal Resistance, Junction to Ambient RJA Natural Convection, Single Layer board (1s)(82), (83) Natural Convection, Four Layer board (2s2p)(82), (84) (85) Thermal Resistance, Junction to Case Peak Package Reflow Temperature During Reflow(86), (87) C/W 85 56 RJC 23 C/W TPPRT Note 87 C Notes 81. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking. 82. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 83. 84. 85. 86. Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 87. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 53 MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 35. Static Electrical Characteristics Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit VSUP 5.5 - 18 V Functional Operating Voltage(88) VSUPOP - - 27 V Load Dump VSUPLD - - 40 V IRUN - 4.5 10 mA - 48 80 - 58 90 - 27 35 - 37 48 ICYCLIC - 10 - VBATFAIL 1.5 3.0 3.9 VBATFAIL_HYS - 0.9 - VSUV 5.55 6.0 6.6 VSUV_HYS - 1.0 - VSOV 18 19.25 20.5 - 1.0 - SUPPLY VOLTAGE RANGE (VS1, VS2) Nominal Operating Voltage SUPPLY CURRENT RANGE (VSUP = 13.5 V) Normal Mode (IOUT at VDD = 10 mA), LIN Recessive State(89) Stop mode, VDD ON with IOUT = 100 A, LIN Recessive State (89), (90), (91) ISTOP A 5.5 V < VSUP < 12 V VSUP = 13.5 V Sleep mode, VDD OFF, LIN Recessive State(89), (91) ISLEEP A 5.5 V < VSUP < 12 V 12 V VSUP < 13.5 V Cyclic Sense Supply Current Adder(92) A SUPPLY UNDER/OVER-VOLTAGE DETECTIONS Power-On Reset (BATFAIL)(93) Threshold (measured on VS1) V (92) Hysteresis (measured on VS1)(92) VSUP Under-voltage Detection (VSUV Flag) (Normal and Normal Request modes, Interrupt Generated) Threshold (measured on VS1) Hysteresis (measured on VS1) V VSUP Over-voltage Detection (VSOV Flag) (Normal and Normal Request modes, Interrupt Generated) Threshold (measured on VS1) Hysteresis (measured on VS1) VSOV_HYS V Notes 88. Device is fully functional. All features are operating. 89. Total current (IVS1 + IVS2) measured at GND pins excluding all loads, cyclic sense disabled. 90. Total IDD current (including loads) below 100 A. 91. Stop and Sleep modes current will increase if VSUP exceeds13.5 V. 92. 93. This parameter is guaranteed by process monitoring but not production tested. The Flag is set during power up sequence. To clear the flag, a SPI read must be performed. 33912 54 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 35. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic (94) VOLTAGE REGULATOR Symbol Min Typ Max 4.75 5.00 5.25 60 110 200 - 0.1 0.25 Unit (VDD) Normal Mode Output Voltage VDDRUN 1.0 mA < IVDD < 50 mA; 5.5 V < VSUP < 27 V Normal Mode Output Current Limitation IVDDRUN Dropout Voltage(95) VDDDROP IVDD = 50 mA Stop Mode Output Voltage V V VDDSTOP IVDD < 5.0 mA mA V 4.75 5.0 5.25 IVDDSTOP 6.0 12 36 Normal mode, 5.5 V < VSUP < 18 V; IVDD = 10 mA LRRUN - 20 25 Stop mode, 5.5 V < VSUP < 18 V; IVDD = 1.0 mA LRSTOP - 5.0 25 Normal mode, 1.0 mA < IVDD < 50 mA LDRUN - 15 80 Stop mode, 0.1 mA < IVDD < 5.0 mA LDSTOP - 10 50 110 125 140 TPRE_HYS - 10 - C TSD 155 170 185 C TSD_HYS - 10 - C -2.0 - 2.0 20 30 50 Stop Mode Output Current Limitation Line Regulation mV Load Regulation Over-temperature Prewarning mA mV (Junction)(96) TPRE Interrupt generated, VDDOT Bit Set Over-temperature Prewarning Hysteresis(96) Over-temperature Shutdown Temperature (Junction)(96) (96) Over-temperature Shutdown Hysteresis C HALL SENSOR SUPPLY OUTPUT(97) (HVDD) VDD Voltage matching HVDDACC = (HVDD-VDD) / VDD * 100% HVDDACC IHVDD = 15 mA Current Limitation Dropout Voltage IHVDD HVDDDROP IHVDD = 15 mA; IVDD = 5.0 mA Line Regulation - 160 300 - 25 40 mV LDHVDD 1.0 mA > IHVDD > 15 mA; IVDD = 5.0 mA mA mV LRHVDD IHVDD = 5.0 mA; IVDD = 5.0 mA Load Regulation % mV - 10 20 Notes 94. Specification with external capacitor 2.0 F < C < 100 F and 100 m ESR 10 . 95. Measured when voltage has dropped 250 mV below its nominal Value (5.0 V). 96. This parameter is guaranteed by process monitoring but not production tested. 97. Specification with external capacitor 1.0 F < C < 10 F and 100 m ESR 10 . 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 55 MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 35. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit VRSTTH 4.3 4.5 4.7 V 0.0 - 0.9 -150 -250 -350 1.5 - 8.0 RST INPUT/OUTPUT PIN (RST) VDD Low Voltage Reset Threshold Low-state Output Voltage VOL IOUT = 1.5 mA; 3.5 V VSUP 27 V High-state Output Current (0 < VOUT < 3.5 V) Pull-down Current Limitation (internally limited) IOH V IPD_MAX VOUT = VDD A mA Low-state Input Voltage VIL -0.3 - 0.3 x VDD V High-state Input Voltage VIH 0.7 x VDD - VDD +0.3 V 0.0 - 1.0 VDD -0.9 - VDD MISO SPI OUTPUT PIN (MISO) Low-state Output Voltage VOL IOUT = 1.5 mA High-state Output Voltage VOH IOUT = -250 A Tri-state Leakage Current V V ITRIMISO 0 V VMISO VDD A -10 - 10 SPI INPUT PINS (MOSI, SCLK, CS) Low-state Input Voltage VIL -0.3 - 0.3 x VDD V High-state Input Voltage VIH 0.7 x VDD - VDD +0.3 V MOSI, SCLK Input Current IIN 0 V VIN VDD CS Pull-up Current A -10 - 10 10 20 30 0.0 - 0.8 VDD -0.8 - VDD IPUCS 0 V < VIN < 3.5 V A INTERRUPT OUTPUT PIN (IRQ) Low-state Output Voltage VOL IOUT = 1.5 mA High-state Output Voltage VOH IOUT = -250 A Leakage Current V V VOH VDD VOUT 10 V mA - - 2.0 PULSE WIDTH MODULATION INPUT PIN (PWMIN) Low-state Input Voltage VIL -0.3 - 0.3 x VDD V High-state Input Voltage VIH 0.7 x VDD - VDD +0.3 V 10 20 30 Pull-up current 0 V < VIN < 3.5 V IPUPWMIN A 33912 56 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 35. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max TJ = 25C, ILOAD = 50 mA; VSUP > 9.0 V - - 7.0 TJ = 150C, ILOAD = 50 mA; VSUP > 9.0 V(98) - - 10 TJ = 150C, ILOAD = 30 mA; 5.5 V < VSUP < 9.0 V(98) - - 14 Unit HIGH SIDE OUTPUTS HS1 AND HS2 PINS (HS1, HS2) Output Drain-to-Source On Resistance RDS(ON) Output Current Limitation(99) ILIMHSX 0 V < VOUT < VSUP - 2.0 V mA 60 120 250 - 5.0 7.5 - - 10 VSUP -2.0 - - THSSD 150 165 180 C THSSD_HYS - 10 - C TJ = 25C, ILOAD = 150 mA, VSUP > 9.0 V - - 2.5 TJ = 125C, ILOAD = 150 mA, VSUP > 9.0 V - - 4.5 - - 10 160 275 350 - 8.0 12 Open Load Current Detection (100) IOLHSX Leakage Current ILEAK -0.2 V < VHSX < VS2 + 0.2 V Short-circuit Detection Threshold(101) Over-temperature Shutdown(102), (107) Over-temperature Shutdown A VTHSC 5.5 V < VSUP < 27 V Hysteresis(107) mA V LOW SIDE OUTPUTS LS1 AND LS2 PINS (LS1, LS2) Output Drain-to-Source On Resistance RDS(ON) TJ = 125C, ILOAD = 120 mA, 5.5 V < VSUP < 9.0 V Output Current Limitation(103) ILIMLSX 2.0 V < VOUT < VSUP Open Load Current Detection(104) IOLLSX Leakage Current ILEAK -0.2 V < VOUT < VS1 Active Output Energy Clamp mA A - - 10 VSUP +2.0 - VSUP +5.0 2.0 - - TLSSD 150 165 180 C TLSSD_HYS - 10 - C VCLAMP IOUT = 150 mA Short-circuit Detection Threshold(105) V VTHSC 5.5 V < VSUP < 27 V Over-temperature Shutdown(106), (107) (107) Over-temperature Shutdown Hysteresis mA V Notes 98. This parameter is production tested up to TA = 125C and guaranteed by process monitoring up to TJ = 150C. 99. 100. 101. 102. 103. 104. 105. 106. 107. When over-current occurs, the corresponding high side stays ON with limited current capability and the HSxCL flag is set in the HSSR. When open load occurs, the flag (HSxOP) is set in the HSSR. When short-circuit occurs and if HVSE flag is enabled, both HS automatic shutdown. When over-temperature shutdown occurs, both high sides are turned off. All flags in HSSR are set. When over-current occurs, the corresponding low side stays ON with limited current capability and the LSxCL flag is set in the LSSR. When open load occurs, the flag (LSxOP) is set in the LSSR. When short-circuit occurs and if HVSE Flag is enabled, both LS automatic shutdown When over-temperature shutdown occurs, both low sides are turned off. All flags in LSSR are set. Guaranteed by characterization but not production tested 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 57 MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 35. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max 2.0 2.5 3.0 3.0 3.5 4.0 0.5 1.0 1.5 -10 - 10 800 1550 - LXDS (Lx Divider Select) = 0 0.95 1.0 1.05 LXDS (Lx Divider Select) = 1 3.42 3.6 3.78 -80 0.0 80 -22 0.0 22 Unit L1, L2, L3 AND L4 INPUT PINS (L1, L2, L3, L4) Low Detection Threshold VTHL 5.5 V < VSUP < 27 V High Detection Threshold VTHH 5.5 V < VSUP < 27 V Hysteresis Analog Input Divider Ratio (RATIOLx = VLx / VADOUT0) Analog Output offset Ratio LXDS (Lx Divider Select) = 0 RLXIN A k RATIOLX VRATIOLxOFFSET LXDS (Lx Divider Select) = 1 Analog Inputs Matching V IIN -0.2 V < VIN < VS1 Analog Input Impedance(109) V VHYS 5.5 V < VSUP < 27 V Input Current(108) V mV LXMATCHING % LXDS (Lx Divider Select) = 0 96 100 104 LXDS (Lx Divider Select) = 1 96 100 104 REXT 20 - 200 k WDACC -15 - 15 % STTOV - 10.5 - mV/K 5.0 5.25 5.5 -30 - 30 -45 - 45 WINDOW WATCHDOG CONFIGURATION PIN (WDCONF) External Resistor Range Watchdog Period Accuracy with External Resistor (Excluding Resistor Accuracy)(110) ANALOG MULTIPLEXER Internal Chip Temperature Sense Gain VSENSE Input Divider Ratio (RATIOVSENSE = VVSENSE / VADOUT0) RATIOVSENSE 5.5 V < VSUP < 27 V VSENSE Output Related Offset OFFSETVSENSE -40C < TA < -20C mV ANALOG OUTPUTS (ADOUT0 AND ADOUT1) Maximum Output Voltage VOUT_MAX -5.0 mA < IO < 5.0 mA Minimum Output Voltage -5.0 mA < IO < 5.0 mA V VDD -0.35 - VDD 0.0 - 0.35 VOUT_MIN V Notes 108. Analog multiplexer input disconnected from Lx input pin. 109. Analog multiplexer input connected to Lx input pin. 110. Watchdog timing period calculation formula: tPWD [ms] = 0.466 * (REXT - 20) + 10 (REXT in k) 33912 58 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 35. