© 2008 IXYS CORPORATION, All rights reserved
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min. Typ. Max.
VGE(th) IC = 250μA, VCE = VGE 3.0 5.0 V
ICES VCE = VCES 300 μA
VGE = 0V TJ = 125°C 5 mA
IGES VCE = 0V, VGE = ±20V ±100 nA
VCE(sat) IC = 60A, VGE = 15V, Note 1 1.50 1.80 V
IC = 120A 1.75
Symbol Test Conditions Maximum Ratings
VCES TJ= 25°C to 150°C 600 V
VCGR TJ= 25°C to 150°C, RGE = 1MΩ600 V
VGES Continuous ±20 V
VGEM Transient ±30 V
IC25 TC= 25°C (limited by leads) 75 A
IC110 TC= 110°C72A
ICM TC= 25°C, 1ms 450 A
SSOA VGE = 15V, TVJ = 125°C, RG = 3ΩICM = 240 A
(RBSOA) Clamped inductive load @ VCE 600V
PCTC= 25°C 540 W
TJ -55 ... +150 °C
TJM 150 °C
Tstg -55 ... +150 °C
MdMounting torque (TO-264) 1.13 / 10 Nm/lb.in.
FCMounting force (PLUS247) 20..120 / 4.5..27 N/lb.
TLMaximum lead temperature for soldering 300 °C
TSOLD 1.6mm (0.062 in.) from case for 10s 260 °C
Weight TO-264 10 g
PLUS247 6 g
DS99869A(06/08)
VCES = 600V
IC110 = 72A
VCE(sat)
£ 1.8V
tfi(typ) = 92ns
IXGK72N60B3H1
IXGX72N60B3H1
GenX3TM 600V IGBT
with Diode
Medium speed low Vsat PT
IGBTs 5-40 kHz switching
Preliminary Technical Information
Features
zOptimized for low conduction and
switching losses
zSquare RBSOA
zAnti-parallel ultra fast diode
zInternational standard packages
Advantages
zHigh power density
zLow gate drive requirement
Applications
zPower Inverters
zUPS
zMotor Drives
zSMPS
zPFC Circuits
zBattery Chargers
zWelding Machines
zLamp Ballasts
G = Gate C = Collector
E = Emitter TAB = Collector
TO-264 (IXGK)
PLUS247 (IXGX)
(TAB)
GCE
TAB
GDS
E
GC
IXYS reserves the right to change limits, test conditions, and dimensions.
IXGK72N60B3H1
IXGX72N60B3H1
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified) Min. Typ. Max.
gfs IC= 50A, VCE = 10V, Note 1 45 76 S
Cies 6800 pF
Coes VCE = 25V, VGE = 0V, f = 1MHz 575 pF
Cres 80 pF
Qg 225 nC
Qge IC= 60A, VGE = 15V, VCE = 0.5 VCES 40 nC
Qgc 82 nC
td(on) 31 ns
tri 33 ns
Eon 1.4 mJ
td(off) 152 240 ns
tfi 92 150 ns
Eoff 1.0 2.0 mJ
td(on) 29 ns
tri 34 ns
Eon 2.7 mJ
td(off) 228 ns
tfi 142 ns
Eoff 2.2 mJ
RthJC 0.23 °C/W
RthCS 0.15 °C/W
Inductive load, TJ = 25°°
°°
°C
IC = 50A, VGE = 15V
VCE = 480V, RG = 3Ω
Inductive load, TJ = 125°°
°°
°C
IC = 50A,VGE = 15V
VCE = 480V,RG = 3Ω
Reverse Diode (FRED) Characteristic Values
(TJ = 25°C, unless otherwise specified)
Symbol Test Conditions Min. Typ. Max.
VF IF = 60A, VGE = 0V, Note 1 1.6 2.0 V
TJ = 150°C 1.4 1.8 V
IRM 8.3 A
trr 140 ns
RthJC 0.3 °C/W
Note 1: Pulse test, t 300μs, duty cycle, d 2%.
