SFUI2048J3BP2TO-I-MS-221-STD - Swissbit

Product Data Sheet

Industrial

USB Flash Drive Module

U-110 Series

USB2.0 high speed

BU: Flash Products

Date : June 0 3, 2014

Revisi o n: 1.60

File:

U-110_data_ sheet_UI -xxBP_ Rev160.doc

Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.60

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U-110 Series USB Flash Drive Module

1GByte to 16GByte

USB Flash Drive Module provides non-volatile, solid-state storage in a compact design, making it perfectly suited

for embedded applications. The standard USB 2.0 interface provides designers with a true plug-n-play storage

device, allowing for short design cycles and fast time to market.

Swissbit use high end USB 2.0 flash memory controller in the Module, providing high data reliability and

endurance. The built-in BCH-ECC engine can detect up to 9-bit errors and correct up to 8-bit errors, while

sophisticated wear leveling algorithms guarantee up to 2,000,000 Write Cycles.

The internal USB Flash Drive Module has an internal 9(10) pin USB connector.

High performance, high reliability and low cost per megabyte make the internal USB Flash Drive Module the

product of choice in embedded applications, such as Gaming, POS Workstations, Networking Equipment and

Industrial PCs.

Swissbit offers value-added services to OEM customers, such as controlled Bill of Materials, customized preloads,

custom setting, customer-specific marking etc.

1 Feature summary

 USB2.0 solid state flash Drive for internal 9(10)-pin USB connector

o Fully compliant with USB-Specification 2.0 (High-Speed, 480Mb/s burst)

o Fully backward compliant with USB 1.1 systems (Full speed, 12Mb/s burst)

 High reliability

o Error correction code (ECC)

o Wear leveling

o MTBF >3,000,000 hours

o Data reliability: < 1 non-recoverable error per 1014 bits read

 Commercial and industrial temperature grade

 Plug & Play

 Standard operating voltage 5V, 3.3V optional

 Bootable

 Fixed drive

 LED indicator

 FAT32 format

 Unique serial number

 USB-IF high speed certified

 CE / FCC

 RoHS compliant

 WEEE

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Table of Content

1 FEATURE SUMMARY ..................................................................................................................................................... 2

TABLE OF CONTENT ......................................................................................................................................................... 3

2 ORDER INFORMATION.................................................................................................................................................. 4

2.1 STANDARD PRODUCTS WITH 2.54MM (J) CONNECTOR FOR 5V (STD) ................................................................................. 4

2.2 LOW PROFILE PRODUCTS WITH 2.00MM (K) CONNECTOR FOR 5V (STD) ............................................................................ 4

2.3 STANDARD PRODUCTS WITH 2.54MM (J) CONNECTOR FOR 3.3V (3V3).............................................................................. 4

2.4 LOW PROFILE PRODUCTS WITH 2.00MM (K) CONNECTOR FOR 3.3V (3V3)......................................................................... 4

2.5 OFFERED OPTIONS FOR CUSTOM PRODUCTS ................................................................................................................... 4

3 SYSTEM PERFORMANCE ............................................................................................................................................... 5

4 INTERFACE / PIN OUT .................................................................................................................................................. 5

5 NAND FLASH TECHNOLOGIES ...................................................................................................................................... 5

6 ELECTRICAL SPECIFICATION ......................................................................................................................................... 6

7 ENVIRONMENTAL SPECIFICATION AND RELIABILITY .................................................................................................... 7

7.1 RECOMMENDED OPERATING CONDITIONS ...................................................................................................................... 7

7.2 RELIABILITY ........................................................................................................................................................... 7

7.3 SHOCK, VIBRATION, AND HUMIDITY ........................................................................................................................... 7

8 COMPATIBILITY & COMPLIANCE .................................................................................................................................. 7

9 APPLICATIONS ............................................................................................................................................................. 8

10 PERFORMANCE REFERENCE ....................................................................................................................................... 8

10.1 TEST EQUIPMENT ................................................................................................................................................... 8

10.2 PERFORMANCE RESULTS ......................................................................................................................................... 8

11 STANDARD FORM FACTORS AND HARDWARE ............................................................................................................. 9

12 ROHS AND WEEE UPDATE FROM SWISSBIT .............................................................................................................. 12

