INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1230N-R11 1
CPC1230N
350V Normally-Open Single-Pole
4-Pin SOP OptoMOS® Relay
Part # Description
CPC1230N 4-Pin SOP (100/tube)
CPC1230NTR 4-Pin SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 350 VP
Load Current 120 mArms / mADC
On-Resistance (max) 30
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket
Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment
Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• 0.4mm Distance Through Insulation
(Supplementary Isolation Requirement of
EN60950)
• 1500Vrms Input/Output Isolation
• Low Drive Power Requirements
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 4-Pin SOP Package
• Tape & Reel Version Available
• Flammability Rating UL 94 V-0
The CPC1230N is a miniature normally-open
(1-Form-A), single-pole solid state relay in a 4-pin
SOP package that employs optically coupled
MOSFET technology to provide 1500Vrms of input to
output isolation. The optically coupled outputs, that
use patented OptoMOS architecture, are controlled
by a highly efficient infrared LED.
The device is compliant with supplementary isolation
in accordance with EN/IEC 60950-1.
The CPC1230N uses IXYS Integrated Circuits
Division’s state of the art double molded vertical
construction packaging to produce one of the world’s
smallest 4-pin relays. It offers board space savings
approaching 20% over the competitor’s larger 4-pin
SOP relay.
Switching Characteristics
of Normally-Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
Approvals
1
23
4
+ Control
– Control
Load
Load
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R11
CPC1230N
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage (Peak) 350 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 170 mW
Total Power Dissipation 2400 mW
Capacitance, Input to Output 1 pF
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L120 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance 2IL=120mA RON -2530
Off-State Leakage Current VL=350VPILEAK --1 µA
Switching Speeds
Turn-On IF=5mA, VL=10V ton --2 ms
Turn-Off toff --1
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -9 - pF
Input Characteristics
Input Control Current to Activate 3IL=120mA IF- 0.8 2 mA
Input Control Current to Deactivate - IF0.3 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR- - 10 µA
1 Load current derates linearly from 120mA @ 25oC to 80mA @ 85oC.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (greater than 60°C) a minimum LED drive current of 4mA is recomended.
Electrical Characteristics @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
INTEGRATED CIRCUITS DIVISION
CPC1230N
www.ixysic.com 3
R11
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
0.85 1.00 1.15 1.250.90 1.10 1.20
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=120mA)
0.21 0.23 0.25 0.270.260.240.22
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mA)
25
20
15
10
5
0
0.70 0.80 0.900.65 0.75 0.85 0.95
LED Current (mA)
Device Count (N)
Typical IF for Switch Operation
(N=50, IL=120mA)
0.65 0.75 0.850.60 0.70 0.80 0.90
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Dropout
(N=50, IL=120mA)
35
30
25
20
15
10
5
0
23.5 24.5 25.5 26.524 25 26
Device Count (N)
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=120mA)
On-Resistance (:)
35
30
25
20
15
10
5
0
370 380 390 400375 385 395
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mA)
LED Forward Voltage Drop (V)
Temperature (ºC)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-On Time
vs. LED Forward Current
(IL=120mA)
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R11
CPC1230N
Turn-On Time (ms)
-40
5.0
4.5
4.0
3.0
3.0
2.5
2.0
1.0
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
IF=5mA
IF=10mA
Typical Turn-On Time vs. Temperature
(IL=80mA)
Turn-Off Time (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Turn-Off Time vs. Temperature
(IL=80mA)
IF=10mA
IF=5mA
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Temperature (ºC)
On-Resistance (:)
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=80mA)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical IF for Switch Operation
vs. Temperature
(IL=80mA)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical IF for Switch Dropout
vs. Temperature
(IL=80mA)
Temperature (ºC) Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-3 -2 -1 0 1 2 3
Typical Load Current
vs. Load Voltage
(IF=5mA)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
Temperature (ºC)
IF=10mA
IF=5mA
-40 -20 0 20 40 60 80 120100
Maximum Load Current
vs. Temperature
Blocking Voltage (VP)
-40
400
395
390
385
380
375
370
365
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=350V)
Temperature (ºC)
Leakage (PA)
Load Voltage (V)
0 50 100 150 200 250 300 350
Output Capacitance (pF)
0
10
20
30
40
50
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz)
Time
Load Current (A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms 100ms 1s10ms 10s 100s
10Ps 100Ps
Energy Rating Curve
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
CPC1230N
www.ixysic.com 5
R11
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1230N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC1230N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1230N-R11
©Copyright 2018, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/30/2018
For additional information please visit our website at: www.ixysic.com
6
CPC1230N
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction of Feed
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P1=8.00
(0.315)
A0=6.50
(0.256)
CPC1230N
CPC1230NTR Tape & Reel
Recommended PCB Land Pattern
2.54
(0.10)
5.50
(0.217)
1.45
(0.057)
0.55
(0.022)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.025
(0.161 ± 0.001)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.025
(0.150 ± 0.001) 0.559 ± 0.127
(0.022 ± 0.005)
0.910 ± 0.025
(0.036 ± 0.001)
2.030± 0.025
(0.080± 0.001)
0.381 TYP.
(0.015 TYP.)
Package standoff:
0.064 ± 0.040
(0.0025 ± 0.0015)
0-0.1
(0-0.004)
0.481
(0.019)
0.203 Typ
(0.008 Typ)
Mouser Electronics
Authorized Distributor
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CPC1230N CPC1230NTR