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DESCRIPTION
PCI1512
SLLA231 – JUNE 2006
CardBus Controller
•Serial EEPROM Interface for LoadingSubsystem ID, Subsystem Vendor ID, and•A 216-Terminal MicroStar BGA™ PBGA
Other Configuration Registers(GVF/ZVF) Package
•Pipelined Architecture for Greater Than•2.5-V Core Logic and 3.3-V I/O with Universal
130-Mbps Throughput from CardBus-to-PCIPCI Interfaces Compatible with 3.3-V and 5-V
and from PCI-to-CardBusPCI Signaling Environments
•Up to Five General-Purpose I/Os•Integrated Low-Dropout Voltage RegulatorLDO-VR) Eliminates the Need for an External •Programmable Output Select for CLKRUN2.5-V Power Supply
•Five PCI Memory Windows and Two I/O•Mix-and-Match 5-V/3.3-V 16-Bit PC Cards and Windows Available for the 16-Bit Interface3.3-V CardBus Cards
•Two I/O Windows and Two Memory Windows•A Single PC Card or CardBus Slot with Hot Available to the CardBus SocketInsertion and Removal
•Exchangeable-Card-Architecture- (ExCA-)•Parallel Interface to TI TPS2211A Single-Slot Compatible Registers Are Mapped in MemoryPC Card Power Switch and I/O Space•Burst Transfers to Maximize Data Throughput •Intel™ 82365SL-DF and 82365SL Registerwith CardBus Cards Compatible•Interrupt Configurations: Parallel PCI, •Ring Indicate, SUSPEND, PCI CLKRUN, andSerialized PCI, Parallel ISA, and Serialized CardBus CCLKRUNISA
•Socket Activity LED Terminal•PCI Bus Lock ( LOCK)•Internal Ring Oscillator
The Texas Instruments PCI1512 device, a 216-terminal MicroStar BGA™ single-slot CardBus controllerdesigned to meet the PCI Bus Power Management Interface Specification for PCI to CardBus Bridges, is anultralow-power high-performance PCI-to-CardBus controller that supports a single PC card socket compliant withthe PC Card Standard (Revision 7.2). The controller provides features that make it the best choice for bridgingbetween PCI and PC Cards in both notebook and desktop computers. The PC Card Standard retains the 16-bitPC Card specification defined in the PCI Local Bus Specification and defines the 32-bit PC Card, CardBus,capable of full 32-bit data transfers at 33 MHz. The controller supports both 16-bit and CardBus PC Cards,powered at 5 V or 3.3 V, as required.
The controller is compliant with the PCI Local Bus Specification, and its PCI interface can act as either a PCImaster device or a PCI slave device. The PCI bus mastering is initiated during CardBus PC Card bridgingtransactions. The controller is also compliant with PCI Bus Power Management Interface Specification (Revision1.1).
All card signals are internally buffered to allow hot insertion and removal without external buffering. Thecontroller is register-compatible with the Intel 82365SL-DF and 82365SL ExCA controllers. The controllerinternal data path logic allows the host to access 8-, 16-, and 32-bit cards using full 32-bit PCI cycles formaximum performance. Independent buffering and a pipeline architecture provide an unsurpassed performancelevel with sustained bursting. The controller can also be programmed to accept fast posted writes to improvesystem-bus utilization.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.MicroStar BGA is a trademark of Texas Instruments.Intel is a trademark of Intel Corporation.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
PCI1512
SLLA231 – JUNE 2006
Multiple system-interrupt signaling options are provided, including parallel PCI, parallel ISA, serialized ISA, andserialized PCI. Furthermore, general-purpose inputs and outputs are provided for the board designer toimplement sideband functions. Many other features designed into the PCI1512 controller, such as a socketactivity light-emitting diode (LED) outputs, are discussed in detail throughout this document.
An advanced complementary metal-oxide semiconductor (CMOS) process achieves low system powerconsumption while operating at PCI clock rates up to 33 MHz. Several low-power modes enable the hostpower-management system to further reduce power consumption.
NOTE:
This product is for high-volume PC applications only. For a complete datasheet ormore information contact support@ti.com.
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
PCI1512ZVF OBSOLETE NFBGA ZVF 216 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 29-Jun-2009
Addendum-Page 1
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