D20V0L1B2LP
Document number: DS38148 Rev. 2 - 2
1 of 6
www.diodes.com
November 2018
© Diodes Incorporated
D20V0L1B2LP
ADVANCE INFO R MA T I O N
ADVANCE INFO R MA T I O N
20V BIDIRECTIONAL TVS DIODE
Product Summary
VBR Min
IPP Max
CT Typ
21V
2A
7pF
Description
This new generation TVS is designed to protect sensitive electronics
from damage due to ESD. The combination of small-size and high
ESD surge capability makes it ideal for use in portable applications
such as cellular phones, digital cameras, and MP3 players.
Applications
Cellular Handsets
Portable Electronics
Computers and Peripherals
Features
Low Profile Package (0.53mm Max) and Ultra-Small PCB Footprint
Area (1.08 x 0.68mm Max) Suitable for Compact Portable
Electronics
Provides ESD Protection per IEC 61000-4-2 Standard:
Air ±20kV, Contact ±15kV
One Channel of ESD Protection
Low Channel Input Capacitance
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: X1-DFN1006-2
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.001 grams (Approximate)
Ordering Information (Note 4)
Part Number
Compliance
Marking
Reel Size (inches)
Tape Width (mm)
Quantity per Reel
D20V0L1B2LP-7B
Commercial
DB
7
8
10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
Device Schematic
X1-DFN1006-2
DB = Product Type Marking Code
Bar Denotes Pin 1
DB
e4
Bottom View
Pin 1
Pin 2
e4
D20V0L1B2LP
Document number: DS38148 Rev. 2 - 2
2 of 6
www.diodes.com
November 2018
© Diodes Incorporated
D20V0L1B2LP
ADVANC E INF O R MA TI O N
ADVANC E INF O R MA TI O N
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Conditions
Peak Pulse Power Dissipation
PPP
68
W
8/20µs, See Figure 3
Peak Pulse Current
IPP
2.0
A
8/20µs, See Figure 3
ESD Protection – Contact Discharge
VESD_CONTACT
±15
kV
IEC 61000-4-2 Standard
ESD Protection – Air Discharge
VESD_AIR
±20
kV
IEC 61000-4-2 Standard
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Package Power Dissipation (Note 5)
PD
250
mW
Thermal Resistance, Junction to Ambient (Note 5)
RθJA
500
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Conditions
Reverse Standoff Voltage
VRWM
—
—
20
V
—
Channel Leakage Current (Note 6)
IRM
—
—
100
nA
VRWM = 20V
Clamping Voltage, Positive Transients
VCL
—
27
30
V
IPP = 1A, tP = 8/20μs
—
30
34
V
IPP = 2A, tP = 8/20μs
Breakdown Voltage
VBR
21
—
25
V
IR = 1mA
Differential Resistance
RDIF
—
2.2
—
Ω
IR = 1A, tP = 8/20μs
Channel Input Capacitance
CT
—
7.0
12
pF
VR = 0V, f = 1MHz
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes Incorporated’s website at http://www.diodes.com/package-outlines.html.
6. Short duration pulse test used to minimize self-heating effect.
0 125 175
150
50
100
0
T , AMBIENT TEMPERATURE ( C)
Figure 1 Power Derating Curve
A°
P , POWER DISSIPATION (mW)
D
25 10050 75 150
25
75
125
250
175
Note 5
200
225
0
50
25 50 75 100 125 150
PEAK PULSE DERATING % OF
PEAK POWER OR CURRENT
T , AMBIENT TEMPERATURE (
癈
)
Figure 2 Pulse Derating Curve
A
0
100
25
75
175 200
(°C)
D20V0L1B2LP
Document number: DS38148 Rev. 2 - 2
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November 2018
© Diodes Incorporated
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ADVANC E INF O R MA TI O N
ADVANC E INF O R MA TI O N
Figure 6 ESD Response to IEC 61000-4-2
(+8kV Contact Discharge)
Figure 7 ESD Response to IEC 61000-4-2
(-8kV Contact Discharge)
0t, TIME ( s)
Figure 3 Pulse Waveform
20 40 60
100
50
0
Peak Value Ipp
Half Value I /2
pp
8x20 Waveform
as defined by R.E.A.
I , PEAK PULSE CURRENT (%I )
P ppP
0
2
4
6
8
10
0 5 10 15 20
V , REVERSE VOLTAGE (V)
R
Figure 5 Typical Total Capacitance vs. Reverse Voltage
C , TOTAL CAPACITANCE (pF)
J
f = 1MHz
20ns/div
40V/div
20ns/div
40V/div
0
2
4
6
8
10
12
14
16
18
20
0 5 10 15 20 25 30 35
TLP VOLTAGE (V)
Figure 8 Transmission Line Pulsing (TLP) Current vs. Voltage
TLP CURRENT (A)
1
10
0
5
10
15
20
I
,
L
E
A
K
A
G
E
C
U
R
R
E
N
T
(
n
A
)
R
Figure 4 Typical Reverse Characteristics
V , REVERSE VOLTAGE (V)
R
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
T = -55°C
A
IR, LEAKAGE CURRENT (nA)
Time (ns)
Time (ns)
VOLTAGE (V)
VOLTAGE (V)
D20V0L1B2LP
Document number: DS38148 Rev. 2 - 2
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November 2018
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ADVANC E INF O R MA TI O N
0
1
2
3
25 27 29 31 33
IPP, CURRENT FROM PIN1 TO PIN2 / PIN2 TO
PIN1 (A)
VC FROM PIN1 TO PIN2/PIN2 TO PIN1 (V)
Figure 9 Clamping Voltage Characteristic
IEC61000-4-5
(Lighting)
Pin1 to Pin2
Pin2 to Pin1
D20V0L1B2LP
Document number: DS38148 Rev. 2 - 2
5 of 6
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November 2018
© Diodes Incorporated
D20V0L1B2LP
ADVANC E INF O R MA TI O N
ADVANC E INF O R MA TI O N
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X1-DFN1006-2
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X1-DFN1006-2
X1-DFN1006-2
Dim
Min
Max
Typ
A
0.47
0.53
0.50
A1
0
0.05
0.03
b
0.45
0.55
0.50
D
0.95
1.075
1.00
E
0.55
0.675
0.60
e
–
–
0.40
L
0.20
0.30
0.25
R
0.05
0.15
0.10
All Dimensions in mm
Dimensions
Value (in mm)
C
0.70
G
0.30
X
0.40
X1
1.10
Y
0.70
L
Eb
R
e
D
A1
A
X1
Y
C
X
G
D20V0L1B2LP
Document number: DS38148 Rev. 2 - 2
6 of 6
www.diodes.com
November 2018
© Diodes Incorporated
D20V0L1B2LP
ADVANC E INF O R MA TI O N
ADVANC E INF O R MA TI O N
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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