Description
Avago Power PLCC-4 is an extension of our PLCC-2 SMT
LEDs. The package can be driven at higher current due to
its superior package design. The product is able to dissi-
pate heat more e ciently compared to the conventional
PLCC-2 SMT LEDs. In proportion to the increase in driving
current, this family of LEDs is able to produce higher light
output compared to the conventional PLCC-2 SMT LEDs.
These SMT LEDs have higher reliability and better perfor-
mance and are designed to work under a wide range of
environmental conditions. This higher reliability makes
them suitable for use under harsh environment and con-
ditions like automotive. In addition, they are also suitable
to be used in electronic signs and signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel will be
shipped in single intensity and color bin (except for red
color), to provide close uniformity.
These LEDs are compatible with IR solder re ow process.
Due to the high reliability feature of these products, they
also can be mounted using through-the-wave soldering
process.
There are a variety of colors and various viewing angles
(30°, 60° and 120°) available in these SMT LEDs. Ideally, the
30° parts are suitable for light piping where focused inten-
sities are required. As for the 60° and 120°, they are most
suitable for automotive interior and exterior lighting and
electronic signs applications.
CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
HSMx-A4xx-xxxxx
SMT LED Surface Mount LED Indicator
Data Sheet
Features
Industry standard PLCC-4
High reliability LED package
High brightness using AlInGaP and InGaN dice
technologies
High optical e ciency
Higher ambient temperature at the same current
possible compared to PLCC-2
Available in full selection of colors
Super wide viewing angle at 120˚
Available in 8mm carrier tape on 7-inch reel
Compatible with both IR and TTW soldering process
JEDEC MSL 2a
High reliability LED package due to enhanced silicone
resin material for InGaN family
Applications
Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
– Navigation and audio system
– Dome lighting
– Push button backlighting
Exterior automotive
– Turn signals
– CHMSL
– Rear combination lamp
– Puddle light
Electronic signs and signals
– Interior full color sign
– Variable message sign
O ce automation, home appliances, industrial
equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
2
Package Dimensions
Device Selection Guide
Color Part Number Min. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology
Red HSMC-A400-S30M1 180.00 355.00 50 AlInGaP
HSMC-A401-U80M1 560.00 1400.00 50 AllnGaP
Red Orange
HSMJ-A401-T40M1 285.00 715.00 50 AlInGaP
HSMJ-A401-U40M1 450.00 1125.00 50 AlInGaP
Orange HSML-A401-U40M1 450.00 1125.00 50 AlInGaP
Amber HSMA-A401-U45M1 450.00 1125.00 50 AlInGaP
Emerald Green HSME-A401-P4PM1 45.00 112.50 50 AlInGaP
Blue HSMN-A400-S8QM2 224.00 560.00 30 InGaN
HSMN-A400-S8PM2 224.00 560.00 30 InGaN
HSMN-A400-S4QM2 180.00 450.00 30 InGaN
Green HSMM-A400-U4QM2 450.00 1125.00 30 InGaN
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. IV tolerance = ±12 %.
0.8 0.3
3.5 0.2
2.8 ± 0.2
0.5 ± 0.1
3.2 0.2
2.2 ± 0.2
1.9 ± 0.2
0.1 TYP. 0.8 ± 0.1
CATHODE MARKING
0.7 0.1
CC
AC
NOTES:
ALL DIMENSIONS IN mm.
ELECTRICAL CONNECTION BETWEEN ALL CATHODES IS RECOMMENDED.
3
Absolute Maximum Ratings (TA = 25°C)
Parameters HSMC/J/L/A/E HSMZ/V/U HSMM/K/N
DC Forward Current[1] 70 mA[3,4] 70 mA[3,4] 30 mA
Peak Forward Current [2] 200 mA 200 mA 90 mA
Power Dissipation 180 mW 240 mW 114 mW
Reverse Voltage 5 V
Junction Temperature 110°C
Operating Temperature –40°C to +100°C
Storage Temperature –40°C to +100°C
Notes:
1. Derate linearly as shown in gure 5.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
Part Numbering System
HSM x1 – A x2 x3x4 – x5x6 x7 x8x9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Speci c Con guration
Package Type
LED Chip Color
4
Optical Characteristics (TA = 25°C)
Peak Dominant Luminous Luminous Intensity/
Wavelength Wavelength Viewing Angle E cacy v[3] Total Flux
Part PEAK (nm) D[1] (nm) 21/2[2] (Degrees) (lm/W) Iv (mcd)/v (mlm)
Color Number Typ. Typ. Typ. Typ. Typ.
Red HSMC 635 626 120 150 0.45
HSMZ 639 630 120 155 0.45
Red Orange HSMJ 621 615 120 240 0.45
HSMV 623 617 120 263 0.45
Orange HSML 609 605 120 320 0.45
Amber HSMA 592 590 120 480 0.45
HSMU 594 592 120 500 0.45
Yellow Green HSME 576 575 120 560 0.45
Emerald Green HSME 568 567 120 610 0.45
Green HSMM 518 525 120 500 0.45
Cyan HSMK 502 505 120 300 0.45
Blue HSMN 468 470 120 75 0.45
Notes:
1. The dominant wavelength, D, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. 1/2 is the o -axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the
luminous e cacy in lumens/watt.
