A AP PP PLLIIC CA ATTIIO ON N GMLB chip beads can be used in a variety of electronic applications including: Computers and Computer Peripherals Cellular Communication Equipment Digital Cameras Digital Televisions Audio Equipment FFE EA ATTU UR RE ES S The GMLB Series is Mag.Layers' line of high quality ferrite chip beads. Using the latest in multilayer technology, we have developed chip beads that are able to resolve all EMI/EMC issues. High quality, reliability, and versatility make the GMLB series chip beads suitable for all your design needs. z High Reliability The monolithic inorganic materials used to construct GMLB chips restrain magnetic flux leakage thereby minimizing EMI concerns. GMLB chips are also extremely effective with unstable grounding. z Small Chip-Shaped Design The chip-shaped design makes GMLB chip beads ideal for automatic mounting. z High Soldering Heat Resistance High quality termination allows both flow and re-flow soldering methods to be applied. z Sharp High Frequency Characteristics The GMLB high frequency chip series has sharp impedance characteristics, which make it suitable for high-speed signal lines. P PR RO OD DU UC CTT IID DE EN NTTIIFFIIC CA ATTIIO ON N G M L B c - 2 0 1 2 0 9 - d 0 0 3 0 A e f - N 8 g h c Product Code d Dimension Code e Impedance (at 100 MHz) f Series Type g Design Code h Code for Special Specification MAG.LAYERS GMLB-201209-R Series P PR RO OD DU UC CTT D DIIM ME EN NS SIIO ON N C D A B NOTEDimensions in mm PRODUCT NO. A B C D GMLB-201209 (0805) 2.00.20 (0.0790.008) 1.20.20 (0.0470.008) 0.90.20 (0.0350.008) 0.50.30 (0.0200.012) C CU UR RR RE EN NTT D DE ER RA ATTIIN NG G In operating temperatures exceeding +85, derating of current is necessary for chip ferrite beads for which rated current is 1.5A or over. Please apply the derating curve shown below according to the operating temperature. 7 Rated Current (A) 6 5 4 3 2 1.5 1 85 Operating Temperature() 125 MAG.LAYERS GMLB-201209-R Series E ELLE EC CTTR RIIC CA ALL R RE EQ QU UIIR RE EM ME EN NTTS S Part Number Impedance () RDC () Max. at 100 MHz GMLB-201209-0080R-S2 8025% 0.2 GMLB-201209-0120R-S2 12025% 0.3 GMLB-201209-0240R-S2 24025% 0.4 GMLB-201209-0300R-S2 30025% GMLB-201209-0430R-S2 43025% GMLB-201209-0600R-S2 60025% IDC (mA) Max. Operating Temp. Range () 300 -55 ~ +125 0.5 200 GMLB-201209-1000R-S2 100025% z Temperature rise should be less than 40 for P-type and less than 25 for other types when rated current is applied. M ME EA AS SU UR RIIN NG GM ME ETTH HO OD D // C CO ON ND DIITTIIO ON N zTest Instrument: Z: Agilent 4291B Impedance Analyzer, Test Fixture: Agilent 16192 Osc. Level: 500mV RDC: Agilent 34401A zTest Condition: < Unless otherwise specified > Temperature: 15C to 35C Humidity: 25% to 85% RH < In case of doubt > Temperature: 25C 2C Humidity: 60% to 70% RH MAG.LAYERS GMLB-201209-R Series TTY CS S (( TT YP PIIC CA 2255 ALL E )) ELLE EC CTTR RIIC CA ALL C CH HA AR RA AC CTTE ER RIIS STTIIC GMLB-201209-0120R-S2 300 120 120 250 90 Z 60 X 30 R 1 10 100 Frequency(MHz) GMLB-201209-0300R-S2 60 X 30 1 10 100 Frequency(MHz) 200 150 100 X 50 R 1 10 100 Frequency(MHz) 1000 1 10 100 Frequency(MHz) 1000 600 Z 300 200 X 100 0 X R 700 Impedance(Ohm) Impedance(Ohm) Z 100 GMLB-201209-0600R-S2 