ATWILC1000B-MUT IEEE 802.11 b/g/n Link Controller SoC DATASHEET Description Atmel(R) ATWILC1000B is a single chip IEEE(R) 802.11b/g/n Radio/Baseband/MAC link controller optimized for low-power mobile applications. ATWILC1000B supports single stream 1x1 802.11n mode providing up to 72Mbps PHY rate. The ATWILC1000B features fully integrated Power Amplifier, LNA, Switch, and Power Management. Implemented in 65nm CMOS technology, the ATWILC1000B offers very low power consumption while simultaneously providing high performance and minimal bill of materials. The ATWILC1000B supports 2- and 3-wire Bluetooth(R) coexistence protocols. The ATWILC1000B provides multiple peripheral interfaces including UART, SPI, I2C, and SDIO. The only external clock source needed for the ATWILC1000B is a high-speed crystal or oscillator with a wide range of reference clock frequencies supported (12-40MHz). The ATWILC1000B is available in both QFN and Wafer Level Chip Scale Package (WLCSP) packaging. Features IEEE 802.1 b/g/n 20MHz (1x1) solution Single spatial stream in 2.4GHz ISM band Integrated PA and T/R Switch Superior Sensitivity and Range via advanced PHY signal processing Advanced Equalization and Channel Estimation Advanced Carrier and Timing Synchronization Wi-Fi Direct and Soft-AP support Supports IEEE 802.11 WEP, WPA, and WPA2 Security Supports China WAPI security Superior MAC throughput via hardware accelerated two-level A-MSDU/AMPDU frame aggregation and block acknowledgement On-chip memory management engine to reduce host load SPI, SDIO, UART, and I2C host interfaces 2- or 3-wire Bluetooth coexistence interface Operating temperature range of -40C to +85C Power save modes: - <1A Power Down mode typical @3.3V I/O - 380A Doze mode with chip settings preserved (used for beacon monitoring) - On-chip low power sleep oscillator - Fast host wake-up from Doze mode by a pin or host I/O transaction Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 Ta bl e of Conte nts 1 Ordering Information and IC Marking ........................................................................ 4 2 Block Diagram ............................................................................................................. 4 3 Pinout and Package Information ................................................................................ 4 3.1 3.2 4 Electrical Specifications ........................................................................................... 11 4.1 4.2 4.3 5 7.3 Features ................................................................................................................................. 16 Description.............................................................................................................................. 16 .............................................................................................................................................. 17 Features ................................................................................................................................. 17 Description.............................................................................................................................. 17 .............................................................................................................................................. 17 Receiver Performance ............................................................................................................ 17 Transmitter Performance ........................................................................................................ 19 I2C Slave Interface .............................................................................................................................. 20 I2C Master Interface ............................................................................................................................ 21 SPI Slave Interface.............................................................................................................................. 22 SPI Master Interface............................................................................................................................ 24 SDIO Slave Interface........................................................................................................................... 25 UART .............................................................................................................................................. 27 Wi-Fi/Bluetooth Coexistence ............................................................................................................... 28 GPIOs .............................................................................................................................................. 28 Power Management ................................................................................................... 29 9.1 9.2 9.3 9.4 2 7.1.1 7.1.2 PHY 7.2.1 7.2.2 Radio 7.3.1 7.3.2 External Interfaces .................................................................................................... 20 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 9 Processor ............................................................................................................................................ 15 Memory Subsystem............................................................................................................................. 15 Non-volatile Memory (eFuse) .............................................................................................................. 15 WLAN Subsystem ...................................................................................................... 16 7.2 8 Crystal Oscillator ................................................................................................................................. 13 Low-Power Oscillator .......................................................................................................................... 14 CPU and Memory Subsystems ................................................................................. 15 6.1 6.2 6.3 7 Absolute Ratings ................................................................................................................................. 11 Recommended Operating Conditions ................................................................................................. 11 DC Electrical Characteristics ............................................................................................................... 12 Clocking ................................................................................................................... 13 5.1 5.2 6 Pin Description ...................................................................................................................................... 4 Package Description ............................................................................................................................. 7 Power Architecture .............................................................................................................................. 