MURS320T3G, SURS8320T3G, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G Surface Mount Ultrafast Power Rectifiers http://onsemi.com This series employs the state-of-the-art epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes, in surface mount applications where compact size and weight are critical to the system. ULTRAFAST RECTIFIERS 3.0 AMPERES 200-600 VOLTS Features * * * * * * Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 3.0 A, TJ = 150C) SURS8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable Pb-Free Packages* SMC CASE 403 PLASTIC MARKING DIAGRAM AYWW U3x Mechanical Characteristics * * * * * * * * * Case: Epoxy, Molded Epoxy Meets UL 94 V-0 @ 0.125 in Weight: 217 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Shipped in 16 mm Tape and Reel, 2500 units per reel Polarity: Notch in Plastic Body Indicates Cathode Lead Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (> 400 V) Human Body Model, 3B (> 8 kV) *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2012 July, 2012 - Rev. 11 1 U3 = Specific Device Code x = D (320T3) = G (340T3) = J (360T3) A = Assembly Location Y = Year WW= Work Week ORDERING INFORMATION Package Shipping MURS320T3G SMC (Pb-Free) 2,500 / Tape & Reel SURS8320T3G SMC (Pb-Free) 2,500 / Tape & Reel MURS340T3G SMC (Pb-Free) 2,500 / Tape & Reel SURS8340T3G SMC (Pb-Free) 2,500 / Tape & Reel MURS360T3G SMC (Pb-Free) 2,500 / Tape & Reel SURS8360T3G SMC (Pb-Free) 2,500 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MURS320T3/D MURS320T3G, SURS8320T3G, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G MAXIMUM RATINGS Rating Symbol MURS320T3G/ SURS8320T3G MURS340T3G/ SURS8340T3G MURS360T3G/ SURS8360T3G Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 400 600 V Average Rectified Forward Current IF(AV) 3.0 @ TL = 140C 4.0 @ TL = 130C 3.0 @ TL = 130C 4.0 @ TL = 115C 3.0 @ TL = 130C 4.0 @ TL = 115C A Non-Repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM Operating Junction Temperature A 100 TJ *65 to +175 C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Thermal Resistance, Junction-to-Lead 11 RqJL C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 1) (iF = 3.0 A, TJ = 25C) (iF = 4.0 A, TJ = 25C) (iF = 3.0 A, TJ = 150C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 150C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) (iF = 0.5 A, iR = 1.0 A, IREC to 0.25 A) trr Maximum Forward Recovery Time (iF = 1.0 A, di/dt = 100 A/ms, Recovery to 1.0 V) tfr V 0.875 0.89 0.71 1.25 1.28 1.05 1.25 1.28 1.05 5.0 150 10 250 10 250 35 25 75 50 75 50 25 50 50 mA ns ns 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. http://onsemi.com 2 MURS320T3G, SURS8320T3G, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G MURS320T3G/SURS8320T3G IR, REVERSE CURRENT ( mA) 5.0 3.0 100C 2.0 25C TJ = 175C TJ = 100C 0.08 0.04 0.02 0.008 0.004 0.002 TJ = 25C 0 20 40 1.0 60 80 100 120 160 140 180 200 VR, REVERSE VOLTAGE (VOLTS) Figure 2. Typical Reverse Current* 0.7 * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. 0.5 PF(AV) , AVERAGE POWER DISSIPATION (WATTS) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) TJ = 175C 80 40 20 8.0 4.0 2.0 0.8 0.4 0.2 0.3 0.2 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 10 9.0 8.0 I (CAPACITIVELOAD) PK + 20 I 7.0 5.0 AV 10 6.0 5.0 4.0 dc 3.0 SQUARE WAVE 2.0 1.0 0 0 vF, INSTANTANEOUS VOLTAGE (VOLTS) 0.5 Figure 1. Typical Forward Voltage 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 90 100 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 200 10 RATED VOLTAGE APPLIED RqJL = 11C/W TJ = 175C 9.0 8.0 TYPICAL CAPACITANCE AT 0 V = 135 pF 7.0 C, CAPACITANCE (pF) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) Figure 3. Power Dissipation 6.0 5.0 4.0 3.0 dc 2.0 100 80 60 40 30 20 SQUARE WAVE 1.0 10 0 90 100 110 120 130 140 150 160 170 180 190 0 10 20 30 40 50 60 70 80 TC, CASE TEMPERATURE (C) VR, REVERSE VOLTAGE (VOLTS) Figure 4. Current Derating, Case Figure 5. Typical Capacitance http://onsemi.com 3 MURS320T3G, SURS8320T3G, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G 400 200 5.0 IR, REVERSE CURRENT ( mA) 3.0 100C TJ = 175C 25C 1.0 TJ = 100C 0.08 0.04 0.02 TJ = 25C 0.008 0.004 0.7 0 100 200 0.5 300 400 500 600 700 VR, REVERSE VOLTAGE (VOLTS) Figure 7. Typical Reverse Current* * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. 0.3 0.2 PF(AV) , AVERAGE POWER DISSIPATION (WATTS) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 2.0 TJ = 175C 80 40 20 8.0 4.0 2.0 0.8 0.4 0.2 0.1 0.07 0.05 0.03 0.02 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 10 9.0 8.0 7.0 SQUARE WAVE 6.0 dc (CAPACITIVE LOADS) 5.0 I 4.0 I 3.0 PK + 20 AV 10 5.0 2.0 1.0 0 0 vF, INSTANTANEOUS VOLTAGE (VOLTS) 0.5 Figure 6. Typical Forward Voltage 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 90 100 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 10 100 9.0 90 8.0 80 C, CAPACITANCE (pF) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) Figure 8. Power Dissipation 7.0 6.0 5.0 4.0 dc 3.0 SQUARE WAVE 2.0 TYPICAL CAPACITANCE AT 0 V = 75 pF 70 60 50 40 30 20 1.0 10 0 0 70 80 90 100 110 120 130 140 150 160 170 0 10 20 30 40 50 60 70 80 TC, CASE TEMPERATURE (C) VR, REVERSE VOLTAGE (VOLTS) Figure 9. Current Derating, Case Figure 10. Typical Capacitance http://onsemi.com 4 MURS320T3G, SURS8320T3G, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G PACKAGE DIMENSIONS SMC PLASTIC PACKAGE CASE 403-03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03. HE E b DIM A A1 b c D E HE L L1 D MIN 1.90 0.05 2.92 0.15 5.59 6.60 7.75 0.76 MILLIMETERS NOM MAX 2.13 2.41 0.10 0.15 3.00 3.07 0.23 0.30 5.84 6.10 6.86 7.11 7.94 8.13 1.02 1.27 0.51 REF MIN 0.075 0.002 0.115 0.006 0.220 0.260 0.305 0.030 INCHES NOM 0.084 0.004 0.118 0.009 0.230 0.270 0.313 0.040 0.020 REF MAX 0.095 0.006 0.121 0.012 0.240 0.280 0.320 0.050 A L L1 c A1 SOLDERING FOOTPRINT* 4.343 0.171 3.810 0.150 2.794 0.110 SCALE 4:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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