Bluetooth™ Radio
Key features
•
A small complete class 1 Bluetooth Radio,
no additional RF-components required
•
Variable reference frequency,
10 MHz-20 MHz
•
Excellent out-band blocking in all
GSM bands
•
High signal level performance in-band
•
Requires no external shielding
•
On board software controlled output
power
•
Quali ed for Bluetooth speci cation 1.1
Description
The Bluetooth Radio PBA 313 02 from Ericsson
Microelectronics is a long-range microwave frequency
radio transceiver for Bluetooth communication links.
Provided in a compact LGA package. No external
shield is required.
The Bluetooth Radio offers a combination of compact
size, low power consumption, and cost effective
assembly. The PBA 313 02 forms a complete radio
with only the addition of an antenna, a reference
frequency, and digital control. As a result, designers
can bene t from a pre-tested and ready-to-use device,
providing a robust Bluetooth Radio function in the
nal OEM application.
PBA 313 02 is built around a BiCMOS ASIC.
Antenna lter, RX and TX baluns are all integrated
into the circuit. The antenna lter is specially
PBA 313 02
designed for application in GSM environment such as
inside a mobile phone. The PBA 313 02 has output
power regulation control through software. Power
levels have typical 4dB steps. Power control exibility
enables customer to specify smaller or larger power
steps. Operating from a 2.7 V supply, the module has
a typical supply current consumption of only 60 mA
(receive mode) or 50 mA (transmit mode) at 0 dBm
output power. In Standby mode the typical current
consumption is only 20 µA thus helping to extend
battery life for portable equipment.
Suggested applications
•
Mobile phones
•
PDA
•
Modems
•
Laptop computers
•
Handheld equipment
2
PBA 313 02
Figure 1. Block diagram
Limiting data
The absolute maximum ratings of the PBA 313 02 are summarised in Table 1.
Unless otherwise noted, whenever VCC is mentioned it also includes VCC_DIG.
Absolute maximum ratings
Parameter
Condition
Symbol
Min
Typ
Max
Unit
Supply voltage
VCC
1
2.65
3.0
V
PA Supply voltage
VCC_PA
2.7
5.5
V
Applied voltage to non supply pins
GND -0.3
Vcc +0.3
V
Input RF power
In-band
15
dBm
Out-band
15
dBm
Storage temperature
T
Stg
-40
+90
°C
Max operating temperature
-30
+75
°C
Reference clock frequency
(f
EXT_CLK
)
EXT_CLK)
EXT_CLK
10
20
MHz
Reference clock amplitude
0.3
1.0
Vpp
Max. load mismatch tolerant, stability
TBD
Radio ASIC
Loop
filter
VCO
tank
RX
balun
TX
balunPA
Switch
Antenna
filter
PBA 313 02/1
ANTENNA
PLL
Control
RX_DATA
RX_ON
SI*
*CLK
EXT_RESET
PHD_OFF
SYNT_ON
TX_DATA
TX_ON
VCC
VCC_PA
TX_SW
Det
XO
XON
XOP
Power
Control
RSSI
3
PBA 313 02
Characteristic data
Unless otherwise noted, the speci cation applies forT
Amb
Unless otherwise noted, the speci cation applies forTAmb
Unless otherwise noted, the speci cation applies forT
=25°C, VCC =2.8V, f
Ref
= 13MHz, ±10ppm, VSWR
≤
2:1, VCC_PA
=3.2V
Operating conditions
Parameter
Condition
Symbol
Min
Typ
Max
Unit
Frequency range
2.402
2.480
GHz
Reference clock frequency
1)
f
EXT_CLK
12.99987
13.00013
MHz
Reference clock frequency tolerance
f
EXT_CLK
10
ppm
Reference clock amplitude
0.8
Vpp
Reference clock phase noice
∆
f = 15 kHz
-110
dBc/Hz
Supply voltage VCC
2.7
2.775
3.0
V
Supply voltage VCC_PA
3.2
4.2
V
Crystal tolerance
2)
±20
ppm
Output matching of ANT pin
VSWR
2:1
Antenna load
50
Ω
Logical input high
V
IH
0.9
×
VCC
VCC +0.3
V
Logical input low
V
IL
-0.3
+0.3
V
Rise/Fall time of all digital inputs
2
20
ns
Clock frequency of SI_CLK
4
MHz
Positive period of SI_CLK
76
ns
Operating temperature
T
Amb
TAmb
T
-20
+25
+55
°C
1)
If an external clock input is used then the XO_N crystal input can be used. The external clock should be AC coupled into the XO_N
input and the XO_P input shall be left unconnected.