29 Power Consumption ............................................................................................................................ 30 9.2.1 Description of Device States................................................................................................... 30 9.2.2 Current Consumption in Various Device States...................................................................... 30 9.2.3 Restrictions for Power States ................................................................................................. 31 Power-Up/Down Sequence ................................................................................................................. 31 Digital I/O Pin Behavior during Power-Up Sequences......................................................................... 32 ATWILC1000B-MUT [DATASHEET] 2 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 10 Reference Design ...................................................................................................... 33 11 Reflow Profile Information ........................................................................................ 34 11.1 Storage Condition................................................................................................................................ 34 11.1.1 Moisture Barrier Bag Before Opened ..................................................................................... 34 11.1.2 Moisture Barrier Bag Open ..................................................................................................... 34 11.2 Stencil Design ..................................................................................................................................... 34 11.3 Baking Conditions ............................................................................................................................... 34 11.4 Soldering and Reflow Condition .......................................................................................................... 34 11.4.1 Reflow Oven ........................................................................................................................... 34 12 Reference Documentation and Support................................................................... 36 12.1 Reference Documents......................................................................................................................... 36 13 Revision History ........................................................................................................ 37 ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 3 3 1 Ordering Information and IC Marking Table 1-1. Ordering Details Atmel official part number (for ordering) 2 Package type IC marking ATWILC1000B-MU-T 5x5 QFN in Tape and Reel ATWILC1000B ATWILC1000B-UU-T 3.25x3.25 WLCSP in Tape and Reel ATWILC1000B Block Diagram Figure 2-1. ATWILC1000B Block Diagram Vbatt SDIO SPI UART x2 2 IC Bluetooth Coexistance RTC Clock PMU XO GPIO WILC1000B Host Interface 802.11bgn Forward Error Correction Microcontroller 802.11bgn OFDM Channel Estimation / Equalization Rx Digital Core 802.11bgn MAC PLL RAM 802.11bgn Coding 802.11bgn iFFT Pinout and Package Information 3.1 Pin Description ~ Tx Digital Core DPD 3 X ADC DAC X ATWILC1000B is offered in an exposed pad 40-pin QFN package. This package has an exposed paddle that must be connected to the system board ground. The QFN package pin assignment is shown in Figure 3-1. The color shading is used to indicate the pin type as follows: Green - power Red - analog Blue - digital I/O Yellow - digital input Grey - unconnected or reserved The ATWILC1000B pins are described in Table 3-1. 4 ATWILC1000B-MUT [DATASHEET] 4 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 Figure 3-1. Pin Assignment Table 3-1. Pin Description Pin # Pin Name Pin Type Description 1 TP_P Analog Test Pin/Customer No Connect 2 VDD_RF_RX Power Tuner RF Supply (see Section 9.1) 3 VDD_AMS Power Tuner BB Supply (see Section 9.1) 4 VDD_RF_TX Power Tuner RF Supply (see Section 9.1) 5 VDD_BATT_PPA Power PA 1st Stage Supply (see Section 9.1) 6 VDD_BATT_PA Power PA 2nd Stage Supply (see Section 9.1) 7 RFIOP Analog Pos. RF Differential I/O (see Table 9-3) 8 RFION Analog Neg. RF Differential I/O (see Table 9-3) 9 SDIO_SPI_CFG Digital Input Tie to 1 for SPI, 0 for SDIO 10 GPIO0/HOST_WAKE Digital I/O, Programmable Pull-Up GPIO0/SLEEP Mode Control 11 GPIO2/IRQN Digital I/O, Programmable Pull-Up GPIO2/Device Interrupt 12 SD_DAT3 Digital I/O, Programmable Pull-Up SDIO Data3 ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 5 5 Pin # Pin Name Pin Type 13 SD_DAT2/SPI_RXD Digital I/O, Programmable Pull-Up SDIO Data2/SPI Data RX 14 VDDC Power Digital Core Power Supply (see Section 9.1) 15 VDDIO Power Digital I/O Power Supply (see Section 9.1) 16 SD_DAT1/SPI_SSN Digital I/O, Programmable Pull-Up SDIO Data1/SPI Slave Select 17 SD_DAT0/SPI_TXD Digital I/O, Programmable Pull-Up SDIO Data0/SPI Data TX 18 SD_CMD/SPI_SCK Digital I/O, Programmable Pull-Up SDIO Command/SPI Clock 19 SD_CLK Digital I/O, Programmable Pull-Up SDIO Clock 20 VBATT_BUCK Power Battery Supply for DC/DC Converter (see Section 9.1) 21 VSW Power Switching output of DC/DC Converter (see Section 9.1) 22 VREG_BUCK Power Core Power from DC/DC Converter (see Section 9.1) 23 CHIP_EN Analog PMU Enable 24 GPIO1/RTC_CLK Digital I/O, Programmable Pull-Up GPIO1/32kHz Clock Input 25 TEST_MODE Digital Input Test Mode - Customer Tie to GND 26 VDDIO Power Digital I/O Power Supply (see Section 9.1) 27 VDDC Power Digital Core Power Supply (see Section 9.1) 28 GPIO3 Digital I/O, Programmable Pull-Up GPIO3/SPI_SCK_Flash 29 GPIO4 Digital I/O, Programmable Pull-Up GPIO4/SPI_SSN_Flash 30 GPIO5 Digital I/O, Programmable Pull-Up GPIO5/SPI_TXD_Flash 31 GPIO6 Digital I/O, Programmable Pull-Up GPIO6/SPI_RXD_Flash 32 I2C_SCL Digital I/O, Programmable Pull-Up I2C Slave Clock (high-drive pad, see Table 43) 33 I2C_SDA Digital I/O, Programmable Pull-Up I2C Slave Data (high-drive pad, see Table 4-3) 34 RESETN Digital Input Active-Low Hard Reset 35 XO_N Analog Crystal Oscillator N 36 XO_P Analog Crystal Oscillator P 37 VDD_SXDIG Power SX Power Supply (see Section 9.1) 38 VDD_VCO Power VCO Power Supply (see Section 9.1) 39 VDDIO_A Power Tuner VDDIO Power Supply (see Section 9.1) 40 TPN Analog Test Pin/Customer No Connect 41(1) PADDLE VSS Power Connect to System Board Ground Notes: 1. 6 Applies to QFN package only. ATWILC1000B-MUT [DATASHEET] 6 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 Description 3.2 Package Description The ATWILC1000B QFN package information is provided in Table 3-2. Table 3-2. QFN Package Information Parameter Value Units Tolerance Package Size 5x5 mm 0.1mm QFN Pad Count 40 Total Thickness 0.85 QFN Pad Pitch 0.40 Pad Width 0.20 0.05mm mm Exposed Pad size 3.7x3.7 The ATWILC1000B 40L QFN package view is shown in Figure 3-2. ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 7 7 Figure 3-2. QFN Package The QFN package is a qualified Green Package. 8 ATWILC1000B-MUT [DATASHEET] 8 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 Figure 3-3. WLCSP Package ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 9 9 Figure 3-4. 