PCI1512 www.ti.com SLLA231 - JUNE 2006 CardBus Controller FEATURES * * * * * * * * A 216-Terminal MicroStar BGATM PBGA (GVF/ZVF) Package 2.5-V Core Logic and 3.3-V I/O with Universal PCI Interfaces Compatible with 3.3-V and 5-V PCI Signaling Environments Integrated Low-Dropout Voltage Regulator LDO-VR) Eliminates the Need for an External 2.5-V Power Supply Mix-and-Match 5-V/3.3-V 16-Bit PC Cards and 3.3-V CardBus Cards A Single PC Card or CardBus Slot with Hot Insertion and Removal Parallel Interface to TI TPS2211A Single-Slot PC Card Power Switch Burst Transfers to Maximize Data Throughput with CardBus Cards Interrupt Configurations: Parallel PCI, Serialized PCI, Parallel ISA, and Serialized ISA * * * * * * * * * * * * Serial EEPROM Interface for Loading Subsystem ID, Subsystem Vendor ID, and Other Configuration Registers Pipelined Architecture for Greater Than 130-Mbps Throughput from CardBus-to-PCI and from PCI-to-CardBus Up to Five General-Purpose I/Os Programmable Output Select for CLKRUN Five PCI Memory Windows and Two I/O Windows Available for the 16-Bit Interface Two I/O Windows and Two Memory Windows Available to the CardBus Socket Exchangeable-Card-Architecture- (ExCA-) Compatible Registers Are Mapped in Memory and I/O Space IntelTM 82365SL-DF and 82365SL Register Compatible Ring Indicate, SUSPEND, PCI CLKRUN, and CardBus CCLKRUN Socket Activity LED Terminal PCI Bus Lock (LOCK) Internal Ring Oscillator DESCRIPTION The Texas Instruments PCI1512 device, a 216-terminal MicroStar BGATM single-slot CardBus controller designed to meet the PCI Bus Power Management Interface Specification for PCI to CardBus Bridges, is an ultralow-power high-performance PCI-to-CardBus controller that supports a single PC card socket compliant with the PC Card Standard (Revision 7.2). The controller provides features that make it the best choice for bridging between PCI and PC Cards in both notebook and desktop computers. The PC Card Standard retains the 16-bit PC Card specification defined in the PCI Local Bus Specification and defines the 32-bit PC Card, CardBus, capable of full 32-bit data transfers at 33 MHz. The controller supports both 16-bit and CardBus PC Cards, powered at 5 V or 3.3 V, as required. The controller is compliant with the PCI Local Bus Specification, and its PCI interface can act as either a PCI master device or a PCI slave device. The PCI bus mastering is initiated during CardBus PC Card bridging transactions. The controller is also compliant with PCI Bus Power Management Interface Specification (Revision 1.1). All card signals are internally buffered to allow hot insertion and removal without external buffering. The controller is register-compatible with the Intel 82365SL-DF and 82365SL ExCA controllers. The controller internal data path logic allows the host to access 8-, 16-, and 32-bit cards using full 32-bit PCI cycles for maximum performance. Independent buffering and a pipeline architecture provide an unsurpassed performance level with sustained bursting. The controller can also be programmed to accept fast posted writes to improve system-bus utilization. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MicroStar BGA is a trademark of Texas Instruments. Intel is a trademark of Intel Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006, Texas Instruments Incorporated PCI1512 www.ti.com SLLA231 - JUNE 2006 Multiple system-interrupt signaling options are provided, including parallel PCI, parallel ISA, serialized ISA, and serialized PCI. Furthermore, general-purpose inputs and outputs are provided for the board designer to implement sideband functions. Many other features designed into the PCI1512 controller, such as a socket activity light-emitting diode (LED) outputs, are discussed in detail throughout this document. An advanced complementary metal-oxide semiconductor (CMOS) process achieves low system power consumption while operating at PCI clock rates up to 33 MHz. Several low-power modes enable the host power-management system to further reduce power consumption. NOTE: This product is for high-volume PC applications only. For a complete datasheet or more information contact support@ti.com. 2 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 29-Jun-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing PCI1512ZVF OBSOLETE NFBGA ZVF Pins Package Eco Plan (2) Qty 216 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. 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