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit CURRENT SENSE AMPLIFIER (ISENSEH, ISENSEL) Gain G CSGS (Current Sense Gain Select) = 0 29 30 31 CSGS (Current Sense Gain Select) = 1 14 14.5 15 CSGS (Current Sense Gain Select) = 0 2.0 10 30 CSGS (Current Sense Gain Select) = 1 5.0 20 50 CSGS (Current Sense Gain Select) = 0 75 - 300 CSGS (Current Sense Gain Select) = 1 75 - 300 -0.2 - 3.0 CSAZ (Current Sense Auto Zero) = 0 -15 - 15 CSAZ (Current Sense Auto Zero) = 1 -2.0 - 2.0 0.0 - 0.8 VDD -0.8 - VDD Differential Input Impedance Common Mode Input Impedance ISENSEH, ISENSEL Input Voltage Range Input Offset Voltage DIFF k CM VIN k VIN_OFFSET V mV RXD OUTPUT PIN (LIN PHYSICAL LAYER) (RXD) Low-state Output Voltage VOL IOUT = 1.5 mA High-state Output Voltage VOH IOUT = -250 A V V TXD INPUT PIN (LIN PHYSICAL LAYER) (TXD) Low-state Input Voltage VIL -0.3 - 0.3 x VDD V High-state Input Voltage VIH 0.7 x VDD - VDD +0.3 V IPUIN 10 20 30 A Pin Pull-up Current, 0V < VIN < 3.5V 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 59 MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 35. Static Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max 40 120 200 Unit (111) LIN PHYSICAL LAYER, TRANSCEIVER (LIN) Output Current Limitation IBUSLIM Dominant State, VBUS = 18 V mA Leakage Output Current to GND Dominant State; VBUS = 0 V; VBAT = 12 V IBUS_PAS_dom -1.0 - - mA Recessive State; 8.0 V < VBAT < 18 V; 8.0 V < VBUS < 18 V; VBUS VBAT IBUS_PAS_REC GND Disconnected; GNDDEVICE = VSUP; VBAT = 12 V; 0 < VBUS < 18 V IBUS_NO_GND - -1.0 - - 20 1.0 A mA IBUS - - 100 A Receiver Dominant State VBUSDOM - - 0.4 Receiver Recessive State VBUSREC 0.6 - - Receiver Threshold Center (VTH_DOM + VTH_REC)/2 VBUS_CNT 0.475 0.5 0.525 Receiver Threshold Hysteresis (VTH_REC - VTH_DOM) VHYS - - 0.175 VLIN_REC VSUP -1.0 - - Dominant State, TXD LOW, 500 External Pull-up Resistor, LDVS = 0 VLIN_DOM_0 - 1.1 1.4 Dominant State, TXD LOW, 500 External Pull-up Resistor, LDVS = 1 VLIN_DOM_1 - 1.7 2 LIN Pull-up Resistor to VSUP RSLAVE 20 30 60 k Over-temperature Shutdown(112) TLINSD 150 165 180 C TLINSD_HYS - 10 - C VBAT Disconnected; VSUP_DEVICE = GND; 0 < VBUS < 18 V Receiver Input Voltages VSUP LIN Transceiver Output Voltage Recessive State, TXD HIGH, IOUT = 1.0 A Over-temperature Shutdown Hysteresis V Notes 111. Parameters guaranteed for 7.0 V VSUP 18 V. 112. When over-temperature shutdown occurs, the LIN bus goes in recessive state and the flag LINOT in LINSR is set. 33912 60 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 36. Dynamic Electrical Characteristics Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit SPI Operating Frequency f SPIOP - - 4.0 MHz SCLK Clock Period SPI INTERFACE TIMING (SEE Figure 36) tPSCLK 250 - N/A ns SCLK Clock High Time(113) tWSCLKH 110 - N/A ns SCLK Clock Low Time(113) tWSCLKL 110 - N/A ns Falling Edge of CS to Rising Edge of SCLK(113) tLEAD 100 - N/A ns Falling Edge of SCLK to CS Rising Edge(113) tLAG 100 - N/A ns MOSI to Falling Edge of SCLK(113) tSISU 40 - N/A ns Falling Edge of SCLK to MOSI(113) tSIH 40 - N/A ns MISO Rise Time(113) tRSO - 40 - CL = 220 pF MISO Fall Time(113) ns tFSO CL = 220 pF Time from Falling or Rising Edges of ns - 40 - CS to:(113) ns - MISO Low-impedance tSOEN 0.0 - 50 - MISO High-impedance tSODIS 0.0 - 50 Time from Rising Edge of SCLK to MISO Data Valid(113) tVALID 0.0 - 75 t RST 0.65 1.0 1.35 ms t RSTDF 350 600 900 ns 8.5 10 11.5 0.2 x VDD MISO 0.8 x VDD, CL = 100 pF ns RST OUTPUT PIN Reset Low-level Duration After VDD High (see Figure 35) Reset Deglitch Filter Time WINDOW WATCHDOG CONFIGURATION PIN (WDCONF) Watchdog Time Period(114) t PWD External Resistor REXT = 20 k (1%) ms External Resistor REXT = 200 k (1%) 79 94 108 Without External Resistor REXT (WDCONF Pin Open) 110 150 205 CMR 70 - - dB SVR 60 - - dB GBP 0.75 3.0 - MHz SR 0.5 - - V/s CURRENT SENSE AMPLIFIER(113) Common Mode Rejection Ratio Supply Voltage Rejection Ratio (115) Gain Bandwidth Product Output Slew-rate Notes 113. This parameter is guaranteed by process monitoring but not production tested. 114. Watchdog timing period calculation formula: tPWD [ms] = 0.466 * (REXT - 20) + 10 (REXT in k) 115. Analog Outputs are supplied by VDD 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 61 MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 36. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit t WUF 8.0 20 38 s - - 5.0 110 150 205 - - 10 L1, L2, L3 AND L4 INPUTS Wake-up Filter Time STATE MACHINE TIMING Delay Between CS LOW-to-HIGH Transition (at End of SPI Stop Command) and Stop mode Activation(116) Normal Request Mode Timeout (see Figure 35) Delay Between SPI Command and HS /LS Turn On(117) t NR TOUT Delay Between Normal Request and Normal Mode After a Watchdog Trigger Command (Normal Request Mode)(116) s t S-OFF 9.0 V < VSUP < 27 V - - 10 - - 10 s t SNR2N Delay Between CS Wake-up (CS LOW to HIGH) in Stop mode and: s Normal Request mode, VDD ON and RST HIGH t WUCS 9.0 15 80 First Accepted SPI Command t WUSPI 90 -- N/A t 2CS 4.0 -- -- Minimum Time Between Rising and Falling Edge on the CS ms s t S-ON 9.0 V < VSUP < 27 V Delay Between SPI Command and HS /LS Turn Off(117) s t STOP s LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR NORMAL SLEW RATE - 20.0 KBIT/SEC(118), (119) Duty Cycle 1: D1 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 50 s 7.0 V VSUP 18 V Duty Cycle 2: D2 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 50 s 7.6 V VSUP 18 V D1 7.0 V VSUP 18 V Duty Cycle 4: D4 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 96s 7.6 V VSUP 18 V -- -- -- -- 0.581 D2 LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR SLOW SLEW RATE - 10.4 Duty Cycle 3: D3 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 96 s 0.396 KBIT/SEC(118), (120) s D3 0.417 -- -- -- -- 0.590 s D4 Notes 116. This parameter is guaranteed by process monitoring but not production tested. 117. Delay between turn on or off command (rising edge on CS) and HS or LS ON or OFF, excluding rise or fall time due to external load. 118. Bus load RBUS and CBUS 1.0 nF / 1.0 k, 6.8 nF / 660, 10 nF / 500 . Measurement thresholds: 50% of TXD signal to LIN signal threshold defined at each parameter. See Figure 29. 119. See Figure 30. 120. See Figure 31. 33912 62 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 36. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 5.5 V VSUP 18 V, -40C TA 125C for the 33912 and -40C TA 85C for the 34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit SRFAST -- 20 -- V / s t REC_PD -- 3.0 6.0 t REC_SYM - 2.0 -- 2.0 t PROPWL 42 70 95 t WAKE -- -- 1500 t WAKE 9.0 13 17 t TXDDOM 0.65 1.0 1.35 - 10 - LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR FAST SLEW RATE LIN Fast Slew Rate (Programming mode) LIN PHYSICAL LAYER: CHARACTERISTICS AND WAKE-UP TIMINGS (121) Propagation Delay and Symmetry(122) s Propagation Delay Receiver, tREC_PD = MAX (tREC_PDR, tREC_PDF) Symmetry of Receiver Propagation Delay tREC_PDF - tREC_PDR Bus Wake-up Deglitcher (Sleep and Stop modes)(123) Bus Wake-up Event Reported From Sleep mode (124) From Stop mode(125) TXD Permanent Dominant State Delay s s s PULSE WIDTH MODULATION INPUT PIN (PWMIN) PWMIN pin(126) fPWMIN Max. frequency to drive HS and LS output pins kHz Notes 121. VSUP from 7.0 V to 18 V, bus load RBUS and CBUS 1.0 nF / 1.0 k, 6.8 nF / 660 , 10 nF / 500 . Measurement thresholds: 50% of TXD signal to LIN signal threshold defined at each parameter. See Figure 29. 122. See Figure 32. 123. See Figure 33 for Sleep and Figure 34 for Stop mode. 124. The measurement is done with 1F capacitor and 0 mA current load on VDD. The value takes into account the delay to charge the capacitor. The delay is measured between the bus wake-up threshold (VBUSWU) rising edge of the LIN bus and when VDD reaches 3.0 V. See Figure 33. The delay depends of the load and capacitor on VDD. 125. In Stop mode, the delay is measured between the bus wake-up threshold (VBUSWU) and the falling edge of the IRQ pin. See Figure 34. 126. This parameter is guaranteed by process monitoring but not production tested. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 63 MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS 33912 1.0 nF LIN TRANSIENT PULSE GENERATOR (NOTE) GND PGND LGND AGND Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b. Figure 27. Test Circuit for Transient Test Pulses (LIN) 33912 Transient Pulse Generator (Note) 1.0 nF L1, L2, L3, L4 10 k GND PGND LGND AGND Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b,. Figure 28. Test Circuit for Transient Test Pulses (Lx) VSUP TXD LIN R0 RXD C0 R0 AND C0 COMBINATIONS: * 1.0 K and 1.0 nF * 660 and 6.8 nF * 500 and 10 nF Figure 29. Test Circuit for LIN Timing Measurements 33912 64 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TXD tBIT tBIT tBUS_DOM (MAX) VLIN_REC tREC - MAX tDOM - MIN 74.4% VSUP tDOM - MIN 58.1% VSUP 40.0% VSUP LIN tBUS_REC (MIN) 60.0% VSUP 58.1% VSUP 40.0% VSUP 28.4% VSUP 28.4% VSUP 42.2% VSUP tREC - MIN tDOM - MAX tBUS_DOM (MIN) tBUS_REC (MAX) RXD tRDOM tRREC Figure 30. LIN Timing Measurements for Normal Slew Rate TXD tBIT tBIT tBUS_DOM (MAX) VLIN_REC tBUS_REC (MIN) tREC - MAX 77.8% VSUP tDOM - MIN LIN tDOM - MIN 61.6% VSUP 40.0% VSUP 60.0% VSUP 61.6% VSUP 40.0% VSUP 25.1% VSUP 25.1% VSUP 38.9% VSUP tREC - MIN tDOM - MAX tBUS_DOM (MIN) tBUS_REC (MAX) RXD tRDOM tRREC Figure 31. LIN Timing Measurements for Slow Slew Rate 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 65 MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS VLIN_REC VBUSREC VBUSDOM VSUP LIN BUS SIGNAL RXD tRX_PDF tRX_PDR Figure 32. LIN Receiver Timing VLIN_REC LIN 0.4 VSUP DOMINANT LEVEL VDD tPROPWL tWAKE Figure 33. LIN Wake-up Sleep Mode Timing Vrec VLIN_REC LIN 0.4VSUP 0.4 VSUP Dominant Level Dominant level IRQ t PROPWL TpropWL t WAKE Twake Figure 34. LIN Wake-up Stop Mode Timing 33912 66 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS VSUP VDD RST tNRTOUT tRST Figure 35. Power On Reset and Normal Request Timeout Timing tPSCLK CS tWSCLKH tLEAD tLAG SCLK tWSCLKL tSISU MOSI UNDEFINED D0 tSIH DON'T CARE D7 DON'T CARE tVALID tSODIS tSOEN MISO D0 DON'T CARE D7 Figure 36. SPI Timing Characteristics 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 67 MC33912BAC / MC34912BAC FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 33912 was designed and developed as a highly integrated and cost-effective solution for automotive and industrial applications. For automotive body electronics, the 33912 is well suited to perform relay control in applications like window lift, sunroof, etc. via LIN bus. Power switches are provided on the device configured as high side and low side outputs. Other ports are also provided, which include a current and voltage sense port, a Hall Sensor port supply, and four wake-up capable pins. An internal voltage regulator provides power to a MCU device. Also included in this device is a LIN physical layer, which communicates using a single wire. This enables this device to be compatible with 3-wire bus systems, where one wire is used for communication, one for battery, and one for ground. FUNCTIONAL PIN DESCRIPTION See Figure 1, 33912 Simplified Application Diagram, for a graphic representation of the various pins referred to in the following paragraphs. Also, see the pin diagram on page 50 for a description of the pin locations in the package. RECEIVER OUTPUT PIN (RXD) The RXD pin is a digital output. It is the receiver output of the LIN interface and reports the state of the bus voltage: RXD Low when LIN bus is dominant, RXD High when LIN bus is recessive. TRANSMITTER INPUT PIN (TXD) The TXD pin is a digital input. It is the transmitter input of the LIN interface and controls the state of the bus output (dominant when TXD is Low, recessive when TXD is High). This pin has an internal pull-up to force recessive state in case the input is left floating. MASTER IN SLAVE OUT PIN (MISO) The MISO pin sends data to an SPI-enabled MCU. It is a digital tri-state output used to shift serial data to the microcontroller. Data on this output pin changes on the negative edge of the SCLK. When CS is High, this pin will remain in high-impedance state. CHIP SELECT PIN (CS) CS is an active low digital input. It must remain low during a valid SPI communication and allow