10 WLCSP WILC1000B UU ATWILC1000B-MUT [DATASHEET] 1 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 0 4 Electrical Specifications 4.1 Absolute Ratings Table 4-1. Absolute Maximum Ratings Characteristic Symbol Min. Max. Unit Core Supply Voltage VDDC -0.3 1.5 I/O Supply Voltage VDDIO -0.3 5.0 Battery Supply Voltage VBATT -0.3 5.0 Digital Input Voltage VIN -0.3 VDDIO Analog Input Voltage VAIN -0.3 1.5 ESD Human Body Model VESDHBM -1000, -2000 (see notes below) +1000, +2000 (see notes below) Storage Temperature TA -65 150 V C Junction Temperature 125 RF input power max 23 Notes: 1. 2. 3. 4.2 dBm VIN corresponds to all the digital pins. VAIN corresponds to the following analog pins: VDD_RF_RX, VDD_RF_TX, VDD_AMS, RFIOP, RFION, XO_N, XO_P, VDD_SXDIG, VDD_VCO. For VESDHBM, each pin is classified as Class 1, or Class 2, or both: The Class 1 pins include all the pins (both analog and digital) The Class 2 pins are all digital pins only VESDHBM is 1kV for Class1 pins. VESDHBM is 2kV for Class2 pins Recommended Operating Conditions Table 4-2. Recommended Operating Conditions Characteristic Symbol Min. Typ. Max. I/O Supply Voltage Low Range VDDIOL 1.62 1.80 2.00 I/O Supply Voltage Mid-Range VDDIOM 2.00 2.50 3.00 I/O Supply Voltage High Range VDDIOH 3.00 3.30 3.60 Battery Supply Voltage VBATT 2.5A 3.60 4.20 Unit V Operating Temperature Notes: 1. 2. 3. 4. -40 85 C ATWILC1000B is functional across this range of voltages; however, optimal RF performance is guaranteed for VBATT in the range 3.0V < VBATT < 4.2V. I/O supply voltage is applied to the following pins: VDDIO_A, VDDIO. Battery supply voltage is applied to following pins: VDD_BATT_PPA, VDD_BATT_PA, VBATT_BUCK. Refer to Section 9.1 and Table 9-3 for the details of power connections. ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 11 1 1 4.3 DC Electrical Characteristics Table 4-3 provides the DC characteristics for the ATWILC1000B digital pads. Table 4-3. DC Electrical Characteristics VDDIO condition Characteristic Min. Typ. Max. Input Low Voltage VIL -0.30 0.60 Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 Unit VDDIOL Output Low Voltage VOL Output High Voltage VOH 0.45 VDDIO-0.50 Input Low Voltage VIL -0.30 0.63 Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 VDDIOM Output Low Voltage VOL Output High Voltage VOH 0.45 VDDIO-0.50 Input Low Voltage VIL -0.30 0.65 Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 (up to 3.60) VDDIOH Output Low Voltage VOL Output High Voltage VOH V 0.45 VDDIO-0.50 All Output Loading 20 All Digital Input Load 6 VDDIOL Pad Drive Strength (regular pads (1)) 1.7 2.4 VDDIOM Pad Drive Strength (regular pads (1)) 3.4 6.5 VDDIOH Pad Drive Strength (regular pads (1)) 10.6 13.5 VDDIOL Pad Drive Strength (high-drive pads (1)) 3.4 4.8 VDDIOM Pad Drive Strength (high-drive pads (1)) 6.8 13 VDDIOH Pad Drive Strength (high-drive pads (1)) 21.2 27 pF Note: 12 1. mA The following are high-drive pads: I2C_SCL, I2C_SDA; all other pads are regular. ATWILC1000B-MUT [DATASHEET] 1 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 2 5 Clocking 5.1 Crystal Oscillator Table 5-1. Crystal Oscillator Parameters Parameter Crystal Resonant Frequency Min. Typ. Max. Unit 12 26 40 MHz 50 150 Crystal Equivalent Series Resistance Stability - Initial Offset (1) -100 100 Stability - Temperature and Aging -25 25 ppm Note: 1. Initial offset must be calibrated to maintain 25ppm in all operating conditions. This calibration is performed during final production testing. The block diagram in Figure 5-1(a) shows how the internal Crystal Oscillator (XO) is connected to the external crystal. The XO has 5pF internal capacitance on each terminal XO_P and XO_N. To bypass the crystal oscillator with an external reference, an external signal capable of driving 5pF can be applied to the XO_N terminal as shown Figure 5-1(b). Figure 5-1. XO Connections External Clock XO_N XO_P XO_N XO_P ATWILC1000B ATWILC1000B (a) (b) (a) Crystal Oscillator is Used b) Crystal Oscillator is Bypassed Table 5-2 specifies the electrical and performance requirements for the external clock. Table 5-2. Bypass Clock Specification Parameter Min. Max. Unit Comments Oscillation frequency 12 32 MHz Must be able to drive 5pF load @ desired frequency Voltage swing 0.5 1.2 Vpp Must be AC coupled Stability - Temperature and Aging -25 +25 ppm Phase Noise -130 dBc/Hz Jitter (RMS) <1psec At 10kHz offset Based on integrated phase noise spectrum from 1kHz to 1MHz ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 13 1 3 5.2 Low-Power Oscillator ATWILC1000B has an internally-generated 32kHz clock to provide timing information for various sleep functions. Alternatively, ATWILC1000B allows for an external 32kHz clock to be used for this purpose, which is provided through Pin 24 (RTC_CLK). Software selects whether the internal clock or external clock is used. The internal low-power clock is ring-oscillator based and has accuracy within 10,000ppm. When using the internal low-power clock, the advance wakeup time in beacon monitoring mode has to be increased by about 1% of the sleep time to compensate for the oscillator inaccuracy. For example, for the DTIM interval value of 1, wakeup time has to be increased by 1ms. For any application targeting very low power consumption, an external 32kHz RTC clock should be used. 14 ATWILC1000B-MUT [DATASHEET] 1 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 4 6 CPU and Memory Subsystems 6.1 Processor ATWILC1000B has a Cortus APS3 32-bit processor. This processor performs many of the MAC functions, including but not limited to association, authentication, power management, security key management, and MSDU aggregation/de-aggregation. In addition, the processor provides flexibility for various modes of operation, such as STA and AP modes. 6.2 Memory Subsystem The APS3 core uses a 128KB instruction/boot ROM along with a 160KB instruction RAM and a 64KB data RAM. In addition, the device uses a 128KB shared RAM, accessible by the processor and MAC, which allows the APS3 core to perform various data management tasks on the TX and RX data packets. Non-volatile Memory (eFuse) ATWILC1000B has 768 bits of non-volatile eFuse memory that can be read by the CPU after device reset. This non-volatile one-time-programmable (OTP) memory can be used to store customer-specific parameters, such as MAC address; various calibration information, such as TX power, crystal frequency offset, etc.; and other software-specific configuration parameters. The eFuse is partitioned into six 128-bit banks. Each bank has the same bit map, which is shown in Figure 6-1. The purpose of the first 80 bits in each bank is fixed, and the remaining 48 bits are general-purpose software dependent bits, or reserved for future use. Since each bank can be programmed independently, this allows for several updates of the device parameters following the initial programming e.g., updating MAC address. Refer to ATWILC1000B Programming Guide for the eFuse programming instructions. Flags 8 Bank 0 F 48 MAC ADDR 7 8 G 15 Used 1 Freq. Offset 1 TX Gain Correc tion 1 Used 4 MAC ADDR Used 3 Reserved 1 Invalid 1 eFuse Bit Map Version Figure 6-1. Used 6.3 16 FO Bank 1 Bank 2 Bank 3 Bank 4 Bank 5 128 Bits ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 15 1 5 7 WLAN Subsystem The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY). The following two subsections describe the MAC and PHY in detail. 