13 BEST PRACTICES........................................................................................................................................................ 14

13.1 WEAR LEVELING AND SPARE BLOCK MANAGEMENT .................................................................................................... 14

13.1 DEVICE REMOVAL & POWER FAILURE ...................................................................................................................... 14

13.2 LIFETIME END HANDLING ...................................................................................................................................... 14

14 PART NUMBER DECODER ......................................................................................................................................... 15

15 LABEL ....................................................................................................................................................................... 16

16 REVISION HISTORY ................................................................................................................................................... 17

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2 Order Information

2.1 Standard products with 2.54mm (J) connector for 5V (STD)

Density

Part Number

1GB

SFUI1024J3BP2TO-t-MS-221-STD

2GB

SFUI2048J3BP2TO-t-MS-221-STD

4GB

SFUI4096J3BP2TO-t-DT-221-STD

8GB

SFUI8192J3BP2TO-t-QT-221-STD

16GB

SFUI16GBJ1BP2MT-t-QT-231-STD

Table 1: Product List - 2.54mm, 5V

2.2 Low profile products with 2.00mm (K) connector for 5V (STD)

Density

Part Number

1GB

SFUI1024K3BP2TO-t-MS-221-STD

2GB

SFUI2048K3BP2TO-t-MS-221-STD

4GB

SFUI4096K3BP2TO-t-DT-221-STD

8GB

SFUI8192K3BP2TO-t-QT-221-STD

16GB

SFUI16GBK1BP2MT-t-QT-231-STD

Table 2: Product List -2.00mm, 5V

2.3 Standard products with 2.54mm (J) connector for 3.3V (3V3)

Density

Part Number

1GB

SFUI1024J3BP2TO-t-MS-221-3V3

2GB

SFUI2048J3BP2TO-t-MS-221-3V3

4GB

SFUI4096J3BP2TO-t-DT-221-3V3

8GB

SFUI8192J3BP2TO-t-QT-221-3V3

16GB

SFUI16GBJ1BP2MT-t-QT-231-3V3

Table 3: Product List - 2.54mm, 3.3V

The maximum supply voltage for 3.3V types must not exceed 3.6V!

2.4 Low profile products with 2.00mm (K) connector for 3.3V (3V3)

Density

Part Number

1GB

SFUI1024K3BP2TO-t-MS-221-3V3

2GB

SFUI2048K3BP2TO-t-MS-221-3V3

4GB

SFUI4096K3BP2TO-t-DT-221-3V3

8GB

SFUI8192K3BP2TO-t-QT-221-3V3

16GB

SFUI16GBK1BP2MT-t-QT-231-3V3

Table 4: Product List -2.00mm, 3.3V

The maximum supply voltage for 3.3V types must not exceed 3.6V!

t = temperature grade (C=0°C to 70°C and I=-40°C to +85°C)

2.5 Offered options for custom products

 Removable or fixed drive

 Customer specified strings and IDs

 FAT16, FAT32 format or customer file system, default FAT32

 Preload service

 CD partition

 Auto run option

 Dongle functionality

 Extended and Industrial Temperature range

Please ask our sales for more details and additional features.

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3 System performance

Speed

High Speed mode (max)

Full Speed mode (max)

unit

Burst

480

Mbit/s

Read

32 1)

1.0

MByte/s

Write

23 1)

0.9

1) Effective speed varies with controller, number and type of flash, host, file size, file system and operating system

The USB drive can be busy for max. 320ms from time to time due to internal reorganization.

4 Interface / Pin out

 USB-connector 10pin (2mm or 2.54mm pitch)

 USB 2.0 high speed interface, USB1.1 full speed compatible

 STD variation

Signal

Comment

V_Bus

Operating voltage

Not Connected

D-

Data signal pair

Not Connected

D+

Data signal pair

Not Connected

GND

Ground

Not Connected

Keyed at the 2.54mm connector

Keyed at the 2.00mm connector (optional not keyed)

Shield

should be connected with host shield,

is connected with card ground for standard products,

could be configured as NC on request

See also chapter 11 (Standard form factors and hardware)