Electrical Characteristics (TA = 25°C)
Forward Voltage Reverse Voltage
V
F (Volts) @ IF = 50 mA VR @ 100 μA
Part Number Typ. Max. Min.
HSMC/J/L/A/E 2.2 2.5 5
HSMZ/V/U 2.8 3.4 5
Forward Voltage Reverse Voltage
V
F (Volts) @ IF = 30 mA VR @ 10 μA
Part Number Typ. Max. Min.
HSMM/K/N 3.8 4.6 5
Figure 1. Relative intensity vs. wavelength
WAVELENGTH – nm
EMERALD GREEN
RELATIVE INTENSITY
1.0
0.8
0
380 480 580 680 730 780
630530430
BLUE
CYAN
0.6
0.4
0.2
GREEN
YELLOW GREEN
AMBER
ORANGE
RED ORANGE
RED
0.1
0.3
0.5
0.7
0.9
5
Figure 2. Forward current vs. forward voltage Figure 3. Relative intensity vs. forward current
(AlInGaP)
Figure 4. Relative intensity vs. forward current
(InGaN)
Figure 5a. Maximum forward current vs. ambi-
ent temperature, derated based on TJmax =
110°C (AlInGaP)
Figure 6. Dominant wavelength vs. forward
current – InGaN devices
Figure 7. Radiation pattern
040
FORWARD CURRENT – mA
0
0.4
RELATIVE INTENSITY
(NORMALIZED AT 50 mA)
80
0.8
0.2
1.0
20
0.6
1.2
6010 30 70
1.4
50
020
CURRENT – mA
460
480
540
DOMINANT WAVELENGTH – nm
35
500
470
510
10
490
520
25
InGaN GREEN
515 30
530
InGaN CYAN
InGaN BLUE
RELATIVE INTENSITY
1.0
0
ANGLE – DEGREES
0.8
0.6
0.2
0.4
-70 -50 -30 30 50 70 90-90 -10 10
0.1
0.3
0.5
0.7
0.9
0
80
020 60 80 120
MAXIMUM FORWARD CURRENT – mA
AMBIENT TEMPERATURE – C
40
40
60
30
300C/W
20
70
100
10
350C/W
470C/W
50
0
020 60 80 120
MAXIMUM FORWARD CURRENT – mA
AMBIENT TEMPERATURE – C
40
20
30
15
300C/W
10
35
100
5
350C/W
470C/W
25
Figure 5b. Maximum forward current vs. ambi-
ent temperature, derated based on TJmax =
110°C (InGaN)
03
FORWARD VOLTAGE – V
0
20
70
80
FORWARD CURRENT – mA
10
50
40
60
12 45
HSMM/K/N
HSMZ/V/U
HSMC/J/L/A/E
30
020
FORWARD CURRENT – mA
0
0.4
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 30 mA)
35
0.8
0.2
1.0
10
0.6
1.2
30515
25
6
Figure 8a. Recommended soldering pad pattern
Figure 8b. Recommended soldering pad pattern (TTW)
Thermal Resistance Solder Pad Area (xy)
300°C/W >16 mm2
350°C/W >12 mm2
470°C/W >8 mm2
X X
0.5 (0.020)
Y
Y
1.0 (0.039)
2.0 (0.079)
2.0 (0.079)
6.0 (0.236)
3.0 (0.118)
2.8 (0.110)
6.1 (0.240)
DIMENSIONS IN mm (INCHES). REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
2.60
(0.103)
SOLDER RESIST REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
4.50 (0.178)
Y
X
0.40 (0.016)
X
0.50
(0.020)
Y
1.10
(0.043)
1.50 (0.059)
DIMENSIONS IN mm (INCHES).
7
Figure 10. Recommended wave soldering pro le
Figure 9. Recommended Pb-free re ow soldering pro le.
Note: For detailed information on re ow soldering of Avago surface mount LEDs,
refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components.
217 °C
MAX. 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
125 °C ± 25 °C
255 °C
60 to 150 SEC.
10 to 20 SEC.
TIME
TEMPERATURE
+5 °C
-0 °C
Figure 11. Recommended Pick and Place Nozzle Size for InGaN Family
Note : Diameter "ID" should
be bigger than 2.3mm
LAMINAR WAVE
BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
01020
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
ID
8
Figure 12. Tape leader and trailer dimensions
Figure 14. Reeling orientation
Figure 13. Tape dimensions
C
A
4 ± 0.1 2 ± 0.05
8 ± 0.1
5.5 ± 0.05
12+0.3
–0.1
1.75 ± 0.1
3.8 ± 0.1
3.6 ± 0.1
0.229 ± 0.01
Ø1.5 +0.1
–0
Ø1+0.1
–0
C
C
3.45 ± 0.1
AA
VIEW A-A
VIEW B-B
B
B
ALL DIMENSIONS IN mm.