7.1.1 Features The ATWILC1000B IEEE802.11 MAC supports the following functions: IEEE 802.11b/g/n IEEE 802.11e WMM QoS EDCA/PCF multiple access categories traffic scheduling Advanced IEEE 802.11n features: 7.1.2 - Transmission and reception of aggregated MPDUs (A-MPDU) - Transmission and reception of aggregated MSDUs (A-MSDU) - Immediate Block Acknowledgement - Reduced Interframe Spacing (RIFS) Support for IEEE 802.11i and WFA security with key management - WEP 64/128 - WPA-TKIP - 128-bit WPA2 CCMP (AES) Support for WAPI security Advanced power management - Standard 802.11 Power Save Mode - Wi-Fi Alliance WMM-PS (U-APSD) RTS-CTS and CTS-self support Supports either STA or AP mode in the infrastructure basic service set mode Supports independent basic service set (IBSS) Description The ATWILC1000B MAC is designed to operate at low power while providing high data throughput. The IEEE 802.11 MAC functions are implemented with a combination of dedicated datapath engines, hardwired control logic, and a low-power, high-efficiency microprocessor. The combination of dedicated logic with a programmable processor provides optimal power efficiency and real-time response while providing the flexibility to accommodate evolving standards and future feature enhancements. Dedicated datapath engines are used to implement data path functions with heavy computational requirements. For example, a FCS engine checks the CRC of the transmitting and receiving packets, and a cipher engine performs all the required encryption and decryption operations for the WEP, WPA-TKIP, WPA2 CCMP-AES, and WAPI security requirements. Control functions which have real-time requirements are implemented using hardwired control logic modules. These logic modules offer real-time response while maintaining configurability via the processor. Examples of hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX control, interframe spacing, etc.), protocol timer module (responsible for the Network Access Vector, back-off timing, timing synchronization function, and slot management), MPDU handling module, aggregation/deaggregation module, block ACK controller (implements the protocol requirements for burst block communication), and TX/RX control FSMs (coordinate data movement between PHY-MAC interface, cipher engine, and the DMA interface to the TX/RX FIFOs). 16 ATWILC1000B-MUT [DATASHEET] 1 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 6 The MAC functions implemented solely in software on the microprocessor have the following characteristics: Functions with high memory requirements or complex data structures. Examples are association table management and power save queuing. Functions with low computational load or without critical real-time requirements. Examples are authentication and association. Functions which need flexibility and upgradeability. Examples are beacon frame processing and QoS scheduling. 7.2 PHY 7.2.1 Features The ATWILC1000B IEEE802.11 PHY supports the following functions: 7.2.2 Single antenna 1x1 stream in 20MHz channels Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, 11Mbps Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, 54Mbps Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2, 13.0, 14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, 72.2Mbps IEEE 802.11n mixed mode operation Per packet TX power control Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery, and frame detection Description The ATWILC1000B WLAN PHY is designed to achieve reliable and power-efficient physical layer communication specified by IEEE 802.11b/g/n in single stream mode with 20MHz bandwidth. Advanced algorithms have been employed to achieve maximum throughput in a real world communication environment with impairments and interference. The PHY implements all the required functions such as FFT, filtering, FEC (Viterbi decoder), frequency and timing acquisition and tracking, channel estimation and equalization, carrier sensing and clear channel assessment, as well as the automatic gain control. 7.3 Radio 7.3.1 Receiver Performance Radio Performance under Typical Conditions: VBATT=3.6V; VDDIO=3.3V; temp.: 25C. Table 7-1. Receiver Performance Parameter Description Frequency Sensitivity 802.11b Sensitivity 802.11g Min. Typ. 2,412 1Mbps DSS -98 2Mbps DSS -94 5.5Mbps DSS -92 11Mbps DSS -88 6Mbps OFDM -90 9Mbps OFDM -89 Max. Unit 2,484 MHz dBm dBm ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 17 1 7 Parameter Sensitivity 802.11n (BW=20MHz) Maximum Receive Signal Level Adjacent Channel Rejection Cellular Blocker Immunity 18 Description Min. Typ. 12Mbps OFDM -88 18Mbps OFDM -85 24Mbps OFDM -83 36Mbps OFDM -80 48Mbps OFDM -76 54Mbps OFDM -74 MCS 0 -89 MCS 1 -87 MCS 2 -85 MCS 3 -82 MCS 4 -77 MCS 5 -74 MCS 6 -72 MCS 7 -70.5 Max. Unit dBm 1-11Mbps DSS -10 0 6-54Mbps OFDM -10 0 MCS 0 - 7 -10 0 1Mbps DSS (30MHz offset) 50 11Mbps DSS (25MHz offset) 43 6Mbps OFDM (25MHz offset) 40 54Mbps OFDM (25MHz offset) 25 MCS 0 - 20MHz BW (25MHz offset) 40 MCS 7 - 20MHz BW (25MHz offset) 20 776-794MHz CDMA -14 824-849MHz GSM -10 880-915MHz GSM -10 1710-1785MHz GSM -15 1850-1910MHz GSM -15 1850-1910MHz WCDMA -24 1920-1980MHz WCDMA -24 dBm dB ATWILC1000B-MUT [DATASHEET] 1 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 8 dBm 7.3.2 Transmitter Performance Radio Performance under Typical Conditions: VBATT=3.6V; VDDIO=3.3V; temp.: 25C. Table 7-2. Transmitter Performance Parameter Description Frequency Min. Typ. 2,412 Output Power (1), ON_Transmit 802.11b 1Mbps 19.5 802.11b 11Mbps 20.5 802.11g 6Mbps 19.5 802.11g 54Mbps 17.5 802.11n MCS 0 18.0 802.11n MCS 7 15.5 Max. Unit 2,484 MHz dBm TX Power Accuracy 1.5 (2) dB Carrier Suppression 30.0 dBc 2nd -33 3rd -38 Harmonic Output Power Notes: 1. 2. dBm/MHz Measured at 802.11 spec compliant EVM/Spectral Mask. Measured at RF Pin assuming 50 differential. ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 19 1 9 8 External Interfaces ATWILC1000B external interfaces include: I2C Slave for control SPI Slave and SDIO Slave for control and data transfer SPI Master for external Flash I2C Master for external EEPROM Two UARTs for debug, control, and data transfer General Purpose Input/Output (GPIO) pins Wi-Fi/Bluetooth coexistence interface With the exception of the SPI Slave and SDIO Slave host interfaces, which are selected using the dedicated SDIO_SPI_CFG pin, the other interfaces can be assigned to various pins by programming the corresponding pin MUXing control register for each pin to a specific value between 0 and 6.The default values of these registers are 0, which is GPIO mode. The summary of the available interfaces and their corresponding pin MUX settings is shown in Table 8-1. For specific programming instructions, refer to ATWILC1000B Programming Guide. Table 8-1. 