SCLS310D - JANUARY 1996 -REVISED OCTOBER 2003 D Wide Operating Voltage Range of 2 V to 6 V D High-Current 3-State Outputs Drive Bus D D D D D Lines, Buffer Memory Address Registers, or Drive Up To 15 LSTTL Loads Inverting Outputs Low Power Consumption, 80-A Max ICC Typical tpd = 10 ns 6-mA Output Drive at 5 V Low Input Current of 1 A Max SN54HC368 . . . J OR W PACKAGE SN74HC368 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 1OE 1A1 1Y1 1A2 1Y2 1A3 1Y3 GND description/ordering information These hex inverting buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The 'HC368 devices are organized as dual 4-line and 2-line buffers/drivers with active-low output-enable (1OE and 2OE) inputs. When OE is low, the device passes inverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC 2OE 2A2 2Y2 2A1 2Y1 1A4 1Y4 1A1 1OE NC VCC 2OE SN54HC368 . . . FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 2A2 2Y2 NC 2A1 2Y1 1Y3 GND NC 1Y4 1A4 1Y1 1A2 NC 1Y2 1A3 NC - No internal connection ORDERING INFORMATION PACKAGE TA PDIP - N SN74HC368N Tube of 40 SN74HC368D Reel of 2500 SN74HC368DR Reel of 250 SN74HC368DT SOP - NS Reel of 2000 SN74HC368NSR HC368 SSOP - DB Reel of 2000 SN74HC368DBR HC368 Tube of 90 SN74HC368PW Reel of 2000 SN74HC368PWR Reel of 250 SN74HC368PWT CDIP - J Tube of 25 SNJ54HC368J SNJ54HC368J CFP - W Tube of 150 SNJ54HC368W SNJ54HC368W LCCC - FK Tube of 55 SNJ54HC368FK TSSOP - PW -55C -55 C to 125 125C C TOP-SIDE MARKING Tube of 25 SOIC - D -40C 85C -40 C to 85 C ORDERABLE PART NUMBER SN74HC368N HC368 HC368 SNJ54HC368FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !"#$%! & '("")% $& ! *(+,'$%! -$%). "!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%& &%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&. *"!-('%& '!#*,$% %! 4 $,, *$"$#)%)"& $") %)&%)(,)&& !%/)"1&) !%)-. $,, !%/)" *"!-('%& *"!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCLS310D - JANUARY 1996 -REVISED OCTOBER 2003 FUNCTION TABLE (each buffer/driver) INPUTS OE A OUTPUT Y H X Z L H L L L H logic diagram (positive logic) 1OE 1A1 1 2 2OE 3 1Y1 2A1 15 12 To Three Other Channels 11 2Y1 To One Other Channel Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCLS310D - JANUARY 1996 -REVISED OCTOBER 2003 recommended operating conditions (see Note 3) SN54HC368 VCC VIH Supply voltage VCC = 2 V VCC = 4.5 V High-level input voltage VCC = 6 V VCC = 2 V VIL VI VO t/v MIN NOM MAX 2 5 6 Input voltage MAX 2 5 6 3.15 3.15 4.2 4.2 0 VCC = 6 V UNIT V V 0.5 0.5 1.35 1.35 1.8 1.8 VCC VCC VCC = 2 V VCC = 4.5 V Input transition rise/fall time NOM 1.5 0 Output voltage MIN 1.5 VCC = 4.5 V VCC = 6 V Low-level input voltage SN74HC368 0 VCC VCC 0 1000 1000 500 500 400 400 V V V ns TA Operating free-air temperature -55 125 -40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL TEST CONDITIONS VI = VCC or 0, MIN MAX SN74HC368 MIN MAX UNIT 1.9 1.998 1.9 1.9 IOH = -20 A 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = -6 mA IOH = -7.8 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 2V 0.002 0.1 0.1 0.1 IOL = 20 A 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V 0.1 100 1000 1000 nA 6V 0.01 0.5 10 5 A 8 160 80 A 10 10 10 pF IOL = 6 mA IOL = 7.8 mA ICC Ci SN54HC368 2V VI = VIH or VIL VI = VCC or 0 VO = VCC or 0 TA = 25C MIN TYP MAX 4.5 V VI = VIH or VIL II IOZ VCC IO = 0 6V 2 V to 6 V POST OFFICE BOX 655303 3 * DALLAS, TEXAS 75265 V V 3 SCLS310D - JANUARY 1996 -REVISED OCTOBER 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) TA = 25C TYP MAX SN54HC368 SN74HC368 PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V 50 95 145 120 tpd A Y 4.5 V 12 19 29 24 6V 10 16 25 20 ten OE tdis OE tt Y Y Any MIN MIN MAX MIN MAX 2V 100 190 285 238 4.5 V 26 38 57 48 6V 21 32 48 41 2V 50 175 265 240 4.5 V 21 35 53 48 6V 19 30 45 41 2V 28 60 90 75 4.5 V 8 12 18 15 6V 6 10 15 13 UNIT ns ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd ten tt FROM (INPUT) A OE TA = 25C MIN TYP MAX SN54HC368 SN74HC368 TO (OUTPUT) VCC 2V 70 120 180 150 Y 4.5 V 17 24 36 30 6V 14 20 31 25 2V 140 230 345 285 4.5 V 30 46 69 57 6V 28 39 59 48 2V 45 210 315 265 4.5 V 17 42 63 53 6V 13 36 53 45 Y Any MIN MAX MIN MAX UNIT ns ns ns operating characteristics, TA = 25C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance per buffer/driver POST OFFICE BOX 655303 No load * DALLAS, TEXAS 75265 TYP 35 UNIT pF SCLS310D - JANUARY 1996 -REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION VCC PARAMETER Test Point From Output Under Test S1 ten RL CL (see Note A) tdis S2 tPZH RL 1 k tPZL tPHZ tPLZ tpd or tt 1 k -- LOAD CIRCUIT CL S1 S2 50 pF or 150 pF Open Closed Closed Open Open Closed Closed Open Open Open 50 pF 50 pF or 150 pF VCC Input 50% 50% 0V tPLH In-Phase Output 50% 10% tPHL 90% VOH 50% 10% V OL tf 90% tr tPHL Out-of-Phase Output 90% tPLH 50% 10% 50% 10% 90% VOH VOL tf tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES Output Control (Low-Level Enabling) VCC 50% 50% 0V tPZL Output Waveform 1 (See Note B) tPLZ 10% tPZH Input 50% 10% 90% VCC 90% 50% 10% 0 V tr Output Waveform 2 (See Note B) VCC VCC 50% VOL tPHZ 50% 90% VOH 0 V tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 5962-86812012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-8681201EA ACTIVE CDIP J 16 1 TBD Call TI Call TI JM38510/65709BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type M38510/65709BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54HC368J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN74HC368D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368DT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368DTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368DTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC368NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC368NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Jan-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) SN74HC368PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC368PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC368FK ACTIVE LCCC FK 20 1 TBD SNJ54HC368J ACTIVE CDIP J 16 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2012 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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OTHER QUALIFIED VERSIONS OF SN54HC368, SN74HC368 : * Catalog: SN74HC368 * Military: SN54HC368 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74HC368DR Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74HC368NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74HC368PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC368PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC368DR SOIC D 16 2500 333.2 345.9 28.6 SN74HC368NSR SO NS 16 2000 367.0 367.0 38.0 SN74HC368PWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74HC368PWT TSSOP PW 16 250 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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