5 NAND Flash technologies

SLC and MLC flash

o Single-level-cell (SLC) flash, 1 bit (1 level) is stored in each memory cell

o Multi-level-cell (MLC) flash, 2 bit (3 level) are stored in each memory cell

Differences

SLC

MLC1)

comment

Endurance

~100,000

~5,000

physical write/erase cycles

Write

Performance

fast write

slow write

MLC write is more time consuming because of 4

states

Read

Performance

fast read

MLC and SLC technology is similar in the read

performance

Reliability

high

normal

errors are more likely, because the 4 states

Price

expensive

cheap

the same density can be stored in less silicon

Not recommended for OEM market or industrial applications

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6 Electrical Specification

Absolute Maximum Ratings

Parameter

Symbol

Min

Max

Unit

Power Supply Voltage (5V Type)

V_Bus

-0.5

6.0

Power Supply Voltage (3.3V Type)

V_Bus

-0.5

3.6

Voltage on D+ and D-

V_Data

-0.5

3.6

Commercial Operating Temperature

T_A

°C

Extended Operating Temperature

-25

Industrial Operating Temperature

-40

DC characteristics for Full-Speed operation (T=25°C, V_Bus=5V or 3.3V)

Parameter

Symbol

Test condition

Min

Typ

Max

Unit

Supply Voltage (5V Type)

V_Bus

4.75*)

5.00

5.25

Supply Voltage (3.3V Type)

V_Bus

3.13

3.3

3.6

Operating current

I_CC

V_Bus=5.0V

120

Suspend current

I_CCS

350

500

µA

Input LOW Voltage

V_IL

0.8

Input HIGH Voltage

V_IH

Output LOW Voltage

V_OL

RL of 1.5kΩ to 3.6V

0.3

Output HIGH Voltage

V_OH

RL of 15kΩ to GND

2.8

3.6

Output Signal Crossover

Voltage

V_CRS

1.3

2.0

*) The minimum operation voltage of the 5V drives is lower than the USB standard. It depends on the # of used

flash chips (see Minimum supply voltage table below) .

DC characteristics for High-Speed operation (T=25°C, V_Bus=5V or 3.3V)

Parameter

Symbol

Test condition

Min

Typ

Max

Unit

Supply Voltage (Standard)

V_Bus

4.75*)

5.00

5.25

Supply Voltage (3.3V Type)

V_Bus

3.13

3.3

3.6

Operating current

I_CC

V_Bus=5.0V

100

180

Suspend current

I_CCS

350

500

µA

High Speed Idle Level

V_HSOI

-10

High Speed Data Signaling

LOW

V_HSOL

-10

High Speed Data Signaling

HIGH

V_HSOH

360

440

Chirp J Level (differential)

V_CHIRPJ

360

440

Chirp K Level (differential)

V_CHIRP

-440

-360

*) The minimum operation voltage of the 5V drives is lower than the USB standard. It depends on the # of used

flash chips (see Minimum supply voltage table below) .

minimum supply voltage for 5V types

Density

Part Number

min operation voltage

1GB

SFUI1024c3BP2TO-t-MS-221-STD

3.25V

2GB

SFUI2048c3BP2TO-t-MS-221-STD

3.25V

4GB

SFUI4096c3BP2TO-t-DT-221-STD

3.55V

8GB

SFUI8192c3BP2TO-t-QT-221-STD

3.55V

16GB

SFUI16GBc1BP2MT-t-QT-231-STD

3.80V

The minimum operation voltage must be guaranteed at the device connector.

For 3.3V supply please use 3.3V types (part number suffix -3V3) (maximum 3.6V supply)

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7 Environmental Specification and Reliability

7.1 Recommended operating conditions

Parameter

Symbol

Min

Typ

Max

Unit

Commercial Operating Temperature

T_A

°C

Extended Operating Temperature

-25

Industrial Operating Temperature

-40

Storage Temperature

T_S

-50

100

7.2 Reliability

Parameter

Value

Endurance (SLC NAND Flash)

~2’000’000 cycles1)

Data reliability

1 in 1014 bits, read

Error correction code (ECC)

BCH detect up to 9-bit errors / correct up to 8-bit errors per sector

MTBF / MTTF

> 3,000,000 hours

Data retention

10 years @ 10% life time / 1 years @ life end

Durability

> 1500 insertions / removals

100’000 program/erase cycles NAND Flash cell endurance / average file size written = 5% of device density (50MB for 1GB device)/no static

data

7.3 Shock, Vibration, and Humidity

Parameter

Value

Shock

1500G Peak, 0.5m pulse duration, 5 pulses, 6 axes

(JESD22-B110)

