RH1021CMH-10#PBF - Linear Technology Corporation

SPEC NO. 05-08-5018 REV. P RH1021-

10, PRECISION 10V REFERENCE

LINEAR TECHNOLOGY CORPORATION Page 1 of 14

REVISION RECORD

REV DESCRIPTION DATE

0 INITIAL RELEASE 06/12/96

A • CORRECTION TO RH1021BM-10, DM-10, OUTPUT VOLTAGE, 100 KRAD MINIMUM LIMIT

FROM “9.98 V” TO “9.938 V, PAGE 10. 02/28/97

B • PAGE 2, ADDED PARAGRAPHS 3.2.1, 3.2.2, AND 3.2.3. PARAGRAPH 3.3.b, ADDED “(SEE

PARAGRAPH 3.2)”.

• PAGE 4, PARAGRAPH 3.12, WAFER LOT ACCEPTANCE REDEFINED. PARAGRAPH 4.4.2,

GROUP B INSPECTION, REDEFINED. PARAGRAPH 4.4.3, GROUP D INSPECTION,

REDEFINED.

• PAGE 5, PARAGRAPH 4.5, SOURCE INSPECTION, REDEFINED.

• PAGE 6, FIGURE 1, TO5 CASE OUTLINE, ADDED θja AND θjc.

11/25/97

C • PAGE 4, AMENDED PARAGRAPHS 4.1 AND 4.1.1 TAKING EXCEPTION TO ANALYSIS OF

CATASTROPHIC FAILURES. 05/8/98

D • PAGE 6, FIGURE 1, CHANGED θja FROM 180°C/W TO 150°C/W. 11/17/99

E • PAGE 4, PARAGRAPH 3.7, CHANGED VERBIAGE FROM “SPECIFIED IN TABLE III TO “AND

AS SPECIFIED IN TABLE III HEREIN”, LINE 2.

PARAGRAPH 3.9, ADDED “HEREIN” AFTER “TABLE II”, LINE 2.

• PAGE 5, PARAGRAPH 4.3, ADDED “HEREIN” AFTER “TABLE III”, LINE 2.

PARAGRAPH 4.4.1, ADDED “HEREIN” AFTER “TABLE III”, LINE 2.

PARAGRAPH 4.4.2.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF TABLE

IIA OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IIA IN MIL-STD-883”.

PARAGRAPH 4.4.3.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF TABLE IV

OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IV IN MIL-STD-883”.

12/13/99

F • PAGE 3, PARAGRAPH 3.2.4, ADDED NEW DEVICE OPTION 4 (W10 FLATPACK).

• PAGE 4, PARAGRAPH 3.8 CHANGED VERBIAGE ADDED FIGURES 5 AND 6.

PARAGRAPH 3.10.1, ADDED FIGURE 2.

PARAGRAPH 3.10.2, CHANGED VERBIAGE ADDED FIGURES 3 AND 4.

PARAGRAPH 3.10.3, CHANGED VERBIAGE.

PARAGRAPH 3.11.3, CHANGED FIGURE 4 TO 7.

• PAGE 8, ADDED PAGE 7 DEVICE OPTION 4, PACKAGE OUTLINE.

• PAGE 9, CHANGED FIGURE 2 TO 3.

• PAGE 10, ADDED DEVICE OPTION 4, FIGURE 4 TERMINAL CONNECTIONS.

• PAGE 11, CHANGED FIGURE 3 TO 5.

• PAGE 12, ADDED DEVICE OPTION 4, FIGURE 6 BURN-IN CIRCUIT.

• PAGE 13, CHANGED FIGURE 4 TO 7.

• PAGE 15, CHANGED VOUT OUTPUT VOLTAGE 10 KRAD (SI) MIN TO 9.992 AND MAX TO

10.008 AND ADDED VERBIAGE TO NOTE 3.

06/25/00

REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE.

CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART

REVISION PAGE NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14

INDEX REVISION P P P P P P P P P P P P P P

REVISION PAGE NO.

