5.7 kV rms, Signal Isolated, Basic CAN FD Transceiver ADM3050E-EP FEATURES FUNCTIONAL BLOCK DIAGRAM 5.7 kV rms signal isolated CAN FD transceiver 1.7 V to 5.5 V supply and logic side levels 4.5 V to 5.5 V supply on bus side ISO 11898-2:2016-compliant CAN FD Data rates up to 12 Mbps for CAN FD Low maximum loop propagation delay: 145 ns Extended common-mode range (VCANx): 25 V Bus fault protection (CANH, CANL): 40 V Passes EN 55022, Class B by 6 dB Safety and regulatory approvals VDE certificate of conformity, VDE V 0884-10 (pending) UL: 5700 V rms for 1-minute duration per UL 1577 (pending) CSA component acceptance 5A at 5.7 kV rms IEC 60950, IEC 61010 (pending) High CMTI: >75 kV/s VDD1 VDD2 ADM3050E-EP CAN TRANSCEIVER DIGITAL ISOLATOR DOMINANT TIMEOUT TXD CANH RXD CANL THERMAL SHUTDOWN GND2 GND1 17317-001 Enhanced Product Figure 1. ENHANCED PRODUCT FEATURES Supports defense and aerospace applications (AQEC standard) Military temperature range (-55C to +125C) Controlled manufacturing baseline 1 assembly/test site 1 fabrication site Product change notification Qualification data available on request APPLICATIONS CANOpen, DeviceNet, and other CAN bus implementations Industrial automation Military and aerospace (MILA) avionics for sensors, actuators, and engine control GENERAL DESCRIPTION The ADM3050E-EP is a 5.7 kV rms isolated controller area network (CAN) physical layer transceiver with a high performance, basic feature set. The ADM3050E-EP fully meets the CAN flexible data rate (CAN FD) ISO 11898-2:2016 requirements and is further capable of supporting data rates as high as 12 Mbps. The device employs Analog Devices, Inc., iCoupler(R) technology to combine a 2-channel isolator and a CAN transceiver into a single small outline integrated circuit (SOIC) surface-mount package. The ADM3050E-EP is a fully isolated solution for CAN and CAN FD applications. The ADM3050E-EP provides isolation between the CAN controller and physical layer bus. Safety and regulatory approvals (pending) for a 5.7 kV rms Rev. 0 withstand voltage, an 849 VPEAK working voltage, and a 12.8 kV surge test, ensure that the ADM3050E-EP meets application isolation requirements. Low loop propagation delays and the extended common-mode range of 25 V support robust communication on longer bus cables. Dominant timeout functionality protects against bus lock up in a fault condition, and current limiting and thermal shutdown features protect against output short circuits. The CAN bus input and output pins are protected to 40 V against accidental connection to a +24 V bus supply. The device is fully specified over the -55C to +125C industrial temperature range. Additional application and technical information can be found in the ADM3050E data sheet. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 (c)2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADM3050E-EP Enhanced Product TABLE OF CONTENTS Features .............................................................................................. 1 Enhanced Product Features ............................................................ 1 DIN V VDE V 0884-10 (VDE V 0884-10) Insulation Characteristics (Pending) .............................................................7 Applications ....................................................................................... 1 Absolute Maximum Ratings ............................................................8 Functional Block Diagram .............................................................. 1 Thermal Resistance .......................................................................8 General Description ......................................................................... 