2)
Crystal frequency can be trimmed by writing a 6-bit value to the XO_trim register in order to get ±10 ppm frequency tolerance.
DC and low frequency speci cations
Parameter
Condition
Symbol
Min
Typ
Max
Unit
Supply current
Transmit mode
3)
50
Receive mode
60
mA
Idle mode
4)
20
50
µA
XO_N input capacitance
3
pF
XO_P input capacitance
3
pF
XO_N Trim capacitance each step
Max 63 steps (6bits)
0.4
pF
XO_P Trim capacitance each step
Max 63 steps (6bits)
0.4
pF
Capacitance of all digital inputs
3
pF
Input leakage current
0.5< V
IN
<(VCC -0.5)
5
µA
Rise/Fall time of digital outputs
5)
2
20
ns
Rise/Fall time of RX Data
15k
Ω
+15pF
20
ns
Logical output high
V
OH
0.9
×
Vcc
VCC
V
Logical output low
V
OL
-0.3
0
+0.3
V
SYS_CLK frequency
f
EXT_CLK
MHz
TX_CLK frequency
1.0
MHz
LPO_CLK frequency
3.2
kHz
LPO_CLK frequency tolerance
250
ppm
3)
See Table 2.
4)
After at least 200 ms from shut down
5)
Driving a 10 pF load.
4
PBA 313 02
Receiver performance
Parameter
Condition
Symbol
Min
Typ
Max
Unit
Frequency Range
f
Range
2.402
2.480
GHz
Input and output impedance of ANT pin
50
Ω
Input matching of ANT pin (VSWR)
6)
2:1
Sensitivity level
2
BER = 0.1%
-83
-86
dBm
Carrier offset = ±75 kHz
Frequency dev = 160kHz
Max input level
BER = 0.1%
+14
dBm
RSSI value (See Table 1)
Co-Channel interference, C/I
co-channel
11
dB
Adjacent (±1 MHz) interference, C/I
1MHz
0
dB
Adjacent (±2 MHz) interference, C/I
2MHz
-30
dB
Adjacent (±3 MHz) interference, C/I
≥
3MHz
-40
dB
Image frequency interference, C/I
image
7)
-9
dB
Adjacent (1MHz) interference to in-band
Image frequency, C/I
image+1MHz
7)
-20
dB
Intermodulation rejection
7)
-39
dBm
LO leakage
-47
dBm
Spurious emission
30 MHz – 1 GHz
-47
dBm
1 GHz – 12.75 GHz
-47
dBm
Out-of-band blocking
7)
30-880 MHz
10)
+11
dBm
880-915 MHz
10)
+11
dBm
915-1710 MHz
10)
+11
dBm
1710-1785 MHz
10)
+11
dBm
1785-1850 MHz
10)
+11
dBm
1850-1980 MHz
10)
+11
dBm
1980-2000 MHz
10)
+11
dBm
2000-2100 MHz
10)
0
dBm
2100-2200 MHz
10)
-10
dBm
2200-2300 MHz
10)
-13
-27
dBm
2300-3000 MHz
10)
-15
-27
dBm
3000-12750 MHz
10,11)
-5
-10
dBm
6)
RX_ON must be high.
7)
PX_ON high and 0xBF written to the Enable register.
8)
Carrier signal level of –67 dBm, interferer Bluetooth modulated
9)
Carrier signal level of –60 dBm, interferer Bluetooth modulated
10)
Carrier signal level of –67 dBm, Continuous Wave (CW) interferer.
