D36
BPrecautions for use
Procedures for Board Extraction
e
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Procedures for Board Insertion
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Procedures for Board Insertion
1. Adjust the socket polarizing key and the board key to the same direction.
2. Insert the board obliquely. Moreover, lay the board in parallel to the opening at
angle of 20° to 30° , and softly insert the board so as to hit the socket bottom.
Stopping insertion halfway will result in improper insertion.
3. Applying the board side notch in parallel to the socket bottom so that the board
position cannot be displaced, press the board side notch up, and fix it to the latch
portion at both socket edges. Press the board side notch, and release the notch
with a snap "click" tone, if the printed board exceeds the latch claw head.
3. With this action, the board has been completely installed in the socket. At this
time, pressing force is equivalent to the extent to turn on the electric product
switch. If the stronger pressing force is needed, check whether the direction and
depth to insert the board is adequate or not, and then re-push the board.
Procedures for Board Extraction
Standard type and high profile type
Apply the thumb nail to the latch knob at both socket edges. Forcibly widen
the latch knobs to right and left ways, and release the latch. Then, draw
the board out along an angle where the board is raised.
Low profile type
Press the top of the latch unit down with fingers to release the latch, and
directly draw the board out.
Cautions
1. The latch has strength enough to endure. However, if force is applied according
to other operation methods instead of the Procedures for Handling Sockets, or if
further force is given in the state where the module board is raised, products
could be damaged. Be sure to observe the Procedures for Handling Sockets.
2. The board is designed in compliance with JEDEC "Small Outline DIMM (Dual
Inline Memory Module". However, if the board is used instead of the
recommended module board, or if the mounting product is used for other devices
than DRAM memory IC, troubles due to vibration or other failures could occur. If
needed, consult the HRS company.
3. The above illustration shows SX1B.
4. The recommended module board pad or sharp angle edges could cause failure
in contacts. Therefore, it is recommended to offset the tie-bar from the center
line, set the internal pad (0.1mm), or remove sharp corners or burrs according to
the recommended sizes.
5. Don't provide the external contact surface of the module board with the
convex/concave and chamfer areas at both edges. Comply with the
recommended sizes.
6. When the board is mounted or housing is installed, if warpage or flexure has
occurred, an excessive load could cause changes in the solder bonding area
and the strength. Check individual conditions.