MAG.LAYERS
GMLB-201209-R Series
A
A
AP
P
PP
P
PL
L
LI
I
IC
C
CA
A
AT
T
TI
I
IO
O
ON
N
N
GMLB chip beads can be used in a variety of electronic applications
including:
Computers and Computer Peripherals
Cellular Communication Equipment
Digital Cameras
Digital Televisions
Audio Equipment
F
F
FE
E
EA
A
AT
T
TU
U
UR
R
RE
E
ES
S
S
The GMLB Series is Mag.Layers’ line of high quality ferrite chip beads. Using
the latest in multilayer technology, we have developed chip beads that are able
to resolve all EMI/EMC issues. High quality, reliability, and versatility make the
GMLB series chip beads suitable for all your design needs.
z High Reliability
The monolithic inorganic materials used to construct GMLB chips restrain magnetic
flux leakage thereby minimizing EMI concerns. GMLB chips are also extremely
effective with unstable grounding.
z Small Chip-Shaped Design
The chip-shaped design makes GMLB chip beads ideal for automatic mounting.
z High Soldering Heat Resistance
High quality termination allows both flow and re-flow soldering methods to be
applied.
z Sharp High Frequency Characteristics
The GMLB high frequency chip series has sharp impedance characteristics, which
make it suitable for high-speed signal lines.
P
P
PR
R
RO
O
OD
D
DU
U
UC
C
CT
T
T
I
I
ID
D
DE
E
EN
N
NT
T
TI
I
IF
F
FI
I
IC
C
CA
A
AT
T
TI
I
IO
O
ON
N
N
GMLB - 201209 - 0030 A-N8
c d e f g h
c Product Code
d Dimension Code
e Impedance (at 100 MHz)
f Series Type
g Design Code
h Code for Special Specification
MAG.LAYERS
GMLB-201209-R Series
P
P
PR
R
RO
O
OD
D
DU
U
UC
C
CT
T
T
D
D
DI
I
IM
M
ME
E
EN
N
NS
S
SI
I
IO
O
ON
N
N
C
A
B
D
NOTEDimensions in mm
PRODUCT NO. A B C D
GMLB-201209
(0805)
2.0±0.20
(0.079±0.008)
1.2±0.20
(0.047±0.008)
0.9±0.20
(0.035±0.008)
0.5±0.30
(0.020±0.012)
C
C
CU
U
UR
R
RR
R
RE
E
EN
N
NT
T
T
D
D
DE
E
ER
R
RA
A
AT
T
TI
I
IN
N
NG
G
G
In operating temperatures exceeding +85, derating of current is necessary for chip
ferrite beads for which rated current is 1.5A or over. Please apply the derating curve
shown below according to the operating temperature.
1
2
3
4
5
6
7
1.5
Operating Temperature()
Rated Current (A)
85 125
MAG.LAYERS
GMLB-201209-R Series
E
E
EL
L
LE
E
EC
C
CT
T
TR
R
RI
I
IC
C
CA
A
AL
L
L
R
R
RE
E
EQ
Q
QU
U
UI
I
IR
R
RE
E
EM
M
ME
E
EN
N
NT
T
TS
S
S
Part Number Impedance ()
at 100 MHz RDC () Max. IDC (mA) Max. Operating
Temp. Range ()
GMLB-201209-0080R-S2 80±25% 0.2
GMLB-201209-0120R-S2 120±25% 0.3 300
GMLB-201209-0240R-S2 240±25% 0.4
GMLB-201209-0300R-S2 300±25%
GMLB-201209-0430R-S2 430±25%
GMLB-201209-0600R-S2 600±25%
GMLB-201209-1000R-S2 1000±25%
0.5 200
-55 ~ +125
z Temperature rise should be less than 40 for P-type and less than 25 for other
types when rated current is applied.
M
M
ME
E
EA
A
AS
S
SU
U
UR
R
RI
I
IN
N
NG
G
G
M
M
ME
E
ET
T
TH
H
HO
O
OD
D
D
/
/
/
C
C
CO
O
ON
N
ND
D
DI
I
IT
T
TI
I
IO
O
ON
N
N
z Test Instrument:
Z: Agilent 4291B Impedance Analyzer, Test Fixture: Agilent 16192
Osc. Level: 500mV
RDC: Agilent 34401A
z Test Condition:
< Unless otherwise specified >
Temperature: 15°C to 35°C Humidity: 25% to 85% RH
< In case of doubt >
Temperature: 25°C ± 2°C Humidity: 60% to 70% RH
MAG.LAYERS
GMLB-201209-R Series
T
T
TY
Y
YP
P
PI
I
IC
C
CA
A
AL
L
L
E
E
EL
L
LE
E
EC
C
CT
T
TR
R
RI
I
IC
C
CA
A
AL
L
L
C
C
CH
H
HA
A
AR
R
RA
A
AC
C
CT
T
TE
E
ER
R
RI
I
IS
S
ST
T
TI
I
IC
C
CS
S
S
(
(
(
T
T
T
2
2
25
5
5
)
)
)
GMLB-201209-0080R-S2
1 10 100 1000
0
30
60
90
120
150
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-0120R-S2
1 10 100 1000
0
30
60
90
120
150
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-0240R-S2
1 10 100 1000
0
50
100
150
200
250
300
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-0300R-S2
1 10 100 1000
0
50
100
150
200
250
300
350
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-0430R-S2
1 10 100 1000
0
100
200
300
400
500
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-0600R-S2
1 10 100 1000
0
100
200
300
400
500
600
700
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-201209-1000R-S2
0
200
400
600
800
1000
1200
1 10 100 1000
Z
R
X
MAG.LAYERS
GMLB-201209-R Series
P
P
PA
A
AC
C
CK
K
KA
A
AG
G
GI
I
IN
N
NG
G
G
z
z
z
Peel-off Force
165° TO 180°
TOP COVER TAPE
BASE TAPE
The force for peeling off cover tape is 10 grams in the arrow direction.