11)
Using two exemptions according to the BT speci cation
Table 1, RSSI performance
RSSI register value
Min
Typ
Max
Unit
0
-85
-85
-79
dBm
1
-83
-81
-78
dBm
2
-81
-80
-76
dBm
3
-80
-78
-75
dBm
4
-79
-77
-74
dBm
5
-78
-76
-73
dBm
6
-77
-75
-72
dBm
7
-76
-74
-70
dBm
8
-74
-72
-69
dBm
9
-72
-70
-66
dBm
10
-69
-68
-64
dBm
11
-67
-66
-62
dBm
12
-66
-64
-61
dBm
13
-65
-63
-60
dBm
14
-64
-62
-59
dBm
15
-63
-61
-59
dBm
RSSI register value
Min
Typ
Max
Unit
16
-62
-60
-57
dBm
17
-61
-59
-56
dBm
18
-60
-58
-54
dBm
19
-58
-56
-53
dBm
20
-57
-54
-52
dBm
21
-54
-53
-49
dBm
22
-53
-51
-48
dBm
23
-52
-50
-46
dBm
24
-51
-49
-46
dBm
25
-50
-48
-45
dBm
26
-50
-47
-44
dBm
27
-49
-46
-44
dBm
28
-48
-45
-43
dBm
29
-47
-44
-41
dBm
30
-45
-43
-40
dBm
31
-44
-41
-39
dBm
5
PBA 313 02
Transmitter performance
Parameter
Condition
Symbol
Min
Typ
Max
Unit
Maximum TX power
15)
14
17
20
dBm
Minimum TX power
15)
+4
dBm
Output power step size
2
8
dBm
Frequency accuracy (excluding crystal accuracy)
25
kHz
Frequency deviation
12)
0000111100001111
pattern
140
175
kHz
Minimum frequency deviation
12)
, 010101 pattern
115
kHz
TX carrier drift
1 slot
13)
(366 µs)
f
Drift1
±25
kHz
3 slots (1598 µs)
f
Drift1
±40
kHz
5 slots (2862 µs)
f
Drift1
±40
kHz
Drift rate
14)
400
Hz/µs
20 dB bandwidth with peak det.
1
MHz
Adjacent channel power
±2 MHz
-20
dBm
±3 MHz
-40
dBm
±4 MHz
-40
dBm
Spurious emissions
Harmonics,
-30
dBm
non-harmonics, <1 GHz,
-36
dBm
non-harmonics, >1 GHz
-30
dBm
Broadband noise
30 MHz-1.91 GHz
-160
dB/Hz
1.91 GHz- 2.3 GHz
-120
dB/Hz
2.5 GHz- 3.0 GHz
-120
dB/Hz
3.0 GHz- 12.75 GHz
-130
dB/Hz
Output impedance
50
Ω
Output
VSWR
2:1
12)
Measured differentially.
13)
Measured in a 5-slot packet.
14)
Measured in a 5-slot packet using curve tting to reduce noise in uence.
15)
See Table 2.
Table 2, transmitter power levels
16)
T
Amb
TAmb
T
=25°C, VCC =2.7V, f
Ref
= 13MHz, ±10ppm, VSWR
≤
2:1, VCC_PA
=3.2V
Register #16 setting
(XXXX XXXX XXXX ABCD)
17)
Register #24
setting
(00100ABC)
Pout
I
Tot
(I
Vcc
+I
Vcc_pa
)
Min
Typ
Max
Unit
Typ
Unit
ABCD = 1111
ABC = 111
14
16.5
20
dBm
175
mA
1100
101
12
dBm
120
mA
1001
101
8
dBm
90
mA
1001
011
4
dBm
75
mA
0111
100
0
dBm
63
mA
1000
001
-4
dBm
62
mA
0111
001
-8
dBm
54
mA
0110
010
-12
dBm
49
mA
0110
001
-16
dBm
48
mA
0110
000
-20
dBm
47
mA
0101
010
-24
dBm
46
mA
0101
000
-28
dBm
45
mA
16)
Power levels have typical 4dB steps. Power control exibility enables customer to specify smaller or larger power steps.
