SN74LVC1G08
SINGLE 2-INPUT POSITIVE-AND GATE
SCES217N – APRIL 1999 – REVISED FEBRUAR Y 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Available in the Texas Instruments
NanoStarand NanoFreePackages
D
Supports 5-V VCC Operation
D
Inputs Accept Voltages to 5.5 V
D
Max tpd of 3.6 ns at 3.3 V
D
Low Power Consumption, 10-µA Max ICC
D
±24-mA Output Drive at 3.3 V
D
Ioff Supports Partial-Power-Down Mode
Operation
D
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description/ordering information
The SN74LVC1G08 performs the Boolean function Y
+
A•BorY
+
A
)
B in positive logic.
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING‡
NanoStar – WCSP (DSBGA)
0.17-mm Small Bump – YEA SN74LVC1G08YEAR
NanoFree – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
SN74LVC1G08YZAR
NanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
SN74LVC1G08YEPR _ _ _
_
–40°C to 85°CNanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free) SN74LVC1G08YZPR
Reel of 3000 SN74LVC1G08DBVR
-
–
Reel of 250 SN74LVC1G08DBVT
_
Reel of 3000 SN74LVC1G08DCKR
-
–
Reel of 250 SN74LVC1G08DCKT
_
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site.
Copyright 2003, Texas Instruments Incorporated
NanoStar and NanoFree are trademarks of Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
A
B
GND
VCC
Y
3
2
1
4
5
GND
B
A
Y
VCC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.