Vibration

20G Peak, 20-2000 Hz, 4 cycles per direction (X, Y and Z)

(JESD22-B103)

Humidity

85°C, 85% RH, Vmax for 500 hrs

(JESD22-A101)

8 Compatibility & Compliance

 Configurable as boot-drive

 Standard fix Configuration (mounted as local drive, not as removable drive)

 Operating Systems:

o Windows CE

o Windows Server 2003 and 2008

o Windows 7, Vista, XP, 2000, ME

o Win98 SE (driver available)

o Mac 9.0 and newer

o Mac 8.6 (with driver) and newer

o Linux 2.4 and newer

o All USB mass-storage host systems (guarantee on all USB-IF certified systems)

 CE – EN 55022/55024

 FCC class B for information technology

 USB-IF high speed certified

 RoHS

 UL60950 compliant PCB

 WEEE

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9 Applications

 Gaming

 Industrial PCs

 Point-Of-Sale (POS)

 Industrial Automation

 Networking Equipment

 Medical Equipment

 Data Recorders

10 Performance reference

10.1 Test Equipment

Mainboard:

ASUS P5LD2

CPU:

Intel Core 2 4400 @2.0GHz

OS:

Win XP Prof. V.2002 SP3

Testsoftware:

Swissbit FlashTest 1.2.1/1.3.0 / Script „Performance“

Firmware:

Depends on generation

Prod.Tool:

SPT 1.0.22/23 SDK: 1.0.24

Filesystem:

Low level

10.2 Performance results

The effective speed depends on Controller, Number and type of flash, File system and file size, Test tool & OS.

Cards with the low-profile connector (Partnumber … K1BP…) have the same properties.

Random Read

[kByte/sec]

Random Write

[kByte/sec]

8 sector - 4kByte

128 sector -

64kByte

8 sector - 4kByte

128 sector -

64kByte

SFUI1024J*BP2TO-t-MS*

~5800

~24800

~100

~1600

SFUI2048J*BP2TO-t-MS*

~5800

~26500

~75

~1200

SFUI4096J*BP2TO-t-DT*

~5800

~26000

~75

~1150

SFUI8192J*BP2TO-t-QT*

~5400

~25900

~75

~1150

SFUI16GBJ*BP2MT-t-QT*

~5100

~26000

~22

~390

Sequential Read

[kByte/sec]

Sequential Write

[kByte/sec]

8 sector - 4kByte

128 sector -

64kByte

8 sector - 4kByte

128 sector -

64kByte

SFUI1024J*BP2TO-t-MS*

~7800

~26200

~6500

~8100

SFUI2048J*BP2TO-t-MS*

~8100

~28500

~4600

~11800

SFUI4096J*BP2TO-t-DT*

~8100

~28700

~4600

~20800

SFUI8192J*BP2TO-t-QT*

~8000

~28900

~4600

~20800

SFUI16GBJ*BP2MT-t-QT*

~6600

~2700

~2900

~22000

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11 Standard form factors and hardware

 Standard form factor of PCBs 36.8mm x 26.65mm

 Hole for mechanical fixture (optional grounded)

 Shield (connector Pin 10) grounded (optional NC)

 2 additional holes

 LED for operation indication (optional no LED)

 2 connector types

o 2.54mm pitch, 7.5mm long standard

o 2.00mm pitch, 3.6mm long low profile

 Component heights max. 1.6mm on connector side

max. 1.2mm on flash side

Figure 1: Mechanical Dimensions for 2.54mm connector (standard)

Figure 2: Mechanical Dimensions for 2.54mm connector (standard)

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Figure 3: Mechanical Dimensions for 2.00mm connector (low profile)

Figure 4: Mechanical Dimensions for 2.00mm connector (low profile)

Variations

Part number

Connector

Power

Supply

Pin 9

Pin 10

Hole

LED

SFUIxxxxJgBP2xx-t-xx-2f1-STD

2.54 mm

Key pin

Shield

(NC on

request)

(grounded

on request)

For

operational

indication

(no LED on

request)