for several devices to be connected in the same SPI bus without contention. A rising edge on CS signals the end of the transmission and the moment the data shifted in is latched. A valid transmission must consist of 8 bits only. While in STOP mode, a low-to-high level transition on this pin will generate a wake-up condition for the 33912. ANALOG MULTIPLEXER PIN (ADOUT0) LIN BUS PIN (LIN) The LIN pin represents the single-wire bus transmitter and receiver. It is suited for automotive bus systems and is compliant to the LIN bus specification 2.0. The LIN interface is only active during Normal and Normal Request modes. SERIAL DATA CLOCK PIN (SCLK) The SCLK pin is the SPI clock input pin. MISO data changes on the negative transition of the SCLK. MOSI is sampled on the positive edge of the SCLK. MASTER OUT SLAVE IN PIN (MOSI) The MOSI digital pin receives SPI data from the MCU. This data input is sampled on the positive edge of SCLK. The ADOUT0 pin can be configured via the SPI to allow the MCU A/D converter to read the several inputs of the Analog Multiplexer, including the VSENSE, L1, L2, L3, L4 input voltages, and the internal junction temperature. CURRENT SENSE AMPLIFIER PIN (ADOUT1) The ADOUT1 pin is an analog interface to the MCU A/D converter. It allows the MCU to read the output of the current sense amplifier. PWM INPUT CONTROL PIN (PWMIN) This digital input can control the high sides and low sides drivers in Normal Request- and Normal mode. To enable PWM control, the MCU must perform a write operation to the High Side Control Register (HSCR) or the Low Side Control Register (LSCR). This pin has an internal 20 A current pull-up. 33912 68 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION RESET PIN (RST) This bidirectional pin is used to reset the MCU in case the 33912 detects a reset condition, or to inform the 33912 that the MCU has just been reset. After release of the RST pin, Normal Request mode is entered. The RST pin is an active low filtered input and output formed by a weak pull-up and a switchable pull-down structure which allows this pin to be shorted either to VDD or to GND during software development, without the risk of destroying the driver. INTERRUPT PIN (IRQ) The IRQ pin is a digital output used to signal events or faults to the MCU while in Normal and Normal Request mode or to signal a wake-up from Stop mode. This active low output will transition to high only after the interrupt is acknowledged by a SPI read of the respective status bits. WATCHDOG CONFIGURATION PIN (WDCONF) The WDCONF pin is the configuration pin for the internal watchdog. A resistor can be connected to this pin to configure the window watchdog period. When connected directly to ground, the watchdog will be disabled. When this pin is left open, the watchdog period is fixed to its lower precision internal default value (150 ms typical). GROUND CONNECTION PINS (AGND, PGND, LGND) The AGND, PGND and LGND pins are the Analog and Power ground pins. The AGND pin is the ground reference of the voltage regulator and the current sense module. The PGND and LGND pins are used for high current load return as in the relay-drivers and LIN interface pin. Note: PGND, AGND and LGND pins must be connected together. CURRENT SENSE AMPLIFIER INPUT PINS (ISENSEH AND ISENSEL) The ISENSEH and ISENSEL pins are the input pins of a ground compatible differential amplifier designed to be used to sense the voltage drop over a shunt resistor. The main purpose of this amplifier is to implement accurate current sensors. The gain of the differential amplifier can be set by SPI. LOW SIDE PINS (LS1 AND LS2) LS1 and LS2 are the low side driver outputs. Those outputs are short-circuit protected and include active clamp circuitry to drive inductive loads. Due to the energy clamp voltage on this pin, it can raise above the battery level when switched off. The switches are controlled through the SPI and can be configured to respond to a signal applied to the PWMIN input pin. Both low side switches are protected against overheating. DIGITAL/ANALOG PINS (L1, L2, L3 AND L4) The Lx pins are multi purpose inputs. They can be used as digital inputs, which can be sampled by reading the SPI and used for wake-up when 33912 is in low power mode or used as analog inputs for the analog multiplexer. When used to sense voltage outside the module, a 33 kohms series resistor must be used on each input. When used as wake-up inputs L1-L4 can be configured to operate in cyclic-sense mode. In this mode one of the high side switches is configured to be periodically turned on and sample the wake-up inputs. If a state change is detected between two cycles a wake-up is initiated. The 33912 can also wake-up from Stop or Sleep by a simple state change on L1-L4. When used as analog inputs, the voltage present on the Lx pins is scaled down by an selectable internal voltage divider and can be routed to the ADOUT0 output through the analog multiplexer. Note: If an Lx input is selected in the analog multiplexer, it will be disabled as a digital input and remains disabled in low power mode. No wake-up feature is available in that condition. When an Lx input is not selected in the analog multiplexer, the voltage divider is disconnected from that input. HIGH SIDE OUTPUT PINS (HS1 AND HS2) These two high side switches are able to drive loads such as relays or lamps. Their structures are connected to the VS2 supply pin. The pins are short-circuit protected and both outputs are also protected against overheating. HS1 and HS2 are controlled by SPI and can respond to a signal applied to the PWMIN input pin. HS1 and HS2 outputs can also be used during low-power mode for the cyclic-sense of the wake inputs. POWER SUPPLY PINS (VS1 AND VS2) Those are the battery level voltage supply pins. In an application, VS1 and VS2 pins must be protected against reverse battery connection and negative transient voltages with external components. These pins sustain standard automotive voltage conditions such as a load dump at 40 V. The high side switches (HS1 and HS2) are supplied by the VS2 pin. All other internal blocks are supplied by VS1 pin. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 69 MC33912BAC / MC34912BAC FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION VOLTAGE SENSE PIN (VSENSE) This input can be connected directly to the battery line. It is protected against battery reverse connection. The voltage present in this input is scaled down by an internal voltage divider, and can be routed to the ADOUT0 output pin and used by the MCU to read the battery voltage. The ESD structure on this pin allows for excursion up to +40 V and down to -27 V, allowing this pin to be connected directly to the battery line. It is strongly recommended to connect a 10 kohm resistor in series with this pin for protection purposes. HALL SENSOR SWITCHABLE SUPPLY PIN (HVDD) The HVDD pin needs to be connected to an external capacitor to stabilize the regulated output voltage. +5V MAIN REGULATOR OUTPUT PIN (VDD) An external capacitor has to be placed on the VDD pin to stabilize the regulated output voltage. The VDD pin is intended to supply a microcontroller. The pin is current limited against shorts to GND and over-temperature protected. During Stop mode, the voltage regulator does not operate with its full drive capabilities and the output current is limited. During Sleep mode, the regulator output is completely shut down. This pin provides a switchable supply for external hall sensors. While in Normal mode, this current limited output can be controlled through the SPI. 33912 70 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION MC33912 - Functional Block Diagram Integrated Supply Hall Sensor Supply Voltage Regulator HVDD VDD Analog Circuitry Wake-Up Window Watchdog Digital / Analog Input Voltage, Current & Temperature Sense MCU Interface and Output Control SPI Interface Reset & IRQ Logic LIN Interface / Control LS/HS - PWM Control High Side Drivers HS1 - HS2 Low Side Drivers LS1 - LS2 LIN Physical Layer Interface Analog Output 0/1 Integrated Supply Analog Circuitry MCU Interface and Output Control Drivers Figure 37. Functional Internal Block Diagram ANALOG CIRCUITRY MCU INTERFACE The 33912 is designed to operate under automotive operating conditions. A fully configurable window watchdog circuit will reset the connected MCU in case of an overflow. Two low power modes are available with several different wake-up sources to reactivate the device. Four analog / digital inputs can be sensed or used as the wake-up source. The device is capable of sensing the supply voltage (VSENSE), the internal chip temperature (CTEMP) as well as the motor current using an external sense resistor. The 33912 is providing its control and status information through a standard 8-Bit SPI interface. Critical system events such as Low- or High-voltage/Temperature conditions as well as over-current conditions in any of the driver stages can be reported to the connected MCU via IRQ or RST. Both Low Side and both High Side driver outputs can be controlled via the SPI register as well as the PWMIN input. The integrated LIN physical layer interface can be configured via SPI register and its communication is driven through the RXD and TXD device pins. All internal analog sources are multiplexed to the ADOUT 0 pin. The current sense analog signal is directly routed through ADOUT1. HIGH SIDE DRIVERS Two current and temperature protected High Side drivers with PWM capability are provided to drive small loads such as Status LED's or small lamps. Both Drivers can be configured for periodic sense during low power modes. LOW SIDE DRIVERS Two current and temperature protected Low Side drivers with PWM capability are provided to drive H-Bridge type relays for power motor applications VOLTAGE REGULATOR OUTPUTS Two independent voltage regulators are implemented on the 33912. The VDD main regulator output is designed to supply a MCU with a precise 5.0 V. The switchable HVDD output is dedicated to supply small peripherals as hall sensors. LIN PHYSICAL LAYER INTERFACE The 33912 provides a LIN 2.0 compatible LIN physical layer interface with selectable slew rate and various diagnostic features. