©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
1
TVS Diode Arrays (SPA ® Diodes)
Revision: 12/12/16
TVS Diode Arrays (SPA
® Diodes)
Low Capacitance ESD Protection - SP0502B Series
Description
Applications
The SP0502B is a low capacitance TVS diode array
designed to protect high-speed data interfaces from
over-voltage caused by ESD (electrostatic discharge),
CDE (Cable Discharge Events), and EFT (electrical fast
transients). It has a typical capacitance of only 0.3pF (pin
1 to 2) making it suitable for use on circuits operating in
excess of 3GHz without signal attenuation.
The SP0502BXTG is in a small SOT-523 package and each
device can be configured to protect 1 bidirectional line or
two unidirectional lines. The combination of small size,
ultra-low capacitance, and high level of ESD protection
makes it an ideal solution for applications such as HDMI,
USB, MDDI, antennas, and DisplayPort.
FeaturesFunctional Block Diagram and Pinout
12
3
RoHS
Pb
GREEN
• High-Definition
Multimedia Interface
(HDMI)
• Mobile Display Digital
Interface (MDDI)
• RF/Antenna Circuits
• USB 2.0
• DisplayPort
• Mobile - Smartphone,
Tablet, Notebook
SP0502B Series 1pF 15kV Diode Arrays
• RoHS compliant and lead-
free
• ESD protection of ±15kV
contact discharge,
±20kV air discharge, (IEC
61000-4-2)
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Lightning protection, IEC
61000-4-5 2nd edition, 2A
(tp=8/20µs)
• Stand-off voltage of 5V
• Low capacitance of 1pF @
VR=0V (MAX)
• Low leakage current of
0.5μA at 5V (MAX)
• Small form factor
(SOT523) and low profile
(<1mm)
• No insertion loss to
>3.0GHz
• AEC-Q101 qualified
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Additional Information
Datasheet Samples
Resources
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
2
TVS Diode Arrays (SPA ® Diodes)
Revision: 12/12/16
TVS Diode Arrays (SPA
® Diodes)
Low Capacitance ESD Protection - SP0502B Series
Absolute Maximum Ratings
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP = 25°C)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM
IR≤1μA, Pin1 or Pin2 to Pin3 and Pin1 to
Pin2 5.0 V
Reverse Breakdown Voltage VBR It=1mA, Pin1 or Pin2 to Pin3 6 V
Leakage Current ILEAK VR=5V 0.5 μA
Clamp Voltage1VCIPP=1A, tp=8/20µs, Pin 1 to Pin 2 12 V
Dynamic Resistance2RDYN TLP, tp=100ns, I/O to GND 0.45 Ω
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact Discharge) ±15 kV
IEC 61000-4-2 (Air Discharge) ±20 kV
Diode Capacitance1
CI/O-I/O
Reverse Bias=0V, f=1MHz;
Pin 1 to Pin2 0.25 0.5 pF
CI/O-GND
Reverse Bias=0V, f=1MHz;
Pin 1 or Pin2 to Pin 3 1. 0 pF
Note:
1Parameter is guaranteed by design and/or device characterization.
2 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
Symbol Parameter Value Units
PPK Peak Pulse Power (tP=8/20µs) 25 W
IPP Peak Pulse Current (tP=8/20µs) 2 A
TOP Operating Temperature -40 to 125 °C
TSTOR Storage Temperature -55 to 150 °C
Thermal Information
Parameter Rating Units
Storage Temperature Range -55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering 20-40s) 260 °C
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
3
TVS Diode Arrays (SPA ® Diodes)
Revision: 12/12/16
TVS Diode Arrays (SPA
® Diodes)
Low Capacitance ESD Protection - SP0502B Series
Insertion Loss of Pin 1 to Pin 2 (I/O to I/O)
Capacitance vs. Reverse Bias (Pin 1 or Pin 2 to Pin 3)
Pulse Waveform
-30
-25
-20
-15
-10
-5
5
1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10
Frenqucy(Hz)
Insertion Loss S
21 (dB)
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
012345
Capacitance (pF)
Bias Voltage (V)
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
Capacitance vs. Reverse Bias (I/O-I/O) (Pin 1 to Pin 2)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
012345
Capacitance (pF)
Bias Voltage (V)
Transmission Line Pulse (TLP)
0
2
4
6
8
10
12
14
16
18
20
0510 15 20
TLP Voltage (V)
TLP Current (A)
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
4
TVS Diode Arrays (SPA ® Diodes)
Revision: 12/12/16
TVS Diode Arrays (SPA
® Diodes)
Low Capacitance ESD Protection - SP0502B Series
SP4040
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Ordering Information
Part Marking System
3**
Product Series
3 = SP0502B Date Code
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
P
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substrate material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Part Number Package Size Marking Min. Order Qty.
SP0502BXTG SOT523 1.6x1.6mm 3** 3000
Part Numbering System
SP 0502B X T G
Series
Package
SOT523 (1.6x1.6mm)
T= Tape & Reel
G= Green
–
TVS Diode Arrays
(SPA® Diodes )
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
5
TVS Diode Arrays (SPA ® Diodes)
Revision: 12/12/16
TVS Diode Arrays (SPA
® Diodes)
Low Capacitance ESD Protection - SP0502B Series
Package Dimensions — SOT523
D
E1 E
e
AA2
A1
SEE VIEW A-A
L1
VIEW A-A
θ
B
B
SECTIONB-B
b
c
b
SEATING PLANE
BASE METAL
e1
Embossed Carrier Tape & Reel Specification — SOT523
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.077 0.081
D1.40 1.60 0.055 0.063
D1 0.45 0.55 0.017 0.021
P0 3.90 4.10 0.154 0.161
10P0 40.0+/- 0.20 1.574+/-0.008
W7.70 8.10 0.303 0.318
P3.90 4.10 0.153 0.161
A0 1.73 1.83 0.068 0.072
B0 1.73 1.83 0.068 0.072
K0 0.64 0.74 0.025 0.029
t0.22 max 0.009 max
Millimetres Inches
Min Typ Max Min Typ Max
A0.60 - 0.90 0.023 - 0.035
A1 0.00 - 0.10 0.000 - 0.004
A2 0.60 0.75 0.80 0.023 0.030 0.031
b0.15 - 0.30 0.005 - 0.012
c0.10 - 0.20 0.003 - 0.008
D1.50 1.60 1.70 0.059 0.063 0.067
e1.00 BSC 0.039 BSC
e1 0.50 BSC 0.020 BSC
E1.45 1.60 1.75 0.057 0.063 0.069
E1 0.75 0.80 0.85 0.029 0.031 0.033
L1 0.22 REF 0.009 RFE
θ0° - 8° 0° -- 8°