8.1 Pin-MUX Matrix of External Interfaces I2C Slave Interface The I2C Slave interface, used primarily for control by the host processor, is a two-wire serial interface consisting of a serial data line (SDA, Pin 33) and a serial clock (SCL, Pin 32). It responds to the seven bit address value 0x60. The ATWILC1000B I2C supports I2C bus Version 2.1 - 2000 and can operate in standard mode (with data rates up to 100Kb/s) and fast mode (with data rates up to 400Kb/s). The I2C Slave is a synchronous serial interface. The SDA line is a bidirectional signal and changes only while the SCL line is low, except for STOP, START, and RESTART conditions. The output drivers are open-drain to perform wire-AND functions on the bus. The maximum number of devices on the bus is limited by only the maximum capacitance specification of 400pF. Data is transmitted in byte packages. For specific information, refer to the Philips Specification entitled "The I2C -Bus Specification, Version 2.1". The I2C Slave timing is provided in Figure 8-1 and Table 8-2. 20 ATWILC1000B-MUT [DATASHEET] 2 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 0 Figure 8-1. I2C Slave Timing Diagram tPR tSUDAT tHDDAT tBUF tSUSTO SDA tHL tLH tWL SCL tLH tHDSTA tHL tWH tPR tPR fSCL Table 8-2. tSUSTA I2C Slave Timing Parameters Parameter Symbol Min. Max. Units 400 kHz SCL Clock Frequency fSCL 0 SCL Low Pulse Width tWL 1.3 SCL High Pulse Width tWH 0.6 SCL, SDA Fall Time tHL 300 SCL, SDA Rise Time tLH 300 START Setup Time tSUSTA 0.6 START Hold Time tHDSTA 0.6 SDA Setup Time tSUDAT 100 Remarks s ns This is dictated by external components s ns 0 SDA Hold Time tHDDAT Master Programming Option 40 STOP Setup time tSUSTO 0.6 Bus Free Time Between STOP and START tBUF 1.3 Glitch Pulse Reject tPR 0 Slave and Master Default s 8.2 50 ns I2C Master Interface ATWILC1000B provides an I2C bus master, which is intended primarily for accessing an external EEPROM memory through a software-defined protocol. The I2C Master is a two-wire serial interface consisting of a serial data line (SDA) and a serial clock line (SCL). SDA can be configured on one of the following pins: SD_CLK (pin 19), GPIO1 (pin 24), GPIO6 (pin 31), or I2C_SDA (pin 33). SCL can be configured on one of the following pins: GPIO0 (pin 10), SD_DAT3 (pin 12), GPIO4 (pin 29), or I2C_SCL (pin 32). For more specific instructions refer to ATWILC1000B Programming Guide. The I2C Master interface supports three speeds: Standard mode (100kb/s) Fast mode (400kb/s) High-speed mode (3.4Mb/s) ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 21 2 1 The timing diagram of the I2C Master interface is the same as that of the I2C Slave interface (see Figure 8-1). The timing parameters of I2C Master are shown in Table 8-3. Table 8-3. I2C Master Timing Parameters Standard Mode Parameter Fast Mode High-Speed Mode Symbol Units Min. Max. 100 Min. 0 Max. 400 Min. 0 Max. SCL Clock Frequency fSCL 0 3400 SCL Low Pulse Width tWL 4.7 1.3 0.16 SCL High Pulse Width tWH 4 0.6 0.06 SCL Fall Time tHLSCL 300 300 10 40 SDA Fall Time tHLSDA 300 300 10 80 SCL Rise Time tLHSCL 1000 300 10 40 SDA Rise Time tLHSDA 1000 300 10 80 START Setup Time tSUSTA 4.7 0.6 0.16 START Hold Time tHDSTA 4 0.6 0.16 SDA Setup Time tSUDAT 250 100 10 SDA Hold Time tHDDAT 5 40 0 STOP Setup time tSUSTO 4 0.6 0.16 Bus Free Time Between STOP and START tBUF 4.7 1.3 Glitch Pulse Reject tPR kHz s ns ns s ns 8.3 0 70 s 50 SPI Slave Interface ATWILC1000B provides a Serial Peripheral Interface (SPI) that operates as a SPI slave. The SPI Slave interface can be used for control and for serial I/O of 802.11 data. The SPI Slave pins are mapped as shown in Table 8-4. The RXD pin is same as Master Output, Slave Input (MOSI), and the TXD pin is same as Master Input, Slave Output (MISO). The SPI Slave is a full-duplex slave-synchronous serial interface that is available immediately following reset when pin 9 (SDIO_SPI_CFG) is tied to VDDIO. Table 8-4. SPI Slave Interface Pin Mapping Pin # SPI Function 9 CFG: Must be tied to VDDIO 16 SSN: Active Low Slave Select 18 SCK: Serial Clock 13 RXD: Serial Data Receive (MOSI) 17 TXD: Serial Data Transmit (MISO) When the SPI is not selected, i.e., when SSN is high, the SPI interface will not interfere with data transfers between the serial-master and other serial-slave devices. When the serial slave is not selected, its transmitted data output is buffered, resulting in a high impedance drive onto the serial master receive line. 22 ATWILC1000B-MUT [DATASHEET] 2 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 2 The SPI Slave interface responds to a protocol that allows an external host to read or write any register in the chip as well as initiate DMA transfers. For the details of the SPI protocol and more specific instructions refer to ATWILC1000B Programming Guide. The SPI Slave interface supports four standard modes as determined by the Clock Polarity (CPOL) and Clock Phase (CPHA) settings. These modes are illustrated in Table 8-5 and Figure 8-2. The red lines in Figure 8-2 correspond to Clock Phase = 0 and the blue lines correspond to Clock Phase = 1. Table 8-5. SPI Slave Modes Mode CPOL CPHA 0 0 0 1 0 1 2 1 0 3 1 1 Figure 8-2. SPI Slave Clock Polarity and Clock Phase Timing CPOL = 0 SCK CPOL = 1 SSN CPHA = 0 RXD/TXD (MOSI/MISO) CPHA = 1 z 1 z 2 1 3 2 4 3 5 4 6 5 7 6 8 7 z 8 z The SPI Slave timing is provided in Figure 8-3 and Table 8-6. ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 23 2 3 Figure 8-3. SPI Slave Timing Diagram Table 8-6. SPI Slave Timing Parameters Parameter 8.4 Symbol Min. Max. Units 48 MHz Clock Input Frequency fSCK Clock Low Pulse Width tWL 5 Clock High Pulse Width tWH 5 Clock Rise Time tLH 5 Clock Fall Time tHL 5 Input Setup Time tISU 5 Input Hold Time tIHD 5 Output Delay tODLY 0 Slave Select Setup Time tSUSSN 5 Slave Select Hold Time tHDSSN 5 ns 20 SPI Master Interface ATWILC1000B provides a SPI Master interface for accessing external Flash memory. The SPI Master pins are mapped as shown in Table 8-7. The TXD pin is same as Master Output, Slave Input (MOSI), and the RXD pin is same as Master Input, Slave Output (MISO). The SPI Master interface supports all four standard modes of clock polarity and clock phase shown in Table 8-5. External SPI Flash memory is accessed by a processor programming commands to the SPI Master interface, which in turn initiates a SPI master access to the Flash. For more specific instructions refer to ATWILC1000B Programming Guide. 24 ATWILC1000B-MUT [DATASHEET] 2 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 4 Table 8-7. SPI Master Interface Pin Mapping Pin # Pin Name SPI Function 28 GPIO3 SCK: Serial Clock Output 29 GPIO4 SCK: Active Low Slave Select Output 30 GPIO5 TXD: Serial Data Transmit Output (MOSI) 31 GPIO6 RXD: Serial Data Receive Input (MISO) The SPI Master timing is provided in Figure 8-4 and Table 8-8. Figure 8-4. SPI Master Timing Diagram fSCK tLH tWH tWL SCK tHL SSN, TXD tODLY tISU tIHD RXD Table 8-8. SPI Master Timing Parameters Parameter 8.5 Symbol Min. Max. Units 48 MHz Clock Output Frequency fSCK Clock Low Pulse Width tWL 5 Clock High Pulse Width tWH 5 Clock Rise Time tLH 5 Clock Fall Time tHL 5 Input Setup Time tISU 5 Input Hold Time tIHD 5 Output Delay tODLY 0 ns 5 SDIO Slave Interface The ATWILC1000B SDIO Slave is a full speed interface. The interface supports the 1-bit/4-bit SD transfer mode at the clock range of 0-50MHz. The Host can use this interface to read and write from any register within the chip as well as configure the ATWILC1000B for data DMA. To use this interface, pin 9 (SDIO_SPI_CFG) must be grounded. The SDIO Slave pins are mapped as shown in Table 8-9. ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 25 2 5 Table 8-9. SDIO Interface Pin Mapping Pin # SPI function 9 CFG: Must be tied to ground 12 DAT3: Data 3 13 DAT2: Data 2 16 DAT1: Data 1 17 DAT0: Data 0 18 CMD: Command 19 CLK: Clock When the SDIO card is inserted into an SDIO aware host, the detection of the card will be via the means described in SDIO specification. During the normal initialization and interrogation of the card by the host, the card will identify itself as an SDIO device. The host software will obtain the card information in a tuple (linked list) format and determine if that card's I/O function(s) are acceptable to activate. If the card is acceptable, it will be allowed to power up fully and start the I/O function(s) built into it. The SD memory card communication is based on an advanced 9-pin interface (Clock, Command, four Data, and three Power lines) designed to operate at maximum operating frequency of 50MHz. The SDIO Slave interface has the following features: Meets SDIO card specification version 2.0 Host clock rate variable between 0 and 50MHz 1 bit/4-bit SD bus modes supported Allows card to interrupt host Responds to Direct read/write (IO52) and Extended read/write (IO53) transactions Supports Suspend/Resume operation The SDIO Slave interface timing is provided in Figure 8-5 and Table 8-10. Figure 8-5. SDIO Slave Timing Diagram fpp tWL SD_CLK tWH tHL tLH tISU tIH Inputs tODLY(MAX) tODLY(MIN) Outputs Table 8-10. SDIO Slave Timing Parameters Parameter 26 Symbol Min. Max. Units 50 MHz Clock Input Frequency fPP 0 Clock Low Pulse Width tWL 10 ATWILC1000B-MUT [DATASHEET] 2 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 6 ns Parameter 8.6 Symbol Min. Max. Clock High Pulse Width tWH Clock Rise Time tLH 10 Clock Fall Time tHL 10 Input Setup Time tISU 5 Input Hold Time tIH 5 Output Delay tODLY 0 Units 10 14 UART ATWILC1000B has two Universal Asynchronous Receiver/Transmitter (UART) interfaces for serial communication: UART1 and UART2. The UARTs are compatible with the RS-232 standard, where ATWILC1000B operates as Data Terminal Equipment (DTE). UART1 has a 2-pin interface without flow control (RXD/TXD), where RXD (received data) can be enabled on one of five alternative pins and TXD (transmitted data) can be enabled on one of seven alternative pins by programming their corresponding pin MUX control registers (see Table 8-1). UART2 has a 4-pin interface with flow control (RXD/TXD/CTS/RTS), where RXD (received data) can be enabled on one of two alternative pins, TXD (transmitted data) can be enabled on one of two alternative pins, CTS (clear to send) can be enabled on one of two alternative pins, and RTS (request to send) can be enabled on one of two alternative pins by programming their corresponding pin MUX control registers (see Table 8-1). The RTS and CTS are used for hardware flow control; they MUST be connected to the host MCU UART and enabled for the UART interface to be functional. Both UARTs feature programmable baud rate generation with fractional clock division, which allows transmission and reception at a wide variety of standard and non-standard baud rates. The UART input clock is selectable between XOx2, XO, XO/2, and XO/4, which corresponds to 52MHz, 26MHz, 13MHz, and 6.5MHz for the typical XO frequency (26MHz). The clock divider value is programmable as 13 integer bits and 3 fractional bits (with 8.0 being the smallest recommended value for normal operation). This results in the maximum baud rate of 52MHz/8.0 = 6.5MBd for typical XO frequency. Both UARTs can be configured for seven or eight bit operation, with or without parity, with four different parity types (odd, even, mark, or space), and with one or two stop bits. They also have RX and TX FIFOs, which ensure reliable high speed reception and low software overhead transmission. FIFO size is 4x8 for both RX and TX direction. The UARTs also have status registers showing the number of received characters available in the FIFO and various error conditions, as well the ability to generate interrupts based on these status bits. UART2 supports standard flow control using CTS and RTS signals - UART2 can be programmed to enable or disable flow control. CTS is an active low input. When it is asserted (low) UART2 will transmit data; when it becomes de-asserted (high) UART2 will finish transmitting the current byte (if it is in progress) and will not resume transmitting until CTS becomes asserted again. RTS is an active low output. It becomes asserted (low) when the RX FIFO in UART2 has space; it becomes de-asserted (high) when there is not enough space in the RX FIFO. An example of UART receiving or transmitting a single packet is shown in Figure 8-6. This example shows 7-bit data (0x45), odd parity, and two stop bits. For more specific instructions refer to ATWILC1000B Programming Guide. ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 27 2 7 Figure 8-6. 8.7 Example of UART RX or TX Packet Wi-Fi/Bluetooth Coexistence ATWILC1000B supports 2-wire and 3-wire Wi-Fi/Bluetooth Coexistence signaling conforming to the IEEE 802.15.2-2003 standard, Part 15.2. The type of coexistence interface used (2 or 3 wire) is chosen to be compatible with the specific Bluetooth device used in a given application. Coexistence interface can be enabled on several alternative pins by programming their corresponding pin MUX control register to 6 (see Table 8-1, where any pin marked "IO_COE" in the "Mux6" column can be configured for any function of the coexistence interface). Table 8-11 shows a usage example of the 2-wire interface using the GPIO3 and GPIO4 pins; 3-wire interface using the GPIO3, GPIO4, and GPIO5 pins; for more specific instructions on configuring Coexistence refer to ATWILC1000B Programming Guide. Table 8-11. Pin name 8.8 Coexistence Pin Assignment Example Pin # Function Target 2-wire 3-wire GPIO3 28 BT_Req BT is requesting to access the medium to transmit or receive. Goes high on TX or RX slot Used Used GPIO4 29 WL_Act Device response to the BT request. High - BT_req is denied and BT slot blocked. Used Used GPIO5 30 BT_Pri Priority of the BT packets in the requested slot. High to indicate high priority and low for normal. Not Used Used GPIO6 31 Ant_SW Direct control on Antenna (coex bypass) Optional Optional GPIOs Nine General Purpose Input/Output (GPIO) pins, labeled GPIO 0-8, are available to allow for application specific functions. Each GPIO pin can be programmed as an input (the value of the pin can be read by the host or internal processor) or as an output (the output values can be programmed by the host or internal processor), where the default mode after power-up is input. GPIOs 7 and 8 are only available when the host does not use the SDIO interface, which shares two of its pins with these GPIOs. Therefore, for SDIO-based applications, seven GPIOs (0-6) are available. For more specific usage instructions refer to ATWILC1000B Programming Guide. 