INDEX REVISION

ORIG LINEAR TECHNOLOGY CORPORATION

DSGN MILPITAS, CALIFORNIA

ENGR TITLE:

MFG MICROCIRCUIT, LINEAR,

CM RH1021-10, PRECISION 10V REFERENCE

QA

PROG SIZE CAGE

CODE DRAWING

NUMBER REV

FUNCT 94155 05-08-5018 P

APPLICATION SIGNOFFS DATE CONTRACT:

FOR OFFICIAL USE ONLY

SPEC NO. 05-08-5018 REV. P RH1021-

10, PRECISION 10V REFERENCE

LINEAR TECHNOLOGY CORPORATION Page 2 of 14

REVISION RECORD

REV DESCRIPTION DATE

G • PAGE 8, CHANGED THETA JA TO θja = +170°C/W AND THETA JC TO θjc = +40°C/W FROM θja

= 225°C/W AND θjc 18°C/W PER PACKAGE ENGINEERING. 9/05/00

H • CONVERSION FROM WORD PERFECT TO MICROSOFT WORD. REDUCED SPEC PAGES TO

14 TOTAL.

• PAGE 2, AN ADDITIONAL REVISION RECORD PAGE WAS INSTALLED

• MADE THE REVISION RELEASE DATES AND THE DOCUMENT CONTROL HISTORY PAGE

DATE MATCH

• PAGE 3:

PARAGRAPH 3.2.1 THROUGH 3.2.4, ADDED THE WORD “OPTION” PRECEDING THE NUMBER OF

EACH LTC PART NUMBER FOR BETTER CUSTOMER ORDERING CONVENIENCE.

• PAGE 4:

PARAGRAPH 3.6, CHANGED “TABLE IA” TO “TABLE II”

PARAGRAPH 3.7, CHANGED “TABLE III” TO “TABLE IV”

PARAGRAPHS 3.8.1 AND 3.8.2, ADDED THE PACKAGE TYPES AND OPTIONS AFTER EACH

FIGURE.

PARAGRAPH 3.9, CHANGED “TABLE II” TO “TABLE III”

PARAGRAPHS 3.10.1 AND 3.10.2, ADDED THE PACKAGE TYPES AFTER EACH FIGURE

PARAGRAPH 3.11.1 WAS CHANGED FROM “…dosage rate of approximately 20 Rads per

second” TO “…dosage rate of less than or equal to 10 Rads per second”

• PAGE 5:

PARAGRAPHS 4.1 THROUGH 4.4.2.1 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING.

• PAGE 6:

PARAGRAPH 4.4.3 CHANGE WAS DONE TO CLARIFY GROUP SAMPLING.

PARAGRAPHS 4.6.2 THROUGH 4.6.4 WERE RE-WRITTEN. THESE DATA PROVIDED, AND DATA

AVAILABLE.

PARAGRAPH 4.6.10 NOTE, ADDED FURTHER EXPLANATION OF MINIMUM DELIVERED DATA.

• PAGES 7 THROUGH 12, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND

PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE.

• PAGE 9, MOVED FIGURE 4 TO PAGE 9 FROM PAGE 10 AS SHOWN IN PREVIOUS

SPECIFICATION REVISION.

• PAGE 12, FIGURE 7, TOTAL DOSE BIAS CIRCUIT REVISED BY ENGINEERING.

• PAGE 13, TABLES I, II AND CORRESPONDING NOTES ALL ON ONE PAGE.

03/26/02

J • PAGE 8, CHANGED OUTLINE DRAWING PIN 1 NOTCH MOVED TO INSIDE LEAD

LOCATION. 05/19/03

K

• PAGE 4, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC. 03/15/05

L • PAGE 4, ADDED NOTE: ABSOLUTE MAXIMUM RATINGS ARE THOSE VALUES BEYOND

WHICH THE LIFE OF A DEVICE MAY BE IMPAIRED.

08/15/05

M • PAGE 5, CHANGED IN BOTH PARAGRAPHS 4.2, 4.3 IN CONJUNCTION TO 3.3 CHANGED TO

3.4 AND PARAGRAPH 4.3 CHANGED 3.1.1 TO 3.1 AND 3.2.1 TO 3.1.1 12/07/07

N • PAGE 4, PARAGRAPH 3.11.1 CHANGED VERBIAGE. 04/30/08

P • PAGE 5, PARAGRAPH 4.4.2 CHANGED VERBIAGE.