1 ESD Caution...................................................................................8 Revision History ............................................................................... 2 Pin Configuration and Function Descriptions..............................9 Specifications..................................................................................... 3 Operational Truth Table ...............................................................9 Timing Specifications .................................................................. 5 Typical Performance Characteristics ........................................... 10 Insulation and Safety Related Specifications ............................ 6 Test Circuits ..................................................................................... 12 Package Characteristics ............................................................... 6 Outline Dimensions ....................................................................... 13 Regulatory Information ............................................................... 6 Ordering Guide .......................................................................... 13 REVISION HISTORY 2/2019--Revision 0: Initial Version Rev. 0 | Page 2 of 13 Enhanced Product ADM3050E-EP SPECIFICATIONS All voltages are relative to their respective ground, 1.7 V VDD1 5.5 V, 4.5 V VDD2 5.5 V, and -55C TA +125C, unless otherwise noted. Typical specifications are at VDD1 = VDD2 = 5 V and TA = 25C, unless otherwise noted. Table 1. Parameter SUPPLY CURRENT Bus Side Recessive State Dominant State 70% Dominant/30% Recessive 1 Mbps 5 Mbps 12 Mbps Logic Side iCoupler Current DRIVER Differential Outputs Recessive State Voltage CANH, CANL Differential Output Dominant State Voltage CANH CANL Differential Output Output Symmetry (VDD2 - VCANH to VCANL) Short-Circuit Current Absolute CANH CANL Steady State CANH CANL Logic Input TXD Input Voltage High Low Complementary Metal-Oxide Semiconductor (CMOS) Logic Input Currents RECEIVER Differential Inputs Differential Input Voltage Range Recessive Dominant Input Voltage Hysteresis Unpowered Input Leakage Current Symbol Min Typ Max Unit Test Conditions/Comments 5.3 63 7 75 mA mA 73 mA TXD high, load resistance (RL) = 60 Limited by transmit dominant timeout (tDT), RL = 60 Limited by tDT, RL = 60 , 4.75 V VDD2 5.25 V Worst case, RL = 60 58 60 65 5.5 mA mA mA mA IDD2 45 49 58 IDD1 TXD high, low, or switching See Figure 18 TXD high, RL, and common-mode filter capacitor (CF) open VCANL, VCANH VOD 2.0 -500 3.0 +50 V mV VCANH VCANL VOD 2.75 0.5 1.5 1.4 1.5 -0.55 4.5 2.0 3.0 3.3 5.0 +0.55 V V V V V V TXD low, CF open 50 RL 65 50 RL 65 50 RL 65 45 RL 70 RL = 2240 RL = 60 , CF = 4.7 nF RL open 115 115 mA mA VCANH = -3 V VCANL = 18 V 115 115 mA mA VCANH = -24 V VCANL = 24 V 0.35 x VDD1 10 V V A Input high or low VSYM |ISC| VIH VIL |IIH|, |IIL| 0.65 x VDD1 VID See Figure 19, RXD capacitance (CRXD) open, -25 V < VCANL, VCANH < +25 V -1.0 0.9 VHYS |IIN (OFF)| +0.5 5.0 150 10 Rev. 0 | Page 3 of 13 V V mV A VCANH, VCANL = 5 V, VDD2 = 0 V ADM3050E-EP Parameter Input Resistance CANH, CANL Differential Input Resistance Matching CANH, CANL Input Capacitance Differential Input Capacitance Logic Output (RXD) Output Voltage Low High Short-Circuit Current COMMON-MODE TRANSIENT IMMUNITY (CMTI)1 Input High, Recessive Input Low, Dominant 1 Enhanced Product Symbol Min RINH, RINL RDIFF mR CINH, CINL CDIFF 6 20 -0.03 Typ Max Unit 25 100 +0.03 k k 35 12 0.2 Test Conditions/Comments mR = 2 x (RINH - RINL)/(RINH + RINL) pF pF VOL VOH IOS VDD1 - 0.2 7 0.4 |CMH| 75 100 kV/s |CML| 75 100 kV/s 85 V V mA Output impedance (IOUT) = 2 mA IOUT = -2 mA Output voltage (VOUT) = GND1 or VDD1 Common-mode voltage (VCM) 1 