ICS308
SERIAL PROGRAMMABLE QUAD PLL VERSACLOCK SYNTHESIZER SER PROG CLOCK SYNTHESIZER
IDT™ / ICS™
SERIAL PROGRAMMABLE QUAD PLL VERSACLOCK SYNTHESIZER 4
ICS308 REV J 120507
External Components
Series Termination Resistor
Clock output traces over one inch should use series
termination. To series terminate a 50Ω tr ace (a
commonly used tr ace impedance), place a 33 Ω resistor
in series with the cloc k line, as close to the cloc k output
pin as possible. The nominal impedance of the clock
output is 20Ω.
STROBE Pull-up Resistor
In order for the device to start up in the default state , a
250 kOhm pull-up re sist or is requ ire d .
Decoupling Capacitors
As with any high-performance mixed-signal IC, the
ICS308 must be isolated from system power supply
noise to perform optimally.
Decoupling capacitors of 0.01µF must be connected
between each VDD and th e PCB ground pla ne.
Crystal Load Capacitors
The de vice crystal connections should include pads f or
small capacitors from X1 to ground and from X2 to
ground. These capacitors are used to adjust the stray
capacitance of the bo ard to match the nominally
required crystal load capacitance. Because load
capacitance can only be increased in this trimming
process, it is important to keep stray capacitance to a
minimum b y using very short PCB traces (and no vias)
between the crystal and device. Crystal capacitors must
be connected from each of the pins X1 and X2 to
ground.
The value (in pF) of these crystal caps should equal (CL
-6 pF)*2. In this equat ion, CL= crystal load capacitance
in pF. Example: For a crystal with a 16 pF load
capacitance, each crystal capacitor would be 20 pF
[(16-6) x 2 = 20].
PCB Layout Recommendations
For optimum device performance and low est output
phase noise, the following guidelines should be
observed.
1) Each 0.01µF decoupling capacitor should be
mounted on the component side of the board as close
to the VDD pin as possible. No vias should be used
between decoupling capacitor and VDD pin. The PCB
trace to VDD pin should be kept as short as possible, as
should the PCB trace to the ground via.
2) The external crystal should be mounted just next to
the device with short traces. The X1 and X2 tr aces
should not be rout ed next to each other with minimum
spaces, instead they should be sep arate d an d away
from other traces.
3) To minimize EMI, the 33Ω series termination resistor
(if needed) should be placed close to each cloc k output.
4) An optim um lay out is one with all components on the
same side of the board, minimizing vias through other
signal layers.
ICS308 Configuration Capabilities
The architecture o f the ICS308 allows the user to easily
configure the device to a wide range of output
frequencies, for a given input reference frequency.
The frequency m ultiplier PLL pro vides a h igh degree of
precision. The M/N values (the mu ltiplier/divide values
av ailable to generate the target VCO frequency) can be
set within the r ange of M = 1 to 2048 and N = 1 to 1024.
The ICS308 also provides separate output divide
va lues, fr om 2 through 20, to allow the t wo output cloc k
banks to support widely diff ering frequency values from
the same PLL.
Each output frequency can be represented as:
Output Freq. = (Ref. Freq)*(M/N)/Output Divide