• PAGE 8, FIGURE 2 NOTE 2 ADDED TO LEAD THICKNESS. DATA SHEET CHANGE TO

ELECTRICAL TEST NOTES #7, #9 VIN = 12V CHANGED TO VIN = 15V.

07/18/08

SPEC NO. 05-08-5018 REV. P RH1021-

10, PRECISION 10V REFERENCE

LINEAR TECHNOLOGY CORPORATION Page 3 of 14

1.0 SCOPE:

1.1 This specification defines the performance and test requirements for a microcircuit processed to a space

level manufacturing flow.

2.0 APPLICABLE DOCUMENTS:

2.1 Government Specifications and Standards: the following documents listed in the Department of Defense

Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this

specification to the extent specified herein.

SPECIFICATIONS:

MIL-PRF-38535 Integrated Circuits (Microcircuits) Manufacturing, General Specification for

MIL-STD-883 Test Method and Procedures for Microcircuits

MIL-STD-1835 Microcircuits Case Outlines

2.2 Order of Precedence: In the event of a conflict between the documents referenced herein and the contents

of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other

referenced specifications.

3.0 REQUIREMENTS:

3.1 General Description: This specification details the requirements for the RH1021-10, Precision 10V

Reference, processed to space level manufacturing flow.

3.2 Part Number:

3.2.1 Option 1 – RH1021BMH-10 (TO5 Metal Can, 8 Leads)

3.2.2 Option 2 – RH1021CMH-10 (TO5 Metal Can, 8 Leads)

3.2.3 Option 3 – RH1021DMH-10 (TO5 Metal Can, 8 Leads)

3.2.4 Option 4 – RH1021CMW-10 (Glass Sealed Flatpack, 10 Leads)

3.3 Part Marking Includes:

3.3.1 LTC Logo

3.3.2 LTC Part Number (See Paragraph 3.2)

3.3.3 Date Code

3.3.4 Serial Number

3.3.5 ESD Identifier per MIL-PRF-38535, Appendix A

SPEC NO. 05-08-5018 REV. P RH1021-

10, PRECISION 10V REFERENCE

LINEAR TECHNOLOGY CORPORATION Page 4 of 14

3.4 The Absolute Maximum Ratings:

Input Voltage . . . .

. . . .

40V

Input / Output Voltage Differential . .

. . . .

35V

Output to Ground Voltage

(Shunt Mode Current Limit) . . . . . . . . . . . 16V

Trim Pin to Ground Voltage

Positive . . .

. . . .

Equal to VOUT

Negative . . . . . . . . . . . . . . . -20V

Output Short Circuit Duration

V

IN = 35V . . .

. . . .

10 sec

VIN = < 20V . .

. . . .

Indefinite

Operating Temperature Range . . .

. . . .

-55°C to 125°C

Storage Temperature Range . . . .

. . . .

-65°C to 150°C

Lead Temperature (Soldering, 10 sec.) . . . . . . . . . 300°C

NOTE: Absolute maximum ratings are those values beyond which the life of a device

may be impaired.

3.5 Electrostatic discharge sensitivity, ESDS, shall be Class 1.

3.6 Electrical Performance Characteristics: The electrical performance characteristics shall be as specified in

Table I and Table II.

3.7 Electrical Test Requirements: Screening requirements shall be in accordance with 4.1 herein,

MIL-STD-883, Method 5004, and as specified in Table IV herein.

3.8 Burn-In Requirement:

3.8.1 Options 1, 2, 3 (TO5): Static Burn-In, Figure 5

3.8.2 Option 4 (Glass Sealed Flatpack) : Static Burn-In, Figure 6

3.9 Delta Limit Requirement: Delta limit parameters are specified in Table III herein, are calculated after

each burn-in, and the delta rejects are included in the PDA calculation.

3.10 Design, Construction, and Physical Dimensions: Detail design, construction, physical, dimensions, and

electrical requirements shall be as specified herein.