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 71 MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES Introduction The 33912 offers three main operating modes: Normal (Run), Stop, and Sleep (Low Power). In Normal mode, the device is active and is operating under normal application conditions. The Stop and Sleep modes are low-power modes with wake-up capabilities. In Stop mode, the voltage regulator still supplies the MCU with VDD (limited current capability), while in Sleep mode the voltage regulator is turned off (VDD = 0 V). Wake-up from Stop mode is initiated by a wake-up interrupt. Wake-up from Sleep mode is done by a reset and the voltage regulator is turned back on. The selection of the different modes is controlled by the MOD1:2 bits in the Mode Control Register (MCR). Figure 38 describes how transitions are done between the different operating modes. Table 37 gives an overview of the operating modes. RESET MODE The 33912 enters the Reset mode after a power up. In this mode, the RST pin is low for 1ms (typical value). After this delay, it enters the Normal Request mode and the RST pin is driven high. The Reset mode is entered if a reset condition occurs (VDD low, watchdog trigger fail, after wake-up from Sleep mode, Normal Request mode timeout occurs). NORMAL REQUEST MODE This is a temporary mode automatically accessed by the device after the Reset mode, or after a wake-up from Stop mode. In Normal Request mode, the VDD regulator is ON, the RESET pin is High, and the LIN is operating in RX Only mode. As soon as the device enters in the Normal Request mode an internal timer is started for 150 ms (typical value). During these 150 ms, the MCU must configure the Timing Control Register (TIMCR) and the Mode Control Register (MCR) with MOD2 and MOD1 bits set = 0, to enter the Normal mode. If within the 150ms timeout, the MCU does not command the 33912 to Normal mode, it will enter in Reset mode. If the WDCONF pin is grounded in order to disable the watchdog function, it goes directly in Normal mode after the Reset mode. If the WDCONF pin is open, the 33912 stays typically for 150 ms in Normal Request before entering in Normal mode. NORMAL MODE In Normal mode, all 33912 functions are active and can be controlled by the SPI interface and the PWMIN pin. The VDD regulator is ON and delivers its full current capability. If an external resistor is connected between the WDCONF pin and the Ground, the window watchdog function will be enabled. The wake-up inputs (L1-L4) can be read as digital inputs or have its voltage routed through the analog-multiplexer. The LIN interface has slew rate and timing compatible with the LIN protocol specification 2.0. The LIN bus can transmit and receive information. The high side and low side switches are active and have PWM capability according to the SPI configuration. The interrupts are generated to report failures for VSUP over/under-voltage, thermal shutdown, or thermal shutdown prewarning on the main regulator. SLEEP MODE The Sleep mode is a low power mode. From Normal mode, the device enters into Sleep mode by sending one SPI command through the Mode Control Register (MCR). All blocks are in their lowest power consumption condition. Only some wake-up sources (wake-up inputs with or without cyclic sense, forced wake-up and LIN receiver) are active. The 5.0 V regulator is OFF. The internal low-power oscillator may be active if the IC is configured for cyclic-sense. In this condition, one of the high side switches is turned on periodically and the wake-up inputs are sampled. Wake-up from Sleep mode is similar to a power-up. The device goes in Reset mode except that the SPI will report the wake-up source and the BATFAIL flag is not set. STOP MODE The Stop mode is the second low power mode, but in this case the 5.0 V regulator is ON with limited current drive capability. The application MCU is always supplied while the 33912 is operating in Stop mode. The device can enter into Stop mode only by sending the SPI command. When the application is in this mode, it can wake-up from the 33912 side (for example: cyclic sense, force wake-up, LIN bus, wake inputs) or the MCU side (CS, RST pins). Wake-up from Stop mode will transition the 33912 to Normal Request mode and generates an interrupt except if the wake-up event is a low to high transition on the CS pin or comes from the RST pin. 33912 72 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES Normal Request Timeout Expired (t NRTOUT ) Normal Request timeout expired (NR TOUT) VVDD Low DD Low VDD High and Normal Request VVDDLow Low DD VVDD LOW (>t NRTOUT ) expired) Expired DD Low (>NRTOUT andand VSUV =0 VSUV =0 Wake-up Wake-Up (Reset) (Reset) Sleep Command SLEEP Command Sleep Stop STOPCommand Command Normal WD Failed WD failed Wake-Up (Interrupt) Wake-Up Interrupt Reset Reset Delay (t Delay VDD High and Reset RST) expired RST) (tExpired WD Disabled WD disabled Power Up WDtrigger Trigger WD Power Down Stop VDD VDD Low Low Legend WD: Watchdog Notes: WD Disabled: Watchdog disabled (WDCONF pin connected to GND) WD - meansisWatchdog WD Trigger: Watchdog triggered by SPI command WD means or Watchdog disabled (WDCONF terminal connected to GND) WD Failed: No disabled watchdog- trigger trigger occurs in closed window WD trigger - means Watchdog is triggered by SPI command Stop Command: Stop command sent via SPI WD failed - means no Watchdog trigger or trigger occurs in closed window Sleep Command: Sleep command sent via SPI STOP Command - means STOP command sent via SPI Wake-Up from Stop Mode: L1, L2, L3 or L4 state change, LIN bus wake-up, Periodic wake-up, CS rising edge wake-up or RST wake-up. SLEEP Command means SLEEP command via wake-up, SPI Wake-Up from Sleep Mode: L1,- L2, L3 or L4 state change,send LIN bus Periodic wake-up. Wake-Up - means L1 or L2 state change or LIN bus wake up or SS rising edge Figure 38. Operating Modes and Transitions 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 73 MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES Table 37. Operating Modes Overview Function VDD HVDD Reset Mode Normal Request Mode Full - Full (127) SPI Normal Mode Stop Mode Sleep Mode Full Stop - SPI - - - SPI/PWM(128) SPI/PWM - - HSx - SPI/PWM(128) SPI/PWM Note(129) Note(130) Analog Mux - SPI SPI - - Lx - Inputs Inputs Wake-up Wake-up Current Sense On On On - - LIN - Rx-Only LSx Full/Rx-Only Rx-Only/Wake-up Watchdog - 150 ms (typ.) timeout On(131)/Off VSENSE On On On Notes 127. 128. 129. 130. 131. Wake-up - - VDD - Operation can be enabled/controlled by the SPI. Operation can be controlled by the PWMIN input. HSx switches can be configured for cyclic sense operation in Stop mode. HSx switches can be configured for cyclic sense operation in Sleep mode. Windowing operation when enabled by an external resistor. INTERRUPTS High-voltage Interrupt: Interrupts are used to signal a microcontroller that a peripheral needs to be serviced. The interrupts which can be generated, change according to the operating mode. While in Normal and Normal Request modes, the 33912 signals through interrupts special conditions which may require a MCU software action. Interrupts are not generated until all pending wake-up sources are read in the Interrupt Source Register (ISR). While in Stop mode, interrupts are used to signal wake-up events. Sleep mode does not use interrupts. Wake-up is performed by powering-up the MCU. In Normal and Normal Request mode the wake-up source can be read by SPI. The interrupts are signaled to the MCU by a low logic level of the IRQ pin, which will remain low until the interrupt is acknowledged by a SPI read. The IRQ pin will then be driven high. Interrupts are only asserted while in Normal, Normal Request and Stop mode. Interrupts are not generated while the RST pin is low. The following is a list of the interrupt sources in Normal and Normal Request modes. Some of these can be masked by writing to the SPI - Interrupt Mask Register (IMR). Signals when the supply line (VS1) voltage increases above the VSOV threshold (VSOV). Low-voltage Interrupt: Signals when the supply line (VS1) voltage drops below the VSUV threshold (VSUV). Over-temperature Prewarning: Signals when the 33912 temperature has reached the preshutdown warning threshold. It is used to warn the MCU that an over-temperature shutdown in the main 5.0 V regulator is imminent. LIN Over-current Shutdown / Over-temperature Shutdown / TXD Stuck At Dominant / RXD Short-circuit: These signal fault conditions within the LIN interface will cause the LIN driver to be disabled, except for the LIN overcurrent condition. In order to restart operation, the fault must be removed and must be acknowledged by reading the SPI. The LINOC bit functionality in the LIN Status Register (LINSR) is to indicate an LIN over-current has occurred and the driver remains enabled. High Side Over-temperature Shutdown: Signals a shutdown in the high side outputs. Low Side Over-temperature Shutdown: Signals a shutdown in the low side outputs. RESET To reset a MCU the 33912 drives the RST pin low for the time the reset condition lasts. 33912 74 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES After the reset source is removed, the state machine will drive the RST output low for at least 1.0 ms (typical value) before driving it high. In the 33912, four main reset sources exist: 5.0 V Regulator Low-voltage-Reset (VRSTTH) The 5.0 V regulator output VDD is continuously monitored against brown outs. If the supply monitor detects that the voltage at the VDD pin has dropped below the reset threshold VRSTTH the 33912 will issue a reset. In case of overtemperature, the voltage regulator will be disabled and the voltage monitoring will issue a VDDOT Flag independently of the VDD voltage. Window Watchdog Overflow If the watchdog counter is not properly serviced while its window is open, the 33912 will detect an MCU software runaway and will reset the microcontroller. Wake-up From Sleep Mode During Sleep mode, the 5V regulator is not active, hence all wake-up requests from Sleep mode require a power-up/ reset sequence. External Reset The 33912 has a bidirectional reset pin which drives the device to a safe state (same as Reset mode) for as long as this pin is held low. The RST pin must be held low long enough to pass the internal glitch filter and get recognized by the internal reset circuit. This functionality is also active in Stop mode. After the RST pin is released, there is no extra t RST to be considered. WAKE-UP CAPABILITIES Once entered into one of the low-power modes (Sleep or Stop) only wake-up sources can bring the device into Normal mode operation. In Stop mode, a wake-up is signaled to the MCU as an interrupt, while in Sleep mode the wake-up is performed by activating the 5.0 V regulator and resetting the MCU. In both cases the MCU can detect the wake-up source by accessing the SPI registers. There is no specific SPI register bit to signal a CS wake-up or external reset. If necessary this condition is detected by excluding all other possible wake-up sources. Wake-up from Wake-up inputs (L1-L4) with cyclic sense disabled The wake-up lines are dedicated to sense state changes of external switches and wake-up the MCU (in Sleep or Stop mode). In order to select and activate direct wake-up from Lx inputs, the Wake-up Control Register (WUCR) must be configured with appropriate LxWE inputs enabled or disabled. The wake-up input's state is read through the Wake-up Status Register (WUSR). Lx inputs are also used to perform cyclic-sense wake-up. Note: Selecting an Lx input in the analog multiplexer before entering low power mode will