17)
X= Don’t care
6
PBA 313 02
Table 3, digital control registers
Register name
# bits
R or W
Address
Value at reset
Recommended Value
ext-PA-level
16
W
010000 = 16
00000000
00000000
See Table 2
VCO/mod. Test trim
8
W
010001 = 17
10001010
10001010
Chan
8
W
010010 = 18
00000010
RSSI
5
R
010010 = 18
XXXUUUUU
XO trim
7
W
010011 = 19
00000000
ID
8
R
010011 = 19
0100VVVV
Set during application trimming
LPO-hi
1
W
010100 = 20
XXXXXXX0
Set during application trimming
LPO-lo
8
W
010101 = 21
00000000
Set during application trimming
Control
8
W
010110 = 22
01000010
01000010
CHP control
8
W
010111 = 23
00000000
00001000
Power Control
8
W
011000 = 24
00000000
See Table 2
Enable
8
W
011001 = 25
00000000
Initial value
Fref
21
W
011010 = 26
XXX10011
11010110
00100000
Initial value
Initial value
Initial value
MidTiming
8
W
011011 = 27
00000000
Initial value
ModInc
21
W
011100 = 28
XXX11111
11110101
00000010
Initial value
Initial value
Initial value
DsmIn
21
W
011101 = 29
XXX00000
00000000
00000000
Initial value
Initial value
Initial value
DsmOut
8
W
011110 = 30
00000000
Initial value
Mux
7
W
011111 = 31
00000000
Initial value
W=Writable, R=Readable, X=n.a., U=Unde ned, V=Version number.
Table 4, short description of the PBA 313 02 pin-out.
(In the Type-column ”A” denotes Analog bipolar and ”D” Digital CMOS
Pin No.
Pin name
Type
Active
Description
A1
VCC
Power
-
Common power supply
A2
RX_ON
D in
High
Receiver power on
A3
VCC_DIG
Power
-
Digital power supply
A4
TX_ON
D in
High
Transmit power on
A5
PX_ON
D in
High
Packet on
A6
VCC_PA
Power
-
Power supply for external PA
B1
ANT
50
Ω
-
Antenna input/output
B2
GND
Ground
-
Common ground
B3
RX_DATA
D out
High
Received data output
B4
GND
Ground
-
Common ground
B5
TX_CLK
D out
-
1 MHz clock
B6
SYS_CLK_REQ
D in
High
System clock request
C1
GND
Ground
-
Common ground
C2
GND
Ground
-
Common ground
C3
GND
Ground
-
Common ground
C4
SI_CDI
D in
High
Serial data input
C5
LPO_CLK
D out
-
3.2 kHz clock
C6
GND
Ground
-
Common ground
C7
GND
Ground
-
Common ground
D1
NC
-
-
Not connected
D2
GND
Ground
-
Common ground
7
PBA 313 02
Pin No.
Pin name
Type
Active
Description
D3
SYS_CLK
D out
-
System clock (13 MHz)
D4
SI_CMS
D in
High
Serial data interface
D5
SI_CDO
D out
High
Serial data output
D6
GND
Ground
-
Common ground
D7
GND
Ground
-
Common ground
E1
GND
Ground
-
Common ground
E2
XO_P
A in
-
Crystal positive input
E3
XO_N
A in
-
Crystal negative input / external clock input
E4
PHD_OFF
D in
High
Open PLL
E5
TX_DATA
D in
High
Transmit data
E6
SI_CLK
D in
-
Serial interface clock (4MHz)
F1
TX_SW
D in
High
Controls the RX/TX switch
F2
NC
-
-
Not connected
F3
EXT_RESET
D in
Low
External reset
F4
POR
D out
High
Power on reset
F5
SYNT_ON
D in
High
Synthesiser power up
F6
NC
-
-
Not connected
G*
NC
-
-
Not connected & should not be grounded.
(Only for mechanical support).
Figure 2. Mechanical dimensions of PBA 313 02. (Seen through the module from the component side)
1 2 3 4 5 6
A
B
C
D
E
F
1 mm
0.6 mm
7
G1 G2
G3
G4 G5
G6 G7
G8
G9 G10
G11 G12
G13
G14 G15
G16 G17
G18
G19 G20
X-Y origin (0,0) The dimensions are 11.8 × 11.8 ±0.2 mm
X
Y
8
PBA 313 02
Physical dimensions
Parameter
Min
Typ
Max
Unit
Length
11.6
11.8
12.0
mm
Width
11.6
11.8
12.0
mm
Thickness
1.6
mm
Coplanarity
0.1
mm
Table 5, Pad co-ordinates for module PBA 313 02
Reference point is down, left corner (0,0) and units are mm.