SFUIxxxxKgBP2xx-t-xx-2f1-STD

2.00 mm

Key pin

SFUIxxxxJgBP2xx-t-xx-2f1-3V3

2.54 mm

3.3V

Key pin

SFUIxxxxKgBP2xx-t-xx-2f1-3V3

2.00 mm

3.3V

Key pin

SFUIxxxxKgBP2xx-t-xx-2f1-3K0

2.00 mm

3.3V

Key pin

g = hardware generation

t = temperature grade (C=0°C to 70°C and I=-40°C to +85°C)

f = firmware generation per product type

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Figure 5: Component region on connector side (general tolerance ±0.2mm)

Figure 6: Component region on flash side (symmetric to center line, general tolerance ±0.2mm)

mirrored (view from connector side)

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12 RoHS and WEEE update from Swissbit

Dear Valued Customer,

We at Swissbit place great value on the environment and thus pay close attention to the diverse aspects of

manufacturing environmentally and health friendly products. The European Parliament and the Council of the

European Union have published two Directives defining a European standard for environmental protection. This

states that CompactFlash Cards must comply with both Directives in order for them to be sold on the European

market:

 RoHS – Restriction of Hazardous Substances

 WEEE – Waste Electrical and Electronic Equipment

Swissbit would like to take this opportunity to inform our customers about the measures we have implemented to

adapt all our products to the European norms.

What is the WEEE Directive (2012/19/EC)?

The Directive covers the following points:

 Prevention of WEEE

 Recovery, recycling and other measures leading to a minimization of wastage of electronic and

electrical equipment

 Improvement in the quality of environmental performance of all operators involved in the EEE life

cycle, as well as measures to incorporate those involved at the EEE waste disposal points

What are the key elements?

The WEEE Directive covers the following responsibilities on the part of producers:

Producers must draft a disposal or recovery scheme to dispose of EEE correctly.

Producers must be registered as producers in the country in which they distribute the goods.

They must also supply and publish information about the EEE categories.

Producers are obliged to finance the collection, treatment and disposal of WEEE.

Inclusion of WEEE logos on devices

In reference to the Directive, the WEEE logo must be printed directly on all devices that have sufficient space. «In

exceptional cases where this is necessary because of the size of the product, the symbol of the WEEE Directive

shall be printed on the packaging, on the instructions of use and on the warranty»

(WEEE Directive 2012/19/EC)

When does the WEEE Directive take effect?

The Directive came into effect internationally on July 04, 2012.

What is RoHS (2011/65/EU)?

The goals of the Directive are to:

 Place less of a burden on human health and to protect the environment by restricting the use of

hazardous substances in new electrical and electronic devices

 To support the WEEE Directive (see above)

RoHS enforces the restriction of the following 6 hazardous substances in electronic and electrical devices:

 Lead (Pb) – no more than 0.1% by weight in homogeneous materials

 Mercury (Hg) – no more than 0.1% by weight in homogeneous materials

 Cadmium (Cd) – no more than 0.01% by weight in homogeneous materials

 Chromium (Cr6+) – no more than 0.1% by weight in homogeneous materials

 PBB, PBDE – no more than 0.1% by weight in homogeneous materials

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Swissbit is obliged to minimize the hazardous substances in the products.

According to part of the Directive, manufacturers are obliged to make a self-declaration for all devices with RoHS.

Swissbit carried out intensive tests to comply with the self-declaration. We have also already taken steps to have

the analyses of the individual components guaranteed by third-party companies.

Swissbit carried out the following steps during the year with the goal of offering our customers products that are

fully compliant with the RoHS Directive.

 Preparing all far-reaching directives, logistical enhancements and alternatives regarding the full

understanding and introduction of the RoHS Directive’s standards

 Checking the components and raw materials:

o Replacing non-RoHS-compliant components and raw materials in the supply chain

o Cooperating closely with suppliers regarding the certification of all components and raw

materials used by Swissbit

 Modifying the manufacturing processes and procedures

o Successfully adapting and optimizing the new management-free integration process in

the supply chain

o Updating existing production procedures and introducing the new procedures to support

the integration process and the sorting of materials

 Carrying out the quality process

o Performing detailed function and safety tests to ensure the continuous high quality of the

Swissbit product line

When does the RoHS Directive take effect?