3.10.1 Mechanical / Packaging Requirements: Case outlines and dimensions are in accordance with

Figure 1 (TO5/8 Leads) and Figure 2 (Glass Sealed Flatpack/10 Leads).

3.10.2 Terminal Connections: The terminal connections shall be as specified in Figure 3 (TO5/8

Leads) and Figure 4 (Glass Sealed Flatpack/10 Leads).

3.10.3 Lead Material and Finish: The lead material shall be Kovar for TO5 and alloy 42 for flatpack.

The lead finish shall be hot solder dip (Finish letter A) in accordance with MIL-PRF-38535.

3.11 Radiation Hardness Assurance (RHA):

3.11.1 The manufacturer shall perform a lot sample test as an internal process monitor for total dose

radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as

a guideline.

SPEC NO. 05-08-5018 REV. P RH1021-

10, PRECISION 10V REFERENCE

LINEAR TECHNOLOGY CORPORATION Page 5 of 14

3.11.2 For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation,

the manufacturer will provide certified RAD testing and report through an independent test

laboratory when required as a customer purchase order line item.

3.11.3 Total dose bias circuit is specified in Figure 7.

3.12 Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A,

except for the following: Topside glassivation thickness shall be a minimum of 4KÅ.

3.13 Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018 and copies of SEM

photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when

specified as a customer purchase order line item.

4.0 VERIFICATION (QUALITY ASSURANCE PROVISIONS)

4.1 Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF-38535.

Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified

Class S manufacturing lines.

4.2 Sampling and Inspection: Sampling and Inspection shall be in accordance with MIL-STD-883, Method

5005 with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1.1, 3.2.1, and

3.4 of the test method.

4.3 Screening: Screening requirements shall be in accordance with MIL-STD-883, Method 5004 with QML

allowed and TRB approved deviations in conjunction with paragraphs 3.1, 3.1.1, and 3.4 of the test

method. Electrical testing shall be as specified in Table IV herein.

4.3.1 Analysis of catastrophic (open/short) failures from burn-in will be conducted only when a lot fails

the burn-in or re-burn-in PDA requirements.

4.4 Quality Conformance Inspection: Quality conformance inspection shall be in accordance with 4.2 and 4.3

herein and as follows:

4.4.1 Group A Inspection: Group A inspection shall be performed in accordance with 4.1 herein, per

MIL-STD-883, Method 5005, and specified in Table IV herein.

4.4.2 Group B Inspection: When purchased, a full Group B is performed on an inspection lot. As a

minimum, Subgroups 1-4 plus 6 are performed on every assembly lot, and Subgroup B2

(Resistance to Solvents / Mark Permanency) and Subgroup B3 (Solderability) are performed prior

to the first shipment from any inspection lot and Attributes provided when a Full Space Data Pack

is ordered. Subgroup B5 (Operating Life) is performed on each wafer lot. This subgroup may or

may not be from devices built in the same package style as the current inspection lot. Attributes

and variables data for this subgroup will be provided upon request at no charge.

4.4.2.1 Group B, Subgroup 2c = 10% Group B, Subgroup 5 = *5%

(*per wafer or inspection lot

Group B, Subgroup 3 = 10% whichever is the larger quantity)

Group B, Subgroup 4 = 5% Group B, Subgroup 6 = 15%

4.4.2.2 All footnotes pertaining to Table IIa in MIL-STD-883, Method 5005 apply. The quantity

(accept number) of all other subgroups are per MIL-STD-883, Method 5005, Table IIa.

SPEC NO. 05-08-5018 REV. P RH1021-

10, PRECISION 10V REFERENCE

LINEAR TECHNOLOGY CORPORATION Page 6 of 14

4.4.3 Group D Inspection: When purchased, a full Group D is performed on an inspection lot. As a

minimum, periodic full Group D sampling is performed on each package family for each assembly

location every 26 weeks. A generic Group D Summary is provided when a full Space Data Pack is

ordered.

4.4.3.1 Group D, Subgroups 3, 4 and 5 = 15% each.

4.4.3.2 All footnotes pertaining to Table IV in MIL-STD-883, Method 5005 apply. The

quantity (accept number) or sample number and accept number of all other subgroups

are per MIL-STD-883, Method 5005, Table IV.