28 ATWILC1000B-MUT [DATASHEET] 2 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 8 9 Power Management 9.1 Power Architecture ATWILC1000B uses an innovative power architecture to eliminate the need for external regulators and reduce the number of off-chip components. This architecture is shown in Figure 9-1. The Power Management Unit (PMU) has a DC/DC Converter that converts VBATT to the core supply used by the digital and RF/AMS blocks. Table 9-1 shows the typical values for the digital and RF/AMS core voltages. The PA and eFuse are supplied by dedicated LDOs, and the VCO is supplied by a separate LDO structure. Figure 9-1. Power Architecture ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 29 2 9 Table 9-1. PMU Output Voltages Parameter Typical RF/AMS Core Voltage (VREG_BUCK) 1.35V Digital Core Voltage (VDDC) 1.10V The power connections in Figure 9-1 provide a conceptual framework for understanding the ATWILC1000B power architecture. Refer to the reference design for an example of power supply connections, including proper isolation of the supplies used by the digital and RF/AMS blocks. 9.2 Power Consumption 9.2.1 Description of Device States ATWILC1000B has several Devices States: ON_Transmit - Device is actively transmitting an 802.11 signal. Highest output power and nominal current consumption ON_Receive - Device is actively receiving an 802.11 signal. Lowest sensitivity and nominal current consumption ON_Doze - Device is on but is neither transmitting nor receiving Power_Down - Device core supply off (Leakage) The following pins are used to switch between the ON and Power_Down states: CHIP_EN - Device pin (pin #23) used to enable DC/DC Converter VDDIO - I/O supply voltage from external supply In the ON states, VDDIO is on and CHIP_EN is high (at VDDIO voltage level). To switch between the ON states and Power_Down state CHIP_EN has to change between high and low (GND) voltage. When VDDIO is off and CHIP_EN is low, the chip is powered off with no leakage (also see Section 9.2.3). 9.2.2 Current Consumption in Various Device States Table 9-2. Current Consumption Device State Code Rate Output Power, dBm Current Consumption (1) IVBATT IVDDIO 802.11b 1Mbps 19.5 294mA 22mA 802.11b 11Mbps 20.5 290mA 22mA 802.11g 6Mbps 19.5 292mA 22mA 802.11g 54Mbps 17.5 250mA 22mA 802.11n MCS 0 18.0 289mA 22mA 802.11n MCS 7 15.5 244mA 22mA 802.11b 1Mbps N/A 52.5mA 22mA 802.11b 11Mbps N/A 52.5mA 22mA 802.11g 6Mbps N/A 55.0mA 22mA 802.11g 54Mbps N/A 57.5mA 22mA 802.11n MCS 0 N/A 54.0mA 22mA ON_Transmit ON_Receive 30 ATWILC1000B-MUT [DATASHEET] 3 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 0 Device State Output Power, dBm Current Consumption (1) IVBATT IVDDIO 802.11n MCS 7 N/A 58.5mA 22mA ON_Doze N/A N/A 380A <10A Power_Down N/A N/A <0.5A <0.2A Note: 9.2.3 Code Rate 1. Conditions: VBATT @3.6v, VDDIO @2.8V, 25C Restrictions for Power States When no power supplied to the device, for example, the DC/DC Converter output and VDDIO are both off (at ground potential), a voltage cannot be applied to the device pins because each pin contains an ESD diode from the pin to supply. This diode will turn on when voltage higher than one diode-drop is supplied to the pin. If a voltage must be applied to the signal pads while the chip is in a low power state, the VDDIO supply must be on, so the SLEEP or Power_Down state must be used. Similarly, to prevent the pin-to-ground diode from turning on, do not apply a voltage that is more than one diode-drop below ground to any pin. 9.3 Power-Up/Down Sequence The power-up/down sequence for ATWILC1000B is shown in Figure 9-2. The timing parameters are provided in Table 9-3. Figure 9-2. Power Up/Down Sequence VBATT tA t A' VDDIO tB t B' CHIP_EN tC t C' RESETN XO Clock Table 9-3. Power-Up/Down Sequence Timing Parameter Min. tA 0 Max. Unit Description Notes VBATT rise to VDDIO rise VBATT and VDDIO can rise simultaneously or can be tied together. VDDIO must not rise before VBATT. VDDIO rise to CHIP_EN rise CHIP_EN must not rise before VDDIO. CHIP_EN must be driven high or low, not left floating. ms tB 0 ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 31 3 1 9.4 Parameter Min. Max. Unit Description Notes tC 5 CHIP_EN rise to RESETN rise This delay is needed because XO clock must stabilize before RESETN removal. RESETN must be driven high or low, not left floating. tA 0 VDDIO fall to VBATT fall VBATT and VDDIO can fall simultaneously or can be tied together. VBATT must not fall before VDDIO. tB 0 CHIP_EN fall to VDDIO fall VDDIO must not fall before CHIP_EN. CHIP_EN and RESETN can fall simultaneously. tC 0 RESETN fall to VDDIO fall VDDIO must not fall before RESETN. RESETN and CHIP_EN can fall simultaneously. Digital I/O Pin Behavior during Power-Up Sequences The following table represents digital I/O Pin states corresponding to device power modes. Table 9-4. Digital I/O Pin Behavior in Different Device States Device State CHIP_EN RESETN Output Driver Input Driver Pull Up/Down Resistor (96k) Power_Down: core supply off High Low Low Disabled (HiZ) Disabled Disabled Power-On Reset: core supply on, hard reset on High High Low Disabled (HiZ) Disabled Enabled Power-On Default: core supply on, device out of reset but not programmed yet High High High Disabled (HiZ) Enabled Enabled High Programmed by firmware for each pin: Enabled or Disabled Opposite of Output Driver state Programmed by firmware for each pin: Enabled or Disabled On_Doze/ On_Transmit/ On_Receive: core supply on, device programmed by firmware 32 VDDIO High ATWILC1000B-MUT [DATASHEET] 3 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 2 High DNI C22 0 Antenna Matching Network. Place right next to antenna DNI C21 L2 E1 ANTENNA Low Pass Filter For Harmonics 0.5pF R2 L3 DNI R3 2.0nH L9 C17 L8 C32 3.3nH 7 8 6.8pF Y1 26MHz Values Shown are initial v alues f or cry stal CL=8pF but must be adjusted f or each board design. C16 C15 35 36 9 25 VDDIO 0.7pF C33 6.8pF 6.8pF 6.8pF 24 C24 C23 1 40 External 32.768KHz clock may be used instead of on chip sleep clock. (Use RTC pin). 3.3nH 1.0pF 1.0pF 0.01uF C1 FB2 BLM03AG121SN1 2 C2 2.2uF 2 4 3 37 38 ATWILC1000 XO_N XO_P RTC_MUX SDIO_SPI_CFG TEST_MODE RFIOP RFION TPP TPN U1 Place C1 next to pins 2 & 4. Place C19 next to pin 38. 