Pad
X
Y
Pad
X
Y
Pad
X
Y
A1
3,4
8,4
D1
3,4
5,4
G1
0,8
11,0
A2
4,4
8,4
D2
4,4
5,4
G2
2,4
11,0
A3
5,4
8,4
D3
5,4
5,4
G3
1,6
10,2
A4
6,4
8,4
D4
6,4
5,4
G4
0,8
9,4
A5
7,4
8,4
D5
7,4
5,4
G5
2,4
9,4
A6
8,4
8,4
D6
8,4
5,4
G6
9,4
11,0
B1
3,4
7,4
D7
9,4
5,4
G7
11,0
11,0
B2
4,4
7,4
E1
3,4
4,4
G8
10,2
10,2
B3
5,4
7,4
E2
4,4
4,4
G8
10,2
10,2
B4
6,4
7,4
E3
5,4
4,4
G9
9,4
9,4
B5
7,4
7,4
E4
6,4
4,4
G10
11,0
9,4
B6
8,4
7,4
E5
7,4
4,4
G11
0,8
2,4
C1
3,4
6,4
E6
8,4
4,4
G12
2,4
2,4
C2
4,4
6,4
F1
3,4
3,4
G13
1,6
1,6
C3
5,4
6,4
F2
4,4
3,4
G14
0,8
0,8
C4
6,4
6,4
F3
5,4
3,4
G15
2,4
0,8
C5
7,4
6,4
F4
6,4
3,4
G16
9,4
2,4
C6
8,4
6,4
F5
7,4
3,4
G17
11,0
2,4
C7
9,4
6,4
F6
8,4
3,4
G18
10,2
1,6
G19
9,4
0.8
G20
11.0
0,8
PBA 313 02/1 P1N
Figure 3. Orientation of PBA 313 02 (Top and bottom layers of the module shown in the same orientation).
9
PBA 313 02
Functional description
PBA 313 02 is a long-range transceiver module for Bluetooth
applications. The transceiver operates in the globally
available 2.4 – 2.5 GHz ISM band. The module is a class 1
Bluetooth device.
The transceiver module is based on a BiCMOS application
speci c integrated circuit (ASIC). The antenna lter, the
RX and TX baluns, and the switch are all at least partially
integrated into the ceramic substrate onto which the
components of the module are mounted.
The maximum output power is +20 dBm and the sensitivity
(0.1% bit error rate) is –86 dBm (typical), measured at the
antenna pin.
Block diagram
PBA 313 02 is based on a single chip radio ASIC that utilises
a heterodyne receiver architecture with low intermediate
frequency. The transmitter utilises direct modulation of the
voltage controlled oscillator. A fractional N synthesiser is
used to enable different reference frequencies to be used.
There are also a number of other circuit blocks including
a crystal oscillator, a low power oscillator, power on reset
and frequency divider. The chip is controlled by the serial
interface.
The block diagram in gure 4 shows the simpli ed
architecture of the radio ASIC and seven major supporting
blocks on the module:
Radio ASIC
The receiver on the radio ASIC consists of a low noise
ampli er, followed by an image reject down converter. The
low IF signal of the mixer is fed to an on chip selectivity lter.
This is followed by a limiter, which generates the RSSI and
also maximises the signal before it is fed to the demodulator.
This is followed by a post detection lter and a slicer, which
outputs the data to a baseband.
The transmitter consists of a gaussian low pass lter to
shape the data before it directly modulates the voltage
controlled oscillator, which is run in open loop during
transmit. The VCO is buffered before driving the PA on the
module. The module output power is controlled by varying
the buffer and PA gain
VCO-tank
Part of the phase locked loop. The modulation is performed
directly on the VCO. To ensure high performance the VCO-
tank is laser trimmed
.
Loop lter
Generates the tuning voltage of the VCO-tank.
RX balun
Transformation from unbalanced (single-ended) to balanced
(differential) transmission. The major part of the balun is
integrated in the substrate.
TX balun
Biasing of the output ampli er in the radio ASIC and
transformation from balanced to unbalanced transmission.
