AH315-G - TriQuint - Datasheet.Directory

AH315

3.3 – 3.8 GHz WiMAX 2W Driver Amplifier

Applications

• 802.16 WiMAX infrastructure

24-pin 5x5mm leadless QFN SMT package

Product Features Functional Block Diagram

• 3.3 – 3.8 GHz

• 25 dB Gain

• EVM <2.5 %@ 25 dBm Pout

• Internal Active Bias

• +5V Single Supply Voltage

• +33 dBm P1dB

• RoHS-compliant/Lead-free

• 5x5 mm QFN SMT package

13

14

15

11

12

3

2

1

5

4

17

19

18

20

16

9

7

8

6

10

Iref1

Vbias1

GND / NC

RF In

Vcc2

GND / NC

RF Out

GND / NC

Vcc1

GND / NC

Vbias2

Iref2

General Description Pin Configuration

The AH315 is a high dynamic range broadband driver

amplifier in a surface mount package. The two-stage

amplifier has 25 dB of gain, while achieving +25 dBm of

linear output power for 3.3–3.8 GHz WiMAX/WiBro

applications.

AH315 uses a high reliability +5V InGaP/GaAs HBT

p

rocess technology. The device incorporates proprietary

b

ias circuitry to compensate for variations in linearity and

current draw over temperature. The device does not require

any negative bias voltage; an internal active bias allows the

AH315 to operate directly off a commonly used single

+5V supply. The RoHS-compliant/Lead-free 5x5mm QFN

p

ackage is surface mountable to allow for low

manufacturing costs to the end user.

The AH315 is targeted for use in a configuration for the

driver stage amplifier in 802.16 WiMAX base stations

where high linearity and medium power is required.

Ordering Information

Part No. Description

AH315-G 3.3 – 3.8 GHz WiMAX 2W Driver Amp

AH315-PCB 3.4 – 3.6 GHz Evaluation Board

Standard T/R size = 1000 pieces on a 7” reel.

Pin No. Function

1 Iref 1

2 Vbias1

4, 5 RFin

3, 6, 7, 8, 9, 10, 14, 18, 20 GND/NC

11, 12, 13 RFout

15 Vcc2

16 Iref 2

17 Vbias2

19 Vcc1

Backside Paddle GND

Data Sheet: Rev A 09/02/10 - 1 of 9 - Disclaimer: Subject to change without notice

AH315

3.3 – 3.8 GHz WiMAX 2W Driver Amplifier

Data Sheet: Rev A 09/02/10 - 2 of 9 - Disclaimer: Subject to change without notice

Specifications

Absolute Maximum Ratings

Parameter Rating

Storage Temperature -55 to +125 o C

RF Input Power, CW, 50Ω,T = 25ºC +19 dBm

Device Voltage, Vcc, Vbias +8 V

Collector Current, Icc (Icc1 + Icc2) 1600 mA

Iref 1 100 mA

Iref 2 50 mA

Device Power 8 W

Thermal Resistance RTH 14.4

o C/W

Operation of this device outside the parameter ranges given

above may cause permanent damage.

Recommended Operating Conditions

Parameter Min Typ Max Units

Vcc +4.75 +5 +6 V

Icc @ 24 dBm 700 mA

TJ (for >106 hours MTTF) +200 oC

Operating Temp. Range -40 +85 oC

Electrical specifications are measured at specified test conditions.

Specifications are not guaranteed over all recommended operating

conditions.

Electrical Specifications

Test conditions unless otherwise noted: 25ºC, +5V Vsupply, 3.4 – 3.6 GHz, in tuned application circuit.

Parameter Conditions Min Typical Max Units

Operational Frequency Range 3.3 3.8 GHz

Test Frequency 3.5 GHz

Power Gain 25 dB

Input Return Loss -15.2 dB

Output Return Loss -11.3 dB

EVM See Note 1. 2.3 2.5 %

Efficiency 8 %

Output P1dB +33 dBm

Noise Figure 7.3 dB

Device Voltage, Vcc +5 V

Iref 1 27 mA

Iref 2 10 mA

Quiescent Current, Icq See Note 2. 600 mA

Notes:

1. Using an 802.16-2004 OFDMA, 64QAM-1/2, 1024-FFT, 20 symbols, 30 subchannels.

2. This corresponds to the quiescent current or operating current under small-signal conditions with bias resistor R1=70Ω off pin 1 and

R2=150Ω off pin 16.