As of June 08, 2011 only new electrical and electronic devices with approved quantities of RoHS will be put on the

market.

When will Swissbit be offering RoHS-approved products?

Swissbit’s RoHS-approved products are available now. Please contact your Swissbit contact person to find out

more about exchanging your existing products for RoHS-compliant devices.

For your attention

We understand that packaging and accessories are not EEE material and are therefore not subject to the WEEE or

RoHS Directives.

Contact details:

Swissbit AG

Industriestrasse 4

CH 9552 Bronschhofen

Tel: +41 71 913 03 03 – Fax: +41 71 913 03 15

E-mail: industrial@swissbit.com – Website: www.swissbit.com

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13 Best Practices

There are a number of best practices to reach the maximum life time.

13.1 Wear Leveling and Spare Block Management

The device uses zone based flash management (zones also called as management units). This means that the user

accessible data range (LBA area) is evenly divided into multiple zones, which are all managed separately for both,

wear leveling (dynamic and static) and for spare & bad block management.

USB HOST INTERFACE

USB FLASH DRIVE

FIRST SECTOR (LBA 0)

LAST SECTOR

ZONE 1 (MU1)

ZONE 2 (MU2)

ZONE 3 (MU3)

ZONE 4 (MU4)

*MU=Management Unit

The number of zones is depending on the device

density and can be read out using the Swissbit

Life Time Monitoring tool. The tool will show the

number of available spare blocks per

management unit (zone). The devices need a

minimum number of 2 spare blocks per unit to

work with. If the first unit reaches this value,

the device will be write-protected by the

firmware.

To get optimal life time, write accesses must be

evenly distributed over all zones. This can, for

example, be achieved by using multiple partitions and by then distributing the data between the partitions.

13.1 Device Removal & Power Failure

User data can be lost or corrupted if power is interrupted while the UFD is writing data. To avoid data loss, it is

necessary to avoid power interruption while the device is busy. This can be made sure by always using the host

(e.g. Windows) shutdown mechanisms or by detaching the device in the operating system before unplugging it.

Swissbit also offers an Application Note “Design-In Guide” that describes techniques to reduce data loss on power

failure, if power failure absolutely can’t be avoided.

13.2 Lifetime end handling

If the flash reaches its end of life, the number of bad blocks will increase (bad flash blocks will be replaced with

spare blocks). There exist different side effects with negative data influence by degraded flash cells. Sometimes

bit errors can occur because of effects that are not immediately detected by the flash, e.g. effects like program

disturb or read disturb, which means that the bad block recognition does not always prevent data loss.

When the number of bit errors in a sector exceeds the ECC correcting capabilities, invalid (uncorrected) data can

be reported back to the host. Because of these effects it is strongly recommended to replace devices that are

nearing their end of life. One good indicator would be the current spare blocks per unit should not be reducing

below 5. It is in the responsibility of the system integrator to account for the flash usage per zone. Swissbit offers

support for calculating expected life time if the exact use case is provided (e.g. by providing low level [USB

interface] write statistics).

For notes on reducing flash stress, Swissbit offers an Application Note called “Design-In Guide”.

Please contact your sales channel for more information or send a mail to sales@swissbit.com.

Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.60

Industriestrasse 4

CH-9552 Bronschhofen www.swissbit.com U-110_data_sheet_UI-xxBP_Rev160

Switzerland industrial@swissbit.com Page 15 of 17

14 Part Number Decoder

4096

211

STD

Manuf.

Option

Memory Type.

Configuration

Product Type

Manuf. Code: Flash Mode

Density

Manuf. Code: Flash Package

Platform

Temp. Option

Product Generation

Flash vendor Code

Memory Organization

Number of flash chips/channels

Technology

1. Manufacturer

Swissbit

2. Memory Type

Flash

3. Product Type

U-1xx USB Flash Drive Module (Internal)

4. Density

1 GB

1024

2 GB

2048

4 GB

4096

8 GB

8192

16 GB

16GB

5. Platform

U-1xx – 2.54mm plug

U-1xx – 2.00mm plug

6. Product Generation

7. Memory Organization

8. Technology

U-100 technology

U-110 technology

9. Number of Flash channels

1 Flash

2 Flash

10. Flash Code

Toshiba

Micron

11. Temp. Option

Industrial Temp. Range -40°C to 85°C

Extended Temp. Range -25°C to 85°C

Standard Temp. Range 0°C to 70°C

12. DIE Classification

SLC MONO (single die package)