The major part of the balun is integrated in the substrate.
Antenna switch
Directs the power either from the antenna lter to the receive
port or from the external PA output port to the antenna lter.
Antenna lter
Front end bandpass lter fully integrated in the ceramic
substrate.
External PA
Two stage GaAs Power Ampli er that operates from a
single supply and boosts the output power up to +20dBm,
mounted on the module. The output power is controlled by
an analogue signal from the ASIC.
Figure 4. Block diagram.
Radio ASIC
Loop
filter
VCO
tank
RX
balun
TX
balunPA
Switch
Antenna
filter
PBA 313 02/1
ANTENNA
PLL
Control
RX_DATA
RX_ON
SI*
*CLK
EXT_RESET
PHD_OFF
SYNT_ON
TX_DATA
TX_ON
VCC
VCC_PA
TX_SW
Det
XO
XON
XOP
Power
Control
RSSI
10
PBA 313 02
I/O signal description
Power supply
There are three connections feeding the Bluetooth radio,
VCC, VCC_DIG and VCC_PA. VCC supplies the sensitive RF
circuitry. It’s important that this supply is proper decoupled
and free from noise and other disturbances. VCC_DIG feeds
the digital circuitry of the module. The power ampli er is fed
from the VCC_PA rail. To avoid AM modulation on the TX
signal this pin should also be decoupled.
Oscillator or external clock input
XO_N and XO_P connects to the crystal’s inputs. The load
capacitance to the crystal can be trimmed using the XO-Trim
register (Depending on crystal, no external load capacitors
are required). If an external clock is used, it should be AC
coupled into the XO_N input and the XO_P input shall be left
unconnected.
Ground
Ground should be distributed with very low impedance as a
ground plane. Connect all GND connections to the ground
plane. It is critical to have a ground plane underneath the
Bluetooth radio in order to shield the VCO tank from any
electrical noise. The ground vias purpose is to connect
the local ground plane to the main ground layer. Note: If a
local ground plane cannot be directly placed underneath
the radio, then no routing should be planned underneath
the radio until a layer can be used as a local ground plane.
The Bluetooth radio will be self-shielding and no additional
shields should be necessary for normal operating conditions.
Antenna
The ANT pin should be connected to a 50
Ω
antenna
interface, thereby supporting the best signal strength
performance. Ericsson Microelectronics partners can
support application speci c antennas.
Input control
There are ve digital inputs available for the radio
controlling features of the PBA 313 02. The Bluetooth timing
requirements for these are described in table 6 and gure 5.
In addition, there is a digital input signal for hardware reset
of the radio, and a digital input signal for waking up the
clock circuitry after a sleep mode period.
PX_ON
Packet switch on control is active ‘high’. Activate this signal
during reception of a Bluetooth payload.
PX_ON is used to control the Slicer of the receiver. Since
the General Inquiry Access Code (GIAC), information in a
Bluetooth packet header contains an equal number of one’s
(+FMOD) and zero’s (-FMOD), the average frequency will
always be centred on the carrier frequency. This provides
the Slicer the reference for the fast tuning. If the fast mode
is not used during the header then the rst bits could be
interpreted incorrectly.
The slow mode gives a more accurate FSK compensation
of the thresholds for a one and a zero compared to the
fast mode; therefore, the BER is less. The fast mode (time
constant < 2µs) is used when PX_ON is deactivated and the
slow mode (time constant < 50µs) when it is activated.
SYNT_ON
Synthesiser on control is active ‘high’. Activate this signal to
power up of the VCO section of the radio. SYNT_ON is used
in both transmit and receive mode. This activates the PLL as
well as the VCO.
RX_ON
Receive-on control is active ‘high’. Activate this signal to
enable reception of Bluetooth data on the RX_DATA pin. The
transmit-on control (TX_ON) must be deactivated and the
synthesiser (SYNT_ON) activated if data is to be received.
TX SLOT
SYNT_ON
TX_ON
TX_SW
PHD_OFF
TX_DATA
RX_ON
SI
RX_DATA
PHD
to
t
s
t
TO
t
TD
tRD
t
R O
to
t
s
t
RX SLOT
PX_ON
Figure 5. Timing sequence for data transmission.
