SN54ACT373, SN74ACT373 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS SCAS544E - OCTOBER 1995 - REVISED OCTOBER 2002 SN54ACT373 . . . J OR W PACKAGE SN74ACT373 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 4.5-V to 5.5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 10 ns at 5 V Inputs Are TTL-Voltage Compatible OE 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND description/ordering information These 8-bit latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. The eight latches are D-type transparent latches. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q LE 1D 1Q OE VCC SN54ACT373 . . . FK PACKAGE (TOP VIEW) A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines in bus-organized systems without need for interface or pullup components. 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 8D 7D 7Q 6Q 6D 4Q GND LE 5Q 5D 2D 2Q 3Q 3D 4D 8Q D D D D OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PDIP - N -55C to 125C TOP-SIDE MARKING Tube SN74ACT373N Tube SN74ACT373DW Tape and reel SN74ACT373DWR SOP - NS Tape and reel SN74ACT373NSR ACT373 SSOP - DB Tape and reel SN74ACT373DBR AD373 TSSOP - PW Tape and reel SN74ACT373PWR AD373 CDIP - J Tube SNJ54ACT373J SNJ54ACT373J CFP - W Tube SNJ54ACT373W SNJ54ACT373W LCCC - FK Tube SNJ54ACT373FK SOIC - DW -40C 40C to 85C ORDERABLE PART NUMBER PACKAGE TA SN74ACT373N ACT373 SNJ54ACT373FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54ACT373, SN74ACT373 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS SCAS544E - OCTOBER 1995 - REVISED OCTOBER 2002 FUNCTION TABLE (each latch) INPUTS OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z logic diagram (positive logic) OE LE 1 11 C1 1D 3 2 1Q 1D To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA Package thermal impedance, JA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54ACT373, SN74ACT373 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS SCAS544E - OCTOBER 1995 - REVISED OCTOBER 2002 recommended operating conditions (see Note 3) SN54ACT373 MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level output current IOL t/v Low-level output current High-level input voltage SN74ACT373 MIN 2 2 V V 0.8 Input transition rise or fall rate UNIT 0.8 V VCC VCC V -24 -24 mA 24 24 mA 8 8 ns/V VCC VCC 0 0 V TA Operating free-air temperature -55 125 -40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS 4.5 V IOH = -50 50 A VOH IOH = -24 24 mA IOH = -50 mA IOH = -75 mA MIN TA = 25C TYP MAX SN54ACT373 MIN MAX MIN 4.49 4.4 5.5 V 5.4 5.49 5.4 5.4 4.5 V 3.86 3.7 3.76 5.5 V 4.86 4.7 4.76 MAX UNIT 4.4 V 3.85 5.5 V IOL = 24 mA SN74ACT373 4.4 5.5 V IOL = 50 A VOL VCC 3.85 4.5 V 0.1 0.1 5.5 V 0.1 0.1 0.1 0.1 4.5 V 0.36 0.44 0.44 5.5 V 0.36 0.44 0.44 V IOL = 50 mA IOL = 75 mA 5.5 V IOZ II VO = VCC or GND VI = VCC or GND 5.5 V 0.25 5 2.5 A 5.5 V 0.1 1 1 A ICC VI = VCC or GND, IO = 0 One input at 3.4 V, Other inputs at GND or VCC 5.5 V 4 80 40 A 1.5 1.5 mA ICC 1.65 5.5 V 5.5 V 1.65 0.6 Ci VI = VCC or GND 5V 4.5 Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms. This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. pF timing requirements over recommended operating free-air temperature range, VCC = 5 V 0.5 V (unless otherwise noted) (see Figure 1) TA = 25C MIN MAX SN54ACT373 MIN MAX SN74ACT373 MIN MAX UNIT tw tsu Pulse duration, LE high 7 8.5 8 ns Setup time, data before LE 7 8.5 8 ns th Hold time, data after LE 0 1 1 ns POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN54ACT373, SN74ACT373 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS SCAS544E - OCTOBER 1995 - REVISED OCTOBER 2002 switching characteristics over recommended operating free-air temperature range, VCC = 5 V 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D Q tPLH tPHL LE Q tPZH tPZL OE Q tPHZ tPLZ OE Q MIN TA = 25C TYP MAX SN54ACT373 SN74ACT373 MIN MAX MIN MAX 2.5 8.5 10 1.5 12.5 1.5 11.5 2 8 10 1.5 12.5 1.5 11.5 2.5 8.5 11 1.5 12.5 2 11.5 2 8 10 1.5 11.5 1.5 11.5 2 8 9.5 1.5 11.5 1.5 10.5 2 7.5 9 1.5 11 1.5 10.5 2.5 9 11 1.5 14 2.5 12.5 1.5 7.5 8.5 1.5 11 1 10 UNIT ns ns ns ns operating characteristics, VCC = 5 V, TA = 25C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance CL = 50 pF, POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 f = 1 MHz TYP 40 UNIT pF SN54ACT373, SN74ACT373 