kV, transient magnitude 800 V Input voltage (VIN) = VDD1 (TXD) or CANH/CANL recessive VIN = 0 V (TXD) or CANH/CANL dominant |CMH| is the maximum common-mode voltage slew rate that can be sustained while maintaining CANH/CANL recessive or RXD VDD1 - 0.2 V. |CML| is the maximum common-mode voltage slew rate that can be sustained while maintaining CANH/CANL dominant or RXD 0.4 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. Rev. 0 | Page 4 of 13 Enhanced Product ADM3050E-EP TIMING SPECIFICATIONS All voltages are relative to their respective ground, 1.7 V VDD1 5.5 V, 4.5 V VDD2 5.5 V, and -55C TA +125C, unless otherwise noted. Typical specifications are at VDD1 = VDD2 = 5 V and TA = 25C, unless otherwise noted. See the ADM3050E data sheet for information about tBIT_BUS. Table 2. Parameter DRIVER Symbol Min Maximum Data Rate Typ Max Unit 12 Propagation Delay from TXD to Bus (Recessive to Dominant) Propagation Delay from TXD to Bus (Dominant to Recessive) Transmit Dominant Timeout RECEIVER tTXD_DOM tTXD_REC tDT Falling Edge Loop Propagation Delay (TXD to RXD) Rising Edge Loop Propagation Delay (TXD to RXD) Loop Delay Symmetry (Minimum Recessive Bit Width) 2 Mbps 5 Mbps 8 Mbps 12 Mbps tLOOP_FALL tLOOP_RISE tBIT_RXD Mbps 35 45 1175 450 160 85 50 60 70 4000 ns ns s 145 145 ns ns 550 220 140 91.6 ns ns ns ns Timing Diagrams TXD 0.7VDD1 0.3VDD1 VDD1 0.3VDD1 0V 5 x tBIT_TXD tBIT_TXD tLOOP_FALL 0.9V 0.5V tTXD_REC tBIT_BUS tTXD_DOM 0.7VDD1 RXD 0.3VDD1 tBIT_RXD VDD1 0V tLOOP_RISE Figure 2. Transceiver Timing Diagram tDT 17317-103 TXD VOD Figure 3. Dominant Timeout, tDT Rev. 0 | Page 5 of 13 17317-002 VOD/VID Test Conditions/Comments See Figure 2 and Figure 18, tBIT_TXD = 200 ns, RL = 60 , CL = 100 pF TXD low, see Figure 3 See Figure 2 and Figure 20, tBIT_TXD = 200 ns, RL = 60 , CL = 100 pF, CRXD = 15 pF tBIT_TXD = 500 ns tBIT_TXD = 200 ns tBIT_TXD = 125 ns tBIT_TXD = 83.3 ns ADM3050E-EP Enhanced Product INSULATION AND SAFETY RELATED SPECIFICATIONS For additional information, see www.analog.com/icouplersafety. Table 3. Parameter Rated Dielectric Insulation Voltage Minimum External Air Gap (Clearance) Symbol L (I01) Value 5700 7.8 Unit V rms mm min Minimum External Tracking (Creepage) L (I02) 7.8 mm min Minimum Clearance in the Plane of the Printed Circuit Board (PCB) Clearance L (PCB) 8.3 mm min CTI 25.5 >600 I m min V Minimum Internal Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) Material Group Test Conditions/Comments 1-minute duration Measured from input terminals to output terminals, shortest distance through air Measured from input terminals to output terminals, shortest distance path along body Measured from input terminals to output terminals, shortest distance through air, line of sight, in the PCB mounting plane Insulation distance through insulation DIN IEC 112/VDE 0303 Part 1 Material group (DIN VDE 0110, 1/89, Table 1) PACKAGE CHARACTERISTICS Table 4. Parameter Resistance (Input to Output)1 Capacitance (Input to Output)1 Input Capacitance2 1 2 Symbol RI-O CI-O CI Min Typ 1013 1.1 4.0 Max Unit pF pF Test Conditions/Comments f = 1 MHz The device is considered a two-terminal device: Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together. Input capacitance is from any input data pin to ground. REGULATORY INFORMATION See Table 9 and the ADM3050E data sheet for the recommended maximum working voltages for specific cross isolation waveforms and insulation levels. The ADM3050E-EP is pending approval or approved by the organizations listed in Table 5. Table 5. UL (Pending) CSA (Pending) VDE (Pending) CQC (Pending) UL1577 Component Recognition Program1 Approved under CSA Component Acceptance Notice 5A DIN V VDE V 0884-10 (VDE V 0884-10):2006-122 Certified