Symbol
Parameter
Min
Typical
Max
Unit
tS
One Slot time
625
µs
tS
Two Slot times
1875
µs
tS
Three Slot times
3125
µs
tTO
Transmitter On delay
102
µs
tTD
Delay before transmitting data
203
213
223
µs
tPHD
Phase Detector Off delay after tTO
104
µs
tD
Data sending period, one slot
366
µs
tD
Data sending period, two slots
1598
µs
tD
Data sending period, three slots
2862
µs
tRO
Receiver On delay
175
213
µs
tRD
Delay before receiving data
213
µs
Table 6. Timing requirements for data transmission.
11
PBA 313 02
TX_ON
Transmit-on control is active ‘high’. Activate this signal
to enable radio signal output on the ANT pin. The actual
transfer of data that exists on the TX_DATA input occurs
when PHD_OFF goes ‘high’. The receive-on control, RX_ON,
must also be ‘low’ and the transmit-switch, TX_SW, be held
“high” if data is to be transmitted.
TX_SW
Transmit-switch is active ”high”. This switch controls which
one of the TX_PA and the RX balun to be connected to the
antenna. During TX mode it should be held ”high”, the rest
of the time it should be ”low”. In system without a dedicated
control pin this signal can be connected to the TX_ON
signal.
PHD_OFF
Phase detector off control is active ‘high’. Activate this
signal in transmit mode to open the phase locked loop
(PLL) employed in the VCO section and enable modulation
of the carrier using the TX_DATA digital input. PHD_OFF is
activated after the initialisation of the SYNT_ON signal and
the TX_ON signal.
POR_EXT
External power on reset is active ‘high’. An external power-
on-reset digital input signal that will reset the radio controller
and its registers. A reset will occur on the positive edge
of POR_EXT signal. The signal should remain high during
operation.
SYS_CLK_REQ
System clock request control is active ‘high’. Once the
crystal oscillator bit (XOCTR, control register, bit #2) has
been set, use this control to switch off (sleep mode) and
wake up (idle and operating modes) the reference clock
circuitry and corresponding 13 MHz and 1 MHz clock output
ports of the module.
Output control
There are four digital output control signals available for
controlling external baseband circuitry.
POR
Power-on-reset digital output is activated after the power
has been applied to the Bluetooth radio or on a positive
edge of the POR_EXT digital input. POR has a transition
from ‘low’ to ‘high’ after four clock cycles have been
delivered to the baseband chip, see gure 6.
SYS_CLK
13 MHz system clock digital output available for the
baseband circuitry when the POR_EXT and SYS_CLK_REQ
are both ‘high’. SYS_CLK will also be available during start-
up, independent on the value of SYS_CLK_REQ.
TX_CLK
1 MHz transmit clock digital output available for the
baseband circuitry when the POR_EXT and SYS_CLK_REQ
(see above) are both ‘high’. TX_CLK changes value on rising
edges of SYS_CLK.
LPO_CLK
3.2 kHz low power oscillator clock digital output that
is adjustable by setting the internal LPOHI and LPOLO
registers (see gure 6).The clock output is available as soon
as the power supply is applied and POR_EXT is ‘high’.
The LPO is necessary for wake-up timing in the baseband
circuitry, if the Ericsson baseband is used.
Data interface
Two digital signals are used for data ow over the air
interface.
TX_DATA
Transmit data digital control is active ‘high’
18)
. The radio
module feeds Bluetooth data (1 Mbit/s) directly
19)
to the
radio frequency modulator when PHD_OFF is activated. The
total delay from the TX_DATA pin to the ANT pin is typically
0.5 µs.
18)
The TX_polarity bit of Enable register should be set to ’1’
(positive polarity) for normal operation.
A logic ’high’ value will then result in a positive frequency
deviation output on the ANT pin.
19)
Data on the TX_DATA pin is digitally buffered before it is
fed to the radio frequency modulator.
0 0.5ms 1.0ms 1.5ms 2.0ms 2.5ms 3.0ms 3.5ms 4.0ms
VCC
POR_EXT
SYS_CLK_REQ
LPO_CLK
Control
Register
SYS_CLK
POR
Vcc
’1’
’0’ or ’1’
10000XX
Figure 6. Powering up the module.