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
4 - Drain (Collector)
PLUS247TM (IXGX) Outline
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.83 5.21 .190 .205
A12.29 2.54 .090 .100
A21.91 2.16 .075 .085
b 1.14 1.40 .045 .055
b11.91 2.13 .075 .084
b22.92 3.12 .115 .123
C 0.61 0.80 .024 .031
D 20.80 21.34 .819 .840
E 15.75 16.13 .620 .635
e 5.45 BSC .215 BSC
L 19.81 20.32 .780 .800
L1 3.81 4.32 .150 .170
Q 5.59 6.20 .220 0.244
R 4.32 4.83 .170 .190
TO-264 (IXGK) Outline
DIM INCHES MILLIMETERS
MIN MAX MIN MAX
A 0.185 0.209 4.70 5.31
A1 0.102 0.118 2.59 3.00
b 0.037 0.055 0.94 1.40
b1 0.087 0.102 2.21 2.59
b2 0.110 0.126 2.79 3.20
c 0.017 0.029 0.43 0.74
D 1.007 1.047 25.58 26.59
E 0.760 0.799 19.30 20.29
e .215 BSC 5.46 BSC
J 0.000 0.010 0.00 0.25
K 0.000 0.010 0.00 0.25
L 0.779 0.842 19.79 21.39
L1 0.087 0.102 2.21 2.59
ØP 0.122 0.138 3.10 3.51
Q 0.240 0.256 6.10 6.50
Q1 0.330 0.346 8.38 8.79
ØR 0.155 0.187 3.94 4.75
ØR1 0.085 0.093 2.16 2.36
S 0.243 0.253 6.17 6.43
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IF = 60A, VGE = 0V, TJ = 100°C
-diF/dt = 200A/μs, VR = 300V
© 2008 IXYS CORPORATION, All rights reserved
IXGK72N60B3H1
IXGX72N60B3H1
Fi g . 1. Ou tp u t C h ar acter i stic s
@ 25º C
0
20
40
60
80
100
120
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
VCE - Volts
IC - Amperes
V
GE
= 15V
13V
11V
7V
9V
Fig. 2. Extended Output Characteristics
@ 25ºC
0
30
60
90
120
150
180
210
240
270
300
330
012345678
VCE - Volts
IC
-
Amperes
V
GE
= 15V
13V
11V
7V
9V
Fi g . 3. Ou tp ut Char acter i stics
@ 125ºC
0
20
40
60
80
100
120
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
VCE - Volts
IC - Amperes
V
GE
= 15V
13V
11V
9V
7V
5V
Fig. 4. Dependence of V
CE(sat)
on
Junction T em perature
0.7
0.8
0.9
1.0
1.1
1.2
1.3
-50 -25 0 25 50 75 100 125 150
TJ - Degrees Centigrade
VCE(sat) - Normalized
V
GE
= 15V
I
C
= 120A
I
C
= 60A
I
C
= 30A
Fi g . 5. C ol l ect o r-to - Emitt er V ol tag e
vs. Gate-to -Emi tter Vo l tag e
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5 6 7 8 9 101112131415
VGE - Volts
VCE - Volts
I
C
= 120A
60A
30A
T
J
= 25ºC
Fig. 6. Input Admittance
0
20
40
60
80
100
120
140
160
180
4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0
VGE - Volts
IC
-
Amperes
T
J
= 125ºC
25ºC
- 40ºC
IXYS reserves the right to change limits, test conditions, and dimensions.
IXGK72N60B3H1
IXGX72N60B3H1
Fi g . 11. Maximu m Tran si en t Ther mal Imped an ce
0.01
0.10
1.00
0.00001 0.0001 0.001 0.01 0.1 1 10
Pulse Width - Seconds
Z
(th)JC
- ºC / W
Fig. 7. Transconductance
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0 20 40 60 80 100 120 140 160 180 200
I
C
- Amperes
g f s -
Siemens
T
J
= - 40ºC
25ºC
125ºC
Fig. 8. Gate Charge
0
2
4
6
8
10
12
14
16
0 20 40 60 80 100 120 140 160 180 200 220 240
Q
G
- NanoCoulombs
V
GE
- Volts
V
CE
= 300V
I
C
= 60A
I
G
= 10mA
Fi g . 10. R ever se-B i as Safe Op er ati n g Ar ea
0
40
80
120
160
200
240
280
100 200 300 400 500 600
V
CE
- Volts
I
C
- Amperes
T
J
= 125ºC
R
G
= 3
dV / dt < 10V / ns
Fig. 9. Capacitance
10
100
1,000
10,000
0 5 10 15 20 25 30 35 40
V
CE
- Volts
Capacitance - PicoFarads
f
= 1 MHz
Cies
Coes
Cres
© 2008 IXYS CORPORATION, All rights reserved
IXGK72N60B3H1
