2015 Microchip Technology Inc. DS20005418B-page 1
HV5122 / HV5222
Features
• Processed with High Voltage CMOS technology
• Output voltages to 225V using a ramped supply
voltage
• SINK current minimum 100mA
• Shift register speed 8.0MHz
• Strobe and enable inputs
• CMOS compatible inputs
• Forward and reverse shifting options
Description
HV5122 / HV5222 are low-voltage serial to high-volt-
age parallel converters with open-drain outputs. These
devices are primarily designed for use as a driver for
AC electroluminescent displays. HV5122 / HV5222 can
also be used in any application requiring multiple high-
voltage, current-sinking output capabilities such as
driving inkjet and electrostatic print heads, plasma pan-
els, vacuum fluorescent, or large matrix LCD displays.
These devices consist of a 32-bit shift register and con-
trol logic to perform the Output Enable and all-on func-
tions. Data is shifted through the shift register on the
high-to-low transition of the clock. HV5122 shifts in the
counter-clockwise direction when viewed from the top
of the package and HV5222 shifts in the clockwise
direction.
For cascading devices, HV5122 / HV5222 provides a
data output buffer that reflects he current status of the
last bit of the shift register. Operation of the shift regis-
ter is not affected by the OE (Output Enable) or the
STR (Strobe) inputs.
HV5122 / HV5222 are designed to be used in systems
which either switch off the high voltage supply before
changing the state of the high voltage outputs or which
limit the current through each output.
32-Channel, Serial-to-Parallel Converter
with Open-Drain Outputs
2015 Microchip Technology Inc. DS20005418B-page 3
HV5122 / HV5222
1.0 ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS†
Supply voltage, VDD ...................................................................................................................................-0.5V to +15V
Supply voltage, VPP .................................................................................................................................-0.5V to +250V
Logic input levels ............................................................................................................................... -0.5V to VDD+0.5V
Ground current1....................................................................................................................................................... 1.5A
Continuous total power dissipation2.................................................................................................................. 1200mW
Operating temperature range.................................................................................................................. -40°C to +85°C
Storage temperature range ................................................................................................................... -65°C to +150°C
1: Duty cycle is limited by the total power dissipated in the package.
2: For operation above 25°C ambient derate linearly to maximum operating temperature at 20mW/°C.
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
TABLE 1-1: ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended conditions unless otherwise specified
Symbol Parameter Min Max Units Conditions
DC Characteristics
IDD VDD supply current - 15 mA fCLK= 8.0MHz, fDATA= 4.0MHz
IDDQ
Quiescent VDD supply current - 100 µA DIN= 0V, all input logic pins = 0V,
all outputs off
IO(OFF) Off-state output current - 10 µA All outputs high, all switches parallel
IIH High level logic input current - 1.0 µA VIN= VDD
IIL Low level logic input current - -1.0 µA VIL= 0
VOH
High level output data out VDD -
1.0V -V
IDOUT= -100µA
VOL Low level output voltage HVOUT -15
VIHVOUT= +100mA
Data out - 1.0 IDOUT= +100µA
VOC HVOUT clamp voltage - -1.5 V IOL= -100mA
AC Characteristics (VDD = 12V, TA=25°C)
fCLK Clock frequency - 8.0 MHz
tWClock width, high or low 62 - ns
tSU Data setup time before CLK falls 25 - ns
tHData hold time after CLK falls 10 - ns
tON Turn-on time, HVOUT from strobe - 500 ns RL= 2.0kΩ to 200V
tDHL Data output delay after H to L CLK - 100 ns CL= 15pF
tDLH Data output delay after L to H CLK - 100 ns CL= 15pF
TABLE 1-2: TYPICAL THERMAL RESISTANCE
Package θja
44-Lead PQFP 51°C/W
44-Lead PLCC 37°C/W
HV5122 / HV5222
DS20005418B-page 4 2015 Microchip Technology Inc.
2.0 PIN DESCRIPTION
The locations of the pins are listed in Package Type.
TABLE 2-1: PIN DESCRIPTION PQFP
Pin # HV5122 HV5222 Description
1HV
OUT11 HVOUT22
High voltage outputs.
2HV
OUT12 HVOUT21
3HV
OUT13 HVOUT20
4HV
OUT14 HVOUT19
5HV
OUT15 HVOUT18
6HV
OUT16 HVOUT17
7HV
OUT17 HVOUT16
8HV
OUT18 HVOUT15
9HV
OUT19 HVOUT14
10 HVOUT20 HVOUT13
11 HVOUT21 HVOUT12
12 HVOUT22 HVOUT11
13 HVOUT23 HVOUT10
14 HVOUT24 HVOUT9
15 HVOUT25 HVOUT8
16 HVOUT26 HVOUT7
17 HVOUT27 HVOUT6
18 HVOUT28 HVOUT5
19 HVOUT29 HVOUT4
20 HVOUT30 HVOUT3
21 HVOUT31 HVOUT2
22 HVOUT32 HVOUT1
23 DATA OUT DATA OUT Data output for cascading to the data input of the next device.
24
N/C N/C No connect.