12
PBA 313 02
RX_DATA
Receive data digital output is active ‘high’. The radio module
latches out Bluetooth data (1 Mbit/s) on the RX_DATA pin
on falling edges of SYS_CLK when RX_ON is activated. The
total delay from the ANT pin to the RX_DATA pin is typically
2.5 µs.
Serial interface
The serial control interface is a JTAG Boundary-Scan
Architecture (IEEE Std 1149.1). Interconnection between
the serial interface and the external controller (baseband
circuit) consists of four 1-bit digital signals; control data
input (SI_CDI), control mode select (SI_CMS), control clock
(SI_CLK) and control data output (SI_CDO). The timing of
these signals are de ned in gure 7.
(Footnotes)
Assembly guidelines
Solder paste
The PBA 313 02 module is made for surface mounting with
land grid array (LGA) gold solder joints. To assemble the
module, solder paste (eutectic Tin/Lead) must be printed
at the target surface. Preferred solder paste height is 100-
127µm (4-5 mil).
Soldering pro le
It must be noted that the module should not be allowed to
be hanging upside down in the re ow operation. This means
that the module has to be assembled on the side of the PCB
that is soldered last. The re ow process should be a regular
surface mount soldering pro le (full convection strongly
preferred), the ramp-up should not be more than 3°C/s
and with a peak temperature of 210-225°C during 10-20
seconds. Max sloping rate should not exceed 4°C/s.
Pad size
It is recommended that the pads on the PCB should have a
diameter of 0.5-0.7mm. The surface nish on the PCB pads
should be Nickel/Gold or a at Tin/Lead surface or OSP
(Organic Surface Protection).
Placement
The recommended pickup co-ordinates for the PBA 313
02 shield is based on a nozzle with inner diameter 2 mm
and outer diameter 3.17 mm. The centre of the shield is the
origin of co-ordinates, (0,0) for (x,y), giving the pickup co-
ordinates (5.9mm, 5.9mm) for (x,y).
Storage
Keep the component in its dry pack when not yet using
the reel. After removal from the dry pack ensure that the
modules are soldered onto the PCB within 48 hours.
Temperature profile
0
50
100
150
200
250
0 50 100 150 200 250
Time (s)
Temperature (˚C)
max 120 s
60-125 s
183˚C
10-20s
max rising 3˚C/s
max sloping 4˚C/s
Min Typ Max Unit
tSI_CLK 200 250 ns
tSI_CLK2 76 76 ns
t120 ns
t220 ns
SI_ CLK
SI _CDI
SI _CDO
SI_ CMS
t2
tSI_CLK
t1
tSI_CLK2
Figure 8. Temperature pro le.
Figure 7. Timing diagram of the serial interface.
13
PBA 313 02
Module marking
Each module is marked on the shield with the following
information:
•
Ericsson logotype
•
Product No with index
•
Revision state
•
Manufacturing unit code
•
Production year and week
•
Bluetooth trademark
•
FCC product code
•
CE marking
Reel marking
The reel, reel box and dry pack has a label with the following
information:
•
Ericsson product number with revision
•
Customer product number with revision
•
Quantity
•
Reel-ID. (Batch No)
•
Factory code
•
Manufacturing date
•
Country of origin
•
Ericsson logotype
1-6 above is also printed in BAR-code format
Contacting Ericsson Microelectronics
For further information regarding Bluetooth technology,
components and development tools,
please contact Ericsson Microelectronics:
Information given in this data sheet is believed to be accurate and reliable.
However no responsibility is assumed for the consequences of its use nor for
any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or
patent rights of Ericsson Microelectronics. These products are sold only accor-
ding to Ericsson Microelectronics' general conditions of sale, unless otherwise
con rmed in writing. Speci cations subject to change without notice.
Ericsson Microelectronics
SE-164 81 Kista, Sweden
Telephone: +46 8 757 50 00
Internet: www.ericsson.com/microelectronics
For local sales contacts, please refer to our website
or call: Int + 46 8 757 47 00, Fax: +46 8 757 47 76
EN/LZT 146 189 R1A
© Ericsson Microelectronics AB, June 2002
Preliminary Data Sheet
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