under CQC11471543-2012 Single Protection, 5700 V rms Isolation Voltage CSA 60950-1-07+A1+A2 and IEC 60950-1, second edition, +A1+A2: Reinforced insulation, 849 VPEAK, VIOTM = 8 kVPEAK GB4943.1-2011 Basic insulation at 780 V rms (1103 VPEAK) Basic insulation at 780 V rms (1103 VPEAK) Reinforced insulation at 390 V rms (552 VPEAK) Reinforced insulation at 390 V rms (552 VPEAK) IEC 60601-1 Edition 3.1: Basic insulation (1 MOPP), 490 V rms (686 VPEAK) Reinforced insulation (2 MOPP), 238 V rms (325 VPEAK) CSA 61010-1-12 and IEC 61010-1 third edition: Basic insulation at: 300 V rms mains, 780 V secondary (1103 VPEAK) Reinforced insulation at: 300 V rms mains, 390 V secondary (552 VPEAK) File E214100 1 2 File 205078 File 2471900-4880-0001 File (pending) In accordance with UL 1577, each ADM3050E-EP is proof tested by applying an insulation test voltage 6840 V rms for 1 sec. In accordance with DIN V VDE V 0884-10, each ADM3050E-EP is proof tested by applying an insulation test voltage 1592 V peak for 1 sec (partial discharge detection limit = 5 pC). The * marking branded on the component designates DIN V VDE V 0884-10 approval. Rev. 0 | Page 6 of 13 Enhanced Product ADM3050E-EP DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS (PENDING) These isolators are suitable for reinforced electrical isolation only within the safety limit data. Protective circuits ensure the maintenance of the safety data. Table 6. Description Installation Classification per DIN VDE 0110 For Rated Mains Voltage 150 V rms For Rated Mains Voltage 300 V rms For Rated Mains Voltage 600 V rms Climatic Classification Pollution Degree per DIN VDE 0110, Table 1 Maximum Working Insulation Voltage Reinforced Basic, DC Working Voltage Test Conditions/Comments Symbol Characteristic Unit I to IV I to IV I to IV 40/125/21 2 See the Absolute Maximum Ratings section and Table 9 for the maximum continuous working voltage for ac bipolar, ac unipolar, and dc voltages, basic and reinforced insulation, and 50 year lifetime to 1% failure VIORM x 1.875 = Vpd (m), 100% production test, tini = tm = 1 sec, partial discharge < 5 pC Input to Output Test Voltage, Method B1 Input to Output Test Voltage, Method A After Environmental Tests Subgroup 1 VIORM VIORM(DC) 849 1500 VPEAK VDC Vpd (m) 1592 VPEAK 1274 VPEAK 1019 VPEAK VIOTM VIMPULSE 8000 8000 VPEAK VPEAK VIOSM VIOSM 12000 8000 VPEAK VPEAK VPEAK TS PS RS 150 2.08 >109 C W Vpd (m) VIORM x 1.5 = Vpd (m), tini = 60 sec, tm = 10 sec, partial discharge < 5 pC VIORM x 1.2 = Vpd (m), tini = 60 sec, tm = 10 sec, partial discharge < 5 pC After Input and/or Safety Test Subgroup 2 and Subgroup 3 Highest Allowable Overvoltage Impulse 1.2 s rise time, 50 s, 50% fall time in air to the preferred sequence Surge Isolation Voltage Basic Reinforced Safety Limiting Values Maximum Junction Temperature Total Power Dissipation at 25C Insulation Resistance at TS VPEAK = 12.8 kV, 1.2 s rise time, 50 s, and 50% fall time VPEAK = 12.8 kV, 1.2 s rise time, 50 s, and 50% fall time Maximum value allowed in the event of a failure (see Figure 4) Test voltage = 500 V SAFE LIMITING POWER (W) 2.5 2.0 1.5 1.0 0 0 50 100 150 AMBIENT TEMPERATURE (C) 200 14971-104 0.5 Figure 4. Thermal Derating Curve, Dependence of Safety Limiting Values with Ambient Temperature per DIN V VDE V 0884-10 (See the Thermal Resistance Section for Additional Information) Rev. 0 | Page 7 of 13 ADM3050E-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Pin voltages with respect to GND1/GND2 are on same side, unless otherwise noted. Table 7. Parameter VDD1/VDD2 Logic Side Input and Output: TXD, RXD CANH, CANL Operating Temperature Range Storage Temperature Range Maximum Junction Temperature (TJ) Electrostatic Discharge (ESD), IEC 