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS SCAS544E - OCTOBER 1995 - REVISED OCTOBER 2002 PARAMETER MEASUREMENT INFORMATION 2 x VCC S1 500 From Output Under Test CL = 50 pF (see Note A) Open 500 TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 x VCC Open 3V 1.5 V Timing Input LOAD CIRCUIT 0V th tsu 3V 1.5 V Data Input tw 0V 3V 1.5 V Input 1.5 V VOLTAGE WAVEFORMS 1.5 V 0V VOLTAGE WAVEFORMS Output Control (low-level enabling) 3V 1.5 V 1.5 V 0V tPZL 3V Input 1.5 V 1.5 V 0V tPLH Output tPHL 50% VCC VOH 50% VCC VOL Output Waveform 1 S1 at 2 x VCC (see Note B) tPLZ VCC 50% VCC tPZH Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS VOL + 0.3 V VOL tPHZ 50% VCC VOH - 0.3 V VOH 0 V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) 5962-87556012A ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 596287556012A SNJ54ACT 373FK 5962-8755601RA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8755601RA SNJ54ACT373J 5962-8755601SA ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8755601SA SNJ54ACT373W 5962-8755601VRA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8755601VR A SNV54ACT373J SN74ACT373DBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AD373 SN74ACT373DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT373 SN74ACT373DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT373 SN74ACT373N ACTIVE PDIP N 20 20 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74ACT373N SN74ACT373NSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT373 SN74ACT373PW ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AD373 SN74ACT373PWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AD373 SNJ54ACT373FK ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 596287556012A SNJ54ACT 373FK SNJ54ACT373J ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8755601RA SNJ54ACT373J SNJ54ACT373W ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8755601SA SNJ54ACT373W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54ACT373, SN54ACT373-SP, SN74ACT373 : * Catalog: SN74ACT373, SN54ACT373 * Enhanced Product: SN74ACT373-EP, SN74ACT373-EP * Military: SN54ACT373 * Space: SN54ACT373-SP NOTE: Qualified Version Definitions: Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 * Catalog - TI's standard catalog product * Enhanced Product - Supports Defense, Aerospace and Medical Applications * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2020 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ACT373DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74ACT373DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74ACT373NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1 SN74ACT373PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2020 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ACT373DBR SN74ACT373DWR SSOP DB 20 2000 853.0 449.0 35.0 SOIC DW 20 2000 367.0 367.0 45.0 SN74ACT373NSR SO NS 20 2000 367.0 367.0 45.0 SN74ACT373PWR TSSOP PW 20 2000 853.0 449.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DB0020A SSOP - 2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 18X 0.65 20 1 2X 7.5 6.9 NOTE 3 5.85 10 11 20X B 5.6 5.0 NOTE 4 SEE DETAIL A (0.15) TYP 0.38 0.22 0.1 C A B 2 MAX 0.25 GAGE PLANE 0 -8 0.95 0.55 0.05 MIN DETAIL A A 15 TYPICAL 4214851/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com EXAMPLE BOARD LAYOUT DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE SYMM 20X (1.85) (R0.05) TYP 1 20 20X (0.45) SYMM 18X (0.65) 11 10 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK OPENING SOLDER MASK OPENING METAL UNDER SOLDER MASK METAL EXPOSED METAL EXPOSED METAL 0.07 MAX ALL AROUND NON-SOLDER MASK DEFINED (PREFERRED) 0.07 MIN ALL AROUND SOLDER MASK DEFINED SOLDER MASK DETAILS 15.000 4214851/B 08/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20 20X (0.45) SYMM 18X (0.65) 10 11 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214851/B 08/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 TYP 9.97 SEATING PLANE PIN 1 ID AREA A 0.1 C 20 1 13.0 12.6 NOTE 3 18X 1.27 2X 11.43 10 11 B 7.6 7.4 NOTE 4 20X 0.51 0.31 0.25 C A B 2.65 MAX 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0 -8 0.3 0.1 1.27 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 11 10 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. 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