disable the wake-up capability of the Lx input Wake-up from Wake-up inputs (L1-L4) with cyclic sense timer enabled The SBCLIN can wake-up at the end of a cyclic sense period if on one of the four wake-up input lines (L1-L4) a state change occurs. The HSx switch is activated in Sleep or Stop modes from an internal timer. Cyclic sense and force wakeup are exclusive. If cyclic sense is enabled, the force wakeup can not be enabled. In order to select and activate the cyclic sense wake-up from Lx inputs, before entering in low power modes (Stop or Sleep modes), the following SPI set-up has to be performed: In WUCR: select the Lx input to WU-enable. In HSCR: enable the desired HSx. * In TIMCR: select the CS/WD bit and determine the cyclic sense period with CYSTx bits. * Perform Goto Sleep/Stop command. Forced Wake-up The 33912 can wake-up automatically after a predetermined time spent in Sleep or Stop mode. Cyclic sense and Forced wake-up are exclusive. If Forced wake-up is enabled, the Cyclic Sense can not be enabled. To determine the wake-up period, the following SPI set-up has to be sent before entering in low power modes: * In TIMCR: select the CS/WD bit and determine the low power mode period with CYSTx bits. * In HSCR: all HSx bits must be disabled. CS Wake-up While in Stop mode, a rising edge on the CS will cause a wake-up. The CS wake-up does not generate an interrupt, and is not reported on SPI. LIN Wake-up While in the low-power mode, the 33912 monitors the activity on the LIN bus. A dominant pulse larger than t PROPWL followed by a dominant to recessive transition will cause a LIN wake-up. This behavior protects the system from a short to ground bus condition. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 75 MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES RST Wake-up While in Stop mode, the 33912 can wake-up when the RST pin is held low long enough to pass the internal glitch filter. Then, the 33912 will change to Normal Request or Normal modes depending on the WDCONF pin configuration. The RST wake-up does not generate an interrupt and is not reported via SPI. From Stop mode, the following wake-up events can be configured: * Wake-up from Lx inputs without cyclic sense * Cyclic sense wake-up inputs * Force wake-up * CS wake-up * LIN wake-up * RST wake-up From Sleep mode, the following wake-up events can be configured: * Wake-up from Lx inputs without cyclic sense * Cyclic sense wake-up inputs * Force wake-up * LIN wake-up WINDOW WATCHDOG The 33912 includes a configurable window watchdog which is active in Normal mode. The watchdog can be configured by an external resistor connected to the WDCONF pin. The resistor is used to achieve higher precision in the timebase used for the watchdog. SPI clears are performed by writing through the SPI in the MOD bits of the Mode Control Register (MCR). During the first half of the SPI timeout, watchdog clears are not allowed, but after the first half of the SPI timeout window, the clear operation opens. If a clear operation is performed outside the window, the 33912 will reset the MCU, in the same way as when the watchdog overflows. WINDOW CLOSED NO WATCHDOG CLEAR ALLOWED WD TIMING X 50% WINDOW OPEN FOR WATCHDOG CLEAR To disable the watchdog function in Normal mode the user must connect the WDCONF pin to ground. This measure effectively disables Normal Request mode. The WDOFF bit in the Watchdog Status Register (WDSR) will be set. This condition is only detected during Reset mode. If neither a resistor nor a connection to ground is detected, the watchdog falls back to the internal lower precision timebase of 150 ms (typ.) and signals the faulty condition through the Watchdog Status Register (WDSR). The watchdog timebase can be further divided by a prescaler which can be configured by the Timing Control Register (TIMCR). During Normal Request mode, the window watchdog is not active but there is a 150 ms (typ.) timeout for leaving the Normal Request mode. In case of a timeout, the 33912 will enter into Reset mode, resetting the microcontroller before entering again into Normal Request mode. HIGH SIDE OUTPUT PINS HS1 AND HS2 These outputs are two high side drivers intended to drive small resistive loads or LEDs incorporating the following features: * PWM capability (software maskable) * Open load detection * Current limitation * Over-temperature shutdown (with maskable interrupt) * High-voltage shutdown (software maskable) * Cyclic sense The high side switches are controlled by the bits HS1:2 in the High Side Control Register (HSCR). PWM Capability (direct access) Each high side driver offers additional (to the SPI control) direct control via the PWMIN pin. If both the bits HS1 and PWMHS1 are set in the High Side Control Register (HSCR), then the HS1 driver is turned on if the PWMIN pin is high and turned of if the PWMIN pin is low. This applies to HS2 configuring HS2 and PWMHS2 bits. WD TIMING X 50% WD PERIOD (tPWD) WD TIMING SELECTED BY REGISTER ON WDCONF PIN Figure 39. Window Watchdog Operation 33912 76 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES Interrupt Control Module MOD1:2 HSx HSxOP VDD VDD PWMIN High-Side Interrupt High Voltage Shutdown HVSE PWMHSx VS2 on/off Control Status HSxCL High Side - Driver charge pump open load detection current limitation Over-temperture shutdown (interrupt maskable) high voltage shutdown (maskable) Cyclic Sense HSx Wakeup Module Figure 40. High Side Drivers HS1 and HS2 Open Load Detection Each high side driver signals an open load condition if the current through the high side is below the open load current threshold. The open load condition is indicated with the bits HS1OP and HS2OP in the High Side Status Register (HSSR). Current Limitation Each high side driver has an output current limitation. In combination with the over-temperature shutdown the highside drivers are protected against over-current and shortcircuit failures. When the driver operates in the current limitation area, it is indicated with the bits HS1CL and HS2CL in the HSSR. Note: If the driver is operating in current limitation mode, excessive power might be dissipated. Over-temperature Protection (HS Interrupt) Both high side drivers are protected against overtemperature. In case of an over-temperature condition both high side drivers are shut down and the event is latched in the Interrupt Control Module. The shutdown is indicated as HS Interrupt in the Interrupt Source Register (ISR). A thermal shutdown of the high side drivers is indicated by setting all HSxOP and HSxCL bits simultaneously. If the bit HSM is set in the Interrupt Mask Register (IMR), then an interrupt (IRQ) is generated. A write to the High Side Control Register (HSCR), when the over-temperature condition is gone, will re-enable the high side drivers. High-voltage Shutdown In case of a high voltage condition and if the high voltage shutdown is enabled (bit HVSE in the Mode Control Register (MCR) is set) both high side drivers are shut down. A write to the High Side Control Register (HSCR), when the high voltage condition is gone, will re-enable the high side drivers. Sleep And Stop Mode The high side drivers can be enabled to operate in Sleep and Stop mode for cyclic sensing. Also see Table 37. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 77 MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES LOW SIDE OUTPUT PINS LS1 AND LS2 These outputs are two low side drivers intended to drive relays incorporating the following features: * PWM capability (software maskable) * Open load detection * Current limitation * Over-temperature shutdown (with maskable interrupt) * Active clamp (for driving relays) * High-voltage shutdown (software maskable) The low side switches are controlled by the bit LS1:2 in the Low Side Control Register (LSCR). HVSE To protect the device against over-voltage when an inductive load (relay) is turned off. An active clamp will reenable the low side FET if the voltage on the LS1 or LS2 pin exceeds a certain level. PWM Capability (direct access) Each low side driver offers additional (to the SPI control) direct control via the PWMIN pin. If both the bits LS1 and PWMLS1 are set in the Low Side Control Register (LSCR), then the LS1 driver is turned on if the PWMIN pin is high and turned off if the PWMIN pin is low. The same applies to the LS2 and PWMLS2 bits for the LS2 driver. VDD Interrupt Control Module VDD MOD1:2 LSx LSxOP LSxCL PWMLSx Low Side Interrupt High-voltage Shutdown PWMIN active clamp LSx on/off Control Status Low Side Driver (active clamp) Open-load Detection Current Limitation Over-temperture Shutdown (interrupt maskable) High-voltage shutdown (maskable) PGND Figure 41. Low Side Drivers LS1 and LS2 Open Load Detection Each low side driver signals an open load condition if the current through the low side is below the open load current threshold. The open load condition is indicated with the bit LS1OP and LS2OP in the Low Side Status Register (LSSR). Current Limitation Each low side driver has a current limitation. In combination with the over-temperature shutdown the low side drivers are protected against over-current and shortcircuit failures. When the drivers operate in current limitation, this is indicated with the bits LS1CL and LS2CL in the LSSR. Note: If the drivers are operating in current limitation mode excessive power might be dissipated. low side drivers are shut down and the event is latched in the Interrupt Control Module. The shutdown is indicated as an LS Interrupt in the Interrupt Source Register (ISR). If the bit LSM is set in the Interrupt Mask Register (IMR) than an Interrupt (IRQ) is generated. A write to the Low Side Control Register (LSCR), when the over-temperature condition is gone, will re-enable the low side drivers. High-voltage Shutdown In case of a high-voltage condition and if the high-voltage shutdown is enabed (bit HVSE in the Mode Control Register (MCR) is set) both low sides drivers are shut down. A write to the Low Side Control Register (LSCR), when the high-voltage condition is gone, will re-enable the low side drivers. Over-temperature Protection (LS Interrupt) Sleep And Stop Mode Both low side drivers are protected against overtemperature. In case of an over-temperature condition both The low side drivers are disabled in Sleep and Stop mode. Also see Table 37. 