61000-4-2, CANH/CANL Across Isolation Barrier with Respect to GND1 Contact Discharge with Respect to GND2 Air Discharge with Respect to GND2 Human Body Model (HBM), All Pins, 1.5 k, 100 pF Moisture Sensitivity Level (MSL) Rating -0.5 V to +6 V -0.5 V to VDD1 + 0.5 V -40 V to +40 V -55C to +125C -65C to +150C 150C Thermal performance is directly linked to PCB design and operating environment. Careful attention to PCB thermal design is required. The thermal resistance value specified in Table 8 is simulated based on JEDEC specifications (unless specified otherwise) and must be used in compliance with JESD51-12. Table 8. Thermal Resistance Package Type RW-161 1 8 kV JA 60 Unit C/W The JA value is based on simulations of a devices mounted on a JEDEC standard, 4-layer board with fine width traces and still air. See the ADM3050E data sheet for the thermal model definitions. 8 kV typical ESD CAUTION 15 kV 4 kV MSL3 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Table 9. Maximum Continuous Working Voltage1 Parameter AC Voltage Bipolar Waveform Basic Insulation Reinforced Insulation Unipolar Waveform Basic Insulation Reinforced Insulation DC Voltage Basic Insulation Reinforced Insulation 1 2 Insulation Rating (20-Year Lifetime)2 VDE 0884-11 Lifetime Conditions Fulfilled 849 VPEAK 707 VPEAK Lifetime limited by insulation lifetime per VDE-0884-11 Lifetime limited by insulation lifetime per VDE-0884-11 1697 VPEAK 1275 VPEAK Lifetime limited by insulation lifetime per VDE-0884-11 Lifetime limited by package creepage per IEC 60664-1 1560 VPEAK 780 VPEAK Lifetime limited by package creepage per IEC 60664-1 Lifetime limited by package creepage per IEC 60664-1 The maximum continuous working voltage refers to the continuous voltage magnitude imposed across the isolation barrier. See the ADM3050E data sheet for more details. Insulation capability without regard to creepage limitations. Working voltage may be limited by the PCB creepage when considering rms voltages for components soldered to a PCB (assumes Material Group I up to 1250 V rms), or by the SOIC_W package creepage of 7.8 mm, when considering rms voltages for Material Group II. Rev. 0 | Page 8 of 13 Enhanced Product ADM3050E-EP PIN CONFIGURATION AND FUNCTION DESCRIPTIONS VDD1 1 16 VDD2 GND1 2 15 GND2 RXD 3 NC 4 ADM3050E-EP 13 CANH NC 5 TOP VIEW (Not to Scale) 12 CANL 14 NC TXD 6 11 NC GND1 7 10 GND2 GND1 8 9 NOTES 1. NC = NO CONNECT. NO INTERNAL CONNECTION TO IC. 17317-004 GND2 Figure 5. Pin Configuration Table 10. Pin Function Descriptions Pin No. 1 2, 7, 8 3 4, 5, 11, 14 6 9, 10, 15 12 13 16 Mnemonic VDD1 GND1 RXD NC TXD GND2 CANL CANH VDD2 Description Power Supply, Logic Side, 1.7 V to 5.5 V. This pin requires a 0.1 F decoupling capacitor. Ground, Logic Side. Receiver Output Data. No Connect. No internal connection to IC. Driver Input Data. Ground, Bus Side. CAN Low Input and Output. CAN High Input and Output. Power Supply, Bus Side, 4.5 V to 5.5 V. This pin requires a 0.1 F decoupling capacitor. OPERATIONAL TRUTH TABLE Table 11. Truth Table VDD1 On On Off On VDD2 On On On Off TXD Low High Don't care Don't care Mode Normal Normal Normal Transceiver off RXD Low High per bus Indeterminate High Rev. 0 | Page 9 of 13 CANH/CANL Dominant (limited by tDT) Recessive and set by bus Recessive and set by bus High-Z ADM3050E-EP Enhanced Product TYPICAL PERFORMANCE CHARACTERISTICS 3.5 VDD1 VDD1 VDD1 VDD1 3.1 43 = 5.0V = 3.3V = 2.5V = 1.8V -35 -15 39 2.7 2.5 2.3 37 35 33 2.1 31 1.9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DATA RATE (Mbps) 27 -55 17317-106 0 85 105 125 105 125 105 125 53 VDD2 = 4.5V VDD2 = 5V VDD2 = 5.5V 55 51 50 VDD1 VDD1 VDD1 VDD1 = 1.8V = 2.5V = 3.3V = 5.0V -35 -15 45 40 47 45 35 43 30 41 