1 C11 2.2uF VDDIO VDDC 2 1 FB3 VBAT C4 0.1uF C7 1.0uF VREG_BUCK VSW CHIP_EN RESETN Wake GPIO_6 GPIO_5 GPIO_4 GPIO_3 SD_DAT3 SD_DAT2_SPI_RXD SD_DAT1_SPI_SSN SD_DAT0_SPI_TXD SD_CMD_SPI_SCK SD_CLK IRQN I2C_SCL I2C_SDA 2.2uF 6.3V C3 BLM03AG121SN1 22 21 L5 23 34 10 31 30 29 28 12 13 16 17 18 19 11 32 33 VDDIO Place C4, C5 and C6 next to pins 15, 26 & 39 R20 4.7K 15nH L1 0 0 0 0 0 0 0 0 0 0 VDDC RxD TxD 1uH SD_DAT3 SD_DAT2 SD_DAT1 SD_DAT0 SD_CMD SD_CLK IRQN I2C_SCL I2C_SDA Place C8 & C12 next to pins 14 & 27 L5 = 15nH is required in series with L1 = 1uH to reduce switching noise RF interf erence. R16 R17 R18 R19 4.7K VDDIO R12 R6 R8 R5 R13 R14 R11 C5 0.1uF Place C2 next to pin 3. Place C11 next to pin 37. C6 0.1uF FB1 BLM03AG121SN1 2 1 C8 2.2uF 1P3V C19 0.1uF VDDRF_RX VDD_RF_TX VDD_AMS VDD_SXDIG VDD_VCO 39 15 26 VDDIO_A VDDIO_0 VDDIO_1 VSS 27 14 VDDC2 VDDC1 5 6 VBAT_PPA VBAT_PA 20 VBat_buck VDDIO VBAT 2.2uF 6.3V C10 1P3V WLAN_Wake required if UART is the only host interf ace used. If SPI or SDIO is used, Wake pin is not required and should be lef t unconnected. Chip_En Reset_n WLAN_Wake Connect Chip_En and Resetn to host GPIO pins that def ault low or high impedance with a pull down resistor at power on. 0 Ohm resistors are placeholders in case f ilter resistors are required to reduce RF noise. VDDIO VBAT Figure 10-1. 41 C12 2.2uF 10 Reference Design The ATWILC1000B reference design schematic is shown in Figure 10-1. ATWILC1000B Reference Schematic ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 33 3 3 11 Reflow Profile Information This section provides guidelines for reflow processes in getting the Atmel module soldered to the customer's design. 11.1 Storage Condition 11.1.1 Moisture Barrier Bag Before Opened A moisture barrier bag must be stored in a temperature of less than 30C with humidity under 85% RH. The calculated shelf life for the dry-packed product shall be 12 months from the date the bag is sealed. 11.1.2 Moisture Barrier Bag Open Humidity indicator cards must be blue, <30%. 11.2 Stencil Design The recommended stencil is laser-cut, stainless-steel type with thickness of 100m to 130m and approximately a 1:1 ratio of stencil opening to pad dimension. To improve paste release, a positive taper with bottom opening 25m larger than the top can be utilized. Local manufacturing experience may find other combinations of stencil thickness and aperture size to get good results. 11.3 Baking Conditions This module is rated at MSL level 3. After sealed bag is opened, no baking is required within 168 hours so long as the devices are held at 30oC/60% RH or stored at <10% RH. The module will require baking before mounting if: 11.4 The sealed bag has been open for >168 hours Humidity Indicator Card reads >10% SIPs need to be baked for 8 hours at 125C Soldering and Reflow Condition 11.4.1 Reflow Oven It is strongly recommended that a reflow oven equipped with more heating zones and Nitrogen atmosphere be used for lead-free assembly. Nitrogen atmosphere has shown to improve the wet-ability and reduce temperature gradient across the board. It can also enhance the appearance of the solder joints by reducing the effects of oxidation. The following bullet items should also be observed in the reflow process: 34 Some recommended pastes include NC-SMQ(R) 230 flux and Indalloy(R) 241 solder paste made up of 95.5 Sn/3.8 Ag/0.7 Cu or SENJU N705-GRN3360-K2-V Type 3, no clean paste Allowable reflow soldering times: 2 times based on the following reflow soldering profile (see Figure 111) Temperature profile: Reflow soldering shall be done according to the following temperature profile (see Figure 11-1) Peak temp: 250C ATWILC1000B-MUT [DATASHEET] 3 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 4 Figure 11-1. Solder Reflow Profile ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 35 3 5 12 Reference Documentation and Support 12.1 Reference Documents Atmel offers a set of collateral documentation to ease integration and device ramp. The following list of documents available on Atmel web or integrated into development tools. To enable fast development contact your local FAE or visit the http://www.atmel.com/. Title Content Datasheet This Document Design Files Package User Guide, Schematic, PCB layout, Gerber, BOM & System notes on: RF/Radio Full Test Report, radiation pattern, design guide-lines, temperature performance, ESD. Platform Getting started Guide How to use package: Out of the Box starting guide, HW limitations and notes, SW Quick start guidelines. HW Design Guide Best practices and recommendations to design a board with the product, Including: Antenna Design for Wi-Fi (layout recommendations, types of antennas, impedance matching, using a power amplifier, etc.), SPI/UART protocol between Wi-Fi SoC and the Host MCU. SW Design Guide Integration guide with clear description of: High level Arch, overview on how to write a networking application, list all API, parameters and structures. Features of the device, SPI/handshake protocol between device and host MCU, flow/sequence/state diagram and timing. SW Programmer Guide Explain in details the flow chart and how to use each API to implement all generic use cases (e.g. start AP, start STA, provisioning, UDP, TCP, http, TLS, p2p, errors management, connection/transfer recovery mechanism/state diagram) - usage and sample App note. For a complete listing of development-support tools and documentation, visit http://www.atmel.com/, or contact the nearest Atmel field representative. 36 ATWILC1000B-MUT [DATASHEET] 3 Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 6 13 Revision History Doc Rev. 42491B 42491A Date Comments 03/2016 1. 2. 3. 4. 5. 6. Update package drawings in figures Figure 3-2 and Figure 3-3. Clarified the datapath description in Section 7.1.2. Revise Transmit Power table values in Table 7-2. Updated power consumption table values in Table 9-2. Updated Schematic figure to Rev 2 in Figure 10-1. Include Reflow Profile data in Chapter 11. 07/2015 DS update to RevB offering Changes from WILC1000A (42351C) to WILC1000B: 1. Added second UART, increased UART data rates 2. Increased instruction RAM size from 128KB to 160KB 3. Updated pin MUX table: added new options for various interfaces 4. Improved description of Coexistence interface 5. Added VDD_VCO switch and connection in the power architecture 6. Updated power consumption numbers 7. Updated reference schematic 8. Changed RTC_CLK pad definition from pull-down to pull-up 9. Modified sections 9.2.1 and 9.2.2 to add high-power and low-power modes and current consumption numbers 10. Updated radio performance in Table 7-1 and Table 7-2 11. Fixed typos for SPI Slave interface timing in Table 8-6 12. Fixed typos for battery supply name: changed from VBAT to VBATT 13. Corrected Table 8-11 14. Corrected Doze mode current in Table 9-2 and in feature list 15. Corrected Table 4-3 and added high-drive pads reference in Table 3-1 16. Miscellaneous minor updates and corrections ATWILC1000B-MUT [DATASHEET] Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 37 3 7 Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 www.atmel.com (c) 2016 Atmel Corporation. / Rev.: Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016. Atmel(R), Atmel logo and combinations thereof, Enabling Unlimited Possibilities(R), and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, b y estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. 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Atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically desi gnated by Atmel as military-grade. Atmel products are not designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive -grade. Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016 38 ATWILC1000B-MUT [DATASHEET] 3 8