CM1205 ESD Protection Arrays, Chip Scale Package Features Product Description * The CM1205 family of transient voltage suppressor arrays provides a very high level of protection for sensitive electronic components that may be subjected to ESD. * * * * * Functionally and pin compatible with CAMD's PACDN1404C, PACDN1408C and PACDN1416C family of ESD protection devices 4, 8, or 16 transient voltage suppressors in a single package OptiguardTM coated for improved reliability at assembly In-system Electrostatic Discharge (ESD) protection to +25kV contact discharge per IEC 61000-4-2 international standard Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages Lead-free versions available These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, +8kV contact discharge). All I/Os are rated at +25kV using the IEC 61000-4-2 contact discharge method. Using the MILSTD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than +30kV. The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. Applications * * * * * * * * ESD protection for sensitive electronic equipment I/O port, keypad and button circuitry protection for portable devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Cameras and Camcorders Notebooks Desktop PCs The CM1205 features OptiGuardTM coating for improved reliability at assembly and is available with optional lead-free finishing. Electrical Schematic B1 B2 B3 B1 B2 B3 B4 B5 D1 D2 D3 D4 D5 A1 A2 A3 A1 A2 A3 A4 A5 C1 C2 C3 C4 C5 B1 B2 B3 B4 B5 A2 A3 A4 A5 CM1205-04CS/CP CM1205-08CS/CP A1 CM1205-16CS/CP (c) 2003 California Micro Devices Corp. All rights reserved. 11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 1 CM1205 PACKAGE / PINOUT DIAGRAMS TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) Orientation Marking (see note 2) 1 A 2 3 L05 B B1 B2 B3 A1 A2 A3 CM1405-04 CSP Package Orientation Marking (see note 2) TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) 1 A 2 3 4 5 120508 B B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 CM1405-08 CSP Package Orientation Marking (see note 2) 1 TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) 2 3 4 5 A D1 D2 D3 D4 D5 B C1 C2 C3 C4 C5 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 C 120516 D CM1405-16 CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 6 CSP CM1205-04CS L05 CM1205-04CP L05 10 CSP CM1205-08CS 120508 CM1205-08CP 120508 20 CSP CM1205-16CS 120516 CM1205-16CP 120516 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. (c) 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 11/17/03 CM1205 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING UNITS -40 to +85 C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN VREV Reverse Standoff Voltage IDIODE=10A 5.5 ILEAK Leakage Current VIN=3.3V DC VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 & 3 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2 & 3 Channel Capacitance At 2.5V DC, f = 1MHz VESD VCL C 5.6 -1.2 TYP MAX UNITS V 6.8 -0.8 100 nA 8.0 -0.4 V V +30 kV +25 kV +12 -8 39 V V 47 pF Note 1: TA=25C unless otherwise specified. GND in this document refers to the lower supply voltage. Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. Note 3: These parameters are guaranteed by design and characterization. (c) 2003 California Micro Devices Corp. All rights reserved. 11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 3 CM1205 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.300mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.350mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.360mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance -- Edge To Corner Ball +50m Solder Ball Side Coplanarity +20m Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260C Non-Solder Mask Defined Pad 0.300mm DIA. Solder Stencil Opening 0.360mm DIA. Solder Mask Opening 0.350mm DIA. Figure 1. Recommended Non-Solder Mask Defined Pad Illustration Temperature (C) 250 200 150 100 50 0 Figure 2. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile (c) 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 11/17/03 CM1205 Mechanical Details The CM1205 devices are packaged in custom Chip Scale Packages (CSP). CM1205-04CS/CP 6-bump CSP Mechanical Specifications The CM1205-04CS/CP devices are packaged in a 6bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams BOTTOM VIEW PACKAGE DIMENSIONS Package B1 B3 B2 Dim C1 Custom CSP Bumps 6 Millimeters 3 Inches Max Nom Max A1 1.109 1.154 1.199 0.0437 0.0454 0.0472 A2 1.759 1.804 1.849 0.0693 0.0710 0.0728 B1 0.645 0.650 0.655 0.0254 0.0256 0.0258 B2 0.645 0.650 0.655 0.0254 0.0256 0.0258 B3 0.645 0.650 0.655 0.0254 0.0256 0.0258 C1 0.202 0.252 0.302 0.0080 0.0099 0.0119 C2 0.202 0.252 0.302 0.0080 0.0099 0.0119 D1 0.638 0.707 0.776 0.0251 0.0278 0.0306 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 A2 Nom 2 1 A B C2 Min # per tape and reel Min OptiGuardTM Coating A1 D1 D2 0.35 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW NOTE: DIMENSIONS IN MILLIMETERS Package Dimensions for CM1205-04CS/CP 6-bump Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CM1205-04CS/CP 1.804 X 1.154 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIA. QTY PER REEL P0 P1 1.98 X 1.32 X 0.91 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 4. Tape and Reel Mechanical Data (c) 2003 California Micro Devices Corp. All rights reserved. 11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 5 CM1205 Mechanical Details (cont'd) CM1205-08CS/CP 10-bump CSP Mechanical Specifications The CM1205-08CS/CP devices are packaged in a 10bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams BOTTOM VIEW PACKAGE DIMENSIONS Custom CSP Bumps 10 Dim Millimeters C1 B1 Inches Nom 5 Max 1.154 1.199 0.0437 0.0454 0.0472 Max A2 3.059 3.104 3.149 0.1204 0.1222 0.1240 B1 0.645 0.650 0.655 0.0254 0.0256 0.0258 B2 0.645 0.650 0.655 0.0254 0.0256 0.0258 C1 0.202 0.252 0.302 0.0080 0.0099 0.0119 C2 0.202 0.252 0.302 0.0080 0.0099 0.0119 D1 0.638 0.707 0.776 0.0251 0.0278 0.0306 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 4 3 2 A2 Nom 1.109 B A B A C2 Min A1 # per tape and reel Min B2 Package OptiGuardTM Coating A1 1 D1 0.35 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW 3500 pieces NOTE: DIMENSIONS IN MILLIMETERS Controlling dimension: millimeters Package Dimensions for CM1205-08CS/CP 10-bump Chip Scale Package CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1205-08CS/CP 3.104 X 1.154 X 0.644 3.28 X 1.32 X 0.81 Po Top Cover Tape TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 5. Tape and Reel Mechanical Data (c) 2003 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 11/17/03 CM1205 Mechanical Details (cont'd) CM1205-16CS/CP 20-bump CSP Mechanical Specifications The CM1205-16CS/CP devices are packaged in a 20bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams BOTTOM VIEW PACKAGE DIMENSIONS Custom CSP Bumps 20 Dim Millimeters C1 B1 Inches Min 5 Max 2.454 2.499 0.0948 0.0966 0.0984 Nom Max A2 3.059 3.104 3.149 0.1204 0.1222 0.1240 B1 0.645 0.650 0.655 0.0254 0.0256 0.0258 B2 0.645 0.650 0.655 0.0254 0.0256 0.0258 C1 0.202 0.252 0.302 0.0080 0.0099 0.0119 C2 0.202 0.252 0.302 0.0080 0.0099 0.0119 D1 0.638 0.707 0.776 0.0251 0.0278 0.0306 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 4 A2 Nom 2.409 3 2 B A B A C2 Min A1 # per tape and reel B2 Package OptiGuardTM Coating A1 1 D C D1 D2 0.35 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW 3500 pieces DIMENSIONS IN MILLIMETERS Controlling dimension: millimeters Package Dimensions for CM1205-16CS/CP 20-bump Chip Scale Package CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1205-16CS/CP 3.104 X 2.454 X 0.644 3.28 X 2.64 X 0.86 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 6. Tape and Reel Mechanical Data (c) 2003 California Micro Devices Corp. All rights reserved. 11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 7