33912 78 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES LIN PHYSICAL LAYER The LIN bus pin provides a physical layer for single-wire communication in automotive applications. The LIN physical layer is designed to meet the LIN physical layer specification and has the following features: * LIN physical layer 2.0 compliant * Slew rate selection * Over-current shutdown * Over-temperature shutdown * LIN pull-up disable in Stop and Sleep modes * Advanced diagnostics * LIN dominant voltage level selection The LIN driver is a low side MOSFET with over-current and thermal shutdown. An internal pull-up resistor with a serial diode structure is integrated, so no external pull-up components are required for the application in a slave node. The fall time from dominant to recessive and the rise time from recessive to dominant is controlled. The symmetry between both slopes is guaranteed. LIN Pin The LIN pin offers a high susceptibility immunity level from external disturbance, guaranteeing communication during external disturbance. INTERRUPT CONTROL MODULE High-voltage Shutdown High Side Interrupt WAKE-UP MODULE LIN Wake-up MOD1:2 LSR0:1 LINPE LDVS RXONLY RXSHORT VS1 LIN - DRIVER Slope and Slew Rate Control Over-current Shutdown (interrupt maskable) Over-temperature Shutdown (interrupt maskable) TXDOM LINOT LINOC 30K LIN TXD SLOPE CONTROL WAKE-UP FILTER LGND RXD RECEIVER Figure 42. LIN Interface Slew Rate Selection LIN Pull-up Disable In Stop And Sleep Modes The slew rate can be selected for optimized operation at 10.4 and 20 kBit/s as well as a fast baud rate for test and programming. The slew rate can be adapted with the bits LSR 1:0 in the LIN Control Register (LINCR). The initial slew rate is optimized for 20 kBit/s. In cases of a LIN bus short to GND or LIN bus leakage during low-power mode, the internal pull-up resistor on the LIN pin can be disconnected by clearing the LINPE bit in the Mode Control Register (MCR). The LINPE bit also changes the Bus wake-up threshold (VBUSWU). This feature will reduce the current consumption in STOP and SLEEP modes. It also improves performance and safe operation. 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 79 MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS OPERATIONAL MODES Current Limit (LIN Interrupt) The output low side FET is protected against over-current conditions. In case of an over-current condition (e.g. LIN bus short to VBAT), the transmitter will not be shut down. The bit LINOC in the LIN Status Register (LINSR) is set. If the LINM bit is set in the Interrupt Mask Register (IMR), an Interrupt IRQ will be generated. The transmitter is automatically re-enabled once TXD is high. A read of the LIN Status Register (LINSR) with the TXD pin at 5.0 V will clear the bit TXDOM. LIN Dominant Voltage Level Selection The LIN dominant voltage level can be selected by the bit LDVS in the LIN Control Register (LINCR). Over-temperature Shutdown (LIN Interrupt) The output low side FET is protected against overtemperature conditions. In case of an over-temperature condition, the transmitter will be shut down and the LINOT bit in the LIN Status Register (LINSR) is set. If the LINM bit is set in the Interrupt Mask Register (IMR), an Interrupt IRQ will be generated. The transmitter is automatically re-enabled once the condition is gone and TXD is high. A read of the LIN Status Register (LINSR) with the TXD pin high, will re-enable the transmitter. RXD Short-circuit Detection (LIN Interrupt) The LIN transceiver has a short-circuit detection for the RXD output pin. In case of an short-circuit condition, either 5V or Ground, the RXSHORT bit in the LIN Status Register (LINSR) is set and the transmitter is shut down. If the LINM bit is set in the Interrupt Mask Register (IMR), an Interrupt IRQ will be generated. The transmitter is automatically re-enabled once the condition is gone (transition on RXD) and TXD is high. A read of the LIN Status Register (LINSR) without the RXD pin short-circuit condition will clear the bit RXSHORT. TXD Dominant Detection (LIN Interrupt) The LIN transceiver monitors the TXD input pin to detect a stuck in dominant (0V) condition. In case of a stuck condition (TXD pin 0 V for more than 1 second (typ.)), the transmitter is shut down and the TXDOM bit in the LIN Status Register (LINSR) is set. If the LINM bit is set in the IMR, an Interrupt IRQ will be generated. LIN Receiver Operation Only While in Normal mode, the activation of the RXONLY bit disables the LIN TXD driver. If case of a LIN error condition, this bit is automatically set. If a low-power mode is selected with this bit set, the LIN wake-up functionality is disabled, then in STOP mode, the RXD pin will reflect the state of the LIN bus. STOP Mode And Wake-up Feature During Stop mode operation, the transmitter of the physical layer is disabled. If the LIN-PU bit was set in the Stop mode sequence, the internal pull-up resistor is disconnected from VSUP and a small current source keeps the LIN pin in the recessive state. The receiver is still active and able to detect wake-up events on the LIN bus line. A dominant level longer than TPROPWL followed by a rising edge will generate a wake-up interrupt, and will be reported in the Interrupt Source Register (ISR). Also see Figure 34. SLEEP Mode And Wake-up Feature During Sleep mode operation, the transmitter of the physical layer is disabled. If the LIN-PU bit was set in the Sleep mode sequence, the internal pull-up resistor is disconnected from VSUP and a small current source keeps the LIN pin in recessive state. The receiver must be active to detect wake-up events on the LIN bus line. A dominant level longer than TPROPWL followed by a rising edge will generate a system wake-up (Reset), and will be reported in the Interrupt Source Register (ISR). Also see Figure 33. 33912 80 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS LOGIC COMMANDS AND REGISTERS 33912 SPI INTERFACE AND CONFIGURATION * MISO -- Master-In Slave-Out * SCLK-- Serial Clock A complete data transfer via the SPI consists of 1 byte. The master sends 4 bits of address (A3:A0) + 4 bits of control information (C3:C0) and the slave replies with 4 system status bits (VMS,LINS,HSS,LSS) + 4 bits of status information (S3:S0). The serial peripheral interface creates the communication link between a microcontroller (master) and the 33912. The interface consists of four pins (see Figure 43): * CS -- Chip Select * MOSI -- Master-Out Slave-In CS Register Write Data MOSI A3 A2 A1 A0 C3 C2 C1 C0 S1 S0 Register Read Data MISO VMS LINS HSS LSS S3 S2 SCLK Read Data Latch Rising Edge of SCLK Change MISO/MISO Output Write Data Latch Falling Edge of SCLK Sample MISO/MISO Input Figure 43. SPI Protocol During the inactive phase of the CS (HIGH), the new data The rising edge of the Chip Select CS indicates the end of transfer is prepared. the transfer and latches the write data (MOSI) into the register. The CS high forces MISO to the high impedance The falling edge of the CS indicates the start of a new data state. transfer and puts the MISO in the low-impedance state and Register reset values are described along with the reset latches the analog status data (Register read data). condition. Reset condition is the condition causing the bit to With the rising edge of the SPI clock (SCLK), the data is be set to its reset value. The main reset conditions are: moved to MISO/MOSI pins. With the falling edge of the SPI - Power-On Reset (POR): the level at which the logic is clock (SCLK), the data is sampled by the receiver. reset and BATFAIL flag sets. The data transfer is only valid if exactly 8 sample clock - Reset mode edges are present during the active (low) phase of CS. - Reset done by the RST pin (ext_reset) 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 81 MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS SPI REGISTER OVERVIEW Table 38. System Status Register Adress(A3:A0) $0 - $F BIT Register Name / Read / Write Information SYSSR - System Status Register R 7 6 5 4 VMS LINS HSS LSS Table 39 summarizes the SPI Register content for Control Information (C3:C0)=W and status information (S3:S0) = R. Table 39. SPI Register Overview Adress(A3:A0) BIT Register Name / Read / Write Information 3 2 1 0 MCR - Mode Control Register W HVSE LINPE MOD2 MOD1 VSR - Voltage Status Register R VSOV VSUV VDDOT BATFAIL VSR - Voltage Status Register R VSOV VSUV VDDOT BATFAIL WUCR - Wake-up Control Register W L4WE L3WE L2WE L1WE WUSR - Wake-up Status Register R L4 L3 L2 L1 WUSR - Wake-up Status Register R L4 L3 L2 L1 LINCR - LIN Control Register W LDVS RXONLY LSR1 LSR0 LINSR - LIN Status Register R RXSHORT TXDOM LINOT LINOC LINSR - LIN Status Register R RXSHORT TXDOM LINOT LINOC HSCR - High Side Control Register W PWMHS2 PWMHS1 HS2 HS1 HSSR - High Side Status Register R HS2OP HS2CL HS1OP HS1CL HSSR - High Side Status Register R HS2OP HS2CL HS1OP HS1CL LSCR - Low Side Control Register W PWMLS2 PWMLS1 LS2 LS1 LSSR - Low Side Status Register R LS2OP LS2CL LS1OP LS1CL LSSR - Low Side Status Register R LS2OP LS2CL LS1OP LS1CL TIMCR - Timing Control Register W CS/WD WD2 WD1 WD0 CYST2 CYST1 CYST0 WDSR - Watchdog Status Register R WDTO WDERR WDOFF WDWO $B WDSR - Watchdog Status Register R WDTO WDERR WDOFF WDWO $C AMUXCR - Analog Multiplexer Control Register W LXDS MX2 MX1 MX0 $D CFR - Configuration Register W HVDD CYSX8 CSAZ CSGS IMR - Interrupt Mask Register W HSM LSM LINM VMM ISR - Interrupt Source Register R ISR3 ISR2 ISR1 ISR0 ISR - Interrupt Source Register R ISR3 ISR2 ISR1 ISR0 $0 $1 $2 $3 $4 $5 $6 $7 $8 $9 $A $E $F 33912 82 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS REGISTER DEFINITIONS HS1CL System Status Register - SYSSR HS1OP The System Status Register (SYSSR) is always transferred with every SPI transmission and gives a quick system status overview. It summarizes the status of the Voltage Status Register (VSR), LIN Status Register (LINSR), High Side Status Register (HSSR), and the Low Side Status Register (LSSR). HSS HS2CL HS2OP Figure 46. High Side Status LSS - Low Side Switch Status This read-only bit indicates that one or more bits in the LSSR are set. Table 40. System Status Register Read S7 S6 S5 S4 VMS LINS HSS LSS 1 = Low Side Status bit set 0 = None VMS - Voltage Monitor Status LS1CL This read-only bit indicates that one or more bits in the VSR are set. 1 = Voltage Monitor bit set 0 = None LS1OP LSS LS2CL LS2OP Figure 47. Low Side Status BATFAIL VDDOT VSUV Mode Control Register - MCR VMS VSOV Figure 44. Voltage Monitor Status The Mode Control Register (MCR) allows switching between the operation modes and to configure the 33912. Writing the MCR will return the VSR. Table 41. Mode Control Register - $0 C3 C2 C1 C0 Write HVSE LINPE MOD2 MOD1 Reset Value 1 1 - - Reset Condition POR POR - - LINS - LIN Status This read-only bit indicates that one or more bits in the LINSR are set. 1 = LIN Status bit set 0 = None HVSE - High-voltage Shutdown Enable LINOC LINOT TXDOM LINS RXSHORT Figure 45. LIN Status This write-only bit enables/disables automatic shutdown of the high side and the low side drivers during a high-voltage VSOV condition. 1 = automatic shutdown enabled 0 = automatic shutdown disabled HSS - High Side Switch Status LINPE - LIN pull-up enable. This read-only bit indicates that one or more bits in the HSSR are set. 1 = High Side Status bit set 0 = None This write-only bit enables/disables the 30 k LIN pull-up resistor in STOP and SLEEP modes. This bit also controls the LIN bus wake-up threshold. 