SLC DDP (dual die package)

SLC QDP (quad die package)

13. PIN Mode

Normal nCE & R/nB

0/S

Dual nCE & Dual R/nB

1/T

Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.60

Industriestrasse 4

CH-9552 Bronschhofen www.swissbit.com U-110_data_sheet_UI-xxBP_Rev160

Switzerland industrial@swissbit.com Page 16 of 17

14. UFD XYZ

X Setting

Fix Drive

Y  Firmware revision per product generation

Revision 1

Revision 2

Revision 3



 Optional setting

default

15. Option

Swissbit / Standard 5V supply

STD

Swissbit / Standard 3.3V supply *)

3V3

Customized version

XXX

*) max 3.6V allowed

15 Label

15.5

10.5

SFUIxxxxXXBPXXX

-X-XX-XXX-XXX

XXXXXXXX

Swissbit

SFUIxxxxxxBPxxx Part Number

-x-xx-xxx-xxx

xxxxxxxx Lot Code

xxxxxx Type No.

Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.60

Industriestrasse 4

CH-9552 Bronschhofen www.swissbit.com U-110_data_sheet_UI-xxBP_Rev160

Switzerland industrial@swissbit.com Page 17 of 17

16 Revision History

Document Revision History

Date

Revision

Revision Details

23-November-2009

1.00

Final release

28-October-2010

1.10

General part numbers update, speed values for Toshiba flash

18-June-2012

1.20

Add 16GB UFD, add best practices

29-August-2012

1.21

16GB Performance adapted (better data reliability)

13-December-2012

1.30

New CE Declaration

04-June-2013

1.40

min voltage specification for standard products dependent on density (3.25…3.80V)

02-July-2013

1.41

Min. voltage specification, add additional 3.3V variation

07-April-2014

1.50

Added FW rev. 3 for 16GB and removed CE declaration

03-June-2014

1.60

Added low profile drawings, added variation table and changed the order information

Disclaimer:

No part of this document may be copied or reproduced in any form or by any means, or transferred to any third

party, without the prior written consent of an authorized representative of Swissbit AG (“SWISSBIT”). The

information in this document is subject to change without notice. SWISSBIT assumes no responsibility for any

errors or omissions that may appear in this document, and disclaims responsibility for any consequences resulting

from the use of the information set forth herein. SWISSBIT makes no commitments to update or to keep current

information contained in this document. The products listed in this document are not suitable for use in

applications such as, but not limited to, aircraft control systems, aerospace equipment, submarine cables, nuclear

reactor control systems and life support systems. Moreover, SWISSBIT does not recommend or approve the use of

any of its products in life support devices or systems or in any application where failure could result in injury or

death. If a customer wishes to use SWISSBIT products in applications not intended by SWISSBIT, said customer

must contact an authorized SWISSBIT representative to determine SWISSBIT willingness to support a given

application. The information set forth in this document does not convey any license under the copyrights, patent

rights, trademarks or other intellectual property rights claimed and owned by SWISSBIT. The information set forth

in this document is considered to be “Proprietary” and “Confidential” property owned by SWISSBIT.

ALL PRODUCTS SOLD BY SWISSBIT ARE COVERED BY THE PROVISIONS APPEARING IN SWISSBIT’S TERMS AND CONDITIONS OF

SALE ONLY, INCLUDING THE LIMITATIONS OF LIABILITY, WARRANTY AND INFRINGEMENT PROVISIONS. SWISSBIT MAKES NO

WARRANTIES OF ANY KIND, EXPRESS, STATUTORY, IMPLIED OR OTHERWISE, REGARDING INFORMATION SET FORTH HEREIN OR

REGARDING THE FREEDOM OF THE DESCRIBED PRODUCTS FROM INTELLECTUAL PROPERTY INFRINGEMENT, AND EXPRESSLY

DISCLAIMS ANY SUCH WARRANTIES INCLUDING WITHOUT LIMITATION ANY EXPRESS, STATUTORY OR IMPLIED WARRANTIES OF

MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.

Mouser Electronics

Authorized Distributor

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