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DATA RATE (Mbps) 39 -55 25 5 45 65 85 TEMPERATURE (C) Figure 7. Supply Current (IDD2) vs. Data Rate 17317-110 tTXD_REC (ns) 49 17317-107 SUPPLY CURRENT, IDD2 (mA) 65 Figure 9. tTXD_DOM vs. Temperature 60 Figure 10. tTXD_REC vs. Temperature 135 180 170 130 160 VDD1 VDD1 VDD1 VDD1 = 1.8V = 2.5V = 3.3V = 5.0V 125 tLOOP_RISE (ns) 150 140 130 120 110 120 115 110 100 105 80 -55 -35 -15 5 25 45 65 85 105 TEMPERATURE (C) 125 Figure 8. Receiver Input Hysteresis vs. Temperature 100 -55 -35 -15 5 25 45 65 85 TEMPERATURE (C) Figure 11. tLOOP_RISE vs. Temperature Rev. 0 | Page 10 of 13 17317-111 90 17317-108 RECEIVER INPUT HYSTERESIS (mV) 45 TEMPERATURE (C) Figure 6. Supply Current (IDD1) vs. Data Rate 25 25 5 17317-109 29 1.7 1.5 VDD1 VDD1 VDD1 VDD1 41 2.9 tTXD_DOM (ns) SUPPLY CURRENT, IDD1 (mA) 3.3 45 = 1.8V = 2.5V = 3.3V = 5.0V Enhanced Product ADM3050E-EP 2.8 125 = 1.8V = 2.5V = 3.3V = 5.0V VDD1 VDD1 VDD1 VDD1 2.6 SUPPLY CURRENT, IDD1 (mA) tLOOP_FALL (ns) 120 VDD1 VDD1 VDD1 VDD1 115 110 105 = 1.8V = 2.5V = 3.3V = 5.0V 2.4 2.2 2.0 1.8 -35 5 -15 25 45 65 85 105 125 TEMPERATURE (C) 1.4 -55 17317-112 100 -55 -35 5 25 45 65 85 105 125 TEMPERATURE (C) Figure 15. Supply Current (IDD1) vs. Temperature Figure 12. tLOOP_FALL vs. Temperature 36.0 2.34 2.32 35.5 2.30 SUPPLY CURRENT, IDD2 (mA) DIFFERENTIAL OUTPUT VOLTAGE (V) -15 17317-115 1.6 2.28 2.26 2.24 2.22 2.20 2.18 35.0 34.5 34.0 33.5 33.0 -5 45 32.5 -55 17317-113 2.14 -55 95 TEMPERATURE (C) -35 5 25 45 65 85 105 125 TEMPERATURE (C) Figure 16. Supply Current (IDD2) vs. Temperature Figure 13. Differential Output Voltage vs. Temperature, RL = 60 2.7 2900 2800 DOMINANT TIMEOUT, tDT (s) 2.5 2.3 2.1 1.9 2700 2600 2500 2400 2300 1.7 1.5 4.5 4.7 4.9 5.1 SUPPLY VOLTAGE, VDD2 (V) 5.3 5.5 Figure 14. Differential Output Voltage vs. Supply Voltage (VDD2), RL = 60 Rev. 0 | Page 11 of 13 2100 -55 -35 -15 5 25 45 65 85 105 TEMPERATURE (C) Figure 17. Dominant Timeout (tDT) vs. Temperature 125 17317-117 2200 17317-114 DIFFERENTIAL OUTPUT VOLTAGE (V) -15 17317-116 2.16 ADM3050E-EP Enhanced Product TEST CIRCUITS RL 2 TXD VOD VCANH RL 2 CANH GND2 VCANL 17317-005 RDIFF Figure 18. Driver Voltage Measurement CDIFF CANL GND2 17317-008 GND1 CF Figure 21. RDIFF and CDIFF Measured in Recessive State, Bus Disconnected RINH CANH CINH RINL CINL CANH VID CANL 17317-006 GND1 GND2 GND2 Figure 19. Receiver Voltage Measurement Figure 22. Input Resistance (RINx) and Input Capacitance (CINx) Measured in Recessive State, Bus Disconnected CANH TXD RL CL CANL RXD GND2 NOTES 1. 1% TOLERANCE FOR ALL RESISTORS AND CAPACITORS. 17317-007 CRXD GND1 CANL 17317-009 RXD CRXD Figure 20. Switching Characteristics Measurements Rev. 0 | Page 12 of 13 Enhanced Product ADM3050E-EP OUTLINE DIMENSIONS 10.50 (0.4134) 10.10 (0.3976) 9 16 7.60 (0.2992) 7.40 (0.2913) 8 1.27 (0.0500) BSC 0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 0.51 (0.0201) 0.31 (0.0122) 10.65 (0.4193) 10.00 (0.3937) 0.75 (0.0295) 45 0.25 (0.0098) 2.65 (0.1043) 2.35 (0.0925) SEATING PLANE 8 0 0.33 (0.0130) 0.20 (0.0079) 1.27 (0.0500) 0.40 (0.0157) COMPLIANT TO JEDEC STANDARDS MS-013-AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 03-27-2007-B 1 Figure 23. 16-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-16) Dimensions shown in millimeters and (inches) ORDERING GUIDE Model1 ADM3050ETRWZ-EP ADM3050ETRWZ-EP-RL EVAL-ADM3050EEBZ 1 Temperature Range -55C to +125C -55C to +125C Package Description 16-Lead Standard Small Outline Package [SOIC_W] 16-Lead Standard Small Outline Package [SOIC_W] Evaluation Board Z = RoHS Compliant Part. (c)2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D17317-0-2/19(0) Rev. 0 | Page 13 of 13 Package Option RW-16 RW-16