1 = LIN pull-up resistor enabled 0 = LIN pull-up resistor disabled 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 83 MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS MOD2, MOD1 - Mode Control Bits These write-only bits select the operating mode and allow clearing the watchdog in accordance with Table 82 Mode Control Bits. 1 = POR Reset has occurred 0 = POR Reset has not occurred Wake-up Control Register - WUCR This register is used to control the digital wake-up inputs. Writing the WUCR will return the Wake-up Status Register (WUSR). Table 42. Mode Control Bits MOD2 MOD1 Description 0 0 Normal Mode 0 1 Stop Mode 1 0 Sleep Mode 1 1 Normal Mode + Watchdog Clear Table 44. Wake-up Control Register - $2 C3 C2 C1 C0 Write L4WE L3WE L2WE L1WE Reset Value 1 1 1 1 Voltage Status Register - VSR Returns the status of the several voltage monitors. This register is also returned when writing to the Mode Control Register (MCR). Reset Condition POR, Reset mode or ext_reset Table 43. Voltage Status Register - $0/$1 Read S3 S2 S1 S0 VSOV VSUV VDDOT BATFAIL VSOV - VSUP Over-voltage This read-only bit indicates an over-voltage condition on the VS1 pin. 1 = Over-voltage condition. 0 = Normal condition. VSUV - VSUP Under-Voltage This read-only bit indicates an under-voltage condition on the VS1 pin. 1 = Under-voltage condition. 0 = Normal condition. VDDOT - Main Voltage Regulator Over-temperature Warning This read-only bit indicates that the main voltage regulator temperature reached the Over-temperature Prewarning Threshold. 1 = Over-temperature Prewarning 0 = Normal BATFAIL - Battery Fail Flag. This read-only bit is set during power-up and indicates that the 33912 had a Power-On-Reset (POR). Any access to the MCR or VSR will clear the BATFAIL flag. LxWE - Wake-up Input x Enable This write-only bit enables/disables which Lx inputs are enabled. In Stop and Sleep mode the LxWE bit determines which wake inputs are active for wake-up. If one of the Lx inputs is selected on the analog multiplexer, the corresponding LxWE is masked to 0. 1 = Wake-Up Input x enabled. 0 = Wake-Up Input x disabled. Wake-up Status Register - WUSR This register is used to monitor the digital wake-up inputs and is also returned when writing to the WUCR. Table 45. Wake-up Status Register - $2/$3 Read S3 S2 S1 S0 L4 L3 L2 L1 Lx - Wake-up input x This read-only bit indicates the status of the corresponding Lx input. If the Lx input is not enabled, then the according Wake-Up status will return 0. After a wake-up from Stop or Sleep mode these bits also allow to determine which input has caused the wake-up, by first reading the Interrupt Status Register (ISR) and then reading the WUSR. 1 = Lx Wake-up. 0 = Lx Wake-up disabled or selected as analog input. 33912 84 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS LIN Control Register - LINCR LIN Status Register - LINSR This register controls the LIN physical interface block. Writing the LIN Control Register (LINCR) returns the LIN Status Register (LINSR). This register returns the status of the LIN physical interface block and is also returned when writing to the LINCR. Table 46. LIN Control Register - $4 Table 48. LIN Status Register - $4/$5 C3 C2 C1 C0 Write LDVS RXONLY LSR1 LSR0 Reset Value 0 0 0 0 Reset Condition POR, Reset mode or ext_reset POR, Reset mode, ext_reset or LIN failure gone* POR * LIN failure gone: if LIN failure (over-temp, TXD/RXD short) was set, the flag resets automatically when the failure is gone. LDVS - LIN Dominant Voltage Select This write-only bit controls the LIN Dominant voltage: 1 = LIN Dominant Voltage = VLIN_DOM_1 (1.7V typ) 0 = LIN Dominant Voltage = VLIN_DOM_0 (1.1V typ) RXONLY - LIN Receiver Operation Only This write-only bit controls the behavior of the LIN transmitter. In Normal mode, the activation of the RXONLY bit disables the LIN transmitter. In case of a LIN error condition, this bit is automatically set. In Stop mode this bit disables the LIN wake-up functionality, and the RXD pin will reflect the state of the LIN bus. 1 = only LIN receiver active (Normal mode) or LIN wakeup disabled (Stop mode). 0 = LIN fully enabled. LSRx - LIN Slew-Rate This write-only bit controls the LIN driver slew-rate in accordance with Table 47. Table 47. LIN Slew-Rate Control LSR1 LSR0 Description 0 0 Normal Slew Rate (up to 20kb/s) 0 1 Slow Slew Rate (up to 10kb/s) 1 0 Fast Slew Rate (up to 100kb/s) 1 1 Reserved Read S3 S2 S1 S0 RXSHORT TXDOM LINOT LINOC RXSHORT - RXD Pin Short-circuit This read-only bit indicates a short-circuit condition on the RXD pin (shorted either to 5.0 V or to Ground). The shortcircuit delay must be a worst case of 8s to be detected and to shut down the driver. To clear this bit, it must be read after the condition is gone (transition detected on RXD pin). The LIN driver is automatically re-enabled once the condition is gone. 1 = RXD short-circuit condition. 0 = None. TXDOM - TXD Permanent Dominant This read-only bit signals the detection of a TXD pin stuck at dominant (Ground) condition and the resultant shutdown in the LIN transmitter. This condition is detected after the TXD pin remains in dominant state for more than 1 second (typical value). To clear this bit, it must be read after TXD has gone high. The LIN driver is automatically re-enabled once TXD goes High. 1 = TXD stuck at dominant fault detected. 0 = None. LINOT - LIN Driver Over-temperature Shutdown This read-only bit signals that the LIN transceiver was shutdown due to over-temperature. The transmitter is automatically re-enabled after the over-temperature condition is gone and TXD is high. The LINOT bit is cleared after SPI read once the condition is gone. 1 = LIN over-temperature shutdown 0 = None LINOC - LIN Driver Over-Current Shutdown This read-only bit signals an over-current condition occurred on the LIN pin. The LIN driver is not shut down but an IRQ is generated. To clear this bit, it must be read after the condition is gone. 1 = LIN over-current shutdown 0 = None 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 85 MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS High Side Control Register - HSCR Low Side Control Register - LSCR This register controls the operation of the high side drivers. Writing to this register returns the High Side Status Register (HSSR). This register controls the operation of the low side drivers. Writing the Low Side Control Register (LSCR) will also return the Low Side Status Register (LSSR). Table 49. High Side Control Register - $6 Table 51. Low Side Control Register - $8 C3 C2 C1 C0 Write PWMHS2 PWMHS1 HS2 HS1 Reset Value 0 0 0 0 Reset Condition POR, Reset mode, ext_reset, HSx over-temp or (VSOV & HVSE) POR C3 C2 C1 C0 Write PWMLS2 PWMLS1 LS2 LS1 Reset Value 0 0 0 0 Reset Condition POR, Reset mode, ext_reset, LSx over-temp or (VSOV & HVSE) POR PWMHSx - PWM Input Control Enable. PWMLx - PWM input control enable. This write-only bit enables/disables the PWMIN input pin to control the respective high side switch. The corresponding high side switch must be enabled (HSx bit). 1 = PWMIN input controls HSx output. 0 = HSx is controlled only by SPI. This write-only bit enables/disables the PWMIN input pin to control the respective low side switch. The corresponding low side switch must be enabled (LSx bit). 1 = PWMIN input controls LSx. 0 = LSx is controlled only by SPI. HSx - HSx Switch Control. LSx - LSx switch control. This write-only bit enables/disables the corresponding high side switch. 1 = HSx switch on. 0 = HSx switch off. This write-only bit enables/disables the corresponding low side switch. 1 = LSx switch on. 0 = LSx switch off. High Side Status Register - HSSR Low Side Status Register - LSSR This register returns the status of the high side switches and is also returned when writing to the HSCR. This register returns the status of the low side switches and is also returned when writing to the LSCR. Table 50. High Side Status Register - $6/$7 Read S3 S2 S1 S0 HS2OP HS2CL HS1OP HS1CL Table 52. Low Side Status Register - $8/$9 Read C3 C2 C1 C0 LS2OP LS2CL LS1OP LS1CL High Side Thermal Shutdown Low Side Thermal Shutdown A thermal shutdown of the high side drivers is indicated by setting all HSxOP and HSxCL bits simultaneously. A thermal shutdown of the low side drivers is indicated by setting all LSxOP and LSxCL bits simultaneously. HSxOP - High Side Switch Open-Load Detection LSxOP - Low Side Switch Open-Load Detection This read-only bit signals that the high side switches are conducting current below a certain threshold indicating possible load disconnection. 1 = HSx Open Load detected (or thermal shutdown) 0 = Normal This read-only bit signals that the low side switches are conducting current below a certain threshold indicating possible load disconnection. 1 = LSx Open Load detected (or thermal shutdown) 0 = Normal HSxCL - High Side Current Limitation LSxCL - Low Side Current Limitation This read-only bit indicates that the respective high side switch is operating in current limitation mode. 1 = HSx in current limitation (or thermal shutdown) 0 = Normal This read-only bit indicates that the respective low side switch is operating in current limitation mode. 1 = LSx in current limitation (or thermal shutdown) 0 = Normal 33912 86 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS Timing Control Register - TIMCR This register is a double purpose register which allows to configure the watchdog and the cyclic sense periods. Writing to the Timing Control Register (TIMCR) will also return the Watchdog Status Register (WDSR). Table 53. Timing Control Register - $A This option is only active if one of the high side switches is enabled when entering in Stop or Sleep mode. Otherwise a timed wake-up is performed after the period shown in Table 55. Table 55. Cyclic Sense Interval CYSX8(132) CYST2 CYST1 CYST0 Interval X 0 0 0 No cyclic sense 0 0 0 1 20 ms 0 0 1 0 40 ms 0 0 1 1 60 ms 0 1 0 0 80 ms 0 1 0 1 100 ms 0 1 1 0 120 ms 0 1 1 1 140 ms CS/WD - Cyclic Sense or Watchdog prescaler select 1 0 0 1 160 ms This write-only bit selects which prescaler is being written to, the Cyclic Sense prescaler or the Watchdog prescaler. 