25
26
27
28 OE OE
Output enable input.
When OE is LOW, all HV outputs are forced into a LOW state,
regardless of data in each channel. When OE is HIGH, all HV
outputs reflect data latched.
29 CLK CLK Data shift register clock. Input are shifted into the shift register on
the positive edge of the clock.
30 GND GND Logic and high voltage ground.
31 VDD VDD Low voltage logic power rail.
32 STR STR Strobe.
33 DATA IN DATA IN Serial data input. Data needs to be present before each rising
edge of the clock.
34 N/C N/C No connect.
2015 Microchip Technology Inc. DS20005418B-page 5
HV5122 / HV5222
35 HVOUT1HV
OUT32
High voltage outputs.
36 HVOUT2HV
OUT31
37 HVOUT3HV
OUT30
38 HVOUT4HV
OUT29
39 HVOUT5HV
OUT28
40 HVOUT6HV
OUT27
41 HVOUT7HV
OUT26
42 HVOUT8HV
OUT25
43 HVOUT9HV
OUT24
44 HVOUT10 HVOUT23
TABLE 2-1: PIN DESCRIPTION PQFP (CONTINUED)
Pin # HV5122 HV5222 Description
TABLE 2-2: PIN DESCRIPTION PLCC
Pin # HV5122 HV5222 Description
1HV
OUT16 HVOUT17
High voltage outputs
2HV
OUT17 HVOUT16
3HV
OUT18 HVOUT15
4HV
OUT19 HVOUT14
5HV
OUT20 HVOUT13
6HV
OUT21 HVOUT12
7HV
OUT22 HVOUT11
8HV
OUT23 HVOUT10
9HV
OUT24 HVOUT9
10 HVOUT25 HVOUT8
11 HVOUT26 HVOUT7
12 HVOUT27 HVOUT6
13 HVOUT28 HVOUT5
14 HVOUT29 HVOUT4
15 HVOUT30 HVOUT3
16 HVOUT31 HVOUT2
17 HVOUT32 HVOUT1
18 DATA OUT DATA OUT Data output for cascading to the data input of the next device.
19
N/C N/C No connect.
20
21
22
23 OE OE
Output enable input.
When OE is LOW, all HV outputs are forced into a LOW state,
regardless of data in each channel. When OE is HIGH, all HV
outputs reflect data latched.
24 CLK CLK Data shift register clock. Input are shifted into the shift register on
the positive edge of the clock.
25 GND GND Logic and high voltage ground.
26 VDD VDD Low voltage logic power rail.
27 STR STR Strobe.
HV5122 / HV5222
DS20005418B-page 6 2015 Microchip Technology Inc.
28 DATA IN DATA IN Serial data input. Data needs to be present before each rising
edge of the clock.
29 N/C N/C No connect.
30 HVOUT1HV
OUT32
High voltage outputs.
31 HVOUT2HV
OUT31
32 HVOUT3HV
OUT30
33 HVOUT4HV
OUT29
34 HVOUT5HV
OUT28
35 HVOUT6HV
OUT27
36 HVOUT7HV
OUT26
37 HVOUT8HV
OUT25
38 HVOUT9HV
OUT24
39 HVOUT10 HVOUT23
40 HVOUT11 HVOUT22
41 HVOUT12 HVOUT21
42 HVOUT13 HVOUT20
43 HVOUT14 HVOUT19
44 HVOUT15 HVOUT18
TABLE 2-2: PIN DESCRIPTION PLCC (CONTINUED)
Pin # HV5122 HV5222 Description
2015 Microchip Technology Inc. DS20005418B-page 7
HV5122 / HV5222
3.0 FUNCTIONAL DESCRIPTION
Table 3-1 provides functional information about
HV5122 / HV5222.
Note 1: H = high level, L = low level, X = irrelevant, ↓ = high-to-low transition
2: ●= dependent on previous stage’s state before the last CLK high-to-low transition
3.1 Power-Up and Recommended
Operating Conditions
To power-up HV5122 / HV5222, perform the following
power-up sequence:
1. Connect ground
2. Apply VDD
3. Set all inputs to a known state
To power-down the device, reverse the steps above.