400 250 Z 150 0 1000 500 300 200 50 R GMLB-201209-0430R-S2 350 0 Z 90 0 1000 Impedance(Ohm) 150 0 Impedance(Ohm) GMLB-201209-0240R-S2 150 Impedance(Ohm) Impedance(Ohm) GMLB-201209-0080R-S2 10 100 Frequency(MHz) Z 400 300 200 X 100 R 1 500 1000 0 R 1 10 100 Frequency(MHz) 1000 GMLB-201209-1000R-S2 1200 1000 Z 800 600 R 400 X 200 0 1 10 100 1000 MAG.LAYERS GMLB-201209-R Series P PA AC CK KA AG GIIN NG G z z Peel-off Force 165 TO 180 TOP COVER TAPE BASE TAPE The force for peeling off cover tape is 10 grams in the arrow direction. Dimension (Unit: mm) z F A B C D E TYPE A B C D E F 8 mm 1781 60 +0.5 -0 - 13 0.2 9 0.5 12 0.5 12 mm 1780.3 60 0.2 19.3 0.1 13.5 0.1 13.6 0.1 - TYPE SIZE A B W P GMLB 201209 1.5 2.3 8 4 T 1.3, *0.950.10 CHIPS/REEL 4000 *: For paper reels MAG.LAYERS GMLB-201209-R Series z z Taping Quantity SERIES 2012 PCS/Reel 4000 Tape Packing Case W L H No. of Reels W L H 2 180.5 180.5 2.40.2 3 180.5 180.5 3.60.2 4 180.5 180.5 4.80.2 5 180.5 180.5 6.00.2 Unit: cm R RE EC CO OM MM ME EN ND DE ED DP PC CB B LLA AY YO OU UTT Land Component pattern Solder-resist Component C W B A L B Unit: mm Type Size 2012 L 2.0 W 1.2 A 0.8~1.2 B 0.8~1.2 C 0.9~1.6 MAG.LAYERS GMLB-201209-R Series R RE ELLIIA AB BIILLTTY Y TTE ES STT *Mechanical Performance Test ITEM Solderability SPECIFICATION TEST CONDITION More than 90% of the terminal electrode shall Solder: be covered with fresh solder. Sn-3.0Ag-0.5Cu Solder Temperature: 245 5 Flux: Rosin Dip Time: 3 1 Seconds Solder temperature : 260 5 The chip shall not crack. Soldering Heat Resistance More than 75% of the terminal electrode shall Flux: Rosin be covered with solder. Dip time: 10 1 seconds The terminal electrode shall not be broken off nor the ferrite damaged. Terminal Strength W No mechanical damage. The ferrite shall not be damaged. 1.0 Chip P R0.5 Bending Strength TYPE W(KGF) TIME (SEC) GMLB-201209 0.6 30 5 TYPE A(MM) P(KGF) GMLB-201209 1.4 1.0 A * Climatic test ITEM Thermal Shock (Temperature Cycle) SPECIFICATION TEST CONDITION Impedance shall be within 20% of the initial Temperature: -55~125 for 30 value. minutes each, 100 cycles. Humidity Resistance High Temperature Resistance Temperature : 60 Humidity: 95% RH Time: 1000 12 Hours Temperature : 852 Time: 1000 12 Hours 1. Operating Temperature Range: -55 TO +125 2. Storage Condition: The temperature should be within -40~85 and humidity should be less than 75% RH. The product should be used within 6 months from the time of delivery. MAG.LAYERS GMLB-201209-R Series R RE EC E CO OM MM ME EN ND DE ED DR RE EFFLLO OW WS SO OLLD DE ER RIIN NG GP PR RO OFFIILLE tP Temperature TP Critical Zone TL to TP Ramp-up T L tL T smax T smin Ramp-down t S Preheat t=25 to Peak Time Profile Feature Sn-Pb Pb-Free 60~120 seconds 60~180 seconds Tsmin 100 150 Tsmax 150 200 3/second max. 3/second max. 183 217 60~150 seconds 60~150 seconds 230 250~260 ts Preheat Average ramp-up rate (Tsmax to TP) Time main above Temperature (TL) Time (tL) Peak temperature (TP) Time within 5 of actual peak temperature (tP) Ramp-down rate 10 seconds 10 seconds 6/sec max. 6/sec max. Time 25 to peak temperature 6 minutes max. 8 minutes max. N NO OTTE ES S The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. MAG.LAYERS GMLB-201209-R Series