4.5 Source Inspection:

4.5.1 The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal

visual.

4.5.2 The procuring activity has the right to perform source inspection at the supplier’s facility prior to

shipment for each lot of deliverables when specified as a customer purchase order line item. This

may include wafer lot acceptance and final data review.

4.6 Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:

4.6.1 Lot Serial Number Sheets identifying all devices accepted through final inspection by serial

number.

4.6.2 100% attributes (completed lot specific traveler; includes Group A Summary)

4.6.3 Burn-In Variables Data and Deltas (if applicable)

4.6.4 Group B2, B3, and B5 Attributes (Variables data, if performed on lot shipping)

4.6.5 Generic Group D data (4.4.3 herein)

4.6.6 SEM Photographs (3.13 herein)

4.6.7 Wafer Lot Acceptance Report (3.13 herein)

4.6.8 X-Ray Negatives and Radiographic Report

4.6.9 A copy of outside test laboratory radiation report if ordered

4.6.10 Certificate of Conformance certifying that the devices meet all the requirements of this

specification and have successfully completed the mandatory tests and inspections herein.

Note: Items 4.6.1 and 4.6.10 will be delivered as a minimum, with each shipment. This is noted

on the Purchase Order Review Form as “No Charge Data”.

5.0 Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All devices

shall be packaged in conductive material or packaged in anti-static material with an external conductive field

shielding barrier.

SPEC NO. 05-08-5018 REV. P RH1021-

10, PRECISION 10V REFERENCE

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DEVICE OPTIONS 1, 2, 3

TO5 METAL CAN / 8 LEADS CASE OUTLINE

θja = +150°C/W

θjc = +40°C/W

FIGURE 1

SPEC NO. 05-08-5018 REV. P RH1021-

10, PRECISION 10V REFERENCE

LINEAR TECHNOLOGY CORPORATION Page 8 of 14

DEVICE OPTION 4

W10, GLASS SEALED FLATPACK / 10 LEADS CASE OUTLINE

FIGURE 2

θja = +170

°

C/W

θjc = +40°C/W

NOTE: 1. THIS DIMENSION ALLOWS FOR OFF-

CENTER LID, MENISCUS AND GLASS OVER RUN.

NOTE: 2. INCREASE DIMENSION BY 0.003 INCH

WHEN LEAD FINISH IS APPLIED (SOLDER DIPPED).

SPEC NO. 05-08-5018 REV. P RH1021-

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LINEAR TECHNOLOGY CORPORATION Page 9 of 14

TERMINAL CONNECTIONS

DEVICE OPTIONS 1, 2, 3, TO5 METAL CAN / 8 LEADS

FIGURE 3

OPTION 4, GLASS SEALED FLATPACK / 10 LEADS

FIGURE 4

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BURN-IN CIRCUIT

OPTIONS 1, 2, 3, TO5 METAL CAN / 8 LEADS

FIGURE 5

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BURN-IN CIRCUIT

OPTION 4, GLASS SEALED FLATPACK / 10 LEADS

FIGURE 6

SPEC NO. 05-08-5018 REV. P RH1021-

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TOTAL DOSE BIAS CIRCUIT

FIGURE 7

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TABLE I: ELECTRICAL CHARACTERISTICS (PRE-IRRADIATION) NOTE 9

TABLE II: ELECTRICAL CHARACTERISTICS (POST-IRRADIATION) NOTE 7

SPEC NO. 05-08-5018 REV. P RH1021-

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TABLE III: POST BURN-IN ENDPOINTS AND DELTA LIMIT REQUIREMENTS

TA = 25°C

APPLIES TO RH1021BM-10 AND RH1021DM-10

ENDPOINT LIMIT DELTA

PARAMETER MIN MAX MIN MAX UNITS

VOUT 9.95 10.05 -0.003 0.003 V

APPLIES TO RH1021CM-10

ENDPOINT LIMIT DELTA

PARAMETER MIN MAX MIN MAX UNITS

VOUT 9.995 10.005 -0.003 0.003 V

TABLE IV: ELECTRICAL TEST REQUIREMENTS