1 = Cyclic Sense Prescaler selected 0 = Watchdog Prescaler select 1 0 1 0 320 ms 1 0 1 1 480 ms 1 1 0 0 640 ms 1 1 0 1 800 ms 1 1 1 0 960 ms 1 1 1 1 1120 ms C3 Write C2 C1 C0 WD2 WD1 WD0 CYST2 CYST1 CYST0 CS/WD Reset Value - Reset Condition 0 0 - 0 POR WDx - Watchdog Prescaler This write-only bits selects the divider for the watchdog prescaler and therefore selects the watchdog period in accordance with Table 54. This configuration is valid only if windowing watchdog is active. Table 54. Watchdog Prescaler WD2 WD1 WD0 Prescaler Divider 0 0 0 1 0 0 1 2 0 1 0 4 0 1 1 6 1 0 0 8 1 0 1 10 1 1 0 12 1 1 1 14 CYSTx - Cyclic Sense Period Prescaler Select This write-only bits selects the interval for the wake-up cyclic sensing together with the bit CYSX8 in the Configuration Register (CFR) (see Configuration Register CFR). Notes 132. bit CYSX8 is located in Configuration Register (CFR) Watchdog Status Register - WDSR This register returns the Watchdog status information and is also returned when writing to the TIMCR. Table 56. Watchdog Status Register - $A/$B Read S3 S2 S1 S0 WDTO WDERR WDOFF WDWO WDTO - Watchdog Timeout This read-only bit signals the last reset was caused by either a watchdog timeout or by an attempt to clear the Watchdog within the window closed. Any access to this register or the Timing Control Register (TIMCR) will clear the WDTO bit. 1 = Last reset caused by watchdog timeout 0 = None 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 87 MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS LOGIC COMMANDS AND REGISTERS WDERR - Watchdog Error Table 58. Analog Multiplexer Channel Select This read-only bit signals the detection of a missing watchdog resistor. In this condition the watchdog is using the internal, lower precision timebase. The Windowing function is disabled. 1 = WDCONF pin resistor missing 0 = WDCONF pin resistor not floating MX2 MX1 MX0 Meaning 0 0 0 Disabled 0 0 1 Reserved 0 1 0 Die Temperature Sensor 0 1 1 VSENSE input 1 0 0 L1 input WDOFF - Watchdog Off 1 0 1 L2 input This read-only bit signals that the watchdog pin connected to Ground and therefore disabled. In this case watchdog timeouts are disabled and the device automatically enters Normal mode out of Reset. This might be necessary for software debugging and for programming the Flash memory. 1 = Watchdog is disabled 0 = Watchdog is enabled 1 1 0 L3 input 1 1 1 L4 input WDWO - Watchdog Window Open This read-only bit signals when the watchdog window is open for clears. The purpose of this bit is for testing. Should be ignored in case WDERR is High. 1 = Watchdog window open 0 = Watchdog window closed Analog Multiplexer Control Register - MUXCR This register controls the analog multiplexer and selects the divider ration for the Lx input divider. Table 57. Analog Multiplexer Control Register -$C C3 C2 C1 C0 Write LXDS MX2 MX1 MX0 Reset Value 1 0 0 0 Reset Condition POR POR, Reset mode or ext_reset LXDS - Lx Analog Input Divider Select This write-only bit selects the resistor divider for the Lx analog inputs. Voltage is internally clamped to VDD. 0 = Lx Analog divider: 1 1 = Lx Analog divider: 3.6 (typ.) MXx - Analog Multiplexer Input Select These write-only bits selects which analog input is multiplexed to the ADOUT0 pin according to Table 58. When disabled or when in Stop or Sleep mode, the output buffer is not powered and the ADOUT0 output is left floating to achieve lower current consumption. Configuration Register - CFR This register controls the Hall Sensor Supply enable/ disable, the cyclic sense timing multiplier, enables/disables the Current Sense Auto-zero function and selects the gain for the current sense amplifier. Table 59. Configuration Register - $D C3 C2 C1 C0 Write HVDD CYSX8 CSAZ CSGS Reset Value 0 0 0 0 Reset Condition POR, Reset mode or ext_reset POR POR POR HVDD - Hall Sensor Supply Enable This write-only bit enables/disables the state of the hall sensor supply. 1 = HVDD on 0 = HVDD off CYSX8 - Cyclic Sense Timing x 8. This write-only bit influences the cyclic sense period as shown in Table 55. 1 = Multiplier enabled 0 = None CSAZ - Current Sense Auto-Zero Function Enable This write-only bit enables/disables the circuitry to lower the offset voltage of the current sense amplifier. 1 = Auto-zero function enabled 0 = Auto-zero function disabled CSGS - Current Sense Amplifier Gain Select This write-only bit selects the gain of the current sense amplifier. 1 = 14.5 (typ.) 0 = 30 (typ.) 33912 88 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC FUNCTIONAL DEVICE OPERATIONS Interrupt Mask Register - IMR LINM - LIN Interrupts Mask This register allows masking of some of the interrupt sources. The respective flags within the Interrupt Source Register (ISR) will continue to work but will not generate interrupts to the MCU. The 5.0 V Regulator over-temperature prewarning interrupt and Under-Voltage (VSUV) interrupts can not be masked and will always cause an interrupt. This write-only bit enables/disables interrupts generated in the LIN block. 1 = LIN Interrupts Enabled 0 = LIN Interrupts Disabled VMM - Voltage Monitor Interrupt Mask Writing to the IMR will return the ISR. This write-only bit enables/disables interrupts generated in the Voltage Monitor block. The only maskable interrupt in the Voltage Monitor Block is the VSUP over-voltage interrupt. 1 = Interrupts Enabled 0 = Interrupts Disabled Table 60. Interrupt Mask Register - $E C3 C2 C1 C0 Write HSM LSM LINM VMM Reset Value 1 1 1 1 Reset Condition Interrupt Source Register - ISR This register allows the MCU to determine the source of the last interrupt or wake-up respectively. A read of the register acknowledges the interrupt and leads IRQ pin to high, in case there are no other pending interrupts. If there are pending interrupts, IRQ will be driven high for 10 s and then be driven low again. This register is also returned when writing to the Interrupt Mask Register (IMR). POR HSM - High Side Interrupt Mask This write-only bit enables/disables interrupts generated in the high side block. 1 = HS Interrupts Enabled 0 = HS Interrupts Disabled Table 61. Interrupt Source Register - $E/$F LSM - Low Side Interrupt Mask This write-only bit enables/disables interrupts generated in the low side block. 1 = LS Interrupts Enabled 0 = LS Interrupts Disabled Read S3 S2 S1 S0 ISR3 ISR2 ISR1 ISR0 ISRx - Interrupt Source Register These read-only bits indicate the interrupt source following Table 62. If no interrupt is pending then all bits are 0. In case more than one interrupt is pending, the interrupt sources are handled sequentially multiplex. Table 62. Interrupt Sources Interrupt Source ISR3 ISR2 ISR1 ISR0 none maskable maskable 0 0 0 0 0 0 0 1 0 0 1 0 - HS Interrupt (Over-temperature) 0 0 1 1 - LS Interrupt (Over-temperature) 0 1 0 0 0 1 0 1 0 1 1 no interrupt Priority no interrupt none Lx Wake-up from Stop mode- highest LIN Interrupt (RXSHORT, TXDOM, LIN OT, LIN OC) or LIN Wake-up Voltage Monitor Interrupt Voltage Monitor Interrupt (Low Voltage and VDD over-temperature) (High Voltage) - Forced Wake-up 0 lowest 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 89 MC33912BAC / MC34912BAC TYPICAL APPLICATION TYPICAL APPLICATION The 33912 can be configured in several applications. The figure below shows the 33912 in the typical Slave Node Application. V BAT VS2 VS1 D1 C2 C1 C4 Interrupt Control Module LVI, HVI, HTI, OCI IRQ C3 Internal Bus VDD Voltage Regulator C5 AGND HVDD 5V Output Module VDD IRQ Reset Control Module LVR, HVR, HTR, WD, RST LS1 Low Side Control Module RST TIMER LS2 HB Type Relay PGND Window Watchdog Module PWMIN HS1 HS2 MISO MOSI Chip Temp Sense Module SCLK Analog Multiplexer SPI & CONTROL SPI CS VSENSE VBAT Sense Module R2 L1 Analog Input Module A/D R1 Motor Output High Side Control Module MCU Hall Sensor Supply ADOUT0 R3 L2 Wake Up Module L3 Digital Input Module L4 R4 Analog Input R5 Analog Input RXD LIN Physical Layer SCI LIN LIN TXD C6 ISENSEH Current Sense Module ADOUT1 WDCONF LGND AGND ISENSEL PGND A/D R6 R7 Typical Component Values: C1 = 47F; C2 = C4 = 100nF; C3 = 10F; C5 = 4.7F; C6 = 220pF R1 = 10k; R2 = R3 = 10k; R4 = R5 = 33k; R6 = 20; R7 = 20k-200k Recommended Configuration of the not Connected Pins (NC): Pin 28 = this pin is not internally connected and may be used for PCB routing optimization. 33912 90 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS Important For the most current revision of the package, visit www.Freescale.com and select Documentation, then under Available Documentation column select Packaging Information. AC SUFFIX (PB-FREE) 32-PIN LQFP 98ASH70029A REVISION D 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 91 MC33912BAC / MC34912BAC IMPORTANT FOR THE MOST CURRENT REVISION OF THE PACKAGE, VISIT WWW.FREESCALE.COM AND SELECT DOCUMENTA- PACKAGE DIMENSIONS (Continued) AC SUFFIX (PB-FREE) 32-PIN LQFP 98ASH70029A REVISION D 33912 92 Analog Integrated Circuit Device Data Freescale Semiconductor MC33912BAC / MC34912BAC REVISION HISTORY REVISION HISTORY Revision Date Description of Changes 5/2007 * Initial Release 2.0 9/2007 * * * * * Several textual corrections Page 11: "Analog Output offset Ratio" (LXDS=1) changed to "Analog Output offset" +/-22mV Page 11: VSENSE Input Divider Ratio adjusted to 5,0/5,25/5,5 Page 12: Common mode input impedance corrected to 75k Page 13/15: LIN PHYSICAL LAYER parameters adjusted to final LIN specification release 3.0 9/2007 * Revision number incremented at engineering request. 4.0 2/2008 * * Changed Functional Block Diagram on page 24. This Data Sheet and previous versions cover Part Numbers MC33912BAC and MC34912BAC. Future revisions do not cover these Part Numbers. 5.0 10/2008 * * * Datasheet updated according to the Pass1.2 silicon version electrical parameters Add Maximum Rating on IBUS_NO_GND parameter Added L1, L2, L3, and L4, Temperature Sense Analog Output Voltage per characterization(39), Internal Chip Temperature Sense Gain per characterization at 3 temperatures(39) See Figure 16, Temperature Sense Gain, VSENSE Input Divider Ratio (RATIOVSENSE=VSENSE/VADOUT0) per characterization(40), and VSENSE Output Related Offset per characterization(40) parameters Added Temperature Sense Gain section Minor corrections to ESD Capability, (18), Cyclic Sense ON Time from Stop and Sleep mode(50), Lin Bus Pin (LIN), Serial Data Clock Pin (SCLK), Master Out Slave In Pin (MOSI), Master In Slave Out Pin (MISO), Low Side Pins (LS1 and LS2), Digital/analog Pins (L1, L2, L3 and L4), Normal Request Mode, Sleep Mode, LIN Over-temperature Shutdown / TXD Stuck At Dominant / RXD Short-circuit:, Fault Detection Management Conditions, Lin Physical Layer, LIN Interface, Over-temperature Shutdown (LIN Interrupt), LIN Receiver Operation Only, SPI Protocol, Lx - Wake-up input x, LIN Control Register - LINCR, and RXSHORT - RXD Pin Short-circuit This data sheet does not contain electrical parameters for MC33912BAC and MC34912BAC (see revision 4.0). Updated Freescale form and style 1.0 * * * * 6.0 2/2009 * * 7.0 3/2009 * * Changed VBAT_SHIFT and GND_SHIFT maximum from 10% to 11.5% for both parameters on page 14. This data sheet does not contain electrical parameters for MC33912BAC and MC34912BAC (see revision 4.0). 8.0 3/2010 * Combined Complete Data sheet for Part Numbers MC33912BAC and MC34912BAC to the back of this data sheet. Changed ESD Voltage for Machine Model from 200 to 150 * Added explanation for pins Not Connected (NC). This data sheet does not contain electrical parameters for MC33912BAC and MC34912BAC (see revision 4.0). 33912 Analog Integrated Circuit Device Data Freescale Semiconductor 93 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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