IXGX72N60B3H1
Fig. 12. Inductive Switching
Ener gy L o ss v s. Ga te R e si sta n ce
0
1
2
3
4
5
6
7
8
0 5 10 15 20 25 30 35 40 45 50 55
R
G
- Ohms
E
off
- MilliJoules
1
2
3
4
5
6
7
8
9
E
on
- MilliJoules
E
off
E
on
- - - -
T
J
= 125ºC , V
GE
= 15V
V
CE
= 480V I
C
= 50A
I
C
=100A
I
C
= 25A
Fig. 15. Inductive Turn-off
Switc h in g Times vs. Gate R esi stance
80
100
120
140
160
180
200
220
240
0 5 10 15 20 25 30 35 40 45 50 55
R
G
- Ohms
t f
- Nanoseconds
100
250
400
550
700
850
1000
1150
1300
t d(off)
- Nanoseconds
t
f
t
d(off)
- - - -
T
J
= 125ºC, V
GE
= 15V
V
CE
= 480V
I
C
= 50A
I
C
= 25A
I
C
= 100A
I
C
= 25A, 50A, 100A
Fig. 13. Inductive Switching
Energy Los s vs. Collecto r Curren t
0
1
2
3
4
5
6
7
20 30 40 50 60 70 80 90 100
I
C
- Amperes
E
off
- MilliJoules
0
1
2
3
4
5
6
7
E
on
- MilliJoules
E
off
E
on
- - - -
R
G
= 3
,
V
GE
= 15V
V
CE
= 480V T
J
= 125ºC
T
J
= 25ºC
Fig. 14. Inductive Switching
Energy Loss vs. Junction Tem perature
0
1
2
3
4
5
6
7
25 35 45 55 65 75 85 95 105 115 125
T
J
- Degrees Centigrade
E
off
- MilliJoules
0
1
2
3
4
5
6
7
E
on
- MilliJoules
E
off
E
on
- - - -
R
G
= 3
,
V
GE
= 15V
V
CE
= 480V
I
C
= 50A
I
C
= 100A
I
C
= 25A
Fig. 16. Inductive Turn-off
Switching Times vs. C o l lecto r Current
70
90
110
130
150
170
190
210
230
20 30 40 50 60 70 80 90 100
I
C
- Amperes
t f
- Nanoseconds
130
145
160
175
190
205
220
235
250
t d(off)
- Nanoseconds
t
f
t
d(off)
- - - -
R
G
= 3
, V
GE
= 15V
V
CE
= 480V
T
J
= 125ºC
T
J
= 25ºC
Fig. 17. Inductive T urn-off
Switching T imes vs. Junction Temperature
60
80
100
120
140
160
180
200
220
25 35 45 55 65 75 85 95 105 115 125
T
J
- Degrees Centigrade
t
f
- Nanoseconds
140
155
170
185
200
215
230
245
260
t d(off)
- Nanoseconds
t
r
t
d(off)
- - - -
R
G
= 3
, V
GE
= 15V
V
CE
= 480V
I
C
= 25A, 50A, 100A
IXYS reserves the right to change limits, test conditions, and dimensions.
IXGK72N60B3H1
IXGX72N60B3H1
IXYS REF: G_72N60B3(76)06-26-08-C
Fig. 18. Inductive Turn-on
Swit ch i n g Ti mes vs. Gat e R esi stan ce
10
30
50
70
90
110
130
150
170
0 5 10 15 20 25 30 35 40 45 50 55
R
G
- Ohms
t
r - Nanoseconds
20
35
50
65
80
95
110
125
140
t d(on) - Nanoseconds
t
r
t
d(on)
- - - -
TJ = 125ºC, VGE = 15V
VCE = 480V
I C = 100A
I C = 25A
I C = 50A
Fig. 19. Inductive T urn-on
Switch i n g Times vs. C o llecto r C u r r en t
10
20
30
40
50
60
70
80
90
20 30 40 50 60 70 80 90 100
I
C
- Amperes
t
r - Nanoseconds
26
27
28
29
30
31
32
33
34
t d(on) - Nanoseconds
t
r
t
d(on)
- - - -
RG = 3 , VGE = 15V
VCE = 480V
25ºC < TJ < 125ºC
TJ = 25ºC, 125ºC
Fig. 20. Inductive Turn-on
Swit ch i n g Ti mes vs. Ju n ct i o n Temp e r atu r e
0
10
20
30
40
50
60
70
80
90
100
25 35 45 55 65 75 85 95 105 115 125
T
J
- Degrees Centigrade
t
r - Nanoseconds
25
26
27
28
29
30
31
32
33
34
35
t d(on) - Nanoseconds
t
r
t
d(on
)
- - - -
RG = 3 , VGE = 15V
VCE = 480V
I C = 25A
I C = 50A
I C = 100A
© 2008 IXYS CORPORATION, All rights reserved
IXGK72N60B3H1
IXGX72N60B3H1
Fi g . 26 Maximum tr an sien t thermal imp ed an ce j u n ctio n to case (fo r d i o d e)
0.01
0.10
1.00
0.0001 0.001 0.01 0.1 1 10
Pul se Wid th [ms]
Z(th )JC - [ ºC / W ]
Fig. 21 Fig. 22
Fig. 24 Fig. 25
Fig. 23
[ s ]
IXYS REF: G_72N60B3(76)06-26-08-C