AH315

3.3 – 3.8 GHz WiMAX 2W Driver Amplifier

Device Characterization Data

VCC = +5 V, ICQ = 600 mA, T = 25 °C, unmatched 50 ohm system, calibrated to device leads

0

5

10

15

20

25

30

012345

Gain (dB)

Frequency (GHz)

Gain vs. Frequency

Output Smith Chart

Input Smith Char

t

-1

0.6

-0.8

0.4

-0.6

-0.4

0.2

-0.2

0.25

0

0.8

1

-1 -0.75-0.5- 0 0.25 0.5 0.75 1

0.05 GHz

5 GHz

0.05 GHz

5 GHz

Notes:

The gain for the unmatched device in 50ohm system is shown as the trace in blue color. The impedance plots are shown from 0-5 GHz,

with markers placed at 0.05 and 5 GHz.

S-Parameter Data

VCC = +5 V, ICQ = 600 mA, T = 25 °C, unmatched 50 ohm system, calibrated to device leads

Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (angle) S22 (dB) S22 (ang)

3200 -7.15 -47.75 24.62 -121.57 -46.71 81.59 -4.82 65.17

3250 -8.30 -67.91 25.04 -142.33 -45.76 65.79 -4.33 64.24

3300 -9.03 -85.52 25.23 -161.71 -45.35 52.08 -4.13 63.23

3350 -10.02 -100.73 25.25 179.97 -45.27 38.15 -4.18 62.35

3400 -10.60 -114.25 25.16 163.19 -45.49 25.90 -4.38 62.37

3450 -11.13 -121.9 25.05 147.33 -45.94 14.60 -4.68 63.12

3500 -11.83 -128.99 24.95 132.15 -46.35 3.68 -5.00 64.61

3550 -12.06 -133.37 24.84 117.52 -46.84 -6.51 -5.32 66.87

3600 -12.42 -133.94 24.79 103.11 -47.68 -18.83 -5.62 69.29

3650 -12.56 -134.22 24.71 89.24 -48.26 -29.21 -5.84 72.04

3700 -12.37 -132.5 24.67 75.18 -49.27 -43.37 -6.05 74.47

3750 -11.85 -131.84 24.70 61.44 -50.2 -58.07 -6.24 76.46

3800 -10.99 -131.88 24.73 47.15 -51.31 -77.27 -6.49 77.95

3850 -10.10 -134.27 24.90 32.58 -51.77 -99.53 -6.82 78.63

3900 -9.19 -139.24 25.02 17.14 -52.57 -125.81

-7.38 79.17

3950 -8.41 -146.73 25.29 0.702 -51.90 -156.29 -8.19 80.03

4000 -7.90 -157.43 25.43 -17.44 -50.26 173.75 -9.28 83.45

Data Sheet: Rev A 09/02/10 - 3 of 9 - Disclaimer: Subject to change without notice

AH315

3.3 – 3.8 GHz WiMAX 2W Driver Amplifier

3.4 – 3.6 GHz Application Circuit (AH315-PCB)

Data Sheet: Rev A 09/02/10 - 4 of 9 - Disclaimer: Subject to change without notice

Notes:

1. C12 to be placed as close as possible to the device.

2. C11 = 47 pF is critical. Do Not Replace with other value.

3. Place C19 between marking 3 and 4.

4. See PC Board Layout on page 8 for more details.

Bill of Material

Ref Des Value Description Manufacturer Part Number

U1 WiMax 2W Driver Amplifier TriQuint AH315-G

C1, C2, C4, C11, C15,

C16, C17, C18 47 pF Cap, Chip, 0805, 2%, 50V various

C3 0.8 Pf Cap, Chip, 0603, ± 0.05 pF,50V, Accu-P AVX 06035J0R8ABTTR

C5, C6, C7 1000 pF Cap, Chip, 0603, 5%, 50V, NPO-COG various

C8 4.7 uF Cap, Chip, 6032, 20%, 35V, TANT various

C12 0.1 uF Cap, Chip, 0805, 5%, 25V, X7R various

L1 18 nH Ind, Chip, 0603, 5%, mulilayer TOKO LL1608-FSL18NJ

R1 68 Res, Chip, 0603, 5%, 1/16W various

R2 150 Res, Chip, 0603, 5%, 1/16W various

R3, R4, R5 0 Res, Chip, 0805, 1/10W various

R6 0 Res, Chip, 0603, 5%, 1/16W various

AH315

3.3 – 3.8 GHz WiMAX 2W Driver Amplifier

Typical Performance 3.4 – 3.6 GHz

Test conditions unless otherwise noted: Vpd, Vbias, Vcc = 5V, ICQ = 700 mA, +25 °C

Frequency MHz 3.4 3.5 3.6

Gain dB 25.4 25 25

Input Return Loss dB 14 15.2 15

Output Return Loss dB 10 11.3 10

Noise Figure dB 7.3

Output P1dB dBm +33

EVM @ 25 dBm Pout (1) % 2.3

Note: 1. Using an 802.16-2004 OFDMA, 64QAM-1/2, 1024-FFT, 20 symbols, 30 subchannels.