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
TRAILER COMPONENT LEADER
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
9
Intensity Bin Select (X5X6)
Individual reel will contain parts from one half bin only.
X5 Min. Iv Bin
X6
0 Full Distribution
2 2 half bins starting from X51
3 3 half bins starting from X51
4 4 half bins starting from X51
5 5 half bins starting from X51
6 2 half bins starting from X52
7 3 half bins starting from X52
8 4 half bins starting from X52
9 5 half bins starting from X52
Intensity Bin Limits
Bin ID Min. (mcd) Max. (mcd)
N1 28.50 35.50
N2 35.50 45.00
P1 45.00 56.00
P2 56.00 71.50
Q1 71.50 90.00
Q2 90.00 112.50
R1 112.50 140.00
R2 140.00 180.00
S1 180.00 224.00
S2 224.00 285.00
T1 285.00 355.00
T2 355.00 450.00
U1 450.00 560.00
U2 560.00 715.00
V1 715.00 900.00
V2 900.00 1125.00
W1 1125.00 1400.00
W2 1400.00 1800.00
Tolerance of each bin limit = ± 12%
Color Bin Select (X7)
Individual reel will contain parts from one full bin only.
X7
0 Full Distribution
Z A and B only
Y B and C only
W C and D only
V D and E only
U E and F only
T F and G only
S G and H only
Q A, B and C only
P B, C and D only
N C, D and E only
M D, E and F only
L E, F and G only
K F, G and H only
1 A, B, C and D only
2 E, F, G and H only
3 B, C, D and E only
4 C, D, E and F only
5 A, B, C, D and E only
6 B, C, D, E and F only
10
Packaging Option (X8X9)
Test Package Reel
Option Current Type Size
M1 50 mA Top Mount 7 inch
M2 30 mA Top Mount 7 inch
Color Bin Limits
Orange Min. (nm) Max. (nm)
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
Red
Orange Min. (nm) Max. (nm)
A 611.0 616.0
B 616.0 620.0
Red Min. (nm) Max. (nm)
Full Distribution
Tolerance of each bin limit = ± 1 nm
Color Bin Limits
Blue Min. (nm) Max. (nm)
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Cyan Min. (nm) Max. (nm)
A 490.0 495.0
B 495.0 500.0
C 500.0 505.0
D 505.0 510.0
Green Min. (nm) Max. (nm)
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Emerald
Green Min. (nm) Max. (nm)
A 552.5 555.5
B 555.5 558.5
C 558.5 561.5
D 561.5 564.5
Yellow
Green Min. (nm) Max. (nm)
E 564.5 567.5
F 567.5 570.5
G 570.5 573.5
H 573.5 576.5
Amber/
Yellow Min. (nm) Max. (nm)
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Forward Voltage Bin Table
For HSMZ/V/U – A4xx-xxxxx only
BIN MIN. MAX.
VA 1.9 2.2
VB 2.2 2.5
VC 2.5 2.8
VD 2.8 3.1
VE 3.1 3.4
Tolerance of each bin limit = ± 0.1
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved. Obsoletes AV01-0312EN
AV02-0479EN - July 28, 2011
Moisture Sensitivity
This product is quali ed as Moisture Sensitive Level 2a per
JEDEC J-STD-020. Precaution when handling this moisture
sensitive product is important to ensure the reliability of
the product. Refer to Avago Application Note AN 5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90% RH for 12 months. If the actual shelf life
has exceeded 12 months and the HIC indicates that
baking is not required, then it is safe to re ow the
LEDs per the original MSL rating.
– It is not recommended to open the MBB prior to
assembly (e.g., for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60% RH at all
times and all high temperature related processes,
including soldering, curing or rework, need to be
completed within 672 hours.
C. Control of un nished reel
– Unused LEDs need to be stored in sealed MBB with
desiccant or in desiccator at <5% RH.
D. Control of assembled boards
– If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
needs to be stored in sealed MBB with desiccant
or in desiccator at <5% RH to ensure no LEDs have
exceeded their oor life of 672 hours.
E. Baking is required if:
– “10%” is Not blue and “5%” HIC indicator turns pink.
– The LEDs are exposed to conditions of >30°C/60%
RH at any time.
– The LEDs' oor life exceeds 672 hours.
Recommended baking conditions: 60±5°C for 20 hours.
Handling Precautions
The encapsulation material of the InGaN family product
is made of silicone for better reliability of the product.
As silicone is a soft material, please do not press on the
silicone or poke a sharp object onto the silicone. These
might damage the product and cause premature failure.
During assembly or handling, the unit should be held on
the body only. Please refer to Avago Application Note AN
5288 for detail information.