FIGURE 3-1: Input and Output Equivalent Circuits
TABLE 3-1: FUNCTIONAL TABLE
Function
Inputs Outputs
Data In CLK OE STR Shift Reg HV Outputs Data Out
1 2...32 1 2...32
All on X X X L ●●...●ON ON...ON ●
All off X X L H ●●...●OFF OFF...OFF ●
Load S/R H/L ↓L H H/L Q1...Q31 OFF OFF...OFF Q32
Output Enable X H/L H H H/L ●...●ON/OFF ●...●●
TABLE 3-2: RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Units
VDD Logic voltage supply 10.8 12 13.2 V
HVOUT High voltage output -0.3 - 225 V
VIH High-level input voltage VDD-2.0 - VDD V
VIL Low-level input voltage 0 - 2.0 V
fCLK Clock frequency - - 8.0 MHz
TAOperating free-air temperature -40 - +85 °C
VDD
INPUT
GND
HV
OUT
Logic Inputs
GND
DATA
OUT
Logic Data Output High Voltage Outputs
VDD
HV
IN
GND
HV5122 / HV5222
DS20005418B-page 8 2015 Microchip Technology Inc.
FIGURE 3-2: Switching Waveforms
DATA
IN Data Valid 1
CLK
DATA
OUT
DATA
OUT
STR
t
DLH
t
SU
t
H
t
WL
t
WH
t
DHL
HV
OUT
50% 50% 50%
50%
50%
15V
t
ON
12V
0V
12V
0V
2015 Microchip Technology Inc. DS20005418B-page 9
HV5122 / HV5222
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
Legend: XX...X Product Code or Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
3
e
3
e
44-lead PLCC Example
XXXXXXXXX
XXXXXXXXXXX
YYWWNNN
XXXXXXXXXXX
e3
HV5122PJ
1526343
e3
44-lead PQFP Example
XXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
e3
HV5122PG
1526343
e3
HV5122 / HV5222
DS20005418B-page 10 2015 Microchip Technology Inc.
44-Lead PQFP Package Outline (PG)
10.00x10.00mm body, 2.35mm height (max), 0.80mm pitch
Symbol A A1 A2 b D D1 E E1 e L L1 L2 ș
Dimension
(mm)
MIN 1.95* 0.00 1.95 0.30 13.65* 9.80* 13.65* 9.80*
0.80
BSC
0.73
1.95
REF
0.25
BSC
0
O
NOM - - 2.00 - 13.90 10.00 13.90 10.00 0.88 3.5
O
MAX 2.35 0.25 2.10 0.45 14.15* 10.20* 14.15* 10.20* 1.03 7
O
JEDEC Registration MO-112, Variation AA-2, Issue B, Sep.1995.
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
Drawings not to scale.
SD # DSPD 44PQFPPG V i C041309
1
44
Seating
Plane
Gauge
Plane
θ
L
L1
L2
View B
View B
Seating
Plane
Top View
D
D1
E
E1
be
Side View
A2
A
A1
Note 1
(Index Area
D1/4 x E1/4)
Note:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU
a printed indicator.
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
2015 Microchip Technology Inc. DS20005418B-page 11
HV5122 / HV5222
44-Lead PLCC Package Outline (PJ)
.653x.653in body, .180in height (max), .050in pitch
Symbol A A1 A2 b b1 D D1 E E1 e R
Dimension
(inches)
MIN .165 .090 .062 .013 .026 .685 .650 .685 .650
.050
BSC
.025
NOM .172 .105 - - - .690 .653 .690 .653 .035
MAX .180 .120 .083 .021 .036†.695 .656 .695 .656 .045
JEDEC Registration MS-018, Variation AC, Issue A, June, 1993.
† This dimension differs from the JEDEC drawing.
Drawings not to scale.
.150 MAX
.048/.042 x 45O
1
.075 MAX
640
D
D1
E1 E
Top View
Horizontal Side View
View B
AA2
A1
Seating
Plane
e
b
Note 1
(Index Area)
.056/.042 x 45O
.020max
(3 Places)
.020 MIN
Vertical Side View
View B
Note 2
44
b1
Base
Plane
R
Notes:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU
a printed indicator.
2. $FWXDOVKDSHRIWKLVIHDWXUHPD\YDU\
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
2015 Microchip Technology Inc. DS20005418B-page 13
HV5122 / HV5222
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: HV5122 = 32-Channel Serial to Parallel Converter,
data shifts in counter-clockwise direction
HV5222 = 32-Channel Serial to Parallel Converter,
data shifts in clockwise direction
Package: PG = 44-Lead PQFP
PJ = 44-Lead PLCC
Environmental G = Lead (Pb)-free/ROHS-compliant package
Media Type: (blank) = 96/Tray for PG package
= 27/Tube for PJ package
Examples:
a) HV5122PG-G Data shifts in counter-
clockwise direction, 44-
Lead PQFP package,
96/Tray
b) HV5222PJ-G Data shifts in clockwise
direction, 44-Lead PLCC
package, 27/Tube
PART NO. X
Device
X
Environmental
XX
Package
Options
Media
--
Type
DS20005418B-page 14 2015 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-882-6
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS20005418B-page 15 2015 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
ASIA/PACIFIC
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
07/14/15