23

24

25

26

27

3.3 3.4 3.5 3.6 3.7 3.8

Gain (dB)

Frequency (GHz)

Gain vs. Frequency

-20

-15

-10

-5

0

3.3 3.4 3.5 3.6 3.7 3.8

S11, S22 (dB)

Frequency (GHz)

Return Loss vs. Frequency

0

1

2

3

4

5

14 16 18 20 22 24 26

EVM ( %)

Pout (dBm)

EVM vs . Pout vs . Tempe rat ure

Data Sheet: Rev A 09/02/10 - 5 of 9 - Disclaimer: Subject to change without notice

S11

S22

+85 C

+25 C

-40 C

OFDM, QAM- 64, 54 Mb/S

Freq = 3.5 GHz

0

1

2

3

4

5

14 16 18 20 22 24 26

EVM ( %)

Pout (dBm)

EVM vs. Pout vs. Frequency

OFDM, QAM-64, 54 Mb/S

22

23

24

25

26

27

28

22 24 26 28 30 32 34

Gain (dB )

Pout (dBm)

Gain vs. Pout vs. Temperature

OFDM, Q AM-64 , 54 Mb/S

Freq = 3.5 GHz

22

23

24

25

26

27

28

14 16 18 20 22 24 26

Gain (dB )

Pout (dBm)

Gain vs. Pout vs. Frequency

OFDM, QAM-64, 54 Mb/S

3.4 GHz

3.5 GHz

3.6 GHz

+85 C

+25 C

-40 C

3.4 GHz

3.5 GHz

3.6GHz

500

600

700

800

900

1000

20 22 24 26 28 30

Current (mA)

Pout (dBm)

Cur re n t vs. P o ut vs. Temper atur e

OFDM, QAM-6 4, 54 Mb/S

Freq = 3.5 GHz

500

600

700

800

900

1000

18 20 22 24 26 28

Current (mA)

Pout (dBm)

Cu rren t vs. P o u t vs. F req u en cy

OFDM, QAM-64, 54 Mb/S

3.4 GHz

+85 C 3.5 GHz

3.6 GHz

+25 C

-40 C

AH315

3.3 – 3.8 GHz WiMAX 2W Driver Amplifier

3.3 – 3.7 GHz Applications Note: Changing Icq Biasing Configurations at +5V

The AH315 can be configured to operate with lower bias current by varying the bias-adjust resistors R1 & R2. The

recommended circuit configurations shown previously in this datasheet have the device operating with a 600 mA as the

quiescent current (ICQ). This biasing level represents a tradeoff in terms of EVM and efficiency. Lowering ICQ will improve

upon the efficiency of the device, but degrade the EVM performance. Measured data shown in the plots below represents the

AH315 measured and configured for 3.5 GHz applications. It is expected that variation of the bias current for other frequency

applications will produce similar performance results.

R1

(ohms)

R2

(ohms)

Icq

(mA)

Vbias

(V)

68 150 600 +5

80 180 500 +5

101 300 400 +5

133 230 350 +5

167 230 300 +5

177 546 250 +5

0

1

2

3

4

5

6

20 21 22 23 24 25 26 27

EVM ( % )

Pout (dBm)

EVM vs. Pout vs. Icq

0

3

6

9

12

15

18

20 21 22 23 24 25 26 27

Efficiency (%)

Pout (dBm)

Efficiency vs. Pout vs. Icq

250 mA Icq

300 mA Icq

350 mA Icq

400 mA Icq

500 mA Icq

600 mA Icq

300 mA Icq

350 mA Icq

400 mA Icq

500 mA Icq

600 mA Icq

Data Sheet: Rev A 09/02/10 - 6 of 9 - Disclaimer: Subject to change without notice

3.3 – 3.7 GHz Applications Note: Changing Icq Biasing Configurations at +3.3V

0

3

6

9

12

15

18

20 21 22 23 24 25 26 27

EVM ( %)

Pout (dBm)

EVM vs. Pout vs. Icq

0

4

8

12

16

20

24

20 21 22 23 24 25 26 27

Efficiency (%)

Pout (dBm)

Efficiency vs. Pout vs. Icq

400 mA Icq

500 mA Icq

400 mA Icq

500 mA Icq

OFDM, QAM-64, 54 Mb/S

F = 3.5 GHz

OFDM, QAM-64, 54 Mb/S

F = 3.5 GHz

OFDM, QAM-64, 54 Mb/S

F = 3.5 GHz

OFDM, QAM-64, 54 Mb/S

F = 3.5 GHz

AH315

3.3 – 3.8 GHz WiMAX 2W Driver Amplifier

Pin Description

17

19

18

20

16

9

7

8

6

10

GND / NC

Vcc1

GND / NC

Vbias2

Iref2

Pin Symbol Description

1 Iref 1

Reference current into internal active bias current mirror. Current into Iref sets device

quiescent current. Also, can be used as on/off control. (for amp 1)

2 Vbias1 Voltage supply for active bias for amp 1. Connect to same supply voltage as Vcc1.

4, 5 RFin RF Input

3, 6, 7, 8, 9,

10, 14, 18, 20 GND/NC No internal connection. This pin can be grounded or N/C on PCB. Land pads should be

provided for PCB mounting integrity.