z Dimension (Unit: mm)
C
D
A
E
B
F
TYPE SIZE A B W P T CHIPS/REEL
GMLB 201209 1.5 2.3 8 4 1.3, *0.95±0.10 4000
*: For paper reels
TYPE A
B
C D E
F
8 mm 178±1
60 +0.5
-0 - 13 ±0.2 9 ±0.5 12 ±0.5
12 mm 178±0.3 60 ±0.2 19.3 ±0.1 13.5 ±0.1 13.6 ±0.1 -
MAG.LAYERS
GMLB-201209-R Series
z Taping Quantity
SERIES 2012
PCS/Reel 4000
z Tape Packing Case
`
W
L
H
Unit: cm
R
R
RE
E
EC
C
CO
O
OM
M
MM
M
ME
E
EN
N
ND
D
DE
E
ED
D
D
P
P
PC
C
CB
B
B
L
L
LA
A
AY
Y
YO
O
OU
U
UT
T
T
ABB
C
Land
pattern
Component
Solder-resist
W
L
Component
Unit: mm
Type 2012
L 2.0
Size W1.2
A 0.8~1.2
B 0.8~1.2
C 0.9~1.6
No. of
Reels W L H
2 18±0.5 18±0.5 2.4±0.2
3 18±0.5 18±0.5 3.6±0.2
4 18±0.5 18±0.5 4.8±0.2
5 18±0.5 18±0.5 6.0±0.2
MAG.LAYERS
GMLB-201209-R Series
R
R
RE
E
EL
L
LI
I
IA
A
AB
B
BI
I
IL
L
LT
T
TY
Y
Y
T
T
TE
E
ES
S
ST
T
T
Mechanical Performance Test
ITEM SPECIFICATION TEST CONDITION
Solderability
More than 90% of the terminal electrode shall
be covered with fresh solder.
Solder:
Sn-3.0Ag-0.5Cu
Solder Temperature:
245 ± 5
Flux: Rosin
Dip Time: 3 ± 1 Seconds
Soldering Heat Resistance
The chip shall not crack.
More than 75% of the terminal electrode shall
be covered with solder.
Solder temperature : 260 ± 5
Flux: Rosin
Dip time: 10 ± 1 seconds
TYPE W(KGF) TIME (SEC)
Terminal Strength
The terminal electrode shall not be broken off
nor the ferrite damaged.
W
GMLB-201209 0.6 30 ± 5
TYPE A(MM) P(KGF)
Bending Strength
No mechanical damage.
The ferrite shall not be damaged.
A
Chip
P
1.0
R0.5
GMLB-201209 1.4 1.0
Climatic test
ITEM SPECIFICATION TEST CONDITION
Thermal Shock
(Temperature Cycle)
Temperature: -55~125 for 30
minutes each, 100 cycles.
Humidity Resistance
Temperature : 60
Humidity: 95% RH
Time: 1000 ± 12 Hours
High Temperature
Resistance
Impedance shall be within ±20% of the initial
value.
Temperature : 85±2
Time: 1000 ± 12 Hours
1. Operating Temperature Range: -55 TO +125
2. Storage Condition: The temperature should be within -40~85 and humidity should be less than
75% RH. The product should be used within 6 months from the time of delivery.
MAG.LAYERS
GMLB-201209-R Series
R
R
RE
E
EC
C
CO
O
OM
M
MM
M
ME
E
EN
N
ND
D
DE
E
ED
D
D
R
R
RE
E
EF
F
FL
L
LO
O
OW
W
W
S
S
SO
O
OL
L
LD
D
DE
E
ER
R
RI
I
IN
N
NG
G
G
P
P
PR
R
RO
O
OF
F
FI
I
IL
L
LE
E
E
Ts
min
Ts
max
tL
tP
tS
Preheat
TP
TL
Critical Zone
T
L
to T
P
Ramp-down
Ramp-up
t=25
to Peak Time
Temperature
Profile Feature Sn-Pb Pb-Free
ts 60~120 seconds 60~180 seconds
Tsmin 100 150
Preheat
Tsmax 150 200
Average ramp-up rate (Tsmax to TP) 3/second max. 3/second max.
Temperature (TL)183 217
Time main above Time (tL) 60~150 seconds 60~150 seconds
Peak temperature (TP) 230 250~260
Time within 5 of actual peak
temperature (tP) 10 seconds 10 seconds
Ramp-down rate 6/sec max. 6/sec max.
Time 25 to peak temperature 6 minutes max. 8 minutes max.
N
N
NO
O
OT
T
TE
E
ES
S
S
The contents of this data sheet are subject to change without notice. Please
confirm the specifications and delivery conditions when placing your order.