Infineon has a broad portfolio of packaged RF transceivers for basestation backhaul solutions –
beside BGT70 and BGT80 for E-band radio, also BGT60 for V-band radio. The family approach has
a major benefit – one architecture supporting the three backhaul frequency ranges of 60, 70 and
80GHz. Customers can easily design all three radios with the same footprint for all three transceivers.
Mobile communication and especially LTE (4G) is gaining momentum these days due to the fact
that all big carriers and mobile phone manufacturers are investing in the 4th generation ecosystem.
The primary challenge facing this ecosystem is the fact that LTE will further enhance video and
data exchange to a maximum, allowing everybody to send their latest holiday pictures and videos
to friends. The bulk of today’s base station infrastructure is not equipped to support the required
high data throughput. The connection between the base station has up to now been planned for
lower data rates (< 100MBit/s) and now needs increased capacity. This is where wireless back-
haul technology comes into play. A solution using wireless backhaul in the V-band (57–64GHz)
will enable the 7GHz frequency to support higher data rates. This enables data rates > 1Gbit/s for
video and data services, sucient for LTE.
BGT60 Features
Target Feature Details
Developed for telecommunication only
Support FDD and TDD systems
(in full duplex or half-duplex mode)
Support modulation schemes:
QPSK, QAM
Support small cell backhaul
(up to 1000m)
Direct conversion I/Q transceiver
IF bandwidth 1000MHz
Dierential RF/IF interface for lower loss
and better isolation
Integration of VCO (Voltage Controller
Oscillator) signal generation
PNssb (Phase Noise single side band)
< -80dBc/Hz @ 100kHz oset
Typ. 13dBm linear output power
7dB NF (Noise Figure)
Integrated power detection function
Integrated thermal sensor
eWLB (embedded Wafer Level
Ball Grid Array) packaged device
Product Brief
Infineon rounds o the Backhaul Family with
a packaged RF Solution for V-band Radio
Backhaul Transceiver Chip – BGT60
www.infineon.com/rf
Backhaul Network
Example
Characteristics of dierent Base Station Sizes
LTE
BTS
Picocell
Microcell Picocell
Macrocell
Picocell
4G/LTE
Base Station Picocell Microcell Macrocell
Range 10–200m 200m–2km 1–30km
No. of users 8–32 64+ 200+
Typical application SMB, enterprise, public
indoor areas
Metro outdoors, city cen-
ters, capacity hotspots
Outdoor coverage
Deployment scenario Enterprise or operator
deployed
Operator deployed Operator deployed
Product Brief
Published by
Infineon Technologies AG
85579 Neubiberg, Germany
© 2013 Infineon Technologies AG.
All Rights Reserved.
Visit us:
www.infineon.com
Order Number: B132-H9781-G1-X-7600
Date: 08 / 2013
Attention please!
The information given in this document shall in no event
be regarded as a guarantee of conditions or characteristics
(“Beschaenheitsgarantie”). With respect to any examples
or hints given herein, any typical values stated herein and/
or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warran-
ties and liabilities of any kind, including without limitation
warranties of non-infringement of intellectual property
rights of any third party.
Information
For further information on technology, delivery terms and
conditions and prices please contact your nearest Infineon
Technologies Oce (www.infineon.com).
Warnings
Due to technical requirements components may contain
dangerous substances. For information on the types in
question please contact your nearest Infineon Technolo-
gies Oce. Infineon Technologies Components may only
be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause
the failure of that life-support device or system, or to aect
the safety or eectiveness of that device or system. Life
support devices or systems are intended to be implanted
in the human body, or to support and/or maintain and
sustain and/or protect human life. If they fail, it is reason-
able to assume that the health of the user or other persons
may be endangered.
Benefits of BGT60
Packaged solution, easy to use and standard SMT flow for mounting
on customer system
Highly integrated RF transceiver requiring no external
RF discretes, thereby simplifying the customer design and
time-to-market
Architecture of Direct Conversion Zero IF eases interface to
latest modem/BB designs (no external filter)
A transceiver approach with implemented BIST (Built-In Self-Test)
on the chip to enable RF testing at Infineon production
Family concept (common architecture, package, pinning)
simplifies customer designs due to modular approach
Transceiver Chip Solution
BGT60 for ISM band (license free), 57–64GHz
BGT60 has identical pinning and same footprint as
BGT70 or BGT80
Channel, Tx or Rx, selection via SPI
V-Band TDD
Base Station A Base Station B
I/F I/Q Downconversion
I/F I/Q Upconversion
I/F I/Q Downconversion
I/F I/Q Upconversion
BGT60
Tx or Rx
On
BGT60
Rx or Tx
On
Half Duplex System in TDD
Infineon rounds o the Backhaul Family with
a packaged RF Solution for V-band Radio
Backhaul Transceiver Chip – BGT60
However, if we compare the 60GHz V-band with the 80GHz E-band, the
former is always seen as a less favorable frequency band, due to the
sharp oxygen absorption. This means that in addition to the Free Space
Loss (FSL), oxygen absorption loss must be taken into account and a
margin allowed for rain fade. As a result, a maximum link distance of up
to 1000 meters is possible.
This could be considered a disadvantage in traditional network design,
where a microwave link would mostly be used for distances beyond
1000 meters. Particularly in the case of Picocell deployment, high
oxygen absorption and the associated reduced range becomes a real
benefit compared to traditional microwave or other wireless backhaul-
ing solutions:
Benefits of V-band Radio
Hundreds of links can be installed in a dense area
Very low interference between the PTP links or other 60GHz devices
in the field
High bandwidth for up to 1Gbit/s (full duplex) per link
The Infineon business approach enables such a Gbit service with the
latest technology. Thanks to Infineon’s advanced SiGe (Silicon Germa-
nium) technology with a transit frequency of 200GHz, we can integrate
all RF (Radio Frequency) building blocks – such as Power Amplifier (PA),
Low Noise Amplifier (LNA), Mixer, Programmable Gain Amplifier (PGA),
Voltage Controlled Oscillator (VCO) – into a single chip.
This technology is already proven and fully qualified for Infineon
Millimeter and Microwave chipsets (e.g. 77GHz automotive radar).
Furthermore, Infineon houses this single-chip in a plastic package
which makes a major dierence to the market. Up to now, solutions
have been bare die and require expensive tools and equipment to build
up a radio system. With the Infineon packaged chipset, customers can
save money and reduce the time-to-market significantly.
The chip is a transceiver for 57–64GHz (BGT60), housed in an
eWLB(6 × 6mm²) package.