11, 12, 13 RFout RF Output

15 Vcc2 Supply Voltage for Amp2

16 Iref 2

Reference current into internal active bias current mirror. Current into Iref sets device

quiescent current. Also, can be used as on/off control. (for amp 2)

17 Vbias2 Voltage supply for active bias for amp 2. Connect to same supply voltage as Vcc2.

19 Vcc1 Supply Voltage for Amp1

Backside Paddle GND RF/DC Ground. Ensure good solder attach for best thermal and electrical performance.

Applications Information

PC Board Layout

PCB Material: 0.0147” Rogers Ultralam 2000, single layer,

1 oz Cu, εr = 2.45 Microstrip line details: width = .042”,

spacing = .050”.

The silkscreen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’,

etc. are used as place markers for critical tuning

components

The pad pattern shown has been developed and tested for

optimized assembly at TriQuint Semiconductor. The PCB

land pattern has been developed to accommodate lead and

package tolerances. Since surface mount processes vary

from company to company, careful process development is

recommended.

For further technical information, Refer to http://www.triquint.com/prodserv/more_info/default.aspx?prod_id=AH315

Data Sheet: Rev A 09/02/10 - 7 of 9 - Disclaimer: Subject to change without notice

AH315

3.3 – 3.8 GHz WiMAX 2W Driver Amplifier

Mechanical Information

Package Information and Dimensions

Mounting Configuration

N

otes:

1. All dimensions are in millimeters (inches). Angles

are in degrees

2. Ground/Thermal vias are critical for the proper

performance of this device. Vias should be .35mm

(#80/.135”) diameter drill and have a final plated

thru diameter of .25mm (.010”).

3. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

performance.

4. To ensure reliable operation, device ground paddle-

to-ground pad solder joint is critical

5. Add mounting screws near the part to fasten board to

a heat sink. Ensure that the ground/thermal via

region contacts the heat sink

6. Do not put solder mask on the backside of the PC

Board in the region where the board contacts the heat

sink.

7. RF trace width depends upon the PC board

construction and material

8. Use 1oz co

pp

er minimu

m



Lead-free/Green/RoHS-compliant.

Package pin plating - Annealed matte tin

over copper.

Compatible with lead-free (Tmax=260°C)

and lead (Tmax=245 °C) soldering processes.

The AH315-G will be marked with an

“AH315G” designator on the top surface of

the package. An alphanumeric lot code

(“XXXX”) is also marked below the part

designator.

Data Sheet: Rev A 09/02/10 - 8 of 9 - Disclaimer: Subject to change without notice

AH315

3.3 – 3.8 GHz WiMAX 2W Driver Amplifier

Product Compliance Information

ESD Information

ESD Rating: Class 1B

Value: Passes between 500 and 1000V

Test: Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value: Passes between 1000V and 2000V

Test: Charged Device Model (CDM)

Standard: JEDEC Standard JESD22-A114

MSL Rating

Level 2 at +260 °C convection reflow

JEDEC standard J-STD-020.

Solderability

Compatible with the latest version of J-STD-020, Lead

free solder, 260°

This part is compliant with EU 2002/95/EC RoHS

directive (Restrictions on the Use of Certain Hazardous

Substances in Electrical and Electronic Equipment).

This product also has the following attributes:

• Lead Free

• Halogen Free (Chlorine, Bromine)

• Antimony Free

• TBBP-A (C15H12Br402) Free

• PFOS Free

• SVHC Free

Contact Information

For the latest specifications, additional product information, worldwide sales and distribution locations, and information about

TriQuint:

Web: www.triquint.com Tel: +1.503.615.9000

Email: info-sales@tqs.com Fax: +1.503.615.8902

For technical questions and application information:

Email: sjcapplications.engineering@tqs.com

Important Notice

The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained

herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint

assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained

herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with

the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest

relevant information before placing orders for TriQuint products. The information contained herein or any use of such

information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property

rights, whether with regard to such information itself or anything described by such information.

TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining

applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.

Data Sheet: Rev A 09/02/10 - 9 of 9 - Disclaimer: Subject to change without notice